JP2021189064A - Probe needle and probe unit - Google Patents

Abstract

To provide a probe needle and a probe unit which do not increase in the wire diameter even if the plating thickness is increased and which can achieve a narrow pitch in a probe needle for inspection mainly used for the continuity inspection of an electronic component and a substrate or the like.SOLUTION: In a probe needle 10 which includes: a body part 6 having an insulating coating film 2 on the outer periphery of a pin-shaped metal conductor 1; and an end part 3 having no insulating coating film at both ends of the metal conductor 1, a plating layer 4 within the range of thickness 1 μm or more and 5 μm or less is formed only in the end part 3. When the outer diameter of the body part 6 is D3 and the outer diameter of the end part 3 is D2, it is preferable that [(D3 - D2)/2] is within the range of 1.5 μm to 5 μm.SELECTED DRAWING: Figure 2

Description

The present invention mainly relates to a probe needle and a probe unit for inspection used for continuity inspection of electronic parts and substrates.

In recent years, various circuit boards such as high-density mounting boards used for mobile phones and IC package boards such as BGA (Ball Grid Array) and CSP (Chip Size Package) incorporated in personal computers and the like have been widely used. There is. In such a circuit board, in the steps before and after mounting, for example, measurement of DC resistance value, continuity inspection, and the like are performed, and the quality of the electrical characteristics of such a circuit board is inspected. The quality of the electrical characteristics is inspected using an inspection device jig (hereinafter referred to as "probe unit") connected to the inspection device for measuring the electrical characteristics. For example, the shape of a pin attached to the probe unit. This is done by bringing the tip of the probe needle of the above into contact with the electrode of the circuit board (hereinafter, also referred to as “measured object”).

In particular, recently, the pitch of the electrodes of the object to be measured has become narrower, and it is required that the probe needles mounted on the probe unit are also arranged at a narrow pitch. As a probe needle that meets such a demand, for example, Patent Document 1 proposes a probe and a method for manufacturing a probe used for a continuity inspection of a fine printed wiring board. The probe for continuity inspection is composed of a conductive wire and an insulating film covering the wire. The insulating film is formed of an inorganic insulator, and the entire wire is covered with a plating layer by electrolytic plating. It has been.

Japanese Unexamined Patent Publication No. 2017-215221

In Patent Document 1, a plating layer is provided by electroplating on the entire conductor cut to a predetermined length, and then an insulating layer is provided. Therefore, the plating layer has the effect of suppressing an increase in contact resistance with an electrode. Play. In particular, since the probe needle and the electrode come into contact with each other repeatedly, a thick plating thickness is preferable in order to maintain good contact for a long period of time. However, if the plating thickness is increased, the outer diameter becomes large, and there is a drawback that it cannot meet the recent demand for narrower pitch.

The present invention has been made to solve the above problems, and an object thereof is a probe needle for inspection mainly used for continuity inspection of electronic parts and substrates, even if the plating thickness is increased. It is an object of the present invention to provide a probe needle and a probe unit which can realize a narrow pitch without increasing the size.

(1) The probe needle according to the present invention is a probe needle having a body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor and ends having no insulating coating on both ends of the metal conductor. It is characterized in that a plating layer having a thickness of 1 μm or more and 5 μm or less is formed only on the portion.

According to the present invention, since the plating layer having a thickness within the above range is formed only at the end portion, the wire diameter of the metal conductor of the body portion can be reduced by the thickness of the plating layer. As a result, the diameter of the probe needle can be reduced, and the demand for narrowing the pitch in the probe unit can be met. In this case, as compared with the case where the plating layer is provided on the metal conductor of the body portion, the thickness of the insulating film of the body portion can be increased by the thickness of the plating layer, and the withstand voltage of the body portion can be increased. .. Further, in the probe unit equipped with this probe needle, an increase in contact resistance with the electrode of the object to be measured can be suppressed by the provided plating layer, and repeated contact between the probe needle and the electrode can be maintained well for a long period of time. can.

In the probe needle according to the present invention, when the outer diameter of the body portion is D3 and the outer diameter of the end portion is D2, [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less. It is preferable to have.

According to the present invention, the above numerical range represents the thickness of the end portion of the insulating coating that abuts on the peripheral edge of the guide hole of the probe unit. Can be done.

