JP3710560B2 - Surface acoustic wave device mounting structure and mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface acoustic wave device mounting structure and a mounting method.
[0002]
[Prior art]
In recent years, cellular phones and PHS have been widely used, and electronic devices have become more and more personalized. Accordingly, high-frequency analog electronic components that form a transmission / reception function for wireless communication have become very important. Among them, devices using surface acoustic waves are very effective in terms of downsizing and cost reduction, and are used for resonators and filters.
[0003]
In general, a device using surface acoustic waves requires a transducer that converts electrical signals into surface acoustic waves, or vice versa, and a piezoelectric material is used as the material for the conversion. There are many cases. When an electric field is applied to a piezoelectric body, distortion, that is, deformation occurs. On the other hand, when stress is applied, an electric field is generated. A so-called piezoelectric effect is generated. Therefore, the electrical signal and surface acoustic wave transducers described above utilize this piezoelectric effect. Thus, conversion of electricity and surface acoustic waves is performed. As the piezoelectric single crystal material, quartz, lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), etc. are often used.
[0004]
FIG. 6 is a diagram showing the configuration of such a conventional SAW (Surface Acoustic Wave) transversal filter, FIG. 6 (a) is a plan view of the SAW transversal filter, and FIG. 6 (b) is the SAW filter. It is a side view of a transversal type filter.
[0005]
As shown in these drawings, the SAW transversal type filter includes a substrate 1 having a piezoelectric effect, a transmitting side IDT 2 (Interdigital Transducer), and a receiving side IDT 3.
[0006]
When an RF voltage is applied from the input signal 4 to the IDT 2 on the transmission side, periodic distortion occurs in the vicinity of the surface of the substrate 1 due to the piezoelectric effect corresponding to the applied electric field distribution in the IDT 2 portion on the transmission side, and SAW (surface elasticity) Wave or Rayleigh wave). Furthermore, after the SAW propagates on the surface of the substrate 1, it is converted again into an electric signal by the IDT 3 on the receiving side and becomes an output signal 5. The SAW wavelength λ has a frequency f0 (= V / 2d, v: surface wave velocity) that coincides with the electrode period 2d of the IDT, and the SAW excited from each electrode finger is added to the same phase. Is the highest.
[0007]
As a method for mounting such a conventional surface acoustic wave device, as shown in FIG. 7, the electrical connection to the base substrate 11 is a normal LSI such as a W / B (Wire Bonding) connection method or a bump connection method. A similar connection method is possible.
[0008]
As described above, the mounted substrate 1 is mounted on the base substrate 11 having the cavity and sealed by the sealing lid 12. In addition, 1a is a functional surface of the surface acoustic wave device, and 13 is an air gap.
[0009]
However, as described above, since the SAW propagates on the surface of the substrate 1 in the surface acoustic wave device, the air gap 13 is indispensable in the substrate 1, and therefore, as shown in FIG. A structure in which the sealing lid 12 is mounted on the substrate 11 and sealed, and the air gap 13 is formed in the SAW propagation portion on the surface of the substrate 1 is the most common surface acoustic wave device package at present.
[0010]
However, such a surface acoustic wave device package has a very high package cost compared to a general LSI package (for example, transfer mold) because of a structural problem for securing an air gap. Further, it is difficult to reduce the package size. Therefore, packaging of surface acoustic wave devices with a low cost while ensuring an air gap has been reported. For example, an annular member is disposed on the substrate so as to surround the SAW propagation portion, and a resin-sealed bump connection structure package (see Japanese Patent Application Laid-Open No. 5-90882), or a portion of the substrate excluding the SAW propagation portion is air-filled. A space for forming a gap is provided, and a sealing lid is bonded to the facing portion (see Japanese Patent Laid-Open No. Hei 3-21112), and the substrate is bump-connected to a base substrate having a cavity and sealed to the back surface of the substrate There is a package for bonding a lid (see Japanese Patent Laid-Open No. 6-61778).
[0011]
[Problems to be solved by the invention]
However, in the conventional surface acoustic wave device mounting method described above, the number of structural members required to form the air gap increases, and a mounting process associated therewith is required, considering the package member cost and mass productivity, There was a problem that it was very difficult to reduce the package cost.
