JP3442995B2 - Manufacturing method and manufacturing apparatus for electronic component device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electronic component device.

[0002]

2. Description of the Related Art As is well known, in the process of handling electronic parts such as the manufacturing process of electronic parts, the electronic parts are arranged in a regular manner in order to recognize the shape of the electronic parts and improve the transportation efficiency. There are various cases where is required.
For example, in the process of die-bonding the semiconductor elements to the lead frame, the semiconductor elements are arranged on an adhesive sheet,
After fixing, the quality of the semiconductor element was judged by a recognition camera, and only good products were conveyed and die-bonded.

Conventionally, as a method of fixing an electronic component, as shown in FIG. 6, for example, the electronic component 1c after the dicing, which is attached to the adhesive sheet 32 fixed by the wafer ring 61, is pushed by the push-up pin 62. At the same time as pushing up from the back surface of the adhesive sheet 32, it was sucked and conveyed by the suction collet 6 and die-bonded to the die pad portion 9 of the lead frame 8. Note that FIG. 7 is an enlarged sectional view of the electronic component at the time of suction.

By the way, as is well known, the base material of electronic parts and semiconductor elements is usually made of, for example, silicon (Si).
Since it is made of a material that is relatively brittle and does not have so high strength or rigidity, when pushing up electronic components using the above-mentioned push-up pins, the mechanical interference does not impair the function or shape of the electronic components. As such, it is necessary to give due consideration.

In addition, a good semiconductor device that can be obtained from one wafer, the number of wafer rings that can be mounted on equipment,
In addition, since there is a limit to the number of electronic components that can be stored in the tray, it is necessary for the operator to consider the timing of material supply. As described above, from the viewpoint of transporting the electronic component, it is desirable to reduce the mechanical pressure applied to the electronic component as much as possible and eliminate the applied force. Further, from the viewpoint of material supply cycle time, it is desirable that the number of times of material supply is small.

[0006]

However, for example, in a conventional fixing device of a type for fixing an electronic component by a wafer ring, the adhesive force of the adhesive sheet is larger than the vacuum suction force applied to the collet at the tip of the tool. Since it is strong, it is necessary to adjust the push-up force, push-up amount, and pin shape of the push-up pin from the backside of the electronic component for each type of electronic component, which takes time and effort, and there is a problem that productivity decreases. It was Also, if the adjustment is insufficient,
The mechanical pressure exerted by the push-up pin may damage the electronic component.

Further, since the size of wafers and the number of trays to be stored are often limited, and the number of electronic parts that can be mounted on one equipment is also limited, the operator attaches the wafers. It was also necessary to frequently supply rings and replace trays. Therefore, the object of the present invention is to solve the above technical problems,
An object of the present invention is to provide a manufacturing method and a manufacturing apparatus for an electronic component device, which can improve productivity without damaging the electronic component and can dispense with material supply for a long time.

[0008]

In order to achieve this object, a method of manufacturing an electronic component device according to a first aspect of the present invention is such that after electronic components are arranged on a plane, the electronic components are sucked and conveyed. A method of manufacturing an electronic component device which is supplied to an intermediate regulation position or in a manufacturing process, which prevents the electronic component from dropping and moving with time by keeping contact with the back surface of the electronic component, and sucks the electronic component. Prepare a wrap film that has a smaller adhesive force than the adsorption force of
Fix the wrap film to the multiple fixing plates and
Arranged around the flat axis , the electronic component is placed on the wrap film , and the electronic component is adsorbed in a state of being closely adhered to the wrap film, and all the electronic components existing on the fixing plate at the predetermined position are attached .
After picking up and transporting electronic parts, place other fixing plates in place.
Rotate and move to pick up and transport electronic components on this fixed plate.
Characterized in that that.

As described above, a wrap film that prevents the electronic component from dropping and moving with time by keeping contact with the back surface of the electronic component and has an adhesive force smaller than the suction force when the electronic component is sucked is provided. Prepare and wrap
Fix the rum to multiple fixed plates and rotate around the horizontal axis.
And arranged, placing the electronic component on a wrap film, the adsorbed in close contact with the electronic components on the wrap film
Together, all the electronic components present on the fixed plate at the prescribed position
After picking up and transporting, rotate the other fixed plate to the specified position.
Since the electronic component on the fixed plate is sucked and conveyed , the electronic component can be conveyed to the intermediate setting position or in the manufacturing process only by suction without pushing up by the push-up pin as in the conventional case. Therefore, the reliability can be improved without damaging the electronic parts, and the adjustment of the push-up pin is unnecessary, so that the productivity is improved. Also, the material supply cycle can be reduced,
There is no need to supply electronic components for a certain period of time.

