JP2020154360A - Server cooling apparatus, server system and server cooling method - Google Patents

Abstract

To provide a liquid-cooling type server cooling apparatus etc. which can be installed in a small space.SOLUTION: A server cooling apparatus comprises: a cooling liquid pipe which is disposed in an area between a side face of a first rack on which a first server can be mounted and the side face of a second rack on which a second server can be mounted, and supplies/discharges cooling liquid; and supplying/discharging means which is connected to the cooling liquid pipe and a heat receiving part added to a heat generating part of the first server or the second server, and supplies/discharges the cooling liquid to/from the heat receiving part.SELECTED DRAWING: Figure 6

Description

The present disclosure relates to a server cooling device for cooling a server and the like.

Patent Document 1 discloses a cooling technique for circulating cold air between two servers with a heat exchanger in between.

Patent Document 2 discloses a cooling system in which a pipe for water cooling is provided on the rear side (rear end) of the server.

Patent Document 3 discloses a closed loop cooling system in which cooling towers are arranged on the front side of two calculation racks and the entire structure is closed. Air is supplied from the cooling tower from the front surface of the computer device of each calculation rack, and the exhaust gas of the computer device flows into the cooling tower from the side surface or the back surface of the calculation rack. The heat of the exhaust is recovered in the cooling tower by a water-cooled heat exchanger. The cooled air circulates to the front of the two computing racks and is used as intake air for the computer equipment to air-cool each server of the computer equipment. Since the system of Patent Document 3 has a closed structure, the heat generated by the computer device is not transferred to the outside.

Further, the system of Patent Document 3 discloses that a cooling plate is attached to a component that becomes hot and direct liquid cooling is performed. The cooling capacity can be increased by combining an air cooling and direct liquid cooling system. At this time, the piping for direct liquid cooling is arranged on the rear side of the calculation rack as is generally performed.

Japanese Unexamined Patent Publication No. 2011-1974 JP-A-2016-042350 Special Table 2016-505917

If the water-cooled pipe is arranged on the rear side of the rack as in Patent Documents 2 and 3, the installation area of the entire server system becomes large. An object of the present disclosure is to provide a liquid-cooled server cooling device or the like that can be installed in a small space.

The server cooling device according to the present disclosure is arranged in an area between the side surface of the first rack on which the first server can be mounted and the side surface of the second rack on which the second server can be mounted, and cools the coolant. It is connected to a coolant pipe for supplying and draining liquid, the coolant pipe, and a heat receiving portion added to a heat generating portion of the first server or the second server, and the coolant is supplied to the heat receiving portion. It is provided with a water supply / drainage means for supplying / draining liquid.

The server system according to the present disclosure includes a side surface of the first server, the second server, the first rack, the second rack, and the first rack on which the first server can be mounted. A coolant pipe that supplies and drains coolant, and the coolant pipe and the first server or the first server, which are arranged in an area between the second server and the side surface of a second rack on which a second server can be mounted. It is provided with a water supply / drainage means which is connected to a heat receiving part added to the heat generating part of the server 2 and supplies / drains the cooling liquid to the heat receiving part.

The server cooling method according to the present disclosure is a cooling method arranged in an area between a side surface of a first rack on which a first server can be mounted and a side surface of a second rack on which a second server can be mounted. The coolant is supplied and discharged through the liquid pipe, and the coolant is supplied by the supply and discharge means connected to the coolant pipe and the heat receiving portion added to the heat generating portion of the first server or the second server. Supply and discharge to the heat receiving part.

According to the present disclosure, it is possible to provide a liquid-cooled server cooling device or the like that can be installed in a small space.

FIG. 1 is a horizontal sectional view of a server system to which the first embodiment is applied. FIG. 2 is a vertical sectional view of the server system to which the first embodiment is applied. FIG. 3 is a diagram showing a case where a blower is used in the first embodiment. FIG. 4 is a diagram showing a case where the relay means is used in the first embodiment. FIG. 5 is a diagram showing another aspect of the supply / discharge means according to the first embodiment. FIG. 6 is a diagram showing an example of the configuration of the second embodiment. FIG. 7A is a diagram showing a first modification of the configuration of the second embodiment. FIG. 7B is a diagram showing a second modification of the configuration of the second embodiment.

[First Embodiment]
The server system according to the present embodiment and the server cooling device provided in the server system for cooling the server will be described.

