JP4169442B2 - Method for manufacturing multiple chip elements - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multiple chip element in which a plurality of chip elements, for example, a resistor element and a resistor element or a chip element such as a resistor element and a capacitor element are connected in parallel.
[0002]
[Prior art]
In recent years, a large number of resistors, capacitors and the like are used as chip parts in computers and VTRs. In addition, there is an increasing demand for higher-density mounting and miniaturization of these chip components. Therefore, for example, a network element in which a plurality of resistors or resistors and capacitors are integrated on one insulator substrate has been developed. According to this network element, the distance between components can be reduced and high-density mounting can be achieved as compared with the case where a resistance element and a capacitor element are mounted alone.
[0003]
[Problems to be solved by the invention]
However, since this conventional network element has a structure in which element bodies such as resistors and capacitors are integrated on a single substrate, for example, when a combination of various element bodies is required, a resistor element in a factory, etc. There is a problem that it takes a certain amount of time for the production process and cannot meet the demand for a short delivery time. In addition, as described above, every time the specifications are different, the production items must be changed drastically. Therefore, there is a problem that it is expensive to produce various specifications. On the other hand, depending on the circuit to be mounted, there is a strong demand from customers (uses) to obtain a network element in which various circuit elements are combined in a short time.
[0004]
The present invention has been made in view of the above circumstances, and can reduce a distance between chip elements, can be mounted at a high density, and can provide a multi-chip element combining various chip elements requested by a customer with a short delivery time and a low delivery time. It is an object of the present invention to provide a method for manufacturing a multiple chip element that can be manufactured at low cost.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a method for manufacturing a multiple chip element according to claim 1 is to form slit grooves in a matrix shape on a square plate-like substrate made of an insulator, and at the intersections of the slit grooves. A circular through hole is formed, electrodes are formed on both ends of the substrate defined by the slit groove and the circular through hole, and an element body is formed so as to straddle these electrodes. A protective film to be coated is formed , the substrate is divided along slit grooves into a series of chip groups, side electrodes are formed on the end faces, and individual chips are formed along the slit grooves of the chip groups. Forming an external electrode by plating and forming a plurality of chip elements in which arc-shaped notches that are part of a circular through hole are formed at both ends of the electrode , Multiple cylindrical shapes on a flat plate By made the pin at intervals in two rows arranged jig formed by planting, to position using a pin which fits into the notch formed on the electrode, these plurality of chip element In a state of being arranged adjacent to each other in parallel, a tape-like fixing material is applied , heat-treated to melt and fix the tape-like fixing material to the chip elements, and the chip elements are fixed to each other.
[0006]
Thereby, it is possible to easily manufacture a multi-chip chip element combining various performance chip elements by individually manufacturing various performance chip elements and combining them with a tape-like fixing material. Therefore, multiple chip elements can be manufactured with a short delivery time and low cost. Furthermore, since it can be easily manufactured with simple equipment, it is possible to manufacture various multiple chip elements by combining chip elements with various performances according to various requests from customers at distribution centers close to customers. Thus, quick delivery can be achieved.
[0007]
In addition, since the chip elements are fixed adjacently, the distance between the chip elements can be reduced, so that a multiple chip element capable of high-density mounting can be manufactured. Thereby, the operation speed can be improved. Furthermore, since a desired number of chip elements having various performances can be combined and easily integrated, it is possible to manufacture a multiple chip element corresponding to the circuit design required by the customer. For example, it is possible to easily integrate resistance elements (chip elements) having different resistance values such as 10 kΩ or 1 MΩ into 2 to 10 stations in accordance with the specifications on the customer's circuit side. In addition, since a plurality of chip elements are integrated, the mounting operation can be performed more efficiently on the user side than mounting each chip element individually on a circuit such as a printed circuit board.
[0008]
In addition, by forming a notch at the side edge of the electrode, the adjacent electrodes are prevented from contacting each other, so the contact between the electrodes is avoided by the conventional formation of the notch, and a short circuit occurs. Is prevented.
