JP2016071626A - Method for manufacturing touch sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a touch sensor mounted for an input operation unit of various electronic apparatuses which can inexpensively configure a touch sensor integrated with a cover lens.SOLUTION: A method for manufacturing a touch sensor includes: a first step of forming a substrate portion 40 with a predetermined resin; a second step of forming a conductive metal film 800 on a first surface 41 of the substrate portion 40; a third step of forming a coated film 850 before exposure overlapping the conductive metal film 800; a fourth step of forming the coated film 850 into a first resin coating 900 having a first film thickness portion 910 and a second film thickness portion 920; a fifth step of removing the first film thickness portion 910 and thereby forming the first resin coating 900 into a substance having an exposed portion 810 of a conductive metal film 800, and forming the second film thickness portion 920 into a first resin layer 61; a sixth step of removing the exposed portion 810 of the conductive metal film 800, and thereby forming a metal pattern 50 which becomes a conductive site of a detection section 20 from the conductive metal film 800; and a seventh step of forming a second resin layer 62 on the side of the first surface 41 of the substrate portion 40.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a method for manufacturing a touch sensor mounted on an input operation unit or the like of various electronic devices.

  In recent years, an increasing number of various electronic devices perform an input operation by a touch operation with a finger or the like on an input operation unit. For example, a representative example thereof is a mobile device such as a smartphone.

  In many cases, the input operation unit is configured by mounting a capacitive touch sensor having optical transparency. For example, a cover lens with a touch sensor having a structure in which a capacitive touch sensor is bonded to a resin cover lens formed in a flat plate shape with an adhesive is arranged at the front position of the display device. In use, a configuration in which the surface of the cover lens is operated with a finger while visually recognizing the display content of a display device disposed in the device via a cover lens and a touch sensor has become widespread.

  Generally, the capacitive touch sensor has a configuration in which a detection unit is formed on a surface of a base material unit such as a polyethylene terephthalate (PET) film. For example, the conductive part of the detection part has an ITO conductive pattern formed on the surface of the base part in a predetermined shape, or a conductive nanowire dispersed in a resin on the surface of the base part in a predetermined shape. It was configured by coating and forming.

  As prior art document information related to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.

JP 2012-174003 A JP 2012-181828 A

  However, if the material of the conductive portion of the detection unit is made of ITO, costs are increased in terms of material costs and processing man-hours. Similarly, those made of conductive nanowires have a limitation in that the materials are expensive and can be constructed inexpensively.

  Also, in general, a touch sensor is configured as a cover lens with a touch sensor in which a surface opposite to a surface having a detection unit is adhesively held by a cover lens, and is mounted on a device. Used for touch operations. When the touch sensor is bonded to the cover lens, the cover sensor needs to be bonded so that a bonding deviation or the like does not occur.

  The present invention solves such a conventional problem, and an object of the present invention is to provide a touch sensor manufacturing method capable of constructing a cover lens integrated touch sensor at a low cost.

  In order to achieve the above object, a method for manufacturing a touch sensor according to the present invention includes the following steps. In the first step, the base portion having the first surface is formed of a predetermined resin, and in the second step, a conductive metal film is formed on the first surface of the base portion. Then, in the third step, a liquid first resin liquid is applied over the conductive metal film to form a pre-exposure coating, and in the fourth step, the pre-exposure coating is applied to the first film thickness portion and the second thickness. A first resin film having a film thickness portion is formed. Then, in the fifth step, the first film portion of the first resin film is removed to have the exposed portion of the conductive metal film, and the second film thickness portion is formed on the first resin layer. By removing the exposed portion of the conductive metal film in 6 steps, a metal pattern to be a conductive portion of the detection portion is formed from the conductive metal film, and in the seventh step, a liquid first is formed on the first surface side of the base material portion. The second resin liquid is applied to form a second resin layer covering the first surface 41 side.

