JP4197767B2 - Solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging chip constituting a solid-state imaging device.
[0002]
[Prior art]
By inserting an elongated insertion part into a body cavity, for example, an endoscope capable of observing an organ in a body cavity or inserting a treatment tool into a treatment tool channel as necessary to perform various treatments and treatments is widely used. ing.
[0003]
Particularly in recent years, various electronic endoscopes have been proposed that include an imaging unit including a solid-state imaging device made up of an objective lens, a CCD, and the like at the distal end of the insertion portion, and a circuit board connected to the solid-state imaging device.
[0004]
An imaging unit of such an electronic endoscope includes an objective lens mounted on a lens frame or the like from the front end side, a solid-state imaging device in which the imaging surface is disposed at the focal position of the objective lens, and the solid-state imaging device. It is mainly composed of a circuit board for amplifying output signals and the like and a signal cable for transmitting and receiving signals to the solid-state image pickup device.
[0005]
As shown in FIG. 20, the conventional solid-state imaging device protects the imaging area 101 having the imaging area 101 on which an optical image that has passed through an objective lens (not shown) is formed, and the imaging area 101. Cover glass 103 that is large enough to prevent unwanted rays that cause flare and ghosts from entering, and an element substrate 104 that electrically connects signals from the image sensor chip 102. In addition, a sufficient space for the effective incident light beam is provided on the outer peripheral portion of the image sensor chip 102.
[0006]
[Problems to be solved by the invention]
However, in response to a request for downsizing of the distal end portion of the endoscope, a method in which the element substrate 104 is eliminated and a signal is directly taken out from the imaging element chip 102 is adopted. In this method, input / output terminals 105 are directly connected to the image sensor chip 102 via bumps 106 as shown in FIG. In order to achieve further miniaturization, the size of the cover glass 103 is formed to be substantially the same as the outer dimension of the image sensor chip 102 to achieve miniaturization.
[0007]
On the other hand, it is known that downsizing can be achieved by reducing the pixel size and reducing the imaging region without changing the number of pixels in order to reduce the size of the imaging element chip. In addition, a peripheral area for providing a connection pad for inputting / outputting a signal to / from the imaging element chip and a peripheral area for wiring for guiding a signal from the imaging area to the connection pad are provided around the imaging area. Although it is conceivable to reduce the size by reducing the size, the peripheral region cannot be formed to an unlimited size.
[0008]
The present invention has been made in view of the above circumstances, and an object thereof is to provide a solid-state imaging device that realizes downsizing of an imaging chip and prevents the incidence of unnecessary light that causes flare and ghost. Yes.
[0009]
[Means for Solving the Problems]
  The solid-state imaging device of the present invention includes a transparent cover glass,A solid-state imaging device and a solid-state imaging device substrate, which are sequentially disposed on the rear side of the optical axis of the cover glass;A solid-state imaging device comprising:elementOn one side,An area formed in a similar small shape with respect to the projected area from the optical axis direction of the solid-state imaging device, for capturing an optical image to be receivedAn effective imaging area;Arranged in one of the four peripheral areas and four peripheral areas on the top, bottom, left, and right formed around the effective imaging areaMain optical black part,The four peripheral regions are all substantially the same in width dimension between each edge of the effective imaging region and each of the opposing edges of the solid-state imaging device,
The distal end portion of the endoscope becomes small by forming a peripheral region with a minimum width dimension in which unnecessary light rays reflected by a surface parallel to the optical axis direction of the cover glass do not enter the effective imaging region. It is characterized by.
[0010]
According to this configuration, it is possible to reduce the size of the solid-state imaging device by providing the main optical black portion in an area configured from one side end of the effective imaging area end to the other end of the solid-state imaging chip.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 relate to an embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope system, FIG. 2 is a sectional view illustrating a configuration of a distal end portion of the endoscope, and FIG. FIG. 4 is an explanatory diagram showing the configuration of the imaging unit, and FIG. 4 is an explanatory diagram showing the configuration of the imaging surface of the imaging element chip.
[0012]
As shown in FIG. 1, the electronic endoscope system 1 includes an electronic endoscope (hereinafter referred to as an endoscope) 2, a light source device 3, a video processor 4, a monitor 5, and the like. The endoscope 2 includes an elongated and flexible insertion portion 6, an operation portion 7 that is connected to the proximal end portion of the insertion portion 6, and a flexibility that extends from the side of the operation portion 7. And the universal cord 8 having the following.
