JP3105630B2 - Antistatic multilayer sheet for circuit board and method of manufacturing circuit board - Google Patents
Antistatic multilayer sheet for circuit board and method of manufacturing circuit boardInfo
- Publication number
- JP3105630B2 JP3105630B2 JP04092187A JP9218792A JP3105630B2 JP 3105630 B2 JP3105630 B2 JP 3105630B2 JP 04092187 A JP04092187 A JP 04092187A JP 9218792 A JP9218792 A JP 9218792A JP 3105630 B2 JP3105630 B2 JP 3105630B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive sheet
- layer
- sheet
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、回路基板に形成され
た電子回路を、静電気から保護するための静電気防止多
層シートと回路基板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antistatic device for protecting an electronic circuit formed on a circuit board from static electricity.
The present invention relates to a method for manufacturing a layer sheet and a circuit board .
【０００２】[0002]
【従来の技術】従来、回路基板に形成された回路を静電
気から保護するには、図６に示すように、複雑な形状を
した回路パターン１に合わせて、回路基板２の表面の所
定の箇所を覆うように、導電性シート３を貼りつけてい
た。この導電シート３は、アルミ箔に粘着層が形成さ
れ、多層剥離シートの表面から所定の形状に切り取られ
た貼り付け部分を剥離して、回路基板２の表面に貼り付
けるものである。従って導電シート３は、貼り付ける箇
所の形に合わせて、非常に複雑な形状に形成され、しか
も、確実に所定の部分を覆う必要があるので、貼り付け
作業は、きわめて慎重に行なわなければならないもので
ある。2. Description of the Related Art Conventionally, in order to protect a circuit formed on a circuit board from static electricity, as shown in FIG. 6, a predetermined portion of the surface of a circuit board 2 is matched with a circuit pattern 1 having a complicated shape. The conductive sheet 3 was stuck so as to cover. The conductive sheet 3 is formed by forming an adhesive layer on an aluminum foil, peeling off an adhered portion cut into a predetermined shape from the surface of the multilayer peeling sheet, and affixing it to the surface of the circuit board 2. Therefore, the conductive sheet 3 must be formed in a very complicated shape in accordance with the shape of the place to be pasted, and furthermore, it is necessary to cover a predetermined portion with certainty. Things.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の技術の、導
電性シート３は、貼り付け箇所の形状に合わせて複雑な
形状に形成されているため、貼り付けの位置合わせ難し
く、人手で貼り付けを行なわなければならないので、貼
り付け作業がきわめて面倒であり、貼り付けに多くの時
間がかかるという問題があった。しかも、導電性シート
３が薄いと扱いにくいので、比較的厚い樹脂フィルム上
にアルミ箔を形成したものを用いていた。従って、回路
パターンとの間に形成される容量が小さく、電磁シール
ド効果が少ないという欠点もあった。Since the conductive sheet 3 of the above-mentioned prior art is formed in a complicated shape in accordance with the shape of the place to be pasted, it is difficult to position the pasting, and the pasting is performed manually. Therefore, there is a problem that the attaching operation is extremely troublesome, and it takes much time to attach. In addition, since the conductive sheet 3 is difficult to handle when it is thin, an aluminum foil formed on a relatively thick resin film is used. Accordingly, there is a disadvantage that the capacitance formed between the circuit pattern and the circuit pattern is small, and the electromagnetic shielding effect is small.
【０００４】この発明は、上記従来の技術の問題点に鑑
みて成されたもので、静電気防止多層シートを容易に正
確に貼り付けることができ、自動化も容易に可能である
静電気防止多層シートと回路基板の製造方法を提供する
ことを目的とする。[0004] The present invention has been made in view of the above-mentioned problems of the prior art, and can easily and accurately attach an antistatic multilayer sheet, and can easily be automated.
An object of the present invention is to provide a method for manufacturing an antistatic multilayer sheet and a circuit board .