  According to the present invention, since the thickness of the base material can be easily set and the manufacturing method is such that the metal pattern is directly provided on the base material, a touch sensor integrated with a cover lens can be constructed at low cost. The advantageous effect that the manufacturing method can be provided is obtained.

1 is an external perspective view of a smartphone equipped with a touch sensor manufactured by a touch sensor manufacturing method according to an embodiment of the present invention. Exploded perspective view of smartphone Block diagram schematically showing the configuration of the smartphone Cross section of touch sensor View of touch sensor from below The figure which expands and shows the principal part in FIG. The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The figure explaining the manufacturing method of a touch sensor The perspective view which shows the modification of a touch sensor

  A method for manufacturing a touch sensor according to the present invention will be described below with reference to the drawings.

(Embodiment)
1 is an external perspective view of a smartphone equipped with a touch sensor manufactured by a touch sensor manufacturing method according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the smartphone, and FIG. 3 is a block diagram schematically showing the configuration of the smartphone. 4 is a cross-sectional view of the touch sensor, FIG. 5 is a view of the touch sensor as viewed from below, and FIG. 6 is an enlarged view of the main part in FIG. FIG. 4 shows a cross-sectional position at the detection unit of the touch sensor. 7 to 13 are diagrams for explaining a method for manufacturing a touch sensor, and FIG. 14 is a perspective view showing a modification of the touch sensor.

  The touch sensor 10 according to the embodiment of the present invention is, for example, a capacitance type that is used by being mounted on a smartphone 100 (see FIG. 1).

  As shown in FIGS. 1 and 2, the smartphone 100 includes a housing 110 formed in an outer frame shape. A cover lens-integrated touch sensor 10 is attached to a front position of the housing 110. The cover lens-integrated touch sensor 10 has optical transparency.

  In the housing 110, as shown in FIG. 3, a display device 300, a microphone 410, a speaker 420, and the like are arranged. In addition, the first control unit 510 and the second control unit 520 are mounted on the wiring board disposed in the housing 110. Further, a radio wave transmission / reception unit 550 and the like are also formed on the wiring board. Although not shown, the display device 300 is disposed behind the cover lens integrated touch sensor 10.

  As shown in FIG. 3, the first control unit 510 has a function of controlling various functional parts such as the display device 300, the microphone 410, and the speaker 420, and is connected to each. The second control unit 520 is connected to the first control unit 510.

  As shown in FIG. 1, three side switch parts 600 are provided on the side part of the casing 110. Each side switch 600 is also connected to the first controller 510 (see FIG. 3). For example, when one of the side surface switch units 600 is pressed, the switch signal is detected by the first control unit 510, and the display screen of the display device 300 is changed under the control of the first control unit 510. Control is performed.

  As shown in FIG. 3, the cover lens integrated type touch sensor 10 is connected to and controlled by the second control unit 520. The second control unit 520 detects a change in capacitance generated in the touch sensor 10 when a proximity operation or a touch operation is performed on the touch sensor 10 with a finger or the like, and outputs a predetermined signal according to the detection result. It has the function to do. When a predetermined signal from the second control unit 520 is input to the first control unit 510, the first control unit 510 controls various functional parts according to the predetermined signal.

  As described above, the smartphone 100 is configured to include the cover lens integrated touch sensor 10 and various functional parts.

  Next, the cover lens integrated type touch sensor 10 will be described.

  As shown in FIGS. 4 to 6, the touch sensor 10 includes a main body portion 15 formed in a flat plate shape, and the main body portion 15 includes a plurality of detection units 20. ing. Although a flexible wiring board is attached to the main body portion 15, illustration thereof is omitted.

  As shown in FIG. 4, the main body portion 15 is disposed so as to overlap the first surface 41 and a resin base material portion 40 having a first surface 41 formed in a plane at positions corresponding to the respective detection portions 20. A metal pattern 50 made of conductive metal, a first resin layer 61 overlapping the metal pattern 50, and a second resin layer 62 overlapping the first surface 41 side so as to cover the first resin layer 61 are provided.