[0010]

[0011]

According to a second aspect of the present invention, there is provided an electronic component device manufacturing apparatus which sucks and conveys electronic components arranged on a plane and supplies the electronic components to an intermediate regulation position or a manufacturing process. Prevents electronic components from falling and moving over time by maintaining contact with the backside of electronic components,
In addition, the wrap film , which has an adhesive force smaller than the suction force when sucking electronic parts, and the horizontal mechanism by the rotating mechanism.
It has a turntable that can rotate
Multiple fixed fixing plates can be detachably attached to the rotary table.
It is characterized by being.

In the above structure, the wrap which keeps contact with the back surface of the electronic component to prevent the electronic component from dropping and moving with time, and has an adhesive force smaller than the suction force when the electronic component is sucked. Film and rotation
With a turntable that can rotate around a horizontal axis by a mechanism
However, a plurality of fixing plates that fix the wrap film are
Since it is removably attached to the rotary table , the electronic component can be transported to the intermediate setting position or in the manufacturing process only by suction without the push-up by the push-up pin unlike the conventional case. Therefore, the reliability can be improved without damaging the electronic parts, and the adjustment of the push-up pin is unnecessary, so that the productivity is improved. Well
In addition, it absorbs all electronic components on the fixed plate
After mounting and transporting, rotate the other fixing plate to the predetermined position.
Electronic components on the lever fixing plate can be picked up and transported.
It Therefore, the material supply cycle can be reduced.
In this case, the work of supplying electronic parts is unnecessary for a certain period of time. Well
In addition, the electronic parts are
Fixing plate where electronic parts exist by removing the fixing plate that does not exist
Since it is possible to install
The operation of equipment is not interrupted.

[0014]

[0015]

[0016]

[0017]

[0018]

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a manufacturing apparatus for an electronic component device according to this embodiment, and FIG. 2 is an enlarged cross-sectional view of the electronic component adsorption device according to the first embodiment.
As shown in FIG. 1, the manufacturing apparatus of this electronic component device includes a fixing device 15 for arranging and fixing electronic components 1a on a plane, and an intermediate regulation position or a manufacturing process for sucking and conveying the electronic components 1a. A supply device 16 for supplying the inside is provided. Note that the electronic component referred to here is a semiconductor element or the like, but is not limited to this, and is intended for those that operate by electrical connection, and the object to which the electronic component is connected in the manufacturing process is The substrate, the lead frame and the like are not particularly limited.

In the fixing device 15, the wrap film 2 on which the electronic component 1a to be fixed is placed is fixed to the fixing plate 3, and each fixing plate 3 is installed on the turntable 4. The wrap film 2 keeps contact with the back surface of the electronic component 1a to prevent the electronic component 1a from dropping and moving with time. The material of the fixing plate 3 is the electronic component 1
There is no particular limitation as long as it can prevent electrostatic destruction of a and does not damage the electronic component 1a. In this embodiment, for example, a conductive acrylic plate is used. Further, in the supply device 16, the collet 6 movable by rotating the ball screw 11 sucks and conveys the electronic component 1a. At that time, as shown in FIG. 2, the surface of the electronic component 1a is suctioned by the suction force by the suction pad 21 at the tip of the collet 6. Therefore, the material of the wrap film 2 on which the electronic component 1a is placed is such that the adhesive force with the back surface of the electronic component 1a is smaller than the vacuum suction force, and the electronic component 1a is positioned vertically below the wrap film 2. Also, it is preferable that at least an adhesive force that can prevent the electronic component 1a from being detached can be secured. In addition, it is desirable that one type can correspond to all shapes and sizes of electronic components. In this embodiment, for example, polypropylene is used.

FIG . 4 shows the rotation mechanism in this embodiment.
It is sectional drawing of the fixing device which has. Shown in Figures 1 and 4
Fixing plates 3 to which the wrap film 2 is fixed
Is detachably attached to the turntable 4, and the rotation mechanism
It is possible to rotate around a horizontal axis. In this case, the turntable
The fixing plate 3 which can be detached from the
And the turntable 4 is fixed to the rack 43.
It is supported by the toe 42. Also, the turntable 4 is the handle 1.
0 and can be easily removed from the bracket 42
Wear. Further, in the rotating mechanism, a recognition camera (not shown)
No.), the rotary table 4 is rotated at a constant angle (for example, 90 degrees).
Only the motor 5 can be used for rotation. Next, a method of manufacturing this electronic component device will be described. When the wrap film 2 is fixed to the plurality of fixing plates 3 as described above,
Both are arranged around the horizontal axis , the electronic component 1a is placed on the wrap film 2 , and the electronic component 1a is sucked by the collet 6 while being in close contact with the wrap film 2. At this time, the adhesive force between the wrap film 2 and the electronic component 1a, which are in close contact with the fixing plate 3, is smaller than the vacuum suction force, so that mechanical pressure due to the push-up of the push-up pin from the back surface of the electronic component 1a is unnecessary. . Then, for example, the electronic component 1
When a is a semiconductor device, the lead frame 8 is sent onto the rail 7 in the manufacturing process, and the collet 6
Then, the electronic component 1a is sucked and conveyed, and is die-bonded on the die pad portion 9. And installed on the turntable 4
The surface of the electronic component 1a of the fixing plate 3 that is facing vertically upward
The electronic component 1a existing on the fixed plate 3a at a predetermined position
Once all are connected, the recognition camera and motor 5
The fixed plate 3b is rotatably moved to a predetermined position so that the fixed plate 3b is
The electronic component 1b of the collet 6 is used in the same manner as in the first embodiment.
Is used for suction and conveyance, and is connected to the die pad section 9. Solid
While sucking and transporting the electronic component 1b on the surface plate 3b,
The fixed plate 3a is removed from the turntable 4 and electronic parts are present.
The fixing plate is installed on the surface where the fixing plate 3a was installed. This
As described above, the electronic components are supplied and the turntable 4 is driven.

