JP4332037B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package for mounting and storing electronic components such as piezoelectric vibrators and semiconductor elements, and an electronic device using the same.

  2. Description of the Related Art Conventionally, electronic components such as piezoelectric vibrators and semiconductor elements are hermetically sealed in an electronic component storage package (hereinafter also referred to as a package) for accommodating these electronic components in an airtight manner, thereby becoming an electronic device. Used as a part of various electronic devices such as computers.

  In such a package for accommodating electronic components in an airtight manner, the most reliable one is made of ceramics such as an aluminum oxide sintered body, and is used for accommodating and mounting the electronic components in the center of the upper surface. An insulating base having a concave mounting portion; a plurality of wiring conductors led out from the inside of the mounting portion of the insulating base to the outer surface; a frame-shaped metal layer formed on the upper surface of the insulating base so as to surround the mounting portion; A metal frame for sealing composed of an iron-nickel-cobalt alloy or an iron-nickel alloy joined to a metal-like metal layer via a brazing filler metal such as silver brazing, and joined to the upper surface of the metal frame by seam welding. And a lid made of iron-nickel alloy or iron-nickel-cobalt alloy.

In the case of this type of package, after mounting the electronic component on the mounting portion of the insulating base and electrically connecting the electrode of the electronic component and the metallized wiring conductor, the lid is placed on the metal frame. The pair of roller electrodes of the seam welding machine are rolled while being in contact with the outer peripheral edge of the seam, and a large current for welding is passed between the pair of roller electrodes to directly seam weld the metal frame and the lid. As a result, an electronic device as a product in which electronic components are housed in an airtight manner. This electronic device is used by being mounted on an external electric circuit board by connecting a portion of the wiring conductor led to the outer surface of the insulating base to an external electric circuit.
Japanese Unexamined Patent Publication No. 7-30007

  However, recently, along with the downsizing and higher functionality of electronic devices, small so-called chip-shaped electronic elements such as capacitors and resistors are also placed on the external electric circuit board on which the electronic device is mounted. In response to this, it has become necessary to mount the electronic component storage package in a narrow and high-density manner, and the electronic component storage package has been miniaturized so that, for example, the length of one side of the insulating base is about several millimeters. For this reason, it is difficult to ensure a sufficient width of the joint surface between the insulating base and the metal frame, the strength of brazing between the metal frame and the insulating base is reduced, and the reliability of hermetic sealing of electronic components is reduced. There was a problem that the performance would deteriorate.

  The present invention has been completed in view of such conventional problems, and an object of the present invention is to reduce the outer dimensions of the insulating base and to braze the metal frame firmly to the insulating base. An object of the present invention is to provide an electronic component storage package and an electronic device that are small and have excellent airtight sealing reliability.

An electronic component storage package according to the present invention includes a rectangular insulating substrate having an electronic component mounting portion on an upper surface, a wiring conductor led out from the mounting portion to the outer surface of the insulating substrate, and an outer periphery of the upper surface of the insulating substrate. is formed in part, the saw takes mounting portion circumference, brazed to at least the brazing metal layer extends on the side surface of the insulating base at each corner, the lower surface is the brazing metal layer of the insulating base And a lid attached to the upper surface of the metal frame so as to cover the mounting portion, and the outer periphery of the metal frame is located outside the outer periphery of the insulating base. It is characterized by doing.

  In the electronic component storage package according to the present invention, the outer periphery of the metal frame is positioned outside the outer periphery of the insulating base by 0.5 mm or more.

In the electronic component storage package of the present invention, the length of the brazing metal layer extending to the side surface of the insulating base is 0.3 mm or more.

  The electronic device according to the present invention has an electronic component mounted on the mounting portion of the electronic component storage package having the above-described configuration, and an electrode of the electronic component is electrically connected to the wiring conductor, and the metal frame body The lid is attached to the upper surface and the electronic component is hermetically sealed.

  According to the electronic component storage package of the present invention, the outer periphery of the metal frame brazed so as to surround the mounting portion on the upper surface of the insulating base is, for example, 0.5 mm or more outside the outer periphery of the insulating base. Therefore, the outer peripheral portion of the lower surface of the metal frame body is exposed and protrudes outside the joint surface between the insulating base and the metal frame body, and the brazing material is bonded to the metal frame body by this exposed amount. As the area increases, a brazing material meniscus can be formed on the outer periphery of the lower surface of the metal frame so that the metal frame can be used as an insulating substrate even if the insulating substrate is downsized. It can be brazed firmly.

  In this case, the outer peripheral portion of the metal frame protrudes to the outside of the insulating base, but the metal frame is not in direct contact with the external electric circuit board. When connecting, the metal frame is hardly hindered, and this makes it possible to easily secure an area for mounting electronic elements and the like on the external electric circuit board.