【０００５】[0005]
【課題を解決するための手段】この発明は、回路基板の
表面の特定箇所を覆うように所定形状に形成された被覆
部が分離可能に形成された導電性シートを有し、この導
電性シートは樹脂フィルム層とアルミ層、及び表面に形
成された粘着層とからなり、全体形状が回路基板の所定
の形状に対応して形成された回路基板用静電気防止多層
シートである。According to the present invention, there is provided a conductive sheet having a cover formed in a predetermined shape so as to cover a specific portion of a surface of a circuit board, the cover being formed in a separable manner. Is an antistatic multilayer sheet for a circuit board, which comprises a resin film layer, an aluminum layer, and an adhesive layer formed on the surface, and has an overall shape corresponding to a predetermined shape of the circuit board.
【０００６】またこの発明は、絶縁基板の表面に形成さ
れた導電部と、この導電部の特定箇所を所定形状で覆っ
た導電性シートとを備え、この導電性シートはアルミ層
に粘着層が形成され、この粘着層により上記導電部に密
着している回路基板である。さらに、上記導電性シート
は、予め上記導電部の特定個所を覆うように打ち抜かれ
て形成され、上記絶縁基板の所定個所を覆わないように
透孔が形成されているものである。The present invention further includes a conductive portion formed on the surface of the insulating substrate, and a conductive sheet covering a specific portion of the conductive portion with a predetermined shape. The conductive sheet has an aluminum layer and an adhesive layer. The circuit board is formed and is in close contact with the conductive portion by the adhesive layer. Further, the conductive sheet is formed by punching in advance so as to cover a specific portion of the conductive portion, and a through hole is formed so as not to cover a predetermined portion of the insulating substrate.
【０００７】またこの発明は、回路基板の表面の特定箇
所を覆うように所定形状に形成された被覆部が分離可能
に形成された導電性シートと、この導電性シートの表面
に形成された粘着層と、この粘着層に対して少なくとも
上記被覆部が剥離可能な第一剥離層と、上記粘着層とは
導電性シートはさんで反対側の面に少なくとも上記被覆
部に対して剥離可能に貼り付けられた第二剥離層とを有
し、全体形状が回路基板の所定の形状に対応して形成さ
れた回路基板用静電気防止多層シートを用いて回路基板
に静電気防止シートを貼り付ける回路基板の製造方法で
ある。そして、上記第一剥離層のうち上記所定形状の被
覆部を覆った部分の第一剥離層を剥し、上記回路基板の
所定の基準位置に合わせて上記静電気防止多層シート全
体を上記回路基板表面に接触させるとともに、上記第一
剥離層を剥がし上記粘着層が露出した上記被覆部を上記
粘着層により上記回路基板に貼り付ける。この後、上記
静電気防止用多層シート全体を回路基板から引き離す
と、上記被覆部の導電性シートを残して上記第二剥離層
および上記被覆部位外の上記導電性シートが上記回路基
板から離れ、上記回路基板の特定箇所を上記導電性シー
トの被覆部で覆われるものである。According to another aspect of the present invention, there is provided a conductive sheet having a cover formed in a predetermined shape so as to cover a specific portion of a surface of a circuit board, the cover having a detachable shape, and an adhesive formed on a surface of the conductive sheet. Layer, a first release layer from which at least the coating portion can be peeled off from the adhesive layer, and the adhesive layer is releasably attached to at least the coating portion on an opposite surface with a conductive sheet interposed therebetween. A second release layer attached to the circuit board, and using an antistatic multilayer sheet for a circuit board formed in an overall shape corresponding to the predetermined shape of the circuit board, attaching the antistatic sheet to the circuit board. It is a manufacturing method. Then, the first release layer of the portion of the first release layer covering the covering portion of the predetermined shape is peeled off, and the entire antistatic multilayer sheet is placed on the surface of the circuit board in accordance with a predetermined reference position of the circuit board. At the same time, the first peeling layer is peeled off, and the coating portion where the adhesive layer is exposed is attached to the circuit board by the adhesive layer. Thereafter, when the entirety of the antistatic multilayer sheet is separated from the circuit board, the conductive sheet outside the second release layer and the covering portion is separated from the circuit board, leaving the conductive sheet of the covering portion, A specific portion of the circuit board is covered with the covering portion of the conductive sheet.
