JP3971273B2 - Manufacturing method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device manufacturing technique, and more particularly to a technique effective when applied to a semiconductor device manufacturing technique capable of reducing the time required for bonding or a semiconductor device manufacturing technique capable of reducing overshoot of a bonding head.
[0002]
[Prior art]
There is a die bonder as a device for positioning and mounting semiconductor chips (dies) one by one at a predetermined position on a lead frame or a package. This die bonder picks up one semiconductor chip from a diced semiconductor wafer with a bonding tool attached to a bonding head operable in the vertical direction, and attaches the picked-up semiconductor chip to a lead frame or the like arranged on a stage. Is.
[0003]
Here, when a semiconductor chip is mounted at a predetermined position on the lead frame, the bonding head to which the bonding tool is attached is moved in the vertical direction. This bonding head performs two types of operations, high speed operation and low speed operation. Is called.
[0004]
The high-speed operation is an operation performed when the distance between the semiconductor chip and the lead frame is large, and is an operation of bringing the picked-up semiconductor chip to a predetermined position above the lead frame arranged on the stage. The low-speed operation is an operation performed for mounting the semiconductor chip in contact with the lead frame from a predetermined position above the lead frame.
[0005]
In the conventional die bonder described above, when the semiconductor chip is mounted on the lead frame, the bonding head is first operated at a high speed, then temporarily stopped, and then switched to a low speed operation. The same operation is performed when one semiconductor chip is picked up from a diced semiconductor wafer by a bonding tool attached to a bonding head.
[0006]
[Problems to be solved by the invention]
However, if the bonding head is temporarily stopped after being operated at a high speed and then switched to a low speed operation, it takes a long time to bond the semiconductor chip to the lead frame and to pick up the semiconductor chip.
[0007]
Some die bonders are provided with two bonding heads, a first bonding head and a second bonding head, which can operate independently from each other in order to shorten the time for bonding the semiconductor chip to the lead frame. . That is, there is a die bonder provided with a first bonding head to which a bonding tool is attached and a second bonding head to which the first bonding head is attached.
[0008]
However, in this die bonder, the high-speed operation end time of the first bonding head is different from the operation end time of the second bonding head, and the high-speed operation end time of the first bonding head is different from the operation end time of the second bonding head. It was getting faster. Therefore, due to the impact generated when the operation of the second bonding head is completed, the first bonding head that has finished high-speed operation overshoots, and the bonding tool that picks up the semiconductor chip strikes the upper surface of the lead frame. There is a problem that it was. Similarly, when picking up a semiconductor chip, the first bonding head overshoots due to the impact generated when the operation of the second bonding head is completed, and the bonding tool hits the upper surface of the diced semiconductor wafer. There is a problem.
[0009]
An object of the present invention is to provide a method of manufacturing a semiconductor device that can reduce the time required for bonding.
[0010]
Another object of the present invention is to provide a method of manufacturing a semiconductor device that can reduce overshoot of the bonding head.
[0011]
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
[0012]
[Means for Solving the Problems]
Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.
[0013]
The present invention is a method of manufacturing a semiconductor device including a step of performing a bonding operation with a bonding tool attached to a vertically moving bonding head, the method comprising: (a) moving the bonding head in a first speed pattern; (B) moving the bonding head in a second speed pattern, and moving the bonding head in the first speed pattern so that the bonding head is at a predetermined speed greater than zero; The bonding head is moved by switching from the first speed pattern to the second speed pattern starting from the predetermined speed.
[0014]
The present invention also includes (a) a step of moving the first bonding head moving in the vertical direction with a first speed pattern, (b) a step of moving the first bonding head with a second speed pattern, c) a method of manufacturing a semiconductor device including a step of performing a bonding operation with a bonding tool attached to the first bonding head, wherein (d) the first operation of ending the operation in the first speed pattern is performed. (E) outputting the first control information for moving the first bonding head to the end position; and (e) moving the first bonding head to the first end position based on the output first control information. And (f) a bonding head that moves in the vertical direction, and the second bonding head to which the first bonding head is attached is operated. (G) a step of moving the second bonding head to the second end position based on the output second control information; The time at which the first control information is output is later than the time at which the second bonding head reaches the second end position.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.
