JP3907571B2 - Method and apparatus for manufacturing image display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an image display device, and more particularly to high vacuum in the image display device.
[0002]
[Prior art]
In an apparatus for displaying an image by irradiating a phosphor as an image display member with an electron beam emitted from an electron source and causing the phosphor to emit light, the inside of the vacuum vessel containing the electron source and the image display member is subjected to a high vacuum. Must hold on. This is because when the gas is generated inside the vacuum vessel and the pressure is increased, the amount of emitted electrons is reduced depending on the type of gas, but a bright image cannot be displayed. Further, when the generated gas is ionized by an electron beam and accelerated by an electric field and collides with the electron source, the electron source may be damaged. Furthermore, an electric discharge may occur inside, and the image display device may be destroyed.
[0003]
Conventionally, the pressure of a vacuum vessel forming an image display device such as a CRT has been maintained by a getter installed in the vacuum vessel. A getter film is a gas adsorption film formed on the inner wall of a container by vapor deposition by heating an alloy containing Ba as a main component in a vacuum container by energization or high frequency.
[0004]
On the other hand, in recent years, development of a flat display in which a large number of electron-emitting devices are arranged on a flat substrate has been advanced. Regarding the vacuum problem, the gas generated from the image display member can hardly reach because the conductance to the getter installed outside the image display area is small, and it gathers in the vicinity of the electron source and causes a local pressure increase. Can be mentioned. Therefore, electron source deterioration has become a characteristic problem.
[0005]
One solution to this problem has been disclosed (see, for example, Patent Document 1). This is because degassing, getter formation and sealing (vacuum containerization) are performed in a series of operations in the vacuum chamber, and a getter with good exhaust characteristics is placed in the image display area, and the entire vacuum container is kept at a low pressure. To try to maintain. In this case, flashing is performed by covering the image display substrate (face plate) with a lid-shaped (box-shaped) scattering prevention jig so that the evaporative getter does not adhere to the area other than the display area.
[0006]
FIG. 12 shows an example in which the getter container 101 is arranged on the inner ceiling portion of the lid-shaped jig 203. Each container 101 is provided with a getter material that is heated by an electric current supplied through a terminal 205 and is flushed when the container 101 exceeds a predetermined temperature, and is formed on an image display substrate.
[0007]
FIG. 13 shows a state in which a lid-like jig 203 that prevents the image display substrate 201 and the evaporative getter from scattering is placed on the carrying jig 202 and introduced into the vacuum chamber 200. The lid-like jig 203 shows a state in which only the right side covers the substrate 201. An electric current can be supplied to the ring-shaped evaporative getter container set on the lid-like jig 203 through the wirings, terminals, and electrodes 204, 205, 206, and 207.
[0008]
[Patent Document 1]
JP 2000-315458 A
[0009]
[Problems to be solved by the invention]
However, in general, in the case of getter flash, CO, CO₂, H₂O, O₂Oxide gas such as CH_FourA large amount of hydrocarbon gas and hydrogen are released. The lid-shaped jig 203 is for preventing getters from scattering in places other than a predetermined place. However, when the lid-shaped jig 203 comes into close contact with the substrate 201 as shown on the right side of FIG. 13, the gas released by the getter flash enters the lid-shaped jig 203. It will be trapped.
[0010]
When the evaporation type getter was flushed, the pressure change of the gas leaking from the gap between the lid-like jig 203 and the substrate 201 was examined. H₂O, O₂, CO₂It was found that as the number of getter flashes increased, the pressure increase decreased, and the formed getter film sucked. That is, the adsorption capacity of the getter is reduced in this step. On the other hand, H₂In the case of CH gas, the same pressure increase is observed with each flash, and the pressure decay is slow even after the flash. Therefore, it is considered that diffusion into the chamber space and adsorption to the substrate or the like occur. In particular, most of the CH-based gas having a high molecular weight is adsorbed to a member such as a substrate. As a result, there is a problem that the exhaust characteristics of the getter are deteriorated and gas is re-released when the image display device is driven, and the pressure in the vacuum vessel cannot be kept low. Furthermore, this causes a problem that the change in device characteristics over time is conspicuous.
[0011]
The initial pressure of the image display device as a vacuum container is determined by the pressure at which the face plate and the rear plate are vacuum-sealed after the getter is formed. When the initial pressure is high, the exhaust characteristics of the getter are deteriorated quickly, and when the image is displayed, the gas is re-released. Furthermore, the problem that the lifetime of an element characteristic becomes short also arises by it.
[0012]
As a second problem, there is a problem that coarse particles (hereinafter referred to as particles) are deposited on the formed getter film. These particles are deposited by depositing particles in the lid-shaped jig during film formation, resulting in a thick film and peeling, and by falling foreign matter (dust) adhering to the ceiling or getter container of the lid-shaped jig Is. Some of these particles have a diameter of up to several tens of microns, and when they are deposited on the substrate, when a high voltage is applied to the image display device when displaying an image, a discharge phenomenon is caused and the display quality is deteriorated. There was a problem.
