JPH1145906A - Part mounter - Google Patents

Part mounter

Info

Publication number
JPH1145906A
JPH1145906A JP9215657A JP21565797A JPH1145906A JP H1145906 A JPH1145906 A JP H1145906A JP 9215657 A JP9215657 A JP 9215657A JP 21565797 A JP21565797 A JP 21565797A JP H1145906 A JPH1145906 A JP H1145906A
Authority
JP
Japan
Prior art keywords
component
flip chip
mounting
adhesive sheet
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9215657A
Other languages
Japanese (ja)
Inventor
Toshinobu Kokatsu
俊亘 小勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9215657A priority Critical patent/JPH1145906A/en
Publication of JPH1145906A publication Critical patent/JPH1145906A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To shorten the time required for mounting a flip chip while protecting the flip chip and a bump against damage and preventing the flip chip from falling in transportation by mounting a removed part onto an object to be mounted while keeping one side of the part to face the earth. SOLUTION: When a push needle 14 is lowered while vacuum sucking an adhesive sheet 113 bonded with a flip chip 115, the flip chip 115 is stripped from the adhesive sheet 113 and fed onto a positioning stage 20. The flip chip 115 is secured on the positioning stage 20 by vacuum suction through a chip suction hole and moved, under that state, by a moving stage to the feeding position for a mounting head 151. The flip chip 115 is subjected, at that position, to positional correction by an XYθ moving mechanism 22 before being delivered to the mount head 151. The mounting head 151 performs mounting onto an object to be mounted previously set on a mount stage 150.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、部品実装装置に係
り、特にウエハを粘着シートに一時固定した状態から、
所望の箇所を引き剥がしフリップチップ（部品）として
被実装物に実装する部品実装装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus in which a wafer is temporarily fixed to an adhesive sheet.
The present invention relates to a component mounting apparatus that peels a desired portion and mounts the flip chip (component) on an object to be mounted.

【０００２】[0002]

【従来の技術】半導体チップの一種として、半導体チッ
プの表面にバンプ（突出電極）を形成してなるフリップ
チップが知られている。フリップチップは、バンプを被
実装物であるプリント基板等の回路パターンの電極に、
ボンディングすることにより実装される。従来のフリッ
プチップ実装装置の概略構成およびその動作を、図４お
よび図５を用いて説明する。図４は従来のフリップチッ
プ実装装置ＦＪの斜視図であり、図５は該フリップチッ
プ実装装置ＦＪの動作過程を示す図である。2. Description of the Related Art As one type of semiconductor chip, a flip chip in which bumps (protruding electrodes) are formed on the surface of a semiconductor chip is known. Flip chips use bumps on circuit pattern electrodes such as printed circuit boards that are objects to be mounted.
It is implemented by bonding. The schematic configuration and operation of a conventional flip chip mounting apparatus will be described with reference to FIGS. FIG. 4 is a perspective view of a conventional flip chip mounting apparatus FJ, and FIG. 5 is a view showing an operation process of the flip chip mounting apparatus FJ.

【０００３】図４，図５に示すように、フリップチップ
実装装置ＦＪは、次に説明するウエハリング１１４等を
支持するウエハリング支持部１１０と、該ウエハリング
支持部１１０をＸＹ方向に移動するウエハリング支持部
移動機構１２０と、次に説明する突上針１３５を上下動
させる突上針上下動部１３０とを備えている。ウエハリ
ング支持部１１０は、ウエハリング１１４を支持するウ
エハリングホルダ１１１と、該ホルダ１１１が固定され
次に説明するＸ方向移動機構１２１上を移動する基部１
１２と、フリップチップを粘着一時固定するチップ粘着
シート１１３を保持するウエハリング１１４等により構
成されている。As shown in FIGS. 4 and 5, a flip-chip mounting apparatus FJ moves a wafer ring support 110 in the XY directions, and a wafer ring support 110 for supporting a wafer ring 114 described below. It includes a wafering support unit moving mechanism 120 and a push-up needle up / down moving unit 130 for vertically moving a push-up needle 135 described below. The wafer ring support 110 includes a wafer ring holder 111 that supports a wafer ring 114, and a base 1 to which the holder 111 is fixed and moves on an X-direction moving mechanism 121 described below.
12 and a wafer ring 114 for holding a chip adhesive sheet 113 for temporarily fixing a flip chip.

