JP2017005217A - Insertion component mounting method and insertion component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable insertion of positioning projections and leads of an insertion component into positioning holes and lead insertion holes of a circuit board as much as possible, even when deformation or the like occurs in the leads.SOLUTION: In the method, bottom end positions of positioning projections 42 and leads 45 of an insertion component 41 held by a component holding tool such as suction nozzles 21, are subjected to image recognition, and thereafter, the bottom end positions of the leads 45 of the insertion component 41 are positioned at lead insertion holes 46 of a circuit board 43, the bottom ends of the leads 45 are slightly inserted into the lead insertion holes 46 of the circuit board 43, and lowering motion of the component holding tool is temporarily suspended. In this state, the insertion component 41 is horizontally moved while deforming the leads 45, and meanwhile, the bottom end positions of the positioning projections 42 are positioned at the positioning holes 44 of the circuit board 43. Thereafter, the lowering motion of the component holding tool is resumed to insert the positioning projections 42 of the insertion component 41 into the positioning holes 44 of the circuit board 43, and simultaneously, insert the leads 45 into the lead insertion holes 46 of the circuit board 43.SELECTED DRAWING: Figure 7

Description

  The present invention provides an insertion part in which a positioning projection and a lead both project downward and a lower end of the lead projects below a lower end of the positioning projection, a positioning hole into which the positioning projection is inserted, The present invention relates to an insertion component mounting method and an insertion component mounting apparatus for mounting on a circuit board provided with lead insertion holes for inserting leads.

  For example, as described in Patent Document 1 (Japanese Patent Laid-Open No. 9-35882), Patent Document 2 (Japanese Patent Laid-Open No. 8-69838), etc., the bonding strength of a large component such as a connector mounted on a circuit board For example, a positioning projection that protrudes downward is provided at a plurality of locations on the component, and the positioning projection is inserted into a positioning hole formed at a plurality of locations on the circuit board. Some components are mounted on a circuit board by positioning the component with reference to a plurality of positioning holes. Hereinafter, a component provided with the positioning projection is referred to as an “insertion component”.

  Further, there is an insertion component in which a plurality of leads are arranged so as to protrude downward, and at the time of mounting, the plurality of leads are inserted into a plurality of lead insertion holes provided in a circuit board. When mounting an insert component having such a configuration on a circuit board using a component mounter, the insert component supplied by a component feeder such as a tray feeder is picked up by a component holder (suction nozzle or chuck) of the component mounter. Then, in the middle of moving the circuit board upward, the insertion component is imaged from the lower surface side with a component imaging camera, and the captured image is processed to determine the position of the positioning projection of the insertion component. After recognizing and correcting the mounting position and angle deviation of the insertion component based on the recognition result, positioning the positioning projection of the insertion component at a position where it can be inserted into the positioning hole of the circuit board, By lowering the component holder that holds the insertion component, the positioning projection and lead of the insertion component are simultaneously inserted into the positioning hole and lead insertion hole of the circuit board.

Japanese Patent Laid-Open No. 9-35782 JP-A-8-69838

  In general, since the lead of the insertion part is formed of a thin metal of several hundred μm to several mm, it is easily deformed by external force. For this reason, there is a possibility that the positional relationship between the positioning projection of the inserted component and the lead is deviated from the original positional relationship due to manufacturing variations of the inserted component and deformation of the lead due to external force.

  However, in the above-described conventional method for mounting the insertion component, the position of the positioning projection on the circuit board is recognized and the positioning projection on the insertion component is positioned at a position where it can be inserted into the positioning hole of the circuit board. In this state, the component holder that holds the insertion component is lowered so that both the positioning projection and the lead of the insertion component are inserted into the positioning hole and the lead insertion hole of the circuit board at the same time. There is a possibility that the lower end of the lead is displaced from the lead insertion hole of the circuit board and cannot be inserted due to manufacturing variations of parts or deformation of the lead.

  In addition, in a state where the lower end of the lead of the insertion component is positioned at a position where it can be inserted into the lead insertion hole of the circuit board, the component holder for holding the insertion component is lowered, and the lead of the insertion component and the positioning projection It is conceivable to insert both of them at the same time into the lead insertion hole and positioning hole of the circuit board. There is a possibility that it cannot be inserted due to misalignment.

  Therefore, the problem to be solved by the present invention is that the positional relationship between the positioning projection of the inserted component and the lead is deviated from the original positional relationship due to manufacturing variations of the inserted component or deformation of the lead due to external force. However, as much as possible, the positioning projections and leads of the insertion parts can be inserted into the positioning holes and lead insertion holes of the circuit board, and the number of insertion parts to be discarded can be reduced because it cannot be inserted. It is to be able to reduce production costs.