[0013]
An object of the present invention is to provide a method for manufacturing an image display device in which the gas in the getter flash is exhausted to keep the pressure in the vacuum vessel low and no particles are generated in the getter film.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:By covering at least a part of the image display substrate having the phosphor film and the anode electrode with a lid-like jig in a reduced-pressure chamber and flashing the evaporative getter disposed inside the lid-like jig, an image is obtained. A chamber in which a getter film is formed on a display substrate, an electron source substrate on which a plurality of electron-emitting devices are arranged, and an image display substrate on which the getter film is formed And a flash is attached between the evaporable getter and the image display substrate with a plurality of openings through which a part of the flashed getter agent passes and another part of the getter agent. And a method for manufacturing an image display device, wherein the member having a portion to be disposed is disposed away from the image display substrate.OfferYouThe
[0015]
According to the present invention,When forming a getter, by installing a member having a plurality of openings in the lid-shaped jig, getter vapor deposition particles from the vertical and near vertical directions pass through the openings and are formed on the face plate substrate. However, other getter-deposited particles are deposited on a member having a plurality of openings, and the getter adsorption area increases. Thereby, the exhaust speed of the vacuum processing chamber is increased, and the pressure at the time of sealing in the vacuum processing chamber can be further reduced. Furthermore, when a metal member is used as a member having a plurality of openings, the surface area is increased by embossing the surface of the metal member, and the exhaust speed is further improved. Accordingly, it is possible to further reduce the pressure when vacuum-sealing the image display device.
[0016]
Further, when a getter is formed, getter vapor-deposited particles in the vertical and near-vertical directions pass through the opening, but other getter vapor-deposited particles are formed on a member having a plurality of openings to form a getter. The surface area that is filmed increases. If a metal member is used for the member having a plurality of openings, the surface area is further increased by embossing the surface of the metal member, the amount of getter vapor deposition particles per unit area is decreased, and the internal amount accompanying the increase in the amount of adhesion is increased. It is possible to suppress an increase in stress and reduce peeling due to a crack in the adhesion film. Therefore, when the getter film is formed on the face plate, it is possible to form a getter film with fewer particles. Further, even if foreign matter (dust) adhering to the getter container and the lid-shaped jig ceiling part falls, the number of foreign matters falling on the face plate is captured by a member having a plurality of openings.
[0017]
A plurality of openings through which a part of the flashed getter agent passes and a portion to which another part of the getter agent adheresThe member may be made of ceramics.
[0018]
Further, a non-evaporable getter may be provided in the lid-shaped jig. The activated non-evaporable getter is H ₂ O, O ₂ , CO, CO ₂ Since such a gas has a large exhaust capacity even at room temperature, the resorption of such a gas to an evaporative getter such as Ba is reduced, and deterioration of the exhaust characteristics of the evaporative getter is suppressed. Further, when the non-evaporable getter is heated to a high temperature, particularly 400 ° C. or higher, the CH _Four For example, hydrocarbon gas that hardly adsorbs at room temperature has a large exhaust capacity. Furthermore, if the non-evaporable getter is continuously energized and heated at the timing of flushing the evaporative getter, including before and after the flash, the gas that is released during driving can be eliminated very effectively. As a result, it is possible to prevent a gas that causes a change with time of the electron source element from being brought into the vacuum container of the image forming apparatus, so that an image forming apparatus with a small change with time can be provided.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings.
[0020]
Referring to FIG.referenceAn internal configuration of a getter scattering prevention jig (hereinafter referred to as a lid-like jig) 203 of the manufacturing apparatus of the embodiment is shown. FIG. 1 is a schematic view of the inside of the lid-shaped jig 203 as seen from the image display substrate (face plate) side.
[0021]
In the lid jig 203, five evaporable getter containers 101 and four plate-like non-evaporable getters 102 are installed.
[0022]
As the evaporable getter mounted in the evaporable getter container 101, metals such as Ba, Mg, Ca, Ti, Zr, Hf, V, Nb, Ta, and W and alloys thereof can be used. Ba, Mg, Ca and alloys thereof, which are alkaline earth metals having a low vapor pressure and are easy to handle, are preferred. Of these, Ba or an alloy containing Ba, which is inexpensive and can be easily evaporated from a metal capsule holding a getter material, is easy to manufacture industrially. The evaporable getter container 101 is provided with a terminal 205 for connection.
