JP3411230B2 - Semiconductor manufacturing jig and semiconductor element mounting method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a semiconductor manufacturing jig contributing to the downsize of semiconductor elements and a method of mounting the semiconductor elements, using the jig. SOLUTION: A semiconductor manufacturing jig for gripping and carrying a square semiconductor element 101 has four grips having corners, corresponding to the side faces of the four corners of the element 101, so that the grips engage with the four corners. According to such a constitution, the top end of a collet 102 enters into facings at only the four corners of the element 101 and in the vicinity thereof and it suffices to consider only regions, corresponding to the four corners periphery of the element 101 where the top end of the collet 102 enters. Hence there is no need for forming larger facings over the entire periphery of the element 101, such as in prior art, the element 101 may be disposed nearer a pad 106 on a circuit board, and a semiconductor device can be greatly downsized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing jig and a semiconductor element mounting method using the same.

[0002]

2. Description of the Related Art A pyramid collet is known as a jig for holding and transferring a semiconductor element by suction or the like. This type of collet is shown, for example, in Japanese Utility Model Laid-Open No. 7-10940. In such a collet, a recess for adsorbing the semiconductor element is formed inside the collet, and the semiconductor element is adsorbed by creating a vacuum in the recess.

A method of mounting a semiconductor element on a substrate using such a collet will be described.

First, as shown in FIG. 2A, a semiconductor element 2 is divided into individual pieces from a semiconductor wafer by a known method.
01 is held using the collet 202. This holding is
This is performed by applying a vacuum to the inside of the recess 203 formed inside the collet 202. That is, the semiconductor element 201 is attracted to the collet 202 by applying a vacuum to the recess 203 through the hole 204 provided in the center of the collet.

Thereafter, the semiconductor element 203 is attached to the circuit board 2 while the semiconductor element 203 is adsorbed by the collet 202.
05 Transfer to above. The semiconductor element mounting region of the circuit board 205 is recessed by cutting the board to a predetermined depth (milling technique). This recess is called a counterbore 206. To fix the semiconductor element 206, an adhesive 207 is placed on the bottom of the counterbore 206 before the semiconductor element 201 is transferred. As shown in FIG. 2B, the semiconductor element 201 is transferred into the counterbore 206 and placed on the adhesive 207.

After the semiconductor element 201 is placed on the adhesive 207, the semiconductor element 201 is given a slight vibration (scrub) in order to bring the adhesive 207 into uniform contact with the back surface of the semiconductor element 201. , Semiconductor element 201
Are fixed to the circuit board 205.

After that, the electrode 208 on the semiconductor element 201 is formed.
And a pad 209 on the circuit board 205 are connected by a metal thin wire 210 such as gold. After that, the semiconductor element 201 and the like are sealed with a sealing material 211 such as a resin as shown in FIG. 2C, and the semiconductor device is completed.

[0008]

In recent years, semiconductor devices have been required to be smaller and smaller. For this miniaturization,
In addition to miniaturization of the semiconductor element, it is necessary to reduce the counterbore of the circuit board. That is, since the pads arranged on the circuit board are arranged apart from the counterbore by a predetermined distance as shown in FIG. 2C, if the counterbore cannot be reduced, the semiconductor device itself can be downsized. Can't hope

The counterbore 206 in the above-mentioned conventional example is
The size is determined in consideration of the size of the semiconductor element 201 and the size of the collet 202, but since the collet 202 is much larger than the semiconductor element 201 as shown in FIG. 3, the size of the counterbore depends on the size of the collet 202. Be dominated.

Since this type of collet 202 is a pyramid type, the tip of the collet 202 penetrates into the counterbore over the entire periphery of the semiconductor element as shown in the top view of FIG. 3 and the sectional view of FIG. . Therefore, it is necessary to set the size of the counterbore to be large considering the part where the collet enters. Pads 209 are arranged around the counterbore set to a larger size as shown in FIG. Therefore, miniaturization of the semiconductor device itself cannot be expected.

Even if only the counterbore is made small, the collet cannot enter the counterbore as shown in FIG. 5, so that the semiconductor element cannot be mounted on the circuit board.

In order to solve such a problem, it has been proposed to adsorb and transfer the circuit surface of the semiconductor element as disclosed in Japanese Patent Laid-Open No. 6-120269.
Such an approach may damage a part of the circuit surface.

[0013]

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing jig which can contribute to miniaturization of a semiconductor device and a semiconductor element mounting method using the same.

To achieve this object, a typical invention of the present invention is a semiconductor manufacturing jig for sandwiching and transferring a rectangular semiconductor element, which has corners corresponding to the side surfaces of the four corners of the semiconductor element. It has four gripping parts, and these gripping parts are engaged with the four corners.

In another typical invention of the present application, such a semiconductor manufacturing jig is used to sandwich the four corners of the semiconductor element and side surfaces in the vicinity thereof, and the side surfaces are transferred into a recess formed in an external substrate. After that, the semiconductor element mounting method is such that the semiconductor element is fixed to the bottom of the recess.