As described above, according to this embodiment, the electronic component 1a can be attracted to the tip of the collet 6 only by the vacuum suction force of the collet 6 without pushing up the push-up pin. Since the adhesive force of the wrap film 2 on which the electronic component is placed is lower than that of the conventional one, it is not necessary to push up the push-up pin from the back surface of the electronic component 1a, and the electronic component 1a can be moved to the intermediate regulation position by suction. Alternatively, it can be transported into the manufacturing process. Therefore, it is possible to improve reliability without damaging the electronic component 1a, and it is not necessary to adjust the push-up pin, which improves productivity. Also, multiple fixed plates
By using the rotatable turntable 4 on which 3 is installed,
It is possible to reduce the charge supply cycle,
No need to supply child parts.

FIG. 3 shows a modification of the first embodiment. As shown in FIG. 3, the wrap film 2 and the fixing plate 3
The elastic body 31 is sandwiched between and to be in close contact with each other. With such a structure, the wrap film 2 is more closely attached to the irregularities on the back surface of the electronic component 1a, and the adhesive area is increased, so that the electronic component 1a is less likely to drop. The material of the elastic body 31 is not particularly limited as long as it has elasticity, and is rubber in this embodiment. Other configurations are similar to those of the first embodiment,
The same members are designated by the same reference numerals and the description thereof is omitted.

[0024]

[0025]

FIG . 5 is a conceptual diagram showing a manufacturing apparatus used in combination with the above embodiment. The electronic component device is a semiconductor device as an example. In FIG. 5, 51 is a supply reel, 52 is a die bonding device, 57 is a wire bonding device, 53 is a sealing device, 59 is a gate cutting device, and 60 is a take-up reel. The die bonding device 52 supplies an adhesive to the die pad portion of the lead frame 8 to fix the semiconductor element, which is an electronic component, to the die pad portion. The wire bonding device 57 connects the electrode portion of the electronic component and the inner lead. The sealing device 53 seals the electronic component after wire bonding with resin. The gate cutting device 59 cuts the gate formed in the resin supply groove at the time of sealing. Reference numeral 54 denotes a coupling heater, which controls the temperature to an optimum temperature for hardening the paste or cooling the solder in the die bonding apparatus, and controls the optimum bonding temperature for the wire and the electrode portion of the electronic component in the wire bonding apparatus. 5
Reference numeral 5 is a front transport mechanism, and 58 is a rear transport mechanism. Reference numeral 56 denotes a buffer, which allows the lead frame 8 to flex and absorb the difference in the feed amount generated between the front transport mechanism 55 and the rear transport mechanism 58. A slack amount of the buffer 56 is detected by a sensor, and when the slack amount reaches a predetermined length, the transport mechanisms 55 and 58 operate.

In the manufacturing apparatus configured as described above, the continuous lead frame 8 is wound around the supply reel 51, and from this supply reel 51, the die bonding device 52, the wire bonding device 57, the sealing device 53, and the gate cutting device 59. The lead frame 8 is supplied to the supply path 7 (FIG. 1) passing through each device of FIG.
The unnecessary portion of the above is wound on the winding reel 60. Thus, there is particularly effective because the do not require manipulation or material supply equipment to the lead frame 8 is wound completely, in terms of prolonged non-stop facilities.