【０００４】該粘着シート１１３の上面には（図５の右
上参照）、フリップチップ１１５が粘着材により一時固
定され、該フリップチップ１１５はバンプ１１５ａが形
成された回路形成面１１５ｂが上を向くように配置され
ている。ウエハリングホルダ１１１にはウエハリング１
１４が支持され、該ウエハリング１１４には、粘着シー
ト１１３がウエハリング保持部材１１６により引き延ば
された状態で固定されている。前記ウエハリング支持部
移動機構１２０は、前述のＸ方向移動機構１２１と、該
Ｘ方向移動機構１２１を支持する支持ブロック１２２
と、該支持ブロック１２２をＹ方向に移動するＹ方向移
動機構１２３とを備えている。On the upper surface of the adhesive sheet 113 (see the upper right of FIG. 5), a flip chip 115 is temporarily fixed by an adhesive, and the flip chip 115 is oriented such that a circuit forming surface 115b on which a bump 115a is formed faces upward. Are located in The wafer ring 1 is placed in the wafer ring holder 111.
The pressure-sensitive adhesive sheet 113 is fixed to the wafer ring 114 while being stretched by a wafer ring holding member 116. The wafering support moving mechanism 120 includes the X-direction moving mechanism 121 and a support block 122 that supports the X-direction moving mechanism 121.
And a Y-direction moving mechanism 123 that moves the support block 122 in the Y-direction.

【０００５】前記突上針上下動部１３０は、次に説明す
る真空吸着用の真空を発生する真空発生器１３１と、ウ
エハリング１１４の交換時等に次に説明する突上針ホル
ダ１３２を上下させる突上針ホルダ上下移動機構１３３
と、突上針１３５を上下動させる突上針上下移動機構１
３６を備えている。前記突上針ホルダ１３２は、粘着シ
ート１１３を吸着するための真空吸着用のシート吸着孔
１３４を備え、該シート吸着孔１３４の内部に上下に移
動可能な突上針１３５を備えている。[0005] The push-up needle vertically moving section 130 holds a vacuum generator 131 for generating a vacuum for vacuum suction described below and a push-up needle holder 132 described below when the wafer ring 114 is replaced or the like. Raising needle holder vertical moving mechanism 133
Needle raising and lowering mechanism 1 for vertically moving the needle 135
36. The push-up needle holder 132 has a sheet suction hole 134 for vacuum suction for sucking the adhesive sheet 113, and has a push-up needle 135 that can move up and down inside the sheet suction hole 134.

【０００６】また、フリップチップ実装装置ＦＪは、図
５の右上方に示すフリップチップ１１５をピックアップ
して１８０°反転ヘッド１４０へ渡す供給ヘッド１４１
と、前記反転ヘッド１４０に渡されたフリップチップ１
１５を、該反転ヘッド１４０と一体に１８０°反転させ
る１８０°反転機構１４２と、反転して供給されたフリ
ップチップ１１５を再度位置補正するための位置決めス
テージ１４３と、該位置決めステージ１４３上のフリッ
プチップ１１５をＸＹθ方向に移動させて位置決めを行
うＸＹθ移動機構１４４と、位置決めされたフリップチ
ップ１１５をマウントステージ１５０に搬送し、リード
フレーム，セラミック基板等の被実装物１５２にマウン
トを行うマウントヘッド１５１とを備えている。Further, the flip chip mounting apparatus FJ picks up the flip chip 115 shown at the upper right of FIG.
And the flip chip 1 passed to the reversing head 140
15 is integrated with the reversing head 140 by 180 °, a 180 ° reversing mechanism 142, a positioning stage 143 for correcting the position of the flip chip 115 supplied by reversing, and a flip chip on the positioning stage 143. An XYθ moving mechanism 144 for moving the 115 in the XYθ direction for positioning, a mount head 151 for transporting the positioned flip chip 115 to the mount stage 150 and mounting it on a mounting object 152 such as a lead frame or a ceramic substrate. It has.