[0012]
An object of the present invention is to provide a mounting structure and a mounting method for a surface acoustic wave device that can eliminate the above-mentioned problems, reduce the package cost, and can be easily manufactured.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
[1] In a surface acoustic wave device mounting structure, a piezoelectric substrate, an interdigital electrode formed on the main surface of the piezoelectric substrate, and formed on the main surface of the piezoelectric substrate connected to the interdigital electrode. A surface acoustic wave device having an input terminal and an output terminal, and a main surface on which the surface acoustic wave device is mounted, and the input terminal and the output terminal of the surface acoustic wave device on the main surface A base substrate including a plurality of connection pads connected to each other via a bonding member, an insulating layer having a hole in which the bonding member is formed , and the insulating layer and the surface acoustic wave device on the base substrate And a sealing material for sealing the surface acoustic wave device mounted with the main surface on which the interdigital electrode is formed facing the main surface of the base substrate. You It is obtained by way.
[0014]
[2] In the surface acoustic wave device mounting structure according to [1] above, the input terminal or the output terminal of the surface acoustic wave device and the connection pad on the base substrate are electrically connected via a bonding member. The joining member is configured such that the height from the main surface of the base substrate is higher than that of the insulating layer .
[0015]
[3] In the surface acoustic wave device mounting structure described in [1] or [2] above, the base substrate is made of ceramic, and the insulating layer contains alumina .
[0016]
[4] The mounting structure of the surface acoustic wave device according to any one of [1] to [3], and the input terminal or the output terminal of said surface acoustic wave device, the connection pads on the base substrate Is electrically connected via a stud bump and a conductive adhesive .
[0017]
[5] In the surface acoustic wave device mounting structure according to the above [4], the stud bump is made of Au, and is formed on the input terminal or the output terminal of the surface acoustic wave device. .
[0018]
[6] The surface acoustic wave device mounting structure according to any one of [1] to [5], wherein a cavity for housing the surface acoustic wave device is provided on the base substrate. is there.
[0019]
[7] In the surface acoustic wave device mounting method, a piezoelectric substrate, an interdigital electrode formed on the surface of the piezoelectric substrate, and connected to the interdigital electrode and formed on the main surface of the piezoelectric substrate. A surface acoustic wave device having an input terminal and an output terminal, and a main surface on which the surface acoustic wave device is mounted, and the input terminal and the output terminal of the surface acoustic wave device are provided on the main surface. A base substrate on which a plurality of connection pads connected via a bonding member is formed, an insulating layer is formed on the base substrate , a hole is formed in the insulating layer, the input terminal and the output said surface acoustic wave device so that the terminal is connected to each of the connection pads via the joint member mounted on the base substrate, the surface acoustic wave device mounted on the base substrate It is obtained so as to seal with a sealant.
[0020]
[8] In the surface acoustic wave device mounting method described in [7] above, the base substrate is made of ceramic, and the insulating layer is formed using alumina.
[0021]
[9] In the surface acoustic wave device mounting method according to [7] or [8], the input terminal or the output terminal of the surface acoustic wave device and the connection pad on the base substrate are stud bumps. And electrically connected via a conductive adhesive.
[0022]
[10] In the surface acoustic wave device mounting method according to [9], the stud bump is made of Au and formed on the input terminal or the output terminal of the surface acoustic wave device. .
[0023]
[11] In the surface acoustic wave device mounting method according to any one of [7] to [10], a cavity is provided on the base substrate, and the surface acoustic wave device is accommodated in the cavity. It was made to do.
[0024]
Since it was configured as above,
(A) By keeping the distance between the base substrate and the substrate as close to zero as possible so that the sealant does not flow into the gap between the base substrate and the substrate, an air gap of about several μm is formed on the functional surface portion (SAW propagation surface) of the substrate. Can be formed.
[0025]
(B) In order to prevent the sealant from flowing into the gap between the base substrate and the substrate more reliably and form an air gap of about several μm on the functional surface (SAW propagation surface) of the substrate, An insulating layer having a cavity with a large external dimension is formed on the base substrate, and the functional surface of the substrate is opposed to the base substrate side so that the substrate fits in the cavity, and then sealing is performed using a sealant. be able to.