<< Configuration >>
FIG. 1 is a horizontal sectional view of the server system of the first embodiment. FIG. 2 is a vertical sectional view of the AA cross section in FIG. The server system to which the server cooling device according to the present embodiment is applied has at least two server racks. In FIGS. 1 and 2, the server system includes server racks 90a and 90b. The server rack 90a is an example of a first rack, and the server rack 90b is an example of a second rack. The number of each of the server racks 90a and 90b is not limited to one, and may be two or more.

The server cooling device has at least a direct liquid cooling mechanism. The direct liquid cooling mechanism is a mechanism that supplies the cooling liquid from the piping through which the cooling liquid flows into the server and cools the electronic components with the cooling liquid. The server cooling device may include an air cooling mechanism in addition to the direct liquid cooling mechanism. The air cooling mechanism via a liquid-cooled heat exchanger is also called an indirect liquid-cooling mechanism. In the drawings corresponding to the first embodiment, both a direct liquid cooling mechanism and an air cooling mechanism are shown.

In each figure, the configuration on the side of the server rack 90a is designated by the reference numeral a, and the configuration on the side of the server rack 90b is designated by the reference numeral b.

<Server racks 90a, 90b>
A plurality of servers 20a are mounted in the vertical direction in the server rack 90a of the server system, and a plurality of servers 20b are mounted in the vertical direction in the server rack 90b. The servers 20a and 20b are examples of the first server and the second server.

In the present embodiment, the server racks 90a and 90b are arranged side by side on the floor or inside the housing at intervals from each other. The server racks 90a and 90b are arranged so that one side surface of each of the servers 20a and 20b faces each other, and the front side of the server 20a and the rear side of the server 20b face the same direction. As described above, in FIG. 1, it can be said that the server racks 90a and 90b are arranged point-symmetrically with respect to the center point of the server system.

The server racks 90a and 90b have a rack mounting mechanism. Generally, the server racks 90a and 90b are designed according to the dimensions conforming to the Electronic Industries Alliance (EIA) standard (EIA-310 standard). A server rack that complies with the EIA-310 standard is called a 19-inch rack. However, the standard of the server rack 90 to which this embodiment can be applied is not limited.

<Servers 20a, 20b>
The servers 20a and 20b suck air from the opening (intake port) on the front side (front side) and discharge the air from the opening (exhaust port) on the rear side (rear side). However, the front and rear directions of the servers 20a and 20b are opposite to each other. The servers 20a and 20b include high power consumption components such as a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). High power consumption components generate heat and become hot, so they need to be cooled in particular. By passing air through the server, high power consumption components on the server can be air-cooled. Further, high power consumption parts can be directly liquid-cooled using a cold plate or the like. The high power consumption component is arranged near the openings of the servers 20a and 20b. As shown in FIG. 2, the servers 20a and 20b are stacked and mounted on the server racks 90a and 90b in multiple stages. The servers 20a and 20b may be rack mount servers or blade servers.

The details of the air cooling mechanism and the direct liquid cooling mechanism of the server cooling device will be described later, but in this embodiment, the air cooling mechanism and the direct liquid cooling mechanism are combined. As a result, the cooling capacity of the server cooling device can be increased. By directly liquid-cooling the high-heat-generating component, for example, the heat generated due to 70% to 80% of the total power consumption of the server can be removed. The heat generated by the remaining 20% to 30% of the power consumption is air-cooled. The 20% to 30% heat that is the target of air cooling is mainly the power supply unit (AC-DC conversion), the power supply circuit of each part (DC-DC conversion), and the LSI (Large-scale Integrated Circuit) that does not directly perform liquid cooling. ) And the heat generated by the consumption of electric power in various electronic components.

<Rack mount mechanism>
The rack mounting mechanism of the server rack 90a includes four pillars (pillars 11a, 12a, 13a, 14a) for fixing the server 20a. Similarly, the rack mounting mechanism of the server rack 90b includes four pillars (pillars 11b, 12b, 13b, 14b) for fixing the server 20b. In the EIA-310 standard, the width of the rack is defined so that the distance between the centers of the columns is 465 mm. The four pillars are provided with mounting holes for mounting the servers 20a and 20b at the EIA universal pitch set by the EIA-310 standard. The servers 20a and 20b are attached to the four pillars via the rack mount rails. The rack mount rail has a unique shape for each server to be fixed. The depth of the server racks 90a and 90b is set according to the depth dimensions of the servers 20a and 20b to be mounted. The depth of the server rack 90 is generally set so that the distance between the columns is between 700 mm and 800 mm. In the present embodiment, the rack mount mechanism is not limited to the above.

