JP2697372B2 - High power semiconductor integrated circuit cooling test jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit, and more particularly to a high power semiconductor integrated circuit (hereinafter referred to as an IC).
To a high-power semiconductor integrated circuit test jig (hereinafter, referred to as a test jig) supplied for testing while cooling.

[0002]

2. Description of the Related Art In recent years, in particular, the heat generation of bipolar ICs has increased with the increase in the degree of integration.
(Tape Automated Bonding) shipping cases are increasing. This is because the number of ICs for large computers has been increasing, and the substrates constituting the computers are shaped as much as possible to be IC package packages.

Conventionally, a high-power TAB type IC uses a test jig with cooling (hereinafter referred to as a cooling jig) to execute a characteristic test of the IC while performing cooling.

FIG. 6 shows a block diagram of a conventional cooling jig. In the drawing, reference numeral 1 denotes a carrier portion of a TAB type IC (hereinafter, referred to as a carrier), 2 denotes a tape portion (hereinafter, referred to as a tape) of a TAB type IC, and 3 denotes an IC chip (1 to 3).
Are collectively referred to as a TAB type IC), 10 is a connection interface section with an IC tester (hereinafter, referred to as an IC tester interface section), and 20 is a tray section (hereinafter, referred to as an IC tray section) for storing and transporting the TAB type ICs. ).

[0005] Further, reference numeral 30 denotes a metal portion (hereinafter, referred to as a cooling metal portion) that conducts cooling heat to the IC chip; It is a circulating pipe (hereinafter referred to as a pipe).

[0006] Reference numeral 60 denotes a unit (hereinafter referred to as a pipe connecting portion) for integrating branches of a plurality of pipes.
Is a valve for controlling the flow of air (hereinafter referred to as a valve), 8
Reference numerals 0 to 81 denote pipes through which air flows (hereinafter referred to as pipes), reference numeral 91 denotes a tip of the pipe (hereinafter referred to as an opening), and reference numeral 9 denotes a pipe.
5 is a unit for creating a vacuum state (hereinafter referred to as a vacuum unit), 100 is a unit for controlling a valve, a vacuum unit and the like (hereinafter referred to as a device control unit), and 110 to 113 are units for controlling the device control unit, the valve and the vacuum unit. (Hereinafter referred to as a control line).

FIG. 9 shows an operation flow of the conventional cooling jig, and the parts whose figure numbers are shown on the right side of the section show the operation state in FIGS. 7 and 8, respectively. In FIG. 7, arrows 701 to 704 indicate the direction of air flow in each hole, and similarly, arrows 801 to 804 in FIG.
The direction of air flow in each hole is shown.

Now, the heat generated from the IC chip 3 for performing the test is activated by activating the vacuum section 95 and opening the valve 70 as shown in FIG.
A vacuum pressure is applied to 1 to 704, and as a result, the ICs 1 to 3 are adsorbed from the IC tray 20 to the cooling metal unit 30, and heat conduction is performed by the thermal resistance in comparison with the pressing pressure of the IC chip 3 and the cooling metal unit 30. Endothermic.

Next, in order to release the adsorbed ICs 1 to 3 to the IC tray 20, as shown in FIG.
Is closed, the vacuum unit 95 is stopped, and the valve 71 is opened, whereby the outside air pressure enters through the opening 91 of the pipe 81, and the vacuum pressure is weakened by the air directions 801 to 804. As a result, the ICs 1 to 3 The cooling metal part 30 is opened to the IC tray 20.

[0010]

Before the final electrical characteristic test, the TAB type IC having a high power is required to be in the form of a liquid BT (Bur).
n in Test), and a fluorocarbon liquid is used for this liquid. When the boiling point is low, the fluorocarbon liquid has the property of easily vaporizing even at room temperature, but the BT test uses a substance having a high boiling point and a property of being difficult to vaporize due to a high temperature. Therefore, a slight amount of the fluorocarbon liquid has adhered to the IC chip 3 and the carrier 1 after the BT test.

Therefore, in the conventional cooling jig described above, the IC chips 3 and the carrier 1 are formed by opening the IC chips 1 to 3 to the IC tray 20 by merely introducing normal pressure outside air. 30, IC
The tray 20 may not be opened. As a result, there is a problem that the original performance of the cooling jig is lost.

An object of the present invention is to provide a high-power semiconductor integrated circuit cooling test jig which solves the above-mentioned problems.

[0013]

In order to achieve the above-mentioned object, a high-power semiconductor integrated circuit cooling test jig according to the present invention corresponds to a predetermined position of a high-power semiconductor integrated circuit.
A cooling metal part having a hole and a pipe;
A vacuum section for generating a vacuum connected via a control valve,
For air compression connected to the pipe via a second control valve
An air compression section, and the high-power semiconductor
Extrusion by suction and pneumatic condensation by vacuum product circuit
Controlling the first control valve and the second control valve
And a device control unit that performs the
Directly contact the high power semiconductor integrated circuit with the cooling metal part
It is designed to conduct heat .

