JP2001093785A - Multiple-chip component and method for manufacturing thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple-chip component in which the distance between chip components can be decreased to package the chip components at high density and various kinds of chip components required by a user can be manufactured in a short period at low costs, and a manufacturing method thereof. SOLUTION: A fixing tape member 7 is melted with heat and fixed in the shape of belt to the top of a resistor element 2 and a capacitor element 12 which are disposed next to each other in parallel such that it covers the major portion of protective films 6, 16 to form a covering film, which integrally fixes the resistor element 2 and the capacitor element 12 to form a multiple-chip component 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple chip component in which a plurality of chip components such as an inductance element and a resistance element or a chip element such as a resistance element and a capacitor element are connected in parallel and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a large amount of resistors, capacitors and the like have been used as chip components in various electronic devices such as computers and VTRs. Demands for higher-density mounting and miniaturization of these chip components are increasing. Therefore, for example, a network component has been developed in which a plurality of resistance elements and capacitor elements, or resistance elements and inductance elements are integrated on one insulating substrate. According to this network component, the distance between components can be reduced and high-density mounting can be achieved as compared with the case where the resistance element and the capacitor element are individually mounted.

[0003]

However, this conventional network component has a structure in which electronic elements such as a resistor element and a capacitor element are integrated on one substrate, so that various customer-specific electronic elements are combined. When such a device is required, it is necessary to start over from the manufacturing process of the electronic element in the factory, and it takes a certain amount of time for the production, and there is a problem that the demand for a short delivery time cannot be met.
Further, as described above, since the production items must be changed greatly each time the specifications are different, there is a problem that it is expensive to produce products having various specifications. On the other hand, there is an increasing demand from customers (use destinations) to obtain multiple chip parts in which various chip parts are combined according to the circuit to be mounted in a short time.

[0004] The present invention has been made in view of the above circumstances,
A multiple chip component capable of reducing the distance between chip components, enabling high-density mounting, and combining various chip components required by a customer at a short delivery time and at low cost, and a method for manufacturing the same. The purpose is to provide.

[0005]

In order to achieve the above object, in the multiple chip component according to the present invention, electrodes are provided on both ends of a chip-shaped substrate made of an insulator, and the electrodes are provided so as to straddle these electrodes. A plurality of chip components each having an electronic element body formed thereon and a protective film covering at least the electronic element body formed thereon are arranged in parallel and / or in a manner such that the electrodes do not come into contact with each other.
Alternatively, in a state where the chip components are melted and fixed to the chip components by heat treatment in a state where the chip components are arranged adjacent to each other in series, the chip components are integrated by a tape-shaped fixing material.

Accordingly, since the chip components are fixed adjacent to each other, the distance between the chip components is reduced, and high-density mounting is possible. In addition, since each chip component is integrated with a tape-shaped fixing material, it can be easily manufactured by combining individually manufactured chip components of various performances. It is possible to manufacture parts at a short delivery time and at low cost.
Further, since a desired number of chip components having various performances can be combined and easily integrated, a multiple chip component having a size corresponding to a circuit design to be mounted can be obtained. For example, in accordance with the specifications of the customer's circuit, for example, a combination of a capacitor element and a
It is possible to integrate as easily as a series. In addition, since a plurality of chip components are integrated on the user side, mounting work can be performed more efficiently than mounting each chip component individually on a circuit such as a printed board. Furthermore, since it can be easily manufactured with simple equipment, in a distribution center close to the customer, various types of chip components with various performances are manufactured by combining various performance chip components according to various requests from customers, and Delivery can be achieved.

As chip components, for example, a resistance element,
A combination of a capacitor element, an inductance element, a fuse element and the like is possible. As a combination of chip components, there is a combination of the same type of chip components or a combination of different types of chip components. For example, there are a combination of a plurality of inductance elements, a combination of a resistance element and a capacitor element, or a combination of a plurality of resistance elements and a plurality of inductance elements. Further, three or more types of chip components such as a resistance element, a capacitor element, and an inductance element may be integrated. In addition, the chip components may be of the same size, may be of different sizes, or may be of different sizes.

As means for preventing the electrodes of each chip component from contacting each other, the electrodes may be separated from each other, or a means such as interposing an insulator between the electrodes may be employed. When the electrodes of the adjacent chips are different in size and the electrodes of the chips do not contact each other, they may be arranged directly adjacent to each other. In short, it is only necessary that the electrodes do not directly contact each other and a short circuit between the electrodes can be prevented.

