JP3839337B2 - Non-contact type IC media and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type IC medium that exchanges information in a non-contact manner and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, a technology related to a non-contact type IC medium (non-contact type IC card or the like) called RF-ID (Radio Frequency Identification) has been rapidly advanced, and its use is also various. Such non-contact type IC media are desired to be reduced in cost, but on the other hand, it is necessary to have excellent durability depending on the use environment.
[0003]
Conventionally, a non-contact type IC medium is manufactured by forming a coiled antenna on a base material by a printing process or the like, and mounting IC modules (including a single IC bare chip) on both ends of the antenna. In order to improve the sensitivity of data exchange with the outside, it is desirable that the area of the antenna portion be as large as possible. Therefore, since it is necessary to form a short-circuit line that guides one of the land portions on which the IC module is mounted by avoiding the antenna portion, an insulating member is interposed between the antenna portion and the short-circuit line. That is, the conventional non-contact type IC media is manufactured by forming an antenna, forming an insulating member at a predetermined portion, further forming a short-circuit line on the insulating member, and mounting an IC module. .
[0004]
[Problems to be solved by the invention]
In the production of the conventional non-contact type IC media as described above, since the steps of heating and pressure application are included, it is necessary that the base material and conductive ink used can withstand the heating and pressure, There is a problem of incurring high costs. In addition, when used in an air bag gauge IC tag used as an air baggage tag, for example, an environment for using the produced non-contact IC media, physical and mechanical stress may be applied. There is a problem that the function may be impaired.
[0005]
Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a non-contact type IC medium and a method for manufacturing the same that reduce costs and improve durability.
[0006]
[Means for Solving the Problems]
  In order to solve the above-mentioned problem, the invention of claim 1 includes an RF-ID module in which an antenna portion is formed and an IC module is mounted.When used, it will be loopedNon-contact type IC media, information related to information stored in the IC module is printed by a predetermined printing meansSingle sheetThe information display sheet, and the information display sheet and the adhesive are laminated.Single sheet, difficult to penetrate moistureInterposed between the base sheet, the information display sheet and the base sheet, at least the antenna sectionOn the plane of a release function sheet coated with a release resinFormed on the information display sheet or substrate sheetSaidA transfer RF-ID module that constitutes the RF-ID module by being transferred with an adhesive.
[0007]
  Claim 2~ 4In the invention of“The non-contact type IC medium according to claim 1, wherein the substrate sheet difficult to transmit moisture is impregnated with a resin varnish”.
  "The release sheet is provided via the adhesive on the back surface of the information display sheet side of the base sheet",
  “The information stored in the IC module and printed on the information display sheet is at least information on parcel delivery”.
[0008]
  Claim5The invention includes an RF-ID module in which an antenna portion is formed, the antenna portion is formed, and an IC module is mounted.When used, it will be loopedNon-contact type IC media manufacturing method, in which a formed object is detachableRemovable resin was coatedPeeling function sheetPlaneAbove, the step of forming the antenna portion with the conductive ink, the step of forming the RF-ID module by mounting the IC module on the antenna portion, and an adhesive on at least one surface AppliedMoisture permeation is difficult with a single sheetA base sheet or an adhesive that prints information related to information stored in the IC module by a predetermined printing means was applied.Single sheetInformation display sheetComposed ofA step of attaching the RF-ID module to a transfer sheet with the adhesive to separate the RF-ID module from the release function sheet, and transferring the RF-ID module to the transfer sheet on the transfer sheet side. And the information display sheet when the transfer sheet is the base sheet, or the step of adhering the base sheet when the transfer sheet is the information display sheet.
