JP4075684B2 - Resin mold type electronic unit - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin mold type electronic unit in which a power module and a control module are molded with an insulating resin in a metal case.
[0002]
[Prior art]
For example, this type of conventional resin mold type electronic unit such as a battery charge control device has a manufactured structure as shown in FIGS. 6 (A) (B) to 9 (A) (B).
[0003]
That is, as shown in FIGS. 6 (A) and 6 (B), the metal case 1 positioned outside the resin mold type electronic unit closes the lower end of the square side wall 1b whose upper surface is the opening 1a and closes the bottom. 1c, and heat radiating fins 2 project from the downward outer surface of the bottom 1c, flanges 1d project horizontally from a pair of opposing side surfaces of the side wall 1b, and mounting holes 1e are provided in these flanges 1d. It has a structure.
[0004]
On the bottom 1c in the metal case 1, as shown in FIGS. 7A and 7B, a power module 6 in which a power element 4 is mounted on a heat sink 3 and connection pins 5 are erected is disposed. The heat sink 3 of the module 6 is made to exist on the bottom part 1c which protruded the radiation fin 2 on the lower surface.
[0005]
Next, as shown in FIGS. 8A and 8B, the control module 7 is stacked on the power module 6 and soldered through the connection pins 5 so as to be electrically connected. An electric circuit of an electronic unit such as a battery charge control device is configured.
[0006]
Next, as shown in FIGS. 9A and 9B, the wire harness 9 is electrically connected to the connection pins 5 that are the external connection terminals of the laminated body 8 of the electric circuit.
[0007]
After that, the metal case 1 is placed in the rectangular side wall portion 1b of the metal case 1 containing the electric circuit laminate 8 composed of the power module 6 and the control module 7 so that the opening 1a faces upward. Then, the insulating resin 10 is filled and molded from above (see, for example, Patent Document 1 and Patent Document 2).
[0008]
[Patent Document 1]
JP-A-7-235430
[Patent Document 2]
Japanese Patent Laid-Open No. 2002-227756
[Problems to be solved by the invention]
However, the conventional resin mold type electronic unit having such a structure has a problem in that workability is poor because the electric circuit laminate 8 composed of the power module 6 and the control module 7 is assembled in the metal case 1. there were.
[0011]
Moreover, since the laminated body 8 of the electric circuit composed of the power module 6 and the control module 7 is placed horizontally in the metal case 1 and then filled with the insulating resin 10 from the upper direction and cast, the relationship of the lateral structure As a result, there is a problem that air is easily trapped in the insulating resin 10.
[0012]
Further, the area of the mold surface 10a of the insulating resin 10 is increased, the mold surface 10a is likely to rise, the accuracy of the mold surface 10a is deteriorated, and the number of locations that may ignite increases due to the large opening area even in the event of a failure. There was a problem that flames were likely to come out from the surface 10a.
[0013]
An object of the present invention is to provide a resin mold type electronic unit that can improve the workability of assembly.
[0014]
Another object of the present invention is to provide a resin mold type electronic unit in which air accumulation is unlikely to occur in an insulating resin.
[0015]
Another object of the present invention is to provide a resin mold type electronic unit that can flatten the mold surface of an insulating resin and have a small area.
[0016]
Another object of the present invention is to provide a resin mold type electronic unit that can easily set a laminated body of an electric circuit within a cylindrical metal case.
[0017]
[Means for Solving the Problems]
The present invention provides a power module in which a power element is mounted on a heat sink, and a control module that is stacked on the power module and electrically connected thereto, and radiating fins project from the outer surface on the side where the power module is mounted. The power module and the control module are accommodated in a metal case, and the power module and the control module are intended for a resin mold type electronic unit molded with an insulating resin in the metal case.