[0013]
A connector 9 is provided at the end of the universal cord 8, and the connector 9 is detachably connected to the light source device 3. A signal cord 10 extends from the side of the connector 9, and a connector 10 a provided at the end of the signal cord 10 is detachably connected to the video processor 4. The insertion portion 6 has a distal end portion 11 incorporating a solid-state image pickup device such as a CCD, which will be described later, a bending portion 12 that can be bent in the vertical and horizontal directions by connecting a plurality of bending pieces, and is elongated and flexible. The flexible tube portion 13 is sequentially connected from the distal end side. In addition, the said operation part 7 and the connector 9 are formed with the resin member, and mix and shape | mold an antibacterial agent in the resin material.
[0014]
As shown in FIG. 2, a distal insulating cover 14 is disposed on the distal end side of the distal end portion 11 of the endoscope 2, and the distal insulating cover 14 includes a distal end portion of the imaging unit 20 and air / water feeding. A nozzle 17, a forceps opening 18, and an illumination window (not shown) are provided.
[0015]
An imaging device through-hole 19a, an air / water feeding through-hole 19b for disposing the imaging unit 20, a treatment instrument insertion through-hole 19c, and the like are formed behind the distal insulating cover 14, for example. A tip block 19 formed of a metal member such as stainless steel is disposed. Reference numeral 15 denotes an outer tube that constitutes the outermost layer of the insertion portion 6, and an antibacterial agent is mixed therein. Reference numeral 16 denotes an adhesive for fixing the image pickup unit 20 in the image pickup device through hole 19a.
[0016]
3A is a longitudinal sectional view of the imaging unit, FIG. 3B is a diagram of the solid-state imaging device viewed from the arrow A side in FIG. 3A, and FIG. The configuration of the imaging unit 20 will be specifically described with reference to a BB sectional view.
[0017]
As shown in FIG. 2A, the imaging unit 20 includes a plurality of optical lenses 21,..., 21 constituting the objective optical unit, a lens frame 22 for holding and fixing these optical lenses 21, and this lens in order from the front end side. An insulating frame 23 that is integrally fixed to the rear end of the frame 22 with an adhesive, an element frame 24 that is integrally fixed to the base end of the insulating frame 23, and an imaging position of the objective optical unit The solid-state imaging device 30 provided with a solid-state imaging device 32 having an effective imaging region 31 of an optical image disposed as a light-receiving unit, and the solid-state imaging device 30 fitted on the outer periphery of the base end portion of the element frame 24 A shielding member 25 having conductivity and a base end portion of the shielding member 25 are arranged, and are electrically connected to the solid-state imaging device 30 to exchange electric signals with an external device. Wire 26 such as wire It is composed of a composite cable 27 with interpolation.
[0018]
As shown in FIGS. 4A and 4B, the solid-state imaging device 30 protects the effective imaging area 31, and unnecessary rays that cause flare and ghost are incident on the effective imaging area 31. And a connection lead 36 that is an input / output terminal for transmitting to an electronic component 35 such as a chip capacitor or a resistor. Via the bump 37 which is a conductor, it extends rearward from the imaging surface side of the solid-state imaging device 32 through the side peripheral surface and is connected to the IC 34 and the electronic component 35.
[0019]
A space portion 38 or a space portion 38 filled with a transparent resin having a low refractive index is provided between the effective imaging region 31 and the cover glass 33. Further, when the connection lead 36 is disposed between the side peripheral surface of the solid-state image pickup device 32 and the connection lead 36 by bending the connection lead 36 toward the solid-state image pickup device 32, the connection lead 36 is in electrical contact with the solid-state image pickup device 32. An insulating member 39 that prevents this is disposed.
[0020]
The cover glass 33 is bonded and fixed to the base end portion of the element frame 24. Further, the electronic components 35 such as the IC 34, the chip capacitor, and the resistor are mounted on a TAB tape 41 formed of an insulating member such as polyimide. Reference numeral 42 denotes an insulating sealing resin.
[0021]
As shown in FIGS. 2B and 2C, the connection lead 36 disposed on the upper side of the solid-state imaging device 32 and the connection lead 36 disposed on the lower side are alternately arranged on the upper side surface and the lower side surface. Are arranged so as to face each other, and can be easily connected. Further, as shown in FIGS. 4A and 4C, the inner conductor 26a of the electric wire 26 is electrically connected to the end portion of each connection lead 36 by a conductive member 28 such as solder or conductive adhesive. Yes.