In the present embodiment, the servers 20a and 20b are fixed horizontally to the rack mount mechanism, but may be fixed vertically. The ceiling side surface of the servers 20a and 20b is the upper surface, the floor side is the lower surface, and the surface other than the upper surface and the lower surface, excluding the entire surface which is the intake port side surface and the back surface which is the exhaust port side surface, is the side surface. ..

The configuration of the air cooling mechanism in the server cooling device of the server cooling device in the present embodiment will be described.

In the present disclosure, the region between the server racks 90a and 90b is referred to as a main arrangement region of the cooling mechanism. The main arrangement area of the cooling mechanism is not only the space sandwiched between the side surfaces of the server racks 90a and 90b, but also the space extending in the direction parallel to the side surfaces of the server racks 90a and 90b, that is, sandwiched between the side surfaces. Spaces protruding from the space in front of and behind the server racks 90a and 90b may be included.

<Split wall 30>
The main arrangement area of the cooling mechanism in the server cooling device may be separated from other areas by the partition walls 30a and 30b. The shape of the partition wall 30 is not limited to the form shown in FIG. The number of partition walls 30 may be one or two or more.

Of the partition walls 30a and 30b, the front side portion 31a of the server rack 90a, the front side portion 31b of the server rack 90b, the rear side portion 32a of the server rack 90a, and the rear side portion 32b of the server rack 90b are air. In order to allow inflow and outflow of, for example, a mesh structure may be used. A part 31a, 31b, 32a, 32b of the partition wall may have a structure without a wall.

When the partition wall 30 is provided, for example, it is possible to prevent the hot exhaust gas of the server rack 90a from being drawn into the server rack 90b as intake air. Therefore, the cooling efficiency of the servers 20a and 20b can be increased.

<Sealed housing 100>
The server cooling device may further include a closed housing 100. The sealed housing 100 seals the entire server rack 90a, the server rack 90b, and the main arrangement area of the cooling mechanism, for example, vertically, front, back, left, and right. By enclosing the server racks 90a and 90b, the intake and exhaust of the server 20 are confined in the sealed housing. A space serving as an air passage may be provided between the openings of the servers 20a and 20b and the walls of the sealed housing 100 before and after the openings. The degree of sealing of the sealed housing 100 is preferably as high as possible, but it may be such that air is retained inside the sealed housing 100.

When the sealed housing 100 is arranged so that the front side of the server 20a and the rear side of the server 20b face the same direction, air can be circulated in the closed housing 100.

When the closed housing 100 is provided, the air in the machine room where the servers 20a and 20b are placed can be blocked from the air inside the closed housing 100. When the air is shut off, the temperature of the water used for cooling, which will be described later, can be raised. Further, by shutting off the air, the intake air temperature of the servers 20a and 20b can be made higher than the environmental temperature of the machine room. Therefore, the power consumption of the water cooling equipment can be reduced. Further, the air conditioning equipment in the machine room cannot be used for air cooling of the server 20. Therefore, the power consumption of the air conditioner in the machine room can be reduced.

<Heat exchanger 40>
In the present embodiment, the liquid-cooled heat exchangers 40a and 40b are housed in a portion where air can flow in and out of the main arrangement region of the air cooling mechanism. The heat exchangers 40a and 40b are examples of a first heat exchanger and a second heat exchanger. For example, the heat exchanger 40 is provided on the rear side of each server rack. In FIG. 1, the server system includes heat exchangers 40a, 40b. The heat exchangers 40a and 40b take in the exhaust gas from the rear side of the servers 20a and 20b and cool them. The heat exchangers 40a and 40b supply the cooled air to the front side of the servers 20a and 20b as intake air. The heat exchangers 40a and 40b are designed so that the heights of the heat exchangers 40a and 40b are the same as the height from the bottom to the top of the server rack. Piping for supplying liquid to the water-cooled heat exchangers 40a and 40b from the outside of the server system and draining the liquid to the outside (not shown) is provided under the floor of the sealed housing 100 (on the back side of the paper in FIG. 1). Alternatively, it is connected from the ceiling (the front side of the paper in FIG. 1).

