JP2019005980A - Method for manufacturing ink jet head - Google Patents

Abstract

To provide a method for manufacturing an ink jet head, by which piezoelectric elements can be provided highly densely and highly accurately and variation in ejection of ink from respective nozzles can be hindered.SOLUTION: A method for manufacturing an ink jet head 1 comprising a nozzle N, a pressure chamber 21, a vibration plate 30 and a piezoelectric element 63 is provided that comprises the steps of: adhering a piezoelectric plate 302 to a substrate 300; forming a resist layer 303; forming a mask pattern 303p; forming a piezoelectric element unit 63U and a dummy part 63D by performing a sand- blasting process; and adhering the piezoelectric element 63 to the vibration plate 30. Distances A1, A2 between the outer peripheral part of the piezoelectric element unit 63U and the dummy parts 63D are greater than distances B1, B2 between piezoelectric elements, in an arrayed direction D1 of the piezoelectric elements 63 and a direction D2 orthogonal to the direction D1.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing an inkjet head.

  2. Description of the Related Art Conventionally, an ink jet recording apparatus that forms an image on a recording medium by ejecting ink from a plurality of fine nozzles provided in an ink jet head is known. Ink ejection in such an ink jet head is performed, for example, by causing a pressure change in a pressure chamber provided in the ink jet head by a piezoelectric element or the like.

  By the way, in recent years, due to a demand for miniaturization of an inkjet head, it is required to manufacture an inkjet head in which a large number of nozzles are two-dimensionally arranged with high density and high accuracy. In such an ink jet head, the piezoelectric elements also need to be arranged two-dimensionally with high density and high accuracy.

As a method of providing piezoelectric elements by arranging them two-dimensionally at high density, a method of forming a piezoelectric plate by bonding the piezoelectric plate to a substrate and subjecting the piezoelectric plate to sandblasting is known.
However, when forming two-dimensionally arranged piezoelectric elements by sandblasting, there is a problem that the shape accuracy of the piezoelectric elements arranged on the outermost periphery is deteriorated.
Specifically, as shown in FIG. 16, in the process of forming the piezoelectric elements 63 arranged two-dimensionally on the substrate 300, the position of the sandblast nozzle 400 is positioned outside the region where the piezoelectric elements 63 are provided. In some cases, the abrasive is sprayed on the side surface of the piezoelectric element 63 arranged on the outermost periphery, and the shape accuracy of the piezoelectric element 63 deteriorates.

  Therefore, in Patent Document 1, when sandblasting, a dummy portion having the same shape as the piezoelectric element is arranged on the outer peripheral portion of the piezoelectric element at the same interval as the interval between the piezoelectric elements, thereby improving the shape accuracy of the piezoelectric element. There is a proposed method.

JP 2003-48323 A

  However, even in the method described in Patent Document 1, the piezoelectric elements are arranged side by side so as to be inclined with respect to the direction orthogonal to the arrangement direction of the piezoelectric elements, or when the piezoelectric element shape itself is viewed in plan view. In the case of a round shape, the abrasive may be sprayed from the gaps between the dummy parts when sandblasting, which solves the problem that the shape accuracy of the piezoelectric elements arranged on the outermost circumference deteriorates There were cases where it was not possible.

  The present invention has been made in view of such problems, and an object of the present invention is to provide piezoelectric elements with high density and high accuracy, and to suppress variations in ink ejection from each nozzle. It is providing the manufacturing method of an inkjet head which can be performed.

In order to solve the above-mentioned problem, the invention described in claim 1
A plurality of nozzles for ejecting ink, a plurality of pressure chambers to which ink is supplied, a vibration plate, and the nozzles by generating pressure through the vibration plate in the ink supplied to the plurality of pressure chambers A plurality of piezoelectric elements for ejecting ink from the inkjet head,
Bonding the piezoelectric plate on the substrate;
Forming a resist layer on the surface of the piezoelectric plate;
By patterning the resist layer, a piezoelectric element mask pattern for forming a piezoelectric element unit in which the plurality of piezoelectric elements are two-dimensionally arranged, and a dummy portion provided on the outer periphery of the piezoelectric element unit are provided. Forming a mask pattern having a dummy mask pattern for forming;
Applying sandblasting on the mask pattern, patterning the piezoelectric plate, and forming the piezoelectric element unit and the dummy part;
Bonding each piezoelectric element of the piezoelectric element unit to the diaphragm;
Separating the substrate from each piezoelectric element of the piezoelectric element unit,
On the substrate, the distance between the outer peripheral portion of the piezoelectric element unit and the dummy portion is greater than the distance between the piezoelectric elements in the piezoelectric element unit with respect to each of the arrangement direction of the piezoelectric elements and the direction orthogonal to the arrangement direction. Is also large.

The invention according to claim 2 is the method of manufacturing an ink jet head according to claim 1,
Among the dummy parts, the dummy part provided in the direction intersecting the main scanning direction of the sandblast when the sandblasting is performed covers at least a part corresponding to one end part to the other end part of the piezoelectric element unit. It is characterized by being formed in a single line.

According to a third aspect of the present invention, in the method of manufacturing an ink jet head according to the first or second aspect,
The dummy portion is provided so as to cover the entire outer peripheral portion of the piezoelectric element unit.

According to a fourth aspect of the present invention, in the method of manufacturing an ink jet head according to any one of the first to third aspects,
The main scanning direction of sandblasting when the sandblasting is performed is parallel to a direction in which the plurality of piezoelectric elements in the piezoelectric element unit are two-dimensionally arranged and in which the number of piezoelectric elements is arranged. And

Invention of Claim 5 is a manufacturing method of the inkjet head as described in any one of Claim 1- Claim 4,
The dummy portion is thicker than the piezoelectric element unit.