【０００８】[0008]
【作用】この発明の静電気防止多層シートは、所定部分
の第一剥離層をはがして回路基板の所定の位置に多層シ
ート全体を位置合わせし、その後多層シート全体を回路
基板からはがすことにより、上記第一剥離層をはがした
部分の所定の導電性シートが回路基板の所定の位置に貼
り付けられ、他の部分は、回路基板には貼り付かず第二
剥離層とともに回路基板から分離されるようにしたもの
である。According to the antistatic multilayer sheet of the present invention, the entire multilayer sheet is positioned at a predetermined position on the circuit board by peeling off the first release layer at a predetermined portion, and then the entire multilayer sheet is peeled off from the circuit board. The predetermined conductive sheet of the portion where the first release layer is peeled off is attached to a predetermined position of the circuit board, and the other portion is separated from the circuit board together with the second release layer without being attached to the circuit board. It is like that.
【０００９】[0009]
【実施例】以下この発明の一実施例について図１〜図５
に基づいて説明する。この実施例の静電気防止多層シー
トは、回路基板１０の表面に形成された回路パターン等
の導電部１２の所定箇所を、外部からの静電気に対する
防御のために、アルミ箔等の導電性シート１４で覆うも
のである。1 to 5 show an embodiment of the present invention.
It will be described based on. The antistatic multi-layer sheet of this embodiment is formed by applying a predetermined portion of the conductive portion 12 such as a circuit pattern formed on the surface of the circuit board 10 to a conductive sheet 14 such as an aluminum foil for protection against external static electricity. To cover.
【００１０】導電性シート１４は、例えば、１２μｍ程
度の厚みのアルミ層１６と、１０〜５０μｍ程度の厚み
のＰＥＴ等の樹脂フィルム層１８、及び２０μｍ程度の
厚みの粘着層２０とからなる。さらにこの導電性シート
１４のアルミ層１６の表面には、剥離可能に、粘着層２
２を有した剥離紙２４が粘着層２２によって貼り付けら
れている。また、導電性シート１４の粘着層２０には、
この粘着層２０に対して剥離可能に剥離紙２６が貼り付
けられている。そして、粘着層２０の粘着力は、粘着層
２２の粘着力より強いものである。The conductive sheet 14 includes, for example, an aluminum layer 16 having a thickness of about 12 μm, a resin film layer 18 of PET or the like having a thickness of about 10 to 50 μm, and an adhesive layer 20 having a thickness of about 20 μm. Further, the surface of the aluminum layer 16 of the conductive sheet 14 is peelably attached to the adhesive layer 2.
A release paper 24 having an adhesive layer 2 is adhered by the adhesive layer 22. In addition, the adhesive layer 20 of the conductive sheet 14 includes
A release paper 26 is attached to the adhesive layer 20 so as to be peelable. The adhesive force of the adhesive layer 20 is stronger than the adhesive force of the adhesive layer 22.
【００１１】導電性シート１４には、図３、図４に示す
ように、回路基板１０の電子部品１１等を避けて導電部
１２の所定箇所を覆う被覆部２８が形成され、この被覆
部２８の表面を覆った剥離紙２６が切り取り線３０によ
って分離可能に形成されている。同様に導電性シート１
４の被覆部２８も、切り取り線３０によって分離可能に
形成されている。電子部品１１に対応する箇所には、予
め透孔３１が形成されている。As shown in FIGS. 3 and 4, the conductive sheet 14 is provided with a cover 28 covering a predetermined portion of the conductive portion 12 while avoiding the electronic components 11 and the like of the circuit board 10. Is formed so as to be separable by a cutout line 30. Similarly, conductive sheet 1
The fourth covering portion 28 is also formed so as to be separable by the cutout line 30. At a location corresponding to the electronic component 11, a through hole 31 is formed in advance.
【００１２】導電性シート１４のアースは、図５に示す
ように、アルミ層１６が外側に位置するように一端部３
２を折り曲げ、回路基板１０の回路パターンに接触さ
せ、さらに、リベット３４により固定する。また、リベ
ット３４により裏面の回路パターンに接地するようにし
ても良い。As shown in FIG. 5, the ground of the conductive sheet 14 is connected to one end 3 so that the aluminum layer 16 is located outside.