According to a second aspect of the present invention, there is provided a method of manufacturing a multiple chip component, wherein electrodes are provided at both ends of a chip-shaped substrate made of an insulator, and an electronic element body is formed so as to extend over these electrodes. After applying a tape-shaped fixing material in a state where a plurality of chip components formed with a protective film covering the element body are arranged in parallel and / or series so as not to contact the electrodes, heat treatment is performed. And melting and fixing the tape-shaped fixing member to the chip component to fix the chip components to each other.

[0010] Thus, by combining individually manufactured chip components of various performances and integrating them with a tape-shaped fixing member, it is possible to easily manufacture multiple chip components in which chip components of various performances are combined. Therefore, multiple chip parts can be manufactured with a short delivery time and low cost. Furthermore, because it can be easily manufactured with simple equipment,
At a distribution center close to the customer, it is possible to produce various multiple chip components by combining various chip components according to various requests from the customer, which enables prompt delivery. Becomes

When a plurality of chip components and a tape-like fixing material are attached to each other, the chip components may be arranged adjacent to each other in parallel and / or series on the tape-like fixing material. The tape-shaped fixing material may be attached after being arranged adjacently in parallel and / or series.

According to a third aspect of the present invention, in the method for manufacturing a multiple chip component or the multiple chip component according to the first or second aspect, a notch is formed at a side end of the electrode.
The invention is characterized in that the adjacent electrodes do not contact each other. This makes it possible to avoid contact between the electrodes by simply arranging these chip components adjacent to each other by using chip parts in which notches are formed in advance, so that the production efficiency is good and the short circuit is easily prevented. Is done. Further, since the respective chip components can be fixed adjacent to each other, the distance between the respective chip components is reduced, and high-density mounting is possible. The shape of the notch may be any shape as long as the electrodes do not contact each other, and various shapes can be adopted.

According to a fourth aspect of the present invention, in the method of manufacturing a multiple chip component or the multiple chip component according to any one of the first to third aspects, the tape-shaped fixing member is formed on the protective film of the chip component. To form a coating film on the protective film. As a result, a film is formed on the protective film, and the film functions as a protective film to improve the protection performance. In addition, after individually trimming chip components such as resistor elements by laser light, etc., the exposed trimming points are covered with a coating of the tape-like fixing material by integrating with a tape-shaped fixing material, and Protection is achieved.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the multiple chip component 1 according to the present embodiment has a resistance element (chip component).
2 and a capacitor element (chip component) 12 are arranged adjacently in parallel. Resistance element 2 and capacitor element 1
Reference numeral 2 denotes a rectangular chip-shaped substrate 3 made of an insulator such as alumina, and electrodes 4 and 4 and electrodes 14 and 14 formed on both ends of the substrate 13, respectively.
A resistive element body (electronic element body) 5 and a capacitor element body (electronic element body) 15 are formed between the resistive element bodies 4 and 14. Is coated. In this case, the substrate 3 and the substrate 13 are formed in the same shape and the same size. Further, arc-shaped notches 4A and 14A each having a quarter circle shape are formed at both end portions of each of the electrodes 4 and 14, so that the electrode 4 and the electrode 14 do not contact each other. I have.

On the resistor element 2 and the capacitor element 12 arranged adjacently in parallel, a tape-shaped fixing material 7 is melt-fixed in a strip shape by heat treatment so as to cover most of the protective films 6 and 16. Thus, a film is formed, whereby the resistance element 2 and the capacitor element 12 are integrally fixed.

The tape-shaped fixing member 7 is, as shown in FIG.
The adhesive 7B is applied to the tape material 7A in a tape shape. After the resistance element 2 and the capacitor element 12 are attached to the adhesive 7B side, the adhesive 7B is heated so that the adhesive 7B The film is firmly melt-fixed in the form of a film so that they are integrally fixed to each other. The tape-shaped fixing member 7 is, for example, a super epoxy tape No. of a tape-shaped adhesive using an epoxy resin as the adhesive 7B. 1520 (trade name, manufactured by Sumitomo 3M Limited), which is cured by melting the epoxy resin in about 1 minute by high-frequency heating at 180 ° C., for example.