[0016]
(In the form state of reference)
Figure 1 is a diagram showing a schematic configuration of a die bonder used in the manufacturing method of the semiconductor device definitive to form state of the reference. FIG. 2 is a graph showing the relationship between the position of the first bonding head and the time when the first bonding head is moved. FIG. 3 is a graph showing the relationship between speed and time when the first bonding head is moved.
[0017]
In FIG. 1, the die bonder includes an XY table 1, a first bonding head 2, a second bonding head 3, a bonding tool 4, a stage 6, a position detection sensor 7, an operation controller 8, a main controller 9, a keyboard 10, A buzzer 11 and a display 12 are included.
[0018]
The XY table 1 is configured such that the attached structure can freely move in a horizontal plane.
[0019]
The 1st bonding head 2 is comprised so that it can move to a perpendicular direction, and the bonding tool 4 is attached to the lower part.
[0020]
Next, the second bonding head 3 is configured to be movable in the vertical direction, and is attached to the XY table 1. The first bonding head 2 is attached to the second bonding head 3. The first bonding head 2 and the second bonding head 3 can operate independently of each other.
[0021]
The bonding tool 4 is configured to pick up a semiconductor chip (not shown) and to attach the picked up semiconductor chip to the lead frame 5.
[0022]
The stage 6 is configured such that a lead frame 5 for mounting a semiconductor chip picked up by the bonding tool 4 can be disposed.
[0023]
The position detection sensor 7 is configured to detect the vertical coordinate positions of the first bonding head 2 and the second bonding head 3, and is connected to the operation controller 8.
[0024]
The operation controller 8 is configured to output the current coordinate position data of the first bonding head 2 and the second bonding head 3 detected by the position detection sensor 7 to the main controller 9, and from the main controller 9. Based on the output control information, a servo motor (not shown) that drives the XY table 1, the first bonding head 2, and the second bonding head 3 is controlled.
[0025]
The main controller 9 indicates how to operate the XY table 1, the first bonding head 2, and the second bonding head 3 next based on the current coordinate position data input from the operation controller 8. The control information is output to the operation controller 8.
[0026]
The main controller 9 is connected to a keyboard 10 for inputting height data for operating the bonding tool 4, for example, and the bonding head does not reach the position determined by the main controller 9, for example. A buzzer 11 for informing an external operator and a display 12 for displaying are connected.
[0027]
Die bonder used in the manufacturing method of the semiconductor device definitive in the form status of this reference is configured as described above, the operation and effect as follows.
[0028]
First, the lead frame 5 is disposed on the stage 6. Subsequently, one semiconductor chip is picked up by the bonding tool 4 from the diced semiconductor wafer.
[0029]
Next, XY table control information for controlling the XY table 1 is output from the main controller 9 to the operation controller 8. Upon receiving the XY table control information, the operation controller 8 controls the servo motor that moves the XY table 1 based on the XY table control information. Then, the second bonding head 3 attached to the XY table 1 moves in the horizontal plane, and the bonding tool 4 attached to the first bonding head 2 is arranged on the lead frame 5.
[0030]
Next, the current coordinate position in the vertical direction is detected by the position detection sensors 7 provided in the first bonding head 2 and the second bonding head 3, and the current coordinate position data is output to the operation controller 8. The The operation controller 8 having received the current coordinate position data outputs the current coordinate position data to the main controller 9. The main controller 9 that has received the current coordinate position data outputs control information for moving to the next target position to the operation controller 8 based on the current coordinate position data. Then, the operation controller 8 controls the servo motor that moves the first bonding head 2 and the servo motor that moves the second bonding head 3 based on the received control information. Then, the first bonding head 2 and the second bonding head 3 move in the vertical direction.
