JP2557650B2 - Sample shape measuring device - Google Patents

Sample shape measuring device

Info

Publication number
JP2557650B2
JP2557650B2 JP62156212A JP15621287A JP2557650B2 JP 2557650 B2 JP2557650 B2 JP 2557650B2 JP 62156212 A JP62156212 A JP 62156212A JP 15621287 A JP15621287 A JP 15621287A JP 2557650 B2 JP2557650 B2 JP 2557650B2
Authority
JP
Japan
Prior art keywords
sample
reference plane
interference fringes
shape measuring
interference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62156212A
Other languages
Japanese (ja)
Other versions
JPS64406A (en
JPH01406A (en
Inventor
孝治 大澤
仁 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidek Co Ltd
Original Assignee
Nidek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidek Co Ltd filed Critical Nidek Co Ltd
Priority to JP62156212A priority Critical patent/JP2557650B2/en
Publication of JPS64406A publication Critical patent/JPS64406A/en
Publication of JPH01406A publication Critical patent/JPH01406A/en
Application granted granted Critical
Publication of JP2557650B2 publication Critical patent/JP2557650B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は干渉計を利用してフィルムやウェーハ等の試
料の形状を測定する装置、より詳細には試料の表面形状
や厚さむらを高精度に測定評価する装置に関する。
The present invention relates to an apparatus for measuring the shape of a sample such as a film or a wafer by using an interferometer, and more specifically, to increase the surface shape and thickness unevenness of the sample. The present invention relates to a device for measuring and evaluating with accuracy.

[従来技術] 一般にウェーハ等の薄板状の試料は、全体的反りと部
分的な凸凹とを併せもっており、試料の表面や裏面はこ
れらが合成された形状をなしている。
[Prior Art] Generally, a thin plate-shaped sample such as a wafer has both a general warp and a partial unevenness, and the front surface and the back surface of the sample have a combined shape.

こうした試料の表面状態や厚さむらの測定について
は、試料内の予め決められた複数ポイントをマイクロメ
ータや静電容量センサ等により測定し、決定する装置が
知られている。
For the measurement of the surface condition and thickness unevenness of such a sample, there is known a device for measuring and determining a plurality of predetermined points in the sample with a micrometer, a capacitance sensor or the like.

しかし、所定点の厚さを測定するにすぎないので得ら
れる情報は不充分であるし、より詳細なデータを得よう
とすれば測定点を飛躍的に増やさなければならず、その
結果測定時間が長くなったり、非常に高価なものになっ
てしまう。
However, the information that can be obtained is insufficient because it only measures the thickness of a predetermined point, and if more detailed data is to be obtained, the number of measurement points must be increased dramatically, resulting in a measurement time Can be long or very expensive.

このため、従来において、試料の全測定領域の凸凹状
態を測定する装置として最も普及しているのは、光の波
長を測定の基準とする干渉計測定器を使用した装置であ
る。
For this reason, conventionally, the most widely used device for measuring the unevenness of the entire measurement region of a sample is a device that uses an interferometer measuring device that uses the wavelength of light as a reference for measurement.

この装置により試料表面にできた干渉縞を読み取り表
面形状や厚さむらを求めるには、基準平面上の干渉縞が
一色となるように、予め干渉計の参照平面と被測定試料
との位置関係を調整する必要がある。
In order to read the interference fringes formed on the sample surface with this device and determine the surface shape and thickness unevenness, the positional relationship between the reference plane of the interferometer and the sample to be measured should be set in advance so that the interference fringes on the reference plane have one color. Need to be adjusted.

第3図はその装置により得られた表面形状の測定例で
ある。
FIG. 3 is a measurement example of the surface shape obtained by the apparatus.

図上部は試料表面1の干渉縞を示している。図下部は
試料表面の最も凸の部分と、最も凹の部分を含む断面X
−X′の表面形状である。
The upper part of the figure shows the interference fringes on the sample surface 1. The lower part of the figure is a cross section X including the most convex part and the most concave part of the sample surface.
-X 'surface shape.