  In general, in an insertion component provided such that both the positioning projection and the lead protrude downward, the lower end of the lead protrudes below the lower end of the positioning projection.

  Focusing on this point, the insertion component mounting method according to claim 1 includes: (1) a component holding step of holding a supplied insertion component in a component holder; and (2) the holding of the component in the component holder. The lower end of the positioning projection of the insertion component and the lower end of the lead are imaged separately or simultaneously by the component imaging camera, and the captured image is processed, so that the position of the lower end of the positioning projection and the lead An image processing step for recognizing the position of the lower end; and (3) lead positioning for positioning the position of the lower end of the lead of the inserted component held by the component holder at a position where it can be inserted into the lead insertion hole of the circuit board. And (4) lowering the component holder holding the insertion component and inserting the lower end of the lead into the lead insertion hole of the circuit board a little so that the lower end of the positioning projection is the circuit board. A temporary insertion step of temporarily stopping the lowering operation of the component holder before reaching the surface; and (5) the lower end of the lead of the insertion component is inserted into the lead insertion hole of the circuit board slightly. Positioning protrusion positioning for positioning the position of the lower end of the positioning protrusion of the insertion part at a position where it can be inserted into the positioning hole of the circuit board while moving the component holder in the horizontal direction and deforming the lead. And (6) resuming the lowering operation of the component holder holding the insertion component and inserting the positioning projection of the insertion component into the positioning hole of the circuit board at the same time as the step. And a main insertion step of inserting into the lead insertion hole of the circuit board.

  In short, in the insertion component mounting method of the present invention, after the image recognition of the position of the lower end of the positioning projection of the insertion component held by the component holder and the position of the lower end of the lead, the position of the lower end of the lead of the insertion component is circuitized. Position the component holder in a position where it can be inserted into the lead insertion hole of the board and insert the lower end of the lead into the lead insertion hole of the circuit board a little, before the lower end of the positioning projection reaches the surface of the circuit board. The descending operation is temporarily stopped, and in this state, the position of the lower end of the positioning projection can be inserted into the positioning hole of the circuit board while moving the component holder holding the inserted component in the horizontal direction to deform the lead. After positioning to the position, restart the descending movement of the component holder and insert the positioning projection of the inserted component into the positioning hole of the circuit board, and at the same time insert the lead into the lead insertion hole of the circuit board So, even if the positional relationship between the positioning projection of the inserted component and the lead is deviated from the original positional relationship due to manufacturing variations of the inserted component or deformation of the lead due to external force, as much as possible, The positioning projections and leads of the insertion part can be inserted into the positioning holes and lead insertion holes of the circuit board, and the number of insertion parts to be discarded can be reduced because it cannot be inserted, and the production cost can be reduced accordingly.

  According to a second aspect of the present invention, the reference mark on the circuit board is picked up by the camera for picking up the circuit board and the picked-up image is processed so that the position of the reference mark is recognized and provided from the circuit board manufacturer. The position of the circuit board positioning hole and the lead insertion hole based on the reference mark position using the specified data (positioning data for the positioning hole and lead etc. based on the position of the reference mark on the circuit board) The data may be acquired. In this case, it is only necessary to recognize an image of the position of the reference mark on the circuit board, and the image recognition of the position of the reference mark is performed to determine the component mounting position on the circuit board in the component mounting machine before component mounting. Therefore, it is sufficient to use the image recognition result as it is, and there is no need to newly add an image recognition process.

  Alternatively, the position of the positioning hole of the circuit board is processed by imaging the positioning hole of the circuit board and the lead insertion hole separately or simultaneously with the board imaging camera and processing the captured image. The position of the lead insertion hole may be recognized. In this way, even if there are variations in the positions of the positioning holes and lead insertion holes due to manufacturing variations in the circuit board, the variations in the positions of the positioning holes and lead insertion holes in the circuit board can be recognized. It is possible to cope with variations in the positions of the holes and the lead insertion holes. As a result, even if the positional relationship between the positioning hole of the circuit board and the lead insertion hole deviates from the original positional relationship due to manufacturing variations of the circuit board, etc., as much as possible, the positioning projections of the inserted parts and the leads Can be inserted into the positioning hole and the lead insertion hole of the circuit board.

  By the way, when the positional relationship between the lower end of the positioning projection of the inserted component and the lower end of the lead is not deviated from the original positional relationship, the inserted component can be mounted on the circuit board by the same mounting method as before. is there.