  According to the present invention, it is possible to provide an ink jet head manufacturing method in which piezoelectric elements can be provided with high density and high accuracy, and variation in ink ejection from each nozzle can be suppressed.

A perspective view showing a schematic configuration of an ink jet recording apparatus Perspective view from above of inkjet head Perspective view from below of inkjet head Sectional view cut along the III-III portion of FIG. 2A showing the main part of the inkjet head FIG. 3 is an enlarged cross-sectional view of a part of the head chip of FIG. Plan view showing the positional relationship between the spacer substrate and the piezoelectric element Plan view showing a piezoelectric element unit and a dummy part provided on a substrate Sectional view showing after bonding the piezoelectric plate to the substrate Sectional view showing after the resist layer is formed on the surface of the piezoelectric plate Sectional drawing which shows after transferring mask pattern by exposure Sectional drawing showing after forming a mask pattern by development Sectional view after sandblasting Sectional view showing the resist layer after removal The top view which shows the modification of a piezoelectric element unit and a dummy part The top view which shows the other modification of a piezoelectric element unit and a dummy part The top view which shows the other modification of a piezoelectric element unit and a dummy part Sectional drawing which shows after apply | coating an adhesive agent on the piezoelectric element surface on a board | substrate Sectional view showing the piezoelectric element after being bonded and fixed to the diaphragm Sectional view showing the substrate after peeling off from the piezoelectric element Sectional view showing just before bonding the diaphragm to the spacer substrate after applying the adhesive to the spacer substrate Sectional view showing a state where pressure is applied from both sides after bonding the diaphragm to the spacer substrate Sectional drawing which shows after peeling the holding member for adhesion from the spacer substrate Sectional view showing just before bonding the wiring board by applying adhesive to the spacer board Plan view for explaining formation of piezoelectric element by conventional sandblasting Explanatory drawing for demonstrating that an abrasive | polishing agent is sprayed on the piezoelectric element located in the outermost periphery of a piezoelectric element unit at the time of sandblasting when the distance of the outer peripheral part of a piezoelectric element unit and a dummy part is near

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the illustrated example.

[Outline of inkjet recording apparatus]
The ink jet recording apparatus 100 includes a platen 101, a transport roller 102, line heads 103, 104, 105, 106, etc. (FIG. 1).
The platen 101 supports the recording medium M on the upper surface, and transports the recording medium M in the transport direction when the transport roller 102 is driven.
The line heads 103, 104, 105, and 106 are provided in parallel in the width direction orthogonal to the transport direction from the upstream side to the downstream side in the transport direction of the recording medium M. In the line heads 103, 104, 105, 106, at least one inkjet head 1 described later is provided. For example, cyan (C), magenta (M), yellow (Y), or black ( The ink K) is ejected toward the recording medium M.
Note that although the description has been given of the embodiment of the one-pass drawing method in which the drawing is performed only by transporting the recording medium using the line head, the present invention can be applied to an appropriate drawing method, for example, the drawing using the scan method. A method may be adopted.

[Inkjet head]
The inkjet head 1 includes a head chip 2, a common ink chamber 70, a holding substrate 80, a connection member 4, a drive unit 5, and the like (FIGS. 2A, 2B, and 3).
Hereinafter, a plane provided with a plurality of nozzles N is defined as an XY plane, and directions along the plane and orthogonal to each other are defined as an X direction and a Y direction, respectively. A direction orthogonal to the XY plane is taken as a Z direction.

  The head chip 2 is configured by laminating a plurality of substrates in the Z direction, and the nozzle substrate 10 positioned at the bottom of the head chip 2 and the wiring substrate 50 positioned at the top are arranged in parallel. ing. In addition, inside the head chip 2, corresponding to each nozzle N, there are a pressure chamber 21 to which ink is supplied, and a piezoelectric element 63 as pressure generating means for applying pressure to the ink in the pressure chamber 21. Is provided. When the ink stored in the pressure chamber 21 is pressurized by the displacement of the piezoelectric element 63, ink droplets are ejected from the nozzle N communicating with the pressure chamber 21.

  The common ink chamber 70 is formed inside an ink chamber forming member 70 a provided on the top of the head chip 2, and stores ink to be supplied to the inside of the head chip 2. An ink supply portion 71 that supplies ink to the common ink chamber 70 and an ink discharge portion 72 that discharges ink from the common ink chamber 70 are provided above the ink chamber forming member 70a (FIG. 2A). The common ink chamber 70 communicates with the conduction paths 51, 41, 31 (see FIG. 4) of the head chip 2 on the lower surface.

  The holding substrate 80 is bonded to the upper surface of the head chip 2 and holds an ink chamber forming member 70 a that forms the common ink chamber 70.

  The connection member 4 is a wiring member made of, for example, FPC (Flexible Printed Circuits), and is connected to the wiring 57 (see FIG. 4) on the upper surface of the wiring substrate 50 at both ends of the head chip 2 in the X direction. . Further, the connection member 4 connected to the wiring 57 is drawn to the upper surface of the holding substrate 80 from through holes provided in the vicinity of both end portions in the X direction of the holding substrate 80.

  The drive unit 5 is configured by an IC (Integrated Circuit) or the like, and includes a power supply side terminal that outputs a drive current supplied to the piezoelectric element 63 and a grounded ground side terminal through which a current flows. Yes. The drive unit 5 is connected to the connection member 4, supplies electricity (drive potential) to the piezoelectric element 63 through the connection member 4 and the wiring 57, and displaces the piezoelectric element 63.