[0022]
As shown in FIG. 4, on one surface side of the solid-state imaging device 32, there is a portion having a function for determining a reference level of an effective imaging region 31 and an output signal level for each pixel provided on one side of the effective imaging region 31. A main optical black portion (hereinafter abbreviated as a main OB portion) 43 and a plurality of connection pads 44 on which the bumps 37 are disposed are provided.
[0023]
The effective imaging region 31 is disposed at a position where the center of the solid-state imaging device 32 and the center of the effective imaging region 31 coincide. As a result, a peripheral region 45 is disposed between each side of the effective imaging region 31 and each side of the solid-state imaging device 32 so as to surround the effective imaging region 31.
[0024]
As shown in the figure, the peripheral area 45 has a left-side peripheral area 45L having a width A formed on the left side of the effective imaging area 31 and a right-side periphery having a width dimension B formed on the right side of the effective imaging area 31. Since the center of the solid-state imaging device 32 and the center of the effective imaging region 31 are made to coincide with each other between the width dimension A and the width dimension B,
The relationship of width dimension A≈width dimension B is established.
[0025]
The widths of the upper peripheral region 45U formed above the effective imaging region 31 and the lower peripheral region 45D formed below the effective imaging region 31 are also the left peripheral region 45L and the right peripheral region 45R. Width dimensions A and B are substantially the same. As a result, the size of the solid-state imaging device 32 is formed to be evenly larger than the effective imaging region 31. Then, the external dimensions of the solid-state imaging device 32 at this time are set to the same dimensions as the external dimensions of the cover glass 33 that prevents unnecessary rays that cause flare and ghost from entering the effective imaging region 31. Yes.
[0026]
On the other hand, a main OB portion 43 is provided in the left peripheral region 45L, and a plurality of connection pads 44 are disposed in the upper peripheral region 45U and the lower peripheral region 45D, for example, where the main OB portion 43 is not provided.
[0027]
At this time, the width dimension C from the end of the main OB portion 43 provided to the left peripheral region 45L formed on the left side of the effective imaging region 31 to the one end of the solid-state imaging device 32, and the main OB portion 43 are not provided. Between the width B from the effective imaging region 31 end of the right peripheral region 45R to the other end of the solid-state imaging device 32,
The relation of width dimension C <width dimension B is established.
[0028]
As described above, when providing a peripheral region in which the main OB portion and the connection pad are arranged, unnecessary light rays that cause flare and ghost are prevented from entering the effective imaging region on the outer periphery of each side of the effective imaging region. The size of the solid-state imaging device can be reduced by providing a peripheral region formed with a uniform width necessary for the size of the solid-state imaging device so that the outer size of the solid-state imaging device having the peripheral region is substantially the same as the outer size of the cover glass. Can do.
[0029]
In addition, the main OB portion is provided in either the left peripheral region or the right peripheral region having substantially the same width dimension, and the width dimension from the main OB portion end to one end of the solid-state image sensor is not provided in the main OB portion. It is possible to reduce the size of the solid-state imaging device in which the main OB portion is arranged in the peripheral region so as to be smaller than the width dimension from the effective imaging region end of the right peripheral region to the other end of the solid-state imaging device.
[0030]
Furthermore, by providing the main OB portion and the connection pad in separate peripheral regions, the main OB portion and the connection pad can be efficiently arranged in the peripheral region, and the solid-state imaging device can be reduced in size. .
[0031]
As shown in FIG. 5A, a solid-state image pickup device substrate 50 including an amplifier circuit of the solid-state image pickup device 32 is disposed on the base end face side of the solid-state image pickup device 32, and connection leads are connected to the solid-state image pickup device substrate 50. 36 is connected. Then, as shown in FIG. 5B, a cable mounting hole 51 is provided on the base end face side of the solid-state imaging device substrate 50, and the inner conductor 26a of the electric wire 26 is arranged in the cable mounting hole 51 to conduct electrical conductivity such as solder. The members 28 are electrically connected.
As a result, there is no need to separately provide a circuit board in the imaging unit, so that the size and cost of the solid-state imaging device can be reduced.
[0032]
Further, as shown in FIGS. 6A and 6B, the inner conductor 26a of the electric wire 26 is connected to the cable mounting hole 51 provided on the base end face side of the solid-state imaging device substrate 50 as in the embodiment shown in FIG. Instead of being electrically connected, a groove 53 is formed on one side of the solid-state imaging device substrate 50, and the inner conductor 26a of the electric wire 26 is disposed in the groove 53 and electrically connected by a conductive member 28 such as solder. In addition, the circuit board 54 may be disposed on the other side surface, and a conductive member 28 such as solder may be provided on the side surface of the circuit board 54 to be electrically fixed integrally. In this configuration, the connection leads 36 extending rearward from one surface side of the solid-state imaging device 32 pass through the upper and lower peripheral surfaces as shown in FIGS.