[0023]
The four non-evaporable getters 102 are installed around the inner ceiling portion of the lid-shaped jig 203. The connection portions at the four corners are insulators such as insulators and are electrically insulated from the lid-shaped jig 203. Each non-evaporable getter 102 is connected to a conductor such as an L-shaped metal piece installed on the insulator by welding or the like, and is electrically connected in series. All non-evaporable getters 102Need not be connected in series, and may be a single drawer or a parallel drawer depending on the number of wires that can be routed. Further, the arrangement of the non-evaporable getter 102 is not limited to the example of FIG. 1, and the non-evaporable getter 102 is attached so that as much area as possible can be obtained, such as the side wall of the lid-like jig 203. Is desirable. The non-evaporable getter 102 is provided with a terminal 208 for connection.
[0024]
Referring to FIG. 2, the terminal 205 of the evaporable getter container 101 and the terminal 208 of the non-evaporable getter 102 are connected in the vacuum chamber 200, and the image display substrate (face plate) 201 is introduced by the conveying jig 202. The schematic diagram ((a) is sectional drawing, (b) is a top view) which shows the mode which was seen is shown. The lid-like jig 203 is placed at a position (a retreat position) that is off the substrate 201 like the left-side lid-like jig 203 except during the getter flash. In FIG. 2, the lid-like jig 203 is designed to be divided into two bodies on the left and right. However, if the getter film can be functionally formed at a predetermined location without any difficulty in space, a single-body type may be used. There may be more than two.
[0025]
The wirings 204 and 209 drawn from the terminals 205 and 208 of the lid-shaped jig 203 are arranged such that when the transfer jig 202 is placed at a predetermined position, the contact electrodes 206 and 210 attached to the transfer jig 202 are converted into chambers. By making contact with feedthrough electrodes 207 and 211 provided with flanges or the like, a power source (not shown) outside the chamber is connected. Thereby, the evaporable getter container 101 and the non-evaporable getter 102 can be energized and heated.
[0026]
Referring to FIG. 3, some examples are schematically shown regarding the moving method of the lid-like jig 203 used in the manufacturing apparatus of the present invention. The movement of the lid-shaped jig 203 is appropriately selected within a range where there is no space and interference with other operations. For example, the rail 301 may be slidably moved from the retracted position to the flash position (a), or the support post 302 may be raised and closed left and right (b). Further, it may be rotated about the horizontal axis 303 and covered from the side of the axis (c).
[0027]
Referring to FIG. 4, an example of a load lock type vacuum chamber 200 is shown. Introduction and unloading of the substrate from the load chamber 701 partitioned by the gate valve 703 to the processing chamber 200 is performed using the transport jig 202. Exhaust devices 704 and 705 are provided in the load chamber and the processing chamber, respectively. Processing chamber 200Then, baking, getter formation (flash), and sealing are mainly performed, but a degassing operation that includes an electron gun and irradiates the face plate with electrons can also be included. A batch type may be used as the vacuum chamber.
[0028]
Referring to FIG.referenceThe schematic diagram of the image display apparatus which is an example of the image display apparatus 413 manufactured by the manufacturing apparatus of a form and which carried out the matrix arrangement | positioning (for example, 800 rows x 4000 columns) of the surface conduction type electron-emitting devices is shown. A plurality of surface conduction type electrons are connected to a matrix wiring formed of a lower wiring (X wiring) 406, an interlayer insulating layer 407, and an upper wiring (Y wiring) 408 on the rear plate 401 via element electrodes 404 and 405. The emission element is connected as an electron source 409 wired in a simple matrix. Reference numerals 410, 411, and 412 denote phosphors, metal backs, and evaporation type getter films formed on the face plate 201.
[0029]
The support frame 403 is previously attached to a predetermined position of the face plate 201 or the rear plate 401 with a glass frit or the like. A bonding member (for example, an alloy containing In or In) is placed on the substrate at a position corresponding to the support frame of the other plate. Both of these substrates are formed into a vacuum container by the following steps in the vacuum chamber. As an example, FIG. 6 shows a case where In 602 is applied on the Ag film 601 disposed on the peripheral edge of the face plate 201. FIG. 6A shows the face plate surface, and FIG. 6B shows its B-B ′ cross section.
[0030]
FIG. 7 schematically shows a state in which matrix wiring, element electrodes, and elements are connected. (A) is a top view, (b) shows the A-A 'cross section figure of the figure of (a). Here, 401 is a rear plate, 408 is a Y wiring or an upper wiring, 406 is an X wiring or a lower wiring, 409 is an electron source 409, 404, and 405 including an electron emitting portion 420, and 407 is an interlayer insulating layer. .
[0031]
Referring to FIG.referenceThe schematic diagram of the image display apparatus which is another example of the image display apparatus 413 manufactured by the manufacturing apparatus of a form and which has a matrix arrangement (for example, 800 rows × 4000 columns) of Spindt-type electron-emitting devices is shown. A cathode 504, an interlayer insulating film 505, a gate 506, and an emitter 507 are sequentially formed on the rear plate 401 to form an electron source portion. The cathode 504 and the gate 506 also serve as X and Y wirings, respectively, and can sequentially scan the elements as in the image display apparatus of FIG. In addition, a spacer 508 is provided so that the panel serving as a vacuum container is not crushed by atmospheric pressure.