[Head chip]
Next, the head chip 2 will be described in detail.
The head chip 2 is formed by laminating a plurality of substrates. For example, the nozzle substrate 10, the pressure chamber substrate 20, the vibration plate 30, the spacer substrate 40, and the wiring substrate 50 are sequentially arranged from the lower side along the Z direction. They are stacked (FIG. 4).
Note that, among the directions along the Z direction, a predetermined direction in which ink is ejected is described as “downward” with the nozzle substrate 10 as a reference, and the opposite direction is described as “upward”.

  The nozzle substrate 10 is, for example, a silicon substrate, and a plurality of nozzles N are formed. For example, the nozzle N is formed by dry etching with respect to the nozzle substrate 10, so that the position and diameter of the nozzle N can be formed with higher accuracy. The nozzles N are provided in a plurality of rows with respect to a direction D2 orthogonal to the nozzle arrangement direction (piezoelectric element arrangement direction D1).

  The pressure chamber substrate 20 is a silicon substrate, for example, and is stacked on the upper surface of the nozzle substrate 10. The pressure chamber substrate 20 is formed with a pressure chamber 21 that communicates with the nozzle N and is supplied with ink.

  The vibration plate 30 is, for example, a silicon substrate, is provided on the upper surface of the pressure chamber 21, and constitutes one surface (upper surface) of the pressure chamber 21. That is, the vibration plate 30 is provided on the opposite side (upper side) to the pressure chamber 21 in a predetermined direction (lower side) in which ink is ejected. A piezoelectric element 63 is provided on the upper surface of the diaphragm 30 as pressure generating means.

The spacer substrate 40 stores a conductive path 41 serving as an ink flow path, a first storage part 42N as a part for storing the piezoelectric element 63, and a dummy part 63D between the diaphragm 30 and the wiring board 50. And a second storage section 42D as a part (FIGS. 4 and 5). The conduction path 41, the first storage portion 42N, and the second storage portion 42D penetrate the spacer substrate 40 in the Z direction.
The first storage unit 42N stores the piezoelectric elements 63 arranged two-dimensionally on the diaphragm 30. The shape of the first storage unit 42N is not particularly limited as long as the piezoelectric element 63 can be stored. For example, as illustrated in FIG. 5, the plurality of piezoelectric elements 63 arranged along the arrangement direction D1 of the piezoelectric elements 63 are all included. It has a substantially rectangular parallelepiped shape that can be stored, and is formed in a plurality of rows in a direction D2 orthogonal to the arrangement direction D1 of the piezoelectric elements.
The second storage unit 42D stores a dummy part 63D provided on the outer periphery of the piezoelectric elements 63 arranged two-dimensionally. The dummy portion 63D is formed at the same time when the two-dimensionally arranged piezoelectric elements 63 are formed, and the details will be described in a method for manufacturing the inkjet head 1 described later.
The shape of the second storage unit 42D is not particularly limited as long as the dummy unit 63D can be stored. For example, as shown in FIG. 5, it is provided along the shape of the dummy part 63D so as to be slightly larger than the dummy part 63D.

The spacer substrate 40 is preferably formed of a material having a thermal expansion coefficient close to that of the diaphragm 30 and the wiring substrate 50. For example, when the diaphragm 30 and the wiring substrate 50 are made of silicon, the spacer substrate 40 is preferably formed of silicon, 42 alloy, glass, or the like.
The first storage portion 42N and the second storage portion 42D of the spacer substrate 40 can be formed by sandblasting. From the viewpoint of being suitable for sandblasting, the spacer substrate 40 is preferably made of glass. Moreover, the glass-made transparent substrate is preferable also from a viewpoint of the ease of positioning of a member.

The spacer substrate 40 is preferably subjected to a surface treatment. As the surface treatment, for example, a plating treatment with nickel (Ni) is preferably performed. The surface treatment is performed after the spacer substrate 40 is subjected to shape processing of the conduction path 41, the first storage portion 42N, the second storage portion 42D, and the like.
Since the spacer substrate 40 can obtain resistance to rust and solvent by surface treatment, the durability of the spacer substrate 40 can be further improved. In particular, since the conductive path 41 is provided in the spacer substrate 40, the surface treatment functions effectively in order to ensure resistance to the solvent and the like contained in the ink.
The surface treatment is not limited to the plating treatment with nickel (Ni), but may be any surface treatment that can obtain rust prevention and resistance to solvents. As another specific example of the surface treatment, for example, a treatment for forming a film made of ethyl silicate such as TEOS (Tetraethyl orthosilicate) or a film made of a paraxylylene polymer such as Parylene (registered trademark) on the surface of the spacer substrate 40 may be used. Can be mentioned. As a specific process for forming the film, for example, a vapor deposition process such as sputtering can be used. These illustrations relating to the surface treatment are merely examples, and are not limited thereto.

  The piezoelectric element 63 is an actuator made of, for example, PZT (lead zirconium titanate) for deforming the vibration plate 30, and can generate pressure to the ink supplied to the pressure chamber 21 via the vibration plate 30. . The piezoelectric element 63 is provided with a first electrode 61 on the upper surface of the piezoelectric body 60 and a second electrode 62 on the lower surface.

As shown in FIG. 4, the first electrode 61 is electrically connected to the wiring 52 provided on the lower surface side of the wiring substrate 50 via the connection portion 90. The connection unit 90 is provided to connect the first electrode 61 and the wiring 52 along the Z direction.
The connection part 90 has bumps 91 formed on the wiring board 50. Specifically, the bump 91 is formed by wire bonding using gold as a material, for example. The bump 91 is formed on the lower surface of the wiring 52, for example. The wiring 52 is made of, for example, a conductive metal (for example, aluminum) plate provided so that at least the lower surface is a flat surface.
A conductive material 92 is applied to the lower end side of the bump 91. Specifically, the conductive material 92 is, for example, a conductive adhesive. The conductive adhesive is an adhesive mixed with conductive metal powder (for example, silver powder) and has conductivity.
As described above, the connection portion 90 electrically connects the wiring substrate 50 and the piezoelectric element 63 via the bump 91 formed on the wiring substrate 50 and the conductive material 92 applied to the bump 91.

