JP5470489B2 - Touch panel, touch panel manufacturing method, and touch panel integrated display device - Google Patents

Description

  The present invention relates to a touch panel.

  The touch panel is used as an input device. The input device is a device for operating various electronic devices. The touch panel is mounted on the display surface side of a liquid crystal display device, for example. Input is performed according to the display content of the display device that is visible through the touch panel. For example, an arbitrary position on the touch surface is designated (contacted or approached) by an input device (for example, a touch pen) or a human finger. Thereby, an input is performed. As such a touch panel, for example, a resistive film type touch panel and a capacitive coupling type touch panel are known.

  The capacitively coupled touch panel is provided with detection electrodes for detecting the touch position along the two-dimensional (x, y) direction of the video display area (input area by touch or approach). The detection electrode is made of, for example, crystalline (or non-crystalline) ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). Alternatively, it is composed of a thin conductive wire. The electrodes are provided on both surfaces (or one surface) of a substrate made of transparent glass (or a transparent resin film). An extraction circuit pattern connected to the detection electrode is formed in a non-image display area (an area outside the display area (frame area)). The extraction circuit pattern is formed on a surface on which the detection electrode is formed.

  There are many reports on touch panels. For example, the following prior art documents can be cited.

  In Patent Document 1, “a touch panel is formed into a three-dimensional shape having a surface and a side surface, a touch position detection surface for detecting a touch position is formed on the surface of the touch panel, and electrodes and Description of `` Narrow frame-compatible touch panel, characterized in that a lead circuit for connecting an electrode to an outside extraction part is formed, and the surface of the touch panel is disposed on the surface of the LCD and the side surface is disposed on the side of the LCD '' is there.

  Patent Document 2 discloses a “conductive sheet having a transparent substrate, a first conductive portion formed on one main surface of the transparent substrate, and a second conductive portion in contact with the other main surface of the transparent substrate. The first conductive part has two or more first fine wire conductive patterns each extending in a first direction and arranged in a second direction orthogonal to the first direction, The two conductive portions each have two or more second thin wire conductive patterns extending in a third direction and arranged in a fourth direction orthogonal to the third direction, and the first thin wire conductive The conductive pattern includes a conductive thin line portion and a first capacitance sensing unit formed on the thin line at a predetermined interval, and the second thin line conductive pattern includes the conductive thin line portion and the fine line portion. A second capacitance sensing unit formed at a predetermined interval on the line, and the first thin wire conductive pattern and the front The second fine wire conductive pattern is arranged so as to intersect when the conductive sheet is seen through, and the first and second fine wire conductive patterns are substantially linear, and the wire of the thin wire portion. The width “a” is 0.1 to 25 μm, and the first and second capacitance sensing units have an opening. There is also a description about "a method for producing a conductive sheet".

  In Patent Document 3, “a mobile phone having an input unit (side input unit) provided on a side surface” “a side surface input unit is configured by a flexible printed circuit board and a plurality of detection electrodes, and the detection electrode of the touch sensor is provided on the flexible printed circuit board. There is a description of “mounting the side surface input section by providing a plurality”.

  Non-Patent Document 1 describes “the market of touch panels and material technology trends”.

JP 2010-146418 A JP 2012-53644 A JP 2011-44933 A JP 2007-72902 A JP 2012-88683 A JP 2011-3169 A JP 2012-174190 A JP 2012-146297 A JP 2012-141690 A JP 2011-175335 A JP 2011-154561 A JP 2010-262557 A

Electric Glass Industry Association, “Touch Panel Market and Material Technology Trends”, Kenji Nakatani, Electric Glass, No. 45, pp.7-13 (April 2011)

  The conventional touch panel has an area outside the main surface (active area: display area of the display device: touch input area of the touch panel) having the maximum area (inactive area: non-display area of the display apparatus: outside the touch input area of the touch panel) : The lead-out wiring is formed in the design area where the light-impermeable design print layer is formed: the decoration area: the frame area: the window frame area). The area of the inactive region (frame region) cannot be ignored. The side part of the touch panel is not used as a touch input area.

  In a conventional touch panel, a plurality of transparent electrodes for detecting a touch position (input) are formed on a surface having the maximum area (touch panel main surface). A lead circuit pattern is formed on the main surface. The extraction circuit pattern is formed on the surface on which the transparent electrode pattern is formed. The frame area where the extraction circuit pattern is formed is not a display area. The display area (touch input area) is limited to an area excluding a frame area of the touch panel main surface. Accordingly, there is a limit to increasing the ratio of the display area (input area) in the main surface of the touch panel. When a large display surface is required, the area of the main surface of the touch panel needs to be increased. Since the input area is formed only on the main surface of the touch panel, the operability of the touch panel is limited.

  In a transparent conductive film made of ITO (IZO) or the like, high light transmittance and low resistance are contradictory characteristics. It is difficult to achieve both high light transmittance and low resistance. A transparent conductive film made of ITO (IZO) or the like is hard, weak against deformation, and easily cracks. The transparent conductive film lacks flexibility. That is, when the transparent conductive film made of ITO (IZO) is used, even if a transparent resin film is used for the substrate, the flexibility is poor.

  Conventionally, it has not been considered that the detection electrode of the touch panel is composed of thin conductive wires (in particular, a pattern in which conductive wires are formed in a mesh shape). By doing in this way, improvement in flexibility and light transmission have not been considered. A touch panel in which the ratio of the display area (input area) to one surface (main surface) of the touch panel is increased and an input area is also provided on the side surface intersecting with the main surface has not been considered. That is, a touch panel provided with input areas on a plurality of surfaces has not been considered.

  The present invention has been made to solve the above problems. In particular, the present invention proposes a touch panel having input areas on the main surface and side surfaces.

The present invention
It has a case body made of an electrically insulating transparent resin film,
The case body includes a main surface portion, a side surface portion, and a hollow portion,
The hollow portion exists in a region formed by the main surface portion and the side surface portion,
The side portion is
Connected to the main surface,
Substantially orthogonal to the main surface portion,
There are four or more side portions that are substantially orthogonal,
At least two of the side surface portions are substantially orthogonal to the first direction of the main surface portion,
At least two of the side surface portions are substantially orthogonal to the second direction of the main surface portion,
The main surface portion includes a main surface input area,
At least one of the four or more side surfaces includes a side surface input region,
The main surface portion is provided with two or more first electrode rows and two or more second electrode rows,
The two or more first electrode rows are:
Provided at predetermined intervals,
Provided along the first direction;
The two or more second electrode rows are:
Provided at predetermined intervals,
Provided along the second direction;
Each of the first electrode row and the second electrode row is composed of two or more island-shaped electrodes and an inter-electrode wiring in which the island-shaped electrodes are electrically connected,
One or two or more third electrode rows and one or two or more fourth electrode rows are provided on the side surface portion having the side surface input region,
The third electrode row is provided on an extension of the first electrode row (and / or the second electrode row),
The fourth electrode row is provided along the direction of the second electrode row (and / or the first electrode row),
One end of the first lead wire is electrically connected to the end of the first electrode row or the end of the third electrode row,
The other end portion of the first lead wiring is formed on a side surface portion that does not include the side surface input region,
One end portion of the second lead-out wiring is electrically connected to the end portion of the second electrode row and the end portion of the fourth electrode row,
The other end portion of the second lead wiring is formed on a side surface portion that does not include the side surface input region,
A capacitive touch panel is proposed in which at least one of the first lead wiring and the second lead wiring passes through a ridge line portion that is a boundary between side surfaces adjacent to each other.

  The present invention is the capacitive touch panel, wherein the first electrode row is provided on one side of the main surface portion, and the second electrode row is the other side of the main surface portion. The third electrode row is provided on the surface side on which the electrode row that is the source of the third electrode row is provided, and the fourth electrode row is provided on the surface side of the fourth electrode row. A capacitive touch panel is proposed in which the electrode row is provided on the surface side on which the electrode row along which the fourth electrode row is provided.

  The present invention is the capacitive touch panel, wherein the first electrode row and the second electrode row are provided on one surface side of the main surface portion, and an electrically insulating spacer is the first electrode row. The third electrode row and the fourth electrode row are provided on one surface side of the side surface portion at the intersection of the second electrode row and the second electrode row. A capacitive touch panel is proposed in which an electrically insulating spacer is provided at an intersection between the third electrode row and the fourth electrode row.

  The present invention proposes a capacitive touch panel as the capacitive touch panel, wherein the lead-out wiring passing through the ridge line portion is located on an inner surface side of the case body. .

  The present invention is the capacitive touch panel, wherein a center position of the island electrode in the first electrode row and a center position of the island electrode in the second electrode row are relative to the main surface portion. We propose a capacitive touch panel that is located at different positions when viewed from orthogonal directions.

  The present invention is the capacitive touch panel, wherein the island-shaped electrodes of the first electrode array and the island-shaped electrodes of the second electrode array are viewed from a direction orthogonal to the main surface portion. In this case, a capacitive touch panel characterized by substantially not overlapping is proposed.

  The present invention is the capacitive touch panel, wherein a visible light shielding layer is provided on a main surface portion outside the main surface input region and / or a side surface portion outside the side surface input region. We propose a capacitive touch panel.

  The present invention proposes a capacitive touch panel as the capacitive touch panel, wherein a transparent resin layer is provided on the surface of the case body.

  The present invention proposes a capacitive touch panel, wherein the capacitive touch panel is provided with a hard coat layer on the surface of the case body.

  The present invention is the capacitive touch panel, wherein a transparent resin layer is provided on the surface of the case body, and a hard coat layer is provided on the surface of the transparent resin layer. We propose a capacitive touch panel.

  The present invention proposes a capacitive touch panel, wherein the capacitive touch panel is provided with a reinforcing frame inside a side surface of the case body.

  The present invention proposes a capacitive touch panel as the capacitive touch panel, wherein the island-shaped electrodes in the main surface input region are configured by a mesh-like conductor.

  The present invention proposes a capacitive touch panel as the capacitive touch panel, wherein the electrode array in the main surface input region is constituted by a mesh-like conductor.

  The present invention is the capacitive touch panel, wherein the electrode array in the main surface input region and the side surface input region is configured by a mesh-like conductor. Propose.

  The present invention is the capacitive touch panel, wherein the conductor is made of one or more metals selected from the group consisting of Ag, Au, Cu, and Al. We propose a capacitive touch panel.

  The present invention is the capacitive touch panel, wherein an external connection terminal is formed on a side surface portion that does not include the side surface input region, and the other end portion of the first lead wiring and the second connection wire One end of the other end of the lead-out wiring is connected to the external connection terminal through a through hole, and the other end of the first lead-out wiring and the other end of the second lead-out wiring are through. A capacitive touch panel is proposed which is connected to the external connection terminal without a hole.

  The present invention proposes a capacitive touch panel as the capacitive touch panel, wherein the surface of the external connection terminal is covered with carbon.

