JP2020177564A - Input device - Google Patents

Abstract

To provide a compact input device that is charged sufficiently even in a low-illuminance environment.SOLUTION: In an input device, a part 110 includes a dye sensitized power generation element 210, and a touch sensor provided on the dye sensitized power generation element 210. The dye sensitized power generation element 210 includes a first substrate 201 including a first surface 201A and a second surface 201B on the opposite side of the first surface 201A, a first electrode 203 provided on the first surface 201A of the first substrate 201, an electrolyte medium 204 provided on the first electrode 203, a first dye 208 provided in contact with the electrolyte medium 204, an oxide semiconductor layer 205 provided on the first dye 208, and a second substrate 207 provided on the oxide semiconductor layer 205.SELECTED DRAWING: Figure 4

Description

The present invention relates to an input device having a power generation element.

In recent years, keyboards that can be used without connecting to a computer by using wiring when using a computer have become widespread. Since such a keyboard is driven by a battery (storage battery) as a power source, it can be used for several hours per charge. However, when the rechargeable keyboard is used on the go, it cannot be used for a long time, and it is difficult to charge the keyboard on the go, so that the usage time is greatly restricted.

Patent Document 1 discloses an input device in which a solar cell is built in a keyboard and a signal is transmitted between the keyboard and a computer body by optical communication.

Japanese Unexamined Patent Publication No. 7-64689

As shown in Patent Document 1, when the solar cell is built in the input device, the solar cell is arranged in the peripheral area of the area where a plurality of keys are arranged. Therefore, the entire input device becomes large. Further, in a low illuminance environment, sufficient power may not be obtained.

Therefore, one of the objects of the embodiment of the present invention is to provide an input device that can sufficiently generate electricity even in a low illuminance environment and is miniaturized.

The input device according to the embodiment of the present invention includes a dye-sensitized power generation element and a touch sensor provided on the dye-sensitized power generation element, and the dye-sensitized power generation element has a first surface and a first surface. A first substrate having a second surface on the opposite side to the surface, a first electrode provided on the first surface of the first substrate, an electrolyte medium provided on the first electrode, and an electrolyte medium provided in contact with the electrolyte medium. It includes a first dye, an oxide semiconductor layer provided on the first dye, and a second substrate provided on the oxide semiconductor layer.

The input device according to the embodiment of the present invention includes a first dye sensitized power generation element, a second dye sensitized power generation element, a touch sensor on the first dye sensitized power generation element and the second dye sensitized power generation element, and the like. Each of the first dye-sensitized power generation element and the second dye-sensitized power generation element is between the first electrode, the oxide semiconductor layer facing the first electrode, and the first electrode and the oxide semiconductor layer. The electrolyte medium, the electrolyte medium, and the first dye between the oxide semiconductor layer.

(A) It is a figure explaining the outline of the input device which concerns on one Embodiment of this invention. (B) It is a figure explaining the hardware structure of the input device which concerns on one Embodiment of this invention. It is a top view of the input device which concerns on one Embodiment of this invention. It is an enlarged view of a part of the input device shown in FIG. It is sectional drawing when the two keys shown in FIG. 3 are cut along the B1-B2 line. It is sectional drawing when the two keys shown in FIG. 3 are cut along the line A1-A2. (A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. It is sectional drawing of the input device which concerns on one Embodiment of this invention. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is sectional drawing when the dye sensitizing power generation element shown in FIG. 12 is cut along the C1-C2 line. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is sectional drawing when the dye sensitizing power generation element shown in FIG. 14 is cut along the line D1-D2. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is sectional drawing when the dye sensitizing power generation element shown in FIG. 16 is cut along the E1-E2 line. It is an external view of the input device which concerns on one Embodiment of this invention.

(First Embodiment)
The input device 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 11.