In the probe needle according to the present invention, it is preferable that the plating layer is a single layer or a plurality of layers selected from a nickel plating layer, a gold plating layer and a rhodium plating layer.

In the probe needle according to the present invention, it is preferable that the outer diameter of the metal conductor is within the range of 8 μm or more and 120 μm or less.

(2) The probe unit according to the present invention has a fuselage portion having an insulating coating on the outer periphery of a pin-shaped metal conductor, a probe needle having both ends of the metal conductor having no insulating coating, and the probe. It has a support plate arranged on the side of the object to be measured having a guide hole to which the needle is mounted, and the end portion of the insulating coating of the probe needle is applied to the peripheral edge of the guide hole of the support plate and the measurement is performed. A probe unit used for inspection performed by contacting the tip of the metal conductor with the electrode of the body.
It is characterized in that a plating layer having a thickness of 1 μm or more and 5 μm or less is formed only on the end portion of the probe needle.
, Characterized by that.

According to the present invention, since the probe needle according to the present invention is provided, the diameter of the probe needle can be reduced, and the request for narrowing the pitch in the probe unit can be met. Further, in the probe unit equipped with this probe needle, an increase in contact resistance with the electrode of the object to be measured can be suppressed by the provided plating layer, and repeated contact between the probe needle and the electrode can be maintained well for a long period of time. can.

In the probe unit according to the present invention, when the outer diameter of the body portion is D3 and the outer diameter of the end portion is D2, [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less. It is preferable that the gap G between the probe needles mounted in the guide hole is within the range of 2 μm or more and 10 μm or less.

According to the present invention, the numerical range of the above [(D3-D2) / 2] represents the thickness of the end portion of the insulating coating that abuts on the peripheral edge of the guide hole of the probe unit. Contact with the perimeter of the hole can be made. Further, since the gap G between the probe needles is within the above range, it is possible to secure a gap between adjacent probe needles even when the pitch is narrowed.

According to the present invention, in a probe needle for inspection mainly used for continuity inspection of electronic parts and substrates, the wire diameter does not increase even if the plating thickness is increased, and a narrow pitch can be realized. In particular, since the wire diameter of the metal conductor of the body portion can be reduced by the thickness of the plating layer, the diameter of the probe needle can be reduced, and the demand for narrowing the pitch in the probe unit can be met. Further, as compared with the case where the plating layer is provided on the metal conductor of the body portion, the thickness of the insulating film of the body portion can be increased by the thickness of the plating layer, and the withstand voltage of the body portion can be increased. Further, even when the pitch is narrowed, it is possible to secure a gap between adjacent probe needles.

It is explanatory drawing which shows an example of the probe needle which concerns on this invention. It is sectional drawing of the probe needle which concerns on this invention. It is explanatory drawing which shows an example of the probe unit which concerns on this invention.

The probe needle and the probe unit according to the present invention will be described with reference to the drawings. The embodiments described below are examples of the technical idea of the present invention, and the technical scope of the present invention is not limited to the following description and drawings, but inventions of the same technical idea. Includes.

[Probe needle]
As shown in FIGS. 1 and 2, the probe needle 10 according to the present invention has a body portion 6 having an insulating coating 2 on the outer periphery of a pin-shaped metal conductor 1 and insulating coatings 2 at both ends of the metal conductor 1. It is characterized in that it has a non-existing end portion 3 and a plating layer 4 having a thickness (T2) of 1 μm or more and 5 μm or less is formed only on the end portion 3.

In such a probe needle 10, since the plating layer 4 having a thickness T2 within the above range is formed only on the end portion 3, the outer diameter D1 of the metal conductor 1 of the body portion 6 is adjusted by the thickness of the plating layer 4. It can be made thinner. As a result, the diameter of the probe needle 10 can be reduced, and the request for narrowing the pitch in the probe unit 60 can be met. In this case, as compared with the case where the plating layer 4 is provided on the metal conductor 1 of the body portion 6, the thickness T1 of the insulating coating 2 of the body portion 6 can be made thicker by the thickness (T1) of the plating layer 4, and the body can be made thicker. The withstand voltage of the part 6 can be increased. Further, in the probe unit 60 to which the probe needle 10 is mounted, an increase in contact resistance of the object to be measured 11 with the electrode 12 can be suppressed by the provided plating layer 4, and repeated contact between the probe needle 10 and the electrode 12 is lengthened. It can be maintained well for a period of time. That is, the probe needle 10 according to the present invention has a special effect that the outer diameter D3 of the body portion 6 does not increase even if the plating layer 4 of the end portion 3 is thickened, and the pitch can be narrowed.