The present invention
It has a case body made of an electrically insulating transparent resin film,
The case body includes a main surface portion, a side surface portion, and a hollow portion,
The hollow portion exists in a region formed by the main surface portion and the side surface portion,
The side portion is
Connected to the main surface,
Substantially orthogonal to the main surface portion,
There are four or more side portions that are substantially orthogonal,
At least two of the side surface portions are substantially orthogonal to the first direction of the main surface portion,
At least two of the side surface portions are substantially orthogonal to the second direction of the main surface portion,
The main surface portion includes a main surface input area,
At least one of the four or more side surfaces includes a side surface input region,
The main surface portion is provided with two or more first electrode rows and two or more second electrode rows,
The two or more first electrode rows are:
Provided at predetermined intervals,
Provided along the first direction;
The two or more second electrode rows are:
Provided at predetermined intervals,
Provided along the second direction;
Each of the first electrode row and the second electrode row is composed of two or more island-shaped electrodes and an inter-electrode wiring in which the island-shaped electrodes are electrically connected,
One or two or more third electrode rows and one or two or more fourth electrode rows are provided on the side surface portion having the side surface input region,
The third electrode row is provided on an extension of the first electrode row (and / or the second electrode row),
The fourth electrode row is provided along the direction of the second electrode row (and / or the first electrode row),
One end of the first lead wire is electrically connected to the end of the first electrode row or the end of the third electrode row,
The other end portion of the first lead wiring is formed on a side surface portion that does not include the side surface input region,
One end portion of the second lead-out wiring is electrically connected to the end portion of the second electrode row and the end portion of the fourth electrode row,
The other end portion of the second lead wiring is formed on a side surface portion that does not include the side surface input region,
At least one of the first lead wiring and the second lead wiring is a method of manufacturing a capacitive touch panel that passes through a ridge line portion that is a boundary between side surfaces adjacent to each other,
The conductor pattern constituting the first electrode row, the second electrode row, the third electrode row, the fourth electrode row, the first lead wire, and the second lead wire is Conductive pattern forming step formed on the electrically insulating transparent resin film,
The manufacturing method of the capacitive touch panel characterized by the said electrically insulating transparent resin film comprising the shaping | molding process shape | molded by the said case body after the said conductor pattern formation process is proposed.

The present invention
A method of manufacturing the capacitive touch panel,
The conductor pattern constituting the first electrode row, the second electrode row, the third electrode row, the fourth electrode row, the first lead wire, and the second lead wire is Conductive pattern forming step formed on the electrically insulating transparent resin film,
The manufacturing method of the capacitive touch panel characterized by the said electrically insulating transparent resin film comprising the shaping | molding process shape | molded by the said case body after the said conductor pattern formation process is proposed.

  The present invention is the method of manufacturing the capacitive touch panel, wherein the first electrode row is provided on one surface side of the main surface portion, and the second electrode row is the main electrode portion. The third electrode row is provided on the other surface side of the surface portion, and the third electrode row is provided on the surface side on which the electrode row that is the basis of the third electrode row is provided, The fourth electrode row is provided on the surface side on which the electrode row along which the fourth electrode row is provided is proposed. A method for manufacturing a capacitive touch panel is proposed. .

  The present invention is a method for manufacturing the capacitive touch panel, wherein the first electrode row and the second electrode row are provided on one surface side of the main surface portion, and an electrically insulating spacer is provided. The intersection between the first electrode row and the second electrode row is provided between the first electrode row and the second electrode row, and the third electrode row and the fourth electrode row are on one side of the side surface portion. A method of manufacturing a capacitive touch panel, wherein an electrically insulating spacer is provided at an intersection between the third electrode row and the fourth electrode row. suggest.

  The present invention is the method for manufacturing the capacitive touch panel, wherein the lead-out wiring passing through the ridge line portion is located on the inner surface side of the case body. We propose a manufacturing method.

  The present invention is the method of manufacturing the capacitive touch panel, wherein the center position of the island electrode in the first electrode row and the center position of the island electrode in the second electrode row are the main positions. Proposed is a method for manufacturing a capacitive touch panel, which is located in a different position when viewed from a direction orthogonal to the surface portion.

  The present invention is the method for manufacturing the capacitive touch panel, wherein the island-shaped electrodes of the first electrode array and the island-shaped electrodes of the second electrode array are orthogonal to the main surface portion. Proposed is a method for manufacturing a capacitive touch panel, which is substantially non-overlapping when viewed from the direction.

  The present invention is a method of manufacturing the capacitance type touch panel, wherein the visible light shielding layer includes a main surface portion outside the main surface input region, and after the conductor pattern forming step and before the forming step. A method of manufacturing a capacitive touch panel is further provided, which further comprises a step provided at a position corresponding to a side surface outside the side surface input area.

  The present invention is the method of manufacturing the capacitive touch panel, further comprising a step in which the transparent resin layer is provided at a position corresponding to the surface of the case body. We propose a manufacturing method.

  The present invention is the method for manufacturing the capacitive touch panel, further comprising a step in which the hard coat layer is provided at a position corresponding to the surface of the case body. We propose a manufacturing method.

The present invention
A display device;
A touch panel integrated display device comprising the capacitive touch panel disposed on a display unit of the display device is proposed.

  An information input area is provided on the main surface and the side surface, has excellent operability, and a touch panel that can be suitably applied to an input / output integrated device is obtained.

Manufacturing process explanatory drawing of touch panel molding (A) Plan view of touch panel film (a) Enlarged view of main part of island electrode and lead-out wiring (plan view) Plan view of the design printing layer Plan view of touch panel film (a) Perspective view of touch panel film heating forming body (α) Front view, plan view, left side view, right side view, and rear view of touch panel film heating forming body (α) Bottom view of touch panel film heating forming body (α) Illustration of input / output integrated device (I) Illustration of touch panel terminal Manufacturing process explanatory drawing of a touch panel molding (B) Illustration of input / output integrated device (II) Manufacturing process explanatory drawing of touch panel molding (C) Illustration of input / output integrated device (III) Manufacturing process explanatory drawing of touch panel molding (D) Perspective view of touch panel film heating forming body (β) Front view, plan view, left side view, right side view, and rear view of touch panel film heating forming body (β) Bottom view of touch panel film heating forming body (β) Plan view of design film Perspective view of design film heating forming body Front view, plan view, left side view, right side view, and rear view of a design film heating forming body Illustration of input / output integrated device (IV) Manufacturing process explanatory drawing of touch panel molding Plan view of touch panel film (b) Plan view of touch panel film (c) Plan view of touch panel film (d) Plan view of touch panel film (e) Plan view of touch panel film (f)

  The first aspect of the present invention is a capacitive touch panel. The touch panel according to the first embodiment includes a case body. The case body is made of an electrically insulating transparent resin film. The case body includes a main surface portion, a side surface portion, and a hollow portion. The hollow portion exists in a region formed (enclosed) by the main surface portion and the side surface portion. The side surface portion is connected to the main surface portion. The side surface portion is substantially orthogonal to the main surface portion. There are four or more side portions that are substantially orthogonal. At least two side surfaces of the four or more side surfaces are substantially orthogonal to the first direction of the main surface. At least two side surfaces of the four or more side surfaces are substantially orthogonal to the second direction of the main surface. The first direction and the second direction are different. The first direction and the second direction are substantially orthogonal, for example. The main surface portion includes a main surface input area. At least one of the four or more side surfaces includes a side surface input region. All side portions may include a side surface input area. Preferably, assuming that the number of side surfaces is N (an integer of 4 or more), (N-1) or (N-2) or less number of side surfaces include side surface input regions. The main surface portion is provided with two or more first electrode rows and two or more second electrode rows. The two or more first electrode rows are provided at a predetermined interval. The first electrode row is provided along the first direction. The two or more second electrode rows are provided at a predetermined interval. The second electrode row is provided along the second direction. Each of the first electrode array and the second electrode array includes two or more island electrodes. The island electrodes are connected by interelectrode wiring. One or two or more third electrode rows and one or two or more fourth electrode rows are provided on the side surface portion including the side surface input region. The third electrode row is provided on an extension of the first electrode row (and / or the second electrode row). On the extension, when the main surface portion (formation surface of the first and second electrode rows) and the side surface portion (formation surface of the third and fourth electrode rows) are on the same plane (for example, In the case of a film state before case molding), the electrode rows are on the same line (for example, on a straight line). The fourth electrode row is provided along the direction of the second electrode row (and / or the first electrode row). The third electrode row includes one or more island electrodes in the electrode row. Even when there is one island-like electrode, this island-like electrode is electrically connected to the first electrode row. Therefore, since the third electrode row includes the island-like electrode and the electrical connection portion, it is expressed in terms of an electrode row. When there are two or more island electrodes, the island electrodes are connected by inter-electrode wiring. The first electrode row and the third electrode row are electrically connected. The fourth electrode row includes two or more island electrodes. The island electrodes are connected by interelectrode wiring. One end portion of the first lead wiring is electrically connected to the end portion of the first electrode row (or the third electrode row). The other end portion of the first lead-out wiring is formed on a side surface portion that does not include the side surface input region. One end portion of the second lead wiring is electrically connected to the end portion of the second electrode row and the end portion of the fourth electrode row. The other end portion of the second lead-out wiring is formed on a side surface portion that does not include the side surface input region. At least one of the first lead wiring and the second lead wiring passes through a ridge line portion that is a boundary between side surfaces adjacent to each other.

  The first electrode row is provided on one surface side of the main surface portion. The second electrode row is provided on the other surface side of the main surface portion. The third electrode row is provided on the surface side on which the electrode row that is the basis of the third electrode row is provided. The fourth electrode row is provided on a surface side on which the electrode row along which the fourth electrode row is provided. This is also explained as follows. The first electrode row and the second electrode row are provided on different surfaces of the main surface portion (the film). The different surfaces are a front surface and a back surface. The third electrode row and the fourth electrode row are surfaces on which the first electrode row is formed when the electrode row serving as the basis of these electrode rows is the first electrode row; Formed on the same side. The third electrode row and the fourth electrode row have a surface on which the second electrode row is formed when the electrode row serving as the basis of these electrode rows is the second electrode row; Formed on the same side. For example, the following cases (1) and (2) can be considered. (1) The said 1st electrode row | line | column is provided in the surface side of the said main surface part (the said film). The second electrode row is provided on the back surface side of the main surface portion (the film). The 3rd electrode row which exists on the extension of the 1st electrode row is provided in the surface side of the side part (the film). The third electrode row on the extension of the second electrode row is provided on the back side of the side surface portion (the film). The fourth electrode row along the first electrode row is provided on the surface side of the side surface portion (the film). The fourth electrode row along the second electrode row is provided on the back surface side of the side surface portion (the film). (2) The first electrode row is provided on the back side of the main surface portion (the film). The second electrode row is provided on the surface side of the main surface portion (the film). The third electrode row on the extension of the first electrode row is provided on the back side of the side surface portion (the film). The third electrode row on the extension of the second electrode row is provided on the surface side of the side surface portion (the film). The fourth electrode row extending along the first electrode row is provided on the back side of the side surface portion (the film). The fourth electrode row extending along the second electrode row is provided on the surface side of the side surface portion (the film).