  Therefore, as in claim 4, the positional relationship between the lower end of the positioning projection of the insertion part recognized in the image processing step and the lower end of the lead is the positional relationship between the positioning hole of the circuit board and the lead insertion hole. Only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, the positioning protrusion positioning step and the main insertion step are executed, If it is determined that the positional relationship between the two matches, the lower end of the positioning projection of the insertion part and the lower end of the lead are simultaneously positioned at positions that can be inserted into the positioning hole of the circuit board and the lead insertion hole, and then inserted. The component positioning projections and leads may be simultaneously inserted into the positioning holes and lead insertion holes of the circuit board. In this way, when the positional relationship between the lower end of the positioning protrusion of the inserted part of the recognized image and the lower end of the lead matches the positional relationship between the positioning hole of the circuit board and the lead insertion hole. As in the prior art, both the positioning projections and leads of the inserted component can be simultaneously inserted into the positioning holes and lead insertion holes of the circuit board in one positioning step and one insertion step. The number can be reduced, and the cycle time for mounting the inserted component on the circuit board can be shortened.

  In general, a plurality of leads are provided in a row in the insertion component, and a plurality of lead insertion holes are provided in a row in the circuit board correspondingly. However, if the deformation direction and deformation amount are different for each lead from the original position, the lower ends of the plurality of leads may not be inserted into the plurality of lead insertion holes of the circuit board. Therefore, as described in claim 5, the positions of the lower ends of the plurality of leads of the inserted part whose image has been recognized are shifted from the original position for each lead, and the lower ends of the plurality of leads are used as the plurality of lead insertion holes of the circuit board. If it is determined that it cannot be inserted, it is determined that mounting is impossible, and the inserted part may be discarded in a predetermined disposal place or collection place. In this way, if it is determined that the lower ends of the plurality of leads of the insertion component cannot be inserted into the plurality of lead insertion holes of the circuit board based on the image recognition result, the subsequent steps can be omitted and the mounting is performed. It is possible to promptly discard the impossible insertion part and to quickly start the process for the next insertion part, and to shorten the cycle time for mounting the insertion part on the circuit board.

  The invention according to claim 6 describes the technical idea substantially the same as the invention of “insertion component mounting method” according to claim 1 as the invention of “insertion component mounting apparatus”.

FIG. 1 is a perspective view showing the configuration of a modular component mounting system in an embodiment of the present invention. FIG. 2 is a perspective view showing a positional relationship among a mounting head, a component imaging camera, a coaxial incident illumination light source, and a side illumination laser light source. FIG. 3 is a block diagram showing the configuration of the control system of the component mounter. 4A is a front view of the insertion part, FIG. 4B is a bottom view of the insertion part, and FIG. 4C is a left side view of the insertion part. FIG. 5 is a diagram illustrating a configuration example of a circuit board on which an insertion component is mounted. FIG. 6 is a plan view showing a state in which the insertion component is mounted on the circuit board. 7A to 7D are process diagrams for explaining each process of the method for mounting the insertion component on the circuit board.

Hereinafter, an embodiment in which a mode for carrying out the present invention is applied to a module type component mounting system will be described.
First, the configuration of the modular component mounting system will be described with reference to FIGS. 1 to 3.

  A plurality of component mounters 12 are arranged on the base table 11 of the modular component mounting system so as to be adjacent to each other in the circuit board conveyance direction. Each component mounting machine 12 is a component feeder 14 such as a tape feeder or a tray feeder, a conveyor 15 for conveying a circuit board 43 (see FIGS. 5 to 7), and a component holder 1 on a main body bed 13. A mounting head 17 that replaceably holds one or a plurality of suction nozzles 21 (see FIG. 2) or a chuck, a head moving device 22 that moves the mounting head 17 in the XY directions, and a component holder for the mounting head 17 21 is mounted with a component imaging camera 16 or the like for imaging components (such as an insertion component 41 described later) from the lower surface side, and a display device such as a liquid crystal display or CRT is provided on the front surface of the upper frame 18. 19 and an operation unit 20 such as an operation key and a touch panel are provided. Further, a substrate imaging camera 23 (see FIG. 3) for imaging a reference mark (not shown) on the circuit board 43 is attached to the head moving device 22 so as to move integrally with the mounting head 17 in the XY directions. ing. Note that the circuit board 43 illustrated in FIGS. 5 to 7 illustrates only a portion on which the insertion component 41 is mounted, and illustration of a portion on which other electronic components are mounted is omitted.