[0028]

According to the method of manufacturing an electronic component device according to the first aspect of the present invention, the electronic component is prevented from dropping and moving with time by keeping contact with the back surface of the electronic component. Prepare a wrap film that has a smaller adhesive force than the suction force at the time of suction, fix the wrap film on a flat surface, and place the electronic component on it.
Since this electronic component is adsorbed in a state of being in close contact with the wrap film, the electronic component can be conveyed to the intermediate setting position or in the manufacturing process only by adsorption without pushing up with a push-up pin as in the past. Therefore, the reliability can be improved without damaging the electronic parts, and the adjustment of the push-up pin is unnecessary, so that the productivity is improved. In addition, multiple wrap films
It is fixed around the horizontal axis and fixed at a predetermined position.
After picking up and transporting all electronic components present on the surface plate,
Rotate the fixed plate of the
Since the child parts are suctioned and transported, the material supply cycle is reduced.
Can be used for a certain period of time, making it difficult to supply electronic components.
It will be important.

[0029]

[0030]

According to the second aspect of the present invention , the electronic component is placed on the wrap film, and the wrap film is kept in contact with the back surface of the electronic component to drop the electronic component. Also, it prevents the position movement over time and has an adhesive force that is smaller than the suction force when picking up electronic components. Alternatively, it can be transported into the manufacturing process. Therefore, the reliability can be improved without damaging the electronic parts, and the adjustment of the push-up pin is unnecessary, so that the productivity is improved. Also, fixed in place
After picking up and transporting all electronic components present on the board,
Rotate the fixed plate to a predetermined position to move the electrons on this fixed plate.
Parts can be picked up and transported. For this reason,
The feeding cycle can be reduced and the electronic part
There is no need for product supply work. In addition, it picks up and carries electronic components.
While sending, remove the fixing plate with no electronic components
It is possible to install a fixed plate with electronic components
Therefore, it is necessary to interrupt the operation of the equipment to supply the material.
Disappears.

[0032]

[0033]

[0034]

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component device manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the first embodiment of the present invention when sucking an electronic component.

FIG. 3 is an enlarged cross-sectional view of a modified example of the first embodiment of the present invention when sucking an electronic component.

FIG. 4 is a front view of the electronic component fixing device according to the first embodiment of the present invention.

FIG. 5 is a conceptual diagram of a manufacturing apparatus used in combination with the first embodiment .

FIG. 6 is a perspective view showing a supply form of electronic components in a conventional example.

FIG. 7 is an enlarged cross-sectional view of a conventional example when sucking an electronic component.

[Explanation of symbols]

1a, 1b, 1c Electronic parts 2 wrap film 3,3a, 3b Fixed plate 4 turntable 5 motor 6 nozzles 7 Lead frame supply path 8 lead frame 9 Die pad part 10 Toride 11 Ball screw 21 Suction pad 31 rubber 41 Fixed claw 42 bracket 43 mounts 51 supply reel 60 take-up reel 52 Die bonder 53 Sealing device 54 heater 55 Front transport mechanism 56 buffers 57 Wire bonder 58 Rear transport mechanism 59 Gate cutting device

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsuguo Murayama 1-1 Sachimachi, Takatsuki City, Osaka Prefecture Matsushita Electronics Co., Ltd. (72) Inventor Zenichiro Tabuchi 1-1, Sachimachi Takatsuki City, Osaka Matsushita Electronic Industry Co., Ltd. (72) Inventor Koji Masui 1-1, Sachimachi, Takatsuki City, Osaka Prefecture Matsushita Electronics Co., Ltd. (56) References JP-A-5-293795 (JP, A) (58) Survey Areas (Int.Cl. ⁷ , DB name) H01L 21/52

Claims (2)

(57) [Claims] 1. A method of manufacturing an electronic component device, comprising: arranging electronic components on a plane; then sucking and transporting the electronic components; and supplying the electronic components to an intermediate regulation position or in a manufacturing process, the back surface of the electronic components. Prevents the electronic component from falling and moving with time by maintaining contact with the lap film, and prepares a wrap film having an adhesive force smaller than the suction force when sucking the electronic component . Solid
It is fixed to a fixed plate and is arranged around the horizontal axis.
The electronic component is placed on Ppufirumu and adsorbs the electronic component in a state of close contact with the wrap film together
To absorb all electronic components that are present on the fixed plate in place.
After mounting and transporting, the other fixed plate is rotated to the specified position.
A method of manufacturing an electronic component device, characterized in that the electronic component on the fixing plate is sucked and conveyed . 2. A manufacturing apparatus for an electronic component device, which adsorbs and conveys electronic components arranged on a plane and supplies them to an intermediate regulation position or in a manufacturing process, by maintaining contact with the back surface of the electronic component. A wrap film that prevents the electronic component from dropping and moving with time, and has an adhesive force that is smaller than the suction force when sucking the electronic component ;
With a turntable that can rotate around a horizontal axis by a mechanism
However, a plurality of fixing plates that fix the wrap film are
An electronic component device manufacturing apparatus, which is detachably attached to a rotary table .