Each component will be described in detail.

As shown in FIG. 3, the probe needle 10 abuts the end portion 7 of the insulating coating 2 on the peripheral edge of the guide hole of the first support plate 20 on the side to be measured, which constitutes the probe unit 60, and is applied to the electrode 12 of the body to be measured 11. It is used in an inspection performed by contacting the tip 1a of the metal conductor 1. The probe needle 10 has a metal conductor 1 and an insulating coating 2 provided in a region (body portion 6) other than at least both ends of the metal conductor 1.

(Metal conductor)
The metal conductor 1 is a pin-shaped conductor processed to a predetermined length, and is formed by cutting a metal wire (also referred to as “metal spring wire”) having high conductivity and high elastic modulus. Examples of the metal used for the metal conductor 1 include metals having a wide elastic range, such as copper alloys such as silver-copper alloys, tin-copper alloys, and beryllium-copper alloys, palladium alloys, tungsten, renium tungsten, and steel (for example). High-speed steel: SKH) and the like can be preferably used. In particular, as shown in Examples described later, tungsten, rhenium tungsten and the like having high strength characteristics and capable of reducing the diameter are preferable.

The metal conductor 1 is usually subjected to plastic working such as cold or hot wire drawing until the metal becomes a linear conductor having a predetermined diameter. The diameter D1 of the metal conductor 1 is required to be reduced in diameter due to the recent demand for narrower pitch, and is in the range of 8 μm or more and 120 μm or less depending on the gap G of the adjacent probe needles 10 in the probe unit 60. Of these, it can be arbitrarily selected from the range of preferably 10 to 110 μm.

The shapes of the front end 1a and the rear end 1b on the front end side and the rear end side of the metal conductor 1 are not shown, but are hemispherical, conical, conical with a hemispherical shape at the tip, conical shape with a flat tip, and the like. Can be selected from. The "hemispherical shape" and "conical shape" referred to here include an accurate hemisphere and a cone, but also include a substantially conical shape and a substantially hemisphere.

At the end 3 of the metal conductor 1 (the portion where the insulating coating 2 is not provided), in order to suppress an increase in the contact resistance value between the metal conductor 1 and the electrode 12 or the lead wire 50 of the inspection device, FIG. As shown in, the plating layer 4 is provided only on the end portion 3. Examples of the metal forming the plating layer 4 include metals such as nickel, gold and rhodium, and alloys such as gold alloys. Specifically, the plating layer 4 may be a single layer or a plurality of layers selected from a nickel plating layer, a gold plating layer and a rhodium plating layer. As the multi-layered plating layer 4, a layer in which a gold plating layer is formed on a nickel plating layer can be preferably mentioned. The plating layer 4 is formed only on the surface of the exposed metal conductor 1 after cutting the metal conductor 1 on which the insulating film 2 is formed, peeling the insulating film 2 and processing the end portion of the metal conductor 1. ..

The thickness T2 of the plating layer 4 can be in the range of 1 μm or more and 5 μm or less, but as shown in Examples described later, it is preferably 1.2 μm or more and 5 μm or less. Since the plating layer 4 having such a thickness T2 is formed only on the end portion 3, the wire diameter of the metal conductor 1 of the body portion 6 can be reduced by the thickness of the plating layer 4. Since the plating layer 4 is provided only at the end portion, the thickness T1 of the insulating coating 2 of the body portion 6 is increased to the plating layer 4 as compared with the case where the plating layer 4 is provided on the entire length of the metal conductor 1 (also on the body portion 6). The thickness can be increased by the thickness (T2) of the body portion 6, and the withstand voltage of the body portion 6 can be increased.

As described above, in the present invention, even if the plating layer 4 at the end portion 3 is thickened, the outer diameter D3 of the body portion 6 does not become large, and a special effect that the pitch can be narrowed can be obtained. The thickly provided plating layer 4 has the effect of suppressing an increase in contact resistance with the electrode 12 and further maintaining good repeated contact with the electrode 12 for a long period of time.