  As shown in FIG. 2, the mounting head 17 is rotatably assembled to a support bracket 24 that moves in the XY directions by a head moving device 22, and a suction nozzle moves around the central axis of the mounting head 17 by a head rotating motor 25. The suction nozzle 21 is configured to rotate intermittently (pitch drive) by 21 arrangement pitch angles, and to rotate the suction nozzle 21 integrally with the rotation of the mounting head 17. A plurality of nozzle holders 26 that hold the suction nozzle 21 are assembled to the mounting head 17 so as to be movable up and down (Z direction), and the mounting head 17 rotates at a predetermined rotation during a component suction operation or a component mounting operation. One nozzle holder 26 (suction nozzle 21) located at a position is moved up and down by a nozzle lifting mechanism 28 using a nozzle lifting motor 27 as a drive source. The suction nozzle 21 of each nozzle holder 26 is configured to be rotated (spinned) by a nozzle rotation motor 29, and the inclination (shift in the horizontal rotation angle) of the component sucked by each suction nozzle 21 is determined as component mounting. Correction is made by rotation of each suction nozzle 21 before.

  On the other hand, the component imaging camera 16 is arranged upward near the component suction position of the component supply device 14. As shown in FIG. 2, a coaxial epi-illumination light source 32 is mounted upward via a lens 31 above the component imaging camera 16. The coaxial epi-illumination light source 32 is configured by arranging light emitting elements such as LEDs in an annular shape coaxial with the optical axis of the component imaging camera 16, and a component holder (suction nozzle 21 or chuck) of the mounting head 17 during component imaging. Etc.) are illuminated from the lower surface side. On the upper surface side of the frame-shaped illumination cover 33 of the coaxial epi-illumination light source 32, four laser light sources 34 that emit laser light in the horizontal direction toward the optical axis of the component imaging camera 16 are assembled at 90 ° intervals. ing.

  The components held by the component holder such as the suction nozzle 21 are so arranged that the positioning protrusions 42 (for example, bosses, pins, etc.) and the inverted L-shaped leads 45 as shown in FIGS. In the case of the insertion part 41 provided on the four parts, four laser light sources 34 are used as illumination light sources when the part imaging camera 16 images the lower end of the positioning projection 42 and the lower end of the lead 45 from below. Like to use.

  In the insertion part 41 to be mounted by the mounting method of the present embodiment, the lower end of the lead 45 protrudes below the lower end of the positioning projection 42, so that the image recognition of the position of the lower end of the lead 45 and the positioning projection 42 are performed. The image recognition at the lower end position is performed separately as follows. When recognizing the image of the position of the lower end of the lead 45, the height position of the lower end portion of the lead 45 is the same as the optical axis of the laser light source 34 of the insertion component 41 held by the component holder such as the suction nozzle 21. In the state where it is lowered, the laser light emitted in the horizontal direction from the four laser light sources 34 is irradiated to the outer peripheral surface of the lower end portion of the lead 45 of the insertion part 41, and the part imaging camera 16 includes the lower end of the lead 45. By capturing an image, the lower end of the lead 45 can be clearly distinguished from the image by distinguishing it from the background. Next, when recognizing the image of the position of the lower end of the positioning projection 42, the height position of the lower end of the positioning projection 42 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set at the laser light source 34. With the laser beam emitted from the four laser light sources 34 in the horizontal direction in a state where it is lowered to the same height as the optical axis, the outer peripheral surface of the lower end portion of the positioning projection 42 of the insertion part 41 is irradiated, By capturing an image including the lower end of the positioning projection 42 with the component imaging camera 16, the shape of the lower end surface of the positioning projection 42 can be clearly distinguished from the lower surface of the insertion component 41 from the image. It has become.

  Note that the positioning projection is formed from an image obtained by illuminating the lower surface side of the insertion component 41 with the coaxial incident illumination light source 32 such that the lower end surface of the positioning projection 42 is colored differently from the lower surface of the insertion component 41. When the shape of the lower end surface of the portion 42 can be recognized separately from the lower surface of the insertion component 41, the lower surface side of the insertion component 41 is illuminated by the coaxial incident illumination light source 32 and an image including the lower end of the positioning projection 42 is included. And the position of the lower end of the positioning projection 42 may be recognized from the image. Similarly, the lower end surface of the lead 45 is colored with a color different from that of the other part of the lead 45, for example, and the lower end of the lead 45 is connected to the other part of the lead 45 from the image captured by the coaxial incident illumination light source 32. Or the background is illuminated with the coaxial epi-illumination light source 32, an image including the lower end of the lead 45 is taken, and the position of the lower end of the lead 45 is recognized from the image. good.

