JP2010186867A - Method of positioning ejector pin and electronic component feeder using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of positioning an ejector pin which can automatically measure the position of the center of the tip of an ejector pin, without having data about the ejector pin in advance, and to provide an electronic component feeder which uses the same. <P>SOLUTION: An ejector pin 45 for pushing up a component P, such as, a diced bare chip on an expand table is photographed from above by means of an imaging device 25. On the basis of the data about the photographed images, cumulative histograms HX and HY that display cumulative values of luminance in two axes of a system of coordinates consisting of two perpendicular axes are created; and based on the distribution of the cumulative histograms, an average value of each cumulative histogram is calculated, and the position of the center of the tip of the ejector pin is grasped from these average values and the ejector pin is positioned accordingly. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for positioning a push-up pin that pushes up a component such as a diced bare chip on an expand base, and an electronic component supply apparatus using the method.

  In a component supply device in an electronic component mounting apparatus that mounts a bare chip on a substrate, the wafer is attached to the adhesive sheet, and is cut into chips by a laser cutter or the like. In this state, the adhesive sheet is expanded in the radial direction. In some cases, the chips are separated from each other, and in this state, the bare chip is pushed up by a push-up pin, peeled off from the adhesive sheet, and supplied to a supply position that can be sucked by a suction nozzle. As a component supply device using this type of push-up pin, for example, there is one described in Patent Document 1 (see FIG. 16).

  In this case, if the center position of the tip of the push-up pin does not match the center position of the component or the suction nozzle, the component cannot be pushed up properly or the component may be damaged. For this reason, it is necessary to grasp the center position of the tip of the push-up pin. In particular, the diced parts (bare chips) on the expand base are often very small, and the position of the tip of the push-up pin is sequentially changed with respect to wear or bending of the tip as the push-up pin is made thinner. It was necessary to grasp accurately.

JP 2004-193442 A

  However, the tip shape of the push-up pin is actually designed and manufactured on the user side according to the size, shape, strength, etc. of the target chip, and these are user know-how. Therefore, the present situation is that the push-up pin is not standardized as a matter of course. For this reason, the device manufacturer of the electronic component mounting apparatus cannot prepare the push pin part data (model image) in advance, and the center position of the tip of the push pin is a part of the conventional image processing technology. It could not be obtained by pattern matching (a method for confirming matching with a model image) or the like. Therefore, conventionally, the center position of the tip of the push-up pin is manually aligned with the center of the suction nozzle by visual observation, which has been a factor that hinders the efficiency of automatic production by the machine.

  The present invention has been made in order to solve the above-described conventional problems. A push pin that can automatically measure the center position of a push pin tip without having data relating to the push pin in advance is provided. It is an object of the present invention to provide a positioning method and an electronic component supply apparatus using the method.

  In order to solve the above-described problem, a feature of the invention of the push pin positioning method according to claim 1 is a push pin positioning method in a component supply device that pushes up a component such as a diced bare chip on the expand base with the push pin. Then, the push-up pins are imaged from above by an imaging device, and cumulative histograms representing cumulative values of luminance with respect to orthogonal two-direction coordinates are created based on the imaging data, and each cumulative histogram based on the distribution state of these cumulative histograms Is obtained, and the center position of the tip of the push-up pin is grasped from these average values and positioned.

  According to a second aspect of the present invention, there is provided a thrust pin positioning method comprising: a suction nozzle that sucks and holds the component pushed up by the push pin according to claim 1; and a tip of the push pin with respect to the suction nozzle Is to position the center position.

  A feature of the push pin positioning method according to claim 3 is that, in claim 1 or claim 2, in obtaining an average value of a cumulative histogram representing a cumulative value of luminance with respect to the orthogonal two-direction coordinates, First, the region width of each cumulative histogram is determined based on the distribution state of each cumulative histogram, and the average value of the cumulative histogram is obtained from each region width.

  According to a fourth aspect of the present invention, there is provided an electronic component supply device according to the second or third aspect, wherein the component sucked and held by the suction nozzle is supplied to an electronic component mounting device.

  According to a fifth aspect of the present invention, there is provided the electronic component supply device according to any one of the second to fourth aspects, wherein the imaging device is attached to a component transfer device provided with the suction nozzle. That is.

  A feature of the electronic component supply device according to claim 6 is that, in any one of claims 1 to 5, the push-up pin is provided on a dark support plate.