  Here, the thickness of the spacer substrate 40 corresponds to the sum of the thicknesses of the piezoelectric element 63 and the connection portion 90 in the Z direction. More specifically, it is preferable to form the spacer substrate 40 as thin as 50 μm to 200 μm, for example. Thus, by providing the spacer substrate 40 thinner, the degree of thermal expansion of the spacer substrate 40 can be minimized, so that the substrate warp due to the difference in the thermal expansion coefficient between the substrates or peeling between the substrates. Problems can be prevented more reliably.

The wiring board 50 includes, for example, a plate-shaped interposer 53 that is a silicon substrate. The upper and lower surfaces of the interposer 53 are covered with an insulating layer 54 and an insulating layer 55, respectively. The wiring substrate 50 includes a through electrode 56 provided in a through hole penetrating in the Z direction, and a wiring 57 provided on the upper surface of the insulating layer 54 and electrically connected to an upper end portion of the through electrode 56. The insulating layer 58 covering the upper surface of the wiring 57 and the insulating layer 54 where the wiring 57 is not provided, and the lower surface of the insulating layer 55 and electrically connected to the lower end of the through electrode 56. Wiring 52, and an insulating layer 59 covering the lower surface of the wiring 52 where the bump 91 is not formed and the lower surface of the insulating layer 55 where the wiring 52 is not provided.
The wiring 52 is connected to a control unit (not shown) related to the application of voltage to the piezoelectric element 63 via the through electrode 56 and the wiring 57.

Further, the second electrode 62 is in contact with the diaphragm 30. The diaphragm 30 is a conductor and functions as an electrode that electrically connects the second electrode 62 and the control unit. Specifically, the second electrode 62 is connected to the control unit via, for example, the diaphragm 30 and a wiring (not shown) connected to the diaphragm 30.
In the piezoelectric element 63, the first electrode 61 is connected to the control unit via the connection unit 90, the wiring 52, the through electrode 56, and the wiring 57, and the second electrode 62 is connected to the diaphragm 30 and a wiring (not shown). By being connected to the control unit, it operates under the control of the control unit.

  The diaphragm 30, the spacer substrate 40, and the wiring substrate 50 are provided with conduction paths 31, 41, and 51 that communicate with the pressure chamber 21, respectively. The ink flow path formed by the conduction paths 31, 41, 51 connects the pressure chamber 21 and the common ink chamber 70 provided above the wiring board 50.

  The common ink chamber 70 is provided, for example, in an ink chamber forming member 70a standing above the wiring substrate 50, and the common ink chamber 70 is connected to an ink supply mechanism (not shown). Then, the ink supplied from the ink supply mechanism to the common ink chamber 70 is supplied to the pressure chamber 21 through the common ink chamber 70 and the conduction paths 51, 41, and 31. The ink supplied to the pressure chamber 21 is ejected from the nozzle N by applying pressure to the ink in the pressure chamber 21 by the vibration of the vibration plate 30 according to the operation of the piezoelectric element 63.

[Inkjet head manufacturing method]
Next, the manufacturing method of the inkjet head 1 of this embodiment is demonstrated.
The manufacturing method of the inkjet head 1 of this embodiment includes (1) a step of bonding the piezoelectric plate 302 on the substrate 300, (2) a step of forming a resist layer 303 on the surface of the piezoelectric plate 302, and (3) a resist layer. Forming a mask pattern 303p by patterning 303, (4) performing a sandblasting process on the mask pattern 303p to form the piezoelectric element unit 63U and the dummy part 63D, and (5) the piezoelectric element unit 63U. A step of bonding each piezoelectric element 63 to the diaphragm 30; and (6) a step of peeling the substrate 300 from each piezoelectric element 63. FIG. 6 shows the piezoelectric element unit 63U and the dummy part 63D formed on the substrate 300.

The “piezoelectric element unit” in the present invention refers to an assembly of piezoelectric elements 63 that are two-dimensionally arranged in the head chip 2 at a predetermined interval. In the present invention, among the directions in which the two-dimensionally arranged piezoelectric elements 63 are arranged, the direction in which a larger number of piezoelectric elements 63 are arranged in a row is referred to as “piezoelectric element arrangement direction D1”.
The “dummy part” in the present invention refers to a piezoelectric element that is not used as pressure generating means for ejecting ink from the nozzle N. The dummy portion 63D in the present embodiment is provided on the outer peripheral portion of the piezoelectric element unit 63U (FIG. 6), and is blown out from the sandblast nozzle when the sandblast nozzle is located outside the piezoelectric element unit 63U. Plays the role of blocking the abrasive.

  Hereinafter, these steps will be described with reference to FIG. FIG. 7 is a cross-sectional view in each process at a position corresponding to the VII-VII portion of the piezoelectric element unit 63U and the dummy part 63D shown in FIG.

First, the piezoelectric plate 302 is bonded onto the substrate 300 via, for example, a peelable adhesive 301 (FIG. 7A).
As the substrate 300, for example, a glass substrate which is a suitable substrate for sandblasting performed in a later process is used.
Moreover, as the peelable pressure-sensitive adhesive 301, a publicly known pressure-sensitive adhesive can be used as appropriate. For example, a pressure-sensitive adhesive containing a heating foaming agent or a pressure-sensitive adhesive whose adhesive strength is reduced by ultraviolet irradiation treatment is used. be able to.