According to this structure, the tips of the collets enter the counterbore only at the four corners of the semiconductor element and in the vicinity thereof, so that the tips of the collets enter only in the areas corresponding to the four corners of the semiconductor element. Should be considered. Therefore, it is not necessary to form a large counterbore over the entire periphery of the semiconductor element as in the conventional example described above.

Therefore, the pads arranged on the circuit board and the semiconductor element can be arranged closer to each other than before. That is, the semiconductor device can be significantly downsized.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1A is a top view showing a step of placing a semiconductor element in the counterbore of a circuit board using the collet of the present invention, and FIG. 1B shows the main part of FIG. 1A. It is the fragmentary sectional view which expanded the part. 1 (A) and 1 (B), only the lower part of the collet is shown to facilitate understanding of the description. Only half of the overall view of the collet is shown in FIG.
Since the collet has a symmetrical shape, the omitted parts will be easily understood by referring to the illustrated parts and the description thereof.

First, similarly to the conventional example, a semiconductor element 101 divided into individual pieces from a semiconductor wafer is held using a collet 102. This gripping is performed by the grip portion 1 of the collet 102.
This is performed by sandwiching the four corners of the semiconductor element 101 and the side surfaces in the vicinity thereof from 02-1 to 102-4.

As shown in FIG. 6, the gripping portions 102-1 to 102-4 are supported by shafts 102-1A and 102-3A which are extendable from the main body of the collet 102. The shaft is expandable and contractable because the collet 102 can accommodate semiconductor elements of various sizes.
This is for surely sandwiching the semiconductor element by the grip portions 102-1 to 102-4.

The grip portion 102-1 at the tip of the collet 102
Reference numerals 104-2 to 104-2 have a rectangular shape so as to correspond to the four side surfaces of the semiconductor element 101. In this case, since the four corners of the semiconductor element 101 are substantially right angles, the gripping portion 1
The rectangular shapes 01-1 to 102-4 are also substantially right angles.

The semiconductor elements 101 are held by the gripping sections 102-1 to 102-4 by engaging the gripping sections 102-1 to 102-4 with the side surfaces of the four corners (each corner) of the semiconductor element 101. Be transferred.

After that, the semiconductor element 101 is sandwiched by the collet 102, and the semiconductor element 101 is mounted on the circuit board 1.
03.

The semiconductor element mounting region of the circuit board 103 has a recessed shape by grinding the substrate to a predetermined depth (milling technique). This recess is counterbore 1
Call 04. In order to fix the semiconductor element 101, an adhesive 105 is placed on the bottom of the counterbore 104 before the semiconductor element 101 is transferred. Counterbore 1
The semiconductor element 101 is transferred into the semiconductor device 04 and placed on the adhesive 105.

Here, in the collet 102 of the present invention, the only parts that enter the counterbore 104 are the gripping parts 102-1 to 102-4.

The gripping portions 102-1 to 102-4 are provided with counterbore 1 only at the four corners of the semiconductor element 101 and in the vicinity thereof.
Since it enters inside 04, it suffices to secure a region where the tip of the collet enters only in the regions corresponding to the four corners of the semiconductor element 101. That is, the counterbore 104 may be enlarged only around the four corners of the semiconductor element 101 to secure the entry regions 104-1 to 104-4.

Since it is not necessary to consider the entrance of the collet 102 except for the entrance areas 104-1 to 104-4, the size in which the semiconductor element 101 is stored is sufficient.

As described above, according to the present invention, it is not necessary to form a large counterbore over the entire periphery of the semiconductor element as in the conventional example described above. Therefore, the pad 106 arranged on the circuit board 103 and the semiconductor element 101 can be arranged closer to each other than before. That is, the size of the entire semiconductor device can be significantly reduced.

After the semiconductor element 101 is placed on the adhesive agent 105, the main axis 102X of the collet 102 vibrates slightly in order to bring the adhesive agent 105 into uniform contact with the back surface of the semiconductor element 101. As a result, weak vibration is transmitted to the semiconductor element 101, and the semiconductor element 201 is securely fixed to the circuit board 103.

After that, the electrodes on the semiconductor element 101 and the pads 106 on the circuit board 103 are connected by a fine metal wire such as gold. After that, the semiconductor element 101 and the like are sealed with a sealing material such as resin to complete the semiconductor device.

According to this structure, the tip of the collet enters the counterbore only at the four corners of the semiconductor element and in the vicinity thereof, so that the tip of the collet enters only in the areas corresponding to the four corners of the semiconductor element. Should be considered. Therefore, it is not necessary to form a large counterbore over the entire periphery of the semiconductor element as in the conventional example described above.

Therefore, the pads arranged on the circuit board and the semiconductor element can be arranged closer to each other than in the conventional case. That is, the semiconductor device can be significantly downsized.