[0032]
BookreferenceThe image display apparatus manufactured by the manufacturing apparatus according to the embodiment is not limited to the above example, and may be various image display apparatuses in which an image is formed by irradiation of electrons emitted from the electron-emitting device in a vacuum container.
[0033]
Referring to FIG.referenceCorresponding to the form,referenceIn the image manufacturing apparatus, the rear plate (electron source substrate) 401 on which the electron source section is formed and the face plate (image display substrate) on which the phosphor / metal back (anode electrode film) and the like are formed. ) 201 and the support frame 403 used as necessary are outlined in the vacuum chamber 200 by heat degassing (baking), getter formation, and sealing to form a vacuum container.
[0034]
First, in (a), the introduced face plate 201 and rear plate 401 are sandwiched between upper and lower hot plates 1003 and 1004, and degassing is performed by baking.
[0035]
Next, in (b), while the hot plates 1003 and 1004 are allowed to escape up and down, the rear plate 401 is also raised at the same time, leaving a space on the face plate 201. The lid-shaped jig 203 is moved to this space, and an electric current is supplied through the terminal 205, the contact electrode 204, and the feedthrough electrode 207 to form an evaporation type getter on the face plate 201.
[0036]
Thereafter, in (c), both substrates are sandwiched again with a hot plate, and a load is applied while heating the rear plate 401, to which the support frame 403 is previously attached, and the face plate 201 in which a bonding agent such as an In alloy is disposed at a predetermined position. Then, it is cooled to complete the sealing (vacuum containerization).
[0037]
Finally, in (d), the hot plate is again lifted up and down and carried out to the load chamber.
[0038]
BookreferenceIn form, in addition to the evaporative getter, a non-evaporable getter is activated in the vacuum chamber. The activation of the non-evaporable getter is easily performed by energization heating like the evaporative getter, and is connected to a current supply power source outside the chamber, and a necessary current is supplied at an appropriate timing for a predetermined time. Although the heating temperature and time of the non-evaporable getter vary depending on the material constituting the getter, the temperature is 450 ° C. to 900 ° C., and the time is about 10 minutes to 1 hour. However, the higher the temperature and the longer the time, the higher the effect.
[0039]
As described above, the energization heating activation of the non-evaporable getter is performed before or during the evaporative getter flash, and then the steps such as sealing, mounting, and aging are performed to form the image display device. For each image display apparatus, generally proposed methods and conditions are applied.
[0040]
Referring to FIG.1The internal structure of the lid-like jig 203 of the manufacturing apparatus of the embodiment is shown. A member 104 having a plurality of openings is disposed between the image display substrate (face plate) 201 and the evaporable getter container 101 disposed in the lid-shaped jig 203. FIG. 10 shows a schematic view of the state in which the lid-like jig 203 is arranged on the image display substrate 201 as seen from the lateral direction.
[0041]
Referring to FIG. 11, a schematic diagram of the member 104 having a plurality of openings 601 that is covered with the lid-like jig 203 and is seen when the inside of the lid-like jig 203 is viewed from the image display substrate (face plate) 201 side. It is shown.
[0042]
The manufacturing apparatus of this embodiment isreferenceThe difference is that a member 104 having a plurality of openings 601 is used instead of the non-evaporable getter of the manufacturing apparatus of the embodiment.
[0043]
  101Is a getter container filled with an evaporative getter, and 105 schematically shows the direction in which the getter agent flies when the evaporative getter is flushed. Getter container 101The getter material released from the light reaches the face plate 201 through the member 104 having a plurality of openings, adheres, and becomes a getter film. Other than the getter agent that passes through the opening, a lid-shaped jig2It adheres to the surface of the member 104 having an inner wall 03 and a plurality of openings. After the getter flush, the discharge gas rate of the processing chamber 200 is set to Q (Pa · m^Three/ Sec), exhaust equipmentSetSet the exhaust speed to S₀ (M ^Three/ Sec), the gas adsorption rate by the getter attached to the inner wall of the lid-shaped jig 203 is G₁ (m^Three/ Sec), the gas adsorption rate by the getter attached to the member 104 having a plurality of openings is G₂Then, the pressure P (Pa) of the processing chamber is P = Q / (S0 + G₁+ G₂). Therefore, the denominator G₂It is possible to reduce the pressure at the time of sealing by the amount of the gas adsorption rate.