【０００７】次に動作を説明する。予め突上針上下移動
機構１３６等は所定位置に固定されている。この状態で
ウエハリング支持部移動機構１２０の動作によりウエハ
リング１１４等が移動され、マウントしようとするフリ
ップチップ１１５の真下に突上針１３５が位置するよう
にされる。次いで、シート吸着孔１３４を介する真空吸
着により、ピックアップしようとするフリップチップの
周囲の粘着シート１１３を吸着した状態で、突上針１３
５を突上針上下移動機構１３６により上昇させる。フリ
ップチップ１１５は突上針先端により突き上げられる
と、フリップチップの周辺部より順に粘着シート１１３
から剥がされ、供給ヘッド１４１によって吸着される。Next, the operation will be described. The push-up needle vertical movement mechanism 136 and the like are fixed at a predetermined position in advance. In this state, the wafer ring 114 and the like are moved by the operation of the wafer ring support moving mechanism 120 so that the protrusion needle 135 is positioned directly below the flip chip 115 to be mounted. Next, in a state where the pressure-sensitive adhesive sheet 113 around the flip chip to be picked up is sucked by vacuum suction through the sheet suction hole 134,
5 is raised by the push-up needle vertical movement mechanism 136. When the flip chip 115 is pushed up by the tip of the rising needle, the adhesive sheet 113 is sequentially arranged from the periphery of the flip chip.
And is sucked by the supply head 141.

【０００８】吸着されたフリップチップ１１５は、供給
ヘッド１４１により１８０°反転ヘッド１４０に渡され
（図５において一点鎖線で示した状態のヘッド１４
０）、１８０°反転機構１４２によって反転された後、
位置決めステージ１４３へフリップチップ１１５が供給
される。この位置決めステージ１４３上でフリップチッ
プの位置補正がＸＹθ移動機構１４４によって行なわれ
る。次いで、位置補正されたフリップチップ１１５は、
マウントヘッド１５１によりマウントステージ１５０上
に予めセットされている被実装物１５２に対してマウン
トが行なわれる。以上に説明した従来例に類似の装置と
して、例えば特開平８−１５０２３０号公報が知られて
いる。The sucked flip chip 115 is transferred to the 180 ° reversing head 140 by the supply head 141 (the head 14 in a state shown by a dashed line in FIG. 5).
0), after being inverted by the 180 ° inversion mechanism 142,
The flip chip 115 is supplied to the positioning stage 143. The position of the flip chip is corrected on the positioning stage 143 by the XYθ moving mechanism 144. Next, the position-corrected flip chip 115 is
The mount 152 is mounted on the mounted object 152 set in advance on the mount stage 150 by the mount head 151. As an apparatus similar to the conventional example described above, for example, Japanese Patent Application Laid-Open No. 8-150230 is known.

【０００９】[0009]

【発明が解決しょうとする課題】しかしながら、従来の
フリップチップ実装装置は、フリップチップをウエハか
ら取り外して被実装物にマウントするまでの受け渡し工
程が複雑なため、次のような不都合があった。即ち、フ
リップチップおよび該フリップチップに形成されたバン
プ等を損傷させるおそれがあり、また、フリップチップ
を被実装物に供給するまでに時間が掛かかるので作業効
率が悪く、更に、フリップチップの搬送途上でフリップ
チップを落下させるおそれがあった。However, the conventional flip-chip mounting apparatus has the following inconvenience because the delivery process from removing the flip chip from the wafer to mounting the flip chip on a mounting object is complicated. That is, there is a possibility that the flip chip and bumps formed on the flip chip may be damaged, and it takes time to supply the flip chip to the object to be mounted. There is a possibility that the flip chip may drop on the way.