[0009]
Furthermore, since the plurality of chip elements are arranged adjacent to each other in parallel by positioning using a pin that fits into the notch formed in the electrode, the plurality of chip elements can be arranged easily and reliably. be able to. Therefore, productivity can be improved. Here, the shape of the pin is formed into a shape that can be fitted into a notch formed in the electrode. The pin does not necessarily need to be fitted into all the notches formed in the electrode, and may be fitted so that the chip element is fixed in position. For example, the pin may be fitted only to the notch formed in the electrode on one side of each chip element, or the pin may be fitted only to the notch located on the diagonal line of each chip element. Anyway.
[0010]
In addition, as a combination of chip elements, there are combinations of the same type of chip elements or different types of chip elements. For example, there are a combination of a plurality of resistance elements, a combination of a resistance element and a capacitor element, or a combination of a plurality of resistance elements and a plurality of capacitor elements. Further, three or more kinds of chip elements such as a resistance element, a capacitor element, and an inductance element may be integrated.
[0011]
According to a second aspect of the present invention, there is provided the method for manufacturing the multiple chip element according to the first aspect, wherein the tape-shaped fixing material is fixed on the protective film of the chip element and a film is formed on the protective film by heating. It is characterized by that. Thereby, this film functions as a protective film and the protection performance is improved. In addition, after trimming each chip element such as a resistance element with laser light or the like, by integrating with a tape-like fixing material, the exposed trimming portion is covered with a film of the tape-like fixing material. Protection is achieved.
[0012]
According to a third aspect of the present invention, there is provided the method for manufacturing a multiple chip element according to the first or second aspect, wherein the chip element is a resistance element, a capacitor element, an inductance element, or other chip parts such as a fuse element. It is characterized by being. Thereby, the multiple chip element of various performance is obtained by combining these.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the multiple chip element 1 manufactured by the multiple chip element manufacturing method according to the present embodiment will be described.
As shown in FIG. 1, in the multiple chip element 1, a plurality (three in this example) of chip elements 2 are arranged adjacent to each other in parallel. The chip element 2 has electrodes 4 and 4 formed on both ends of a square plate-like chip-shaped substrate 3 made of an insulator such as alumina, and an element body 5 is formed between the electrodes 4 and 4. 5 is covered with a protective film 6 made of glass. Arc-shaped notches 4A are formed at both ends of each electrode 4 so that the electrodes 4 do not contact each other. Here, for example, one of the three chip elements 2 has the element body 5 formed as a resistance element, and the other one chip element 2 has the element body 5 formed as a capacitor element. In the other one, the element body 5 is formed as an inductance element.
[0014]
Then, on the plurality of chip elements 2 arranged adjacent to each other in parallel, the tape-like fixing material 7 is melted and fixed in a band shape by heat treatment so as to cover most of each protective film 6 to form a film. Thus, each chip element 2 is firmly fixed integrally.
As shown in FIG. 2, the tape-shaped fixing material 7 is formed by applying an adhesive 7B to the tape material 7A in a tape shape, and a plurality of chip elements 2 are attached to the adhesive 7B side and then heated. As a result, the adhesive 7B is firmly melted and fixed to the chip element 2 in a film shape, whereby the plurality of chip elements 2 are integrally fixed to each other. As this tape-shaped fixing material 7, for example, a super-epoxy tape No. 1 of a tape-shaped adhesive using an epoxy resin as the adhesive 7B. 1520 (trade name, manufactured by Sumitomo 3M Limited), which is cured after the epoxy resin is melted in about 1 minute by high-frequency heating at 180 ° C., for example.
[0015]
Next, a method for manufacturing the multiple chip element 1 according to the present embodiment will be described.
First, a method for manufacturing the chip element 2 will be described.
The chip element 2 can be manufactured by a conventional method. In this method, a plurality of chip elements 2 are simultaneously manufactured using a large substrate P. That is, as shown in FIG. 3, slit grooves M are formed in a matrix on a square plate-like substrate P made of an insulator such as alumina, and circular through holes K are formed at the intersections of the slit grooves M.
[0016]
Next, for example, an Ag—Pd paste is applied to both ends of the substrate 3 defined by the slit groove M and the circular through hole K by screen printing, and then baked to form the electrode 4. Here, arc-shaped notches 4 </ b> A, which are part of the circular through-hole K, are formed at both ends of the electrode 4.