[0009]
  Claim6The invention includes an RF-ID module in which an antenna portion is formed, the antenna portion is formed, and an IC module is mounted.When used, it will be loopedNon-contact type IC media manufacturing method, in which a formed object is detachableRemovable resin was coatedPeeling function sheetPlaneOn top, the step of forming the antenna portion with the conductive ink, and the adhesive was applied to at least one surfaceMoisture permeation is difficult with a single sheetA base sheet or an adhesive that prints information related to information stored in the IC module by a predetermined printing means was applied.Single sheetInformation display sheetComposed ofThe step of causing the antenna portion to adhere to the transfer sheet with the adhesive to be peeled off and transferred from the release function sheet, and the IC module being mounted on the transferred antenna portion on the transfer sheet And the step of forming the RF-ID module, on the transfer sheet, on the side where the RF-ID module is transferred, and when the transfer sheet is the base sheet, the information display sheet, Alternatively, when the transfer sheet is the information display sheet, the substrate sheet is adhered.
[0010]
  Claim7,8In the invention, "the base sheet is configured such that a release sheet is further bonded to the back surface of the surface coated with the pressure-sensitive adhesive via a pressure-sensitive adhesive"
  “The information stored in the IC module and printed on the information display sheet is at least information on parcel delivery”.
[0011]
  In this way, the antenna unit and the IC module are provided.Non-contact IC media that is in a loop shape when used, and is formed on the plane of a release functional sheet coated with a release resin.The transfer RF-ID moduleSingle sheetInformation display sheet andMoisture permeation is difficult with a single sheetBetween base sheetBy transcription to any ofIntervene. That is, at least the information display sheet and the base sheet can increase the strength against physical and mechanical stress and improve the durability. Moreover, at least an antenna part is formed on a peeling function sheet | seat, and it produces by making it transfer to a transfer sheet. That is, since the heating and pressure application steps in the manufacturing process are performed on the release function sheet, the substrate to be used does not need to consider heating and pressure, and the cost can be reduced.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a case where the present invention is applied to a non-contact type IC tag as a non-contact type IC medium is shown. However, the present invention is not limited to this, and a card having an IC module capable of storing and erasing data by non-contact data exchange It can also be applied to labels, forms, postcards and envelopes.
[0013]
FIG. 1 shows a configuration diagram of a non-contact type IC medium according to the present invention. FIG. 1A is a longitudinal sectional view of a non-contact type IC medium as a non-contact type IC tag as an example, and FIG. 1B is a configuration diagram of an RF-ID module to be mounted. In FIG. 1A, a non-contact type IC medium 11 is configured by laminating a heat sensitive sheet 12, which is an information display sheet, an RF-ID module 13, a double-sided adhesive sheet 14, and a release sheet 15. In the double-sided pressure-sensitive adhesive sheet 14, the pressure-sensitive adhesives 22 and 23 are applied to both surfaces of the base material sheet 21, and the RF-ID module 13 is bonded to the pressure-sensitive adhesive 22 and is interposed between the heat-sensitive sheet 12. It is said.
[0014]
Moreover, it is the base material sheet 21 in the double-sided adhesive sheet 14, Comprising: The peeling sheet 15 is stuck and provided in the back surface of the surface at the side of the heat sensitive sheet 12 via the adhesive 23. The form in which the release sheet 15 is provided on the double-sided pressure-sensitive adhesive sheet 14 is a transfer sheet described later. In addition, as a case where a single-sided adhesive sheet is used, when a peeling sheet is provided later via an adhesive, the single-sided adhesive sheet becomes a transfer sheet described later.
[0015]
The thermal sheet 12 is a sheet on which information related to information stored in an IC module, which will be described later, is printed by a thermal printing means, and a thermal coloring layer is formed on a substrate such as paper or a resin film. . In addition to the heat-sensitive sheet 12, it is possible to use paper, film, or the like as the information display sheet. In this case, information printing may be performed by, for example, an ink jet printer as a printing unit.
[0016]
The substrate sheet 21 in the double-sided pressure-sensitive adhesive sheet 14 is, for example, a resin substrate such as polyester, a nonwoven fabric, a woven fabric formed of various inorganic or organic fibers (glass fiber, alumina fiber, polyester fiber, polyamide fiber, etc.), It is formed of a sheet of paper, a combination of these, or a composite base material formed by impregnating these sheets with a resin varnish. The durability of the entire medium can be improved by using the base sheet 21 as a material that is particularly difficult to transmit moisture. As the pressure-sensitive adhesives 22 and 23, known pressure-sensitive adhesives are sufficient, and those that are bonded when they are in the final product form are used.