【００１０】そこで、本発明の目的は、フリップチップ
（部品）とフリップチップに形成されたバンプを損傷さ
せず、搬送途上でフリップチップを落下させず、フリッ
プチップの実装に要する作業時間を短縮したフリップチ
ップ（部品）実装装置を提供することである。It is an object of the present invention to reduce the work time required for mounting the flip chip without damaging the flip chip (part) and the bump formed on the flip chip, not dropping the flip chip during transportation. An object of the present invention is to provide a flip chip (component) mounting device.

【００１１】[0011]

【課題を解決するための手段】前記課題を解決するため
に請求項１記載の発明は、部品が一時固定された部品支
持部材から該部品を取り外す部品取外手段と、該部品取
外手段が取り外した部品を、該部品の大地に対する一の
面を維持したまま被実装物に実装する実装手段とを備え
たことを特徴とする。このようにすれば、部品は大地に
対して一の面を維持したままで、被実装物に実装される
ので、途中の工程で部品の反転がなく、部品が損傷や落
下されず、作業時間が短縮される。In order to solve the above-mentioned problems, according to the present invention, there is provided a component removing means for removing a component from a component supporting member to which a component is temporarily fixed, and the component removing means comprises: Mounting means for mounting the removed component on a mounting object while maintaining one surface of the component with respect to the ground. In this way, the component is mounted on the mounting object while maintaining one surface with respect to the ground, so that the component does not turn over in the middle of the process, the component is not damaged or dropped, and the working time is reduced. Is shortened.

【００１２】[0012]

【発明の実施の形態】以下、本発明を図示の実施形態例
に基づいて説明する。なお、既に説明した部分と同等部
分には同一符号を付し、重複記載を省略する。図１は本
実施形態例のフリップチップ実装装置ＦＪ1 の斜視図、
図２は該フリップチップ実装装置ＦＪ1 の動作を示す
図、図３は該フリップチップ実装装置ＦＪ1 の要部の詳
細断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. The same parts as those already described are denoted by the same reference numerals, and redundant description will be omitted. FIG. 1 is a perspective view of a flip chip mounting apparatus FJ1 of the embodiment,
FIG. 2 is a view showing the operation of the flip-chip mounting apparatus FJ1, and FIG. 3 is a detailed sectional view of a main part of the flip-chip mounting apparatus FJ1.

【００１３】図１〜図３に示すように、フリップチップ
実装装置ＦＪI は、次に説明する突下針１４を備え上下
に移動する突下針上下移動機構１０と、ウエハリング支
持部１１０Ａと、ウエハリング支持部移動機構１２０
と、次に説明する位置決めステージ２０と、該位置決め
ステージ２０を移動する移動ステージ３０とを備えてい
る。突下針上下移動機構１０は、次に説明する第１円筒
１１と、密閉プレート１７等により構成されている。As shown in FIGS. 1 to 3, the flip chip mounting apparatus FJI includes a push-down needle vertical movement mechanism 10 having a push-down needle 14 described below, which moves up and down, a wafering support section 110A, Wafering support moving mechanism 120
And a positioning stage 20 described below, and a moving stage 30 for moving the positioning stage 20. The push-down needle vertical movement mechanism 10 includes a first cylinder 11 described below, a sealing plate 17, and the like.

【００１４】前記第１円筒１１はウエハリングホルダ１
１１Ａの上方に配置され、該第１円筒１１の内部に第２
円筒１２を備えている（図３参照）。該第２円筒１２の
内部にはフリップチップの周辺部を吸着するチップ吸着
孔１３が形成され、該吸着孔１３の内部にはフリップチ
ップを下方に突き下げる突下針１４が配置されている。
第１円筒１１の内側と第２円筒１２の外側との間には吸
着シート１１３を吸着するシート吸着孔１５が形成され
ている。前記第２円筒１２の先端部には、次に説明する
ようにウエハリング１１４の略下端面の位置まで突上針
ホルダ１２ａが形成されている。The first cylinder 11 is a wafer ring holder 1
11A, and a second cylinder 11 is provided inside the first cylinder 11.
A cylinder 12 is provided (see FIG. 3). A chip suction hole 13 for sucking a peripheral portion of the flip chip is formed inside the second cylinder 12, and a push-down needle 14 for pushing the flip chip downward is arranged inside the suction hole 13.
A sheet suction hole 15 for sucking the suction sheet 113 is formed between the inside of the first cylinder 11 and the outside of the second cylinder 12. A protruding needle holder 12a is formed at the distal end of the second cylinder 12 to a position substantially at the lower end surface of the wafer ring 114, as described below.