Since the air cooling mechanism of the server cooling device according to the present embodiment uses water-cooled heat exchangers 40a and 40b, it can be said that the servers 20a and 20b are indirectly water-cooled.

The configuration of the direct liquid cooling mechanism of the server cooling device in the present embodiment will be described. The direct liquid cooling mechanism includes a coolant pipe and a coolant supply / discharge means.

<Coolant piping>
As shown in FIG. 1, the coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b are arranged in the main arrangement area of the cooling mechanism. The coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b are examples of the coolant pipes. The coolant supply pipes 50a and 50b supply the coolant from the outside, and the coolant discharge pipes 60a and 60b carry the coolant to the outside. The coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b are connected to the outside of the server system from under the floor (lower side of the paper surface) and ceiling (upper side of the paper surface) of the sealed housing 100.

The coolant may be cooled by a cooling device external to the server system. In addition to the air cooling method, various cooling methods such as a method using a heat exhaust destination having a large heat capacity such as groundwater, seawater, and soil, a heat pump, and the like may be adopted for cooling the coolant.

In the present embodiment, the coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b are arranged inside the heat exchangers 40a and 40b as shown in FIG. In FIG. 1, the arrangement of the coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b is arranged in the depth direction of the main arrangement area of the cooling mechanism, but the arrangement is not limited to this. For example, the coolant pipes may be arranged so as to be arranged in the left-right direction on the paper surface of FIG.

The material and shape of the coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b are not limited. In the present embodiment, two coolant supply pipes 50a and 50b and two coolant discharge pipes 60a and 60b are arranged, but the present invention is not limited to this. There may be one pipe for each supply and one pipe for drainage, or more than two pipes. In the present embodiment, water is used as the cooling liquid, but other liquids that can be the refrigerant may be used.

The coolant supply pipes 50a and 50b include a liquid supply manifold. The coolant discharge pipes 60a and 60b are provided with a liquid drainage manifold. FIG. 1 shows a liquid supply manifold and a liquid drainage manifold. The liquid supply manifold branches the flow of the coolant in the coolant supply pipes 50a and 50b, and distributes the coolant flow into the server from the supply / discharge means described later. The drainage manifold collects the coolant that has passed through the supply / drainage means into one and drains the coolant to the coolant discharge pipes 60a and 60b. In the present embodiment, the liquid supply manifold and the liquid drainage manifold are metal branch pipes directly connected to or integrally formed with the coolant supply pipes 50a and 50b and the coolant discharge pipes 60a and 60b, and have a diameter. Is about 1 inch. However, the size and material of the liquid supply manifold and the drainage manifold do not matter.

By providing the coolant piping in the main arrangement area of the cooling mechanism, the server cooling mechanism can be provided in a small space. By arranging the coolant piping on the side surface side of the server rack, it is possible to prevent the air circulation in the sealed housing 100 from being obstructed. In addition, the number of parts can be reduced by sharing the coolant piping between the two server racks. Further, by providing the coolant pipe between the two server racks 90 and near the opening of the server 20, the length of the coolant supply / discharge means described later can be shortened.

<Means of supply and discharge>
The water supply / discharge means is connected to the liquid supply manifold and the liquid drainage manifold in communication with each other, and distributes the coolant of the coolant pipes (coolant supply pipes 50a, 50b) to the heat receiving portions added to the servers 20a, 20b. To do. In the present embodiment, the supply / discharge means is a rubber hose having a diameter of about 10 mm. However, the distribution method, material and size of the coolant of the supply / discharge means do not matter. The material may be metal, glass, or resin. A fluid coupling such as a coupling may be used for the connection between the liquid supply / drainage manifold and the liquid supply / drainage manifold and the connection between the servers 20a and 20b and the liquid supply / drainage means.

The supply / discharge means includes supply means 51a, 51b, 52a, 52b and discharge means 61a, 61b, 62a, 62b. The supply means 51a, 51b, 52a, 52b distributes the cooling liquid from the liquid supply manifold to the heat receiving portion via the liquid supply port on the front side or the rear side of the servers 20a, 20b. The heat receiving part of the server cools the high heat generating parts by the distributed coolant. The discharge means 61a, 61b, 62a, 62b discharge the hot coolant through the heat receiving portion to the drainage manifold from the drainage port on the front side or the rear side.