[0044]
The member 104 having a plurality of openings is created by assembling a metal plate or a metal alloy plate in a lattice shape. The metal plate or metal alloy to be used may be anything as long as it can be used as a vacuum material, and can be appropriately selected from Fe, Ni, Cu, Al, Au, Mo, Ti, Zn, and the like, or alloys thereof. Furthermore, by embossing the surface of the metal plate or metal alloy plate, that is, by forming a metal plate or alloy plate with random or regular irregularities formed by a forming process such as press working or roll forming. , Getter surface area increases, gas adsorption rate G₂Will increase. Also, since the amount of adhesion per unit area of the getter film for obtaining the same gas adsorption rate is small, it is possible to suppress the increase of internal stress accompanying the increase in the amount of adhesion and to prevent the phenomenon of crack peeling of the adhesion film. And generation of particles can be suppressed. The surface processing of the metal plate or the alloy plate is not limited to embossing, and any method may be used as long as the same effect can be obtained. As another method, when the copper plate is used, the treated electrolytic copper plate (the matte surface of the electrolytic copper plate) Further, electrolytic treatment is further performed, and fine particles of copper or copper oxide are randomly deposited on the minute lump protrusions present on the mat surface), a metal spray plate, an electrolytic SUS plate, or the like is used as appropriate. be able to.
[0045]
Further, the member 104 having a plurality of openings can be achieved by forming a ceramic plate in a lattice shape. The ceramic plate to be used may be anything as long as it can be used as a vacuum material, and can be appropriately selected from steatite, forsterite, zircon magnetism, alumina ceramic, zirconia ceramic, beryllia ceramic, pyroceram, surbit, glass ceramic and the like.
[0046]
In addition, the manufacturing method corresponding to the manufacturing apparatus of the present embodiment, except that the non-evaporable getter is not heated by current,referenceIt is the same as that of the manufacturing method of a form.
[0047]
First of the present invention2The manufacturing apparatus of the embodiment isreferenceA non-evaporable getter 102 of the form,1This is an apparatus using a lid-like jig 203 including both the members 104 having a plurality of openings in the embodiment. Moreover, the manufacturing method corresponding to the manufacturing apparatus of this embodiment isreferenceIt is the same as that of the manufacturing method of a form.
[0048]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples.
[0049]
(referenceExample 1)
In the following, an image display device in which the surface conduction electron-emitting devices of FIG. 5 are arranged is manufactured.referenceCorresponding to the manufacturing method of the formreferenceAn example will be described.
[0050]
Step a₁(Formation of glass substrate and device electrode)
Glass substrate401 is sufficiently washed, and a film of titanium and platinum is formed thereon, and is patterned into a desired shape by a photolithography method to form device electrodes 404 and 405.
[0051]
Step b₁
The X wiring (lower wiring) 406 is formed in a line pattern so as to be in contact with one of the element electrodes 404 and to connect them. Silver paste ink is screen printed, dried, exposed to a predetermined pattern and developed. Thereafter, the wiring is formed by firing.
[0052]
Process c₁(Insulating film formation)
A pattern that covers the intersection of the Y wiring (upper wiring) 408 and the X wiring (lower wiring) 406 and opens a contact hole for electrical connection between the upper wiring (Y wiring) 408 and the element electrode 405 is used. A glass paste is screen printed and fired to form an interlayer insulating layer.
[0053]
Step d₁
On the insulating film 407, silver paste ink is screen printed / dried and baked to form a Y wiring (upper wiring) 408.
[0054]
Process e₁
Subsequently, a conductive thin film 409 is formed between the element electrodes by an ink jet coating method. As the coating solution, an organic palladium-containing solution was used. Then board401 is heated and fired to obtain palladium oxide (PdO).
[0055]
Process f₁
Next, in the surface conduction electron-emitting device, in a process called forming, the conductive thin film 409 is energized to cause cracks therein, thereby forming the electron emission portion 420. The end of the forming process is determined by measuring the element resistance, and the forming is ended when a resistance of 1000 times or more of the resistance before the forming process is shown.
[0056]
Process g₁(Activation-Carbon deposition)
A process called activation is performed on the element after forming. This treatment is performed by repeatedly applying a pulse voltage from the outside to the device electrode through the XY wiring in the same manner as in the above-described forming under an appropriate vacuum degree in which an organic compound exists. As a result, carbon or a carbon compound is deposited as a carbon film in the vicinity of the crack. In this step, tolunitrile is used as the organic compound. When the current flowing between the device electrodes reaches almost saturation, the energization is stopped and the activation process is terminated.
[0057]
Process h₁(Support frame pasting)
Next, a frit glass is applied to a predetermined position on the rear plate, the position is adjusted, and the support frame 403 is temporarily fixed to the face plate. Thereafter, firing is performed, and the support frame is attached to the rear plate.
[0058]
Step i₁(Spacer stand)
Install a spacer on the Y wiring.