  The first electrode array and the second electrode array may both be provided on one surface side of the main surface portion. Both the third electrode row and the fourth electrode row may be provided on one surface side of the side surface portion. In this case, an electrically insulating spacer is provided at the intersection between the first electrode row and the second electrode row. An electrically insulating spacer is provided at the intersection of the third electrode row and the fourth electrode row. The first electrode row and the second electrode row must be electrically non-contact with each other. The third electrode row and the fourth electrode row must be electrically non-contact with each other. For this reason, an electrically insulating spacer is provided at the intersection of the two. The first electrode row, the second electrode row, the third electrode row, and the fourth electrode row may all be provided on one surface side of the film. The surface on which the first electrode row and the second electrode row are provided and the surface on which the third electrode row and the fourth electrode row are provided may be different from each other. good. However, in this example, the electrically insulating spacer is essential. Therefore, the case of the embodiment in which an electrically insulating spacer is not an essential requirement (the first electrode row and the second electrode row are provided on different surfaces) is preferable.

  The center position of the island electrode of the first electrode row and the center position of the island electrode of the second electrode row are at different positions when viewed from a direction orthogonal to the main surface portion. It is preferable. In particular, it is preferable that the island-like electrodes of the first electrode row and the island-like electrodes of the second electrode row do not substantially overlap each other. By doing in this way, in the main surface input area, the light transmittance becomes uniform regardless of the place. Visibility on the display surface is improved. A change in capacitance is detected efficiently with substantially the same detection sensitivity. The relationship between the island electrode in the third electrode row and the island electrode in the fourth electrode row is the relationship between the island electrode in the first electrode row and the island electrode in the second electrode row. And so on. However, the third electrode row and the fourth electrode row are formed on side surfaces. It seems that the translucency at the side surface portion is not required as the translucency at the main surface portion. Therefore, the island-like electrode of the third electrode row and the island-like electrode of the fourth electrode row may overlap partly or entirely. Of course, the case where it does not overlap is preferable.

  Preferably, a visible light shielding layer is provided on the main surface portion outside the main surface input region (and / or the side surface portion outside the side surface input region).

  Preferably, a transparent resin layer is provided on the surface of the case body.

  Preferably, a hard coat layer is provided on the surface of the case body.

  Preferably, a transparent resin layer is provided on the surface of the case body, and a hard coat layer is provided on the surface of the transparent resin layer.

  Preferably, a reinforcing frame is provided inside the side surface portion of the case body.

  Preferably, the island electrode of the main surface portion is constituted by a mesh-like conductor. More preferably, the island-like electrode on the side surface portion is constituted by a mesh-like conductor. Preferably, the interelectrode wiring in the main surface portion is also constituted by a mesh-like conductor. More preferably, the inter-electrode wiring on the side surface portion is also constituted by a mesh-like conductor. Among these, preferably, the electrode row of the main surface portion is constituted by a mesh-like conductor. If the conductor portion has a mesh shape, the light transmittance is high accordingly. That is, the visibility is good. The conductor is composed of one or more metals selected from the group consisting of Ag, Au, Cu, and Al. Two or more metals are alloys.

  Preferably, the external connection terminal is formed on a side surface portion that does not include the side surface input region. One of the other end of the first lead wiring and the other end of the second lead wiring is connected to the external connection terminal through a through hole. The other end of the first lead wire and the other end of the second lead wire are connected to the external connection terminal without a through hole. The surface of the external connection terminal is preferably covered with carbon. The lead-out wiring passing through the ridge line portion is preferably located on the inner surface side of the case body. Therefore, when the film is formed into a case body, the extension wiring is hardly stretched. Disconnection of the lead wiring is difficult to occur.

  The second aspect of the present invention is a method for manufacturing a capacitive touch panel. The manufacturing method of this embodiment is a manufacturing method of the capacitive touch panel of the said embodiment. The method includes a conductor pattern forming step. In the conductor pattern forming step, the first electrode row, the second electrode row, the third electrode row, the fourth electrode row, the first lead wire, and the second lead wire This is a step of forming an electrically insulating transparent resin film. Each conductor pattern is formed simultaneously (or in order). The method includes a forming step. The forming step is a step in which the electrically insulating transparent resin film on which the conductor pattern is formed is formed on the case body.

  Preferably, in the method, after the conductor pattern forming step and before the forming step, the visible light shielding layer has a main surface portion outside the main surface input region and / or a side surface outside the side surface input region. The method further includes a step provided at a position corresponding to the portion.

  Preferably, the method further includes a step of providing a transparent resin layer at a position corresponding to the surface of the case body.

  Preferably, the method further includes a step of providing a hard coat layer at a position corresponding to the surface of the case body.

  The third aspect of the present invention is a touch panel integrated display device. The apparatus includes a display device. The apparatus includes the capacitive touch panel. The capacitive touch panel is disposed on a display unit of the display device.

  The film in which at least one of the first electrode row and the second electrode row is formed prior to the forming step (second step) after the conductor pattern forming step (first step) is completed. It can be set as the structure which has the process of forming the design printing layer which shields visible light and provides a design in one surface of this. According to this, it is not necessary to prepare the design film for forming the design printing layer separately. The number of parts is reduced.

  By the film insert molding and the film in-mold molding, a transparent resin layer can be formed on the outer surface of the heating forming body, and a hard coating layer can be formed on the surface of the transparent resin layer. According to this, the box which comprises a touch panel, and formation of a hard-coat layer can be formed by shaping | molding which performs film insert molding and film-in-mold shaping | molding at once. Manufacturing efficiency is good.

  It can be set as the structure which has the process of forming a transparent resin layer in the outer surface of the said heating forming body by film insert molding. According to this, the transparent resin layer which comprises a box can be integrated with a heating forming body.

  After the step of forming the transparent resin layer, it is possible to adopt a configuration including a step of providing an annular reinforcing frame made of an electrically insulating resin in contact with the inner wall of the hollow portion. According to this, a touch panel having sufficient strength against external force and strong against deformation can be obtained.

  Prior to the second step, a design printing layer made of an electrically insulating transparent resin, which shields visible light and imparts a design is formed as an opaque region, and the transparent region is positioned by the indicator Preparing a design film to be used as the main surface input region and the side surface input region, a second main surface portion corresponding to the main surface portion by heating and forming the design film, and at least four And a step of forming a second heating forming body corresponding to the box-shaped heating forming body. It can be set as the structure which has the process of forming a transparent resin layer between the heating forming body of the said film, and the said 2nd heating forming body by film insert molding. According to this, by preparing a design printing layer having various patterns according to the purpose for the heating forming body of the film, the heating forming body of the film and the first forming layer are formed by the transparent resin layer constituting the box. The touch panel which has the design printing layer of the target pattern by integrating 2 heating forming bodies is obtained.

  The first electrode array may be formed on one surface of the film, and the second electrode array may be formed on the other surface facing the one surface of the film. According to this, compared with the case where the first electrode row and the second electrode row are formed on one surface of the film, the first electrode row and the second electrode row are formed by a simple process. I can do it.

  A terminal portion connected to the lead-out wiring connected to the island electrode at the end of each of the plurality of rows of the first electrode row and the second electrode row, the one surface or the other It is possible to adopt a configuration in which a through hole is formed in the lead-out wiring or the terminal portion. According to this, electrical connection with an external circuit is easily possible on one side or the other side. A touch panel capable of transmitting and receiving signals to and from the first electrode array and the second electrode array is obtained.

  A step of filling the inside of the through hole with carbon, the step of forming the terminal portion with carbon, or the terminal portion is formed of the same material as the conductive material constituting the lead-out wiring, and the terminal portion It can be set as the structure which has the process of forming a carbon layer as a protective layer which covers. According to this, a terminal part can be protected. In particular, when the terminal portion is made of Ag, oxidation and migration of Ag can be prevented.

  Forming the third electrode row on one or both of the two side surfaces substantially orthogonal to the first direction in the third direction in which the first electrode row of the main surface portion extends; An electrode row in which island-like electrodes are formed via the inter-electrode wirings can be formed in the second direction in parallel with the second electrode row of the main surface portion. The third electrode row is formed in one of the two side surface portions substantially orthogonal to the second direction in the third direction in which the second electrode row of the main surface portion extends, and the island shape An electrode row in which electrodes are formed via the inter-electrode wiring can be formed in the first direction in parallel with the first electrode row of the main surface portion. According to this, the side surface input area into which information is input by the indicator can be formed on the side surface. Signals can be transmitted and received by a common external circuit to the electrode arrays formed in the main surface input region and the side surface input region, respectively.

  The first electrode row, the second electrode row, and the lead-out wiring can be formed of any one of Ag, Au, Cu, and Al. According to this, in the formation of the heating forming body, the electrical connection is hardly interrupted in these lead wires due to the deformation caused by the tensile force and the compressive force applied to the lead wires.

  A terminal portion is provided at a terminal portion of the lead-out wiring formed on at least one of the two side surface portions substantially perpendicular to the first direction and one of the two side surface portions substantially orthogonal to the second direction. It can be set as the structure which has the process of forming. A configuration may be provided that includes a step of forming a terminal portion at a terminal portion of the lead-out wiring formed on one of the two side surface portions substantially orthogonal to the second direction. According to this, the lead-out wiring and the terminal portion are formed on the side surface portion. Most areas of the main surface of the touch panel can be used as the main surface input area. The frame area can be minimized.

  An input / output integrated device of the present invention includes a touch panel manufactured by the above-described touch panel manufacturing method and a display device in which at least a part is accommodated in the hollow portion.

  In the touch panel of the present invention, when viewed from a direction perpendicular to the surface of the film, the first electrode row and the second electrode row are arranged so as to intersect with each other, and the island electrodes of the first electrode row are arranged. And the island-shaped electrodes of the second electrode array are separated and alternately arranged two-dimensionally in a grid pattern. According to this, in the main surface input area which is also the display surface, the light transmittance is uniform regardless of the place. Visibility on the display surface is improved. A change in capacitance can be detected efficiently with substantially the same detection sensitivity over the entire main surface input region.

  The film is formed on at least one of the surfaces formed by a part of the main surface part and at least a part of each of the four side surface parts to shield visible light and impart a design. It has a design printing layer, The heating forming body of the said film can be set as the structure which has the said design printing layer. According to this, the design print layer leaves the main surface input area on the main surface portion and the side surface input area on the side surface portion as a substantially transparent light-transmitting opening, and prints and displays information on the remaining portion of the touch panel. It is possible to display decorations and designs.

  It can be set as the structure which has the transparent resin layer formed in the outer surface of the heating forming body of the said film, and the hard coating layer formed in the surface of this transparent resin layer. According to this, the box which comprises a touch panel can be formed with a transparent resin layer, the inside of a touch panel can be protected, and the outermost surface of a touch panel can be protected by a hard-coat layer.

  Without providing a hard coat layer, it can be configured to have a transparent resin layer formed on the outer surface of the heat-formed body of the film. According to this, the transparent resin layer which comprises a box can be integrated with the heating forming body of a film.

  It can be set as the structure which has the annular reinforcement frame made from an electrically insulating resin provided in contact with the inner wall of the said hollow part. According to this, a touch panel having sufficient strength against external force and strong against deformation can be obtained.