  In addition, although mentioned later for details, the metal pattern 50 and the 1st resin layer 61 are formed in the same shape by planar view. Moreover, the 1st resin layer 61 and the 2nd resin layer 62 are comprised only with resin.

  The base material portion 40 is made of, for example, a light-transmitting polycarbonate (PC) resin. Further, the first resin layer 61 and the second resin layer 62 are also made of a light transmissive material.

  In addition, as a material of the base material portion 40, a light transmissive resin such as a polyethylene terephthalate (PET) resin, a polymethyl methacrylate (PMMA) resin, or a cyclic olefin resin can be used other than the PC resin.

  The thickness of the base material portion 40 may be set to a thickness at which a predetermined amount of change in capacitance can be obtained during operation while ensuring strength when the cover lens is integrated. The thickness depends on the characteristics of the resin used. For example, in the case of using a PC resin, a thickness of about 1 mm is sufficient from the viewpoint of securing strength. Desirably, it is thicker than about 1 mm. On the other hand, if it is too thick, it becomes difficult to obtain a predetermined change in capacitance during operation, so it is preferable to make the thickness up to about 3 mm, preferably less than about 3 mm.

  In addition, the base material part 40 etc. do not need to have a light transmittance except the case where transmission of display content is required as for the smartphone 100.

  In the cover lens integrated type touch sensor 10, the second surface 42 side facing the first surface 41 of the base material portion 40 is an operation surface side for performing an operation with a finger or the like. Therefore, the second surface 42 is provided with a functional film such as a hard coat layer 48 in an overlapping manner. In addition to the hard coat layer 48, examples of the functional film formation include a layer having an antireflection function and an anti-fingerprint function. The hard coat layer 48 shown in FIG. Those having functions may be used, or layers having these functions may be laminated on the second surface 42.

  The shape of each detection unit 20 is a rectangular shape having the same size, and as shown in FIG. 5 and FIG. 6, the base material unit so that the plurality of detection units 20 are arranged in a matrix form independent of each other. 40. A drawer 30 is provided for each detector 20. The lead portions 30 are respectively routed to the outer edge position of the main body portion 15 and connected to a flexible wiring board (not shown) attached to the main body portion 15. And each detection part 20 is connected to the 2nd control part 520 via this flexible wiring board.

  Each of the detection units 20 is configured such that the conductive portion is composed of a metal pattern 50 (see FIG. 4) formed so as to overlap the first surface 41. In a plan view, the metal pattern 50 is provided so as to have a rectangular outer frame and mesh with each other in the outer frame. The metal patterns 50 are all formed with the same width and the same thickness, and are connected to each other. Similarly, each of the lead portions 30 is also configured such that the conductive portions are composed of metal patterns 50 connected to each other.

  Here, the metal pattern 50 will be described. The metal pattern 50 is formed with a width of 0.5 μm to 3 μm. In the outer frame of the detector 20, the metal patterns 50 formed in a parallel relationship with a pitch of 50 μm to 1000 μm are connected so as to intersect with each other in a substantially orthogonal relationship and are formed in a mesh shape. The metal pattern 50 in the outer frame of the detection unit 20 and the metal pattern 50 in the outer frame are also connected and formed. If the connected metal patterns 50 in the outer frame or the like are in a regular arrangement state, the regions where the metal patterns 50 are not arranged on the first surface 41 are also secured in a regular and the same area. preferable.

  The metal pattern 50 is made of a conductive metal such as copper, silver, aluminum, gold, and alloys thereof, and has a thickness of 0.5 μm to 3 μm.