[0017]
As the release sheet 15, paper is the most economically preferable as a sheet base material, but a polyester film such as polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate, or a known resin film is used. Since these are adhered to the adhesive 23 of the base material sheet 21 of the double-sided adhesive sheet 14, it is easy to peel off later, and the surface such as a silicone agent is used so as not to interfere with the formation of the RF-ID module 14. A release agent is applied.
[0018]
As shown in FIG. 1B, the RF-ID module 13 has an antenna portion 31 formed of conductive ink and an IC module 32 mounted thereon. The antenna part 31 is an antenna pattern wound by a predetermined number of turns in a planar coil shape as an example, and both ends thereof become land parts 31A and 31B. An insulating layer 33 is formed on the antenna pattern inward from the land portion 31A, and a short-circuit line 34 is formed from the land portion 31A via the insulating layer 33. An end portion of the short-circuit line 34 becomes a land portion 35.
[0019]
That is, the antenna portion 31 is configured by the antenna pattern (including the land portions 31A and 31B), the insulating layer 33, the short-circuit line 34, and the land portion 35. The antenna pattern is appropriately designed according to the use form as an IC module to be used or a non-contact IC medium, and the distance between the land portions 31A and 31B matches the distance between terminals of the IC module 32, The insulating layer 33 and the short-circuit line 34 (land portion 35) can be omitted depending on a designed pattern such as a case of only one round.
[0020]
The antenna part 31 is formed with the antenna pattern, the short-circuit line 34 and the land part 35 by using, for example, screen printing using conductive ink, and insulated by using, for example, the same screen printing as described above using an insulating member (insulating ink). An agent layer 33 is formed. This conductive ink is solidified by heat, infrared rays, ultraviolet rays, electron beams, etc. after printing. For example, Asahi Chemical Research Laboratory LS-411AW (trade name), Fujikura Kasei FA-353 (trade name), Toyobo DWP-026 (trade name) can be used. The insulating layer 33 may be formed by attaching an insulating film, paper, or insulating tape on the corresponding antenna pattern.
[0021]
The IC module (configuration is shown in FIG. 7) 32 is mounted between the land portion 31B and the land portion 35 by being electrically connected at least in a close contact state. As a method for bringing it into close contact, there is a method in which an anisotropic conductive film, anisotropic conductive paste, insulating resin, double-sided adhesive tape, or the like is interposed between the lands 31B and 35 and the terminals of the IC module 32. As a method for applying these, there are a dispensing method, a printing method, a spraying method, and the like, but when an anisotropic conductive paste or an insulating resin is used, it is preferably applied by a dispensing method.
[0022]
On the other hand, bumps formed by metal electrolytic plating, studs, electroless metal plating, fixing of conductive resin, or the like are formed on the connection terminal portion of the IC module 32 as necessary. When mounting the IC module 32, a necessary pressure may be applied, or when mounting with an adhesive tape, energy such as heat, light, electromagnetic waves, or ultrasonic waves may be applied depending on the material. Good. Further, post-curing may be performed in order to sufficiently fix the bonded portion after mounting. In order to protect the mounted IC module 32, the whole or a part of the mounting part may be covered and protected with a glove top material or an underfill material.
[0023]
FIG. 2 shows a conceptual diagram of manufacturing the non-contact type IC media of FIG. FIG. 2 shows a non-contact IC media manufacturing system 41, and the peeling function sheet 42 is conveyed, for example, endlessly. The release function sheet 42 is obtained by coating a resin film or a nonwoven fabric with a release member such as a fluororesin base material, a fluororesin, or silicone, a nonwoven fabric, various inorganic or organic fibers (glass fiber, alumina fiber, polyester). Fibers, polyamide fibers, etc.) formed by coating a peelable resin on a woven fabric, paper, or a combination sheet of these may be used as appropriate. Considering that the electrical conductivity can be improved by treating the antenna part 31 of the RF-ID module 13 at a high temperature, the sheet base material of the release function sheet 42 is made of a heat-resistant fluororesin base material, a silicone-coated polyimide base. It is desirable to use a material, a fluororesin-containing glass cloth. The peeling function sheet 42 can form a new antenna portion 31 again after the transfer, which contributes to cost reduction.