  The main surface input region and the side surface input, which are made of an electrically insulating transparent resin, have a design printing layer that shields visible light, imparts a design, is formed as an opaque region, and a transparent region is designated by the indicator Heating the design film to be a region, the second main surface portion corresponding to the main surface portion, and the second side surface portions corresponding to at least four of the side surface portions, respectively, and heating the box-shaped film A second heating forming body corresponding to the forming body is provided, and a transparent resin layer formed by film insert molding is provided between the heating forming body of the film and the second heating forming body. I can do it. According to this, the transparent resin layer which comprises a box is made into a 2nd heating forming body by preparing the design printing layer which has various various patterns according to the objective with respect to said heating forming body. A touch panel having a design printing layer having a target pattern can be obtained.

  The first electrode array may be formed on one surface of the film, and the second electrode array may be formed on the other surface opposite to the one surface of the film. According to this, compared with the case where the first electrode row is formed on one surface of the film and the second electrode row is formed on the other surface opposite to the one surface of the film, a simple process is used. The first electrode row and the second electrode row can be formed.

  A terminal portion connected to the lead-out wiring connected to the island electrode at the end of each of the plurality of rows of the first electrode row and the second electrode row is the one surface or the other It is possible to adopt a configuration in which a through hole is formed in the lead-out wiring or the terminal portion. According to this, electrical connection with an external circuit can be easily performed on one surface or the other surface, and signals can be transmitted to and received from the first electrode array and the second electrode array.

  The inside of the through hole is filled with carbon, the terminal portion is made of the same material as carbon or the conductive material constituting the lead-out wiring, and a carbon layer is formed as a protective layer covering the terminal portion. I can do it. According to this, a terminal part can be protected. In particular, when the terminal portion is made of Ag, oxidation and migration of Ag can be prevented.

  The third electrode row is formed in one or both of the two side surface portions substantially orthogonal to the first direction in the third direction in which the first electrode row of the main surface portion extends, An electrode row in which island-like electrodes are formed via the inter-electrode wirings may be formed in the second direction in parallel with the second electrode row on the main surface portion. The third electrode row is formed in one of the two side surface portions substantially orthogonal to the second direction in the third direction in which the second electrode row of the main surface portion extends, and the island shape An electrode array in which electrodes are formed via the inter-electrode wiring can be formed in the first direction in parallel with the first electrode array on the main surface portion. According to this, the side surface input area into which information is input by the indicator can be formed on the side surface. Signals can be transmitted and received by a common external circuit to the electrode arrays formed in the main surface input region and the side surface input region, respectively.

  A terminal portion is provided at a terminal portion of the lead-out wiring formed on at least one of the two side surface portions substantially orthogonal to the first direction and one of the two side surface portions substantially orthogonal to the second direction. Can be formed. A terminal portion may be formed at the terminal end portion of the lead-out wiring formed on one of the two side surface portions substantially orthogonal to the second direction. According to this, the lead-out wiring and the terminal portion are formed on the side surface portion. Most areas of the main surface of the touch panel can be used as the main surface input area. The frame area can be minimized.

  The first electrode row, the second electrode row, and the lead-out wiring can be formed of any one of Ag, Au, Cu, and Al. According to this, in the formation of the heating forming body, disconnection hardly occurs in these lead-out wirings due to the deformation caused by the tensile force and the compression force applied to the lead-out wirings.

  An input / output integrated device of the present invention includes a touch panel having a main body input region and a side surface input region as a main component, and a display device at least partially housed inside the hollow portion. Have. Excellent operability.

<Explanation of terms>
Terms in the present embodiment will be described.
"Touch panel": The touch panel is configured integrally with the display device. The touch panel is a device that detects a user's touch operation without disturbing image display on the display device, for example. The touch panel includes a maximum area portion (main surface portion: main surface) and a side surface portion (side surface) connected to the maximum area portion. There are preferably four side surface portions, for example. The touch panel has a rectangular parallelepiped hollow structure (hollow space, hollow portion) inside the main surface portion and the side surface portions (four side surface portions). Accordingly, the touch panel has a case-like (box-like) three-dimensional shape. On the main surface portion and the side surface portion, island-shaped electrodes, inter-electrode wiring, lead-out wiring, and terminal portions are formed as necessary. An input area is formed on the touch panel.
"Touch panel film": The touch panel film is composed of an electrically insulating transparent resin film. In the electrically insulating transparent resin film, island-shaped electrodes, inter-electrode wirings, lead-out wirings, terminal portions, and design printing layers are formed as necessary. The design print layer may not be formed.
"Touch panel molded body": An electrically insulating transparent resin film on which island-shaped electrodes and the like are formed is a resin molded body formed by various molding methods.
“Indicator”: For example, an input device such as a conductive touch pen. Or it is a user's finger. Used by the user to designate an arbitrary position of the input area on the main surface portion (side surface portion) of the touch panel.
“Touch (touch input)”: The indicator touches (or approaches) the touch panel.
“Touch surface”: a surface on which the indicator contacts (or approaches) the touch panel.
“Touch position”: a position indicated by contact (or approach) of the indicator.
“Main surface input area”: an area in the main surface portion whose position is specified by the indicator.
“Side-side input area”: an area in the side face portion whose position is designated by the indicator.
"Design print layer": The design print layer is formed on an electrically insulating transparent resin film. The region where the design print layer is formed is an opaque region. The opaque area blocks visible light. A design is formed in the opaque region. A transparent area where the design print layer is not formed is an input area. The design printing layer is formed on the outside (periphery: window frame portion: frame portion) of the main surface input region and the side surface input region of the touch panel. Desired character information and information by design symbols are displayed on the design print layer.
"Design film": a film on which the design print layer is formed.
“Hard coat layer”: a protective layer that imparts a predetermined strength (hardness) to the outermost layer (transparent resin case or design film) of the touch panel. The protective layer ensures durability, weather resistance and impact resistance. For example, it is made of an ultraviolet curable resin.
“Island-like electrode”: an electrode for detecting a change in capacitance due to contact (or approach) of the indicator. It is said to be a contact detection electrode. It is also called a detection electrode. Examples of the shape of the island electrode include a triangle, a square, a rectangle, a rhombus (the apex angle may be 90 ° or other than 90 °), N (N is an integer of 5 or more), a circle, an ellipse, and the like. .
"Interelectrode wiring": a conductor (wiring) to which adjacent island electrodes are electrically connected.
“Leader wiring”: a conductor (wiring) to which the island electrode and the touch panel terminal are electrically connected.
“Mesh-like conductor”: A conductor (wiring) having a mesh shape. The island electrode is a mesh conductor. The inter-electrode wiring is also preferably a mesh conductor. The lead wiring may also be a mesh conductor.
“Mesh-like conductor pattern”: a conductor pattern formed in a mesh shape.
"Touch panel terminal part": It is an input / output terminal part formed by connecting to the terminal part of the lead wiring formed on the side part of the touch panel.
“Heating forming”: heating and softening a film to form a case (box shape). For example, vacuum molding (vacuum molding in which the mold and the film are evacuated and the film is brought into close contact with the mold), pressure molding (the film is heated and softened, and the film is moved along the mold by the force of compressed air. Compressed air forming).
“Heating forming body”: a molded body formed by heating forming.
“Touch panel film heating formed body”: A molded body formed by heat forming a touch panel film.
“Designed film heating and forming body”: A molded body formed by heating and forming a design film.
“Film-in-mold molding”: A desired layer (for example, a temporarily hard-coated hard coat layer) is formed on a release film that has been treated with a release material (release material). This film is inserted into the mold, and the molding resin in a melt-flow state is injected into the mold and solidified. As a result, a molded body having a desired layer transferred onto the surface can be obtained.
“First direction”: When the main surface input area of the touch panel is rectangular, the long side direction of the main surface input area is the first direction. In the drawing, it is the y direction (left-right direction). When the main surface input area is a square, the direction of any side of the main surface input area is the first direction.
“Second direction”: When the main surface input area of the touch panel is rectangular, the short-side direction of the main surface input area is the second direction. In the drawing, it is the x direction (vertical direction).
“Third direction”: the direction perpendicular to the paper surface on which the drawing is shown (depth) is the third direction. In the drawing, it is the z direction. The first direction, the second direction, and the third direction are, for example, orthogonal to each other. However, strict orthogonality is not required. For example, the crossing angle may be approximately orthogonal from 85 ° to 95 °.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention only needs to have a configuration that satisfies the above-described functions and effects. It is not limited to the following embodiment. The following drawings are drawn for clarity. The scale is not strictly accurate.

[Embodiment]
First, common matters will be described.

<Projection type capacitive coupling touch panel>
The present invention particularly relates to a projected capacitively coupled touch panel. Furthermore, the present invention relates to a device (input / output integrated device) in which the touch panel is incorporated in a display device. The touch panel is used as an input device for operating an electronic device. The touch panel is mounted on a display surface of a display device (for example, a liquid crystal display device). The touch panel is a touch panel molded body. The touch panel touches the touch surface of an indicator (for example, a conductor such as a touch pen or a finger) according to the display content of the display device that is visible through the touch surface (for example, the main surface) of the molded body. It is an apparatus in which various operations (for example, input) of an electronic device are performed by contact (approach: position instruction).

  In the touch panel, island-shaped electrodes are provided on an electrically insulating transparent film. For example, it is provided on both surfaces (front surface and back surface) of the film. Two or more island-shaped electrodes are provided on the film surface along the x direction (or y direction). Two or more island-shaped electrodes are provided on the back surface of the film along the y direction (or the x direction). When viewed from a direction perpendicular to the film, the island electrodes are arranged in a lattice (two-dimensional). The island-shaped electrodes formed on the film surface and the island-shaped electrodes formed on the back surface of the film are arranged so as not to substantially overlap each other. When a change in capacitance at the (x, y) position is sequentially detected by the island-shaped electrodes arranged in this way, multi-touch detection is possible.

  The island-like electrode is formed on the main surface of the touch panel molded body and the side surface intersecting with the main surface. Information input areas by user touch include a main surface input area formed on the main surface and a side surface input area formed on the side surface. The touch input area is formed on both the main surface and the side surface.

<Common Items of Touch Panel Main Components [Touch Panel Molded Body (A) to (D)]>
Common items of the touch panel [touch panel molded bodies (A) to (D) described later] will be described.

(Touch panel molding)
The touch panel is a heated forming body (touch panel molded body) of a touch panel film. The touch panel molded body includes a main surface ((xy) plane in an xyz coordinate system) that is a maximum area portion, a side surface substantially orthogonal to the main surface ((xz) plane in the coordinate system), the main surface Have side surfaces ((yz) plane in the coordinate system) substantially orthogonal to. The (xy) plane is, for example, one. There are two (xz) planes, for example. There are two (yz) planes, for example. A region formed by the main surface and the side surface is a hollow portion (hollow space).

  The transparent resin constituting the touch panel is a thermoplastic resin (for example, an acrylic resin, a polycarbonate resin, a polyester resin, a polyolefin resin, or the like) or a thermosetting resin (for example, an epoxy resin, a urea resin, or a silicone resin).