As a result, the size of the solid-state imaging device can be reduced.
[0033]
When the electronic component 35 is electrically connected and fixed to one surface of the circuit board 54 with a conductive member 28 such as solder as shown in FIG. 6B, the electronic component 35 is connected to the circuit board as shown in FIG. When arranged on the pattern 55 provided in 54, a gap 56 is formed between the electronic component 35 and the circuit board 54. In this state, when the electronic component 35 is fixed to the pattern 55 by soldering, the conductive member 28 such as solder may flow into the gap 56 and the first pattern 55a and the second pattern 55b may be electrically connected. It was.
[0034]
For this reason, as shown in FIG. 5B, the pattern 55 is provided in a groove formed in advance so that a gap 56 is not formed between the electronic component 35 and the circuit board 54. The end surface and the upper end surface of the circuit board 54 are substantially matched, or an insulating adhesive 57 or the like is applied to the gap 56 formed between the electronic component 35 and the circuit board 54 as shown in FIG. Thus, the configuration in which the gap 56 is filled can surely prevent a problem that the patterns 55a and 55b are electrically connected to each other when the electronic component 35 is fixed to the pattern 55 by soldering.
[0035]
By the way, when the internal conductors 26a of the electric wires 26 are electrically connected to the cable attachment holes 51 provided on the base end face side of the solid-state imaging device substrate 50 as in the embodiment shown in FIG. In this case, the plurality of core wires are scattered when the outer sheath constituting the electric wire 26 is covered, and it is troublesome to collect the scattered core wires together.
[0036]
In the present embodiment, the composite cable 27 is configured as follows.
As shown in FIG. 8 (a), the outer sheath of the composite cable 27 was peeled off to expose the plurality of electric wires 26, and then the outer diameter of the pipe was formed to be substantially the same as the outer diameter of the composite cable 27. A metallic cable frame 61 is covered.
[0037]
Then, as shown in FIG. 2B, the core wire coating 26b of the electric wire 26 is peeled to expose the internal conductor 26a. Next, the cable frame 61 is moved to the exposed internal conductor 26a side, and only the tip portion of the internal conductor 26a is arranged in a state (dimension a) slightly protruding from the cable frame 61, and the cable frame 61 is filled with an insulating adhesive 62 and fixed integrally.
[0038]
Finally, as shown in FIG. 4D, a metal bump 63 is provided on the tip surface of the internal conductor 26a to adjust the protruding height. Then, as shown in FIG. 5E, the metal bumps 63 provided on the front end surfaces of the plurality of internal conductors 26a are brought into contact with the electrode surfaces provided on the solid-state imaging device substrate 50 to perform electrical connection collectively. .
[0039]
In this way, after peeling the outer sheath of the composite cable to separate the plurality of electric wires one by one, the core wire covering of these electric wires is peeled to expose the inner conductor and covered with the cable frame. By applying an insulating adhesive inside, fixing the inner conductors of the plurality of electric wires integrally in the cable frame, and arranging the connection bumps provided on the front end surface of the inner conductor on the same plane, these plural The connection bumps and the conductive surface of the circuit board can be electrically connected together. This simplifies the connection work between the composite cable and the circuit board.
[0040]
In the present embodiment, the composite cable 27 is a composite coaxial cable 65. That is, the composite coaxial cable 65 is provided with a plurality of coaxial cables 66. FIG. 9 shows a configuration in which the plurality of coaxial cables 66 can be collectively connected to the electrode surface provided on the solid-state imaging device substrate 50 as shown in FIG. is there.
[0041]
First, as shown in FIG. 9A, after peeling the outer cover of the composite coaxial cable 65 to expose the plurality of coaxial cables 66, the plurality of coaxial cables 66 are made of a thin first member formed of a conductive member. It penetrates through the through-hole 67a formed in the cable frame 67 with a hole. Then, as shown in FIG. 4B, the first hole-attached cable frame 67 is integrally fixed to the outer surface of the composite coaxial cable 65 with an adhesive 70.
[0042]
Next, the outer sheath 66a of the coaxial cable 66 is peeled off to expose the outer conductor 66b. If the outer conductors 66b of all the coaxial cables 66 are exposed and bundled together as shown in FIG. 5C, a plurality of inner conductor covering insulating parts 66c are formed of an insulating member such as a ceramic member. It passes through the through-hole 68a formed in the thick second cable frame 68 with a hole.