もっとも、図上部からは図下部を直ちに求めることて
はできないので、干渉縞の凸凹判定機構により凸凹を判
定する。
However, since the lower part of the figure cannot be immediately obtained from the upper part of the figure, the unevenness determination mechanism of the interference fringe determines the unevenness.

y軸は干渉縞の感度を1目盛として、凸凹量を表して
いる。試料の裏面は、干渉縞が一色となる基準平面2′
に密着しており、x軸に平行な直線となる。従って、試
料の厚さむらは第3図のC寸法として求めることができ
る。
The y-axis represents the amount of unevenness, with the sensitivity of the interference fringe being one scale. The back surface of the sample is a reference plane 2'where interference fringes are one color.
Is in close contact with and is a straight line parallel to the x-axis. Therefore, the thickness unevenness of the sample can be obtained as the dimension C in FIG.

しかしながら、前記の基準平面上の干渉縞が一色とな
るような試料積載台2の基準平面2′と干渉計(参照平
面)との位置関係を、稼動中正確に保持することは非常
に困難である。一般に必要とされる干渉縞の感度からす
れば、装置の振動や熱変形の影響を無視することはでき
ない。また、試料交換等のために試料積載台を移動した
場合、基準平面2′と干渉計(参照平面)との位置関係
を正確に再現するのは困難である。
However, it is very difficult to accurately maintain the positional relationship between the reference plane 2'of the sample loading table 2 and the interferometer (reference plane) such that the interference fringes on the reference plane become one color during operation. is there. From the sensitivity of interference fringes generally required, the influence of vibration and thermal deformation of the device cannot be ignored. Further, when the sample loading table is moved for sample exchange or the like, it is difficult to accurately reproduce the positional relationship between the reference plane 2'and the interferometer (reference plane).

[発明の目的] この発明は、上記従来装置の問題点に鑑み、干渉計の
参照平面と試料積載台の基準平面(=試料裏面)の位置
関係の変動にかかわりなく、被測定試料の表面形状や厚
さむら等を短時間に精度好く測定できる装置を提供する
ことにある。
[Object of the Invention] In view of the problems of the above-described conventional apparatus, the present invention is directed to the surface shape of the sample to be measured regardless of the variation in the positional relationship between the reference plane of the interferometer and the reference plane (= the back surface of the sample) of the sample loading table. An object of the present invention is to provide an apparatus capable of accurately measuring thickness, thickness unevenness, and the like in a short time with high accuracy.

[発明の構成] 本発明は、上記目的を達成するために、 (1)試料を吸着する吸着手段を持ち,吸着される試料
の領域を越えて干渉縞を形成できる精度に仕上げられた
基準平面を有する試料載置台と、試料及び基準平面にそ
れぞれ干渉縞を形成する干渉縞形成光学系と、試料及び
基準平面の干渉縞を撮像し、撮像された試料及び基準平
面の各干渉縞情報に基づいて試料を評価する評価手段
と、を有することを特徴としている。
[Structure of the Invention] In order to achieve the above-mentioned object, the present invention has (1) a reference plane which has an adsorption means for adsorbing a sample and is formed to an accuracy capable of forming an interference fringe beyond the area of the adsorbed sample. A sample mounting table, an interference fringe forming optical system that forms interference fringes on the sample and the reference plane, respectively, and images of the interference fringes of the sample and the reference plane, and based on each imaged interference fringe information of the sample and the reference plane. And an evaluation means for evaluating the sample.

[発明の実施例] 以下、本発明の一実施例である厚さむら測定装置を図
面に基づいて説明する。
[Embodiment of the Invention] A thickness unevenness measuring apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

第1図は上記の装置全体の構造を示す概略図である。 FIG. 1 is a schematic view showing the structure of the above-mentioned apparatus as a whole.

1は被測定試料、2は試料より1回り大きく高精度に
仕上げられた基準平面2′を有する試料積載台である。
Reference numeral 1 is a sample to be measured, and 2 is a sample loading table having a reference plane 2'which is one size larger than the sample and finished with high precision.

基準平面2′には、試料1を強制吸着するための小穴
が多数あけられており、これらの吸着用の小穴の直径お
よびその配置位置は、試料1に局部的変形を生じさせる
ことなく、試料が基準平面2′に完全に密着するように
考慮されている。
A large number of small holes for forcibly adsorbing the sample 1 are formed in the reference plane 2 ′, and the diameter and the arrangement position of the small holes for adsorbing the sample 1 do not cause local deformation in the sample 1 and Are considered to be in perfect contact with the reference plane 2 '.