In the above-described embodiment, after the semiconductor element 101 is placed on the adhesive 105, the grip portions 102-1 to 102-2 are provided.
-4 needs to be expanded outward to release the grip, and the gripping portions 102-1 to 102-4 need to be pulled out from the entry areas 104-1 to 104-4 of the counterbore 104. That is, the grip portions 102-1 to 102-4 once expand outward with respect to the semiconductor element 101 and then move upward.

Therefore, the entrance areas 104-1 to 104-4 must be formed in consideration of the outward expansion of the grip portions 102-1 to 102.4.

Therefore, in another embodiment of the present invention, as shown in FIG. 7, the suction holes 107 are provided inside the grip portions 102'-1 to 102'-4, that is, on the side in contact with the side surface of the semiconductor element 101. -1 to 107-4 (only the grippers 102'-3, 102'-4 are shown in FIG. 7).

The side surface of the semiconductor element 101 is sucked into a vacuum through the suction holes 107-1 to 107-4. That is, in the above-mentioned example, the semiconductor element is gripped only by sandwiching by the gripping portions 102-1 to 102-4, but here, vacuum suction is used instead of sandwiching. Vacuum suction is performed through a pipe formed inside a collet (not shown).

By utilizing such vacuum suction, the outward expansion of the gripping portions 102-1 to 102-4 can be suppressed to the minimum. In other words, if the suction is stopped, the gripping state is released, so even if the gripping part slightly expands outward due to the margin between the semiconductor element and the gripping part, the movement distance is extremely small. Is.

According to this structure, in addition to the effect obtained by the above-described embodiment, the counterbore is formed more easily than in the above-described embodiment, so that the manufacturing cost of the semiconductor device can be reduced.

Although the present invention has been described using illustrative embodiments, this description should not be taken in a limiting sense. Various modifications of this illustrative embodiment, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to this description. It is therefore contemplated that the appended claims will cover all such modifications or embodiments as fall within the true scope of the invention.

[0041]

According to the present invention, since the tip of the collet enters into the counterbore only at the four corners of the semiconductor element and in the vicinity thereof, the area where the tip of the collet enters only in the areas corresponding to the four corners of the semiconductor element. You should consider it. Therefore, it is not necessary to form a large counterbore over the entire periphery of the semiconductor element as in the conventional example described above.

Therefore, the pad and the semiconductor element arranged on the circuit board can be arranged closer to each other than in the conventional case. That is, the semiconductor device can be significantly downsized.

[Brief description of drawings]

FIG. 1 is a top view showing a step of placing a semiconductor element in a counterbore of a circuit board using a collet of the present invention, and an enlarged partial cross-sectional view of a main part of the top view.

FIG. 2 is a process sectional view illustrating a method of mounting a semiconductor element on a substrate using a conventional collet.

FIG. 3 is a top view for explaining the problems of the conventional collet.

FIG. 4 is a cross-sectional view illustrating a problem of a conventional collet.

FIG. 5 is a cross-sectional view for explaining a problem with a conventional collet.

FIG. 6 is a partial side view illustrating the overall configuration of the collet.

FIG. 7 is a partial cross-sectional view illustrating another embodiment of the present invention.

[Explanation of symbols]

101 Semiconductor element 102 collet 102-1 to 102-4 Collet grip 103 circuit board 104 counterbore 104-1 to 104-4 entry area 105 adhesive 106 pads

Claims (5)

(57) [Claims] 1. A square semiconductor device having four holding parts having corners corresponding to side faces of four corners, and the semiconductor device is sandwiched by engaging these holding parts with the four corners. In the semiconductor manufacturing jig to be transferred, the gripping portion has an opening at a position corresponding to a side surface of the semiconductor element, and the side surface of the semiconductor element is sucked through the opening to sandwich the semiconductor element. A semiconductor manufacturing jig. 2. A step of sandwiching the four corners of a rectangular semiconductor element having an integrated circuit formed on the surface and side surfaces in the vicinity thereof,
A semiconductor element, comprising: a step of transferring the semiconductor element into the recess formed in the external substrate while holding it; and a step of fixing the semiconductor element to the bottom of the recess after the transfer. How to implement. 3. An adhesive is introduced at the bottom of the recess,
Then, the semiconductor device is transferred onto the adhesive,
After that, the semiconductor element is fixed while the semiconductor element is fixed while vibrating the semiconductor element. 4. The semiconductor manufacturing jig used in the sandwiching step according to claim 2, has four gripping portions each having a corner portion that engages with the four corners of the rectangular semiconductor element. A semiconductor manufacturing jig, wherein the semiconductor element is sandwiched by bringing parts into contact with the four corners of the semiconductor element. 5. The semiconductor manufacturing jig according to claim 4, wherein the gripping portion has an opening at a position corresponding to the side surface of the semiconductor element, and the side surface of the semiconductor element is sucked through the opening. A semiconductor manufacturing jig characterized by sandwiching a semiconductor element.