  Note that when the metal pattern 50 has a width or thickness of 3 μm or less, the metal pattern 50 is hardly perceived and is in a so-called light-transmitting state. For this reason, the metal pattern 50 is set so that the width is 3 μm or less. And when the width | variety and thickness setting of the said metal pattern 50 are set and the base material part 40 is formed with transparent resin, what is called a transparent touch panel can be obtained. In addition, even if the width and thickness of the metal pattern 50 are 3 μm or less, it is possible to avoid a complete disconnection state if the metal pattern 50 is configured in a mesh shape as in the configuration. Can be obtained.

  As shown in FIG. 4, in this configuration, the first resin layer 61 is provided so as to overlap the metal pattern 50. Further, a second resin layer 62 is provided so as to cover the first surface 41 where the first resin layer 61 and the metal pattern 50 are not disposed.

  The first resin layer 61 is made of, for example, a light-transmitting acrylic resin that serves as an insulating resist, and the second resin layer 62 is made of, for example, a light-transmitting acrylic resin that is used as an insulating resist. It is preferable that both are the same because the types of materials used are suppressed. The first resin layer 61 is formed in the same shape as the connected metal patterns 50 in plan view.

  The thickness of the first resin layer 61 is 0.1 μm to 3 μm. The thickness of the second resin layer 62 is 1.0 μm to 100 μm at a portion overlapping the first surface 41. In addition, the 2nd resin layer 62 has a surface opposite to the base material portion 40 side formed with a flat surface having the same height.

  As described above, the second surface 42 side is provided with the functional film such as the hard coat layer 48 in an overlapping manner.

  In the touch sensor 10 configured as described above, the first surface 41 side of the base material portion 40 in the main body portion 15 faces the inside of the housing 110, and the second surface 42 side of the base material portion 40 becomes the operation surface. Thus, the second surface 42 side is exposed and mounted on the device (see FIG. 1).

  Next, an input operation state to the smartphone 100 equipped with the cover lens integrated touch sensor 10 will be described.

  The user displays various icons on the display device 300 of the smartphone 100, and in that state, touches the surface position on the second surface 42 side of the touch sensor 10 corresponding to the desired icon with a finger. In accordance with this touch operation, a change in capacitance occurs in the corresponding detection unit 20 of the touch sensor 10. This change in capacitance is detected by the second control unit 520 through the lead-out unit 30 and a signal corresponding to the detection result is input to the first control unit 510. The first control unit 510 changes the display of the display device 300 to the next screen corresponding to the desired icon in accordance with the input signal.

  At this time, the cover lens-integrated touch sensor 10 has improved detection accuracy compared to the conventional product.

  In the conventional product, a detection unit is configured to overlap the surface of the base material part, and the surface of the base material part opposite to the detection part side is bonded to the cover lens via an adhesive. And it is used in the form which performs input operation on the surface of the cover lens opposite to the adherence side.

  On the other hand, since the touch sensor 10 according to the present invention is a cover lens integrated type, no adhesive is required, and the metal pattern 50 formed so as to overlap the first surface 41 approaches the finger being operated. Can be positioned. For this reason, the capacitance between the finger and the finger becomes a large value, the detection accuracy is improved as compared with the conventional product, and the device can be made thinner.

  Next, a method for manufacturing the touch sensor 10 will be described with reference to FIGS.

  In the first step, using a resin such as polycarbonate resin, as shown in FIG. 7, the base material portion 40 having the first surface 41 and the second surface 42 facing each other is formed as an in-process product 701 by injection molding. . The work-in-progress 701 may be formed in a single unit state, but may be formed in a large shape that allows a plurality of portions corresponding to the base material portion 40 to be taken. And the base material part 40 is formed as that in which the 1st surface 41 consists of a plane at least.

  Next, in the second step, as shown in FIG. 8, a conductive metal film 800 made of a conductive metal such as copper is formed on the entire surface of the base portion 40 on the first surface 41 side to form the work-in-process 702. To do. The conductive metal film 800 is formed with a thickness of, for example, 0.1 μm to 3.0 μm, and is formed to a thickness that satisfies at least the thickness required for the metal pattern 50. The film forming method may be a sputtering method or a vapor deposition method, but is not particularly limited.