[0018]
In the resin mold type electronic unit according to the present invention,
The heat sink of the power module is mounted on a metal tray, the control module is stacked on the power module, and the power module and the control module are electrically connected,
The metal case is formed in a deep cylindrical shape in the opposite direction of the opening, and heat radiating fins are projected outside the wide surface on one side,
The laminated body of the power module and the control module mounted on the metal tray has a direction perpendicular to the laminating direction of the laminated body so that the metal tray is on the heat radiating fin side in the cylindrical metal case. Is accommodated in the insertion direction,
The laminate is molded by filling a cylindrical metal case with an insulating resin.
[0019]
In the resin mold type electronic unit having such a structure, a metal tray is used, and a laminated body of a power module and a control module is mounted on the metal tray. Therefore, an electric circuit is assembled outside the metal case. Therefore, the workability of assembly can be improved.
[0020]
The power module and control module stack mounted on the metal tray is housed in a cylindrical metal case so that the direction perpendicular to the stacking direction of the stack is the insertion direction. Since the insulating resin is filled from the upper opening, the direction perpendicular to the stacking direction of the laminate faces the opening of the metal case, and air can easily escape. There is an advantage that accumulation does not easily occur.
[0021]
Moreover, the power module mounted on the metal tray and the control module stack are arranged in the cylindrical metal case with the direction orthogonal to the stacking direction of the stack facing the opening. The opening of the cylindrical metal case can be made smaller than in the prior art, and the insulating resin can be filled up to the top of the laminate to flatten the mold surface of the insulating resin.
[0022]
Also, since the metal tray is close to the surface of the metal case where the heat radiating fins are projected, the heat generated by the power module can be radiated well from the heat radiating fins of the metal case via the heat sink and the metal tray. it can.
[0023]
Further, in the resin mold type electronic unit according to the present invention, when a rail for guiding the metal tray along the insertion direction is provided in the cylindrical metal case, the electric circuit laminate is positioned in the cylindrical metal case. And can be set easily.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
FIGS. 1A, 1B to 5A, 5B show a manufacturing process of an example of an embodiment of a resin mold type electronic unit according to the present invention in which the present invention is applied to a battery charge control device. 1A is a front view of a metal case used in this example, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. 2A is a metal tray in this example. 2B is a cross-sectional view taken along line BB of FIG. 2A, and FIG. 3A is a control module on the power module provided on the metal tray in this example. 3B is a cross-sectional view taken along the line CC of FIG. 3A, and FIG. 4A is a laminate of a power module and a control module provided on a metal tray in this example. 4B is a cross-sectional view taken along the line DD of FIG. 4A, and FIG. 5A is the present example. FIG. 5B is a plan view of a process in which a laminated body of a power module and a control module provided on a metal tray is accommodated in a cylindrical metal case, and FIG. 5B is insulated in the cylindrical metal case in FIG. It is the EE sectional view taken on the line filled with resin. Note that portions corresponding to those in FIGS. 6A to 6B described above are denoted by the same reference numerals.
[0025]
As shown in FIGS. 1 (A) and 1 (B), an aluminum metal case 1 used in this example is formed in a deep cylindrical shape in the opposite direction of the opening 1a and one side of the wide surfaces 1f and 1g. The heat radiating fins 2 project from the outer surface of the wide surface 1g. A rail 12 that guides the metal tray 5 along its insertion direction is provided in a space 11 that is deeply provided in the opposite direction to the opening 1 a of the cylindrical metal case 1. The distance between the rail 12 and the wide surface 1 g provided with the heat radiating fins 2 of the metal case 1 is set to a dimension in the thickness direction of the metal tray 5.
[0026]
Next, in this example, as shown in FIGS. 2A and 2B, an aluminum metal tray 13 having a quadrangular shape and having an edge raised is used. On this metal tray 13, a power module 6 in which the power element 4 is mounted on the heat sink 3 and the connection pins 5 are erected is disposed, and the heat sink 3 of the power module 6 is fixed on the bottom of the metal tray 13. To do.