【００１５】第１円筒１１の下面には円板状の密閉プレ
ート１７が固定され、突下針上下移動機構１０が下方に
移動したときに、該プレート１７はウエハリングホルダ
１１１Ａの上面に当接される（図３に示した状態）。前
記シート吸着孔１５は密閉プレート１７を貫通して形成
されている。ウエハリングホルダ１１１Ａの下面には粘
着シート１１３が張り付けられたウエハリング１１４
が、ウエハリング保持部材１８により保持されている。
前記ウエハリングホルダ１１１Ａは、その上下両面に真
空吸着の効率を上げるためのゴムパッキン１９を備えて
いる。A disk-shaped sealing plate 17 is fixed to the lower surface of the first cylinder 11, and the plate 17 comes into contact with the upper surface of the wafer ring holder 111A when the push-down needle vertical movement mechanism 10 moves downward. (The state shown in FIG. 3). The sheet suction holes 15 are formed through the sealing plate 17. Wafer ring 114 with adhesive sheet 113 stuck to the lower surface of wafer ring holder 111A
Are held by the wafering holding member 18.
The wafer ring holder 111A is provided with rubber packings 19 on both upper and lower surfaces thereof to increase the efficiency of vacuum suction.

【００１６】前記粘着シート１１３にはバンプ１１５ａ
が形成されダイシングを行ったウエハ（フリップチッ
プ）が、回路形成面１１５ｂを下に向けて接着されてい
る。前記ウエハリングホルダ１１１Ａの下方には、位置
決めステージ２０が配置され、該ステージ２０は、粘着
シート１１３から突下針１４により引き剥がされたフリ
ップチップ１１５を、被実装物１５２（図２参照）に実
装する前にＸＹθ方向への位置決めを行うＸＹθ移動機
構２２を備えている。また、移動ステージ３０は、位置
決めステージ２０がウエハリングよりフリップチップ１
１５の供給を受ける位置と、マウントヘッド１５１へフ
リップチップを渡す位置との間を移動するステージであ
る。The adhesive sheet 113 has bumps 115a.
Is formed, and the diced wafer (flip chip) is bonded with the circuit forming surface 115b facing downward. A positioning stage 20 is disposed below the wafering holder 111A. The positioning stage 20 transfers the flip chip 115 peeled off from the adhesive sheet 113 by the push-down needle 14 to the mounting object 152 (see FIG. 2). An XYθ moving mechanism 22 for positioning in the XYθ direction before mounting is provided. In addition, the moving stage 30 is configured such that the positioning stage 20 is a flip chip 1 from the wafer ring.
15 is a stage that moves between a position where the flip chip 15 is supplied and a position where the flip chip is transferred to the mount head 151.

【００１７】次に本実施形態例の動作を説明する。フリ
ップチップ１１５は、回路形成面１１５ｂの逆の面が粘
着シート１１３に接着されて、また、位置決めステージ
２０は所定位置に停止されている。この状態で、先ず、
ウエハリング支持部移動機構１２０の動作によりウエハ
リング支持部１１０Ａが移動され、剥がそうとするフリ
ップチップが突下針上下移動機構１０の下の所定位置に
到達するように位置決めがされる。次いで、密閉プレー
ト１７が下降され、ゴムパッキン１９を介してウエハリ
ングホルダ１１１Ａに密着されると、密閉プレート１
７，粘着シート１１３，ウエハリング１１４等により形
成される空間部Ｋ（図３参照）が密閉される。この密閉
状態で、図示しない吸引真空機の作動により、粘着シー
ト１１３が弛まない程度に吸引が行なわれる。Next, the operation of this embodiment will be described. The flip chip 115 has a surface opposite to the circuit forming surface 115b adhered to the adhesive sheet 113, and the positioning stage 20 is stopped at a predetermined position. In this state,
The wafer ring support 110A is moved by the operation of the wafer ring support moving mechanism 120, and the flip chip to be peeled is positioned so as to reach a predetermined position below the push-down needle vertical movement mechanism 10. Next, when the sealing plate 17 is lowered and brought into close contact with the wafer ring holder 111A via the rubber packing 19, the sealing plate 1
7, a space K (see FIG. 3) formed by the adhesive sheet 113, the wafer ring 114, and the like is sealed. In this sealed state, suction is performed by the operation of a suction vacuum machine (not shown) to such an extent that the adhesive sheet 113 does not loosen.