[0026]
(C) forming a bump-like bonding member to an input / output terminal in the same plane as the functional surface of the substrate on which the IDT is formed, and forming the size of the connection pad of the base substrate larger than the size of the bonding member; Furthermore, after mounting the functional surface of the substrate on the base substrate so as to face the base substrate on which the insulating layer for forming the connection pad is provided, the substrate and the base substrate are connected with a bonding member, and then sealed. By performing a sealing process using a stopper, an air gap can be formed between the functional surface of the substrate and the base substrate.
[0027]
(D) A bump-shaped bonding member is formed on the connection pad of the base substrate, the size of the input / output terminal of the substrate is clearly larger than the size of the bonding member, and an insulating layer for forming the connection pad is further provided. By mounting the functional surface of the substrate on the base substrate so as to face the base substrate, the substrate and the base substrate are connected by a bonding member, and then a sealing process using a sealing agent is performed. An air gap can be formed between the functional surface and the base substrate.
[0028]
(E) A metal stud bump having a height smaller than the thickness of the insulating layer is formed on the input / output terminal on the same plane as the functional surface of the substrate, and the conductive adhesive is transferred to the metal stud bump. Or after applying a conductive adhesive to the connection pad of the base substrate on which the insulating layer for forming the connection pad is applied, the conductive surface is applied while applying a load with the functional surface of the substrate facing the base substrate side. It is possible to form an air gap between the functional surface of the substrate and the base substrate by curing the adhesive, connecting the substrate and the base substrate, and then performing sealing using a sealing agent. it can.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0030]
1 is a cross-sectional view showing the overall structure of a surface acoustic wave device according to a first embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of a portion A in FIG. 1, and FIG. 3 is a method for forming an air gap of the surface acoustic wave device It is explanatory drawing of.
[0031]
In these drawings, 21 is a base substrate, 22 is a connection pad formed on the base substrate 21, 23 is an insulating layer formed on the base substrate 21, 24 is a hole formed in the insulating layer 23, and It is a joining member formed in the hole, and the input / output terminal 26 formed on the substrate 25 is joined to the joining member 24. Reference numeral 25a denotes a functional surface of the substrate 25, 27 denotes an air gap, and 28 denotes a sealant.
[0032]
The configuration will be described in detail below.
[0033]
A substrate 25 and a base substrate 21 made of a piezoelectric material (for example, quartz, LiNbO ₃ , LiTaO _3, etc.) on which an IDT is formed are electrically connected by a bonding member 24. As the material of the bonding member 24 used at this time, generally available Pb / Sn solder is relatively inexpensive, and the package is connected to the mounting substrate by eutectic solder. High temperature solder having a melting point (for example, 95Pb / 5Sn) is preferable. However, there is no problem even if other metal solder is used.
[0034]
As the connection method, a bump-shaped bonding member 24 is formed on the input / output terminal 26 on the functional surface 25a (SAW propagation surface) side of the substrate 25 by a plating method or a ball mounting method, or a ball mounting method or the like. Using a printing method, a bump-shaped bonding member 24 is formed on the connection pad 22 of the base substrate 21, and the substrate 25 is mounted and heated so that the functional surface 25 a faces the base substrate 21.
[0035]
In the above embodiment, the bump-shaped bonding member 24 is formed on the base substrate 21 side. However, the bump-shaped bonding member 24 may be formed on the input / output terminal 26 side of the substrate 25. .
[0036]
Furthermore, as another connection method, a good connection can be obtained by heating with a ball-shaped solder sandwiched between the base substrate 21 and the substrate 25. The heating method is performed by reflow using a belt furnace or a hot plate.
[0037]
What is important when the base substrate 21 and the substrate 25 are connected is that when the sealant 28 is applied after the base substrate 21 and the substrate 25 are connected, the sealant 28 is formed between the base substrate 21 and the substrate 25. This is to make the distance between the base substrate 21 and the substrate 25 as close to zero as possible so as not to flow into the air gap 27. As a result, an air gap 27 region of about several μm can be secured in the functional surface 25 a of the substrate 25.