<Overview of input device>
FIG. 1A is a diagram illustrating an outline of an input device 100 according to an embodiment of the present invention. The input device 100 is connected to an information processing device 10 such as a personal computer, a smartphone, or a tablet by wireless communication. The information processing device 10 can be controlled by transmitting the control signal detected by the input device 100 to the information processing device 10.

FIG. 1B is a diagram showing a hardware configuration of an input device 100 according to an embodiment of the present invention. The input device 100 includes a control unit 111, an operation unit 112, a communication unit 113, and a power generation unit 114.

The control unit 111 is, for example, a CPU (Central Processing Unit) and executes various control processes of the operation unit 112, the communication unit 113, and the power generation unit 114. The operation unit 112 corresponds to an area in which a plurality of keys 102 are arranged. When the operation unit 112 includes, for example, a touch sensor and detects that the user has touched the key 102, the operation unit 112 outputs a control signal corresponding to the key 102 that the user has contacted to the control unit of the information processing device 10. Further, the operation unit 112 includes haptics, and when it detects that the user has touched the key 102, it vibrates the contacted region as an output reaction. The communication unit 113 is a communication interface included in the input device 100. In the present embodiment, the input device 100 can be connected to the information processing device 10 via the communication unit 113. The communication unit 113 transmits a signal to the information processing device 10 by wireless communication. As the communication unit 113, for example, Bluetooth (registered trademark) can be used. The power generation unit 114 generates electric power consumed by the input device 100. The power generation unit 114 supplies the generated electric power to the control unit 111, the operation unit 112, and the communication unit 113. In one embodiment of the present invention, a dye-sensitized power generation element is used as the power generation unit 114. Hereinafter, the configuration of the dye-sensitized power generation element will be described in detail.

<Structure of dye-sensitized power generation element>
The dye-sensitized power generation element is called a Grätzel cell and has a photoanode, a counter electrode, and an electrolyte medium provided between the photoanode and the counter electrode. The optical anode typically has a conductive layer that transmits visible light and a semiconductor layer that contains a photosensitizer formed on the conductive layer. The semiconductor layer contains, for example, porous titanium oxide, and a dye is supported on the surface of the porous titanium oxide as a photosensitizer. The dye is, for example, a ruthenium (Ru) complex. The counter electrode is, for example, a platinum electrode. The electrolyte medium is, for example, an electrolyte solution containing a redox substance (mediator).

In the dye-sensitized power generation element, when the battery is irradiated with light, the dye carried on the porous titanium oxide of the photoanode is photoexcited, and then electrons are injected from the dye into the porous titanium oxide to oxidize the dye. To. The dye that has lost electrons takes electrons from iodine in the electric field solution and is reduced, and iodine receives electrons from the counter electrode and returns to the original. The configuration of the photosensitizer type power generation element according to the embodiment of the present invention will be described in detail below.

FIG. 2 is a plan view of the input device 100 according to the embodiment of the present invention. As shown in FIG. 2, a plurality of keys 102 are arranged on the upper surface of the input device 100, and the keys 102 are surrounded by a region 105. FIG. 3 is an enlarged view of a part 110 of the input device 100 shown in FIG. 2, and FIG. 4 is a cross-sectional view of the part 110 shown in FIG. 3 cut along the B1-B2 line. Note that FIG. 4 shows the configuration of the dye-sensitized power generation element 210.

The input device 100 has a dye-sensitized power generation element 210. The dye-sensitized power generation element 210 is provided with a first conductive layer 202 and a first electrode 203 that functions as a counter electrode on the first substrate 201 side, and a second conductive layer 206 that functions as an optical anode on the second substrate 207 side. The oxide semiconductor layer 205 and the dye 208, the dye 218, and the dye 228 are provided. Further, an electrolyte medium 204 is provided between the first electrode 203 and the dye 208, the dye 218, and the dye 228.