Next, a resist layer 303 is first formed on the surface of the piezoelectric plate 302 by a known photolithography technique (FIG. 7B). Next, after transferring the pattern of the mask 304 by exposure (FIG. 7C), development is performed to form a mask pattern 303p according to the present embodiment (FIG. 7D).
Next, sandblasting is performed on the mask pattern 303p, and the piezoelectric plate 302 is patterned to form the respective piezoelectric elements 63 constituting the piezoelectric element unit 63U and the dummy portion 63D (FIG. 7E), and the resist layer 303 ( The mask pattern 303p) is removed (FIG. 7F).

  Here, the mask pattern 303p of this embodiment includes a piezoelectric element mask pattern 303n for forming a piezoelectric element unit 63U in which a plurality of piezoelectric elements 63 are two-dimensionally arranged, and an outer peripheral portion of the piezoelectric element unit 63U. And a dummy mask pattern 303d for forming the provided dummy portion 63D (FIG. 7D).

  Here, by masking the portion where the piezoelectric element unit 63U is provided with the piezoelectric element mask pattern 303n and masking the portion where the dummy portion 63D is provided with the dummy mask pattern 303d, the piezoelectric element is formed on the substrate 300 in the sand blast processing described later. The unit 63U and the dummy part 63D can be formed (see FIGS. 7E and 6).

  In addition, the piezoelectric element unit 63U and the dummy part 63D on the substrate 300 are formed between the outer peripheral part of the piezoelectric element unit 63U and the dummy part 63D in each of the arrangement direction D1 of the piezoelectric elements 63 and the direction D2 orthogonal to the arrangement direction D1. The distances A1 and A2 are larger than the distances B1 and B2 between the piezoelectric elements in the piezoelectric element unit 63U (FIG. 6).

Here, the “distance between the outer peripheral portion of the piezoelectric element unit and the dummy portion” in the present invention refers to the distance from the piezoelectric element 63 located at the outermost periphery of the piezoelectric element unit 63U to the dummy portion 63D. Here, as shown in FIG. 6 as an example, the “distance between the outer peripheral portion of the piezoelectric element unit and the dummy portion” in the arrangement direction D1 of the piezoelectric elements 63 is A1, and “the distance in the direction D2 orthogonal to the arrangement direction D1 of the piezoelectric elements” A distance between the outer peripheral portion of the piezoelectric element unit and the dummy portion "is indicated as A2.
Further, the “distance between piezoelectric elements” in the present invention means a distance B1 between adjacent piezoelectric elements 63 in the arrangement direction D1 of the piezoelectric elements 63, as shown in an example in FIG. In a direction D2 orthogonal to the element arrangement direction D1, it means a distance B2 between the arrangements of the piezoelectric elements.

  Therefore, in the example shown in FIG. 6, in the arrangement direction D1 of the piezoelectric elements, the distance A1 between the outer peripheral part of the piezoelectric element unit 63U and the dummy part is larger than the distance B1 between the piezoelectric elements. Further, in the direction D2 orthogonal to the arrangement direction D1 of the piezoelectric elements, the distance A2 between the outer peripheral part of the piezoelectric element unit 63U and the dummy part 63D is larger than the distance B2 between the piezoelectric elements.

In such a method of manufacturing the inkjet head 1 of the present embodiment, when sandblasting, the sandblast nozzle is scanned to the outside of the dummy portion 63D. Here, when the sandblast nozzle is located outside the dummy portion 63D, the dummy portion 63D serves as a defense wall. More specifically, when the sandblast nozzle is located outside the piezoelectric element unit 63U, the abrasive blown from the sandblast nozzle is blocked by the dummy portion 63D. Therefore, the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be improved.
Further, in the piezoelectric element arrangement direction D1 and the direction D2 orthogonal to the direction D1, the distances A1, A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy part 63D are made larger than the distances B1, B2 between the piezoelectric elements. When sandblasting, the sandblast nozzle can be scanned to a position farther from the outer periphery of the piezoelectric element unit 63U. Accordingly, when the sandblast nozzle is positioned outside the dummy portion 63D, the distance from the sandblast nozzle to the piezoelectric element unit 63U is further increased, and the abrasive is less likely to be sprayed onto the piezoelectric element unit 63U. The shape accuracy of the piezoelectric element 63 located on the outermost periphery of the unit 63U can be improved.

In addition, if the distances A1 and A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy portion 63D are short, the abrasive reflected on the side surface of the dummy portion 63D as shown by the dashed arrows in FIG. There is a problem that the shape accuracy of the piezoelectric element 63 is deteriorated by being sprayed to the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U.
On the other hand, in the manufacturing method of the ink jet head 1 of the present embodiment, the distances A1 and A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy part 63D are made larger than the distances B1 and B2 between the piezoelectric elements. Since A1 and A2 are made larger, the abrasive reflected by the side surface of the dummy part 63D is difficult to be sprayed onto the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U, as shown by the broken arrows in FIG. The shape accuracy of the piezoelectric element 63 can be improved.

  Further, if the distances A1, A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy portion 63D are larger than the distances B1, B2 between the piezoelectric elements, the effect of the present invention can be obtained. The upper limit is not particularly limited. However, from the viewpoint of manufacturing efficiency, it is preferable that the distances A1 and A2 with the outer peripheral portion of the piezoelectric element unit 63U be smaller than three times the distances B1 and B2 between the piezoelectric elements, respectively. It is more preferable to make it smaller than twice B2.