2 is bent, brought into contact with the circuit pattern of the circuit board 10, and further fixed by rivets 34. Alternatively, the rivet 34 may be used to ground the circuit pattern on the back surface.
【００１３】この実施例の静電気防止多層シートの使用
方法は、まず、被覆部２８の剥離紙２６をはがし、被覆
部２８の粘着層２０を露出させる。そして、この静電気
防止多層シート全体を、被覆部２８の粘着層２０を下に
して回路基板１０の表面に位置させ、所定の基準位置と
なる側面または角部等にあわせて位置決めする。この状
態で、回路基板１０の導電部１２の所定の場所には、被
覆部２８が、粘着層２０によって接着し、正確に被覆部
２８が貼り付けられる。そして、この静電気防止多層シ
ート全体を回路基板１０からはがすと、被覆部２８は回
路基板１０の表面に接着しており、切り取り線３０で囲
まれている部分が、粘着層２２とアルミ層１６との間で
分離し、被覆部２８以外の部分は、剥離紙２６から表面
の剥離紙２４まで一体に付いて回路基板１０から離れ
る。これによって、回路基板１０の所定の箇所を、導電
性シート１４で被覆することができ、静電気に対する電
子回路の保護が成される。In the method of using the antistatic multilayer sheet of this embodiment, first, the release paper 26 of the covering section 28 is peeled off, and the adhesive layer 20 of the covering section 28 is exposed. Then, the entire antistatic multilayer sheet is positioned on the surface of the circuit board 10 with the adhesive layer 20 of the covering portion 28 facing down, and positioned in accordance with a predetermined reference position such as a side surface or a corner. In this state, the covering portion 28 is adhered to the predetermined portion of the conductive portion 12 of the circuit board 10 by the adhesive layer 20, and the covering portion 28 is accurately attached. When the entire antistatic multilayer sheet is peeled off from the circuit board 10, the covering portion 28 is adhered to the surface of the circuit board 10, and the portion surrounded by the cutout line 30 is formed by the adhesive layer 22 and the aluminum layer 16. And the portions other than the covering portion 28 are integrated from the release paper 26 to the release paper 24 on the front surface and are separated from the circuit board 10. As a result, a predetermined portion of the circuit board 10 can be covered with the conductive sheet 14, thereby protecting the electronic circuit against static electricity.
【００１４】この実施例の静電気防止多層シートによれ
ば、回路基板の所定箇所を導電性シートで覆う際に、静
電気防止多層シート全体を回路基板の側縁等に合わせる
だけで正確な位置決めができ、この多層シート全体を引
き離すことで、導電性シートが正確に所定の位置に貼り
付けられる。さらに、導電性シート１４の樹脂フィルム
層１８を薄くすることができ、電磁シールド効果も高く
することができる。According to the antistatic multi-layer sheet of this embodiment, when a predetermined portion of the circuit board is covered with the conductive sheet, accurate positioning can be performed only by aligning the entire anti-static multi-layer sheet with a side edge of the circuit board. By pulling the entire multi-layer sheet apart, the conductive sheet can be accurately adhered to a predetermined position. Further, the resin film layer 18 of the conductive sheet 14 can be made thinner, and the electromagnetic shielding effect can be enhanced.
【００１５】尚、この発明の静電気防止多層シートは、
上記実施例に限定されるものではなく、第二剥離層は、
粘着層を介さずに導電性シート表面に密着されていても
良い。Incidentally, the antistatic multilayer sheet of the present invention comprises:
It is not limited to the above embodiment, the second release layer,
It may be in close contact with the conductive sheet surface without the interposition of the adhesive layer.