<Heat receiving part>
As shown by the broken line in FIG. 1, a liquid-cooled heat receiving portion is mounted on the high heat generating component (not shown) of the servers 20a and 20b. As a heat receiving unit, a heat sink attached to a general server may be removed and a cold plate may be added. A thermal interface material (TIM) such as thermal grease is applied between the high heat generating component and the cold plate. By flowing water through the cold plate, the heat of the high heat generating parts of the servers 20a and 20b can be transferred to the cooling water. The hot cooling water is carried out of the server by the discharge means. In contrast to the above-mentioned indirect water cooling that cools air with water, this cooling mechanism that directly cools high heat generating parts with water is called direct water cooling.

<< Operation >>
<Operation of indirect liquid cooling (air cooling) mechanism>
The heat radiation of the servers 20a and 20b causes air convection, and the air is discharged from the openings of the servers 20a and 20b. The air exhausted from the rear side of the server 20b is taken into the liquid-cooled heat exchanger 40a and cooled. The air cooled and exhausted by the heat exchanger 40a is taken in from the front side of the server 20a and used for cooling the server 20a. Since the front side of the server 20a and the rear side of the server 20b are arranged so as to face the same direction, and the two server racks are sealed by the sealed housing 100, air circulates in the sealed housing 100. Therefore, the exhaust gas of the server 20a is cooled by the heat exchanger 40b, and the exhausted air is taken in from the front side of the server 20b and used for cooling the server 20b. In the present embodiment, the air flow path in the closed housing 100 draws one closed curve when viewed from the ceiling side.

<Operation of direct liquid cooling mechanism>
Cooling water is supplied to the coolant piping from the outside of the server system. The cooling water passes through the water supply manifold of the coolant supply pipe 50a and is distributed to the front side of the server 20a by using the first water supply means 51a. The distributed cooling water flows in the cold plate added to the high heat generation component located on the front side in the server 20a, and directly water-cools the high heat generation component. The cooling water that has absorbed heat in the cold plate and whose temperature has risen is moved from the server 20a to the drainage manifold by using the first drainage means 61a. The cooling water whose temperature has risen is discharged to the coolant discharge pipe 60a through the drainage manifold. The heat of the server is carried to the outside of the server system through the coolant discharge pipe.

Similarly, on the rear side of the server 20a, the cooling water is distributed from the liquid supply manifold using the second water supply means 52a. The distributed cooling water cools the high heat generating component located on the rear side, and moves from the server 20a to the drainage manifold by using the second drainage means 62a. The cooled cooling water whose temperature has risen is discharged from the drainage manifold to the discharge pipe 60b, and the heat of the server is carried to the outside of the server system.

The direct water cooling operation on the front side and the rear side of the server 20b is the same as the direct water cooling operation on the server 20a.

In the present embodiment, the cooling water supplied from the water supply port on the front side is discharged from the drain port on the front side. However, the mode of the cooling water supply / discharge means is not limited to this. The cooling water supplied from the water supply port on the front side may be discharged from the drain port on the rear side through the cold plate.

<Effect of the first embodiment>
If the water-cooled pipe is arranged on the rear side of the rack as in Patent Documents 2 and 3, the installation area of the entire server system becomes large. According to this embodiment, since the coolant pipe is provided in the area between the two server racks, the server system can be installed in a small space.

In the cooling system of Patent Document 3, the exhaust gas is drawn from the side surface of the rack to the central cooling tower. Therefore, a computer board with a dedicated blade structure is required, which increases the cost. Further, when the method of Patent Document 3 is applied to a normal rack mount server, it is necessary to draw the exhaust gas so as to wrap around from the back surface of the rack to the central cooling tower, so that the depth of the rack becomes long. According to the present embodiment, since the configuration is such that air is drawn into the heat exchanger from the rear side of the server, it is possible to provide a server rack cooling system that can be installed in a small space regardless of the type of server.

Further, according to the present embodiment, since the coolant piping is arranged inside the air flow path, it is possible to provide a server system that efficiently circulates the exhaust gas of the server.

Further, according to the present embodiment, the exhaust of the server is indirectly water-cooled by the water-cooled heat exchanger, and the high heat generating parts are directly water-cooled, so that it is possible to provide a water-cooled server system. In addition, according to the present embodiment, since the server rack is surrounded by a closed housing, the server system can be cooled without relying on air conditioning in the machine room. Therefore, the power consumption can be suppressed and the operating cost of the data center or the like can be suppressed as compared with the case of increasing the air conditioning equipment in the machine room.