In such a multiple chip component 1,
Since the resistance element 2 and the capacitor element 12 are fixed adjacent to each other, the distance between them can be reduced, so that high-density mounting can be performed. In addition, since the resistance element 2 and the capacitor element 12 are integrated by the tape-shaped fixing member 7, the resistance element 2 and the capacitor element 12 that are individually manufactured can be easily manufactured by combining them. The multiple chip component 1 in which the resistance element 2 and the capacitor element 12 are combined can be manufactured in a short delivery time and at low cost. Furthermore, since a desired number of resistance elements 2 and capacitor elements 12 of various performances can be combined in a desired number and easily integrated, the multiple chip parts 1 having the number of chip parts corresponding to the circuit design to be mounted can be obtained. .
For example, it is possible to easily integrate about 2 to about 10 resistor elements 2 and capacitor elements 12 according to the specifications of the circuit side of the customer. In addition, since the resistance element 2 and the capacitor element 12 are integrated, the mounting operation can be performed more efficiently than when they are individually mounted on a circuit such as a printed circuit board. Furthermore, since it can be easily manufactured with simple equipment, various types of multi-chips can be manufactured by combining resistance elements 2 and capacitor elements 12 of various performances at a distribution center close to the customer in response to various requests from the customer. The part 1 can be manufactured and delivered in a short time. Further, since the resistance element 2 and the capacitor element 12 in which the cutouts 4A and 14A are formed in advance are used, the contact between the electrode 4 and the electrode 14 can be avoided only by arranging these adjacently. Therefore, the production efficiency can be improved, and the resistance element 2 and the capacitor element 12 can be improved.
Can be fixed adjacent to each other, so that the distance between them can be reduced, so that high-density mounting can be achieved. Furthermore, since the film of the tape-shaped fixing member 7 is formed on the protective films 6 and 16 of the resistor element 2 and the capacitor element 12, the film functions as a protective film, and the protection performance can be improved. In addition, since the resistive element 2 and the like are individually trimmed with a laser beam or the like and then integrated with the tape-shaped fixing member 7, the exposed trimmed portion can be covered with the film of the tape-shaped fixing member 7. Thus, the trimming portion can be protected.

Next, a method of manufacturing the multiple chip component 1 will be described with reference to the drawings. A resistance element 2 and a capacitor element 12 which are manufactured in advance and taped for different performance values are prepared. Then, first, the tape-shaped fixing material 7
Are arranged in a straight line. In this embodiment, as the tape-shaped fixing material 7, the super epoxy tape No. 1
520 are used. Next, a combination of the resistive element 2 and the capacitor element 12 having the desired performance is selected from the resistive element 2 and the capacitor element 12 having various performances so that the multiple chip component 1 has the desired performance. As shown in (2), the resistance element 2 and the capacitor element 12 are sequentially adhered on the adhesive 7B of the tape-shaped fixing member 7 and arranged adjacently in parallel. Resistance element 2 and capacitor element 12
Are attached such that the protective films 6, 16 are on the lower side with the protective films 6, 16 facing down. A plurality of units of the resistor element 2 and the capacitor element 12 arranged adjacent to each other in parallel are formed on the tape-shaped fixing member 7 at predetermined intervals.

Next, the tape-shaped fixing member 7 is cut in accordance with the units of the resistor element 2 and the capacitor element 12 arranged adjacently in parallel. Then, for example, 150 ° C.
For about 5 to 10 minutes. Thereby, the adhesive 7B of the tape-shaped fixing member 7 is hardened and firmly fixed on the surfaces of the resistance element 2 and the capacitor element 12, and these are fixed to each other and integrated. In this case, the adhesive 7 </ b> B covers most of the protective films 6 and 16, and is melted and fixed in a strip shape over the resistance element 2 and the capacitor element 12.
A coating is formed (see FIG. 4). Then, the tape material 7A is in a state of being detached from the adhesive 7B which has been burned and fixed by melting or is easily peeled off. Next, after the manufactured multiple chip components 1 are measured and inspected, they are sequentially taped by an automatic taping device.

In such a method of manufacturing the multiple chip component 1, the tape-shaped fixing member 7 is formed by combining the resistance element 2 and the capacitor element 12 of various performances which are individually manufactured using a conventional method. Thus, the multiple chip components 1 having various performances can be easily manufactured by integrating these components, so that the multiple chip components 1 can be manufactured at a short delivery time and at low cost. Furthermore, since it can be easily manufactured with simple equipment, even if the customer requests various multiple chip parts 1 combining the resistive element 2 and the capacitor element 12 of various specifications according to the circuit design, delivery close to the customer is required. In a center, a sales office, or the like, a resistor element 2 and a capacitor element 12 of various performances manufactured individually in a factory are combined and integrated by a tape-shaped fixing member 7, so that the product can be quickly delivered to a customer. it can.