The probe needle 10 can be easily attached to the probe unit 60, and the tip 1a of the probe needle 10 is caught on the peripheral edge of the guide hole 21 of the first support plate 20 when the probe unit 60 is used. From the viewpoint of preventing the movement from being hindered, the straightness of the metal conductor 1 is preferably high, and specifically, the straightness is preferably 1000 mm or more with a radius of curvature R.

(Insulation film)
As shown in FIGS. 1 and 2, the insulating coating 2 is provided on the outer periphery of a region other than the ends 3 and 3 on at least both sides of the metal conductor 1. The portion having the insulating coating 2 is referred to as a body portion 6, the portion not provided with the insulating coating 2 is referred to as an end portion 3, and the tip of the end portion 3 is referred to as a tip 1a and a rear end 1b.

The constituent material of the insulating coating 2 is not particularly limited, but is preferably composed of one or more resin materials selected from, for example, polyurethane, polyester, polyesterimide, polyamideimide, polyimide and fluororesin. Then, it is formed of a single layer or two or more layers by the above-mentioned one or more kinds of resin materials. The insulating coating 2 is usually preferably formed on a long metal conductor 1 by a continuous enamel baking method, but may be formed by another known method such as electrodeposition coating.

The insulating film 2 may be a single layer or a laminated layer of two or more layers (three layers or four layers may be used), and is not particularly limited, but it is convenient to contain a pigment or a dye so as to be distinguishable from other probe needles 10. Is. Either the pigment or the dye may be used, but from the viewpoint of not reducing the strength of the insulating film 2, it is preferable to use the pigment. As the pigment, various pigments generally used for identifying enamel wires can be adopted. An enamel paint containing such a pigment in a resin can be obtained and baked with enamel to form a colored insulating film 2.

Similar to the case of the metal conductor 1 described above, the outer diameter D3 of the body portion 6 provided with the insulating coating 2 is required to have a smaller diameter due to the request for narrowing the pitch of the electrode 12 of the object to be measured 11. It is preferably within the range of 10 μm or more and 140 μm or less, preferably within the range of 13 μm or more and 130 μm or less. In the present invention, when the outer diameter of the body portion 6 is D3 and the outer diameter of the end portion 3 is D2, it is preferable that [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less. .. This [(D3-D2) / 2] represents the thickness of the end portion 7 of the insulating coating 2 that abuts on the peripheral edge of the guide hole 21 of the first support plate 20. In the present invention, the thickness of such an end portion 7 can be secured within the range of 1.5 μm or more and 5 μm or less. Since the thickness of the end portion 3 is within this range, it is possible to perform contact with the peripheral edge of the guide hole while exhibiting a high dielectric strength.

Therefore, the thickness T1 of the insulating coating 2 is the thickness of the end portion 7 of the insulating coating 2 [(D3-D2) / 2] (μm), and the thickness T2 (μm) of the plating layer 4 described above. It becomes the sum of. [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less, and the thickness T2 of the plating layer 4 is within the range of 1 μm or more and 5 μm or less. T1 is in the range of 2.5 μm or more and 10 μm or less. The body portion 6 having the insulating film 2 having such a thickness T1 can secure a high dielectric strength.

(Probe unit)
The probe unit 60 according to the present invention includes a probe needle 10 having a body portion 6 having an insulating coating 2 on the outer periphery of a pin-shaped metal conductor 1 and end portions 3 having no insulating coating 2 at both ends of the metal conductor 1. It has a support plate 20 arranged on the side to be measured, which has a guide hole 21 to which the probe needle 10 is mounted. Specifically, as shown in FIG. 3, the support plate has a first support plate 20 arranged on the side to be measured and a second support plate 30 arranged on the inspection device side, and at least these of them. The two first support plates 20 and the second support plate 30 have guide holes 21 and 31, respectively. Then, the end portion 7 of the insulating coating 2 of the probe needle 10 is applied to the peripheral edge of the guide hole 21 of the first support plate 20 on the measured body side, and the tip 1a of the metal conductor 1 is brought into contact with the electrode 12 of the measured body 11. The inspection is done. The plating layer 4 having a thickness (T2) of 1 μm or more and 5 μm or less is formed only on the end portion 3 of the probe needle 10.