[0014] Further, at a predetermined position of the high power semiconductor integrated circuit.
Cooling metal parts with corresponding holes and pipes and multiple fronts
Means to combine the pipes into one and separate them into two
One of the pipes separated by the separation means
Connected to a raw vacuum section, and a control valve was connected to one of the pipes
Equipped, connect the other pipe to the air compressor for air compression
And the other pipe is provided with a control valve.
The vacuum of the high power semiconductor integrated circuit to the cooling metal part
Control unit that controls extrusion by air suction and air compression
And the high-power semiconductor on the cooling metal part during adsorption.
The heat conduction is performed by directly contacting the integrated circuit .

Further, the device control unit, advance start advance the vacuum unit and the air compressor unit, prior to the vacuum side
The function of opening the serial control valve to adsorb the high power semiconductor integrated circuit, after closure of the control valve of the vacuum side, the high-power semiconductor that adsorb opening the control valve of the air compressor portion
And a function of pushing out the body integrated circuit .

[0016]

The cooling jig according to the present invention conventionally releases the vacuum state by the ambient air at normal pressure. On the other hand, as shown in FIG. 1, air is compressed, that is, high-pressure air is injected.
The difference is that the carrier 1 and the IC chip 3 are forcibly released from the cooling metal part 30.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing a cooling jig according to the present invention. In the figure, the same components as those of the related art have the same numbers,
The components having the same name and having the following different numbers are constituent components of the present invention.

That is, in the present embodiment, the high power piece TA
In the cooling metal part 30 of the cooling test jig of the B-type IC, holes 40, 41,
42 and pipes 50, 51, 52, and a pipe connecting portion 60 for integrating the plurality of pipes 50, 51, 52 into one and further separating the two into two. The pipe 80 is provided with a valve 70, and the other pipe 81 is connected to an air compression unit 90, and the pipe 81 is provided with a valve 71, so that the IC can be suctioned by vacuum and opened by air compression. It has a device control unit 100 for controlling. 110,111,112,1
Reference numeral 13 denotes a control line that connects the device control unit 100, the air compression unit 90, the vacuum unit 95, and the valves 70 and 71.

Also, as a device control unit 100 for suction by vacuum and opening by air compression, after the vacuum unit 95 is started, the valve 70 on the vacuum unit 95 side is opened and the IC chip 3 is sucked. After closing the valve 70, the vacuum unit 95 is stopped, and then the air compressing unit 90 is started. Then, the valve 71 on the air compressing unit 90 side is opened to open the IC that has been adsorbed.
It has a function of opening the chip 3.

The equipment control unit 100 has a vacuum unit 95 in advance.
In addition, each of the air compression units 90 is activated, and the vacuum unit 9 is activated.
After opening the valve 70 on the side of the vacuum 5 and closing the valve 70 on the side of the vacuum 95, the air compressor 9
It may have a function of opening the zero-side valve 71 and opening the IC chip 3 that has been sucked.

FIGS. 4 and 5 show the operation flow of the cooling jig according to the present invention, and the parts whose figure numbers are shown on the right side of the item respectively show the operation states in FIGS. 2 and 3. . FIG.
3, arrows indicated by 201 to 204 indicate the directions of air flow in the respective holes, and similarly, arrows indicated by 301 to 304 in FIG. 3 also indicate the directions of air flow in the respective holes.

The operation of the cooling jig according to the present invention is as follows.
As shown in the operation flow of FIG. 4 as an embodiment of the present invention, the cooling metal part 30 according to FIG.
From the position of the chip 3 and the IC tray section 20, the cooling metal section 30 is lowered to the IC tray section 20, and the cooling metal section 30 is lowered.
When the carrier 1 and the IC chip 3 come into contact with each other, the vacuum section 95 is activated and the valve 70 is opened.

As a result, the pressure in the holes 40 to 42, the pipes 50 to 52, and the pipe 80 in the cooling metal part 30 becomes negative, and the carrier 1 and the IC chip 3 are adsorbed to the cooling metal part 30, so that the cooling metal part 30 Figure 2 is raised to the top
It is.

Next, the IC tray section 20 is retracted from the IC tester interface section 10, that is, moved in the left or right direction in FIG.
While the carrier 1 and the IC chip 3 are still adsorbed, the cooling metal part 30 is lowered to bring the IC tester interface part 10 and the tape 2 into electrical contact, and the electric characteristic test of the ICs 1 to 3 is performed by the IC tester. (The IC tester is not shown because it is a general matter in the figure).

