JP3864467B2 - Manufacturing method of electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a surface mount type electronic component .
[0002]
[Prior art]
Conventionally, as shown in FIGS . 11 and 12, a method for forming an end face external electrode of a surface-mount type electronic component is as follows. after the form of the divided bar-shaped pieces 27b, a conductive paste 28 such as by transcription by dipping or roller 29 is applied to the exposed end faces made by dividing was to form external electrodes.
[0003]
[Problems to be solved by the invention]
However, in the structure and manufacturing method as in the above-described conventional example, when forming the external electrode, for example, a large plate in which a plurality of electronic component bodies are integrated, such as a chip resistor, is divided once to separate the electronic components into pieces There is a problem that the productivity is poor because the processing is performed with the 27a or the bar-shaped pieces 27b.
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to easily form an end face external electrode of a surface-mount type electronic component while maintaining a large plate, thereby improving productivity.
[0005]
[Means for Solving the Problems]
And in order to achieve this object, the present invention provides a step of providing a notch in a portion corresponding to both ends of the electronic component main body as each piece of a large plate in which a plurality of electronic component main bodies are integrated, A step of printing and forming a conductive paste film on the bottom part of the electronic component that is continuous with the notch, and a step of cutting by half dicing into the conductive paste film formed on the notch, Manufacturing an electronic component comprising a step of forming a solder film on the surface of the conductive paste film and an end surface formed by the notch, and a step of dividing the notch formed in the large plate into individual electronic component bodies Is the method.
[0006]
According to the present invention, it is possible to obtain a surface-mount type electronic component that can be easily formed with an end face external electrode being a large plate.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, there is provided a step of providing a notch in a portion corresponding to both ends of the electronic component main body that is each piece of a large plate in which a plurality of electronic component main bodies are integrated, A step of printing and forming a conductive paste film on the bottom part of the electronic component that is continuous with the notch, and a step of cutting by half dicing into the conductive paste film formed on the notch, Manufacturing an electronic component comprising a step of forming a solder film on the surface of the conductive paste film and an end surface formed by the notch, and a step of dividing the notch formed in the large plate into individual electronic component bodies It is a method, and it becomes possible to form the end surface external electrodes of a plurality of electronic component bodies integrated on a large plate by batch processing without dividing, and has an effect of improving productivity.
[0008]
The invention described in claim 2 is the method of manufacturing an electronic component according to claim 1 , wherein the notch is formed by half dicing with a V-shaped blade, and has an effect of easily forming the notch.
[0009]
Invention of Claim 3 is a manufacturing method of the electronic component of Claim 1 which formed the resist on the surface of the large board, and formed the notch by sandblasting, The effect | action that a notch can be easily formed by sandblasting Have
[0010]
The invention described in claim 4 is the method of manufacturing the electronic component according to claim 3 in which the notch has a long hole shape, and has an effect of coating and forming the conductive paste film without blurring.
[0011]
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0012]
(Embodiment 1)
FIG. 1 shows the structure of a crystal resonator. In FIG. 1, reference numeral 1 denotes a diaphragm, which is a quartz plate having a thickness of 100 μm. Covers 2 and 3 made of a quartz plate having a thickness of 400 μm are directly bonded to the front and back surfaces of the diaphragm 1. In addition, 4 and 5 in this FIG. 1 are external electrodes and are arrange | positioned at the both end parts of the back surface of the cover 3, and the end surface part continuous with it. As shown in FIGS. 2 and 3, the diaphragm 1 is formed with a U-shaped kerf 6 inside thereof, thereby forming a tongue-like vibrating portion 7.
[0013]
Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibration part 7, and the lead electrodes 11 and 12 are drawn out through the root part 10 of the vibration part 7. As shown in FIGS. 2 and 3, the end portion of the inner lead electrode 11 penetrates the diaphragm 1 through the through hole 13, and then passes through the side of the vibrating portion 7 as shown in FIG. The connecting portion 14 is formed extending to the opposite side. The lead electrode 12 forms a connection portion 15 on the base portion 10 side.
[0014]
Then, they are connected to the external electrodes 4 and 5 through the conductors 18 in the through holes 16 and 17 formed in the cover 3 corresponding to these connection portions 14 and 15, respectively.
[0015]
The covers 2 and 3 sandwich the front and back outer peripheries of the diaphragm 1 at their outer peripheries and are directly joined to each other, but they are joined at the outer peripheries of the kerfs 6 of the diaphragm 1. The portion where the lead electrode 11 passes through the side of the vibrating portion 7 is joined to the cover 3 on the outer side.
[0016]
Then, in order to form the lead electrode 11 on the back surface side of the diaphragm 1 in this way, the diaphragm 1 is sandwiched between the covers 2 and 3 as is apparent from FIGS. Only the portion is thickened, and the portions where the vibrating portion 7 and the lead electrodes 11 and 12 are formed are thinned by etching.
[0017]
Since the lead electrode 11 is provided on the side of the vibration part 7 as shown in FIG. 3, the vibration part 7 is naturally displaced in one direction from the central part of the vibration plate 1. In addition, the cut of the kerf 6 in the root portion 10 has a semicircular shape, which makes it difficult for cracks to occur even when an excessive impact is applied.
[0018]
Then, the external electrode of the electronic component obtained by this Embodiment is demonstrated.
[0019]