【００１６】[0016]
【発明の効果】この発明の静電気防止多層シートは、導
電性シートの表面に粘着層を形成し、この粘着層に対し
て剥離可能に第一剥離層を設け、上記粘着層とは導電性
シートはさんで反対側の面に、上記導電性シートに対し
て剥離可能に貼り付けられた第二剥離層を設けたので、
回路基板に導電性シートを貼り付ける作業は、多層シー
ト全体を回路基板の側縁等に合わせて位置決めし、離す
だけで、所定の箇所に正確に導電性シートを貼り付ける
ことができる。従って、この導電性シートの貼り付け作
業を自動化することもでき、製造効率を大幅に向上させ
ることができ、きわめて複雑な導体部の構成に対して
も、複雑な導電性シートを正確且つ迅速に貼り付けるこ
とができる。According to the antistatic multilayer sheet of the present invention, an adhesive layer is formed on the surface of a conductive sheet, and a first release layer is provided on the adhesive layer so as to be releasable. Since a second release layer attached to the conductive sheet on the opposite side was peelably attached to the conductive sheet,
In the operation of attaching the conductive sheet to the circuit board, the conductive sheet can be accurately attached to a predetermined location only by positioning and separating the entire multilayer sheet in accordance with the side edge of the circuit board or the like. Therefore, the operation of attaching the conductive sheet can be automated, and the production efficiency can be greatly improved. Even for the configuration of an extremely complicated conductor portion, a complicated conductive sheet can be accurately and quickly formed. Can be pasted.
【００１７】この発明の回路基板の製造方法は、上記多
層シートを回路パターンの所定箇所に貼り付けるので、
導電性シートの貼り付け作業が簡単であり、自動化も容
易であるとともに、フィルム部分が薄い導電性シートで
も容易に正確に貼り付けることができ、シールド効果の
高い回路基板を提供することができる。According to the circuit board manufacturing method of the present invention, the multilayer sheet is attached to a predetermined portion of the circuit pattern.
The work of attaching the conductive sheet is simple, automation is easy, and even a conductive sheet having a thin film portion can be easily and accurately attached, so that a circuit board having a high shielding effect can be provided.
【図１】この発明の静電気防止多層シートの一実施例の
部分斜視図である。FIG. 1 is a partial perspective view of an embodiment of an antistatic multilayer sheet according to the present invention.
【図２】この実施例の静電気防止多層シートの縦断面図
である。FIG. 2 is a longitudinal sectional view of the antistatic multilayer sheet of this embodiment.
【図３】この実施例の静電気防止多層シートの第一剥離
層をはがした状態の平面図である。FIG. 3 is a plan view showing a state in which a first release layer of the antistatic multilayer sheet of this embodiment is peeled off.
【図４】この実施例の導電性シートを貼り付けた回路基
板の縦断面図である。FIG. 4 is a longitudinal sectional view of a circuit board to which a conductive sheet of this embodiment is attached.
【図５】この実施例の導電性シートの端部の端部を回路
基板に取り付けた状態の縦断面図である。FIG. 5 is a longitudinal sectional view showing a state in which the end of the conductive sheet of this embodiment is attached to a circuit board.
【図６】従来の技術を示す斜視図である。FIG. 6 is a perspective view showing a conventional technique.
１０ 回路基板 １２ 導体部 １４ 導電性シート １６ アルミ層 ２０，２２ 粘着層 ２４，２６ 剥離紙 ２８ 被覆部 DESCRIPTION OF SYMBOLS 10 Circuit board 12 Conductor part 14 Conductive sheet 16 Aluminum layer 20,22 Adhesive layer 24,26 Release paper 28 Covering part
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 9/00 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 9/00
Claims (2)
所定形状に形成された被覆部を有した導電性シートから
成り、この被覆部は上記導電性シートの他の部分と分離
可能に形成され、この導電性シートは樹脂フィルム層と
アルミ層、及び上記樹脂フィルム側に形成された粘着層
と、上記アルミ層側に形成された剥離層とからなり、こ
の剥離層と上記アルミ層との間には上記剥離層の剥離と
ともに上記アルミ層から剥離される粘着層が設けられ、
全体形状が上記回路基板の所定の形状に対応して形成さ
れ、上記導電性シートの被覆部及び剥離層には上記回路
基板の突部を避ける透孔が形成されていることを特徴と
する回路基板用静電気防止多層シート。 1. A conductive sheet having a cover formed in a predetermined shape so as to cover a specific portion of a surface of a circuit board.
This covering part is separated from other parts of the conductive sheet.
The conductive sheet is formed with a resin film layer.
Aluminum layer and adhesive layer formed on the resin film side
And a release layer formed on the aluminum layer side.