【００１８】更に、フリップチップの周辺部は、突下針
ホルダ１２ａの下端面により粘着シート１１３が支えら
れながら、チップ周辺部吸着孔１３を介して真空吸着が
行なわれる（矢印で示す）。この状態で突下針１４が下
降されるとフリップチップ１１５が粘着シート１１３か
ら引き剥がされ、位置決めステージ２０へ供給される。
位置決めステージ２０ではチップ吸着孔２１を介した真
空吸着によりフリップチップが固定された状態となり、
この状態で移動ステージ３０によりマウントヘッド１５
１への供給位置へと移動される。この位置でフリップチ
ップの位置補正をＸＹθ移動機構２２により行った後、
マウントヘッド１５１に渡される。そして、マウントヘ
ッド１５１は、予めマウントステージ１５０上に載置さ
れたリードフレーム，セラミック基板等の被実装物に実
装を行う。Further, the peripheral portion of the flip chip is vacuum-sucked through the chip-peripheral suction hole 13 while the adhesive sheet 113 is supported by the lower end surface of the push-down needle holder 12a (indicated by an arrow). When the push-down needle 14 is lowered in this state, the flip chip 115 is peeled off from the adhesive sheet 113 and supplied to the positioning stage 20.
In the positioning stage 20, the flip chip is fixed by vacuum suction through the chip suction hole 21,
In this state, the mount stage 15 is moved by the moving stage 30.
1 to the feed position. After the position of the flip chip is corrected at this position by the XYθ moving mechanism 22,
It is passed to the mount head 151. Then, the mount head 151 performs mounting on an object to be mounted such as a lead frame, a ceramic substrate, or the like, which is mounted on the mount stage 150 in advance.

【００１９】本実施形態例の図２と従来例の図５を比較
すれば明らかなように、フリップチップを１８０°反転
する工程を削除されている。なお、本実施形態例ではフ
リップチップを実装するフリップチップ実装装置の場合
について説明したが、フリップチップ以外の小型部品に
対しも本発明を適用できるのは勿論である。As is clear from comparison between FIG. 2 of the present embodiment and FIG. 5 of the conventional example, the step of inverting the flip chip by 180 ° is omitted. In the present embodiment, the case of the flip chip mounting apparatus for mounting the flip chip has been described, but the present invention can of course be applied to small components other than the flip chip.

【発明の効果】以上説明したように本発明によれば、フ
リップチップ（部品）とフリップチップに形成されたバ
ンプを損傷させず、搬送途上でフリップチップを落下さ
せず、フリップチップの実装に要する作業時間を短縮し
た部品実装装置を提供することができる。As described above, according to the present invention, the flip chip (parts) and the bumps formed on the flip chip are not damaged, the flip chip is not dropped during the transportation, and the flip chip is required to be mounted. It is possible to provide a component mounting apparatus in which operation time is reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施形態例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.

【図２】同実施形態例の動作を示す図である。FIG. 2 is a diagram showing an operation of the embodiment.

【図３】同実施形態例の要部の拡大断面図である。FIG. 3 is an enlarged sectional view of a main part of the embodiment.

【図４】従来のフリップチップ実装装置の斜視図であ
る。FIG. 4 is a perspective view of a conventional flip chip mounting apparatus.