  According to a seventh aspect of the present invention, there is provided the electronic component supply device according to any one of the first to sixth aspects, wherein the push-up pin has one point or a plurality of points of point symmetry or line symmetry. It is configured.

  According to the invention according to claim 1 configured as described above, the push-up pin is imaged from above by the imaging device, and a cumulative histogram representing the cumulative value of luminance with respect to the orthogonal two-direction coordinates is created based on the imaging data. Since the average value of each cumulative histogram is obtained based on the distribution state of these cumulative histograms, and the center position of the tip of the push-up pin is determined from these average values, the component supply device or the electronic component mounting is performed. Even when the maker does not have any data regarding the push-up pin at the time of delivery of the device, the center position of the push-pin tip arbitrarily selected by the user can be obtained automatically and accurately.

  According to the invention of claim 2, since the suction nozzle for sucking and holding the component pushed up by the push-up pin is provided and the center position of the push-up pin tip is positioned with respect to the suction nozzle, the tip of the push-up pin This makes it possible to accurately match the center position of the suction and the center position of the suction nozzle that holds and holds the parts, and reliably prevents the parts from being pushed up or damaged as in the past. can do.

  According to the third aspect of the invention, in obtaining the average value of each cumulative histogram, first, the area width of each cumulative histogram is determined based on the distribution state of each cumulative histogram, and the area width is selected from these area widths. Since the average value of the cumulative histogram is calculated, the average value of the cumulative histogram can be recalculated with the noise at both ends of the cumulative histogram removed, and the average value of the cumulative histogram can be calculated accurately. it can.

  According to the fourth aspect of the invention, since the component sucked and held by the suction nozzle is supplied to the electronic component mounting apparatus, the component pushed up by the push pin and supplied to the supply position is supplied to the electronic component. It can supply to an electronic component mounting apparatus with the suction nozzle of an apparatus.

  According to the invention according to claim 5, since the imaging device is attached to the component transfer device side provided with the suction nozzle, it is possible to take a push-up pin image using an existing imaging device that images a component or the like. Can do.

  According to the invention of claim 6, since the push-up pin is provided on the dark support plate, the picked-up pin that has been imaged and its surrounding density are clarified, and the upper surface image of the push-up pin is accurately acquired. Can do.

  According to the seventh aspect of the invention, the push-up pin is composed of one having point symmetric or line symmetric one point or a plurality of vertices. Therefore, the push-up pins of various configurations are based on the image data of the push-up pin. The center position of the tip can be determined.

It is the schematic of the electronic component mounting apparatus which shows embodiment of this invention. It is the figure which expanded a part of FIG. It is a figure which shows the push-up pin which pushes up components, such as a diced bare chip, on an expand stand. It is a figure which shows the imaging device which images a thrust pin from upper direction. It is a figure which shows the upper surface image of the thrust pin imaged by the imaging device. It is a figure which shows the cumulative histogram of the X direction and Y direction produced based on the upper surface image of a push-up pin. It is a figure which shows the specific method for producing a cumulative histogram from the upper surface image of a pushing pin. It is a figure which calculates | requires the average value of the accumulation histogram of a X direction.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an outline of an electronic component mounting apparatus 10, and a substrate transfer device 12 that transfers a substrate S in the Y direction is provided on a base 11 of the electronic component mounting apparatus 10. On the upper side of the substrate transfer device 12, a movable table 30 is guided and supported so as to be movable in the X direction by a fixed rail 20 extending in the X direction orthogonal to the Y direction, and a slide 21 elongated in the Y direction is provided on the lower surface of the movable table 30. It is fixed. The movement of the slide 21 in the X direction is controlled by a servo motor 22 via a ball screw. As shown in FIG. 2, as shown in FIG. 2, the slide 21 is attached with an image pickup device 25 having an optical axis O <b> 1 parallel to the Z direction for picking up a push-up pin, which will be described later, and a component transfer device 26. The table 24 is guided and supported so as to be movable in the Y direction, and its movement is controlled by a servo motor 31 via a ball screw.

