JPS6022889U - multilayer printed wiring board - Google Patents
multilayer printed wiring boardInfo
- Publication number
- JPS6022889U JPS6022889U JP11227983U JP11227983U JPS6022889U JP S6022889 U JPS6022889 U JP S6022889U JP 11227983 U JP11227983 U JP 11227983U JP 11227983 U JP11227983 U JP 11227983U JP S6022889 U JPS6022889 U JP S6022889U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer printed
- printed wiring
- metal coating
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す斜視図、第２図および
第３図は各部を詳細に示す断面図、第４図は本考案の他
の実施例を示す斜視図である。
１・・・・・・配線板、２・・・・・・金属フレーム、
３ａ〜３Ｃ・・・・・・絶縁基板、４ａ〜４ｄ・・・・
・・銅はく、５・・・・・・メッキ層、６・・・・・・
接着材、７・・・・・・ヒートシンク形金属フレーム。FIG. 1 is a perspective view showing one embodiment of the present invention, FIGS. 2 and 3 are sectional views showing each part in detail, and FIG. 4 is a perspective view showing another embodiment of the present invention. 1... Wiring board, 2... Metal frame,
3a to 3C...Insulating substrate, 4a to 4d...
...Copper foil, 5...Plating layer, 6...
Adhesive material, 7...Heat sink type metal frame.
Claims (1)
層とを交互に複数層積層してなる多層プリント配線板に
おいて、当該配線板の端面に金属被膜を施し、上記配線
層を構成する導電膜の一部をこの金属被膜に接続すると
ともに、当該金属被膜を設けた配線板端面部分に低熱抵
抗材からなる放熱部材を低熱抵抗接続したことを特徴と
する多層プリント配線板。In a multilayer printed wiring board formed by alternately laminating a plurality of layers of an insulating substrate and a wiring layer made of a conductive film adhered to the substrate, a metal coating is applied to the end surface of the wiring board to constitute the wiring layer. A multilayer printed wiring board characterized in that a part of the conductive film is connected to the metal coating, and a heat dissipation member made of a low thermal resistance material is connected with low thermal resistance to the end face portion of the wiring board provided with the metal coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227983U JPS6022889U (en) | 1983-07-21 | 1983-07-21 | multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227983U JPS6022889U (en) | 1983-07-21 | 1983-07-21 | multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6022889U true JPS6022889U (en) | 1985-02-16 |
Family
ID=30260342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11227983U Pending JPS6022889U (en) | 1983-07-21 | 1983-07-21 | multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022889U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325991A (en) * | 1989-06-23 | 1991-02-04 | Furukawa Electric Co Ltd:The | Printed circuit board |
| JPH06334357A (en) * | 1993-05-19 | 1994-12-02 | Japan Aviation Electron Ind Ltd | Card type package |
| JP2013110354A (en) * | 2011-11-24 | 2013-06-06 | Keihin Corp | Electronic control device |
| JP2018046439A (en) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | Antenna module |
-
1983
- 1983-07-21 JP JP11227983U patent/JPS6022889U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325991A (en) * | 1989-06-23 | 1991-02-04 | Furukawa Electric Co Ltd:The | Printed circuit board |
| JPH06334357A (en) * | 1993-05-19 | 1994-12-02 | Japan Aviation Electron Ind Ltd | Card type package |
| JP2013110354A (en) * | 2011-11-24 | 2013-06-06 | Keihin Corp | Electronic control device |
| JP2018046439A (en) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | Antenna module |
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