【図５】従来のフリップチップ実装装置の動作を示す図
である。FIG. 5 is a diagram showing an operation of a conventional flip chip mounting apparatus.

【符号の説明】[Explanation of symbols]

Ｋ 密閉空間 １０ 突下針上下移動機構 １１ 第１円筒 １２ 第２円筒 １２ａ 突下針ホルダ １３ チップ周辺孔 １４ 突下針 １５ シート吸着孔 １７ 密閉プレート １８ ウエハリング保持部材 １９ パッキン ２０ 位置決めステージ ３０ 移動ステージ １１０Ａ ウエハリング支持部 １１１Ａ ウエハリングホルダ １１３ 粘着シート １１４ ウエハリング １１５ フリップチップ １１５ａ バンプ １１５ｂ 回路形成面 １２０ ウエハリング支持部移動機構 １５２ 被実装物 K Closed space 10 Push-down needle vertical movement mechanism 11 First cylinder 12 Second cylinder 12a Push-down needle holder 13 Tip peripheral hole 14 Push-down needle 15 Sheet suction hole 17 Sealing plate 18 Wafer ring holding member 19 Packing 20 Positioning stage 30 Movement Stage 110A Wafer ring support 111A Wafer ring holder 113 Adhesive sheet 114 Wafer ring 115 Flip chip 115a Bump 115b Circuit formation surface 120 Wafer ring support moving mechanism 152 Mounted object

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 部品が一時固定された部品支持部材から
該部品を取り外す部品取外手段と、 該部品取外手段が取り外した部品を、該部品の大地に対
する一の面を維持したまま被実装物に実装する実装手段
とを備えたことを特徴とする部品実装装置。1. A component removing means for removing a component from a component supporting member to which a component is temporarily fixed, and a component removed by the component removing means is mounted while maintaining one surface of the component with respect to the ground. A component mounting apparatus comprising: mounting means for mounting on a product. 【請求項２】 前記部品支持部材は、部品を下面側に支
持する粘着シートを備えてなり、 前記部品取外手段は、前記部品を大地に対して突き下げ
て前記粘着シートから引き剥がす突下針を備えてなり、 前記実装手段は、前記部品を実装する被実装物が予め配
置された位置まで搬送する搬送手段を備えてなることを
特徴とする請求項１記載の部品実装装置。2. The component supporting member includes an adhesive sheet that supports the component on a lower surface side, and the component removing unit pushes the component down to the ground and peels the component from the adhesive sheet. 2. The component mounting apparatus according to claim 1, further comprising a needle, wherein the mounting unit includes a conveying unit configured to convey a mounting object on which the component is mounted to a position where the mounting unit is arranged in advance. 【請求項３】 前記部品取外手段は、前記粘着シートと
該粘着シートを保持する粘着シート保持部材とがなす空
間を密閉する密閉部材と、 該密閉部材により形成された空間を真空吸引する真空吸
引手段とを備えたことを特徴とする請求項２記載の部品
実装装置。3. The component removing means includes: a sealing member that seals a space formed by the adhesive sheet and an adhesive sheet holding member that holds the adhesive sheet; and a vacuum that suctions a space formed by the sealing member. 3. The component mounting apparatus according to claim 2, further comprising a suction unit. 【請求項４】 前記搬送手段は、前記部品の位置補正を
行う位置補正手段を備えたことを特徴とする請求項２に
記載の部品実装装置。4. The component mounting apparatus according to claim 2, wherein the transport unit includes a position correcting unit that corrects a position of the component. 【請求項５】 前記部品は、ウエハを切断してなる半導
体チップであることを特徴とする請求項１乃至請求項４
のいずれかに記載の部品実装装置。5. The semiconductor device according to claim 1, wherein the component is a semiconductor chip obtained by cutting a wafer.
The component mounting apparatus according to any one of the above. 【請求項６】 前記半導体チップは、一方の面にバンプ
が形成され、他方の面に被実装物に実装される部品対向
面が形成された、フリップチップであることを特徴とす
る請求項５に記載の部品実装装置。6. The semiconductor chip according to claim 5, wherein the semiconductor chip is a flip chip in which a bump is formed on one surface and a component facing surface to be mounted on an object is formed on the other surface. A component mounting apparatus according to item 1.
JP9215657A 1997-07-25 1997-07-25 Part mounter Pending JPH1145906A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9215657A JPH1145906A (en) 1997-07-25 1997-07-25 Part mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9215657A JPH1145906A (en) 1997-07-25 1997-07-25 Part mounter