  The component transfer device 26 is supported by a support base 27 attached to the movable table 24, and supported by the support base 27 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction. The component mounting head 28 is controlled to be moved up and down, and a cylindrical suction nozzle 29 that protrudes from below the component mounting head 28 and sucks and holds a component P such as a bare chip at the lower end. The center line O3 of the component mounting head 28 and the suction nozzle 29 is parallel to the Z direction, and the suction nozzle 29 is supported so as to be rotatable around the center line O3 with respect to the component mounting head 28, and is rotated by a servo motor (not shown). Is to be controlled.

  It should be noted that a plurality of suction nozzles 29 can be indexed on the component transfer device 26 so that various types of components P having different shapes and sizes can be sucked, or the component transfer device 26 can be attached to and detached from the moving table 24. By providing, it becomes possible to easily change to the suction nozzle corresponding to the change of the component P.

  An electronic component supply device 40 provided on one end side of the electronic component mounting apparatus 10 is provided with an XY table 41 movable in the XY directions, and the component P is placed in a state of a wafer diced on the XY table 41. An expand base 42 to be introduced is installed. As shown in FIG. 3, the component P is bonded to the adhesive sheet 43 and is held on the expanding table 42. A push-up pin 45 that pushes up the component P bonded to the adhesive sheet 43 is disposed below the expand base 42 in the vertical direction. The push-up pin 45 is erected on the support plate 46, and the support plate 46 is held on a lift member 47 that can move in the vertical direction. The upper part of the push-up pin 45 has a conical shape, and its tip (upper end) is made into a glossy flat or arc shape by finishing, so that the adhesive sheet 43 is not damaged when the part P is pushed up by the push-up pin 45. It has become. Note that the upper surface of the support plate 46 is dark, so that when the upper surface image of the push-up pin 45 is acquired, the push-up pin 45 and the light and shade can be clearly distinguished.

  As shown in FIG. 1, a component recognition camera 48 having an optical axis O2 parallel to the Z direction is provided on the base 11 between the substrate transfer device 12 and the electronic component supply device 40. This component recognition camera 48 has a light source (not shown) that illuminates the component P to be recognized and the lower end of the suction nozzle 29 from below. In order to recognize the component P sucked and held by the suction nozzle 29, the component transfer device 26 is temporarily stopped on the component recognition camera 48 while the component P is being transferred from the electronic component supply device 40 to the substrate S. In this state, the component recognition camera 48 captures an image of the component P from below the suction nozzle 29, so that the misalignment of the component P sucked by the suction nozzle 29 with respect to the center of the suction nozzle 29 and the deviation of the angle around the center are detected. It can be detected.

  The component recognition camera 48 recognizes the component based on the position of the image of the tip of the suction nozzle 29 that does not suck and hold the component P periodically (for example, after the machine is stopped or after a certain period of time elapses). It is also used to measure the positional relationship between the optical axis O2 of the camera 48 and the center line O3 of the suction nozzle 29.

  The imaging device 25 attached to the moving table 24 integrally with the component transfer device 26 images the push pin 45 from above in order to obtain the center position of the tip of the push pin 45. As shown in FIG. 4, the imaging device 25 includes a camera 51, a half mirror 52, a light source 53 made of LEDs, and a diffusion plate 54. The light source 53 irradiates the upper surface of the push-up pin 45 imaged by the camera 51 from above through the diffusion plate 54, and can capture the upper surface image of the push-up pin 45 by the camera 51 through the half mirror 52. . The imaged upper surface image of the push-up pin 45 is input to the image recognition device 55 and subjected to image processing.

  With the above-described configuration, when the component P is introduced in the state of a wafer diced on the expand table 42, the expand table 42 is moved in the XY direction together with the XY table 41, and the component P to be mounted on the substrate S is pushed up. Positioned above the pin 45. In this state, when the push-up pin 45 is raised, the component P adhered to the pressure-sensitive adhesive sheet 43 is pushed up, peeled off from the pressure-sensitive adhesive sheet 43, and supplied to a position where it is sucked by the suction nozzle 29. The component P pushed up by the push-up pin 45 is sucked and held by the suction nozzle 29, and the component transfer device 26 is moved in the XY direction together with the moving table 24, so that it is transported to a predetermined position on the substrate S, and the substrate S The component P can be mounted on the.

  The imaging device 25 is also used when detecting the position of a reference mark (not shown) provided on the substrate S when mounting a component. Based on the position of the reference mark, the imaging device 25 is used to move the slide 21 and the movable table 24. The position P is corrected in the X direction and the Y direction so that the component P sucked and held at the tip of the suction nozzle 29 of the component mounting head 28 can be mounted at a predetermined coordinate position on the substrate S.