[0024]
Above the conveyed release function sheet 42, in the order of conveyance, conductive ink printing means 43, solidifying means (here, heating) 44, insulating ink printing means 45, solidifying means (here, heating). ) 46, conductive ink printing means 47, and solidifying means (here, heating) 48 are disposed. The conductive ink printing means 43 is for forming the antenna pattern by printing with the conductive ink, and the solidifying means 44 is for heating and solidifying the printed antenna pattern.
[0025]
The insulating ink printing means 45 is for forming the insulating layer 33 on the predetermined portion of the antenna pattern by printing with the insulating ink, and the solidifying means 46 forms the printed insulating layer 33. It is for heating and solidifying. Further, the conductive ink printing means 47 is for forming a short-circuit line 34 (land portion 35) on the insulating layer 33 by printing with the conductive ink, and the solidifying means 48 is a printed short-circuit. This is for heating and solidifying the line 34 (land portion 35).
[0026]
Further, an IC module mounting means 49 is disposed above the peeled functional sheet 42 to be conveyed and behind the solidifying means 48 in the conveying direction. The IC module mounting means 49 corresponds to the mounting method of the IC module 32. For example, when the connection terminal is a bump, the IC module 32 is connected to the land portion 31B of the antenna portion 31 and the short-circuit line 34. Mounting is performed by pressing on the land portion 35 and making electrical connection. As described above, when the protective film is formed on the RF-ID module 13 on which the IC module 32 is mounted, the protective film material printing means and the solidifying means are further provided at the subsequent stage of the IC module mounting means 49. Arranged appropriately.
[0027]
On the other hand, a continuous body of the transfer sheet (double-sided pressure-sensitive adhesive sheet 14 and release sheet 15) is supplied from the transfer sheet continuous body supply unit 50 so as to overlap at an end portion in the transport direction of the transport function sheet 42 to be transported. Thus, after the transfer of the RF-ID module 13, the continuous body of the thermal sheet 12 is supplied from the thermal sheet continuous body supply unit 51 so as to overlap the transfer side. The continuous body of the non-contact type IC media 11 to which the heat-sensitive sheet 12 is laminated and adhered is wound and stored by the non-contact type IC media continuous body storage unit 52.
[0028]
FIG. 3 shows a flowchart of manufacturing the non-contact type IC media shown in FIG. 1, and FIGS. 4 and 5 are explanatory diagrams of each stage in manufacturing the non-contact type IC media shown in FIG. 4 and 5 are shown as a single body or a part thereof. In FIG. 3, first, an antenna pattern (a part of the antenna portion 31 as shown in FIG. 4 (B) is formed on the release function sheet 42 shown in FIG. 4 (A) by the conductive ink printing means 43. The land portions 31A and 31B) are printed and solidified by the solidifying means 44 (step (S) 1).
[0029]
Subsequently, an insulating layer 33 constituting a part of the antenna portion 31 as shown in FIG. 4C is printed on the predetermined portion of the antenna pattern by the insulating ink printing means 45, and is solidified by the solidifying means 46. Solidify (S2). Further, the conductive ink printing means 47 prints the short circuit line 34 and the land portion 35 as shown in FIG. 4D, and solidifies by the solidifying means 48 (S3). Thus, the antenna part 31 is formed. Then, as shown in FIG. 4E, the RF-ID module 13 is formed by mounting the IC module 32 between the land portions 31B and 35 of the antenna portion 31 formed in the IC module mounting means 49 (see FIG. 4E). S4).