  An island electrode is formed on at least one of the (xz) plane and the (yz) plane and the (xy) plane. Adjacent island electrodes are connected in series by inter-electrode wiring.

  On the surface of the (xy) plane, a plurality of island-like electrode arrays arranged in the y direction are formed in the x direction. A plurality of island-shaped electrode arrays arranged in the x direction are formed on the back surface of the (xy) plane in the y direction. This arrangement may be reversed between the front surface and the back surface.

  When the island-shaped electrode array is formed on the (xz) plane, the island-shaped electrode array on the (xz) plane is formed by, for example, bending the film in which the island-shaped electrode array in the y-direction array is formed by 90 °. ,It is formed. When the island-shaped electrode array is formed on the (yz) plane, the island-shaped electrode array on the (yz) plane is formed by, for example, bending the film in which the island-shaped electrode array in the x-direction array is formed by 90 °. ,It is formed. The island electrode array on the (xy) plane is a part of the island electrode array formed on the film surface. The (xz) plane island electrode array is a part of the island electrode array formed on the film surface. The island electrode array on the (xz) plane exists, for example, on an extension of the island electrode array on the (xy) plane. The island-shaped electrode array on the (yz) plane is a part of the island-shaped electrode array formed on the film surface. The island electrode array on the (yz) plane exists, for example, on an extension of the island electrode array on the (xy) plane.

  The island-shaped electrode array formed on the front surface side of the film and the island-shaped electrode array formed on the back surface side of the film do not substantially overlap each other. From the viewpoint of light transmittance (visibility), it is preferable that the region (area) where the front-side island electrode and the back-side island electrode overlap is smaller. The overlapping area (area) is zero. From the viewpoint of capacitance, it is preferable that the region (area) where the island electrodes do not overlap is smaller. There are slightly non-overlapping regions (areas).

  Lead wires are formed on at least one of the (xz) plane and the (yz) plane. Preferably, it is formed across both one (xz) plane and one (yz) plane (the two planes are adjacent and connected). The lead wiring is connected to, for example, the island-shaped electrode array on the (xz) plane. The lead wiring is connected to, for example, the island electrode array on the (yz) back surface. A terminal portion is formed at the end of the lead wiring.

  The terminal portion and one FPC connection terminal of a flexible printed circuit board (FPC) are connected. The other FPC connection terminal is connected to the touch panel control / signal processing circuit.

  The touch panel is configured as a projected capacitive coupling method. The touch panel is a device that functions as an input device for various information. For example, a rectangular main surface input area is provided on the main surface of the touch panel. A rectangular side surface input region is provided on at least one of the side surfaces ((xz) plane, (yz) plane). The touch position indicated by the touch of the indicator on the main surface input region and the side surface input region is static between the island electrode formed on the front surface side of the touch panel and the island electrode formed on the back surface side of the touch panel. It is detected by detecting a change in electric capacity by a self-capacitance method or a mutual capacitance method.

  An active area is formed on the main surface of the touch panel. In some cases, an inactive area is configured. The active area is an area where various information is input by touch. The active area is a transparent translucent area (main surface input area: touch input area) where a touch input is detected. The inactive area is formed in a frame-shaped area (frame area) surrounding the main surface input area. The non-active region is a design region (decorative region) where a light-impermeable design print layer is formed. Even if there is a touch input in the inactive area, this touch input is not detected. An active area and an inactive area are formed on the side surface of the touch panel. The side active area is a side input area.

  The detection of the touch position of the indicator with respect to the main surface input area by the self-capacitance method (mutual capacitance method) will be described.

  In the self-capacitance method, voltage signals for touch position detection are sequentially supplied to island electrode arrays arranged in the x direction on the main surface ((xy) surface). A voltage signal for detecting the touch position is sequentially supplied to the island-like electrode arrays arranged in the y direction on the main surface ((xy) surface). The capacitance between the island electrode array A arranged in the x direction of the main surface facing the touch position and the island electrode array B arranged in the y direction of the main surface and the GND (ground) increases. To the island-shaped electrode array A in the x direction other than the combination of the island-shaped electrode array A in the x-direction and the island-shaped electrode array B in the y-direction. The waveform is different from the waveform of the transmission signal from the island electrode array B in the “and y direction”. The touch panel control / signal processing circuit is based on the transmission signal supplied from the island electrode array (the island electrode array arranged in the x direction of the main surface and the island electrode array arranged in the y direction of the main surface). Calculate the touch position.

  In the mutual capacitance method, for example, voltage signals for touch position detection are sequentially supplied to island-like electrode rows arranged in the x direction on the main surface, and island electrodes arranged in the y direction on the main surface. Sensing (detection of a transmission signal) is sequentially performed on the columns. The stray capacitance of the indicator is added in parallel to the parasitic capacitance between the island electrode array A arranged in the x direction facing the touch position and the island electrode array B arranged in the y direction. The waveform of the transmission signal from the island electrode array B arranged in the y direction is different from the waveform from the island electrode array B ′ in the y direction other than the island electrode array B in the y direction. Therefore, the touch panel control / signal processing circuit is based on the order of the island electrode arrays arranged in the x direction to which the voltage signal is supplied and the transmission signal from the supplied island electrode arrays arranged in the y direction. To calculate the touch position.

  By adopting the self-capacitance type (or mutual capacitance type) touch position detection method, even if two indicators touch (or approach) the main surface input area at the same time, the touch position can be detected. It becomes possible.

  Similarly, the touch position of the indicator with respect to the side surface input area can be detected.

(Touch panel film on which a mesh conductor is formed, design film on which a design print layer is formed)
The touch panel film (design film) is an electrically insulating transparent resin film. Examples of the film material include ester resins (for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.), olefin resins (for example, polyethylene (PE), polypropylene (PP), etc.), and vinyl resins. , Vinyl acetate resins (for example, EVA, etc.), polycarbonate (PC), triacetyl cellulose (TAC), polymethyl methacrylate (PMMA), polyether sulfone (PES), polyether ether ketone (PEEK), polyamide (PA) , Polyimide (PI), polystyrene (PS), cyclic olefin polymer (COC), polyurethane (PU), polyvinyl alcohol (PVA), and the like. A typical example is PET.

  The thickness of the film is, for example, 10 μm to 300 μm. However, it is not limited to this. From the viewpoint of light transmittance and mechanical strength, it is preferably 30 to 150 μm.

(Method for forming mesh conductor)
A typical method for forming a mesh conductor (mesh conductor) will be described. The island-like electrodes and the interelectrode wiring are preferably made of the mesh conductor. The lead-out wiring may also be composed of the mesh conductor. If it is a mesh (high aperture ratio), the light transmittance is high.

(1) Method by Printing of Conductive Ink A conductive ink containing conductive nanoparticles and a binder is formed in a mesh shape on the transparent film surface. For example, printing (screen printing, inkjet printing, gravure printing, offset printing, flexographic printing, dispenser printing, etc.) is used.

  The conductive nanoparticles are, for example, conductive particles having an average particle diameter of 2 μm or less (preferably 200 to 500 nm). The material of the particles is, for example, Ag, Au, Pt, Cu, Al, or carbon. The binder is, for example, a polyester resin.

  The mesh conductor can also be formed by printing a conductive ink containing a conductive polymer. Examples of the conductive polymer include poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, polyacetylene, polyphenylene vinylene, and the like.

(2) Method by etching of conductive thin film A conductive thin film is formed on the resin film surface. A mesh-like resist pattern is formed on the conductor thin film. The conductive thin film exposed from the resist pattern is removed by etching. Thereby, a mesh conductor is obtained. The thin film is formed by vacuum deposition, sputtering, ion plating, or plating. A metal thin film bonded to a resin film may be used. The conductor thin film is a thin film made of, for example, Au, Ag, Cu, or Al.

  The conductive thin film may be a film formed from a conductive polymer. Examples of the conductive polymer include the polymer.

(3) Method by metal vapor deposition thin film using mask The metal thin film is, for example, an Au, Ag, Cu or Al thin film.

(4) Method by conductive silver forming method using silver salt A photosensitive material containing a photosensitive silver halide salt and a binder is applied onto the resin film surface. Pattern exposure and development are performed. Silver composed of fine lines is formed in the exposed portion, and a light transmissive portion is formed in the unexposed portion. Thereby, a mesh conductor (Ag) is formed.

(Line width, pitch, thickness dimension of mesh conductor (conductor thin wire))
The line width, the pitch of the conductor wires, and the thickness of the conductor wires constituting the island electrodes and the inter-electrode wirings are, for example, 10 μm to 50 μm, 100 μm to 1000 μm, and 2 μm to 10 μm, respectively. Such a mesh-like conductor has a thin conductor line width, a large pitch with respect to the line width, is hardly noticeable, and improves visibility.

  The aperture ratio of the mesh conductor (island electrode, inter-electrode wiring) is preferably 90% or more from the viewpoint of the brightness of the display screen. The aperture ratio is (total outer area of mesh conductor−area of conductor portion) / (total outer area of mesh conductor).

  The size of the island electrode is, for example, 2 mm to 5 mm. The outer width of the interelectrode wiring is smaller than the outer shape of the island electrode.

  A distance between adjacent island electrodes (island electrodes connected by the inter-electrode wiring) (a distance between sides forming the outer shape of the island electrodes) is, for example, 20 μm to 100 μm.

  The dimensions, pitch, and thickness of the lead wiring (conductor thin wire) may be the same as, or different from, the dimensions, pitch, and thickness of the island electrode. For example, the line width, pitch, and thickness of the thin conductor wire may be 50 μm to 200 μm, 100 μm to 1000 μm, and 10 μm to 50 μm, respectively.

  The lead wiring is a wiring through which a signal from the island electrode array is transmitted to an external circuit. The lead wiring is made of a conductive material having high conductivity. The lead wiring has a mesh shape. However, it is not limited to a mesh shape. Non-mesh (solid) wiring may be used.

  Touch panel terminal part formed as an extension part of the lead wiring, and isolated wiring (the touch panel in which the lead wiring formed on one surface of the touch panel film is connected via a conductor in a through hole formed in the touch panel film. The isolated wiring formed on the other surface of the film has a mesh shape. However, it is not limited to a mesh shape. So-called solid wiring may be used.

(Design printing layer)
The design print layer is a layer on which a light-opaque window frame, a letter cut, or the like is printed. The design print layer is provided in a region (inactive region) outside the input region (active region: touch input region).

  The design printing layer is formed on the design film. As the design film, an electrically insulating transparent resin film used as a touch panel film is used. A design printing layer is formed on one side of the film.

  The design print layer is formed by printing (for example, screen printing, offset printing, flexographic printing, gravure printing, inkjet printing, etc.). The printing thickness is, for example, 2 μm to 10 μm.

  The design print layer may be directly formed on the touch panel film on which the mesh conductor pattern is formed. The area inside the design print layer is a display area (input area). In this case, the design film is not used.