  Next, a method for obtaining the center position of the tip of the push-up pin 45 will be described. Since the push-up pin 45 is worn or bent as it is used, it is replaced at a predetermined frequency. Since the center position of the tip of the push-up pin 45 changes due to such wear, bending, replacement, etc. of the push-up pin 45, the push-up pin 45 is pushed up periodically (for example, after the machine is stopped or every time a certain time elapses). Processing for measuring the center position of the tip of the pin 45 is performed.

  In order to obtain the center position of the tip of the push-up pin 45, first, the expand base 42 is moved in the XY direction together with the XY table 41 and retracted from above the push-up pin 45. Subsequently, the imaging device 25 is moved in the XY direction together with the moving base 24 and positioned at a position above the push-up pin 45. In this state, the push-up pin 45 is picked up from above by the imaging device 25, and the upper surface image (tip image) data ID of the push-up pin 45 as shown in FIGS. 5 and 6 can be acquired. The imaged upper surface image data ID of the push-up pin 45 is input to the image recognition device 55 and subjected to image processing.

  That is, the light emitted from the light source 53 is applied to the tip of the push-up pin 45 through the diffusion plate 54, and the reflected light is reflected by the half mirror 52 and enters the camera 51. As a result, the tip P1 of the push-up pin 45 is brightest, and the brightness gradually decreases as the conical diameter of the push-up pin 45 is increased, so that the top image data ID that is darkest in the support plate 46 region P2 can be acquired. From the acquired upper surface image data ID, a first processing region Z1 (white frame in FIG. 5) that includes the entire push-up pin 45 is determined. Then, the top surface image data ID in the first processing area Z1 is projected in the X and Y directions, and as shown in FIG. 6, an X direction cumulative histogram HX representing the cumulative value of the luminance with respect to the X direction position, and the Y direction position A Y-direction cumulative histogram HY representing a cumulative value of luminance with respect to is generated. That is, cumulative histograms HX and HY representing the cumulative values of luminance with respect to orthogonal two-direction coordinates are created.

  Specifically, in order to generate the cumulative histograms HX and HY in the X direction and the Y direction, for example, as shown in FIG. Luminance (0-255) is represented on these pixels. Then, a cumulative histogram HX in the X direction is created based on the cumulative value of the luminance in the column with respect to the X direction, and similarly, a cumulative histogram HY in the Y direction is created on the basis of the cumulative value of the luminance in the row with respect to the Y direction.

  Then, as shown in FIG. 8A, an index (σ) representing the spread such as variance or standard deviation and an average value (expected value) are respectively calculated from the entire region of the generated X-direction cumulative histogram HX. Then, an area obtained by adding and subtracting a value (kσ) obtained by multiplying the index σ by a constant k to the average value is set as a second processing area Z2X (see FIG. 8B). Thereafter, as shown in FIG. 8C, the average value of the X-direction cumulative histogram HX in the second processing area Z2X is recalculated, and the X of the tip of the push-up pin 45 is calculated by the recalculated average value HXA. The center position coordinate of the direction is obtained.

  Similarly, the Y-direction cumulative histogram HY is not shown, but an area obtained by adding and subtracting a value (kσ) obtained by multiplying the index σ by a constant k to the average value calculated from the entire area is the second process. Set as the area Z2Y, based on the second processing area (Z2Y), recalculate the average value of the Y-direction cumulative histogram HY, and use the recalculated average value (HYA) in the Y direction of the tip of the push-up pin 45 Is obtained. In this way, the center position coordinate of the tip of the push-up pin 45 is recognized.

  By calculating the average values HXA and HYA of the cumulative histograms HX and HY in two steps, noise caused by dirt at both ends of the cumulative histograms HX and HY is removed, and the cumulative histograms HX in the X and Y directions are removed. , HY can be obtained with high accuracy. In this case, the recalculation is not limited to two steps, and the average values of the cumulative histograms HX and HY in the X direction and the Y direction can be obtained with higher accuracy by repeating three or more steps.

  In this way, the center position (coordinate position of the center) HXA, HYA of the tip of the push-up pin 45 is obtained from the average value of the two cumulative histograms HX, HY in the X direction and the Y direction. From the center position coordinate of the tip of the push-up pin 45, the amount of deviation of the tip of the push-up pin 45 in the XY direction, in other words, the amount of error can be calculated.

