JP2819372B2 - Card type package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card type package for connecting a connector provided on a substrate such as a printed circuit board to a mating connector on the device side so as to be insertable and connectable.

[0002]

2. Description of the Related Art As shown in FIG. 6, a conventional card type package has a frame 60 made of a synthetic resin material, a substrate 70 held by the frame 60, and a connector attached to one side of the frame 60. 80, and a pair of reinforcing panels 90a attached to the frame 60 so as to sandwich the substrate 70 opposite to the front and back surfaces of the substrate 70.
90b.

The substrate 70 has a plurality of ICs or LSs.
An element 71 such as I is mounted. In the connector 80,
A plurality of conductive contacts (not shown) are incorporated, and the contacts are connected to circuit conductors on the substrate 70.

Now, after the board 70 and the connector 80 are accommodated in the frame of the frame 60, the reinforcing panels 90a and 90b are opposed to the front and back surfaces of the board 70 in a one-to-one correspondence. By fixing the package to the frame 60, a card-shaped package having a thin card shape is manufactured.

In recent years, as the function of a card-type package has become more sophisticated, an element 71 mounted on a substrate 70 has recently been developed.
Also, since a device with a high degree of integration is mounted, the heat generation of the element 71 is also increasing.

[0006]

However, in the conventional card type package, it is impossible to sufficiently radiate the heat generated from the element 71, and the inside of the card type package, that is, the reinforcement is not provided. Panels 90a and 90b
In addition, there is a problem that the temperature of the space surrounded by the frame 60 rises and adversely affects the element 71.

It is therefore an object of the present invention to provide a card-type package capable of obtaining a sufficient heat radiation effect even by increasing the heat generation of the element.

[0008]

According to the present invention, there is provided a metal frame for holding a substrate on which an element is mounted, the frame including a pair of side frames and heat from the element being transferred to the frame. And an internal beam spanned and connected between the side frames so as to convey the internal beam, the internal beam having a contact surface facing the substrate and contacting only the element, and the contact surface facing the substrate. A card-type package is obtained, wherein the recess is recessed from the upper surface of the internal beam.

According to the present invention, a radiating fin is formed at a predetermined position of the internal beam, and the radiating fin is provided between the upper surface of the internal beam and a rear surface opposite to the upper surface. A card type package characterized by being formed with a plate thickness or less is obtained.

According to the present invention, there is provided a metallic frame for holding a substrate on which an element is mounted, and a frame defined by the frame in the frame so as to transfer heat from the element to the frame, and integrally with the frame. And a panel formed, the panel having a contact surface facing the substrate and contacting only the element, wherein the contact surface is recessed from an upper surface of the panel facing the substrate. And a card-type package characterized by being a unit.

According to the present invention, a radiating fin is formed at a predetermined position of the panel, and the radiating fin has a thickness between the upper surface of the panel and a rear surface opposite to the upper surface. A card-type package characterized in that it is formed to have dimensions or less is obtained.

[0012]

According to the structure of the present invention, by providing a contact surface at a predetermined position of the internal beam for contacting the element mounted on the substrate, heat generated from the element mounted on the substrate is transferred to the outside through the internal beam. Is conducted to the frame and dissipated.

Further, a contact surface is formed at a predetermined position of the internal beam to be in contact with the upper surface of the element mounted on the substrate, and a radiation fin is formed at a predetermined position on a surface of the internal beam that forms the card outer surface. As a result, the heat generated from the element is conducted through the internal beam and is radiated from the radiation fins.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, individual embodiments of the card type package of the present invention will be sequentially described with reference to FIGS.

FIGS. 1 and 2 show a first embodiment of a card type package according to the present invention. Referring to FIGS. 1 and 2, a card type package includes a frame 1 formed of a metallic material, a substrate 2 on which elements 3a and 3b such as ICs or LSIs are mounted at predetermined positions on one surface.
It has a connector 4 connected to one end of the substrate 2 and a pair of reinforcing plates 5a and 5b attached to the frame 1 so as to sandwich the substrate 2 from both sides.

The connector 4 has engagement projections 4a formed at both ends in the longitudinal direction fitted into engagement grooves 10a formed at the other end of the side frame 10. The frame 1 includes a pair of side frames 10 arranged in parallel with each other, a connection frame 12 connecting one end of the side frames 10, and a pair of side frames 1.
And a plurality of internal beams 13 and 14 connected so as to bridge between a pair of side frames 10 in the middle of the longitudinal direction of the pair.

In the first embodiment shown in FIG.
Two internal beams 13 and 14 are employed. Internal beam 13, 1
4 is a side frame 1 with extremely small electric heat resistance.
0. At predetermined positions on the upper surfaces of the two internal beams 13 and 14 facing the substrate 2, contact surfaces 13a and 14 that contact only the elements 3a and 3b mounted on the substrate 2 are provided.
a is formed. The contact surfaces 13a and 14a are recesses that are recessed below the upper surfaces of the internal beams 13 and 14. The contact surfaces 13a and 14a are used to contact, among the plurality of elements 13a and 14a, particularly the element having a high heat generation temperature.

In FIG. 1, an element 3 having a high heat generation temperature is shown.
Only two elements a and 3b are shown, and other elements are also mounted. In addition, the element 3 whose heat generation temperature is high
When three or more a and 3b are mounted on the substrate 2,
By increasing the number of internal beams 13 and 14, the contact surfaces 13a,
What is necessary is just to increase the number of 14a.

In FIG. 1, one internal beam 13 is provided.
Is provided with one contact surface 13a.
Needless to say, a plurality of contact surfaces 13a may be formed on one internal beam 13 in accordance with the numbers of a and 3b.