  The aspect by which the design film in which the design printing layer was formed, and the touchscreen film in which the mesh-shaped conductor pattern was formed may be laminated | stacked. For example, a touch panel molded body (D) described later may be used.

(Hard coat layer)
A hard coat layer may be provided on the outermost layer of the touch panel (transparent resin case (or design film)). This hard coat layer preferably has a thickness of 1 μm to 20 μm. Examples of the material of the hard coat layer include an organic-inorganic hybrid hard coat agent Acier manufactured by NIDEK.

<Common items for I / O integrated devices (I), (II), (III), (IV)>
The common items of the input / output integrated devices (I), (II), (III), and (IV) will be explained.

(I / O integrated device)
The touch panel and the display device are combined to constitute an input / output integrated device. The input / output integrated device includes a touch panel molded body, a display device, a connection conductor such as a flexible printed circuit board (FPC) that electrically connects the touch panel molded body and the display device, a touch panel control / signal processing circuit, and a display. Unit control / signal processing circuit, input / output integrated device control / signal processing circuit, etc. The display device is, for example, a liquid crystal display device (LCD).

  The touch panel control / signal processing circuit is driven and controlled by a drive signal transmitted from now on, and processes a signal from the touch panel molded body. The signal from the touch panel molded body or the processing result of this signal is transmitted to the display device. Signal processing required for display is performed. The processing result is displayed on a display device (display surface) that is driven and controlled by the display unit control / signal processing circuit. The input / output integrated device control / signal processing circuit controls the entire input / output integrated device. The input / output integrated device control / signal processing circuit is a circuit that executes signal processing for the entire device. The input / output integrated device control / signal processing circuit transmits a control signal to the touch panel control / signal processing circuit and the display unit control / signal processing circuit to control the operation of the circuit.

  The display device combined with the touch panel is a video output device including character information and image information. The display device includes a display surface and a display unit control / signal processing circuit. The display surface includes a display area for outputting and displaying an image and a non-display area surrounding the display area. The display unit control / signal processing circuit processes information relating to the video to be output and displayed, and drives the display device based on the video information. The display device displays a predetermined image on the display surface based on the control signal of the display unit control / signal processing circuit.

  The main surface of the touch panel is disposed to face the upper side of the display device (display surface). The main surface input area (touch input area, active area) provided on the main surface of the touch panel is disposed relative to the display area of the display device (display surface). The inactive area provided on the main surface of the touch panel is disposed relative to the display area of the non-display surface of the display device. The user observes an image displayed on the display surface of the display device via the translucent main surface input area.

(Size of input / output integrated device)
As an example of an electronic device including an input / output integrated device, a mobile terminal having a telephone function can be given. The external dimensions of this terminal are 70 mm to 80 mm in width, 130 mm to 150 mm in length, and 8 mm to 100 mm in thickness. The shape of the display area of the display device (display surface) and the shape of the main surface input area of the touch panel corresponding to the display device (display surface) are rectangular. For example, the horizontal length is 60 mm to 70 mm, and the vertical length is 90 mm to 120 mm. The shape of the side input area is a rectangle. For example, on the side surface, the length in the thickness direction is 8 mm to 10 mm, and the length in the horizontal direction is 50 mm to 60 mm. On the vertical side, the length in the thickness direction is 8 mm to 10 mm, and the length in the vertical direction is 80 mm to 110 mm.

  The touch panel is used in combination with a display device. The touch panel includes a main surface input region and a side surface input region. There are multiple touch input areas. Most of the lead wires are formed on the side surfaces. Most of the main surface is a main surface input area. Therefore, the main surface input area has a large display surface. The touch panel is used for a display device having a large display surface. It is suitable for an input / output integrated device having a large display surface. The operability of these devices is excellent.

(Example of display device)
Examples of the display device combined with the touch panel include a liquid crystal display device, an organic LED display device, an inorganic LED display device, an electrochromic display, a plasma display device, and a field emission display device.

(Examples of electronic devices to which an input / output integrated device is applied)
The input / output integrated device includes, for example, general household appliances (washing machines, refrigerators, televisions, etc.), mobile phones, car navigation devices, portable navigation devices, portable media players, electronic book reader devices, tablet terminals, game machines, Used in industrial equipment such as electronic dictionaries, automatic teller machines, and various physics and chemistry equipment.

  The user uses the same output display screen as an input surface while referring to the output display screen of the input / output integrated device, and touches it with an indicator (an input instrument such as a touch pen or a finger). An arbitrary position on the output display screen is designated by the touch. Thereby, various operation conditions set in advance are selected on the output display screen. Alternatively, various operation conditions are numerically input on the output display screen. A target key is selected from a plurality of keys preset in the side surface input area corresponding to various operation conditions, and the operation conditions are instructed to various electronic devices.

  The touch panel has touch input areas formed on both the main surface and the side surface. Therefore, any one of the main surface input region and the side surface input region can be used for the instruction of the operation condition. This means that operability is high.

  Hereinafter, a touch panel, a touch panel manufacturing method, and an input / output integrated device will be described.

<Touch Panel Molding Body (A) Manufacturing Method of Touch Panel, Touch Panel, and Input / Output Integrated Device (I) Comprising Touch Panel and Display Device>
<Touch panel molding (A)>
The touch panel (touch panel molded body (A)) is manufactured through the following manufacturing process (see FIG. 1).

  FIG. 1 is a manufacturing process diagram of a touch panel molded body (A). Fig.1 (a) is a top view of the film obtained through the process in which an island-like electrode and extraction wiring are formed in a touchscreen film, and the process in which a design printing layer is formed. FIG.1 (b1) is a perspective view of the touch-panel film heating forming body (touch panel molding) ((alpha)) obtained through the process in which the film of Fig.1 (a) is heat-formed. FIG. 1B2 is a cross-sectional view taken along line XX in FIG. FIG.1 (c) is sectional drawing in the process of film insert molding and film-in-mold molding. FIG.1 (d) is XX sectional drawing in the hard-coat material main-curing process after the molded object is taken out from the metal mold | die. FIG.1 (e1) is a XX sectional view of a flexible printed circuit board (FPC) connection touch panel molding (A). FIG. 1E2 is a cross-sectional view taken along line YY.

  On the front and back surfaces of the touch panel film 40, island-shaped electrodes, interelectrode wiring, lead-out wiring, touch panel terminal portions 18 and through-holes 19 at the end of the lead-out wiring were formed in a predetermined pattern (see FIG. 1A). ). The inter-electrode wiring, the lead-out wiring, and the through hole are not shown in FIG. The through hole 19 was formed in the touch panel terminal portion 18 at the end of the lead wiring 32 in the y direction. A touch position is detected by the island electrodes.

  Reference numeral 20 denotes island-shaped electrodes arranged on the surface of the touch panel film 40 in the x direction. Reference numeral 30 denotes island-shaped electrodes arranged on the back surface of the touch panel film 40 in the y direction. Reference numerals 21 and 31 denote wirings (interelectrode wirings) for connecting the island-shaped electrodes. Reference numeral 21 denotes an inter-electrode wiring in the x direction formed on the surface of the touch panel film 40. 31 is an inter-electrode wiring in the y direction formed on the back surface of the touch panel film 40. The electrode rows 1, 2, 3, and 4 are constituted by the island-shaped electrodes and the inter-electrode wires. The electrode array 1 is formed on the surface of the center position of the touch panel film 40 ((xy) plane in FIG. 1 (b1)). The electrode array 2 is formed on the back surface of the center position of the touch panel film 40 ((xy) plane in FIG. 1 (b1)). The electrode array 3 is formed on the surface of the touch panel film 40 at the left position ((xz) plane in FIG. 1 (b1)) and the upper position ((yz) plane in FIG. 1 (b1)). Yes. The electrode array 4 is formed on the back surface of the touch panel film 40 at the left position ((xz) plane in FIG. 1 (b1)) and the upper position ((yz) plane in FIG. 1 (b1)). Yes. 22 and 32 are lead wires. Reference numeral 22 denotes an extraction wiring in the x direction formed on the surface of the touch panel film 40. Reference numeral 32 denotes a lead wire in the y direction formed on the back surface of the touch panel film 40. Reference numeral 10 denotes a main surface input area. Reference numerals 15a and 15b denote side surface input areas. Reference numeral 12 denotes a main surface (main surface region). Reference numeral 43 denotes a design printing layer. Reference numeral 18 denotes a touch panel terminal portion.

  The design print layer 43 was formed on the surface of the touch panel film 40. A touch panel film in which the island-shaped electrodes 20 and 30, the inter-electrode wirings 21 and 31, the lead-out wirings 22 and 32, and the design print layer 43 were formed was obtained. This touch panel film will be described with reference to FIGS.

  In the finally formed touch panel, the main surface input area 10 and the side surface input areas 15a and 15b are indicated by dotted lines (see FIG. 1A).

  For the touch panel film on which the island-shaped electrodes 20 and 30, the inter-electrode wirings 21 and 31, the extraction wirings 22 and 32, and the design printing layer 43 are formed, the touch panel terminal portion 18 (the touch panel at the end of the extraction wiring 32 in the y direction) A through hole 19 may be formed in the terminal portion 18). The design printed layer 43 may be formed after the through hole 19 is formed in the touch panel terminal portion 18 (the touch panel terminal portion 18 at the end of the lead wiring 32 in the y direction).

  The film obtained in FIG. 1 (a) was heated and formed. Thereby, the touch-panel film heating forming body ((alpha)) 50 (alpha) was obtained (refer FIG. 1 (b1) (b2)). A touch panel film (see FIG. 1A) on which a mesh-like conductor pattern and a design printing layer were formed was set in a mold before being softened by heating and cooled and solidified. The target box (case) was molded by vacuum pressure or compressed air. Thereafter, unnecessary portions were trimmed (finishing and punching). As a result, a box-shaped film intermediate product having a rectangular parallelepiped hollow portion 63 (a touch panel heating forming body (α) having a design print layer 43 on the outer surface of the hollow portion 63) was obtained (FIG. 1 ( b1) (see b2)). The heating forming body (α) 50α will be described (see FIG. 6 described later).

  In FIG. 1A and FIG. 1B, the island-shaped electrodes 20 and 30 are substantially transparent and are not visually recognized. However, in order to clarify the configuration, the island-shaped electrodes 20 and 30 formed on the front surface and the back surface are indicated by solid lines. The inter-electrode wirings 21 and 31 that connect the island electrodes are omitted. When viewed from the z direction, the gap between the island electrode 20 on the front surface and the island electrode 30 on the back surface is also omitted (FIGS. 2, 5, 6, 7, 8, and 11). (A), FIG.11 (b), FIG.13 (a), FIG.13 (b), FIG.15 (a), FIG.15 (b), FIG.15 (e), FIG.16, FIG.17 (b), figure 18, the same applies to FIGS. 24-28).

  A touch panel molded body (A) 50A was obtained by film insert molding and film in-mold molding (see FIGS. 1C and 1D).

  A touch panel heating forming body (α) and a peelable film 46 on which a temporary hardened layer 45a of a hard coat material was formed were used, and film insert molding and film in-mold molding were performed. As a result, a touch panel molded body (A) 50A was obtained.