  Next, the operation of the electronic component mounting apparatus 10 that performs the positioning method of the push-up pin 45 in the above-described embodiment will be described.

  The wafer introduced onto the expand base 42 expands the adhesive sheet 43 in the radial direction by the expand base 42, thereby separating adjacent parts (bare chips) P from each other and making it easy to take out the parts P. Thereafter, the expand base 42 is moved in the XY direction together with the XY table 41, and the component P to be mounted on the substrate S is positioned above the push-up pin 45. Next, the push-up pin 45 is raised, the component P adhered to the adhesive sheet 43 is pushed up and peeled off from the adhesive sheet 43, the suction nozzle 29 is lowered, and the component P pushed up by the push-up pin 45 is moved by the suction nozzle 29. Adsorbed and held. When the component P is sucked and held by the suction nozzle 29, the component transfer device 26 is moved in the XY direction together with the moving table 24. The component transfer device 26 temporarily stops moving at a position where the center position of the suction nozzle 29 coincides with the component recognition camera 48, and sucks the component P sucked by the suction nozzle 29 by the component recognition camera 48. A misalignment with respect to the center of the nozzle 29 and a misalignment around the center are detected. Next, the component transfer device 26 is moved in the X and Y directions together with the moving table 24 to convey the component P to a predetermined position on the substrate S, and mount the component P on the substrate S. At this time, the component P is mounted on the substrate S at a position corrected by an amount of misalignment of the component P sucked by the suction nozzle 29 with respect to the center of the suction nozzle 29 and an angle shift around the center.

  By the way, since the center position of the tip of the push-up pin 45 changes due to wear, bending or replacement, a process for periodically obtaining the center position of the push-up pin 45 by image processing is executed. In order to obtain the center position of the tip of the push-up pin 45, first, the expand base 42 is moved in the XY direction together with the XY table 41 and retracted from above the push-up pin 45. In this state, the imaging device 25 is moved in the X and Y directions together with the moving table 24 so that the imaging device 25 is positioned above the push-up pin 45. In this state, the upper surface image data ID of the push-up pin 45 is acquired by the imaging device 25, and the acquired upper surface image data ID of the push-up pin 45 is input to the image recognition device 55 and subjected to image processing. In this case, as shown in FIGS. 5 and 6, the top surface image data ID of the push-up pin 45 is brightest at the tip of the push-up pin 45, and the brightness gradually decreases as the conical diameter of the push-up pin 45 is increased. On the outside of the diameter of the push-up pin 45, the image becomes darkest by the back plate 47.

  The image processing device 55 first determines a first inspection region Z1 that includes the entire push-up pin 45 from the acquired upper surface image data ID, and projects the first inspection region Z1 in the X and Y directions. Thus, cumulative histograms HX and HY in the X and Y directions are created. The X-direction cumulative histogram HX is created based on the cumulative value of luminance with respect to the X-direction position. Similarly, the Y-direction cumulative histogram HY is created based on the cumulative value of luminance with respect to the Y-direction position.

  From these cumulative histograms HX and HY in the X direction and Y direction, an index σ representing the spread such as variance or standard deviation and an average value (expected value) are respectively calculated (see FIG. 8A). Regions obtained by adding and subtracting a value (kσ) obtained by multiplying the average σ by a constant k to the index σ are set as second processing regions Z2X and Z2Y (see FIG. 8B). Then, the average value of the cumulative histograms HX and HY in the X direction and the Y direction in the second processing areas Z2X and Z2Y is recalculated (see FIG. 8C), and this value is used as the final average value HXA. , HYA. Based on the coordinate positions of the average values HXA and HYA in the X direction and the Y direction, the center position coordinate of the tip of the push-up pin 45 is obtained.

  Thus, based on the newly obtained center position coordinates of the tip of the push-up pin 45, a deviation amount (error value) with respect to the reference position is calculated, and this deviation amount is stored as a correction value. Thus, when the electronic component P is pushed up by the push-up pin 45 next time, the relative position of the push-up pin 45 with respect to the component P can be corrected by the amount of deviation, and the center position of the component P can be pushed up by the push-up pin 45 accurately. To.