[0059]
Process j₁(Face plate formation)
After sufficiently washing the glass substrate, the phosphor film 410 is applied by a printing method, and the surface is smoothed to form a phosphor portion. The fluorescent film 410 is a fluorescent film in which striped phosphors (R, G, B) and black conductive materials (black stripes) are alternately arranged. Further, a metal back 411 made of an Al thin film is formed on the fluorescent film 410 by a sputtering method.
[0060]
Process k₁(In coating)
As shown in FIG.201In 602 is applied on the Ag film 601 disposed on the peripheral edge of the substrate. FIG. 6A shows the face plate surface, and FIG. 6B shows its B-B ′ cross section.
[0061]
Process l₁(Baking)
A transfer jig 202 in which a face plate 201 and a rear plate 401 are set is put into a load chamber 701 of a vacuum chamber. 3 × 10 in the load room^-FiveThe vacuum was pulled to about Pa, the gate valve 703 was opened, and the transfer jig and the substrate were introduced into the vacuum processing chamber 200. Next, baking was performed by bringing the upper hot plate 1003 into close contact with the rear plate 401 and the lower hot plate 1004 into close contact with the face plate 201.
[0062]
Process m₁(Non-evaporable getter activation, getter flash)
Next, the plate-like non-evaporable getter 102 (ST707: manufactured by SAES) on the inner ceiling of the lid-like jig 203 for getter flash was activated. As shown in FIG. 2, the lid-like jig 203 is equipped with front and rear portions corresponding to the half of the face plate 201, so that both were activated simultaneously. Subsequently, the rear plate 401 and a part of the conveying jig that supports the rear plate 401 were raised together with the upper hot plate. Subsequently, one lid-like jig 203 was moved to the space between the rear plate and the face plate and brought into contact with the face plate 201. In this state, a barium film was deposited on the metal back 411 by sequentially passing a current through each of the five barium getter containers installed on the inner ceiling of the jig. After the five-pole flash was completed, the lid-shaped jig 203 was returned to the original position, and the same operation was performed on the other lid-shaped jig.
[0063]
Process n₁(Sealing)
After the lid-like jig 203 is returned to the original position, the rear plate 401 and the supporting jig, and the upper hot plate 1003 are lowered to the original position, and then the rear plate supporting jig is lowered little by little, between the rear and face plates. Overloaded. The hot plate is naturally cooled as it is, and waits until it reaches room temperature to complete the sealing.
[0064]
Process o₁(Implementation and systematization)
The vacuum container formed in the above process is flex-mounted and then assembled with a driver IC, a housing, etc. to complete the form of the image display device.
[0065]
(referenceExample 2)
In the following, an image display device using the Spindt type electron-emitting device of FIG. 8 is manufactured.referenceForm manufacturing methodreferenceAn example will be described.
[0066]
Step a₂(Cathode formation)
The glass substrate PD-200 having a thickness of 2.8 mm is sufficiently cleaned. A Mo film having a thickness of 0.25 μm is formed thereon by sputtering, and a cathode electrode 504 that also serves as X wiring is formed by ordinary photolithography.
[0067]
Step b₂(Insulating layer, gate formation)
On top of this, 1 μm thick SiO₂A film 505 was formed by a sputtering method, and subsequently Mo having a thickness of 0.25 μm was formed. Thereafter, Mo and SiO are formed by a normal photolithography method.₂A hole having a diameter of 1.5 μm is formed in the film, and a gate electrode 506 also serving as a Y wiring and an emitter formation hole are formed.
[0068]
Process c₂(Emitter formation)
Subsequently, 1.5 μm thick SiO₂A film is formed by sputtering, and 1.2 μm is etched back. Subsequently, a 1 μm thick W film was formed, and the remaining 0.3 μm SiO film was formed.₂After the film is lifted off, a cone-shaped emitter electrode 507 is formed.
[0069]
Step d₂(Support frame pasting)
referenceExample 1 step h₁And common.
Process e₁(Spacer stand)
referenceExample 1 step i₁And common.
[0070]
Process f₂(Face plate formation)
referenceStep j of Example 1₁And common.
[0071]
Process g₂(In coating)
referenceStep k of Example 1₁And common.
[0072]
Process h₂(Baking)
referenceStep 1 of Example 1₁And common.
[0073]
Step i₂(Non-evaporable getter activation, getter flash)
The rear plate 401 and a part of the conveying jig that supports the rear plate 401 were raised together with the upper hot plate. Subsequently, one lid-like jig 203 was moved to the space between the rear and face plates and brought into contact with the face plate 201. nextreferenceAs in Example 1, the barium getters are flushed half by one. At this time, a plate-shaped non-evaporable getter 102 (ST122: manufactured by SAES) previously installed on the inner ceiling of the lid-like jig is simultaneously used. Activation was performed. In the barium getter, a current was sequentially supplied to each of the five electrodes, and during that time, the heating for activating the non-evaporable getter was maintained.
[0074]
Process j₂(Sealing)
referenceStep n of Example 1₁And common.