Further, in FIG. 6, one dummy portion 63D is provided in each of the outer peripheral portions of the piezoelectric element unit 63U in the piezoelectric element arrangement direction D1 and in each of the directions D2 orthogonal to the piezoelectric element arrangement direction D1. However, the present invention is not limited to this example.
The dummy part 63D, for example, may be divided into a plurality of pieces as shown in FIG. 8 (FIG. 8), or the piezoelectric element array direction D1 may be divided into a plurality of parts, and the direction D2 orthogonal to the direction D1. May be formed continuously (FIG. 9), or may be provided so as to cover the entire outer periphery of the piezoelectric element unit 63U (FIG. 10).
In addition, when the dummy part 63D is divided into a plurality of parts, it is preferable to provide the piezoelectric element unit 63U at a position parallel to the dummy part 63D so as to cover 80% or more from the viewpoint of obtaining the effects of the present invention.

Of the dummy portion 63D, at least a portion corresponding to at least one end portion of the piezoelectric element unit 63U from the other end portion of the dummy portion 63D provided in a direction intersecting with the main scanning direction MD of the sandblast when sandblasting is performed. It is preferable that it is formed in a stretch so as to be covered.
The “sandblast main scanning direction” in the present invention refers to a direction parallel to the line direction when the sandblasting process is performed by dividing it into a plurality of lines. In the present invention, the movement to the next line is called sub-scanning, and the direction perpendicular to the main scanning direction, which is the moving direction, is called sub-scanning direction.
In the sandblasting process, the substrate 300 may be fixed and the sandblast nozzle may be moved, or the sandblasting nozzle may be fixed and the substrate 300 may be moved.

FIG. 9 shows an example of sandblast main scanning direction MD and sub-scanning direction SD when sandblasting on the substrate 300. In FIG. 9, the dummy portion 63 </ b> D covers at least from one end portion to the other end portion of the piezoelectric element unit 63 </ b> U in the orthogonal direction (sub-scanning direction) which is one of the directions intersecting the main scanning direction MD of sandblast. As a result, it is formed as a series. The example shown in FIG. 9 shows an example in which the main scanning direction MD of sandblast and the arrangement direction D1 of the piezoelectric elements are parallel.
When sandblasting is performed, the time during which the sandblast nozzle stays outside the dummy portion 63D provided in the direction intersecting the main scanning direction MD of sandblasting becomes longer. Here, the dummy part 63D provided in the direction intersecting with the main scanning direction MD of sandblasting when sandblasting is continued so as to cover a part corresponding to one end part to the other end part of the piezoelectric element unit 63U. When the sandblast nozzle remains on the outside of the dummy portion 63D, the abrasive is less likely to be sprayed onto the piezoelectric element unit 63U. Therefore, the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be further improved.

  Further, from the viewpoint of effectively obtaining the effects of the present invention, the dummy portion 63D is preferably provided so as to cover the entire outer peripheral portion of the piezoelectric element unit 63U (FIG. 10). As a result, there is no gap between the dummy parts 63D, and the dummy part 63D makes it easier to protect, so that the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be further improved.

  Also, the sandblast main scanning direction MD during sandblasting is a direction in which the plurality of piezoelectric elements 63 in the piezoelectric element unit 63U are two-dimensionally arranged (piezoelectric element arrangement direction D1). It is preferable that they are parallel (FIG. 9). As a result, when the sandblast nozzle stays outside the dummy portion 63D provided in the direction intersecting the sandblast main scanning direction MD during sandblasting, the number of piezoelectric elements 63 located near the sandblast nozzle is reduced. Therefore, the shape accuracy of the piezoelectric element unit 63U can be further improved.

Moreover, it is preferable that the thickness of the dummy part 63D is thicker than the thickness of the piezoelectric element unit 63U. Thereby, since the defense capability of dummy part 63D improves, the shape precision of the piezoelectric element 63 located in the outermost periphery of the piezoelectric element unit 63U can be improved more.
Moreover, in order to make the thickness of the dummy part 63D thicker than the thickness of the piezoelectric element unit 63U, for example, it can be manufactured by using the piezoelectric plate 302 in which the part for forming the dummy part 63D is thickened.

Next, an adhesive 310 is applied to the surface of each piezoelectric element 63 of the piezoelectric element unit 63U formed on the substrate 300 (FIG. 11A). Next, the surface of the piezoelectric element 63 to which the adhesive 310 is applied is adhered on the vibration plate 30 of the substrate on which the nozzle substrate 10, the pressure chamber substrate 20 and the vibration plate 30 are stacked (FIG. 11B) and applied from both sides. By pressing, the piezoelectric element 63 and the diaphragm 30 are brought into close contact with each other.
Here, the dummy portion 63D can also be bonded to the diaphragm 30 in the same manner as the piezoelectric elements 63 constituting the piezoelectric element unit 63U. However, since the dummy part 63D is not used for ink ejection, only the piezoelectric element unit 63U may be bonded to the diaphragm 30 after the dummy part 63D is cut off.
FIG. 5 shows the positional relationship between the spacer substrate 40 and the dummy part D when the dummy part 63D is also bonded to the diaphragm 30.

  Next, the substrate 300 is peeled from the piezoelectric element 63 (FIG. 11C). Since the piezoelectric element 63 is bonded to the substrate 300 via the peelable adhesive 301, for example, when a pressure sensitive adhesive containing a heating foaming agent is used as the peelable adhesive, by heating, The substrate 300 can be peeled from each piezoelectric element 63.

  Next, the spacer board | substrate 40 which has the 1st storage part 42N which stores the piezoelectric element 63 is prepared (FIG. 12). As shown in FIG. 5, when the dummy portion 63 </ b> D is also bonded to the vibration plate 30, the spacer substrate 40 needs to be formed with the second storage portion 42 </ b> D.