  As a result, according to the present invention, the external dimensions of the insulating base can be reduced, and the lid can be firmly bonded to the metal frame, and the size is small and the reliability of the hermetic sealing is excellent. An electronic component storage package can be provided.

In the electronic component storing package of the present invention, the brazing metal layer upper surface formed metal frame of the insulation substrate is bonded, for example, 0.3mm or more in length, at least the corners of the insulating base in the fact that by extending the side surface of the insulating base, by the brazing material is integrally bonded while forming a meniscus toward the metal layer side of the insulating base from the lower surface of the metal frame, the metal frame of the brazing material and bonding area with respect to the insulating substrate can be secured wide and also because it can meniscus of the brazing material is greatly formed, even bonding area between the upper surface of the lower surface and the insulating substrate of the metal frame is reduced, the metal frame body is joined to strong solid with respect to the insulating substrate can be made the reliability of the hermetic seal was superior. In addition, by extending a brazing metal layer on the side surface of the insulating base at least at each corner of the insulating base, each corner is subjected to great stress when the lid is joined to the metal frame by welding or the like. In addition, the bonding area of the brazing material is increased, a large pool of brazing material can be formed into a favorable meniscus shape, and the bonding between the insulating base and the metal frame can be effectively reinforced, It is possible to provide a small-sized electronic component storage package that has excellent long-term reliability of bonding between the metal frame and the insulating base and is extremely excellent in reliability of hermetic sealing.

  An electronic device according to the present invention includes an electronic component storage package having the above-described configuration and an electronic component mounted on a mounting portion, and a lid is attached to the upper surface of the metal frame via a brazing material. Since the electronic component is hermetically sealed, it can be made compact and highly reliable with excellent hermetic sealing reliability.

  An electronic component storage package and an electronic device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a sectional view showing an example of an embodiment of an electronic component storage package and an electronic device according to the present invention. In FIG. 1, 1 is an insulating substrate, 2 is a wiring conductor, 3 is a metal frame, 4 is a metal layer for brazing, and 5 is a lid. The insulating component 1, the wiring conductor 2, the metal frame 3, the brazing metal layer 4, and the lid 5 constitute an electronic component storage package 7. In addition, the electronic component 6 is mounted on the mounting portion 1 a on the upper surface of the insulating base 1, the electrodes of the electronic component 6 are electrically connected to the wiring conductor 2, and the lid 5 is attached to the upper surface of the metal frame 3. The electronic device 9 is formed by hermetically sealing the electronic component 6.

  The insulating base 1 has a mounting portion 1a for mounting the electronic component 6 on the upper surface, and is an insulating material such as an aluminum oxide sintered body, a glass ceramic, an aluminum nitride sintered body, or a mullite sintered body. It is formed by.

  In addition, although the insulating base | substrate 1 showed the example which provided the recessed part in the upper surface, and provided the mounting part 1a in the bottom face of the recessed part in FIG.

  When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. A ceramic green sheet for the insulating substrate 1 is obtained by forming into a sheet form by a conventionally known doctor blade method, and thereafter, the ceramic green sheet is subjected to an appropriate punching process, and a plurality of sheets are laminated and fired at a high temperature. Produced.

Note that the insulating substrate 1 and the mounting portion 1a, as suitable for hermetically sealing mounting the electronic component 6 of the rectangular plate, you formed in a square shape in plan view. In this case, the shape is not limited to a perfect quadrangle, and may be, for example, a shape in which corners are chamfered in an arc shape in order to prevent occurrence of chipping or the like.

  In the insulating base 1, a plurality of wiring conductors 2 are led out from the mounting portion 1a on the upper surface to the outer surface such as the side surface and the lower surface.

  The electrode (not shown) of the electronic component 6 mounted on the mounting portion 1a is electrically connected to a portion of the wiring conductor 2 exposed to the mounting portion 1a via a bonding wire or solder.

  The wiring conductor 2 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, or gold. For example, when it is made of tungsten, the tungsten paste obtained by adding and mixing an appropriate organic binder and solvent to tungsten powder is insulated. The ceramic green sheet to be the base 1 is printed and applied in a predetermined pattern by a well-known screen printing method, and is fired together with the ceramic green sheet to be the insulating base 1 to form a predetermined pattern.

  The insulating base 1 has a brazing metal layer 4 formed on the outer periphery of the upper surface so as to surround the mounting portion 1a, and the metal frame 3 and the brazing material 8 on the brazing metal layer 4. Is brazed through.

  The brazing metal layer 4 acts as a base metal layer for brazing the metal frame 3 to the outer periphery of the upper surface of the insulating substrate 1 and is formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, gold or the like. The

  The metal layer 4 for brazing is preferably formed of the same metal material as the wiring conductor 2 in consideration of productivity and the like. For example, in the case of being made of tungsten, the above-described wiring conductor 2 is formed. The same tungsten paste is formed by printing and applying a frame-like pattern on a portion surrounding the mounting portion 1a of the ceramic green sheet serving as the insulating substrate 1.