[0030]
Subsequently, the adhesive layer of the transfer sheet (14, 15) supplied from the transfer sheet continuous body supply unit 50 to the RF-ID module 13 formed on the release function sheet 42 as shown in FIG. As shown in FIG. 5B, the RF-ID module 13 is peeled off from the peeling function sheet 42 and transferred to the transfer sheet (14, 15) (S5). Then, as shown in FIG. 5C, the thermal sheet continuous body supply unit 51 supplies the transfer sheet (14, 15) on the side to which the RF-ID module (transfer RF-ID module) 13 is transferred. The heat-sensitive sheet 12 to be bonded is bonded to form a continuous body of the non-contact type IC media 11 and is wound around the non-contact type IC media continuous body storage unit 52 (S6). Thereafter, the non-contact type IC media 11 is cut for each single or a predetermined plurality according to the usage pattern.
[0031]
As described above, the antenna unit 31 is formed on the release function sheet 42 and is transferred to the transfer sheet (14, 15), so that the heating and pressure application steps in the manufacturing process are performed on the release function sheet. The transfer sheets (14, 15) and the heat sensitive sheet 12 to be used do not need to consider heating and pressure, and the cost can be reduced. The non-contact type IC media 11 manufactured in this way can be improved in durability against physical and mechanical stress by the transfer sheets (14, 15) and the heat sensitive sheet 12, and the durability can be improved. Is.
[0032]
In the above embodiment, the IC module 32 is mounted before transfer by the transfer sheet (14, 15). However, it is mounted after the transfer and before the thermal sheet 12 is overlaid. Also good. In this case, it is also possible to fix the mounting of the IC module 32 by utilizing the adhesiveness of the adhesive 22 of the double-sided adhesive sheet 14 other than the above method.
[0033]
On the other hand, when manufacturing the non-contact IC media 11 in the above-described embodiment, the transfer sheet continuous body supply unit 50 in FIG. 2 transfers the heat-sensitive sheet 12 coated with an adhesive on one side, and transfers the heat-sensitive sheet. It is good also as supplying the said base material sheet 21 as a continuous body supply part of the base material sheet 21 to which the peeling sheet 15 was adhere | attached suitably instead of the continuous sheet supply part 51. FIG. In this case, it is preferable to mount the IC module 32 before transfer.
[0034]
Next, FIG. 6 shows an explanatory diagram of one use example of the non-contact type IC media according to the present invention. The non-contact type IC media 11 shown in FIG. 6A is produced as described above as a baggage IC tag attached to a consignment baggage when boarding at an airport or a consignment baggage when boarding, for example. In such a non-contact type IC medium 11, for example, the destination, the number of flights, the passenger number, etc. are printed on the thermal sheet 12 by the thermal printer among the information relating to the consignment baggage stored in the RF-ID module 13 included. The Then, the release sheet 15 is peeled off from the non-contact type IC media 11, and the adhesive 23 is attached to the target consignment with a loop shape.
[0035]
FIG. 7 shows a block diagram of a reader / writer for using the non-contact type IC medium according to the present invention. The reader / writer 61 shown in FIG. 7 stores information related to consignment luggage in the RF-ID module 13 of the non-contact type IC medium (baggage IC tag) 11 and is stored in the RF-ID module 13 at least during the transportation. The predetermined information is read. The reader / writer 61 is connected to the printing unit 62 and the input unit 63.
[0036]
Here, the non-contact type IC medium (baggage IC tag) 11 includes an IC module 32 including a processing unit 71, a memory 72, and a demodulation unit 73, and an antenna unit 31. The antenna unit 31 is wound in a coil shape on a plane as described above, receives a signal from the reader / writer 61, or is supplied to the reader / writer 61 from the non-contact type IC medium (baggage IC tag) 11. It is responsible for sending data.
[0037]
In the IC module 32, the memory 72 is for storing various information as the card. The demodulator 73 demodulates the control signal and data from the radio wave received by the antenna unit 31, and appropriately converts the code. And the process part 71 performs the process which memorize | stores the received control signal and data in the memory 72 with a program, and transmits the data memorize | stored in the memory.