基準平面2′は、第2図に示しているようにオプチカ
ルフラットに対して傾斜させている。この傾斜量は干渉
縞感度、熱変形等によって生じる干渉計と被測定面の位
置関係の変化、試料を交換した場合の干渉計と被測定面
の再現性に対して充分大きくとってあり、干渉縞の凸凹
状態は一義的に決定される。第4図はこのような測定例
を示す。
The reference plane 2'is inclined with respect to the optical flat as shown in FIG. This tilt amount is sufficiently large for the sensitivity of the interference fringes, the change in the positional relationship between the interferometer and the measured surface caused by thermal deformation, and the reproducibility of the interferometer and the measured surface when the sample is replaced. The unevenness of the stripes is uniquely determined. FIG. 4 shows an example of such measurement.

試料表面以外の基準平面2′の干渉縞は等間隔の直線
となり、試料裏面の傾斜状態を正確に表わしている。従
って、試料の表面の干渉縞より求められる凸凹状態か
ら、試料の裏面の傾斜成分を取り除くことにより、試料
裏面に対して、垂直方向の凸凹差Cを算出することがで
きる。
The interference fringes on the reference plane 2'other than the sample surface are straight lines at equal intervals, and accurately represent the inclined state of the sample back surface. Therefore, the unevenness difference C in the vertical direction with respect to the back surface of the sample can be calculated by removing the tilt component of the back surface of the sample from the uneven state obtained from the interference fringes on the front surface of the sample.

3〜8は干渉縞を形成する部分で、いわゆる斜入射干
渉法による構成となっている。
Reference numerals 3 to 8 are portions that form interference fringes and are configured by so-called oblique incidence interference method.

3は光源で、He−Neレーザ装置を用いている。光源3
から射出された光束はイクスバンダ4によって必要な大
きさの光束に拡張される。コリメータレンズ5はその前
側焦点位置にイクスバンダ4が位置するように配置し、
レーザ光束を平行光束とする。
A light source 3 uses a He-Ne laser device. Light source 3
The light flux emitted from is expanded by the extender 4 into a light flux of a required size. The collimator lens 5 is arranged so that the extender 4 is located at the front focus position,
The laser light flux is a parallel light flux.

7は被測定試料1および基準平面2′上に干渉縞を発
生させるためのプリズムであり、7′は参照面である。
8はテレビカメラ9の撮像面上に干渉縞を結像するため
の結像レンズである。
Reference numeral 7 is a prism for generating interference fringes on the sample to be measured 1 and the reference plane 2 ', and 7'is a reference surface.
Reference numeral 8 denotes an image forming lens for forming an interference fringe on the image pickup surface of the television camera 9.

テレビカメラ9にズーム機能を備えれば小径の試料を
拡大して測定することができる。
If the TV camera 9 is provided with a zoom function, a sample having a small diameter can be enlarged and measured.

6はレーザ光束の入射角を変える入射角調整プリズム
である。一縞の感度はレーザ光束の入射角を変えること
によって任意に変化させることができる。スイッチ15、
コントローラ14を介して、パルスモータ16を駆動させ、
入射角調整プリズム6を動かすことにより、レーザ光束
の入射角は調整される。
Reference numeral 6 denotes an incident angle adjusting prism that changes the incident angle of the laser light beam. The sensitivity of one stripe can be arbitrarily changed by changing the incident angle of the laser beam. Switch 15,
Drive the pulse motor 16 via the controller 14,
By moving the incident angle adjusting prism 6, the incident angle of the laser beam is adjusted.

入射角調整プリズム6は、映像信号を画像処理プロセ
ッサ10によって2値化信号に変換するのに、鮮明な信号
として取り出すことができるよう変調をかけるためにも
使用される。
The incident angle adjusting prism 6 is also used for converting the video signal into a binarized signal by the image processor 10 and for modulating so as to extract it as a clear signal.