Between the release layer and the aluminum layer, the release of the release layer
Both are provided with an adhesive layer that is peeled from the aluminum layer,
The overall shape is formed corresponding to the predetermined shape of the circuit board.
The covering portion and the release layer of the conductive sheet have the circuit described above.
The feature is that a through hole is formed to avoid the protrusion of the substrate.
Antistatic multilayer sheet for circuit boards.
所定形状に形成された被覆部が分離可能に形成された導
電性シートと、この導電性シートの表面に形成された粘
着層と、この粘着層に対して少なくとも上記被覆部が剥
離可能な第一剥離層と、上記粘着層とは導電性シートは
さんで反対側の面に少なくとも上記被覆部に対して剥離
可能に貼り付けられた第二剥離層とを有し、全体形状が
回路基板の所定の形状に対応して形成された回路基板用
静電気防止多層シートを用いて回路基板に静電気防止シ
ートを貼り付ける際に、上記第一剥離層のうち上記所定
形状の被覆部を覆った部分の第一剥離層を剥し、上記回
路基板の所定の基準位置に合わせて上記静電気防止多層
シート全体を上記回路基板表面に接触させるとともに、
上記第一剥離層を剥がし上記粘着層が露出した上記被覆
部を上記粘着層により上記回路基板に貼り付け、この後
上記静電気防止用多層シート全体を回路基板から引き離
すと、上記被覆部の導電性シートを残して上記第二剥離
層および上記被覆部位外の上記導電性シートが上記回路
基板から離れ、上記回路基板の特定箇所を上記導電性シ
ートの被覆部で覆うことを特徴とする回路基板の製造方
法。2. A conductive sheet formed in a predetermined shape so as to cover a specific portion of a surface of a circuit board, a conductive sheet formed separably, an adhesive layer formed on a surface of the conductive sheet, At least the coating portion is peelable with respect to the adhesive layer, and the adhesive layer is releasably attached to at least the coating portion on an opposite surface with the conductive sheet interposed therebetween. A second release layer, and when attaching the antistatic sheet to the circuit board using the circuit board antistatic multilayer sheet formed in a whole shape corresponding to the predetermined shape of the circuit board, Peeling off the first release layer of the portion of the release layer covering the coating of the predetermined shape, and bringing the entire antistatic multilayer sheet into contact with the surface of the circuit board in accordance with a predetermined reference position of the circuit board,
When the first release layer is peeled off and the coated portion where the adhesive layer is exposed is attached to the circuit board by the adhesive layer, and then the entire antistatic multilayer sheet is separated from the circuit board, the conductivity of the coated portion is reduced. The second release layer leaving the sheet and the conductive sheet outside the covering portion are separated from the circuit board, and a specific portion of the circuit board is covered with the covering portion of the conductive sheet, Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04092187A JP3105630B2 (en) | 1992-03-18 | 1992-03-18 | Antistatic multilayer sheet for circuit board and method of manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04092187A JP3105630B2 (en) | 1992-03-18 | 1992-03-18 | Antistatic multilayer sheet for circuit board and method of manufacturing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267878A JPH05267878A (en) | 1993-10-15 |
| JP3105630B2 true JP3105630B2 (en) | 2000-11-06 |
Family
ID=14047443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04092187A Expired - Fee Related JP3105630B2 (en) | 1992-03-18 | 1992-03-18 | Antistatic multilayer sheet for circuit board and method of manufacturing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3105630B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100306231B1 (en) * | 1998-12-30 | 2002-03-21 | 마이클 디. 오브라이언 | Circuit Board Structure of Semiconductor Package and Grounding Method Using Circuit Board |
| JP2001308574A (en) * | 2000-04-25 | 2001-11-02 | Tokin Corp | Esd suppressing sheet |
| TWI388273B (en) * | 2008-12-19 | 2013-03-01 | Hon Hai Prec Ind Co Ltd | Electronic fabric and electronic device using thereof |
-
1992
- 1992-03-18 JP JP04092187A patent/JP3105630B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05267878A (en) | 1993-10-15 |
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| LAPS | Cancellation because of no payment of annual fees |