[0038]
The reader / writer 61 includes a control unit 81 and a data memory 82, and includes a data conversion unit 83, a modulation unit 84, a transmission unit 85, a power amplification unit 86, a detection unit 87, an antenna 88, a display unit 89, and an interface (IF) unit 90. Is provided. The control unit 81 performs overall control of the entire reader / writer 61, and a program corresponding to this is set. The data memory 83 stores various data relating to the input consignment package. Examples of the various data include the name, address, telephone number, passenger number, boarding flight name, destination, seat number, and the like of the package owner.
[0039]
The data conversion unit 83 converts information when transmitting information to the non-contact type IC medium (baggage IC tag) 11 to, for example, “1” and “0”, and the non-contact type IC medium. The transmission data from the (baggage IC tag) 11 is converted into, for example, “1” and “0”. The modulation unit 84 modulates the information converted by the data conversion unit 83 based on the transmission output from the transmission unit 85, for example, into an FSK (frequency shift keying) modulated wave. The power amplifying unit 86 amplifies the power of the modulated wave modulated by the modulating unit 84, and the amplified modulated wave is transmitted from the antenna 88. Then, the detector 87 detects and demodulates the transmission radio wave received from the non-contact type IC medium (baggage IC tag) 11 received by the antenna 88.
[0040]
And the display part 89 is provided suitably and displays the data handled. Further, the IF unit 90 serves to transmit print data to the print unit 62 and to acquire input data from the input unit 63.
[0041]
For example, when the reader / writer 61 performs communication with the target non-contact type IC medium (baggage IC tag) 11 and printing by the printing unit 62 on the same line, first, the input unit 63 uses the above-mentioned information relating to consignment luggage. Data such as the name, address, telephone number, passenger number, boarding flight name, destination, seat number, etc. of the baggage owner are input and stored in the data memory 82. Of the stored data, predetermined data (for example, passenger number, boarding flight name, destination) is transmitted to the non-contact type IC medium (baggage IC tag) 11 and stored in the memory 72, and is stored in the printing unit 62. The same data is output, and the destination, boarding flight name, and passenger number are printed on the thermal sheet 12 portion of the non-contact type IC medium (baggage IC tag) 11 (see FIG. 6).
[0042]
Thus, even in an environment subject to mechanical and physical stress used in baggage IC tags, the base sheet 21 of the heat sensitive sheet 12 or the double-sided adhesive sheet (transfer sheet) 14 can increase the strength. The durability can be improved.
[0043]
【The invention's effect】
  As described above, according to the present invention, the antenna unit and the IC module are provided.Non-contact IC media that is in a loop shape when used, and is formed on the plane of a release functional sheet coated with a release resin.The transfer RF-ID moduleSingle sheetInformation display sheet andMoisture permeation is difficult with a single sheetBetween base sheetBy transcription to any ofBy adopting an intervening configuration, the strength can be increased against physical and mechanical stress, and the durability can be improved. In addition, by forming at least the antenna part on the release function sheet and transferring it to the transfer sheet, heating and pressure application processes in the manufacturing process are performed on the release function sheet, so that the substrate used can be heated and pressurized. Therefore, the cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a non-contact type IC medium according to the present invention.
2 is a conceptual diagram of manufacturing the non-contact type IC media of FIG. 1. FIG.
FIG. 3 is a flowchart of manufacturing the non-contact type IC media of FIG. 1;
4 is an explanatory diagram (1) of each stage in manufacturing the non-contact type IC media of FIG. 3. FIG.
FIG. 5 is an explanatory diagram (2) of each stage in manufacturing the non-contact type IC media of FIG. 3;
FIG. 6 is an explanatory diagram of an example of use of a non-contact type IC medium according to the present invention.
FIG. 7 is a block diagram of a reader / writer for using the non-contact type IC medium according to the present invention.