画像処理プロセッサ10はテレビカメラ9を介して画像
データを取り込み、処理して被測定面の凸凹状態の解析
を行う。11はスイッチパネルで測定に際し各種の測定モ
ードを設定するためのものである。12は解析結果をプリ
ントするもので、13は解析結果を表示するためのモニタ
である。
The image processor 10 takes in the image data via the television camera 9 and processes it to analyze the unevenness of the surface to be measured. 11 is a switch panel for setting various measurement modes at the time of measurement. Reference numeral 12 is for printing the analysis result, and reference numeral 13 is a monitor for displaying the analysis result.

以上のような構成の実施例において、次にその動作を
説明する。
The operation of the embodiment having the above configuration will be described below.

試料積載台2は、図示なき駆動手段にて、その基準平
面2′上に試料1を載せ、強制吸着した後、所定の測定
位置に移動する。
The sample loading table 2 is moved to a predetermined measurement position after the sample 1 is placed on the reference plane 2 ′ by the driving means (not shown) and is forcibly adsorbed.

光源3から出射したレーザ光束はイクスパンダ4によ
り光束を拡げられ、コリメータレンズ5で平行光束とな
る。平行光束となったレーザ光は入射角調整プリズム6
にてレーザ光の入射角が調整され、プリズム7に入射す
る。プリズムの参照面7′を透過して試料1表面で反射
した光束と参照面7′で反射した光束とが干渉現象を起
こす。
The laser light flux emitted from the light source 3 is expanded by the expander 4 and becomes a parallel light flux by the collimator lens 5. The laser light that has become a parallel light beam is incident angle adjustment prism 6
The incident angle of the laser light is adjusted by and is incident on the prism 7. The light flux transmitted through the reference surface 7'of the prism and reflected on the surface of the sample 1 and the light flux reflected by the reference surface 7'cause an interference phenomenon.

干渉現象を起こした光束は、結像レンズ8によりテレ
ビカメラ9の撮像面に結像される。このようにして得ら
れた映像信号は画像処理プロセッサ10に画像データは送
られ、A/Dユニットを介して、画像データとして収納す
る。画像データの取り込みは、前述したように干渉縞を
変調させ2回行う。
The light flux that has caused the interference phenomenon is imaged on the imaging surface of the television camera 9 by the imaging lens 8. The video signal thus obtained is sent to the image processor 10 as image data and stored as image data via the A / D unit. The image data is captured twice by modulating the interference fringes as described above.

これらの画像データを演算、フィルタリング、射影す
ることにより、試料領域の認識をし、2値化画像より干
渉縞の判別を行う。このようにして判別された干渉縞か
ら縞次数の決定等のデータの算出をし、凸凹状態の解析
を行う。
By calculating, filtering, and projecting these image data, the sample area is recognized, and the interference fringes are discriminated from the binarized image. Data such as the determination of the fringe order is calculated from the interference fringes thus determined, and the unevenness is analyzed.

解析結果に基づき、これをプリンタ12で打ち出した
り、モニタ13にその鳥瞰図、等高線図を出力する。
Based on the analysis result, this is printed out by the printer 12 or its bird's-eye view and contour map are output to the monitor 13.

[発明の効果] 本発明の構成によれば、試料表面と基準平面上とにそ
れぞれ干渉縞を形成し、両干渉縞の関係から、試料の表
面形状や厚みむら等を検知するので、干渉計と測定面の
位置関係の変動等の影響を受けず、高精度な測定ができ
る。
[Effects of the Invention] According to the configuration of the present invention, interference fringes are formed on the sample surface and the reference plane, respectively, and the surface shape, thickness unevenness, and the like of the sample are detected from the relationship between the two interference fringes. Highly accurate measurement can be performed without being affected by changes in the positional relationship between the measurement surface and the like.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の1実施例の装置全体の構造を示す概略
図、第2図は基準平面2′の状態を説明する図、第3図
は従来装置により得られた表面形状の測定例を示す図、
第4図は実施例の装置による測定例である。 1:被測定試料 2:試料積載台、2′:基準平面 6:入射角調整プリズム、7:プリズム 9:テレビカメラ 10:画像処理プロセッサ
FIG. 1 is a schematic view showing the structure of the entire apparatus of one embodiment of the present invention, FIG. 2 is a view for explaining the state of a reference plane 2 ', and FIG. 3 is an example of measuring the surface shape obtained by a conventional apparatus. Showing the figure,
FIG. 4 shows an example of measurement by the apparatus of the embodiment. 1: sample to be measured 2: sample loading platform, 2 ': reference plane 6: incident angle adjusting prism, 7: prism 9: TV camera 10: image processor