[0043]
Next, as shown in FIG. 6D, after the second hole cable frame 68 is fitted on the first hole cable frame 67, the second hole cable frame 68 is bonded to the first hole cable frame 68 with an adhesive. The first holed cable frame 67 is fixed integrally. Then, the inner conductor covering insulating portion 66c protruding from the front end surface of the second hole cable frame 68 is cut at a position indicated by a dotted line, and the second hole cable frame 68 and the first hole hole are provided. The external conductor 66b exposed from between the cable frame 67 is cut at a position indicated by a one-dot chain line.
[0044]
Finally, as shown in FIG. 10E and FIG. 10, the front end surface of the inner conductor 66d in the inner conductor covering insulating portion 66c and the front end surface of the second holed cable frame 68 are flush with each other. The connecting portion is formed by polishing, and the soldering portion 69 for connecting the GND line is formed.
[0045]
As described above, the first holed cable frame and the second holed cable frame are arranged with respect to the plurality of coaxial cables of the composite coaxial cable, and the front end surface of the second holed cable frame and the front end of the internal conductor are arranged. By forming the same surface as the surface and providing a soldering part for the outer conductor, the inner conductor can be collectively connected to the electrode surface provided on the solid-state imaging device substrate and soldered. It is possible to easily shield the imaging apparatus by connecting a GND line to the unit.
[0046]
In addition, the metal conductor is provided on the front end surface of a plurality of core wires integrally formed with the cable frame, or the front end surface is polished in a state where the plurality of core wires are arranged on the cable frame with a hole, so that the inner conductors are flush with the cable frame. In place of the above arrangement, a conductor electrode is provided on the front end surface of the composite coaxial cable by the method described below, and the connection work between the composite cable and the circuit board can be simplified as described above.
[0047]
In FIGS. 11 and 12, a substrate is disposed on the front end surface of a coaxial cable or a composite cable, and a conductor provided on the substrate is electrically connected to an internal conductor of the cable.
[0048]
First, a forming method by applying a pulse will be described with reference to FIG.
As shown in FIG. 6A, the front end surface of the composite coaxial cable 65 is cut so as to be orthogonal to the longitudinal axis direction, and the conductor connection portions 72a are formed on both sides of the front surface of the front end surface via the insulating layer 71. The provided double-sided through-hole substrate 72 is disposed.
[0049]
Then, after aligning the inner conductor 66d of each coaxial cable 66 of the composite coaxial cable 65 and the conductor connecting portion 72a of the substrate 72, the conductor connecting portion 72a on the distal end surface side and the proximal end portion of the inner conductor 66d Terminals 73 and 74 are connected to and a pulse voltage from a pulse power source 75 is applied.
[0050]
Then, as shown in FIG. 5B, the application of the pulse voltage causes the insulating layer 71 between the inner conductor 66d of the coaxial cable 66 and the conductor connection portion 72a of the substrate 72 to be electrically destroyed. The conductor connection portion 72a and the internal conductor 66d are electrically connected. By repeating this operation, the substrate 72 in which each internal conductor 66d of the composite coaxial cable 65 and the conductor connection portion 72a are electrically connected is disposed on the front end surface of the composite coaxial cable 65. As a result, the connection work between the composite coaxial cable 65 and the circuit board described above can be simplified.
[0051]
Next, a formation method by etching will be described with reference to FIG.
As shown in FIG. 6A, when the coaxial cable 66 is configured, the inner conductor 66d and the outer conductor 66b are formed of materials having different etching rates. Then, as shown in FIG. 5B, the tip end portion of the coaxial cable 66 is immersed in an etching solution 76 for removing only the outer conductor 66b for a predetermined time.
[0052]
Then, as shown in FIG. 3C, only the outer conductor 66b of the coaxial cable 66 is removed by a predetermined amount, and only the inner conductor 66d is positioned on the distal end surface of the coaxial cable 66.
[0053]
Here, as shown in FIG. 4D, a double-sided through-hole substrate 72 is disposed on the front end surface of the coaxial cable 66 to electrically connect the internal conductor 66d and the conductor connecting portion 72a. Accordingly, the substrate 72 in which the inner conductor 66d of the coaxial cable 66 and the conductor connection portion 72a are electrically connected can be arranged on the front end surface of the coaxial cable 66, and the connection work with the circuit board can be simplified. .