FIG. 4 shows the external electrode structure and the mounting state on the printed circuit board. A notch 19 inclined upward is provided at both ends of the bottom surface of the case 3, and a conductive paste film 20 (for example, conductive material such as silver-coated powder) is provided on the surface of the notch 19 and both ends of the bottom surface of the case 3 that are continuous with the notch 19. A film formed by applying a conductive paste obtained by kneading a curable resin to a conductive metal powder). Furthermore, a solder film 21 is formed on the conductive paste film 20 in order to improve solder wettability. As described above, the conductive paste film 20 and the solder film 21 constitute the external electrodes 4 and 5. Reference numeral 22 denotes mounting solder, and 23 denotes a printed board.
[0020]
Here, when the crystal oscillator is reflowed implemented using mounting solder 22 to the printed circuit board 23, serve as external electrodes end faces an external electrode formed on the notch 19 as shown in FIG. 4, the mounting solder 22 Wet and form a fillet. The depth of the notch 19 is desirably at least 0.15 mm from the viewpoint of the appearance inspection of the fillet.
[0021]
In this embodiment, the case of two terminals is illustrated, but the present invention can also be applied to the case of multiple terminals such as four terminals.
[0022]
Next, a method for manufacturing a crystal resonator having the end face external electrode will be described.
[0023]
FIG. 5 shows an external electrode formation flow of the crystal unit shown in FIGS. As a processing mode, the processing is performed in a wafer configuration (for example, a quartz wafer having a size of about 50 mm square) in which a plurality of crystal resonators as shown in FIG. Reference numerals 24 and 25 denote cutting lines used when singulated.
[0024]
First, in order to provide the end face external electrode on the surface of the case 3, the notch 19 is formed along the cutting line 24 parallel to the X axis in FIG.
[0025]
As a method, a V-shaped notch 19 as shown in FIG. 7 is formed by half dicing using a V-shaped blade. Alternatively, as shown in FIG. 8, the portion other than the portion where the notch 19 is to be provided is protected with a resist 26 and processed by sandblasting. In this case, the shape of the notch 19 is an inclined surface having a slight curvature. Here, the depth of the notch 19 to be formed, it is desirable that at least 0.15mm or more for the reasons mentioned above.
[0026]
Next, a conductive paste (for example, a conductive paste obtained by kneading a curable resin in a conductive metal powder such as a silver-coated conductive powder) is applied to the surface of the case 3 and the inclined surface of the notch 19 by printing or the like, and is cured. The Here, in particular, when the notch 19 is formed by sandblasting, the conductive paste is notched 19 when printing is applied, as long as it has an independent long hole shape corresponding to each external electrode terminal as shown in FIG. It is possible to maintain the shape without bleeding inside.
[0027]
Next, as shown in FIG. 10, the conductive paste film 20 is cut by half dicing. Here, when the conductive paste is filled up to the notch 19 by printing and a uniform film thickness cannot be formed along the inclined surface of the notch 19, the surface exposed by this notch functions as an end face external electrode. Further, when the conductive paste film 20 is exposed and affected by oxidation or the like, it is possible to completely coat with the solder film 21 by using this construction method, and oxidation can be prevented.
[0028]
Next, a solder film 21 is formed on the conductive paste film 20. As a method, it is formed by applying plating, solder dip, or cream solder by printing or the like, followed by heat precipitation.
[0029]
Finally, singulation is performed along the cutting lines 24 and 25 by dicing or breaking. In particular, when dicing into individual pieces, a blade thinner than the blade thickness at the time of half dicing is used to prevent the removal of the solder film 21 formed on the end surface formed by cutting the conductive paste film 20 by half dicing. use.
[0030]
【The invention's effect】
As described above, according to the present invention, it is possible to form the end surface external electrodes of a plurality of electronic component bodies integrated on a large plate by batch processing without dividing, and there is an advantageous effect that productivity is improved. can get.
[Brief description of the drawings]
1 is a perspective view of a vibrator according to an embodiment of the present invention. FIG. 2 is an exploded perspective view for explaining a surface state of the diaphragm of FIG. 1. FIG. 3 is a back surface state of the diaphragm of FIG. FIG. 4 is an exploded perspective view for explaining. FIG. 4 is a structural diagram of a vibrator external electrode according to an embodiment of the present invention. FIG. 5 is a manufacturing process flow diagram according to an embodiment of the present invention. FIG. 7 is a sectional view of a notch according to an embodiment of the present invention. FIG. 8 is a sectional view of a notch according to an embodiment of the present invention. FIG. 10 is a sectional view of a notch according to an embodiment of the present invention. FIG. 11 is a schematic view showing a conventional method of manufacturing an end face external electrode. FIG. Schematic diagram showing the manufacturing method [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Diaphragm 2 Cover 3 Cover 4 External electrode 5 External electrode 6 U-shaped groove 7 Vibration part 8,9 Excitation electrode 10 Root part 11 Lead electrode 12 Lead electrode 14 Connection part 15 Connection part 16 Through-hole 17 Through-hole DESCRIPTION OF SYMBOLS 18 Conductor 19 Notch 20 Conductive paste film 21 Solder film 22 Solder for mounting 23 Printed circuit board 24 Cutting line 25 Cutting line 26 Resist 27a Piece 27b Bar-shaped piece 28 Conductive paste 29 Roller

Claims (4)

A step of providing a notch in a portion corresponding to both ends of the electronic component main body which is each piece of a large plate in which a plurality of electronic component main bodies are integrated, and a bottom of the electronic component bottom portion of the individual piece continuous with the notch A step of printing and forming a conductive paste film thereon, a step of making a cut by half dicing in the conductive paste film formed on the notch, and a surface of the conductive paste film and the cut A method of manufacturing an electronic component, comprising: forming a solder film on the end face that has been formed; and dividing the cutout formed in the large plate into individual electronic component bodies. 2. The method of manufacturing an electronic component according to claim 1, wherein the notch is formed by half dicing with a V-shaped blade. The method of manufacturing an electronic component according to claim 1 , wherein a resist is formed on the surface of the large plate and a notch is formed by sandblasting. The method for manufacturing an electronic component according to claim 3, wherein the notch has a long hole shape.

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