As the first substrate 201 and the second substrate 207, for example, a glass substrate or a plastic substrate is used. As the plastic substrate, for example, an organic resin such as acrylic, polyimide, polyethylene terephthalate, or polyethylene naphthalate is used. The first substrate 201 has a first surface 201A and a second surface 201B opposite to the first surface 201A. The second substrate 207 has a first surface 207A and a second surface 207B opposite to the first surface 207A. The first surface 201A of the first substrate 201 is the surface on which the first electrode 203 is provided, and the first surface 207A of the second substrate 207 is the surface on which the second conductive layer 206 is provided. Further, by using a flexible plastic substrate as the first substrate 201 and the second substrate 207, it is possible to form an input device 100 that can be bent or curved.

For example, platinum is used as the first electrode 203. The first electrode 203 has no photovoltaic force. The first electrode 203 has a function of reducing redox-based I ₃ ^- ions to I ^- ions on the surface of the first electrode 203.

The first conductive layer 202 is connected to the first electrode 203 and is connected to the electrode supply terminal.

Indium tin oxide (ITO) or fluorine-doped tin oxide (FTO) film is used as the second conductive layer 206 that functions as a photoanode on the second substrate 207 side. Further, as the oxide semiconductor layer 205, n-type semiconductors such as titanium oxide, zinc oxide, and tin oxide are used. Further, IGZO may be used as the oxide semiconductor layer 205. The oxide semiconductor layer 205 described above has absorption in the ultraviolet region. The dye 208, the dye 218, and the dye 228 are adsorbed on the oxide semiconductor layer 205 by a chemical bond (ester bond).

Inorganic dyes or organic dyes are used as the dye 208, the dye 218, and the dye 228. As the inorganic dye, for example, a Ru-based dye is used. The Ru-based dye has a long photoexcitation lifetime, and the Ru oxide species generated in the electron transfer process after photoexcitation are stable. As the Ru-based dye, RuL ₂ (NCS) ₂ , RuL ₁ (NCS) ₂ , Ru phenanthroline dye, and Ru picinoline dye are used. Alternatively, a coumarin derivative, a mercurochrome dye, or the like is used as the organic dye.

The dye 208, the dye 218, and the dye 228 have different peaks in the absorption spectrum. Therefore, the dye 208, the dye 218, and the dye 228 can represent the key 102 of the input device 100. For example, the dye 208 is used in the region 103, the dye 218 is used in the region 104, and the dye 228 is used in the region 105. Here, the area 103 corresponds to the area of the key 102. The area 104 is provided inside the area 103. In the area 104, the characters, figures, and symbols are arranged so as to form a pattern in the area 103. Further, the area 105 surrounds the area 103. At least, by making the peaks of the absorption spectra of the dye 208 provided in the region 103 and the dye 218 provided in the region 104 different from each other, characters, figures, symbols and the like can be visually identified in the input device 100. Can be displayed. Further, by making the peaks of the absorption spectra of the dye 208 and the dye 228 different from each other, the input device 100 can display the key 102 and the peripheral region of the key 102 so as to be visually distinguishable. In the region 104, it is preferable that the dye 208 and the dye 218 do not overlap with each other, and the dye 218 is preferably adsorbed on the oxide semiconductor layer 205. As described above, in the input device 100 according to the embodiment of the present invention, the arrangement of the plurality of keys 102 is represented by the dye 208, the dye 218, and the dye 228. It suffices if the area 103, the area 104, and the area 105 can be visually identified. Therefore, the dye 108 may be provided at least in the region 103 representing the key 102, and the region 104 and the region 105 may not be provided with the dye. Further, since it is sufficient that the regions 103 to 105 can be distinguished from each other, the peaks of the absorption spectra of the dyes provided in the regions 104 and 105 may be substantially the same.

The electrolyte medium 204 receives electrons from the first electrode 203 to reduce the oxidized dye 208, dye 218, and dye 228. Therefore, those having a high diffusion rate in the electrolyte medium 204 and a low redox potential are preferable. As the electrolyte medium 204, for example, an iodine-based electric field solution is used. Further, as the electric field liquid other than the iodine type, a bromine type, a cobalt type and the like are used. Further, the electrolyte medium 204 may be a liquid or a solid.