  In the third step, the liquid first resin liquid is applied to the first surface 41 side of the base material portion 40. The first resin liquid is of a UV curable type, and a spin coating method may be used as a coating method. As a result, as shown in FIG. 9, the work-in-process 703 in which the coating film 850 of the first resin liquid before exposure overlaps the conductive metal film 800 is obtained. Note that it is preferable to use a spin coating method because the surface opposite to the conductive metal film 800 side can be formed to have the same height as the coating film 850 before exposure. In addition, it is excellent in production efficiency if it is made into the circular large-sized thing which can take a part corresponding to the base material part 40 in multiple numbers.

  Thereafter, in the fourth step, the UV irradiation is performed in a state where, for example, a stamper is pressed against the coating film 850 of the first resin liquid before exposure. The stamper has an uneven surface to be pressed. As the concavo-convex shape, a portion formed from the conductive metal film 800 to the metal pattern 50 has a configuration in which the coating film 850 remains thick, and other portions are formed in a shape in which the coating film 850 remains thin. The material of the stamper is not particularly limited, but a resin resin stamper is preferable because the stamper can be easily manufactured.

  Then, UV irradiation is performed with the stamper pressed. As a result, as shown in FIG. 10, the in-process product 704 formed on the first resin coating 900 is obtained by curing the coating 850 before exposure in a shape corresponding to the uneven shape of the pressing surface of the stamper. In other words, the work-in-process 704 is formed with the first resin film 900 formed so as to overlap the conductive metal film 800. As the first resin liquid, it is preferable to use a UV curable resin material because the curing time can be shortened. However, the first resin liquid is not limited to the UV curable resin material.

  As can be seen from the above description, in the manufacturing method, so-called imprint lithography is performed from the third step to the fourth step to form the work-in-process 704 with the first resin coating 900.

  As shown in FIG. 10, the first resin film 900 is formed by integrally forming a first film thickness part 910 and a second film thickness part 920 formed thicker than the first film thickness part 910. Yes.

  The second film thickness portion 920 is provided in accordance with the location where the metal pattern 50 is formed. That is, the second film thickness portion 920 is provided in a shape such as a mesh shape that is connected to each other in plan view, and the width thereof is approximately the same as the width of the metal pattern 50 to be formed or slightly wider than that. It has become a thing.

  The first film thickness portion 910 has a flat surface opposite to the conductive metal film 800 side. As shown in FIG. 10, the first film thickness portion 910 is formed with a B dimension from the conductive metal film 800 to the surface (hereinafter referred to as the first thickness). The second film thickness portion 920 is also formed with a flat surface opposite to the conductive metal film 800 side. As shown in FIG. 10, the second film thickness portion 920 has a thickness from the conductive metal film 800 to the surface (hereinafter referred to as a second thickness) having a C dimension.

  In the fifth step, the work-in-process 704 is subjected to, for example, an etching process using oxygen gas on the entire surface, and the work-in-process 705 (see FIG. 11) from which the first film thickness portion 910 of the first resin coating 900 has been removed. Form.

  When removing the first film thickness portion 910 of the first resin film 900, the removal of the second film thickness portion 920 proceeds simultaneously. For this reason, the setting of the first thickness (B dimension) of the first film thickness part 910 and the second thickness (C dimension) of the second film thickness part 920 is performed on the work-in-process 705 from which the first film thickness part 910 is removed. In the state, the first thickness (B dimension) and the second thickness (C dimension) are such that the second film thickness portion 920 remains on the conductive metal film 800 as the first resin layer 61 having a thickness of, for example, 0.1 μm to 3.0 μm. ) Is set. In other words, the second thickness (C dimension) of the second film thickness portion 920 of the first resin coating 900 overlaps the first thickness (B dimension) of the first film thickness portion 910 and the conductive metal film 800 to remain. The thickness is set equal to or greater than the sum of the thicknesses of the resin layers 61.