[0017]
Next, when the chip element 2 is a resistance element, for example, a ruthenium oxide (RuO2) paste is applied by screen printing so as to straddle the electrodes 4 and 4, and then fired to form an element body (resistor) 5. To do. When the chip element 2 is a capacitor element, for example, a barium titanate (BaTiO2) paste is applied between the electrodes 4 and 4 by screen printing, and then fired to form an element body (capacitor) 5. When the chip element 2 is an inductance element, a copper paste, for example, is spirally applied between the electrodes 4 and 4 by screen printing, and then fired to form an element body (inductance element body) 5.
Next, for example, laser trimming for adjusting a resistance value or the like is performed as necessary, and a glass paste is applied onto the element body 5 by screen printing, followed by baking (heating) to form a protective film (glass protective film or A resin protective film 6 is formed to cover the element body 5 (see FIG. 4).
[0018]
Next, after the back electrode of the electrode 4 is formed, an overcoat made of an epoxy resin or the like is deposited on the protective film 6 to perform marking. In addition, formation of overcoat can also be abbreviate | omitted. Next, the electrode 4 side of the substrate P is divided by cracking along the slit groove M to form a series of chip groups in a strip shape, and the side electrodes of the electrode 4 are formed on these end faces. Next, the chips are divided into individual chips by cracking along the slit grooves M of the chip group. Next, Ni plating is applied to the electrode 4 whose longitudinal cross-sectional shape is “U”, and further, solder plating is applied to form an external electrode.
[0019]
Next, the chip element 2 manufactured in this way is sequentially taped by an automatic taping device after measurement and inspection.
Similarly, a resistance element (chip element) 2, a capacitor element (chip element) 2 and an inductance element (chip element) 2 having different performance values are manufactured, and taping is performed for each performance value.
[0020]
Next, as shown in FIG. 5, a jig G in which a plurality of pins N are planted at intervals in two rows is arranged on a flat base plate H, and then the tape-like fixing material 7 is bonded to the adhesive. With the 7B side up, it is arranged linearly along this row at the center between the pins N arranged in two rows. Each pin N is formed in an elongated cylindrical shape, and has a shape and an arrangement that can be fitted into a cutout portion 4 </ b> A formed in the electrode 4. In the present embodiment, the tape-shaped fixing material 7 is the super epoxy tape No. 1520 is used.
[0021]
Next, a combination of a resistance element, a capacitor element, and an inductance element is selected from the chip elements 2 manufactured as described above so that the multiple chip element 1 has a desired performance, as shown in FIG. As described above, a plurality of (three in this example) chip elements 2 are sequentially stuck on the adhesive 7B of the tape-shaped fixing material 7 and arranged adjacent to each other in parallel. More specifically, by placing each chip element 2 so that the notch 4A formed in the electrode 4 fits into the pin N, each chip element 2 is sequentially positioned, and a plurality of chips Elements 2 are arranged adjacent in parallel. Each chip element 2 is attached so that the protective film 6 is on the lower side and the protective film 6 is positioned on the tape-shaped fixing material 7. A plurality of units of the plurality of chip elements 2 arranged adjacent to each other in parallel are formed on the tape-shaped fixing material 7 at a predetermined interval.
[0022]
Next, after removing the jig G, the tape-shaped fixing material 7 is cut in accordance with the units of the plurality of chip elements 2 arranged adjacent to each other in parallel.
Next, for example, heating is performed at about 150 ° C. for about 5 to 10 minutes. As a result, the adhesive 7B of the tape-shaped fixing material 7 is melted and then cured and firmly fixed on the surface of the plurality of chip elements 2, and the chip elements 2 are fixed to each other and integrated. In this case, the adhesive 7B is melted and fixed in a strip shape over the plurality of chip elements 2 so as to cover most of each protective film 6, thereby forming a film (see FIG. 7). Then, since the tape material 7A burns out and becomes detached from the adhesive 7B which has been melted and fixed, or is easily peeled off, it is peeled off and removed.
Next, the manufactured multiple chip element 1 is sequentially taped by an automatic taping device after measurement and inspection.
[0023]
In such a manufacturing method of the multiple chip element 1, the chip elements 2 with various performances are individually manufactured, and the chip elements 2 with various performances are integrated by combining them with the tape-shaped fixing material 7. Therefore, the multiple chip element 1 can be manufactured with a short delivery time and low cost. Furthermore, since it can be easily manufactured with simple equipment, even if the customer requests various chip elements 1 combining various chip elements 2 according to the circuit design, a distribution center or sales office close to the customer For example, the multiple chip elements 1 can be easily manufactured according to customer specifications by combining the chip elements 2 having various performances manufactured individually in the factory and integrating them with the tape-like fixing material 7. Can be delivered quickly to customers.