[0075]
Process k₂(Implementation and systematization)
referenceStep o of Example 1₁And common.
[0076]
(referenceComparative Example 1)
Process A₁~ L₁
referenceStep a of Example 1₁~ L₁And common.
Process M₁(Getter Flash)
Except for the (installation) activation of non-evaporable getters,referenceProcess m of example 1₁And common.
[0077]
Process N₁, O₁
referenceStep n of Example 1₁, O₁And common.
[0078]
As abovereferenceAn image display device as Comparative Example 1 was prepared.
[0079]
(referenceComparative Example 2)
Process A₂~ H₂
referenceStep a of Example 2₂~ H₂And common.
[0080]
Process I₂(Getter Flash)
Except for the (installation) activation of non-evaporable getters,referenceStep i of Example 2₂And common.
[0081]
Process J₂, K₂
referenceStep j of Example 2₂, K₂And common.
[0082]
As abovereferenceAn image display device as Comparative Example 2 was prepared.
[0083]
referenceExamples 1 and 2referenceIn the manufacturing process of the image display device manufactured in Comparative Examples 1 and 2, the gas partial pressure increase due to the released gas during the getter flash was compared.referenceIn Example 1, H₂O, O₂, CO₂The partial pressure ofreferenceCompared to Comparative Example 1, the maximum was reduced to about ½. furtherreferenceIn Example 2, not only the above gas but also CH_FourThe partial pressure ofreferenceCompared to Comparative Example 2, it was reduced by one digit or more. This results in a bookReference exampleIt has been confirmed that the manufacturing apparatus according to the above has an effect of reducing the emission gas during the getter flash. The image display device made by the manufacturing process of the present invention isreferenceCompared with the image display device made as a comparative example, the luminance instability was greatly improved.
[0084]
(Example1)
referenceAn image display device was prepared in the same manner as in Example 1, but in this example, the process m₁The member 104 having a plurality of openings was disposed in the lid-shaped jig without disposing the non-evaporable getter. As a result, vertical and nearly vertical Ba vapor deposition particles passed through the opening, and the other Ba vapor deposition particles adhered to the metal member having a plurality of openings. The member 104 having a plurality of openings was formed by embossing a SUS plate with a thickness of 2 mm and a height of 2 mm, and then assembling it into a lattice pattern at a pitch of 2 mm. Other than thisreferenceAn image display device was prepared in the same manner as in Example 1.
[0085]
When the getter film 412 surface of the face plate 201 was observed after the getter flash operation, no particles were generated. Further, when the change in gas partial pressure was observed with a mass spectrometer (not shown) installed in the processing chamber 200 after the getter flash,referenceAs a comparative example, it was reduced to less than half compared with the case without the member 104 having a plurality of openings. The pressure at the time of sealing isreferenceAs a comparative example, it was less than half compared with the case without the member 104 having a plurality of openings.
[0086]
An image signal of 167 μsec, 60 Hz, 15 V is supplied from the voltage application device connected to the image display device formed according to this embodiment to the electron-emitting device, and at the same time, a high voltage of 10 kV is applied by the high-voltage application device, and surface conduction electron emission is performed. The element 420 was caused to emit light, and the image display device 413 was displayed as an image.
[0087]
The discharge during the image display never occurred, and the image display device was continuously displayed for life evaluation, and the time until the luminance was reduced to half was measured. As a comparative example, the member 104 having a plurality of openings was used. Compared with an image display device using Ba getter vapor deposition without using, the discharge frequency was reduced and the life was improved by about 20%.
[0088]
(Example2)
In this example,FIG.Example using a Spindt-type electron-emitting device as an electron source as shown in FIG.1In a lid-shaped jig in which members having a plurality of openings shown in FIG.referenceExample except that non-evaporable getter having the configuration shown in Example 1 was included1An image display device was produced in the same manner as described above. For procedures such as activation of non-evaporable gettersreferencePerformed as in Example 1.
[0089]
In the image display apparatus of this embodiment, the rear plate 401 isreferenceUsing the same one as in Example 1, a Spindt-type electron-emitting device is formed on the rear plate 401. Mo is used as the cathode electrode 504 and the gate electrode 506, the tip angle of the field emission portion 507 is 45 degrees, the electron source corresponding to one pixel has 100 electron emission portions 507, and the insulating layer 505 has a thickness of 1 μm. SiO₂Was used.
[0090]
Ba getter deposition is performed using a lid-like jig 203 in which a metal member 104 having a plurality of openings and a non-evaporable getter 102 are arranged.referenceAn image display device was prepared in exactly the same manner as in Example 1. When the surface of the face plate 201 on the getter film 412 was observed after Ba getter deposition, no particles were generated. The gas partial pressure after getter flush is alsoreferenceThe partial pressure was the same as in Example 1. Next, after assembling the image display device, the embodiment1When the image was displayed in the same manner as in Example1As with the above, good characteristics could be obtained.