Since the probe unit 60 also has the probe needle 10 according to the present invention, the diameter of the probe needle 10 can be reduced, and the request for narrowing the pitch in the probe unit 60 can be met. Further, in the probe unit 60 to which the probe needle 10 is mounted, an increase in contact resistance of the object to be measured 11 with the electrode 12 can be suppressed by the provided plating layer 4, and repeated contact between the probe needle 10 and the electrode 12 is lengthened. It can be maintained well for a period of time.

In the probe unit 60 equipped with the probe needle 10, when the outer diameter of the body portion 6 is D3 and the outer diameter of the end portion 3 is D2, [(D3-D2) / 2] is 1.5 μm or more and 5 μm or less. It is preferably within the range, and the gap G between the probe needles 10 and 10 mounted in the guide hole 21 is preferably within the range of 2 μm or more and 10 μm or less. Since the numerical range of [(D3-D2) / 2] represents the thickness of the insulating coating end portion 7 that abuts on the peripheral edge of the guide hole of the probe unit 60, it hits the peripheral edge of the guide hole while showing a high dielectric strength. You can make contact. Further, since the gap G between the probe needles is within the above range, it is possible to secure a gap between adjacent probe needles even when the pitch is narrowed.

The second support plate 30 on the inspection device side has a guide hole 31 having an inner diameter slightly larger than the outer diameter D3 of the body portion 6. On the other hand, the first support plate 20 on the side to be measured has a guide hole 21 having an inner diameter slightly larger than the outer diameter D2 of the end portion 3. A slightly larger means that the clearance is slightly larger (eg 1-3 μm). Since the guide hole 21 is smaller than the outer diameter D3 of the body portion 6, the probe needle 10 does not slip through the guide hole 21, and the end portion 7 of the insulating coating 2 abuts on the edge of the peripheral edge of the guide hole. The guide hole 21 guides each probe needle 10 so as to accurately contact the tip 1a of the metal conductor 1 with the electrode 12 of the object to be measured 11.

In the example of FIG. 3, the probe unit 60 is positioned so that the probe needle 10 and the measured body 11 correspond to each other when inspecting the electrical characteristics of the measured body 11. The inspection of the electrical characteristics is performed by stroking the probe unit 60 up and down and using the elastic force of the probe needle 10 to press the tip 1a of the probe needle 10 against the electrode 12 of the object to be measured 11 with a predetermined pressure. .. At this time, the rear end 1b of the probe needle 10 comes into contact with the lead wire 50, and an electric signal from the object to be measured 11 is sent to an inspection device (not shown) through the lead wire 50.

This will be specifically described with reference to Examples and Comparative Examples.

[Example 1]
As the metal conductor 1, a long rhenium tungsten wire (outer diameter D1 is 10 μm) was used. The insulating film 2 was formed on the metal conductor 1 so that the thickness T1 was 3 μm by using an enamel paint for forming a polyester film. A long metal conductor 1 on which the insulating coating 2 is formed is cut with a standard cutting machine to cut out a probe needle with an insulating coating having a length of 10 mm, and predetermined ends 3 and 3 on both sides of the probe needle with the insulating coating are cut out. The length was laser stripped. A nickel plating layer having a thickness of 1 μm is provided on the surface of the metal conductor 1 exposed by peeling the insulating film 2, and then a gold plating layer having a thickness of 0.2 μm is further provided on the nickel plating layer to have a total thickness. A plating layer 4 having T2 of 1.2 μm was formed. The probe needle 10 had D1 = 10 μm, D2 = 12.4 μm, D3 = 16 μm, T1 = 3 μm, T2 = 1.2 μm, and [(D3-D2) / 2] = 1.8 μm. In Table 1, P is the pitch (μm) of the guide holes 21 in the probe unit 60, and G is the gap (μm) between the probe needles.

[Examples 2 to 8]
As for the metal conductor 1, the same rhenium tungsten wire as in Example 1 was used in Examples 2 to 4, and a tungsten wire was used in Examples 5 to 8 instead of the rhenium tungsten wire. As for the insulating film 2, Examples 2 to 5 use the same enamel paint for forming a polyester film as in Example 1, and Examples 6 to 8 use an enamel paint for forming a polyurethane film instead of the enamel paint for forming a polyester film. Was used. As for the plating layer 4, in Examples 2 to 8, a gold plating layer was provided on the nickel plating layer as in Example 1. The outer diameter D1 of the metal conductor 1, the thickness T1 of the insulating coating 2, and the thickness T2 of the plating layer 4 are shown in Table 1, respectively. Furthermore, D2, D3, [(D3-D2) / 2], P, and G are also shown in Table 1.