  The inner surface of the hollow portion 63 of the touch panel heating forming body (α) 50α was set on the convex portion of the convex mold 91a. Between the outer surface of the touch panel heating forming body (α) 50α and the concave portion of the concave mold 91b, a peelable film 46 having a temporarily hardened layer 45a of a hard coat material formed on the surface was set. Thereafter, the convex mold 91a and the concave mold 91b were mold-matched (clamping and mold closing) (see FIG. 1C). The fluidized molded resin material (transparent resin 60) was injected and filled between the temporary hardened layer 45a of the hard coat material formed on the peelable film 46 and the outer surface of the touch panel heating forming body (α) 50α. At the same time, the temporarily cured layer 45a was transferred from the surface of the peelable film 46 to the surface of the molded resin material. After cooling and solidification, the mold was opened and the molded body was taken out.

  The temporary hardened layer 45a of the hard coat material of the molded body taken out from the mold was fully cured. The hard coat layer 45, the transparent resin case 62 made of a molded resin material, and the touch panel heating forming body (α) 50α were integrated. A touch panel molded body (A) 50A in which the design print layer 43 was sandwiched between the touch panel film 40 and the transparent resin case 62 was obtained (see FIG. 1D).

The details of the mold are not shown in FIG. However, the convex mold 91a and the concave mold 91b are formed with a draft angle in order to facilitate the mold removal from the mold of the molded body. In order to facilitate the flow of the molded resin material that has been heated and melted, and to reduce stress concentration, the corner portion is a curved surface. In the molded body, the radius of curvature (R) of the corner portion where the two surfaces of the transparent resin cured body having a thickness of t intersect is R ₁ = (1 / t) on the inner surface side of the corner portion, and the outer surface side of the corner portion R ₂ = (1.5 / t). For example, when t = 0.5 mm, R ₁ = 0.25 mm and R ₂ = 0.75 mm. The draft angle and the radius of curvature (R) of the corner are also formed in the convex molds 93a, 95a, 95b, 97a and the concave molds 93b, 95c, 97b.

  One FPC terminal portion of the flexible printed circuit board (FPC) 70 is connected to the touch panel terminal portion 18 exposed on the (zy) surface of the touch panel molded body (A) 50A (see FIG. 1E). The other FPC terminal portion of the flexible printed circuit board (FPC) 70 includes a display device 90, a touch panel control / signal processing circuit 100, a display unit control / signal processing circuit 110, an input / output integrated device control / signal processing circuit 120, and the like. It is connected to a mounting board terminal 72 of a mounting board 92 on which a circuit is mounted (see FIG. 9 described later).

  The structure in the vicinity of the touch panel terminal portion 18 to which the flexible printed circuit board (FPC) 70 is connected will be described later (see FIG. 10).

(Formation of mesh conductor pattern on touch panel film)
FIG. 2 is a plan view of the touch panel film (a) on which island-shaped electrodes and lead wires are formed.

  On the surface of the touch panel film 40, an electrode array of island electrodes 20 arranged in the x direction was formed. The island electrode 20 and the island electrode 20 were connected by an inter-electrode wiring 21 in the x direction. A plurality of rows (for example, 10 rows) of the electrode rows were formed in the y direction. The lead wiring 22 in the x direction was connected to the end position of the electrode row of the island-like electrode 20.

  On the back surface of the touch panel film 40, an electrode array of island electrodes 30 arranged in the y direction was formed. The island electrode 30 and the island electrode 30 were connected by an inter-electrode wiring 31 in the y direction. The electrode rows were formed in a plurality of rows (for example, 6 rows) in the x direction. A lead wire 32 in the y direction was connected to the end position of the electrode row of the island electrode 30.

  The island-shaped electrode 20 formed on the surface of the touch panel film 40 and the island-shaped electrode 30 formed on the back surface do not overlap each other when viewed from the z direction. That is, they are two-dimensionally arranged in a lattice form with an interval (see FIG. 2). The shape of the island-shaped electrodes 20 and 30 is a rhombus whose apex angle is 90 °.

  On the surface of the touch panel film 40, the touch panel terminal portion 18 to which the x-direction lead wiring 22 (and the y-direction lead wiring 32) is connected is formed. The lead wiring 32 in the y direction is connected to the touch panel terminal portion 18 through the through hole 19. The through hole 19 is an extraction wiring in the y direction from an arbitrary position of the touch panel terminal portion 18 (or the island electrode 30 at the end of the electrode array of the island electrodes 30 arranged in the y direction to the touch panel terminal portion 18. 32 arbitrary locations).

  On the back surface of the touch panel film 40, the touch panel terminal portion 18 to which the x-direction lead wire 22 (and the y-direction lead wire 32) is connected may be formed. The through hole 19 is at an arbitrary location (any location of the lead-out wiring 22 in the x direction from the end of the island-shaped electrode 20 of the island-shaped electrode 20 arranged in the x direction to the touch panel terminal portion 18). , May be formed. The lead wiring 22 in the x direction may be connected to the touch panel terminal portion 18 through the through hole 19.

  The resistance values of the island-like electrodes (detection electrodes) 20 and 30 and the lead-out wirings 22 and 32 are precisely adjusted, and the resistance values of the lead-out wirings 22 and 32 are adjusted as necessary to increase the position detection accuracy of the touch position. The resistance adjustment section for doing so may be provided at an arbitrary location (for example, an arbitrary location on the way until the lead-out wirings 22 and 32 formed on the side surface portion of the touch panel reach the touch panel terminal portion 18).

  The main surface input area 10 of the finally formed touch panel is almost the main surface portion 12 of the film 40. The island-shaped electrode 20 in the side surface input area 15 a of the touch panel is located above the film 40. The island-shaped electrode 30 in the side surface input region 15b of the touch panel is located on the left side of the film 40 (see FIG. 2).

  FIG. 3 is a partially enlarged plan view of a mesh conductor (island electrode, interelectrode wiring, lead-out wiring). 3A1 is an enlarged plan view of the inter-electrode wiring 31-island electrode 30-inter-electrode wiring 31-island electrode 30-inter-electrode wiring 31 in the y direction. FIG. 3A2 is an enlarged plan view of the interelectrode wiring 21-island electrode 20-interelectrode wiring 21-island electrode 20-interelectrode wiring 21 in the x direction. FIG. 3B1 is a partially enlarged plan view of the lead wiring 32 in the y direction. FIG. 3B2 is a partially enlarged plan view of the lead-out wiring 22 in the x direction.

  The island-shaped electrode 20 and the island-shaped electrode 20 are electrically connected by an interelectrode wiring 21. A lead-out wiring 22 is connected to the island-like electrode 20 at the end (end) in the x direction.

  The island-shaped electrode 30 and the island-shaped electrode 30 are electrically connected by an interelectrode wiring 31. A lead wire 32 is connected to the island-like electrode 30 at the end (end) in the y direction.

  The island-shaped electrodes 20 and 30 and the inter-electrode wirings 21 and 32 are composed of the mesh conductor. In the present embodiment, the lead-out wirings 22 and 32 are also composed of the mesh conductor. However, the lead-out wirings 22 and 32 do not have to have a mesh shape. So-called solid wiring may be used.

  The touch panel terminal 18 that is an extension of the lead-out wirings 22 and 32 may also have a mesh shape or may not have a mesh shape.

  The island-like electrode and the interelectrode wiring are preferably mesh-like from the viewpoint of light transmittance. In particular, a mesh having an aperture ratio of 90% or more is preferable. Thereby, it is difficult to visually recognize the thin line, and the visual field of the display screen is brightened.

  The island-shaped electrodes 20 and 30, the inter-electrode wirings 21 and 31, and the lead-out wirings 22 and 32 are preferably mesh conductors. The reason is that when the film is formed into a case (box shape), it is difficult for disconnection to occur in the mesh conductor. The heat-formed body (α) (β) is obtained by heat-forming a touch panel film on which island-like electrodes, interelectrode wirings, and lead-out wirings are formed. At this time, even if the mesh conductor (island electrode, inter-electrode wiring, lead-out wiring) is located at the corner (ridge line portion) of the heating forming body, the tensile force or compressive force generated during the heating forming is Even if it acts on the wire-like conductor, disconnection hardly occurs in the mesh-like conductor. In particular, when the mesh conductor is made of Au, Ag, Cu, Al or the like, disconnection is difficult to occur.

  Even when the lead wiring is a solid wiring, the lead wiring is preferably made of Au, Ag, Cu, Al or the like. The reason is that Au, Ag, Cu, Al, etc. are excellent in malleability and ductility. Therefore, disconnection is difficult to occur.

  For the mesh conductor, the above-described methods [for example, (1) a method by printing a conductive ink, (2) a method by etching a conductive thin film, (3) a metal vapor deposition method using a vapor deposition mask, (4) a silver salt was used. It can be formed by a method by a conductive silver forming method].

(Formation of design print layer on touch panel film)
FIG. 4 is a plan view of a design print layer formed on the touch panel film.

  The main surface input region 10 that occupies most of the region 12 that becomes the main surface ((xy) surface) of the touch panel is formed as a light-transmitting transparent opening region 44. This region is a portion where the design print layer 43 is not formed. A design printing layer is formed on the outer peripheral portion of the opening region 44 (see FIG. 4).

  For example, guide keys 7 for various operations and a transparent background are formed by printing on the portions (portions indicated by dotted lines) that become the side surface input regions 15a and 15b. A light-impermeable layer is printed as the design print layer 43 in the outer peripheral portion of the opening region 44 and the region that does not become the side surface input region (the region on the right side and the lower side in FIG. 4) (see FIG. 4). .

  The touch panel terminal portion opening 16 is an opening (see FIG. 4). The touch panel terminal 18 (see FIG. 5) is exposed from the opening 16. The design print layer is not provided in the opening 16 (see FIG. 4).

  FIG. 5 is a plan view of the touch panel film (a). In the touch panel film (a), island-shaped electrodes, lead-out wirings, and design print layers are formed. FIG. 5 is a diagram in which FIG. 4 is superimposed on FIG. Therefore, the description is omitted.

(Formation of touch panel film heating forming body (α))
FIG. 6 is a perspective view of the touch panel film heating forming body (α).

  The touch panel heating forming body (α) 50α includes a rectangular parallelepiped hollow portion 63 therein. The design printing layer is provided on the main surface and the side surface. The main surface input region (formed by the island electrodes 20 arranged in the x direction and the island electrodes 30 arranged in the y direction) 10 is formed on the main surface portion ((xy) surface) 12 of the touch panel heating forming body (α) 50α. Is formed. The design print layer 43 is formed in the outer peripheral area of the main surface input area 10. The side surface input regions 15a and 15b are formed on the side surface orthogonal to the main surface ((xy) surface). The design print layer 43 is formed in the outer peripheral area of the side surface input areas 15a and 15b. A touch panel terminal 18 and a touch panel terminal opening 16 are formed on the side surface. A through hole 19 is formed in the touch panel terminal opening 16 (see FIG. 6).