[0054]
Next, a formation method by oxidation will be described with reference to FIG.
As shown in FIG. 2A, the coaxial cable 66 is constructed by using an inner conductor 66d and an outer conductor 66b having different electrolytic rates. And the front-end | tip part of the coaxial cable 66 is immersed in the electrolyte solution 77 as shown in the figure (b). At this time, an electrode 78 is disposed in the electrolytic solution 77, and the electrode 78 and the external conductor 66b are electrically connected. In this state, a voltage is applied to the electrode 78 and the external conductor 66b for a predetermined time.
[0055]
Then, as shown in FIG. 3C, the tip of the outer conductor 66b is oxidized and becomes non-conductive, and only the inner conductor 66d is positioned on the tip of the coaxial cable 66.
[0056]
Here, as shown in FIG. 4D, a double-sided through-hole substrate 72 is disposed on the front end surface of the coaxial cable 66 to electrically connect the internal conductor 66d and the conductor connecting portion 72a. Accordingly, the substrate 72 in which the inner conductor 66d of the coaxial cable 66 and the conductor connection portion 72a are electrically connected can be arranged on the front end surface of the coaxial cable 66, and the connection work with the circuit board can be simplified. .
[0057]
It should be noted that instead of the oxidation electrode 78 shown in FIG. 13, a plating electrode is used, and a voltage is applied to the inner conductor and the plating electrode to apply to the front end surface of the inner conductor 66d as shown in FIG. A conductive plating part 79 is provided by electrolytic plating, and the conductor connection part 72a of the double-sided through-hole substrate 72 is arranged and electrically connected so as to be electrically connected to the conductive plating part 79. At this time, an insulating layer is provided around the conductive plating portion 79 by applying an insulating adhesive 80 or the like. As a result, the board 72 electrically connected to the inner conductor 66d of the coaxial cable 66 is disposed on the front end surface of the coaxial cable 66, and the connection work with the circuit board can be simplified.
[0058]
FIG. 15 is a diagram showing another configuration example of the coaxial cable.
As shown in FIG. 6A, the cable in this figure is a composite coaxial cable 65 in which a plurality of coaxial cables 66 are regularly arranged and fixed integrally. As shown in FIG. 5B, the composite coaxial cable 65 is formed by grinding the outer peripheral surface to form a convex portion 81 having a predetermined height on the front end surface of the composite coaxial cable 65. A cable socket 82 to be fitted is prepared.
[0059]
An inner conductor 66d and an outer conductor 66b are exposed on the outer peripheral surface of the convex portion 81, and a conductor portion 83 that is electrically connected to the exposed inner conductor 66d and outer conductor 66b of the convex portion 81 on the inner peripheral surface of the cable socket 82. Is provided. The conductor portion 83 has a connecting portion 84 extending from the distal end surface of the cable socket 82.
[0060]
As shown in FIG. 6C, the inner and outer conductors 66d and 66b exposed on the convex portion 81 of the composite coaxial cable 65 are aligned with the conductor portion 83 of the cable socket 82, so that the cable socket 82 is combined coaxially. It arrange | positions at the convex part 81 of the cable 65. FIG. As a result, the cable socket 82 in which the inner conductor 66d and the outer conductor 66b of the composite coaxial cable 65 and the conductor portion 83 are electrically connected is disposed on the front end surface of the composite coaxial cable 65, thereby simplifying the connection work with the circuit board. Can be
[0061]
FIG. 16 is a diagram showing still another configuration example of the coaxial cable.
As shown in FIG. 6A, the coaxial cable 85 of the present embodiment is formed by flattening the cable tip 86, and the flattened cable tip 86 is regularly polished. The conductor portions 87 arranged in the are exposed.
[0062]
Then, the coaxial cable 85 in which the cable front end portion 86 is flattened and the conductor portion 87 is exposed is directly connected to the HIC substrate on which the electronic component 35 is mounted or the imaging device substrate 50 with an anisotropic conductive resin 88 or the like. Yes. The electronic component 35 and the IC 34 are disposed in a recess formed in the imaging device substrate 50.
[0063]
Thus, by flattening the cable tip and exposing the conductive part at the cable tip to configure the coaxial cable, it is possible to simplify the connection work to the board and to reduce the size. it can.
[0064]
FIG. 17 is a diagram showing another configuration example of the coaxial cable.