The frame 1 is manufactured by, for example, a metal injection casting method (die casting) using an aluminum alloy or a zinc alloy as a material, or a shell mold (lost wax) method or a forging (press) using a copper alloy as a material. You.

Next, the procedure for assembling the above components will be described. An element 3 that dissipates high-temperature heat is applied to contact surfaces 13a and 14a formed on the internal beams 13 and 14 of the frame 1.
The substrate 2 is placed on the frame 1 so that the upper surfaces of the substrates a and 3b are in contact with each other. In this state, the internal beams 13, 1
4 and the substrate 2 are not in contact with each other. Contact surfaces 13a, 14a
In order to obtain good heat transfer, a thermal grease (for example, Dow 34 manufactured by Dow Chemical Co.)
0) or a heat dissipation member (for example, Denka heat dissipation sheet M series manufactured by Denki Kagaku Kogyo KK).

To mount the board 2 on the frame 1,
The locking projection 4a of the connector 4 is fitted into the locking groove 10a of the side frame 10. After this, the reinforcing panels 5a, 5b
Is attached to the frame 1 from the front and back surfaces of the substrate 2. In the card type package obtained in this way, FIG.
As shown in (2), the elements 3a, 3b having a high heat generation temperature are in contact with the contact surfaces 13a, 14a of the internal beams 13, 14,
The heat from the elements 3a and 3b is guided through the internal beams 13 and 14 in the direction of the arrow in FIG. 2 and further radiated from the side frames 10.

Next, the second type of the card type package of the present invention will be described.
The embodiment will be described below. As shown in FIG.
In this card type package, the same configuration as that of the first embodiment is adopted for the substrate 2, the elements 3a and 3b mounted on the substrate 2, the connector 4, and one reinforcing plate 5a. .

A panel 18 is provided on the entire surface of the frame 8 which is a metal material and has a substantially U-shaped plane. The panel 18 is formed of a metal material similarly to the frame 8, and may be formed integrally with the frame 8 or may be formed by joining separately formed ones. In addition, the entire surface of the panel 18 defined by the frame 8 is flush, and has a function as a reinforcing plate as well as the one reinforcing plate 5a.

At predetermined positions of the panel 18, contact surfaces 18a and 18b which are in contact with the upper surfaces of the elements 3a and 3b mounted at predetermined positions of the substrate 2 are formed. Contact surfaces 18a, 1
8b is a dent. Also in this example,
The elements 3a, 3b contact only the contact surfaces 18a, 18b,
The panel 18 and the substrate 2 are not in contact with each other. Also,
As shown in FIGS. 4 and 5, a predetermined number of heat radiation fins 20 for improving heat radiation efficiency are formed on the panel 18 at predetermined positions on the back surface opposite to the upper surface of the panel 18 facing the substrate 2. ing. The radiation fins 20 are formed to have a thickness equal to or less than the thickness between the upper surface of the panel 18 and the rear surface opposite to the upper surface. It is needless to say that the arrangement and the number of the radiation fins 20 are not limited to those shown in the drawings, but can be appropriately changed in design.

At the time of assembling, between the contact portions 18a and 18b of the internal beam 18 and the elements 3a and 3b, the first
Similarly to the embodiment, a thermal grease or a heat radiating sheet may be interposed.

[0027]

According to the card type package of the present invention described above, in any of the embodiments, the heat generated from the element generating high heat is conducted to the frame in contact with the outside air via the internal beam and is radiated. Even if an element that generates high temperature and generates heat at a high temperature is mounted, the heat dissipation is improved and the function of the element is not impaired, so that a high-performance card-type package can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an exploded state of a card type package according to a first invention.

FIG. 2 is a sectional view taken along line II in a state where the card-type package in FIG. 1 is assembled.

FIG. 3 is a perspective view showing an exploded state of a card type package according to a second invention.

FIG. 4 is a bottom perspective view showing a frame of a card type package according to a second invention.

FIG. 5 is a perspective view showing a main part of the assembled state of the card type package according to the second invention, and is a sectional view taken along line VV in FIG. 4;
It is sectional drawing corresponding to a line.

FIG. 6 is a perspective view showing a disassembled state of a conventional card type package.

[Explanation of symbols]

 1, 6, 8 Frame 2 Board 3a, 3b Element 4 Connector 5a, 5b Reinforcement panel 10 Side frame 13, 14 Internal beam 13a, 14a Contact surface 18 Panel 18a, 18b Contact surface 20 Radiation fin

Claims (4)

(57) [Claims] An electronic device includes a metal frame for holding a substrate on which an element is mounted, and the frame extends between a pair of side frames and the side frames so as to transfer heat from the element to the frame. With a connected internal beam,
The internal beam has a contact surface facing the substrate and contacting only the element, and the contact surface is a recessed portion that is recessed from an upper surface of the internal beam facing the substrate. Card type package. 2. A heat radiation fin is formed at a predetermined position of the internal beam, and the heat radiation fin is formed to have a thickness equal to or less than a thickness between the upper surface of the internal beam and a rear surface opposite to the upper surface. The card type package according to claim 1, wherein the card type package is provided. 3. A metal frame for holding a substrate on which an element is mounted, and a frame defined by and within the frame so as to transfer heat from the element to the frame. A panel having a contact surface facing the substrate and contacting only the element, wherein the contact surface is a recessed portion recessed from an upper surface of the panel facing the substrate. A card type package. 4. A heat radiation fin is formed at a predetermined position of the panel, and the heat radiation fin is formed to have a thickness equal to or less than a thickness between the upper surface of the panel and a rear surface opposite to the upper surface. The card type package according to claim 3, wherein