[0038]
After the connection between the base substrate 21 and the substrate 25, the appearance is almost in contact, but microscopically there is an air gap 27 of several μm, so if there is an air gap 27 of several μm, Even if the sealing agent 28 is applied, the applied sealing agent 28 flows into the air gap 27 between the base substrate 21 and the substrate 25 unless a high pressure is applied or the sealing agent 28 has an extremely low viscosity. There is nothing, and the air gap 27 can be secured in the functional surface 25a of the substrate 25.
[0039]
Next, a method for forming the distance between the base substrate 21 and the substrate 25 as close to zero as possible will be described below.
[0040]
First, as shown in FIG. 3A, the connection pads 22 are formed on the base substrate 21, but the insulating layer 23 (for example, when ceramic is applied to the material of the base substrate 21) is connected to the connection side with the substrate 25. In the case of a printed circuit board such as alumina coating or FR4 material, a solder resist or the like is applied, and at this time, the shape of the connection pad 22 is patterned.
[0041]
For connecting the base substrate 21 and the substrate 25, the bump-shaped bonding member 24 is formed on either one. For example, when the bump-shaped bonding member 24 is formed on the base substrate 21 side, the size of the input and output terminals 26 on the functional surface 25a, keep clearly larger than the size of the bump-shaped junction member 24 formed. With this configuration, the heated and melted bonding member 24 sufficiently wets and spreads to the input / output terminal 26, so that the substrate 25 sinks due to its own weight, and the base substrate 21 and the substrate 25 are almost in contact with each other. It becomes a state.
[0042]
Conversely, when the bonding member 24 is formed on the substrate 25 side, the size of the connection pad 22 on the base substrate 21 is obviously made larger than the size of the bump-shaped bonding member 24. The height of the bonding member 24 at this time is set to be approximately the same as the height of the insulating layer 23 formed on the substrate 25 side of the base substrate 21. In addition, the height of the bonding member 24 before bonding needs to be higher than at least the thickness dimension of the insulating layer 23.
[0043]
In the experiment, on the base substrate 21 using the FR4 material, the connection pad 22 is formed in a size of φ0.1 mm with a solder resist having a thickness of 40 μm, and by using a ball mounting method using a solder ball of φ0.1 mm, When the bump-shaped bonding member 24 is formed and the connection is performed with the size of the input / output terminal 26 on the functional surface 25a of the substrate 25 being about 0.25 mm □, the gap between the base substrate 21 and the substrate 25 is 5 The required air gap 27 can be surely formed. Further, although it was a very small air gap 27, it was confirmed that there was no problem in the frequency characteristics of the filter.
[0044]
After the base substrate 21 and the substrate 25 are connected, sealing is performed with a sealing agent 28 (for example, liquid epoxy resin, E pellet, etc.). Needless to say, in the connection structure of the base substrate 21 and the substrate 25 according to the structure of the present invention, it is possible to use a sealing structure using a sealing lid or the like as usual.
[0045]
As described above, according to the first embodiment, the air gap 27 can be reliably formed on the functional surface 25a of the substrate 25 without using a special structural member or a complicated mounting process associated therewith. Therefore, it is possible to reduce the package cost and mount a surface acoustic wave device with high mass productivity.
[0046]
Next, a second embodiment of the present invention will be described.
[0047]
FIG. 4 is a diagram showing a surface acoustic wave device mounting method according to the second embodiment of the present invention.
[0048]
In this embodiment, the basic structure and principle are the same as those in the first embodiment, but as a method for connecting the base substrate 31 and the substrate 35, as shown in FIG. A stud bump 37 is formed on the substrate 35 side and connected to the conductive adhesive 34 of the base substrate 31. That is, the Au stud bump 37 and the conductive adhesive 34 are used in combination.
[0049]
What is important in this case is to set the height dimension of the Au stud bump 37 smaller than the thickness dimension of the insulating layer 33, and then transfer the conductive adhesive 34 to the Au stud bump 37, or A conductive adhesive 34 is applied to the connection pads 32 of the base substrate 31 by a method such as printing or dispensing, and the substrate 35 is mounted on the base substrate 31 and cured.
[0050]
Then, as shown in FIG. 4B, by applying a load to the substrate 35 at the time of curing, the substrate 35 sinks to the base substrate 31 side, and after the curing, the base substrate 31 and the substrate 35 are almost in contact with each other. Therefore, the gap between the base substrate 31 and the substrate 35 is almost zero. Reference numeral 36 denotes an input / output terminal.