  Each component mounter 12 transports the circuit board 43 conveyed from the upstream component mounter 12 to a predetermined position by the conveyor 15, and clamps and positions the circuit board 43 by a clamp mechanism (not shown). Thereafter, the reference mark on the circuit board 43 is imaged by the board imaging camera 23, the captured image is processed to recognize the position of the reference mark on the circuit board 43, and the component supplied by the component supply device 14. Is held by a component holder such as the suction nozzle 21 of the mounting head 17, the component is moved to the imaging position, and is imaged by the component imaging camera 16, and the holding posture and positional deviation of the component are image-recognized. To the circuit board 43 on the conveyor 15. At this time, with reference to the position of the reference mark on the circuit board 43, the specification data provided by the manufacturer of the circuit board 43 (data on the component mounting position of the circuit board 43 based on the position of the reference mark) is used. The component mounting position of the circuit board 43 is determined, and the positional deviation and inclination (horizontal rotation angle deviation) of the component held by the component holder such as the suction nozzle 21 of the mounting head 17 are corrected, and the component is circuitized. It is mounted at a component mounting position on the substrate 43.

  Incidentally, among the components mounted on the circuit board 43 by the component mounter 12, there is an insertion component 41 as shown in FIG. The insertion component 41 is a large component such as a connector component, for example, and a plurality of lower surfaces of the insertion component 41 are provided for the purpose of increasing the bonding strength between the insertion component 41 and the circuit board 43 (see FIGS. 5 to 7). Positioning projections 42 (for example, bosses, pins, etc.) projecting downward are provided at locations (for example, two locations), and the positioning projections 42 are formed in positioning holes 44 formed at a plurality of locations (for example, two locations) of the circuit board 43. To insert. Furthermore, the plurality of leads 45 are arranged in a row on the insertion component 41 so as to protrude downward, and the plurality of leads 45 are inserted into the plurality of lead insertion holes 46 provided in the circuit board 43 at the time of mounting. There is something. In general, the lead 45 of the insertion part 41 is formed of a thin metal of several hundreds μm to several mm, and thus is easily deformed by an external force. For this reason, there is a possibility that the positional relationship between the positioning projection 42 of the insertion component 41 and the lead 45 is deviated from the original positional relationship due to manufacturing variations of the insertion component 41 and deformation of the lead 56 due to external force. With the conventional mounting method, there is a possibility that the positioning protrusions 42 and the leads 45 of the insertion component 41 cannot be inserted into the positioning holes 44 and the lead insertion holes 46 of the circuit board 43.

  As a countermeasure, in this embodiment, the control device 51 that controls the operation of each mechanism of the component mounter 12 executes an insertion component mounting program (not shown), thereby performing a component holding process, an image processing process, and a lead. The positioning process, temporary insertion process, positioning protrusion positioning process, and main insertion process are executed in order to realize the functions of the image processing means, lead positioning means, temporary insertion means, positioning protrusion positioning means, and main insertion means. To do. Hereinafter, the content of each process is demonstrated.

[Part holding process]
The insertion component 41 supplied by the component supply device 14 is held by a component holder such as the suction nozzle 21 of the mounting head 17.

[Image processing step (image processing means)]
In the illumination by the coaxial incident illumination light source 32, it is difficult to accurately recognize the position of the lower end of the lead 45 and the position of the lower end of the positioning projection 42 from the captured image of the component imaging camera 16, so Four laser light sources 34 are used as illumination light sources for imaging the lower end of the positioning projection 42 and the lower end of the lead 45 with the component imaging camera 16, but the lower end of the lead 45 is lower than the lower end of the positioning projection 42. Since it protrudes downward, the lower end of the lead 45 and the lower end of the positioning projection 42 cannot be recognized simultaneously by the illumination of the laser light source 34.

  Therefore, in this embodiment, image recognition of the position of the lower end of the lead 45 and the position of the lower end of the positioning projection 42 is performed separately as follows. When recognizing the image of the position of the lower end of the lead 45, the height position of the lower end portion of the lead 45 is the same as the optical axis of the laser light source 34 of the insertion component 41 held by the component holder such as the suction nozzle 21. In the state where it is lowered, the laser light emitted in the horizontal direction from the four laser light sources 34 is irradiated to the outer peripheral surface of the lower end portion of the lead 45 of the insertion part 41, and the part imaging camera 16 includes the lower end of the lead 45. By capturing an image, the position (XY coordinate) of the lower end of the lead 45 is recognized from the image. Next, when recognizing the image of the position of the lower end of the positioning projection 42, the height position of the lower end of the positioning projection 42 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set at the laser light source 34. With the laser beam emitted from the four laser light sources 34 in the horizontal direction in a state where it is lowered to the same height as the optical axis, the outer peripheral surface of the lower end portion of the positioning projection 42 of the insertion part 41 is irradiated, By capturing an image including the lower end of the positioning projection 42 with the component imaging camera 16, the position (XY coordinate) of the lower end of the positioning projection 42 is recognized from the image.