As shown in FIG. 5A, in the present embodiment, a plurality of internal conductors 91 of the composite cable 90 are arranged in a protruding state. In this case, the cable tip is temporarily hardened with an adhesive 96 or the like, and then the adhesive 96 and the outer skin other than the internal conductor 91 are removed with a laser or the like so that only the internal conductor 91 is exposed.
[0065]
Then, a plurality of internal conductors 91 protruding from the composite cable 90 are routed around the lands 94 provided on the HIC substrate, the TAB tape 93, etc. as shown in FIG. Connected. Thereafter, as shown in FIG. 3C, the imaging unit 20 is configured by filling the periphery of the connecting portion with an adhesive 96.
[0066]
In this way, by providing an internal conductor that protrudes from the cable front end surface, the internal conductor is routed and electrically connected to the HIC board or TAB tape, thereby reducing the distance from the cable front end surface to the connecting portion. The rigid length of the imaging unit can be shortened.
[0067]
Instead of routing the inner conductor 91 as shown in FIG. 8B, a through hole for arranging the inner conductor is provided in the land portion 94 as shown in FIGS. By connecting the internal conductor 91 to the land portion 94 through the hole, the protruding amount of the internal conductor 91 can be shortened, and the connection work of the internal conductor 91 to the land portion 94 can be further simplified and the wire breaks. Can be prevented.
[0068]
By the way, when the circuit for the output signal of the solid-state image pickup device is configured by the HIC substrate, a chip capacitor for stabilizing the voltage of the solid-state image pickup device is mounted on the HIC substrate, but the substrate is increased accordingly. . For this reason, in this embodiment, signal lines for transmitting signals are configured as shown in FIG.
[0069]
As shown in the figure, the signal line of this embodiment is formed by interposing a plurality of coaxial cables 66, and the plurality of coaxial cables 66 are covered with a first shield member 97a. The outer periphery of the first shield member 97a is covered with a dielectric 98, the outer periphery of the dielectric 98 is further covered with a second shield member 97b, and the outer periphery of the second shield member 97b is covered with an outer skin 99. It is covered. One of the first shield member 97a and the second shield member 97b is connected to a power source, and the other is connected to GND.
[0070]
Thus, by disposing the first shield member and the second shield member so that the dielectric is sandwiched inside the outer skin of the signal line, the capacitor is configured, thereby eliminating the need for the chip capacitor provided on the HIC substrate. Therefore, it is possible to reduce the size of the imaging device.
[0071]
By the way, as shown in FIG. 19A, in the endoscope 2 provided with a plurality of optical systems 6a, 6b, 6c, it was difficult to simultaneously grasp three or more observation screens such as the front and two side surfaces. . For this reason, in this embodiment, the endoscope apparatus is configured as shown in FIG.
[0072]
As shown in FIG. 5B, in this embodiment, the surgeon observes a direct-view image when inserting the target site with the face mount display 100 worn by the surgeon, and divides the screen of the high-definition TV monitor 5H into two. The left and right perspective images are displayed on each of the divided screens 5L and 5R so that a plurality of viewers can observe the images. As a result, the surgeon can efficiently observe a plurality of images of the face mount display and the high-definition TV monitor, and also displays a perspective image on the high-definition TV monitor and observes with a plurality of observers. Can be done.
[0073]
As shown in FIG. 5C, the high-definition TV monitor 5H is divided into three to display a direct-view image on the central screen 5C, and each of the screens 5L and 5L positioned on the left and right with respect to the central screen. By displaying the left perspective image and the right perspective image on 5R, the left perspective image, the direct view image, and the right perspective image are continuously displayed on the screen of the high-definition TV monitor 5H. Can be observed.
[0074]
It should be noted that the number of cores installed in the above-described composite cable and the type of electric wires installed are not limited to the above-described number of cores and coaxial wires. Further, the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention.
[0075]
[Appendix]
According to the embodiment of the present invention as described above in detail, the following configuration can be obtained.
[0076]
(1) In a solid-state imaging device including a transparent cover glass, a solid-state imaging chip, and an input / output terminal,
The solid-state imaging chip includes, on one side, an effective imaging area, a main optical black portion provided on one side of the effective imaging area, and an area in which connection pads to which the input / output terminals are connected are arranged.
The distance from the end of the main optical black portion provided on one side of the effective imaging area to one end of the solid-state imaging chip, and the solid-state imaging chip from the other side end of the effective imaging area end where the main optical black portion is not provided A solid-state imaging device set shorter than the distance to the other end.
[0077]
(2) The solid-state imaging device according to appendix 1, wherein the connection pads are provided in a region different from a region where the main optical black portion is provided.