[Explanation of symbols]
11 Contactless IC media
12 Thermal sheet
13 RF-ID module
14 Double-sided adhesive sheet
15 Release sheet
21 Substrate sheet
31 Antenna section
32 IC module
33 Insulator layer
34 Short circuit line
41 Non-contact IC media manufacturing system
42 Peeling function sheet
43, 47 Conductive ink printing means
44, 46, 48 Solidification means
45 Insulating ink printing means
49 IC module mounting means
50 Transfer sheet continuum supply unit
51 Thermal sheet continuum supply unit
52 Non-contact IC media continuum storage
61 Reader / Writer

Claims (8)

Antenna unit is formed, with a RF-ID module IC module is mounted, a non-contact type IC medium that is looped in use,
A single sheet information display sheet on which information related to the information stored in the IC module is printed by a predetermined printing means;
A single sheet laminated with the information display sheet and an adhesive, a substrate sheet that is difficult to permeate moisture ,
Wherein interposed between the information display sheet and the base sheet, wherein at least the antenna portion is formed on the plane of the release function sheet peeling of the resin is coated by the information display sheet or the substrate sheet adhesive A transfer RF-ID module constituting the RF-ID module by being transferred with an agent;
A non-contact type IC medium characterized by comprising: 2. The non-contact type IC medium according to claim 1, wherein the substrate sheet that is difficult to transmit moisture is impregnated with a resin varnish. 3. 3. The non-contact type IC medium according to claim 1, wherein a release sheet is provided on the back surface of the base sheet on the information display sheet side through an adhesive. 4. IC media. 4. The non-contact type IC medium according to claim 1, wherein the information stored in the IC module and printed on the information display sheet is at least information on consignment delivery. Non-contact IC media. Antenna unit is formed, with a RF-ID module IC module is mounted, a non-contact type IC medium manufacturing method that is looped in use,
A step of forming the antenna portion with the conductive ink on the plane of the release functional sheet coated with a release resin that can be peeled off freely;
A step of forming the RF-ID module by mounting the IC module on the antenna unit;
A single sheet coated with an adhesive on at least one side is coated with a base sheet that is difficult to transmit moisture , or an adhesive that prints information related to information stored in the IC module by a predetermined printing means. A transfer sheet composed of a single-sheet information display sheet , the RF-ID module is peeled off from the release function sheet by bonding with the adhesive, and transferred;
On the transfer sheet, on the side where the RF-ID module is transferred, when the transfer sheet is the base sheet, the information display sheet, or when the transfer sheet is the information display sheet Adhering the base sheet;
A method for producing a non-contact type IC media, comprising: Antenna unit is formed, with a RF-ID module IC module is mounted, a non-contact type IC medium manufacturing method that is looped in use,
A step of forming the antenna portion with the conductive ink on the plane of the release functional sheet coated with a release resin that can be peeled off freely;
A single sheet coated with an adhesive on at least one side is coated with a base sheet that is difficult to transmit moisture , or an adhesive that prints information related to information stored in the IC module by a predetermined printing means. A transfer sheet composed of a single-sheet information display sheet , the step of separating the transfer from the release functional sheet by bonding the antenna portion with the adhesive, and
On the transfer sheet, the RF-ID module is formed by mounting the IC module on the transferred antenna portion;
On the transfer sheet, on the side where the RF-ID module is transferred, when the transfer sheet is the base sheet, the information display sheet, or when the transfer sheet is the information display sheet Adhering the base sheet;
A method for producing a non-contact type IC media, comprising: The method for producing a non-contact type IC medium according to claim 5 or 6 , wherein the base sheet has a release sheet bonded to the back surface of the surface coated with the pressure-sensitive adhesive via a pressure-sensitive adhesive. A method of manufacturing a non-contact type IC media characterized by the above. A non-contact IC medium manufacturing method according to at least one of claims 5-7, stored in the IC module, the information to be printed on the information display sheet is information of at least cargo consignment A method of manufacturing a non-contact type IC medium, which is characterized.

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