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】試料を吸着する吸着手段を持ち,吸着され
る試料の領域を越えて干渉縞を形成できる精度に仕上げ
られた基準平面を有する試料載置台と、 試料及び基準平面にそれぞれ干渉縞を形成する干渉縞形
成光学系と、 試料及び基準平面の干渉縞を撮像し、撮像された試料及
び基準平面の各干渉縞情報に基づいて試料を評価する評
価手段と、 を有することを特徴とする試料形状測定装置。
1. A sample mounting table having suction means for sucking a sample and having a reference flat surface finished with an accuracy capable of forming interference fringes beyond the area of the sample to be sucked, and the interference fringes on the sample and the reference flat surface, respectively. An interference fringe forming optical system for forming an image, an evaluation means for imaging the interference fringes of the sample and the reference plane, and evaluating the sample based on each interference fringe information of the imaged sample and the reference plane. Sample shape measuring device.
【請求項2】請求項1の評価手段は、前記試料及び基準
平面の干渉縞を撮像した画像を処理する画像処理手段
と、該画像処理手段により得られた情報に基づいて試料
を解析する解析手段とを備えていることを特徴とする試
料形状測定装置。
2. The evaluation means according to claim 1, wherein an image processing means for processing an image of the interference fringes of the sample and the reference plane, and an analysis for analyzing the sample on the basis of the information obtained by the image processing means. And a sample shape measuring device.
【請求項3】請求項1の試料載置台は、前記基準平面を
オプチカルフラット面に対して傾斜させていることを特
徴とする試料形状測定装置。
3. The sample shape measuring apparatus according to claim 1, wherein the reference plane is tilted with respect to an optical flat surface.
JP62156212A 1987-06-23 1987-06-23 Sample shape measuring device Expired - Lifetime JP2557650B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62156212A JP2557650B2 (en) 1987-06-23 1987-06-23 Sample shape measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62156212A JP2557650B2 (en) 1987-06-23 1987-06-23 Sample shape measuring device

Publications (3)

Publication Number Publication Date
JPS64406A JPS64406A (en) 1989-01-05
JPH01406A JPH01406A (en) 1989-01-05
JP2557650B2 true JP2557650B2 (en) 1996-11-27

Family

ID=15622811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62156212A Expired - Lifetime JP2557650B2 (en) 1987-06-23 1987-06-23 Sample shape measuring device

Country Status (1)

Country Link
JP (1) JP2557650B2 (en)

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JP2006266958A (en) * 2005-03-25 2006-10-05 Tosoh Corp Method and instrument for measuring unevenness in thickness of flat plate
US11333607B2 (en) 2018-10-02 2022-05-17 Electronics And Telecommunications Research Institute Fluorescent signal detection apparatus using diagnostic kit

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JP4529227B2 (en) * 2000-04-19 2010-08-25 Nok株式会社 Plane inspection apparatus and plane inspection method
JP5282489B2 (en) * 2008-09-02 2013-09-04 住友ベークライト株式会社 Film surface shape measuring jig and measuring method

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JPS5985906U (en) * 1982-12-01 1984-06-11 富士写真光機株式会社 Flatness measuring device
JPS60209106A (en) * 1984-03-31 1985-10-21 Konishiroku Photo Ind Co Ltd Flatness inspecting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266958A (en) * 2005-03-25 2006-10-05 Tosoh Corp Method and instrument for measuring unevenness in thickness of flat plate
JP4559271B2 (en) * 2005-03-25 2010-10-06 東ソー株式会社 Method and apparatus for measuring thickness unevenness of flat plate
US11333607B2 (en) 2018-10-02 2022-05-17 Electronics And Telecommunications Research Institute Fluorescent signal detection apparatus using diagnostic kit

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