  According to the above-described embodiment, based on the upper surface image ID of the push-up pin 45 imaged by the imaging device 25, the cumulative histograms HX and HY representing the cumulative values of the luminance with respect to the XY direction position are created, respectively, Since the center position of the tip of the push-up pin 45 is obtained from the average value of the cumulative histograms HX and HY based on the distribution state of HY, the manufacturer completely sends out data regarding the push-up pin 45 when the electronic component mounting apparatus 10 is delivered. Even if not, the center position of the tip of the push-up pin 45 arbitrarily selected by the user can be obtained automatically and accurately.

  In the above-described embodiment, the component P is pushed up by the single push-up pin 45 having a conical tip. However, the push-up pin 45 may be formed by arranging a plurality of pins in contrast to the center line. Any shape can be used as long as the average value can be obtained by using the cumulative histogram.

  In the above-described embodiment, the component transfer device 26 is provided with the suction nozzle 29, and the component P pushed up by the push-up pin 45 is sucked and held by the suction nozzle 29 and directly conveyed to the position of the substrate S for mounting. However, the component P pushed up by the push-up pin 45 is sucked and held by the suction nozzle provided on the electronic component supply device 40 side and is conveyed to a predetermined intermediate position, and the component P conveyed to the intermediate position is You may make it mount on the board | substrate S by carrying out suction holding | maintenance with another suction nozzle provided in the electronic component mounting apparatus side.

  Furthermore, in the above-described embodiment, the example in which the expand base 42 is provided so as to be movable in the XY direction with respect to the push-up pin 45 has been described. For example, while the expand base 42 can be moved in the Y direction, The push-up pin 45 can be moved in the X direction. In short, any configuration may be used as long as the expand base 42 and the push-up pin 45 can be moved relative to each other in the XY directions so that the parts P on the expand base 42 can be pushed up by the push-up pin 45.

  The positioning method of the push-up pin 45 of the present invention is not limited to being applied to the electronic component mounting apparatus 10, but the component P is pushed up by the push-up pin 45 and can be sucked by the suction nozzle 29. The present invention can be applied to a wide range of electronic component supply devices 40 that supply P.

  As described above, the present invention is not limited to the above-described embodiments, and various forms can be adopted without departing from the gist of the present invention described in the claims.

  The push pin positioning method according to the present invention is suitable for use in a component supply device of an electronic component mounting apparatus that automatically measures the center position of the tip of the push pin and positions it with respect to the suction nozzle.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 25 ... Imaging apparatus, 26 ... Component transfer apparatus, 28 ... Component mounting head, 29 ... Adsorption nozzle, 40 ... Electronic component supply apparatus, 42 ... Expand base, 43 ... Adhesive sheet, 45 ... Push-up Pins 46 ... support plates 51 ... cameras 53 ... light sources 55 ... image processing devices HX, HY ... cumulative histograms, HXA ... average values, P ... parts, S ... substrates.

Claims (7)

The positioning method of the push-up pin in the component supply device that pushes up the component such as the diced bare chip on the expand base with the push-up pin,
The push-up pin is imaged from above by an imaging device, and a cumulative histogram representing a cumulative value of luminance with respect to orthogonal two-direction coordinates is created based on the imaging data, and an average of each cumulative histogram is based on the distribution state of these cumulative histograms A method for positioning a push-up pin, wherein each of the values is obtained, and the center position of the tip of the push-up pin is grasped from the average value and positioned.   2. The method for positioning a push-up pin according to claim 1, further comprising: a suction nozzle that sucks and holds the component pushed up by the push-up pin, and positioning a center position of the tip of the push-up pin with respect to the suction nozzle. .   In obtaining the average value of the cumulative histogram representing the cumulative value of the luminance with respect to the orthogonal two-direction coordinates according to claim 1 or 2, first, based on the distribution state of each cumulative histogram, A push pin positioning method, wherein an area width is determined, and an average value of a cumulative histogram is obtained from each of the area widths.   4. The electronic component supply device according to claim 2, wherein the component sucked and held by the suction nozzle is supplied to an electronic component mounting device.   5. The electronic component supply device according to claim 2, wherein the imaging device is attached to a component transfer device provided with the suction nozzle.   6. The electronic component supply apparatus according to claim 1, wherein the push-up pin is provided on a dark support plate.   7. The electronic component supply apparatus according to claim 1, wherein the push-up pin is configured to have one point or a plurality of points of point symmetry or line symmetry.

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