[0078]
(3) In a solid-state imaging device comprising a transparent cover glass, a solid-state imaging device, and an external input / output terminal,
The solid-state imaging device includes an imaging region having an effective imaging region and a main optical black portion provided on one side of the effective imaging region, and a peripheral region in which a connection pad to which the external input / output input terminal is connected is disposed. With
Forming the outer dimensions of the solid-state image sensor uniformly larger than the outer dimensions of the effective imaging area;
A solid-state imaging device in which a main optical plaque portion and a connection pad are provided in a region formed between the solid-state imaging device end and an effective imaging region end.
[0079]
As a result, the outer dimension of the cover glass can be set uniformly large relative to the outer shape of the effective imaging region, and the incidence of unnecessary light rays that cause flare and ghost can be prevented.
[0080]
(4) The solid-state imaging device according to supplementary note 3, wherein the main optical black portion and the connection pad are provided in different areas formed between the solid-state imaging element end and the effective imaging area end, respectively.
[0081]
(5) The solid-state imaging device according to appendix 1 or appendix 3, wherein the cover glass and the solid-state imaging device have the same external dimensions.
[0082]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a solid-state imaging device that realizes downsizing of an imaging chip and prevents the incidence of unnecessary light that causes flare and ghost.
[Brief description of the drawings]
FIG. 1 to FIG. 4 relate to an embodiment of the present invention, and FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope system.
FIG. 2 is a cross-sectional view illustrating the configuration of the distal end portion of the endoscope
FIG. 3 is an explanatory diagram illustrating a configuration of an imaging unit.
FIG. 4 is an explanatory diagram illustrating a configuration of an imaging surface of an imaging element chip.
FIG. 5 is a diagram illustrating another configuration example of the solid-state imaging device.
FIG. 6 is a diagram illustrating another configuration example of the solid-state imaging device.
FIG. 7 is a view showing a method for fixing the connection of an electronic component to a circuit board pattern.
FIG. 8 is a diagram illustrating a configuration example of a signal line that can perform electrical connection all at once;
FIG. 9 is a diagram illustrating another example of the configuration of signal lines that can be electrically connected together;
10 is a cross-sectional view of the distal end portion of the signal line in FIG. 9;
FIG. 11 is a diagram for explaining a method of forming signal lines that can be electrically connected at a time by applying a pulse;
FIG. 12 is a diagram for explaining a method of forming signal lines that can be electrically connected at once by etching;
FIG. 13 is a diagram illustrating a method of forming signal lines that can be electrically connected in a batch by oxidation.
FIG. 14 is a diagram illustrating a method of forming signal lines that can be electrically connected in a batch by plating.
FIG. 15 is a diagram showing another configuration example of the coaxial cable.
FIG. 16 is a diagram showing still another configuration example of the coaxial cable.
FIG. 17 is a diagram showing another configuration example of the coaxial cable.
FIG. 18 is a diagram showing a configuration example of a coaxial cable having a capacitor.
FIG. 19 is a diagram showing a configuration example of an endoscope apparatus that facilitates grasping three or more observation screens simultaneously.
FIG. 20 is a diagram illustrating a configuration example of a conventional solid-state imaging device.
FIG. 21 is a diagram illustrating another configuration example of a conventional solid-state imaging device.
[Explanation of symbols]
31 ... Effective imaging area
32 ... Solid-state imaging device
43 ... Main optical black section
44 ... Connection pad
45 ... Peripheral area

Claims (2)

In a solid-state imaging device comprising a transparent cover glass, a solid-state imaging device and a solid-state imaging device substrate sequentially disposed on the optical axis rear side of the cover glass,
The solid-state image sensor is on one side,
An effective imaging region for capturing an optical image to be received, which is a region formed in a similar small shape with respect to the projected area from the optical axis direction of the solid-state imaging device;
Four peripheral areas on the top, bottom, left and right formed around the effective imaging area;
A main optical black portion disposed in one of the four peripheral regions;
Arrange
All of the four peripheral areas have substantially the same width dimension between each edge of the effective imaging area and each of the opposing edges of the solid-state imaging device. The effective imaging area is disposed in a range where unnecessary light incident on the solid-state imaging device is not incident through the cover glass,
The four peripheral regions are formed in a range that allows the incidence of unnecessary light incident on the solid-state image sensor through the cover glass,
2. The solid-state imaging device according to claim 1, wherein the cover glass has a shape similar to the effective imaging region and is formed to have substantially the same size as the solid-state imaging element.

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