In the dye-sensitized power generation element 210, a spacer is provided to form a gap between the first electrode 203 and the oxide semiconductor layer 205 (not shown in FIG. 3). The spacer may be provided so as to surround the area where the plurality of keys are arranged (see FIG. 5), or a columnar spacer may be provided between the key 102 and the key 102.

<Input device configuration>
FIG. 5 is a cross-sectional view when the input device 100 shown in FIG. 2 is cut along the lines A1-A2. Note that FIG. 5 describes a configuration in which the touch sensor 217 is used as the input function of the input device 100 and the haptics 220 is used as the output reaction.

The touch sensor 217 is provided above the second substrate 207. In FIG. 5, the touch sensor 217 is formed directly on the second substrate 207. Alternatively, the touch sensor 217 formed on a substrate (for example, a cover material) different from the second substrate 207 may be attached to the second substrate 207 with an adhesive.

The haptics 220 are provided below the dye-sensitized power generation element 210, and specifically, are provided on the second surface 201B of the first substrate 201. The haptics 220 has a transparent electrode 212, a vibration type actuator 213, a transparent electrode 215, and a spacer 216.

The first substrate 201 uses a flexible substrate such as a plastic substrate in order to transmit the pressure when the key 102 is pressed by the user to the transparent electrode 215. ITO is used as the transparent electrode 215, and the ITO is formed on the second surface 201B of the first substrate 201. The actuator 213 is provided on the third substrate 211 via the transparent electrode 215. ITO is used as the transparent electrode 215, and ITO is formed by a sputtering method or a thin film deposition method. The spacer 216 also functions as a sealing material for bonding the actuator 213 and the transparent electrode 215. Further, the spacer 216 can provide a space 214 between the actuator 213 and the transparent electrode 215.

In the input device 100, when the key 102 is pressed by the user, the distance between the transparent electrode 212 and the transparent electrode 215 becomes narrow. As a result, a current flows through the actuator 213, causing the key 102 to vibrate. The vibration gives the user a sensation similar to the feel of pressing a physical key.

In the input device 100 according to the embodiment of the present invention, the dye-sensitized power generation element 210 is provided in the region where a plurality of keys are arranged. The dye-sensitized power generation element 210 has a power storage function. Therefore, even if there is a sudden change in the amount of light, the fluctuation of the power output can be flattened to some extent. Therefore, even if the user interferes with the power generation of the dye-sensitized power generation element 210 by hand when using the input device 100, the influence can be less than that of the solar cell. Further, unlike the solar cell, it is not necessary to separate the area where the plurality of keys are arranged and the area where the dye sensitizing power generation element 210 is arranged, so that the input device 100 can be miniaturized.

<Manufacturing method of input device 100>
Next, a method of manufacturing the input device 100 according to the embodiment of the present invention will be described with reference to FIGS. 6 to 9.

FIG. 6A is a step of forming the first substrate 201, the first conductive layer 202, and the first electrode 203 on the support substrate 231. The support substrate 231 is a substrate used when forming a plastic substrate as the first substrate 201. As the support substrate 231, for example, a glass substrate is used. First, the first substrate 201 is formed on the support substrate 231. Here, polyimide is used as the first substrate 201. Next, the first conductive layer 202 is formed on the first substrate 201. The first conductive layer 202 is formed by a vapor deposition method using a metal mask. Next, the first electrode 203 is formed on the first conductive layer 202. Similarly, the first electrode 203 is also formed by a vapor deposition method using a metal mask.