Publications (1)

Publication Number Publication Date
JPH1145906A true JPH1145906A (en) 1999-02-16

Family

ID=16676028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9215657A Pending JPH1145906A (en) 1997-07-25 1997-07-25 Part mounter

Country Status (1)

Country Link
JP (1) JPH1145906A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216937B1 (en) * 1999-12-22 2001-04-17 International Business Machines Corporation Process and apparatus to remove closely spaced chips on a multi-chip module
EP1191574A2 (en) * 2000-09-21 2002-03-27 Siemens Aktiengesellschaft Chip feeder and method for feeding semiconductor chips
JP2002313844A (en) * 2001-04-19 2002-10-25 Toray Eng Co Ltd Device for supplying chip and device for mounting chip

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216937B1 (en) * 1999-12-22 2001-04-17 International Business Machines Corporation Process and apparatus to remove closely spaced chips on a multi-chip module
EP1191574A2 (en) * 2000-09-21 2002-03-27 Siemens Aktiengesellschaft Chip feeder and method for feeding semiconductor chips
EP1191574A3 (en) * 2000-09-21 2004-06-09 Rohwedder Microtech GmbH & Co. KG Chip feeder and method for feeding semiconductor chips
JP2002313844A (en) * 2001-04-19 2002-10-25 Toray Eng Co Ltd Device for supplying chip and device for mounting chip
JP4544776B2 (en) * 2001-04-19 2010-09-15 東レエンジニアリング株式会社 Chip supply device and chip mounting device

Similar Documents

Publication Publication Date Title
JP4266106B2 (en) Adhesive tape peeling device, adhesive tape peeling method, semiconductor chip pickup device, semiconductor chip pickup method, and semiconductor device manufacturing method
JP4021614B2 (en) Semiconductor element pickup jig, semiconductor element pickup device, semiconductor element pickup method, semiconductor device manufacturing method, and semiconductor device manufacturing apparatus
JP5543812B2 (en) Adhesive tape application method and adhesive tape application device
KR101729335B1 (en) Method and apparatus for separating protective tape
CN107622955B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
TW201200447A (en) Workpiece transport method and workpiece transport device
JP2005175384A (en) Sticking method and peeling method of masking tape
JP2018160564A (en) Die bonding device and semiconductor device manufacturing method
TW201916225A (en) Element packaging device, element packaging method and element packaged substrate manufacturing method can simply and exactly pick up elements of multiple rows and columns
JP2010135436A (en) Apparatus for sticking adhesive tape to substrate
KR20140111581A (en) Collet cleaning method and die bonder using the same
JP4190611B2 (en) Component mounting method and component mounting apparatus
WO2003069660A1 (en) Plate-like object carrying mechanism and dicing device with carrying mechanism
WO1998012908A1 (en) Method and apparatus for packaging ic chip, and tape-shaped carrier to be used therefor
TWI758990B (en) Die bonding device and manufacturing method of semiconductor device
KR20210018090A (en) Method for forming protection member and apparatus for forming protection member
JPH1145906A (en) Part mounter
KR20160046732A (en) Method and apparatus for joining adhesive tape
JP2000022395A (en) Method and apparatus for mounting electronic component
JP2004193442A (en) Electronic component mounting apparatus
KR940002759B1 (en) Inner lead bonding apparatus
JP2002270628A (en) Bonding method and apparatus
JP3970732B2 (en) Joining method and apparatus
JP3552574B2 (en) Apparatus and method for mounting conductive ball
KR20190124149A (en) Method and apparatus for transporting adhesive tape