  The first resin layer 61 remaining on the conductive metal film 800 is formed corresponding to the position where the metal pattern 50 is formed. For example, in a plan view, the first resin layer 61 is connected to each other in a mesh shape.

  In the work-in-process 705, as shown in FIG. 11, the 800 portions of the conductive metal film not covered with the first resin layer 61 are exposed portions 810 exposed to the outside.

  Subsequently, in a sixth step, 810 exposed portions of the conductive metal film 800 are removed. For example, if the conductive metal film 800 is made of a copper material, an etching process is performed on copper, and the exposed portion 810 is removed to obtain a work-in-process 706 (see FIG. 12).

  In the work-in-process 706, the conductive metal film 800 is removed at the exposed portion 810, so that only the portion covered with the first resin layer 61 remains and the remaining portion becomes the metal pattern 50. That is, in the sixth step, the metal pattern 50 is formed so as to overlap with the first surface 41 from the conductive metal film 800. The metal pattern 50 has a thickness and width of 0.5 μm to 3 μm, and is formed in a shape connected to each other in a mesh shape or the like in plan view. The first resin layer 61 overlaps all of the metal pattern 50 with a width substantially equal to that of the metal pattern 50. In the work in process 706, the first surface 41 portion where the metal pattern 50 is not disposed is exposed.

  In the seventh step, the second resin liquid that is liquid is applied to the work-in-process 706 from the first surface 41 side, and then the second resin liquid is cured, thereby covering the entire first surface 41 side. It is formed on the work-in-process 707 on which the resin layer 62 is formed. The second resin layer 62 is preferably provided with a uniform height setting on the surface height, and the second resin liquid is a UV curable type, and the spin coating method may be used as the coating method. Etc. are the same as in the case of the first resin liquid.

  Thereafter, a functional film such as a hard coat layer 48 is provided on the second surface 42 side of the work-in-process 707 to complete the main body 15 of the touch sensor 10. In addition, when it is formed in a large shape, the outer shape is punched and formed on the main body portion 15 of the touch sensor 10.

  The formation timing of the functional film such as the hard coat layer 48 may be performed after the first step. In the case of the cover lens integrated type touch sensor 10, the function film on the second surface 42 side is operated with a finger or the like. That is, it is necessary to make the surface flat for functional film formation. For this reason, it is preferable to form the functional film using the spin coat method.

  Subsequently, the touch sensor 10 is formed by attaching a flexible wiring board to the main body 15.

  As described above, according to the manufacturing method, the cover lens integrated touch sensor 10 can be manufactured in an easy and simple process. And since this touch sensor 10 does not use expensive ITO-made or electroconductive nanowires as a material of a detection part, it can be comprised at low cost. Furthermore, when the spin coating method is used, the first resin liquid and the second resin liquid can be applied to the same height in a short time, and can be formed efficiently in a large size, which is also inexpensive and high quality. This contributes to obtaining a touch sensor 10 that is reliable.

  Further, in the manufacturing method, since the thickness of the base material portion 40 can be easily set and the metal pattern 50 is directly provided on the base material portion 40, the cover lens integrated touch sensor 10 is easily manufactured. be able to. The cover lens-integrated touch sensor 10 has an advantage that when it is mounted on a device, a bonding process to the cover lens is not required as in the conventional product, so that a bonding deviation does not occur. . In addition, you may manufacture what is affixed and used for a cover lens like a conventional product. In that case, what is necessary is just to make the formation thickness of the base material part 40 into a corresponding thickness.

  In the above description, the base material portion 40 has a flat plate shape and is not bent. However, if it is the said manufacturing method, it is also possible to obtain the touch sensor 10A of the modification shown in FIG. The touch sensor 10A is formed in a shape in which only the short side is an arc.