[0051]
The subsequent sealing process is as shown in the first embodiment.
[0052]
Next, a third embodiment of the present invention will be described.
[0053]
FIG. 5 is a sectional view showing a surface acoustic wave device mounting structure according to a third embodiment of the present invention.
[0054]
Also in this embodiment, the basic structure, principle and bonding process of the first embodiment and the second embodiment are applied.
[0055]
As shown in FIG. 5, as a method for more reliably forming the air gap 45 in which the sealant 47 exists between the base substrate 41 and the substrate 46, the outer shape of the insulating layer 42 is slightly larger than the outer shape of the substrate 46. A single-stage cavity 44 having dimensions is provided. As described above, the insulating layer 42 is formed on the base substrate 41 with the shape of the connection pads patterned in order to form connection pads (not shown) of the base substrate 41. The functional surface 46a is formed on the opposing surface.
[0056]
Thereby, even if the sealing agent 47 tries to flow into the air gap 45 between the base substrate 41 and the substrate 46, since the cavity 44 is provided, the function of the substrate 46 in which the sealing agent 47 is the SAW propagation surface is provided. The distance to reach the surface 46a is long, so that the air gap 45 can be more reliably formed. Reference numeral 43 denotes a joining member.
[0057]
It is very easy to provide the one-step cavity 44 in the insulating layer 42 part. In general, the alumina coat or solder resist of the insulating layer 42 is formed by applying and curing a paste-like insulating material by a printing process, and in order to provide the cavity 44, a window frame-like pattern that matches the cavity shape. And just add printing.
[0058]
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.
[0059]
【The invention's effect】
As described above in detail, according to the present invention, the following effects can be obtained.
[0060]
(1) By keeping the distance between the base substrate and the substrate as close to zero as possible so that the sealant does not flow into the gap between the base substrate and the substrate, an air gap of about several μm is formed on the functional surface (SAW propagation surface) of the substrate. Can be formed.
[0061]
Therefore, it is possible to obtain a surface acoustic wave device which is compact and has a reduced package cost, and can be easily manufactured.
[0062]
(2) In order to prevent the sealant from flowing into the gap between the base substrate and the substrate more reliably and form an air gap of about several μm on the functional surface (SAW propagation surface) of the substrate, An insulating layer having a cavity with a large external dimension is formed on the base substrate, and the functional surface of the substrate is opposed to the base substrate side so that the substrate fits in the cavity, and then sealing is performed using a sealant. be able to.
[0063]
(3) forming a bump-shaped bonding member to an input / output terminal in the same plane as the functional surface of the substrate on which the IDT is formed, and forming the connection pad size of the base substrate larger than the size of the bonding member; Furthermore, after mounting the functional surface of the substrate on the base substrate so as to face the base substrate on which the insulating layer for forming the connection pad is provided, the substrate and the base substrate are connected with a bonding member, and then sealed. By performing a sealing process using a stopper, an air gap can be formed between the functional surface of the substrate and the base substrate.
[0064]
(4) A bump-shaped bonding member is formed on the connection pad of the base substrate, the size of the input / output terminals of the substrate is formed to be clearly larger than the size of the bonding member, and an insulating layer for forming the connection pad is further provided. By mounting the functional surface of the substrate on the base substrate so as to face the base substrate, the substrate and the base substrate are connected by a bonding member, and then a sealing process using a sealing agent is performed. An air gap can be formed between the functional surface and the base substrate.
[0065]
(5) A metal stud bump having a height smaller than the thickness of the insulating layer is formed on the input / output terminal on the same plane as the functional surface of the substrate, and the conductive adhesive is transferred to the metal stud bump. Or after applying a conductive adhesive to the connection pad of the base substrate on which the insulating layer for forming the connection pad is applied, the conductive surface is applied while applying a load with the functional surface of the substrate facing the base substrate side. It is possible to form an air gap between the functional surface of the substrate and the base substrate by curing the adhesive, connecting the substrate and the base substrate, and then performing sealing using a sealing agent. it can.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an overall configuration of a surface acoustic wave device according to a first embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of a part A in FIG.
FIG. 3 is an explanatory diagram of a method for forming an air gap of the surface acoustic wave device according to the first embodiment of the present invention.