Next, the spacer substrate 40 is bonded to the substrate 201 via the peelable adhesive 200, and the adhesive 210 is applied to the surface of the spacer substrate 40 (FIG. 12). In FIG. 12, of the adhesive 210 on the surface of the spacer substrate 40, the adhesive 210a on the lower surface of the cut surface of the spacer substrate 40 and the spacer path 40 and the spacer substrate 40 at the back of the first storage portion 42N. The adhesive 210b on the lower surface is shown with different reference numerals.
Next, the spacer substrate 40 is bonded to the diaphragm 30, and pressure is applied (for example, pressure is applied from both sides) so that the spacer substrate 40 and the diaphragm 30 are in close contact with each other (FIG. 13).

  Next, the substrate 201 is peeled from the spacer substrate 40 (FIG. 14). When a pressure-sensitive adhesive containing a heating foaming agent is used as the peelable pressure-sensitive adhesive 200, the substrate 201 can be peeled from the spacer substrate 40 by heating.

Next, an adhesive 220 is applied to the upper surface of the spacer substrate 40 (FIG. 15), the wiring substrate 50 is bonded and fixed to the upper surface of the spacer substrate 40, and the wiring substrate 50 and the piezoelectric element 63 are connected by the conductive material 92. Thus, the head chip 2 of this embodiment can be manufactured (FIG. 4).
In FIG. 15, among the adhesives 220 on the surface of the spacer substrate 40, the adhesive 220 a on the upper surface of the cut surface of the spacer substrate 40, the conductive path 41, and the spacer substrate 40 in the back of the first storage portion 42 </ b> N. The adhesive 220b on the upper surface is shown with different symbols.

[Technical effects of the present invention]
As described above, the inkjet head 1 according to the present invention is supplied to the plurality of nozzles N that eject ink, the plurality of pressure chambers 21 to which ink is supplied, the vibration plate 30, and the plurality of pressure chambers 21. And a plurality of piezoelectric elements 63 for ejecting ink from the nozzles N by generating pressure on the ink through the vibration plate 30. In the method of manufacturing the inkjet head 1 according to the present invention, a step of bonding the piezoelectric plate 302 on the substrate 300, a step of forming the resist layer 303 on the surface of the piezoelectric plate 302, and patterning the resist layer 303 are performed. Piezoelectric element mask pattern 303n for forming a piezoelectric element unit 63U in which the piezoelectric elements 63 are two-dimensionally arranged, and a dummy mask for forming a dummy part 63D provided on the outer periphery of the piezoelectric element unit 63U A step of forming a mask pattern 303p having a pattern 303d, a step of performing sandblasting on the mask pattern 303p, patterning the piezoelectric plate 302, and forming a piezoelectric element unit 63U and a dummy portion 63D, and a piezoelectric element Each piezoelectric element 6 of the unit 63U The has a step of bonding the diaphragm 30, a step of separating the substrate 300 from each of the piezoelectric elements 63 of the piezoelectric element unit 63U, a. In addition, on the substrate 300, the distances A1 and A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy portion 63D with respect to the arrangement direction D1 of the piezoelectric elements 63 and the direction D2 orthogonal to the arrangement direction D1 are piezoelectric elements. The distance between the piezoelectric elements B1 and B2 in the unit 63U is larger.
In such a method of manufacturing the inkjet head 1 of the present embodiment, when sandblasting, the sandblast nozzle is scanned to the outside of the dummy portion 63D. Here, when the sandblast nozzle is located outside the dummy portion 63D, the dummy portion 63D serves as a defense wall. More specifically, when the sandblast nozzle is located outside the piezoelectric element unit 63U, the abrasive blown from the sandblast nozzle is blocked by the dummy portion 63D. Therefore, the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be improved.
Further, in the piezoelectric element arrangement direction D1 and the direction D2 orthogonal to the direction D1, the distances A1, A2 between the outer peripheral portion of the piezoelectric element unit 63U and the dummy part 63D are made larger than the distances B1, B2 between the piezoelectric elements. When sandblasting, the sandblast nozzle can be scanned to a position farther from the outer periphery of the piezoelectric element unit 63U. Accordingly, when the sandblast nozzle is positioned outside the dummy portion 63D, the distance from the sandblast nozzle to the piezoelectric element unit 63U is further increased, and the abrasive is less likely to be sprayed onto the piezoelectric element unit 63U. The shape accuracy of the piezoelectric element 63 located on the outermost periphery of the unit 63U can be improved.
Furthermore, since the distances A1 and A2 between the outer periphery of the piezoelectric element unit 63U and the dummy part 63D are larger than the distances B1 and B2 between the piezoelectric elements, the distances A1 and A2 are increased. The abrasive reflected on the side surface is difficult to be sprayed on the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U, and the shape accuracy of the piezoelectric element 63 can be improved.

Further, in the method for manufacturing the inkjet head 1 of the present embodiment, of the dummy portions 63D, the dummy portions 63D provided in the direction intersecting the main blasting direction MD of sandblasting when sandblasting are at least provided for the piezoelectric element unit 63U. It is preferable that the portions corresponding to the one end portion to the other end portion are continuously formed so as to be covered.
When sandblasting is performed, the time during which the sandblast nozzle stays outside the dummy portion 63D provided in the direction intersecting the main scanning direction MD of sandblasting becomes longer. Here, the dummy part 63D provided in the direction intersecting with the main scanning direction MD of sandblasting when sandblasting is continued so as to cover a part corresponding to one end part to the other end part of the piezoelectric element unit 63U. When the sandblast nozzle remains on the outside of the dummy portion 63D, the abrasive is less likely to be sprayed onto the piezoelectric element unit 63U. Therefore, the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be further improved.