  Further, the metal frame 3 acts as a side wall for hermetically sealing the mounting portion 1a on which the electronic component 6 is mounted, and the lid 5 is attached to the upper surface of the metal frame 3 so that the mounting portion 1a is attached to the mounting portion 1a. The mounted electronic component 6 is hermetically sealed inside a container composed of the insulating base 1, the metal frame 3, and the lid 5.

  The metal frame 3 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, when the metal frame 3 is made of an iron-nickel-cobalt alloy, the metal frame 3 is appropriately rolled or punched into an iron-nickel-cobalt alloy plate It is formed by processing such as processing and etching processing.

  The brazing of the metal frame 3 to the brazing metal layer 4 is performed via a brazing material 8 such as silver brazing. For example, the metal frame 3 is placed on the upper surface of the brazing metal layer 4 and the frame is interposed therebetween. It is set by positioning through a silver brazing material such as a silver-copper eutectic braze, and brazing at about 800 ° C. to 900 ° C. using a brazing furnace or the like.

  In the electronic component storage package 7 of the present invention, the outer periphery of the metal frame 3 is positioned outside the outer periphery of the insulating substrate 1.

  By positioning the outer periphery of the metal frame 3 outside the outer periphery of the insulating base 1, the outer peripheral portion of the lower surface of the metal frame 3 is exposed to the outside of the joint surface between the insulating base 1 and the metal frame 3. As a result of the protrusion, the bonding area of the brazing material 8 to the metal frame 3 is increased by the exposed amount, and a meniscus (a brazing material reservoir) of the brazing material 8 is formed on the outer periphery of the lower surface of the metal frame 3. Therefore, even if the insulating base 1 is downsized, the metal frame 3 can be firmly brazed to the insulating base 1.

  In this case, the outer peripheral portion of the metal frame 3 protrudes to the outside of the insulating base 1, but the metal frame 3 is not in direct contact with the external electric circuit board. When the elements are connected, the metal frame 3 is hardly hindered, so that it is possible to easily secure an area for mounting the chip-shaped electronic elements on the external electric circuit board.

  As a result, according to the present invention, it is possible to reduce the outer dimensions of the insulating base 1 and to reliably join the metal frame 3 to the insulating base 1 in a small and hermetic sealing reliability. It is possible to provide the electronic component storage package 7 having excellent performance.

  Further, when the outer periphery of the metal frame 3 is positioned outside the outer periphery of the insulating base 1, the metal of the brazing material 8 is positioned when the outer periphery of the metal frame 3 is less than 0.5 mm from the outer periphery of the insulating base 1. There is a tendency that it becomes difficult to sufficiently increase the bonding area with respect to the frame 3 or to form a sufficiently large meniscus of the brazing material 8, and the metal frame 3 is firmly brazed to the insulating substrate 1. Tend to be difficult. Therefore, it is preferable that the outer periphery of the metal frame 3 be positioned 0.5 mm or more outside the outer periphery of the insulating base 1, and considering that the electronic component storage package 7 is more effectively reduced in size, It is even more preferable to locate the outside in the range of 0.5 mm or more and 3 mm or less.

  The shape of the metal frame 3 is preferably a square frame so as to correspond to the shape of the insulating substrate 1. As a result, the electronic component 6 that is generally rectangular, such as a semiconductor integrated circuit element or a piezoelectric vibrator, can be efficiently surrounded without taking a useless space. In this case, the metal frame 3 is preferably chamfered in a circular arc shape at each corner to prevent the occurrence of chipping or the like at the corner.

In the electronic component storing package 7 of the present invention, the brazing metal layer 4, as shown in FIG. 2, at least a portion of that it has been extended to the side surface of the insulating substrate 1.

About the brazing metal layer 4, at least a part of the brazing metal layer 4 is extended to the side surface of the insulating base 1, so that the brazing material 8 is brazed from the lower surface of the metal frame 3 to the side surface of the insulating base 1. As a result, the bonding area of the brazing material 8 to the metal frame 3 and the insulating base 1 can be secured widely, and a large meniscus can be formed in the brazing material 8. result, even if the bonding area between the lower surface of the metal frame 3 and the upper surface of the insulating substrate 1 is reduced, the metal frame 3 is joined to the strong solid with respect to the insulating base 1, the reliability of the hermetic seal An excellent electronic component storage package can be provided.

  When the brazing metal layer 4 is extended to the side surface of the insulating base 1, if the extension length is less than 0.3 mm, the bonding area of the brazing material 8 is effectively increased at the corners, or a good meniscus is obtained. There is a tendency that it becomes difficult to form the metal frame 3 and it becomes difficult to reinforce the bonding between the metal frame 3 and the insulating substrate 1. Therefore, the brazing metal layer 7 is preferably extended to the side surface of the insulating substrate 1 with a length of 0.3 mm or more.