[0027]
Next, as shown in FIGS. 3A and 3B, the control module 7 is stacked on the power module 6 and soldered through the connection pins 5 to be electrically connected. An electric circuit of an electronic unit such as a battery charge control device is configured.
[0028]
Next, as shown in FIGS. 4A and 4B, the wire harness 9 is electrically connected to the connection pins 5 that are the external connection terminals of the laminate 8 of the electric circuit.
[0029]
Thereafter, as shown in FIGS. 5 (A) and 5 (B), the metal tray 13 radiates heat to the space 11 in the cylindrical metal case 1 as shown in FIGS. The fins 2 are accommodated so that the direction perpendicular to the stacking direction of the stacked body 8 is the insertion direction. At this time, the metal tray 13 is inserted between the rail 12 provided in the space 11 in the metal case 1 and the wide surface 1g provided with the heat radiating fins 2, and the laminated body 8 is moved by using the rail 12 as a guide. It is inserted so that the direction orthogonal to the stacking direction is the insertion direction.
[0030]
Thereafter, as shown in FIG. 5 (B), the insulating resin 10 is filled into the space 11 in the cylindrical metal case 1 to mold the laminate 8. At this time, the mold surface 10a of the insulating resin 10 is positioned above the upper end of the metal tray 13 as shown in the figure. Thus, when the mold surface 10a of the insulating resin 10 is above the upper end of the metal tray 13, the mold surface 10a becomes flat.
[0031]
In the resin mold type electronic unit having such a structure, the metal tray 13 is used and the laminated body 8 of the power module 6 and the control module 7 is mounted on the metal tray 13. The electric circuit can be assembled, and the workability of the assembly can be improved.
[0032]
Further, in the laminated body 8 of the power module 6 and the control module 7 mounted on the metal tray 13, the direction orthogonal to the laminating direction of the laminated body 8 is the insertion direction in the cylindrical metal case 1. Since the insulating resin 10 is filled from the upper opening 1a in the state of being housed in the housing, the direction orthogonal to the stacking direction of the stacked body 8 faces the opening 1a of the metal case 1 and air. Therefore, there is an advantage that air is not easily trapped in the insulating resin 10.
[0033]
Moreover, the laminated body 8 of the power module 6 and the control module 7 mounted on the metal tray 13 has a direction perpendicular to the laminating direction of the laminated body 8 in the cylindrical metal case 1 facing the opening 1a. Therefore, the opening 1a of the cylindrical metal case 1 can be made smaller than before, and the insulating resin 10 is filled up to the top of the laminated body 8 to mold the insulating resin 10. The surface 10a can be flattened.
[0034]
Further, since the metal tray 13 is brought close to the surface of the metal case 1 on which the heat radiating fins 2 are projected, the heat generated by the power module 6 is radiated from the heat sink 3 and the metal tray 13 through the heat radiating fins of the metal case 1. 2 can dissipate heat well.
[0035]
Furthermore, since the rail 12 which guides the metal tray 13 along the insertion direction is provided in the space 11 in the cylindrical metal case 1, the laminated body 8 of the electric circuit is positioned in the cylindrical metal case 1. And can be set easily.
[0036]
In the above example, an example in which the present invention is applied to a battery charge control device has been described. However, the present invention is not limited to this, and the circuit can be divided into the power module 6 and the control module 7. For example, it can be similarly applied to an inverter of a magnet generator.
[0037]
【The invention's effect】
In the resin mold type electronic unit according to the present invention, a metal tray is used, and a laminated body of a power module and a control module is mounted on the metal tray, so that an electric circuit is assembled outside the metal case. Thus, the assembly workability can be improved.
[0038]
The power module and control module stack mounted on the metal tray is housed in a cylindrical metal case so that the direction perpendicular to the stacking direction of the stack is the insertion direction. Since the insulating resin is filled from the upper opening, the direction perpendicular to the stacking direction of the laminate faces the opening of the metal case, and air can easily escape. There is an advantage that accumulation does not easily occur.