[0031]
Here, the first bonding head 2 moves in the vertical direction as shown in FIG. That is, the vehicle starts accelerating from the movement start position and starts descending, then decelerates to a predetermined speed, and reaches the first end position at the operation switching time t ₁ . That is, as shown in FIG. 3, the high-speed operation is performed with the first speed pattern including the acceleration region and the deceleration region. This operation is controlled by the main controller 9.
[0032]
Next, when the main controller 9 recognizes from the current coordinate position data received from the operation controller 8 that the first bonding head 2 is at the first end position, the main controller 9 switches the operation so far and changes the first operation shown in FIG. Control information is output to the operation controller 8 so as to move the first bonding head 2 with a speed pattern of 2. That is, the control information is output to the operation controller 8 so as to move the first bonding head 2 with the second speed pattern in which the speed when the first end position is reached is a constant speed. Next, the operation controller 8 that has received this control information controls the servo motor that moves the first bonding head 2 to operate the first bonding head 2 at a low speed. Then, by moving the bonding tool 4 attached to the lower part of the first bonding head 2 while operating the first bonding head 2 at a constant speed, one semiconductor chip is mounted at a predetermined position on the lead frame 5. .
[0033]
Thus, according to the die bonder used in the manufacturing method of the semiconductor device definitive to form state of the reference, by causing the first bonding head 2 is first in the first speed pattern at high speed operation, the first bonding head 2 Since the first bonding head 2 is operated at a low speed by switching from the first speed pattern to the second speed pattern starting from the predetermined speed when the speed reaches a predetermined speed, the bonding time can be shortened. it can.
[0034]
According to the conventional die bonder, first, the first bonding head 2 is moved with a first speed pattern, then temporarily stopped, and then the first bonding head 2 is moved with a second speed pattern. Therefore, only once it does not stop minute at the switch according to the die bonder definitive the form status of the reference it is possible to shorten the bonding time.
[0035]
Further, since the bonding time can be shortened, the number of semiconductor devices that can be manufactured per hour can be increased.
[0036]
In the form status of the reference, a case has been described in which switching from the high-speed operation to the low-speed operation, may be applied to a case of switching from low-speed operation to the high speed operation.
[0037]
(Embodiment 1 )
Construction of a die bonder used in the method of manufacturing a semiconductor device of the first embodiment is similar to the die bonder definitive the form status of the reference, it is shown in Figure 1.
[0038]
FIG. 4 is a graph showing the relationship between the position and time when the first bonding head 2 and the second bonding head 3 are operated. In FIG. 4, a solid line indicates a target position indicated by control information output from the main controller 9, and a broken line indicates a position where the bonding head has actually reached. That is, as can be seen from FIG. 4, it can be seen that the bonding head has actually reached the target position after a predetermined time has elapsed since the target position was indicated by the control information output from the main controller 9.
[0039]
Hereinafter, operations of the first bonding head 2 and the second bonding head 3 will be described with reference to FIG.
[0040]
First, the lead frame 5 is disposed on the stage 6. Subsequently, one semiconductor chip is picked up by the bonding tool 4 from the diced semiconductor wafer. Then, by moving the XY table 1, the bonding tool 4 attached to the first bonding head 2 is arranged on the lead frame 5.
[0041]
Thereafter, the first bonding head 2 and the second bonding head 3 are simultaneously started to operate in the vertical direction. First, the operation of the second bonding head 3 will be described. First, the second bonding head 3 is accelerated and then decelerated. The second control information for operating the second end position at time t ₂ from the main controller 9 to the working controller 8 is output. When the operation controller 8 receives the second control information, the operation controller 8 controls the servo motor that moves the second bonding head 3 based on the second control information. Then, the second bonding head 3 reaches the second end position at time t ₃ and ends the operation.
[0042]
On the other hand, the first bonding head 2 similarly accelerates and then performs a high-speed operation of decelerating. Then, the second bonding head 3 is first bonding head 2 even at the time t ₃ when to end the arrival operates in the second end position is in the state during operation.
[0043]
Thereafter, at time t ₄ later than time t _3, first control information for operating the first bonding head 2 to the first end position is output from the main controller 9 to the operation controller 8. Upon receiving the first control information, the operation controller 8 controls the servo motor that moves the first bonding head 2 based on the first control information. Then, the first bonding head 2 reaches the first end position at time t ₅ and ends the high-speed operation.