FIG. 6B is a step of forming the second conductive layer 206, the oxide semiconductor layer 205, and the dye 208, the dye 218, and the dye 228 on the second substrate 207. In FIG. 6B, the dye 208 and the dye 218 are not shown. As the second substrate 207, for example, a glass substrate or a plastic substrate can be used. When a glass substrate is used as the second substrate 207, the second conductive layer 206 and the oxide semiconductor layer 205 can be formed by a sputtering method. Further, the second conductive layer 206 and the oxide semiconductor layer 205 can be processed by photolithography. When a plastic substrate is used as the second substrate 207, the second substrate 207 may be formed on the support substrate in the same manner as in the step of forming the first substrate 201. Next, the dye 208, the dye 218, and the dye 228 are formed on the oxide semiconductor layer 205. It is preferable that the dye 208, the dye 218, and the dye 228 have different peaks in the absorption spectra. Dye 208 is used in region 103, dye 218 is used in region 104, and dye 228 is used in region 105. In addition, in FIG. 6B, dye 228 is shown.

FIG. 7A is a diagram illustrating a step of forming the spacer 209 on the second substrate 207 and forming the electrolyte medium 204 in the region surrounded by the spacer 209. The spacer 209 is formed so as to surround the peripheral edge of the second substrate 207. Further, the electrolyte medium 204 is formed in the region surrounded by the spacer 209.

FIG. 7B is a diagram illustrating a step of bonding the first substrate 201 and the second substrate 207. The bonding of the first substrate 201 and the second substrate 207 may be performed in the atmosphere or in a vacuum. By irradiating the spacer 209 with light after the first substrate 201 and the second substrate 207 are bonded together, the spacer 209 is cured and the first substrate 201 and the second substrate 207 can be adhered to each other.

FIG. 8A describes a step of forming the transparent electrode 215 on the second surface 201B of the first substrate 201 after peeling the dye-sensitized power generation element 210 formed on the first substrate 201 from the support substrate 231. It is a figure to do. Here, a transparent electrode is used as the transparent electrode 215.

FIG. 8B is a diagram illustrating a step of forming the actuator 213, the transparent electrode 212, and the spacer 216 on the third substrate 211. A transparent electrode 212 is formed on the third substrate 211. Next, a vibration type actuator 213 is provided on the transparent electrode 212. Next, the spacer 216 is formed on the vibration type actuator 213. The spacer 216 is formed at a height at which the transparent electrode 212 and the transparent electrode 215 face each other.

FIG. 9A is a diagram illustrating a step of attaching the third substrate 211 to the transparent electrode 215 of the first substrate 201 with the spacer 216 interposed therebetween. As a result, the dye-sensitized power generation element 210 and the haptics 220 can be formed.

Finally, by forming the touch sensor 217 on the second surface 207B of the second substrate 207, the input device 100 shown in FIG. 5 can be manufactured. The touch sensor 217 may be formed directly on the second substrate 207, or the touch sensor formed on the cover material may be attached to the second substrate 207 via an adhesive material.

(Modification example 1)
In FIG. 5, an example in which the spacer 209A is formed on the peripheral edge of the second substrate 207 has been described, but the present invention is not limited thereto. Spacer 209B may be provided in the region 105. In this case, the spacer 209B is preferably provided so as to be in contact with the oxide semiconductor layer and the first electrode. Further, the spacer 209B may be provided between the adjacent regions 103.

(Modification 2)
Next, the planar layout of the first conductive layer 202 and the second conductive layer 206 constituting the dye-sensitized power generation element 210 will be described. In FIG. 11, the difference from FIG. 5 is the configuration of the dye-sensitized power generation element 210, the first conductive layer 202, and the second conductive layer 206. Therefore, the configuration and the position where the touch sensor 217 and the haptics 220 are arranged may be referred to FIG. 5, and the illustration is omitted.

FIG. 11 is a view of the first conductive layer 202 and the second conductive layer 206 in a plan view. As shown in FIG. 11, the first conductive layer 202 and the second conductive layer 206 are arranged so as to overlap with the region where at least a plurality of keys 102 are arranged. Further, the first conductive layer 202 and the second conductive layer 206 may be formed in a peripheral region of a region in which a plurality of keys 102 are arranged. In FIG. 11, for the sake of explanation, the area of the first conductive layer 202 is shown to be larger than the area of the second conductive layer 206, but the area of the first conductive layer 202 and the area of the second conductive layer 206 are shown. It may be the same as the area of 206. Further, the terminal 222 of the first conductive layer 202 and the terminal 226 of the second conductive layer 206 are connected to the power supply terminal. The terminal 222 and the terminal 226 are connected to the control unit 111, the operation unit 112, and the communication unit 113 via the power supply terminal.