[0039]
Moreover, the power module mounted on the metal tray and the control module stack are arranged in the cylindrical metal case with the direction orthogonal to the stacking direction of the stack facing the opening. The opening of the cylindrical metal case can be made smaller than in the prior art, and the insulating resin can be filled up to the top of the laminate to flatten the mold surface of the insulating resin.
[0040]
Also, since the metal tray is close to the surface of the metal case where the heat radiating fins are projected, the heat generated by the power module can be radiated well from the heat radiating fins of the metal case via the heat sink and the metal tray. it can.
[0041]
Furthermore, if a rail for guiding the metal tray along its insertion direction is provided in the space in the cylindrical metal case 1, the laminated body of electric circuits can be positioned and easily set in the cylindrical metal case. Can do.
[Brief description of the drawings]
FIG. 1A is a front view of a metal case used in an example of an embodiment of a resin mold type electronic unit according to the present invention in which the present invention is applied to a battery charge control device, and FIG. FIG.
FIG. 2A is a plan view of a process of providing a power module on a metal tray in the manufacturing process of an example of an embodiment of a resin mold type electronic unit according to the present invention, and FIG. It is B line sectional drawing.
3A is a plan view of a process of providing a control module on a power module provided on a metal tray in this example, and FIG. 3B is a cross-sectional view taken along line CC in FIG.
4A is a plan view of a process of connecting a wire harness to a laminate of a power module and a control module provided on a metal tray in this example, and FIG. 4B is a cross-sectional view taken along line DD of FIG. FIG.
5A is a plan view of a process in which a laminated body of a power module and a control module provided on a metal tray in this example is housed in a cylindrical metal case, and FIG. 5B is a plan view of FIG. It is EE sectional view taken on the line which filled the insulating resin in the shape-like metal case.
6A is a front view of a metal case used in a conventional resin mold type electronic unit, and FIG. 6B is a sectional view taken along line FF in FIG.
7A is a plan view of a process of providing a power module on a metal case in a manufacturing process of a conventional resin mold type electronic unit, and FIG. 7B is a cross-sectional view taken along the line GG of FIG.
8A is a plan view of a process of providing a control module on a power module provided on a metal case in the conventional example, and FIG. 8B is a cross-sectional view taken along line HH in FIG.
9A is a plan view of a process of connecting a wire harness to a laminate of a power module and a control module provided on a metal case in a conventional example, and FIG. 9B is a metal case after the process of FIG. It is the II sectional view taken on the line of (A) of the state which filled the inside with insulating resin.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal case 1a Opening part 1b Side wall part 1c Bottom part 1d Flange 1e Mounting hole 1f, 1g Wide surface 2 Radiation fin 3 Heat sink 4 Power element 5 Connection pin 6 Power module 7 Control module 8 Laminate body 9 Wire harness 10 Insulating resin 10a Mold surface 11 Space 12 Rail 13 Metal tray

Claims (2)

A metal case in which a power module having a power element mounted on a heat sink and a control module stacked and electrically connected on the power module are provided with radiating fins protruding from the outer surface on the side where the power module is mounted In the resin mold type electronic unit housed in, the power module and the control module are molded with insulating resin in the metal case,
The heat sink of the power module is mounted on a metal tray, the control module is stacked on the power module, and the power module and the control module are electrically connected.
The metal case is formed in a deep cylindrical shape in the opposite direction of the opening, and the heat dissipating fins protrude from the wide surface on one side,
The laminate of the power module and the control module mounted on the metal tray is arranged in the stacking direction of the laminate so that the metal tray is on the heat radiating fin side in the cylindrical metal case. Is accommodated so that the direction orthogonal to the insertion direction is the insertion direction,
A resin mold type electronic unit in which the insulating resin is filled in a cylindrical metal case and the laminate is molded. The resin mold type electronic unit according to claim 1, wherein a rail for guiding the metal tray along an insertion direction thereof is provided in the cylindrical metal case.

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