[Modified example of the first embodiment]
<Fan 70>
The server cooling device of the server system according to the present embodiment may include a blower fan 70 as a blower for forcibly circulating air. The fan 70 is provided in the main arrangement region of the cooling mechanism on the intake side or the exhaust side of the heat exchanger 40. FIG. 3 is a diagram showing a case where fans 70a and 70b are provided on the exhaust side of the heat exchangers 40a and 40b.

Whether the fans 70a and 70b are arranged on the intake side or the exhaust side of the heat exchangers 40a and 40b can be selected according to the parts to be used, the power consumption of the cooling target, and the like. It is possible to place the fans on both the intake side and the exhaust side, but the cooling performance does not improve significantly compared to the case where the fans are placed on one side, despite the increase in fan power consumption. There are many disadvantages. Therefore, fans are generally not placed on either side of the heat exchanger.

If the power consumption in the part that is not the target of direct liquid cooling is large, the cooling performance of the heat exchanger may be insufficient. By providing the fans 70a and 70b, a mechanism for forcibly circulating air can be provided in the immediate vicinity of the heat exchanger to improve the cooling performance by air cooling.

<Relay means>
The server cooling device of the server system according to the present embodiment may further include a cooling liquid relay means. FIG. 4 is a diagram showing a case where the supply / discharge means further includes relay means 56a, 56b, 57a, 57b. In FIG. 4, the servers 20a and 20b are provided with two water supply ports, two drainage ports, a first heat receiving unit, and a second heat receiving unit, respectively, on the front side and the rear side. The water supply port and the drain port communicate with the heat receiving unit in the server via the relay means 56a, 56b, 57a, 57b, the supply means 51a, 51b, 52a, 52b, or the discharge means 61a, 61b, 62a, 62b, respectively. Is connected. The positions of the water supply port and the drain port are not limited to the front side and the rear side, and may be provided on the side surfaces, the upper surface, and the lower surface of the servers 20a and 20b.

After the supply means 51a distributes water to the heat receiving portion via the liquid supply port on the front side of the server 20a, the first relay means 56a supplies water from the drainage port on the front side to another water supply port. To do. After that, the water passes through another heat receiving section and is discharged to the discharge means 61a.

In recent years, high-performance and high-density servers such as thin rack-mount servers that can mount not only CPUs but also a plurality of GPUs have been used. In high-density servers, many high-power consumption components are directly subject to water cooling. For example, two CPUs and eight GPUs may be provided in one server. In this case, it may be advantageous to provide two water supply / drainage units for water cooling of the CPU and GPU, for example, on the front side and the rear side of the server. Therefore, by providing the relay means, the high-density server can be effectively cooled.

<Modified example of supply / discharge means>
The mode of the supply / discharge means is not limited to the mode shown in FIG. FIG. 5 is a diagram showing another aspect of the supply / discharge means shown in FIG. The supply means 51a, 51b, 52a, and 52b shown in FIG. 5 are branched and supply the cooling liquid to the two heat receiving portions. The discharge means 61a, 61b, 62a, 62b shown in FIG. 5 collect the cooling liquid from the two heat receiving portions.

In FIGS. 1 and 5, the supply / discharge means are connected to the front side and the rear side of both the servers 20a and 20b, but the arrangement of the supply / discharge means is not limited to this. The supply / discharge means may be connected to the rear side of the server and not connected to the front side, or may be connected to the front side and not connected to the rear side.

When a plurality of servers 20 are mounted on the server rack 90, supply / discharge means may be provided for each server.

[Second Embodiment]
FIG. 6 is a diagram showing an example of a server system according to the second embodiment. In the present embodiment, the same components as those in the first embodiment are designated by the same reference numerals.

The server cooling device of the server system according to the second embodiment includes at least coolant pipes 50 and 60 and supply / discharge means 52a, 52b, 62a and 62b. In FIG. 6, the exhaust port of the server 20a and the exhaust port of the server 20b face the same direction and are arranged on the floor. The server rack 90a is an example of a first rack, and the server rack 90b is an example of a second rack. The number of each of the server racks 90a and 90b is not limited to one, and may be two or more.