(Second Embodiment)
In the present embodiment, an input device having a plurality of dye-sensitized power generation elements 210 will be described with reference to FIGS. 12 to 17.

FIG. 12 is a view of the first conductive layer 202 and the second conductive layer 206 provided on the dye-sensitized power generation element 210 in a plan view. As shown in FIG. 12, it is divided into a plurality of first conductive layers 202A to 202D, and is divided into a plurality of second conductive layers 206A to 206D. The plurality of first conductive layers 202A to 202D are connected in parallel, and the plurality of second conductive layers 206A to 206D are connected in parallel. That is, the configuration is equivalent to that a plurality of dye sensitizing power generation elements 210A to 210D are connected in parallel.

FIG. 13 is a cross-sectional view taken along the line C1-C2 shown in FIG. As shown in FIG. 13, in the plurality of dye-sensitized power generation elements 210A to 210D adjacent to each other, the stacking order of the first electrode 203, the oxide semiconductor layer 205, the electrolyte medium 204, and the dye 228 is the same. For example, the stacking order of the first electrode 203, the oxide semiconductor layer 205, the electrolyte medium 204, and the dye 228 included in the dye sensitized power generation element 210A is the first electrode 203, the oxide semiconductor layer included in the dye sensitized power generation element 210B. The order of stacking 205, the electrolyte medium 204, and the dye 228 is the same.

When dividing into a plurality of first conductive layers 202A to 202D, the first electrode 203 may be patterned in the same manner as the first conductive layers 202A to 202D. Alternatively, the first electrode 203 may be formed so as to overlap the entire plurality of first conductive layers 202A to 202D without patterning. Although the dye is adsorbed on the oxide semiconductor layer 205, it is difficult to adsorb on the first electrode 203. Therefore, for example, when the dye 228 is provided in the region between the first conductive layer 202A and the first conductive layer 202B, the oxide semiconductor layer 205 is not patterned, and the plurality of first conductive layers 202A to 202D are formed. It is preferable to form it so as to overlap with the whole.

(Modification 3)
Next, the planar layout of the first conductive layer 202 and the second conductive layer 206 constituting the dye-sensitized power generation element 210 which is partially different from FIG. 11 will be described.

FIG. 14 is a view of the first conductive layer 202 and the second conductive layer 206 in a plan view. As shown in FIG. 14, it is divided into a plurality of first conductive layers 202A to a plurality of first conductive layers 202D, and is divided into a plurality of second conductive layers 206A to a second conductive layer 206D. The difference from FIG. 12 is that a plurality of dye sensitizing power generation elements 210A to 210D are connected in series. The first conductive layers 202A to 202D are connected to each other. On the other hand, the second conductive layer 206B and the second conductive layer 206C are connected. The second conductive layer 206A and the second conductive layer 206D are separated from each other. The terminal 222A of the second conductive layer 206A and the terminal 222B of the second conductive layer 206D are connected to different power supply terminals.