[0024]
In the above-described embodiment, the arc-shaped cutout 4A is formed, but the shape of the cutout 4A is not limited to this, and may be other shapes such as a triangle or a quadrangle. The pin N is formed in a shape that can be fitted into the notch 4A corresponding to the shape of the notch 4A.
[0025]
In the above-described embodiment, the pin N is provided on the jig G. However, instead of this, the pin N may be provided directly on the work table.
[0026]
Further, in the above-described embodiment, after the tape-shaped fixing material 7 is disposed, the plurality of chip elements 2 are disposed adjacent to each other in parallel using the pins N, but instead, After a plurality of chip elements 2 are arranged adjacent to each other in parallel using pins N with the protective film 6 on the upper side, a tape-like fixing material 7 is placed on these chip elements 2 with the adhesive 7B facing downward. You may make it stick.
[0027]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the distance between the chip elements by combining individually manufactured chip elements with various performances and integrating them with the tape-shaped fixing material. A high-density mounting is possible, and a multiple chip element combining various chip elements can be manufactured at a short delivery time and at a low cost. Furthermore, by positioning using a pin that fits into a notch formed in the electrode and arranging a plurality of chip elements adjacent in parallel, a plurality of chip elements can be arranged easily and reliably. And productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a multiple chip element according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a tape-shaped fixing material according to an embodiment of the present invention.
FIG. 3 is a plan view showing a large-sized substrate for explaining a method for manufacturing a multiple chip element according to the embodiment of the present invention;
4 is a view for explaining a method for manufacturing a multiple chip device according to the embodiment of the present invention, and is a partial plan view showing a state in which a protective film is formed on the substrate of FIG. 3;
FIG. 5 is a view for explaining the method for manufacturing the multiple chip element according to the embodiment of the present invention, and is a view showing a state in which a tape-shaped fixing material is arranged between pins.
FIG. 6 is a diagram for explaining a method for manufacturing a multiple chip element according to an embodiment of the present invention, wherein a plurality of chip elements are adjacently arranged in parallel on a tape-like fixing material using pins. It is a figure which shows the state arrange | positioned.
FIG. 7 is a diagram for explaining a method for manufacturing a multiple chip element according to an embodiment of the present invention, and is a plan view showing a state in which a tape-like fixing material is melted and fixed on a plurality of chip elements; is there.
[Explanation of symbols]
1 Multiple chip element 2 Chip element (resistance element, capacitor element, inductance element)
3 Substrate 4 Electrode 4A Notch 5 Element body (resistor, capacitor, inductance element body)
6 Protective film 7 Tape-like fixing material N pin

Claims (3)

In the square plate-like substrate made of an insulator, slit grooves are formed in a matrix, and circular through holes are formed at the intersections of the slit grooves,
Forming electrodes on both ends of the substrate defined by the slit groove and the circular through hole,
Forming a device body so as to extend over the electrodes to form a protective film covering at least the element body, and further forming a back electrode of the electrodes,
The substrate is divided along the slit groove to form a series of chip groups in a strip shape, side electrodes are formed on these end faces, and divided into individual chips along the slit groove of the chip group. Forming an external electrode, and forming a plurality of chip elements in which arc-shaped notches that are part of the circular through-holes are formed at both ends of the electrode ;
A jig comprising a plurality of cylindrically formed pins planted at intervals in two rows on a flat base plate is arranged,
By positioning using the pin to be fitted into the cutout portion formed in the electrode, these plurality of said chip element while arranged adjacent in parallel, and sticking a tape-like fixing material,
A method for manufacturing a multiple chip element, wherein the chip element is fixed to each other by heat-treating and fixing the tape-shaped fixing material to the chip element.   The method for manufacturing a multiple chip element according to claim 1, wherein the tape-like fixing material is fixed on the protective film of the chip element, and a film is formed on the protective film by heating.   3. The method for manufacturing a multiple chip element according to claim 1, wherein the chip element is a resistance element, a capacitor element, an inductance element, or other chip parts.

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