During the electrical characteristic test, heat is conducted and heat is absorbed by the thermal resistance of the IC chip 3 and the cooling metal part 30 which is higher than the pressing pressure. When the electrical characteristic test of the ICs 1 to 3 is completed, the cooling metal unit 30 is raised to the upper end in a state where the carrier 1 and the IC chip 3 are attracted, and the retracted IC tray unit 20 is moved to the IC tester interface unit 1.
, The cooling metal part 30 is lowered to the IC tray part 20, and the cooling metal part 30, the carrier 1 and the IC chip 3 are restored.
When the contact is made, the valve 70 is closed and the vacuum
Is stopped, the air compressor 90 is started, and the valve 71 is opened.

As a result, the pressure in the holes 40 to 42, the pipes 50 to 52, and the pipe 81 in the cooling metal part 30 becomes positive, and the carrier 1 and the IC chip 3 are released from the cooling metal part 30. FIG. 3 is a diagram in which it is raised to the upper end.

Next, the valve 71 is closed and the air compressor 9 is closed.
0 is stopped to complete a series of operation flows.

In the second embodiment, as shown by the operation flow in FIG. 5, the vacuum section 95 and the air compression section 90 are started in advance and are always in an operating state. Then, since the devices of the vacuum unit 95 and the air compression unit 90 do not operate at the point of suction or release, only the valves 70 to 71 are controlled. The entire operation flow is the same except for the control means here. An advantage of the second embodiment is that since the vacuum section 95 and the air compression section are constantly operated, the rise in the vacuum state and the high pressure state is quicker than in the case of sequentially starting.

Although the cooling method is not described in the present invention, a semiconductor element having a Peltier effect may be attached to the cooling metal part 30 to control the temperature. Also, IC
Depending on the calorific value (power consumption) of the element, cooling with metal fins is sufficient.

[0031]

As described above, according to the present invention, a small amount of fluorocarbon liquid adheres to the IC chip 3 and the carrier 1 by the liquid BT test, and the IC chip 3 and the carrier 1 Even if the cooling jig is stuck, it is reliably opened to the IC tray section 20 by being pushed out by the compressed air, so that the original performance of the cooling jig can be maintained.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a cooling jig according to the present invention.

FIG. 2 is a block diagram of a cooling jig according to the present invention showing IC suction.

FIG. 3 is a block diagram of a cooling jig according to the present invention showing IC suction.

FIG. 4 is an operation flowchart showing a first embodiment of the present cooling jig.

FIG. 5 is an operation flowchart showing a second embodiment of the present cooling jig.

FIG. 6 is a block diagram of a conventional cooling jig.

FIG. 7 is a block diagram of a conventional cooling jig showing IC suction.

FIG. 8 is a block diagram of a conventional cooling jig showing IC suction.

FIG. 9 is an operation flowchart of the cooling jig.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Carrier 2 Tape 3 IC chip 10 IC tester interface part 20 IC tray part 30 Cooling metal part 40-42 hole 50-52 Pipe 60 Pipe connection part 70,71 Valve 80,81 Pipe 90 Air compression part 91 Opening part 95 Vacuum part REFERENCE SIGNS LIST 100 Device control unit 110 to 113 Control line 201 to 204 Air flow direction of hole in cooling metal unit when IC is adsorbed 301 to 304 Air flow direction of hole in cooling metal unit when IC is opened 701 to 704 IC adsorption Direction of air flow through holes in cooling metal part at the time 801-804 Direction of air flow through holes in cooling metal part when IC is open

Claims (3)

(57) [Claims] 1. Corresponding to a predetermined position of a high power semiconductor integrated circuit
Cooling metal part with holes and pipes
A vacuum unit for generating a vacuum connected via the control valve of No. 1;
Air compression connected to the pipe via a second control valve
Air compressing section and the high power semi-conductor to the cooling metal section
Pushed out by adsorption and pneumatic condensation by vacuum body integrated circuit
Control the first control valve and the second control valve
And a device control unit that performs control by controlling
Directly contact the high power semiconductor integrated circuit with the cooling metal part
A high-power semiconductor integrated circuit cooling test jig characterized in that heat conduction is performed . 2. Corresponding to a predetermined position of a high power semiconductor integrated circuit
A cooling metal part having holes and pipes
There is a means to combine
Then, a vacuum is generated in one of the pipes separated by the separation means.
And a control valve on one of the pipes.
And connect the other pipe to the air compressor for air compression
And the other pipe is provided with a control valve.
The vacuum of the high power semiconductor integrated circuit to the cooling metal part
Control unit that controls extrusion by air suction and air compression
And the high-power semiconductor on the cooling metal part during adsorption.
The heat transfer is performed by directly contacting the integrated circuit.
A high-power semiconductor integrated circuit cooling test jig. 3. The apparatus control section, wherein the vacuum section and the
The advance start the air compressor unit, a function of opening the system <br/> valve of the vacuum side to adsorb the high power semiconductor integrated circuit, after closure of the control valve of the vacuum side, the high power semiconductor collector that adsorb opening the control valve of the air compressor portion
High power semiconductor integrated circuit cooling test fixture according to claim 2, characterized in that it comprises a function to push out the product circuit.