[0044]
Next, after a predetermined time has elapsed, the first bonding head 2 is moved at a constant speed to perform a low speed operation. Then, by moving the bonding tool 4 attached to the lower part of the first bonding head 2 while operating the first bonding head 2 at a constant speed, one semiconductor chip is mounted at a predetermined position on the lead frame 5. .
[0045]
In this way, the operation of the second bonding head 3 is completed by setting the time t ₅ when the first bonding head 2 finishes the high-speed operation to be later than the time t ₃ when the second bonding head 3 finishes the operation. It is possible to reduce the overshooting of the first bonding head 2 due to the vibration generated at times. That is, the second bonding head 3 at time t ₃ when the operation ends, than when the first bonding head 2 has already completed the high-speed operation, when the first bonding head 2 is operating Since the influence of vibration can be reduced, the overshoot of the first bonding head 2 can be reduced.
[0046]
In other words, the time t _{4 at} which the first control information is output from the main controller 9 to the operation controller 8 is delayed from the time t _{3 at} which the second bonding head 3 reaches the second end position. The overshoot of the head 2 can be reduced.
[0047]
At time t ₃ when the second bonding head 3 ends the operation, than when the first bonding head 2 has already completed the high-speed operation, when the first bonding head 2 is operated at high speed The distance between the bonding tool 4 attached to the first bonding head 2 and the lead frame 5 is longer. Therefore, it is possible to reduce the bonding tool 4 from hitting the lead frame 5 due to the overshoot of the first bonding head 2.
[0048]
As described above, according to the semiconductor device manufacturing method of the first embodiment, product defects due to overshoot of the first bonding head 2 can be reduced, and the yield can be improved.
[0049]
(Embodiment 2 )
Die bonder used in the manufacturing method of the semiconductor device definitive to the second embodiment is similar to the die bonder definitive the form status of the reference, it is shown in Figure 1.
[0050]
FIG. 5 is a graph showing the relationship between position and time when the first bonding head 2 and the second bonding head 3 are operated. In FIG. 5, a solid line indicates a target position indicated by control information output from the main controller 9, and a broken line indicates a position where the bonding head has actually reached.
[0051]
Hereinafter, operations of the first bonding head 2 and the second bonding head 3 will be described with reference to FIG.
[0052]
First, the lead frame 5 is disposed on the stage 6. Subsequently, one semiconductor chip is picked up by the bonding tool 4 from the diced semiconductor wafer. Then, by moving the XY table 1, the bonding tool 4 attached to the first bonding head 2 is arranged on the lead frame 5.
[0053]
Thereafter, the first bonding head 2 and the second bonding head 3 are simultaneously started to operate in the vertical direction. First, the operation of the second bonding head 3 will be described. First, the second bonding head 3 is accelerated and then decelerated. The second control information for operating the second end position at time t ₂ from the main controller 9 to the working controller 8 is output. When the operation controller 8 receives the second control information, the operation controller 8 controls the servo motor that moves the second bonding head 3 based on the second control information. Then, the second bonding head 3 reaches the second end position at time t ₃ and ends the operation.
[0054]
On the other hand, the first bonding head 2 similarly accelerates and then performs a high-speed operation of decelerating. Then, the second bonding head 3 is first bonding head 2 even at the time t ₃ when to end the arrival operates in the second end position is in the state during operation.
[0055]
Thereafter, at time t ₄ later than time t _3, first control information for operating the first bonding head 2 to the first end position is output from the main controller 9 to the operation controller 8. Upon receiving the first control information, the operation controller 8 controls the servo motor that moves the first bonding head 2 based on the first control information. Then, the first bonding head 2 reaches the first end position at time t _5.