[Comparative Examples 1 to 8]
As for the metal conductor 1, Comparative Examples 1 to 4 used the same rhenium tungsten wire as in Example 1, and Comparative Examples 5 to 8 used a tungsten wire instead of the rhenium tungsten wire. Regarding the insulating film 2, Comparative Examples 1 to 5 used the same enamel paint for forming a polyester film as in Example 1, and Comparative Examples 6 to 8 used an enamel paint for forming a polyurethane film instead of the enamel paint for forming a polyester film. Was used. As for the plating layer 4, in Comparative Examples 1 to 8, a gold plating layer was provided on the nickel plating layer as in Example 1. The outer diameter D1 of the metal conductor 1, the thickness T1 of the insulating coating 2, and the thickness T2 of the plating layer 4 are shown in Table 1, respectively. Furthermore, D2, D3, [(D3-D2) / 2], P, and G are also shown in Table 1.

[result]
The probe needles and probe units of Examples 1 to 8 and Comparative Examples 1 to 8 are summarized in Table 1. From the results in Table 1, when D1, T1, T2, and D2 are the same, in Examples 1 to 3, the gap G of the probe needle 10 can be secured, and the probe needle 10 can be set at a narrow pitch. On the other hand, in Comparative Examples 1 to 8, the gap G of the probe needle 10 could not be secured, and even the probe needle 10 could not be set. The difference is that in Examples 1 to 8, since the plating layer 4 is not provided on the body portion 6, the outer diameter D3 of the body portion 6 can be reduced, whereas in Comparative Examples 1 to 8, the body portion can be reduced. This is because the plating layer 4 is provided on the body 6, so that the outer diameter D3 of the body portion 6 cannot be reduced. If the outer diameter of the body portion 6 is to be the same, in Comparative Examples 1 to 8, the thickness T1 of the insulating coating 2 must be reduced or the outer diameter D1 of the metal conductor 1 must be reduced, which is the former. Has a drawback that the withstand voltage becomes small and the latter has a high conductor resistance. On the other hand, in Examples 1 to 8, such a difficulty cannot occur.

1 Metal conductor 1a Tip 1b Rear end 2 Insulation coating 3 End 4 Plating layer 6 Body 7 Insulation coating end that abuts on the periphery of the guide hole 10 Probe needle 11 Measured body 12 Electrode 20 First support plate 21 Guide hole 30 2nd support plate 31 Guide hole 40 Lead wire holding plate 50 Lead wire 60 Probe unit D1 Metal conductor outer diameter D2 End diameter D3 Probe needle outer diameter T1 Insulation coating thickness T2 Plating layer thickness G Gap between probe needles

Claims (6)

In a probe needle having a fuselage portion having an insulating coating on the outer periphery of a pin-shaped metal conductor and an end portion having no insulating coating on both ends of the metal conductor, the thickness range is 1 μm or more and 5 μm or less only at the end portion. A probe needle characterized in that an inner plating layer is formed. The first aspect of the present invention, wherein when the outer diameter of the body portion is D3 and the outer diameter of the end portion is D2, [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less. Probe needle. The probe needle according to claim 1 or 2, wherein the plating layer is a single layer or a plurality of layers selected from a nickel plating layer, a gold plating layer, and a rhodium plating layer. The probe needle according to any one of claims 1 to 3, wherein the outer diameter of the metal conductor is within the range of 8 μm or more and 120 μm or less. A body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor, a probe needle having an end portion having no insulating coating at both ends of the metal conductor, and a cover having a guide hole to which the probe needle is mounted. It has a support plate arranged on the side of the measuring body, and the end of the insulating coating of the probe needle is applied to the peripheral edge of the guide hole of the support plate, and the tip of the metal conductor is in contact with the electrode of the measured body. It is a probe unit used for inspections performed by
A probe unit characterized in that a plating layer having a thickness of 1 μm or more and 5 μm or less is formed only on the end portion of the probe needle. When the outer diameter of the body portion is D3 and the outer diameter of the end portion is D2, [(D3-D2) / 2] is within the range of 1.5 μm or more and 5 μm or less, and is mounted in the guide hole. The probe unit according to claim 5, wherein the gap G between the probe needles is within the range of 2 μm or more and 10 μm or less.

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