In the above-described embodiment, the arc-shaped notch 4A is formed in the electrode 4 so that the electrodes do not come into contact with each other. However, the shape of the notch 4A may be other shapes such as a triangle, a square, and the like. Shape may be sufficient.

FIG. 5 is a plan view showing a multiple chip component 10 according to another embodiment. Note that FIG.
The same components as those described above are denoted by the same reference numerals and description thereof will be simplified. In the multiple chip component 10, two resistance elements (chip components) 22 and an inductance element (chip component) 32 interposed therebetween are arranged adjacent to each other in parallel. The resistance element 22 has the same configuration as the resistance element 2 except that the notch 4A is not formed. The inductance element 32 is provided with electrodes 3 on both ends of a chip-shaped substrate 33.
4 and 34 are formed, an inductance element body (electronic element body) 35 is formed between the electrodes 34 and 34, and a protective film 36 such as a resin is coated on the inductance element body 35. In this case, the inductance element 32
Are formed in a size larger than the resistance element 22 so that the adjacent electrodes 34 and the electrodes 4 do not come into contact with each other even if they are arranged adjacently. When the electrode 34 of the inductance element 32 and the electrode 4 of the resistance element 22 are in contact with each other, an insulator may be interposed between them.

The tape-shaped fixing member 7 is formed on the resistance element 22, the inductance element 32 and the resistance element 22 which are arranged adjacently in parallel so as to cover the central portions of the protective films 6, 36 and 6. Melted and fixed in a belt shape by heat treatment,
A coating is formed, whereby the resistance element 22, the inductance element 32, and the resistance element 22 are integrally fixed.

[0024]

As described above, according to the present invention,
By combining individually manufactured chip components of various specifications and integrating them with a tape-shaped fixing material, the distance between chip components can be reduced, high-density mounting is possible, and various chip components are combined. It is possible to provide a multiple chip component that can be manufactured at a low cost at a short delivery time, and a method for manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a plan view showing a multiple chip component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a tape-shaped fixing member according to the embodiment of the present invention.

FIG. 3 is a view for explaining the method for manufacturing the multiple chip component according to the embodiment of the present invention, and is a view showing a state in which a resistor element and a capacitor element are attached to a tape-shaped fixing member.

FIG. 4 is a plan view illustrating a method of manufacturing a multiple chip component according to the embodiment of the present invention, showing a state in which a tape-shaped fixing material is melt-fixed on a resistor element and a capacitor element. is there.

FIG. 5 is a plan view showing a multiple chip component according to another embodiment of the present invention.

[Explanation of symbols]

 1,10 Multiple chip parts 2,22 Resistance element (chip part) 3,13,33 Substrate 4,14,34 Electrode 4A, 14A Notch 5 Resistance element body (electronic element body) 6,16,36 Protective film 7 Tape-shaped fixing material 12 Capacitor element (chip part) 15 Capacitor element body (electronic element body) 32 Inductance element (chip part) 35 Inductance element body (electronic element body)

Claims (4)

[Claims] An electrode is provided at both ends of a chip-shaped substrate made of an insulator, an electronic element is formed so as to extend over these electrodes, and a protective film covering at least the electronic element is formed. In a state in which the chip components are arranged adjacently in parallel and / or series so that the electrodes do not come into contact with each other, a tape-shaped fixing material that is melted and fixed to the chip components by heat treatment and fixes the chip components to each other. Multi-chip parts characterized by being integrated. 2. A plurality of chips each having electrodes provided on both ends of a chip-shaped substrate made of an insulator, forming an electronic element body so as to extend over these electrodes, and forming a protective film covering at least the electronic element body. After attaching a tape-shaped fixing material in a state where the chip components are arranged adjacently in parallel and / or series so that the electrodes do not contact each other, heat treatment is performed to melt the tape-shaped fixing material into the chip components. A method for manufacturing a multiple chip component, wherein the chip components are fixed to each other by being fixed. 3. The multiple chip component according to claim 1, wherein a notch is formed at a side end of the electrode so that the adjacent electrodes do not contact each other. Or its manufacturing method. 4. The tape-shaped fixing member according to claim 1, wherein the tape-shaped fixing member is melt-fixed on the protective film of the chip component to form a film on the protective film. A multiple chip component or a method for manufacturing the same.