  On the other hand, the data of the position of the positioning hole 44 of the circuit board 43 and the position of the lead insertion hole 46 are the data of the reference mark of the circuit board 43 recognized from the image obtained by previously imaging the reference mark of the circuit board 43 by the board imaging camera 23. Using the position as a reference, it is obtained from specification data provided by the manufacturer of the circuit board 43 (data on the position of the positioning hole 44 and the position of the lead insertion hole 46 of the circuit board 43 based on the position of the reference mark). The image recognition of the position of the reference mark on the circuit board 43 is performed to determine the component mounting position on the circuit board 43 in the component mounter 12 before component mounting. Therefore, if the image recognition result is used as it is. Well, there is no need to add a new image recognition process.

[Lead positioning process (lead positioning means)]
After the completion of the image processing process, the process proceeds to a lead positioning process, where the mounting head 17 is moved in the horizontal direction by the head moving device 22 and components such as the suction nozzle 21 of the mounting head 17 as shown in FIG. The position of the lower end of the lead 45 of the insertion part 41 held by the holder (position recognized in the image processing step) is positioned at a position where it can be inserted into the lead insertion hole 46 of the circuit board 43. At this time, the insertion component 41 is positioned so that the center of the lower end surface of the lead 45 coincides with the center of the lead insertion hole 46 of the circuit board 43.

[Temporary insertion process (temporary insertion means)]
After the lead positioning step is completed, the process proceeds to a temporary insertion step, and the component holder holding the insertion component 41 is lowered as shown in FIG. 7B, and the lower end of the lead 45 is moved to the lead insertion hole of the circuit board 43. The component holder is lowered temporarily before the lower end of the positioning projection 42 reaches the surface of the circuit board 43 by being slightly inserted into 46.

[Positioning process for positioning protrusion (positioning protrusion positioning means)]
After completion of the temporary insertion step, the process proceeds to the positioning protrusion positioning step, and as shown in FIG. 7C, the component holder holding the insertion component 41 is moved in the horizontal direction and the lead 45 is deformed for positioning. The position of the lower end of the projection 42 for use (position recognized in the image processing step) is positioned at a position where it can be inserted into the positioning hole 44 of the circuit board 43. At this time, the insertion component 41 is positioned so that the center of the lower end surface of the positioning projection 42 is aligned with the center of the positioning hole 44 of the circuit board 43.

[Main insertion process (main insertion means)]
After completion of the positioning protrusion positioning step, the process proceeds to the main insertion step, and as shown in FIG. 7D, the lowering operation of the component holder is resumed and the positioning protrusion 42 of the insertion component 41 is moved to the circuit board 43. The lead 45 is inserted into the lead insertion hole 46 of the circuit board 43 simultaneously with the insertion into the positioning hole 44. If the lead 45 is soldered to the circuit board 43 in this state, the process of mounting the insertion component 41 on the circuit board 43 is completed.

  If the positioning process and the insertion process are performed in two steps as in the present embodiment described above, the positioning protrusions of the insertion part 41 due to manufacturing variations of the insertion part 41 and deformation of the lead 45 due to external force. Even when the positional relationship between the portion 42 and the lead 45 is deviated from the original positional relationship, the positioning projection 42 and the lead 45 of the insertion component 41 are inserted into the positioning hole 44 of the circuit board 43 and the lead as much as possible. The number of insertion parts 41 that can be inserted into the hole 46 and cannot be inserted and can be reduced can be reduced, and the production cost can be reduced accordingly.

  By the way, when the positional relationship between the lower end of the positioning projection 42 of the insertion component 41 and the lower end of the lead 45 is not deviated from the original positional relationship, the insertion component 41 is also mounted on the circuit board by a mounting method similar to the conventional one. 43 can be implemented.

  Therefore, in this embodiment, the control device 51 of the component mounting machine 12 determines that the positional relationship between the lower end of the positioning projection 42 of the insertion component 41 and the lower end of the lead 45 recognized in the image processing step is the circuit board 43. It is determined whether or not the positional relationship between the positioning hole 44 and the lead insertion hole 46 matches, and only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, and the positioning When the protrusion positioning step and the main insertion step are executed and it is determined that the positional relationship between the two matches, the lower end of the positioning protrusion 42 of the insertion component 41 held by the component holder and the lower end of the lead 45 are simultaneously set. After positioning at a position where the circuit board 43 can be inserted into the positioning hole 44 and the lead insertion hole 46, the component holder for holding the insertion component 41 is lowered to position the insertion component 41. And a projecting portion 42 and the lead 45 are simultaneously inserted into the positioning hole 44 and the lead insertion hole 46 of the circuit board 43.