  In order to manufacture the touch sensor 10A, the base material portion is formed in an arc shape only on the short side in the first step described above. If the second and subsequent steps are manufactured using the same manufacturing process, the touch sensor 10A can be obtained. Note that even when the first surface and the second surface of the base member have a curved shape like the touch sensor 10A, it is preferable to apply the first resin liquid or the like by using the spin coating method.

  In addition, you may apply the detection part 20 which used the metal pattern 50 mentioned above as the electroconductive part to things other than the touch sensor 10 and 10A. For example, the present invention can be applied to a configuration in which a first plate-like member provided with a strip-like detection part extending in the X direction and a second plate-like member provided with a strip-like detection part extending in the Y direction are bonded together. .

  In the above description, the touch sensors 10 and 10A are described as being mounted on the smartphone 100 as having light transmissivity. However, the devices to be mounted are not particularly limited, and are for input operation units of various electronic devices. Etc. can be mounted. Moreover, you may arrange | position the touch sensors 10 and 10A in the location which does not require visual recognition of the display content. In that case, since the light transmittance of the touch sensors 10 and 10A is not required, the range of selection of materials to be used is widened, and it is possible to configure at a lower cost. In addition, as a device equipped with a touch sensor that does not require light transmission, for example, an operation panel in a passenger compartment of an automobile can be cited, but there is no particular limitation.

  The method for manufacturing a touch sensor according to the present invention can form a cover lens-integrated touch sensor at low cost, and the touch sensor is mainly useful for input operation units of various electronic devices.

DESCRIPTION OF SYMBOLS 10, 10A Touch sensor 15 Main body part 20 Detection part 30 Drawer part 40 Base part 41 1st surface 42 2nd surface 48 Hard coat layer 50 Metal pattern 61 1st resin layer 62 2nd resin layer 100 Smartphone 110 Case 300 Display Device 410 Microphone 420 Speaker 510 First control unit 520 Second control unit 550 Transmission / reception unit 600 Side switch unit 701, 702, 703, 704, 705, 706, 707 Work in progress 800 Conductive metal film 810 Exposed unit 850 Coating film 900 First 1 resin film 910 first film thickness part 920 second film thickness part

Claims (7)

A first step of forming a base portion having a first surface and a second surface facing each other with a predetermined resin;
A second step of forming a conductive metal film on the first surface of the base portion;
A third step of forming a pre-exposure coating film by applying a liquid first resin liquid on the conductive metal film;
A fourth step of forming the coating film before exposure on a first resin film having a first film thickness portion and a second film thickness portion;
Removing the first film thickness portion of the first resin coating to have the exposed portion of the conductive metal film, and forming the second film thickness portion on the first resin layer; ,
A sixth step of forming a metal pattern serving as a conductive portion of the detection unit from the conductive metal film by removing the exposed portion of the conductive metal film;
A liquid second resin liquid is applied to the first surface side of the base portion, and then the second resin liquid is cured to form a second resin layer covering the first surface 41 side. And a method for manufacturing the touch sensor. The touch sensor manufacturing method according to claim 1, wherein a resin having light permeability is used as the predetermined resin for forming the base portion, and the width of the metal pattern is 0.5 μm to 3 μm. The touch sensor manufacturing method according to claim 1, wherein in the third step, the first resin liquid is applied by a spin coating method. The method for manufacturing a touch sensor according to claim 1, wherein in the fourth step, the first resin film is formed using a stamper. In the first resin film formed in the fourth step, the thickness of the second film thickness portion is equal to or greater than the sum of the thickness of the first film thickness portion and the thickness of the first resin layer. The touch sensor manufacturing method according to claim 1, which is formed by: The touch sensor manufacturing method according to claim 1, wherein in the seventh step, the second resin liquid is applied by a spin coating method. The touch sensor manufacturing method according to claim 1, wherein the functional film is formed on the second surface side of the base material by a spin coating method.

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