[0056]
Next, when the main controller 9 inputs the current coordinate position data detected by the position detection sensor 7 from the operation controller 8 and recognizes that the first bonding head 2 is at the first end position, the operation up to now is performed. The control information is output to the operation controller 8 so as to move the first bonding head 2 with the second speed pattern. That is, the control information is output to the operation controller 8 so as to move the first bonding head 2 with the second speed pattern in which the speed when the first end position is reached is a constant speed. Next, the operation controller 8 that has received this control information controls the servo motor that moves the first bonding head 2 to operate the first bonding head 2 at a low speed.
[0057]
Thereafter, one semiconductor chip is mounted at a predetermined position on the lead frame 5 by moving the bonding tool 4 attached to the lower portion of the first bonding head 2 while operating the first bonding head 2 at a constant speed. .
[0058]
In this way, the overshoot of the first bonding head 2 can be reduced and the bonding time can be shortened.
[0059]
The invention made by the present inventor has been specifically described based on the above embodiment, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.
[0060]
In the above embodiment, the case where the semiconductor chip picked up by the bonding tool is mounted on the lead frame has been described. However, the present invention may be applied to the case where the semiconductor chip is picked up by the bonding tool.
[0061]
In the above-described embodiment, a die bonder in which a semiconductor chip is mounted on a lead frame is described as an example of a bonding operation.
[0062]
【The invention's effect】
The effects obtained by the representative ones of the inventions disclosed by the present application will be briefly described as follows.
[0063]
By operating the bonding head at a high speed according to the first speed pattern, when the bonding head reaches a predetermined speed, the first speed pattern is switched to the second speed pattern starting from the predetermined speed. Since the bonding head is operated at a low speed, the bonding time can be shortened.
[0064]
In addition, when the second bonding head finishes operating, the first bonding head is put into an operating state, so that the first bonding head overshoots due to vibration generated at the end of the operation of the second bonding head. Can be reduced.
[Brief description of the drawings]
1 is a diagram showing a schematic configuration of a die bonder used in the method of manufacturing the semiconductor device in the second shape condition or et exemplary reference of the present invention.
[Figure 2] Oite the form status of reference of the present invention, is a graph showing the relationship between the position and time of the first bonding head when you move the first bonding head.
[Figure 3] Oite reference shape condition of the present invention, is a graph showing the relationship between speed and time when you move the first bonding head.
In the first embodiment of the invention, FIG is a graph showing the relationship between the position and the time in the case of operating the first bonding head and the second bonding head.
In the second embodiment of the present invention; FIG is a graph showing the relationship between the position and the time in the case of operating the first bonding head and the second bonding head.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 XY table 2 1st bonding head 3 2nd bonding head 4 Bonding tool 5 Lead frame 6 Stage 7 Position detection sensor 8 Operation controller 9 Main controller 10 Keyboard 11 Buzzer 12 Display

Claims (2)

(A) moving the first bonding head moving in the vertical direction in a first speed pattern;
(B) moving the first bonding head in a second speed pattern that is slower than the first speed pattern ;
(C) a method of manufacturing a semiconductor device including a step of performing a bonding operation with a bonding tool attached to the first bonding head,
(D) outputting first control information for moving the first bonding head to a first end position where the operation in the first speed pattern is ended;
(E) moving the first bonding head to the first end position based on the output first control information;
(F) a step of outputting second control information for moving the second bonding head attached with the first bonding head to a second end position to end the operation, the bonding head moving in the vertical direction; ,
(G) moving the second bonding head to the second end position based on the outputted second control information,
A method of manufacturing a semiconductor device, wherein a time at which the first control information is output is later than a time at which the second bonding head reaches the second end position. (A) moving the first bonding head moving in the vertical direction in a first speed pattern;
(B) moving the first bonding head in a second speed pattern that is slower than the first speed pattern ;
(C) A semiconductor device manufacturing method including a step of performing a bonding operation with a bonding tool attached to the first bonding head,
(D) moving the first bonding head to a first end position for ending the operation in the first speed pattern;
(E) a bonding head that moves in a vertical direction, the step of moving the second bonding head to which the first bonding head is attached to a second end position to end the operation;
A method of manufacturing a semiconductor device, wherein a time at which the first bonding head reaches the first end position is later than a time at which the second bonding head reaches the second end position.

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