  In the method for manufacturing the inkjet head 1 of the present embodiment, it is preferable that the dummy portion 63D is provided so as to cover the entire outer peripheral portion of the piezoelectric element unit 63U. As a result, there is no gap between the dummy parts 63D, and the dummy part 63D makes it easier to protect, so that the shape accuracy of the piezoelectric element 63 located on the outermost periphery of the piezoelectric element unit 63U can be further improved.

  Further, in the method of manufacturing the inkjet head 1 according to the present embodiment, the main blasting direction MD of sandblasting during sandblasting is a piezoelectric element among the directions in which the plurality of piezoelectric elements 63 in the piezoelectric element unit 63U are two-dimensionally arranged. It is preferable to be parallel to the direction D1 where the number of arrangements is large. As a result, when the sandblast nozzle stays outside the dummy portion 63D provided in the direction intersecting the sandblast main scanning direction MD during sandblasting, the number of piezoelectric elements 63 located near the sandblast nozzle is reduced. Therefore, the shape accuracy of the piezoelectric element unit 63U can be further improved.

  In the method for manufacturing the inkjet head 1 of the present embodiment, it is preferable that the thickness of the dummy portion 63D is thicker than the thickness of the piezoelectric element unit 63U. Thereby, since the defense capability of dummy part 63D improves, the shape precision of the piezoelectric element 63 located in the outermost periphery of the piezoelectric element unit 63U can be improved more.

[Others]
The embodiment of the present invention should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  For example, as a layer configuration of the head chip 2, another substrate (hereinafter referred to as an intermediate substrate) may be further provided between the nozzle substrate 10 and the pressure chamber substrate 20. In the intermediate substrate, for example, a conduction path that communicates the nozzle N and the pressure chamber 21 is formed, and the conduction path is shaped so as to reduce the diameter of the path through which the ink passes. The kinetic energy produced may be adjusted.

  Further, in the head chip 2 of the present embodiment, an example in which the pressure chamber substrate 20 and the vibration plate 30 are separately provided and laminated has been described. However, the present invention is not limited thereto, and the pressure chamber substrate 20 and the vibration plate 30 are provided. It may be integrally formed.

DESCRIPTION OF SYMBOLS 1 Inkjet head 2 Head chip 10 Nozzle substrate 20 Pressure chamber substrate 21 Pressure chamber 30 Vibrating plate 40 Spacer substrate 42 Storage unit 50 Wiring substrate 63 Piezoelectric element 63D Dummy unit 63U Piezoelectric element unit 100 Inkjet recording apparatus 300 Substrate 302 Piezoelectric plate 303 Resist layer 303d Dummy mask pattern 303n Piezoelectric element mask pattern 303p Mask pattern N Nozzle MD Sandblast main scanning direction D1 Piezoelectric element arrangement direction A1 Distance between the outer periphery of the piezoelectric element unit and the dummy part (piezoelectric element arrangement direction)
A2 Distance between the outer peripheral part of the piezoelectric element unit and the dummy part (a direction orthogonal to the arrangement direction of the piezoelectric elements)
B1 Distance between piezoelectric elements in piezoelectric element unit (arrangement direction of piezoelectric elements)
B2 Distance between piezoelectric elements in the piezoelectric element unit (direction orthogonal to the arrangement direction of the piezoelectric elements)

Claims (5)

A plurality of nozzles for ejecting ink, a plurality of pressure chambers to which ink is supplied, a vibration plate, and the nozzles by generating pressure through the vibration plate in the ink supplied to the plurality of pressure chambers A plurality of piezoelectric elements for ejecting ink from the inkjet head,
Bonding the piezoelectric plate on the substrate;
Forming a resist layer on the surface of the piezoelectric plate;
By patterning the resist layer, a piezoelectric element mask pattern for forming a piezoelectric element unit in which the plurality of piezoelectric elements are two-dimensionally arranged, and a dummy portion provided on the outer periphery of the piezoelectric element unit are provided. Forming a mask pattern having a dummy mask pattern for forming;
Applying sandblasting on the mask pattern, patterning the piezoelectric plate, and forming the piezoelectric element unit and the dummy part;
Bonding each piezoelectric element of the piezoelectric element unit to the diaphragm;
Separating the substrate from each piezoelectric element of the piezoelectric element unit,
On the substrate, the distance between the outer peripheral portion of the piezoelectric element unit and the dummy portion is greater than the distance between the piezoelectric elements in the piezoelectric element unit with respect to each of the arrangement direction of the piezoelectric elements and the direction orthogonal to the arrangement direction. A method for manufacturing an ink-jet head, wherein   Among the dummy parts, the dummy part provided in the direction intersecting the main scanning direction of the sandblast when the sandblasting is performed covers at least a part corresponding to one end part to the other end part of the piezoelectric element unit. The method of manufacturing an ink jet head according to claim 1, wherein the ink jet head is formed in a continuous manner.   The method of manufacturing an ink jet head according to claim 1, wherein the dummy portion is provided so as to cover the entire outer peripheral portion of the piezoelectric element unit.   The main scanning direction of sandblasting when the sandblasting is performed is parallel to a direction in which the plurality of piezoelectric elements in the piezoelectric element unit are two-dimensionally arranged and in which the number of piezoelectric elements is arranged. The manufacturing method of the inkjet head as described in any one of Claim 1- Claim 3.   The method of manufacturing an ink jet head according to any one of claims 1 to 4, wherein a thickness of the dummy portion is larger than a thickness of the piezoelectric element unit.

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