[0091]
【The invention's effect】
As described above, according to the present invention, there is no generation of particles at the time of getter vapor deposition, the pressure at the time of sealing can be further reduced, and a long-life image display device that does not generate discharge at the time of image display. There is an effect that it can be produced.
[Brief description of the drawings]
[Figure 1]referenceIt is a figure which shows the internal structure of the lid-shaped jig | tool 203 of the manufacturing apparatus of a form.
FIG. 2 shows a state in which a terminal 205 of an evaporable getter container 101 and a terminal 208 of a non-evaporable getter 102 are connected in a vacuum chamber 200, and an image display substrate (face plate) 201 is introduced by a conveying jig 202. (A) is a cross-sectional view, and (b) is a top view.
FIGS. 3A and 3B are diagrams showing three examples of a moving method of the lid-like jig 203 used in the manufacturing apparatus of the present invention. FIGS.
FIG. 4 is a view showing an example of a load lock type vacuum chamber.
FIG. 5 is a schematic view of an image display device in which surface conduction electron-emitting devices are arranged in a matrix.
6 is a view showing a state in which In602 is applied on an Ag film 601 disposed on the peripheral edge of the face plate 201 in order to fix the support frame 403. FIG.
FIG. 7 is a diagram schematically showing a state where matrix wiring, element electrodes, and elements are connected to a face plate.
FIG. 8 is a schematic diagram of an image display device in which Spindt-type electron-emitting devices are arranged in a matrix.
FIG. 9 shows that a face plate (image display substrate) 201 and a support frame 403 used as necessary are made into a vacuum container by heating degassing (baking), getter formation, and sealing in a vacuum chamber 200. It is a figure which shows the outline | summary of operation.
FIG. 10 shows the first of the present invention.1It is a figure which shows the internal structure of the lid-shaped jig | tool 203 of the manufacturing apparatus of embodiment.
FIG. 11 is a schematic diagram of a member 104 having a plurality of openings 601 that is covered with the lid-like jig 203 and seen when the inside of the lid-like jig 203 is viewed from the image display substrate (face plate) 201 side. .
FIG. 12 is a diagram showing an internal configuration of a lid-like jig 203 of a conventional manufacturing apparatus.
13 shows a state in which the terminal 205 of the evaporable getter container 101 and the terminal 208 of the non-evaporable getter 102 are connected and the image display substrate (face plate) 201 is introduced by the conveying jig 202 in the prior art. FIG. 2 is a schematic diagram ((a) is a cross-sectional view, and (b) is a top view).
[Explanation of symbols]
101 Evaporable getter container
102 Non-evaporable getter
203 Lid
205 terminals
208 terminals
200 Vacuum chamber (processing room)
201 Image display board (face plate)
202 Transfer jig
204 Wiring
209 Wiring
206 Contact electrode
210 Contact electrode
207 Feedthrough electrode
211 Feedthrough electrode
301 rails
302 prop
303 horizontal axis
701 Road room
703 Gate valve
704 Exhaust device
705 Exhaust device
401 Rear plate
403 Support frame
404 Device electrode
405 Element electrode
406 Lower wiring (X wiring)
407 Interlayer insulation layer
408 Upper wiring (Y wiring)
409 electron source
410 phosphor
411 metal back
412 Evaporative getter
413 Image display device
601 Ag film
602 In
420 Electron emission part
504 cathode
505 Interlayer insulator
506 gate
507 emitter
508 Spacer
1003 Hot plate
1004 Hot plate
104 Member having a plurality of openings
105 Direction of flight of getter agent
601 opening

Claims (6)

By covering at least a part of the image display substrate having the phosphor film and the anode electrode with a lid-shaped jig in a reduced-pressure chamber, and flashing the evaporation getter disposed inside the lid-shaped jig, Forming a getter film on the image display substrate;
Sealing an electron source substrate in which a plurality of electron-emitting devices are arranged and the image display substrate on which the getter film is formed in the chamber in which the getter film is formed; and
I have a,
The flash, between the image display substrate and the evaporable getter, that having a a portion other part of the plurality of openings and said getter material passing a portion of the flushed getter agent adheres portion the timber Ru done while located away from the image display substrate, a method of manufacturing an image display device. Before pre Symbol flash to have a step of performing a non-evaporable getter activation is disposed in the lid-like jig, manufacturing method of an image display apparatus according to claim 1.   The method of manufacturing an image display device according to claim 2, wherein the non-evaporable getter is energized and heated during the flash.   The method for manufacturing an image display device according to claim 1, wherein the member is made of a metal or a metal alloy. The method for manufacturing an image display device according to claim 4, wherein a surface of the member is embossed. The method for manufacturing an image display device according to claim 1, wherein the member is made of ceramic.

Images