FIG. 15 is a cross-sectional view taken along the line D1-D2 shown in FIG. As shown in FIG. 15, the first conductive layer 202A, the first electrode 203A, the electrolyte medium 204A, the dye 228A, the oxide semiconductor layer 205A, and the second conductive layer 206A are laminated in this order from the first substrate 201 side. .. Further, the first conductive layer 202A, the oxide semiconductor layer 205B, the dye 228B, the electrolyte medium 204, the first electrode 203B, and the second conductive layer 206B are laminated in this order from the first substrate 201 side. That is, the stacking order of the dye sensitizing power generation element 210A is opposite to the stacking order of the dye sensitizing power generation element 210B. Further, the first conductive layer 202C, the first electrode 203C, the electrolyte medium 204C, the dye 228C, the oxide semiconductor layer 205C, and the second conductive layer 206C are laminated in this order from the first substrate 201 side. Further, the first conductive layer 202D, the oxide semiconductor layer 205D, the dye 228D, the electrolyte medium 204D, the first electrode 203D, and the second conductive layer 206D are laminated in this order from the first substrate 201 side. That is, the adjacent dye sensitizing power generation elements 210A to 210D are connected while being interchanged in the stacking order.

(Modification example 4)
Next, the planar layout of the first conductive layer 202 and the second conductive layer 206 constituting the dye-sensitized power generation element 210 which is partially different from FIG. 11 will be described.

FIG. 16 is a view of the first conductive layers 202A to 202D and the second conductive layers 206A to 206D in a plan view. As shown in FIG. 16, it is divided into a plurality of first conductive layers 202A to 202D, and is divided into a plurality of second conductive layers 206A to 206D. Also in FIG. 16, the configuration is equivalent to that of a plurality of dye sensitizing power generation elements 210A to 210D connected in series. The difference from FIG. 14 is that the first conductive layers 202A to 202D and the second conductive layers 206A to 206D are connected inside the dye sensitizing power generation element 210.

FIG. 17 is a cross-sectional view taken along the line E1-E2 shown in FIG. As shown in FIG. 17, the first electrodes 203A to 203D are formed on the first conductive layers 202A to 202D, and the second conductive layers 206A to 206D are formed via the oxide semiconductor layers 205A to 205D. Dyes 228A-228D are provided. The first conductive layer 202A partially overlaps with the second conductive layer 206B. In the region where the first conductive layer 202A and the second conductive layer 206B are overlapped with each other, the first conductive layer 202 and the second conductive layer 206B are connected by the conductive sealing material 219. Further, the first conductive layer 202B partially overlaps with the second conductive layer 206C. In the region where the first conductive layer 202B and the second conductive layer 206C are overlapped with each other, the first conductive layer 202B and the second conductive layer 206C are connected by the conductive sealing material 219. Further, the conductive sealing material 219 is surrounded by a spacer 209, and insulates the adjacent first conductive layer 202 and the adjacent second conductive layer 206.

(Modification 5)
In the input device 100 according to the embodiment of the present invention, the configuration in which the dye-sensitized power generation element 210 is provided in the region where the plurality of keys 102 are arranged has been described, but the region where the dye-sensitized power generation element 210 is provided is included in this. Not limited. For example, the dye sensitizing power generation element 230A may be provided on the side surface of the housing 101 of the input device 100.

FIG. 18 shows an external view of the input device 100 according to the embodiment of the present invention. As shown in FIG. 18, a dye sensitizing power generation element 210 is provided on the side surface of the housing 101 of the input device 100. One dye-sensitizing power generation element 210 may be provided so as to surround the side surface of the housing 101, or the dye-sensitizing power generation element 230A may be provided for each side surface of the housing 101. As a result, the amount of power generation can be increased because the light can be absorbed from the side surface as compared with the case where the light is absorbed only from the upper surface of the input device 100.

10: Information processing device, 100: Input device, 101: Housing, 102: Key, 103: Area, 104: Area, 105: Area, 110: Part, 111: Control unit, 112: Operation unit, 113: Communication unit , 114: Power generation unit, 201: First substrate, 201A: First surface, 201B: Second surface, 202: First conductive layer, 203: First electrode, 204: Electrolyte medium, 205: Oxide semiconductor layer, 206 : 2nd conductive layer, 207: 2nd substrate, 207A: 1st surface, 207B: 2nd surface, 208: dye, 209: spacer, 210: dye sensitized power generation element, 211: 3rd substrate, 212: transparent electrode , 213: Actuator, 215: Transparent electrode, 216: Spacer, 217: Touch sensor, 218: Dye, 219: Sealing material, 220: Haptics, 222: Terminal, 226: Terminal, 228: Dye, 230A: Dye sensitized power generation Element, 231: Support substrate