Further, when causing extend the brazing metal layer 4 on the side surface of the insulating base 1, a shape where the insulating substrate 1 has a square shaped corner, Contact Ku by extending at least each corner of the insulating base 1. By keeping by extending the brazing metal layer 4 on the side surface of the insulating base 1 at each corner of the insulating base 1, the large stress when you joined by welding or the like lid 5 to the metal frame 3 is applied at the corners, with increasing bonding area of the brazing material 8, to form a large reservoir of the brazing material 8 can be a good meniscus shape, enable the bonding of the insulating base 1 and the metal frame 3 it is possible to reinforce, that the long-term reliability of the bonding of the metal frame 3 and the insulating substrate 1 assumes a superior, provides very good small electronic component storing package reliability hermetic seal it can. Therefore, it is even more preferable that the brazing metal layer 4 is extended with a length of 0.3 mm or more at least at the corners of the insulating substrate 1.

  The width of the extended portion of the brazing metal layer 4 is preferably 1 mm or more. If the width of the extended portion is less than 1 mm, it is difficult to effectively secure the bonding area of the brazing material 8 and it is difficult to effectively reinforce the bonding strength of the metal frame 3 to the insulating base 1.

  Further, when the metal frame 3 is inclined with the lower surface at least outside the portion bonded to the upper surface of the insulating substrate 1 being inclined downward or upward, the external dimensions of the metal frame 3 are not increased. In addition, the bonding area of the brazing material 8 to the metal frame 3 can be secured larger, and an electronic component storage package that is even smaller and has excellent airtight sealing reliability can be provided. Therefore, it is preferable that the metal frame 3 is inclined such that at least the lower surface outside the portion bonded to the upper surface of the insulating substrate 1 is inclined downward or upward.

  Then, the electronic component 6 is mounted on the mounting portion 1a of the electronic component storage package 7, and the electrode is electrically connected to the wiring conductor 2 via a conductive connecting material such as solder or bonding wire. The electronic device 9 of the present invention is configured by joining the lid 5 to the upper surface of the body 3 and hermetically sealing the electronic component 6.

  The lid 5 is joined to the metal frame 3 by aligning and placing the outer peripheral portion of the upper surface of the metal frame 3 and the outer peripheral portion of the lower surface of the lid body 5 along the outer peripheral portion of the lid 5. It can be performed by performing welding such as beam welding.

  In the electronic device 9 of the present invention, the electronic component 6 is mounted on the mounting portion 1a of the electronic component storage package 7 having the above-described configuration, and the lid 5 is joined to the upper surface of the metal frame 3 via the brazing material 8. Therefore, it can be made small and highly reliable with excellent hermetic sealing reliability.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, the distance between the outer surface of the insulating base 1 and the outer surface of the metal frame 3 does not have to be the same over the entire circumference. For example, the lid 5 is joined to the metal frame 3 by welding or the like. It is also possible to widen the corner portion where the stress at the time of large action acts to ensure a sufficient bonding area of the silver brazing to the lower surface of the metal frame 3.

It is sectional drawing which shows an example of embodiment of the electronic device using the package for electronic component accommodation of this invention. It is a principal part expanded sectional view of the other Example of the electronic component storage package and electronic device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a .... Mounting part 2 ... Wiring conductor 3 ... Metal frame 4 ... Metal layer 5 for brazing ... Lid body 6 ... Electronic component 7 ... Electronic Component storage package 8 ... brazing material 9 ... electronic device

Claims (4)

  A rectangular insulating base having an electronic component mounting portion on the upper surface, a wiring conductor led out from the mounting portion to the outer surface of the insulating base, and an outer peripheral portion of the upper surface of the insulating base, surrounding the mounting portion And a brazing metal layer extending to a side surface of the insulating base at at least each corner of the insulating base, a metal frame having a lower surface brazed to the brazing metal layer, and the mounting portion. In this way, the electronic component storing package is provided with a lid attached to the upper surface of the metal frame, and the outer periphery of the metal frame is located outside the outer periphery of the insulating base.   2. The electronic component storage package according to claim 1, wherein an outer periphery of the metal frame is located 0.5 mm or more outside an outer periphery of the insulating base.   3. The electronic component storage package according to claim 1, wherein a length of the brazing metal layer extending to a side surface of the insulating base is 0.3 mm or more. An electronic component is mounted on the mounting portion of the electronic component storage package according to any one of claims 1 to 3 , and an electrode of the electronic component is electrically connected to the wiring conductor, and the metal frame An electronic device, wherein the lid is attached to an upper surface of the body and the electronic component is hermetically sealed.

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