  In this way, the positional relationship between the lower end of the positioning projection 42 of the insertion component 41 and the lower end of the lead 45 recognized in the image processing step is the relationship between the positioning hole 44 of the circuit board 43 and the lead insertion hole 46. In the case of matching the positional relationship between the positioning projections 42 and the leads 45 of the insertion component 41 in the positioning hole of the circuit board 43 in one positioning step and one insertion step as in the prior art. 44 and the lead insertion hole 46, the number of steps can be reduced, and the cycle time for mounting the insertion component 41 on the circuit board 43 can be shortened.

  In general, a plurality of leads 45 are provided in a row in the insertion component 41, and a plurality of lead insertion holes 46 are provided in a row in the circuit board 43 corresponding thereto. If the position of the lower end of the lead 45 is shifted from the original position for each lead 45, the lower direction of the plurality of leads 45 may not be inserted into the plurality of lead insertion holes 46 of the circuit board 43. There is.

  Therefore, in the present embodiment, the control device 51 of the component mounting machine 12 is configured such that the positions of the lower ends of the plurality of leads 45 of the insertion component 41 recognized in the image processing process are shifted from the original position to each of the leads 45. If it is determined that the lower end of the lead 45 cannot be inserted into the plurality of lead insertion holes 46 of the circuit board 43, it is determined that mounting is impossible, and the inserted component 41 is discarded to a predetermined disposal place or collection place. Yes. In this way, when it is determined that the lower ends of the plurality of leads 45 of the insertion component 41 cannot be inserted into the plurality of lead insertion holes 46 of the circuit board 43 based on the image recognition result, the subsequent steps are not performed. Therefore, the insert component 41 that cannot be mounted can be quickly discarded and the process for the next insert component 41 can be started quickly, and the cycle time for mounting the insert component 41 on the circuit board 43 can be shortened.

  In this embodiment, the data of the position of the positioning hole 44 and the position of the lead insertion hole 46 of the circuit board 43 is the circuit board recognized from the image obtained by imaging the reference mark of the circuit board 43 by the board imaging camera 23 in advance. The specification data provided by the manufacturer of the circuit board 43 with reference to the position of the reference mark 43 (data of the position of the positioning hole 44 of the circuit board 43 and the position of the lead insertion hole 46 based on the position of the reference mark) However, in the present invention, the positioning hole 44 and the lead insertion hole of the circuit board 43 are imaged separately or simultaneously by the board imaging camera 23, and the captured image is processed to obtain the circuit board. The positions of the positioning holes 44 of 43 and the positions of the lead insertion holes may be recognized. In this way, even if there are variations in the positions of the positioning holes 44 and the lead insertion holes 46 due to manufacturing variations in the circuit board 43, the variations in the positions of the positioning holes 44 and the lead insertion holes 46 in the circuit board 43 can be recognized. Therefore, it is possible to cope with variations in the positions of the positioning hole 44 and the lead insertion hole 46. Thereby, even when the positional relationship between the positioning hole 44 of the circuit board 43 and the lead insertion hole 46 is deviated from the original positional relationship due to manufacturing variations of the circuit board 43, the positioning of the insertion component 41 is as much as possible. The projecting portion 42 and the lead 45 can be inserted into the positioning hole 44 and the lead insertion hole 46 of the circuit board 43.

  Note that the present invention is not limited to the above-described embodiment. For example, the configuration of the component mounter 12 may be changed as appropriate, or the configurations of the insertion component 41 and the circuit board 43 may be changed as appropriate. Needless to say, various modifications can be made.

  DESCRIPTION OF SYMBOLS 12 ... Component mounting machine, 14 ... Component supply apparatus, 15 ... Conveyor, 16 ... Camera for component imaging, 17 ... Mounting head, 21 ... Adsorption nozzle (component holder), 22 ... Head moving device, 23 ... Camera for board imaging 32 ... Coaxial epi-illumination light source, 34 ... Laser light source, 41 ... Insertion part, 42 ... Positioning projection, 43 ... Circuit board, 44 ... Positioning hole, 45 ... Surface mounting electrode part, 46 ... Lead insertion hole, 51 ... Control devices (image processing means, lead positioning means, temporary insertion means, positioning projection positioning means, main insertion means)

Claims (6)