Claims (15)

Dye-sensitized power generation element and
Including a touch sensor provided on the dye-sensitized power generation element,
The dye-sensitized power generation element is
With the first electrode
The oxide semiconductor layer facing the first electrode and
An electrolyte medium between the first electrode and the oxide semiconductor layer,
An input device comprising the electrolyte medium and a first dye between the oxide semiconductor layer. The dye-sensitized power generation element further contains a second dye.
The first region provided with the first dye and
It has a second region provided with the second dye, and has
The second region is arranged inside the first region.
The input device according to claim 1, wherein the second dye has a peak in an absorption spectrum different from that of the first dye. The second region is arranged so as to form a pattern of characters, figures, and symbols in the first region.
The input device according to claim 2, wherein the pattern is displayed through the touch sensor. The dye-sensitized power generation element further has a third region provided with a third dye, and has a third region.
The third region is arranged so as to surround the first region.
The input device according to claim 3, wherein the third dye has a peak in the absorption spectrum different from that of the first dye. Further including haptics provided below the dye-sensitized power generation element via the first substrate,
The haptics are
The first transparent electrode provided on the first substrate and
The second transparent electrode facing the first transparent electrode and
A vibrating actuator between the first transparent electrode and the second transparent electrode,
The input device according to claim 1, further comprising the vibration actuator and a first spacer provided so that the first transparent electrode faces the first transparent electrode. The input device according to claim 5, wherein the first substrate is flexible. The dye-sensitized power generation element is
The input device according to claim 1, further comprising a second spacer forming a gap between the first electrode and the oxide semiconductor layer. The first dye-sensitized power generation element and the second dye-sensitized power generation element,
The first dye sensitized power generation element and the touch sensor on the second dye sensitized power generation element are included.
Each of the first dye-sensitized power generation element and the second dye-sensitized power generation element
With the first electrode
The oxide semiconductor layer facing the first electrode and
An electrolyte medium between the first electrode and the oxide semiconductor layer,
An input device comprising the electrolyte medium and a first dye between the oxide semiconductor layer. The input device according to claim 8, wherein the first dye-sensitized power generation element and the second dye-sensitized power generation element are connected in series. The stacking order of the first electrode, the oxide semiconductor layer, the electrolyte medium, and the first dye of the first dye-sensitized power generation element is the first electrode of the second dye-sensitized power generation element. The input device according to claim 9, wherein the order of laminating the oxide semiconductor layer, the electrolyte medium, and the first dye is the same. The stacking order of the first electrode, the oxide semiconductor layer, the electrolyte medium, and the first dye of the first dye-sensitized power generation element is the first electrode of the second dye-sensitized power generation element. The input device according to claim 9, wherein the order of laminating the oxide semiconductor layer, the electrolyte medium, and the first dye is opposite. The input device according to claim 8, wherein the first dye-sensitized power generation element and the second dye-sensitized power generation element are connected in parallel. The stacking order of the first electrode, the oxide semiconductor layer, the electrolyte medium, and the first dye of the first dye-sensitized power generation element is the first electrode of the second dye-sensitized power generation element. The input device according to claim 12, wherein the order of laminating the oxide semiconductor layer, the electrolyte medium, and the first dye is the same. Further including a haptics provided below the first dye-sensitized power generation element and the second dye-sensitized power generation element via a first substrate.
The haptics are
The first transparent electrode provided on the first substrate and
The second transparent electrode facing the first transparent electrode and
A vibrating actuator between the first transparent electrode and the second transparent electrode,
The input device according to claim 8, further comprising the vibration actuator and a first spacer provided so that the first transparent electrode faces each other. The input device according to claim 14, wherein the first substrate is flexible.

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