The coolant piping is arranged in the area between the side surface of the server rack 90a on which the server 20a can be mounted and the side surface of the server rack 90b on which the server 20b can be mounted, and supplies and drains the coolant. The coolant pipe includes a coolant supply pipe 50 having a liquid supply manifold and a coolant discharge pipe 60 having a liquid drainage manifold. The liquid supply / drainage manifold and the liquid drainage manifold are connected to each other through the liquid supply / drainage means. The water supply / drainage means is connected to the coolant pipe and the heat receiving portion added to the heat generating portion of the servers 20a and 20b, and supplies / drains the coolant to the heat receiving portion.

<Modified example of the second embodiment>
In the second embodiment, the coolant supply pipe 50 and the coolant discharge pipe 60 are not limited to one set. 7A and 7B are diagrams showing a first modification and a second modification of the server system according to the second embodiment. In the first modification, similarly to the server rack of the server system shown in FIG. 1, the server racks 90a and 90b are arranged side by side so that the front side faces different directions. The coolant supply pipe 50b supplies the coolant to the heat receiving portion attached to the rear side of the server rack 90a via the supply means 52a. The coolant supply pipe 50a supplies the coolant to the heat receiving portion attached to the rear side of the server rack 90b via the supply means 52b. In the second modification, the server racks 90a and 90b are arranged side by side so that the front side faces the same direction. The coolant supply pipe 50a supplies the coolant to the heat receiving portion attached to the front side of the server rack 90b via the supply means 51b.

When the server racks 90a and 90b are arranged as in the first modification and the second modification, the server racks 90a and 90b share a set of coolant pipes 50 and 60 as in FIG. May be good.

<Effect of the second embodiment>
According to the present embodiment, the coolant pipe is arranged in the area between the side surface of the first rack on which the first server can be mounted and the side surface of the second rack on which the second server can be mounted. Since the drainage means supplies and drains the coolant of the coolant pipe to the heat generating portion of the first server or the second server, the server system can be installed in a space-saving manner.

Each of the above-described embodiments is merely an example embodying the present invention, and various modifications can be made within the scope of the gist of the present invention described in the claims.

100 Sealed housing 20 Server 30 Partition wall 40 Heat exchanger 50 Coolant supply piping 60 Coolant discharge piping 70 Fan

Claims (10)

A coolant pipe that is arranged in the area between the side surface of the first rack on which the first server can be mounted and the side surface of the second rack on which the second server can be mounted and supplies and drains the coolant. ,
A water supply / drainage means that is connected to the coolant pipe and the heat receiving portion added to the heat generating portion of the first server or the second server and supplies / drains the cooling liquid to the heat receiving portion. Equipped with a server cooling device. A heat exchanger arranged in the region and for cooling the air exhausted from the first server and the second server.
The server cooling device according to claim 1. The heat exchanger cools the air exhausted from the first server and supplies the air to the second server, and cools the air exhausted from the second server. Including a second heat exchanger to supply one server,
The server cooling device of claim 2. The coolant pipe is arranged inside the first heat exchanger and the second heat exchanger.
The server cooling device according to claim 3. A blower is provided on the exhaust side or the intake side of the first heat exchanger and the second heat exchanger.
The server cooling device according to claim 3 or 4. A housing that surrounds the first rack and the second rack is provided.
The first rack and the second rack are arranged so that their side surfaces face each other and the intake port of the server mounted on one rack faces the same direction as the exhaust port of the server mounted on the other rack. Being done
Any of claims 3 to 5, wherein the air flow path in the housing is formed between the first server, the second server, the first heat exchanger, and the second heat exchanger. That server cooling device. The server cooling device according to any one of claims 1 to 6, wherein the region is partitioned by a partition wall, and the partition wall partially allows air to flow in and out. The heat receiving unit includes a first heat receiving unit and a second heat receiving unit.
A relay means for relaying the coolant from the first heat receiving unit to the second heat receiving unit is provided.
The server cooling device according to any one of claims 1 to 7. With the first server
With the second server
With the first rack
With the second rack
A server system comprising the cooling device for the server according to any one of claims 1 to 8. Coolant is supplied and discharged through a coolant pipe arranged in the area between the side surface of the first rack on which the first server can be mounted and the side surface of the second rack on which the second server can be mounted.
The coolant is supplied to and discharged from the heat receiving portion by a supply and discharge means connected to the coolant pipe and the heat receiving portion added to the heat generating portion of the first server or the second server.
How to cool the server.

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