The positioning projection and the lead both project downward, and the lead is inserted into the insertion hole in which the lower end of the lead projects below the lower end of the positioning projection. The positioning hole and the lead are inserted into the positioning projection. In an insertion component mounting method for mounting on a circuit board provided with a lead insertion hole,
A component holding step of holding the supplied insertion component in a component holder;
The lower end of the positioning protrusion and the lower end of the lead of the insertion component held by the component holder are imaged separately or simultaneously with a component imaging camera, and the captured image is processed, whereby the positioning An image processing step for recognizing the position of the lower end of the protrusion and the position of the lower end of the lead;
A lead positioning step of positioning a position of the lower end of the lead of the insertion component held by the component holder at a position where the lead can be inserted into the lead insertion hole of the circuit board;
Before the component holder holding the inserted component is lowered and the lower end of the lead is slightly inserted into the lead insertion hole of the circuit board so that the lower end of the positioning projection reaches the surface of the circuit board. A temporary insertion step of temporarily stopping the lowering operation of the component holder;
The positioning projection of the insertion component while deforming the lead by moving the component holder horizontally with the lower end of the lead of the insertion component inserted into the lead insertion hole of the circuit board a little. A positioning protrusion positioning step for positioning the lower end position of the circuit board at a position where it can be inserted into the positioning hole of the circuit board;
The lead is inserted into the lead of the circuit board at the same time as the downward movement of the part holder holding the insert part is resumed and the positioning projection of the insert part is inserted into the positioning hole of the circuit board. An insertion component mounting method comprising: a main insertion step of inserting into the hole. In the insertion component mounting method according to claim 1,
The circuit board reference mark is imaged with a substrate imaging camera, and the captured image is processed to recognize the position of the reference mark, using the specification data provided by the circuit board manufacturer, An insertion component mounting method comprising: obtaining data of the position of the positioning hole of the circuit board and the position of the lead insertion hole based on the position of a reference mark. In the insertion component mounting method according to claim 1,
Recognizing the position of the positioning hole and the position of the lead insertion hole by imaging the positioning hole and the lead insertion hole of the circuit board separately or simultaneously with a substrate imaging camera and processing the captured image An insertion component mounting method characterized by: In the insertion component mounting method according to any one of claims 1 to 3,
The positional relationship between the lower end of the positioning protrusion and the lower end of the lead of the insertion component recognized in the image processing step matches the positional relationship between the positioning hole of the circuit board and the lead insertion hole. Determine whether or not to
Only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, the positioning protrusion positioning step and the main insertion step are executed,
If it is determined that the positional relationship between the two matches, the lower end of the positioning projection of the insertion part and the lower end of the lead are simultaneously placed in a position that can be inserted into the positioning hole and the lead insertion hole of the circuit board. After positioning, the insertion component mounting method, wherein the positioning projection and the lead of the insertion component are simultaneously inserted into the positioning hole and the lead insertion hole of the circuit board. In the insertion component mounting method according to any one of claims 1 to 4,
The insertion part is provided with a plurality of leads in a row, and the circuit board is correspondingly provided with a plurality of lead insertion holes in a row,
The positions of the lower ends of the plurality of leads of the insertion component recognized in the image processing step are shifted from the original position to each lead, and the lower ends of the plurality of leads are used as the plurality of lead insertion holes of the circuit board. An insertion component mounting method, characterized in that, when it is determined that the insertion cannot be performed, it is determined that the mounting is impossible, and the insertion component is discarded in a predetermined disposal place or a collection place. The positioning projection and the lead both project downward, and the lead is inserted into the insertion hole in which the lower end of the lead projects below the lower end of the positioning projection. The positioning hole and the lead are inserted into the positioning projection. In an insertion component mounting apparatus for mounting on a circuit board provided with a lead insertion hole,
A component holder for holding the supplied insertion component;
The lower end of the positioning protrusion and the lower end of the lead of the insertion component held by the component holder are imaged separately or simultaneously with a component imaging camera, and the captured image is processed, whereby the positioning Image processing means for recognizing the position of the lower end of the protrusion and the position of the lower end of the lead;
Lead positioning means for positioning the position of the lower end of the lead of the insertion component held by the component holder at a position where the lead can be inserted into the lead insertion hole of the circuit board;
Before the component holder holding the inserted component is lowered and the lower end of the lead is slightly inserted into the lead insertion hole of the circuit board so that the lower end of the positioning projection reaches the surface of the circuit board. Temporary insertion means for temporarily stopping the lowering operation of the component holder;
The positioning projection of the insertion component while deforming the lead by moving the component holder horizontally with the lower end of the lead of the insertion component inserted into the lead insertion hole of the circuit board a little. A positioning protrusion positioning means for positioning the position of the lower end of the circuit board at a position where it can be inserted into the positioning hole of the circuit board;
The lead is inserted into the lead of the circuit board at the same time as the downward movement of the part holder holding the insert part is resumed and the positioning projection of the insert part is inserted into the positioning hole of the circuit board. An insertion component mounting apparatus comprising: a main insertion means for inserting into the hole.

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