FIG. 4 is a diagram illustrating a surface acoustic wave device mounting method according to a second embodiment of the present invention.
FIG. 5 is a cross-sectional view showing a surface acoustic wave device mounting structure according to a third embodiment of the present invention.
FIG. 6 is a diagram illustrating a configuration of a conventional SAW transversal filter.
FIG. 7 is a cross-sectional view showing a mounting structure of a conventional surface acoustic wave device.
[Explanation of symbols]
21, 31, 41 Base substrate 22, 32 Connection pad 23, 33, 42 Insulating layer 24, 43 Bonding member 25, 35, 46 Substrate 25a, 46a Substrate functional surface 26, 36 Input / output terminals 27, 45 Air gap 28, 47 Sealant 34 Conductive adhesive 37 Au stud bump 44 Cavity

Claims (11)

A surface comprising a piezoelectric substrate, an interdigital electrode formed on the main surface of the piezoelectric substrate, and an input terminal and an output terminal connected to the interdigital electrode and formed on the main surface of the piezoelectric substrate An acoustic wave device;
It has a main surface which surface acoustic wave device is mounted, and a plurality of connection pads connected through a bonding member to said input terminal and said output terminal of said surface acoustic wave device on said main surface, said joint A base substrate comprising an insulating layer having holes in which members are formed ;
The main surface on which the interdigital electrode is formed is mounted on the base substrate so as to face the main surface of the base substrate while providing a gap between the insulating layer and the surface acoustic wave device. A mounting structure for a surface acoustic wave device, comprising: a sealing material for sealing the surface acoustic wave device.   2. The surface acoustic wave device mounting structure according to claim 1, wherein the input terminal or the output terminal of the surface acoustic wave device and the connection pad on the base substrate are electrically connected via a bonding member. The surface acoustic wave device mounting structure is characterized in that the joining member is higher in height from the main surface of the base substrate than the insulating layer.   3. The surface acoustic wave device mounting structure according to claim 1, wherein the base substrate is made of ceramic, and the insulating layer includes alumina.   The surface acoustic wave device mounting structure according to any one of claims 1 to 3, wherein the input terminal or the output terminal of the surface acoustic wave device and the connection pad on the base substrate include a stud bump and A surface acoustic wave device mounting structure, wherein the surface acoustic wave device is electrically connected via a conductive adhesive. 5. The surface acoustic wave device according to claim 4, wherein the stud bump is made of Au and formed on the input terminal or the output terminal of the surface acoustic wave device. Implementation structure.   The surface acoustic wave device mounting structure according to any one of claims 1 to 5, wherein a cavity for housing the surface acoustic wave device is provided on the base substrate. Implementation structure. Surface elasticity comprising a piezoelectric substrate, an interdigital electrode formed on the surface of the piezoelectric substrate, and an input terminal and an output terminal connected to the interdigital electrode and formed on the main surface of the piezoelectric substrate Wave device,
The surface acoustic wave device has a main surface on which a plurality of connection pads connected to the input terminal and the output terminal of the surface acoustic wave device via bonding members are formed. Prepare the base board and
On the base substrate, forming an insulating layer, said surface acoustic wave device so as to form a hole in the insulating layer, the input terminal and the output terminal are connected to each via the joint member and the connection pad Is mounted on the base substrate, and the surface acoustic wave device mounted on the base substrate is sealed with a sealing material.   8. The surface acoustic wave device mounting method according to claim 7, wherein the base substrate is made of ceramic, and the insulating layer is formed using alumina.   The surface acoustic wave device mounting method according to claim 7 or 8, wherein the input terminal or the output terminal of the surface acoustic wave device and the connection pad on the base substrate are formed of a stud bump and a conductive adhesive. A method of mounting a surface acoustic wave device, wherein the surface acoustic wave device is electrically connected to the surface acoustic wave device. 10. The surface acoustic wave device mounting method according to claim 9, wherein the stud bump is made of Au and formed on the input terminal or the output terminal of the surface acoustic wave device. Implementation method.   11. The surface acoustic wave device mounting method according to claim 7, wherein a cavity is provided on the base substrate, and the surface acoustic wave device is accommodated in the cavity. Mounting method of surface acoustic wave device.

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