  FIG. 7 is an explanatory view of a touch panel film heating forming body (α), and FIG. 7 (a) is a rear view. FIG. 7B is a left side view. FIG. 7C is a plan view. FIG. 7D is a right side view. FIG. 7E is a front view.

  The touch panel heating forming body (α) 50α includes a main surface portion 12 ((xy) surface). A main surface input region 10 is formed in the main surface portion 12. The main surface input area 10 occupies most of the main surface portion 12. A side surface input region 15a is formed on the back surface (side surface). Side input area 15b is formed on the left side. The touch panel terminal 18 and the touch panel terminal opening 16 are formed on the front surface (side surface). A through hole 19 is formed in the touch panel terminal opening 16. A design print layer 43 that shields the lead-out wiring 22 in the x direction and the lead-out wiring 32 in the y direction is formed. On the right side, a design print layer 43 that shields the lead-out wiring 32 in the y direction is formed (see FIG. 7).

  FIG. 8 is a bottom view of the touch panel film heating forming body (α).

  A lead wire 22 in the x direction is connected to the terminal portion 18a. The lead wire 22 is connected to the island-like electrode 20 at the end (sixth row) of the electrode row arranged in the x direction. The lead wiring 22 is formed in front of the touch panel heating forming body (α) 50α. A lead wire 32 in the y direction is connected to the terminal portion 18b. The lead wiring 32 is connected to the island-like electrode 30 at the end (tenth row) of the electrode row arranged in the y direction. The lead wiring 32 is formed on the right side surface of the touch panel heating forming body (α) 50α (see FIG. 8).

<I / O integrated device (I)>
An input / output integrated device (I) (including a touch panel (touch panel molded body (A)) and a display device) will be described.

  FIG. 9 is an explanatory diagram of the input / output integrated device (I). FIG. 9A is a perspective view (a hard coat layer is not shown). FIG. 9B is a sectional view taken along line XX. FIG. 9C is a sectional view taken along line YY.

  The input / output integrated device (I) 50I includes an upper box 67 composed of a touch panel molded body (A) 50A and a lower box 69 fitted to the upper box 67. The upper box 67 and the lower box 69 form a closed space inside (see FIG. 9).

  The outermost hard coat layer 45 of the touch panel molded body (A) 50A is not shown (see FIG. 9A). The opening area 44 is a transparent area where the design print layer is not formed on the touch panel film 40. The opening area 44 corresponds to the main surface input area 10. The island electrodes 20 and 30 are not shown.

  The display device 90 mounted on one surface of the mounting board terminal 72 is housed in the internal space of the upper box 67 (see FIGS. 9B and 9C). The upper box 67 and the mounting board terminal 72 are joined. Circuits such as a touch panel control / signal processing circuit 100, a display unit control / signal processing circuit 110, and an input / output integrated device control / signal processing circuit 120 are mounted on the other surface of the mounting board terminal 72.

  One FPAC terminal (terminal of the flexible printed circuit board (FPC) 70) is connected to the touch panel terminal unit 18. The other FPAC terminal is connected to the mounting board terminal portion 72 of the mounting board 92. The mounting board terminal portion 72 and the touch panel terminal portion 18 are electrically connected via a flexible printed circuit board (FPC) 70.

  Signals are transmitted / received to / from the electrode arrays formed in the main surface input region and the side surface input region by a common external circuit 100, 110, 120 (the same applies to FIGS. 12, 14, and 22 described later). .

  One FPAC terminal and the touch panel terminal portion 18 are connected by, for example, an anisotropic conductive adhesive. The other FPAC terminal and the mounting board terminal portion 72 are connected by, for example, an anisotropic conductive adhesive.

  The one FPAC terminal and the touch panel terminal portion 18 and the other FPAC terminal and the mounting substrate terminal portion 72 are connected by an anisotropic conductive adhesive (see FIG. 9B). Details of the connection between one FPAC terminal and the touch panel terminal 18 are not shown (the same applies to FIGS. 12, 14, and 22).

As anisotropic conductive adhesives, commercially available anisotropic conductive films (ACF: Anisotropic Conductive Film) and anisotropic conductive pastes (ACP: Anisotropic)
conductive Paste). For example, an anisotropic conductive film is disposed between the mounting board terminal portion 72 and the other FPAC terminal. Alternatively, after the anisotropic conductive paste is applied to one of the mounting board terminal portion 72 and the other FPAC terminal, the anisotropic conductive adhesive is cured while applying pressure. The mounting board terminal portion 72 and the other FPAC terminal are electrically joined, and the mounting board 92 and the flexible printed circuit board (FPC) 70 are joined.

  FIG. 10 is an explanatory diagram of the touch panel terminal portion. FIG. 10A is an enlarged plane of the touch panel terminal portion. FIG. 10B is an enlarged sectional view taken along the line WW. FIG. 10B1 is a cross-sectional view when forming a through hole. FIG. 10B2 is a cross-sectional view after forming the protective layer. FIG. 10C is an explanatory diagram of the positional relationship between the touch panel terminal portion and the FPC terminal portion.

  A protective layer 34 is formed. The protective layer 34 covers the exposed portion that is not covered with the design print layer 43 and the isolated wiring 23 portion. The exposed portion is an exposed portion in the vicinity of the touch panel terminal portion 18. The exposed portion is a portion where the conductor filled in the through hole 19 is exposed to the outside. The lead-out wiring 73 and the touch panel terminal portion 75 are covered with a protective layer 34 (see FIG. 10). The same applies to the touch panel terminal portion 18 shown in FIGS. 11, 13, 15 to 18, and 24 to 28 described later.

  The touch panel terminal portion 18 is an extended portion of the lead wiring 32. Accordingly, the touch panel terminal portion 18 is illustrated as a cross section of the lead wiring 32. The isolated wiring 23 is formed on the surface on which the lead wiring 22 is formed. The isolated wiring 23 is not connected to the lead wiring 22. The isolated wiring 23 is connected to the lead-out wiring 32 via a conductor filled in the through hole 19 (see FIGS. 10B and 10C).

  After the island-like electrodes 20 and 30, the lead wires 22 and 32, and the touch panel terminal portion 18 are formed on the touch panel film 40, the through hole 19 is formed. The through hole 19 is used for electrical connection between the isolated wiring 23 and the extraction wiring 32 (see FIG. 10B1).

  The isolated wiring 23 may be a mesh-like conductor or a solid wiring, like the lead-out wirings 22 and 32 and the touch panel terminal portion 18.

  After the island-shaped electrodes 20 and 30, the inter-electrode wirings 21 and 31, the lead-out wirings 22 and 32, and the design printing layer 43 are formed on the touch panel film 40, the touch panel terminal portion 18 and the through hole 19 may be formed. The design print layer 43 may be formed after the touch panel terminal portion 18 and the through hole 19 are formed.

  When the carbon ink is supplied and filled into the through hole 19 from both sides of the touch panel film 40 and the design layer printing layer 43 is formed, the protective layer 34 is provided. The protective layer 34 completely covers the isolated wiring 23, the lead-out wiring 32, and the through hole 19 filled surface exposed carbon 33 that are not covered with the design layer printing layer 43. The protective layer is formed by printing with carbon ink (see FIG. 10B2).

  When the lead wires 22 and 32 and the touch panel terminal portion 18 are made of Ag, the carbon protective layer 34 completely covers the Ag portion. Therefore, oxidation and migration of Ag are prevented.

  When the design layer printed layer 43 is formed after the protective layer 34 is provided, the design layer printed layer 43 is provided so as to overlap the protective layer 34.

  FIG. 10C and FIG. 9B are related. FIG. 10C shows a positional relationship in connection between the touch panel terminal unit 18 and the FPAC terminal unit 78. The carbon protective layer 34 formed on the touch panel terminal portion 18 and the FPAC terminal 78 are electrically connected by an anisotropic conductive adhesive.

<Input / output integrated device (II) (equipped with touch panel and display device made of touch panel molded body (B))>
<Touch panel molding (B)>
The touch panel molded body (B) is manufactured through the following manufacturing process (see FIG. 11).

  FIG. 11 is an explanatory diagram of a manufacturing process of the touch panel molded body (B). Fig.11 (a) is a top view of the film obtained through the process in which an island-like electrode and extraction wiring are formed in a touchscreen film, and the process in which a design printing layer is formed. FIG.11 (b1) is a perspective view of the touch-panel film heating forming body ((alpha)) obtained through the process in which the film of Fig.11 (a) is heat-formed. FIG. 11B2 is a cross-sectional view taken along line XX of FIG. FIG.11 (c) is XX sectional drawing in a film insert molding process. FIG.11 (d1) is a XX sectional view of a flexible printed circuit board (FPC) connection touch panel molding (B). FIG. 11D2 is a cross-sectional view taken along line YY.

  The touch panel molded body (A) in FIG. 1 includes a hard coat layer 45. The touch panel molded body (B) in FIG. 11 does not include the hard coat layer 45.

  11 (a) and 11 (b) are the same as FIGS. 1 (a) and 1 (b). The present embodiment was performed in the same manner as in FIGS. 1 (a) and 1 (b). First, the mesh-like conductor patterns 20, 30 and 18 were formed on the touch panel film 40. Next, the design print layer 43 was formed. That is, a touch panel film in which the mesh-like conductor patterns 20, 30, 18 and the design print layer 43 were formed was produced. This touch panel film was heat-formed to obtain a touch panel heat-formed body (α) 50α.

  Film insert molding was performed on the touch panel heating forming body (α) 50α to obtain a touch panel molded body (B) (see FIG. 11C). That is, the inner surface of the hollow portion 63 of the touch panel heating forming body (α) 50α was set on the convex portion of the convex mold 93a. The convex mold 93a and the concave mold 93b were mold matched (clamping and mold closing). The fluidized molding resin material (transparent resin 60) was injected and filled between the concave portion of the concave mold 93b and the outer surface of the touch panel heating forming body (α) 50α. After cooling and solidification, the mold was opened. The molded body (B) 50b was taken out from the mold.

  The touch panel molded body (B) 50b is obtained by integrating a transparent resin case 62 and a touch panel heating forming body (α) 50α. The design print layer 43 is sandwiched between the touch panel film 40 and the transparent resin case 62. The design print layer 43 is completely sealed.

  FIG. 11D is a diagram in which the touch panel molded body (A) 50A is replaced with a touch panel molded body (B) 50B (see FIG. 1E). Therefore, details are omitted.

<Input / output integrated device (II)>
An input / output integrated device (II) (comprising a touch panel having a touch panel molded body (B) and a display device) will be described.

  FIG. 12 is an explanatory diagram of the input / output integrated device (II). FIG. 12A is a cross-sectional view taken along the line XX (position similar to the position of the XX line). FIG. 12B is a cross-sectional view taken along line YY (position similar to the position of the YY line).

  The input / output integrated device (II) 50II of FIG. 12 is the same as the input / output integrated device (I) 50I of FIG. FIG. 12 is a diagram in which the touch panel molded body (A) 50A is replaced with a touch panel molded body (B) 50B (see FIG. 1). Therefore, details are omitted.

<Input / output integrated device (III) (comprising a touch panel comprising a touch panel molded body (C) and a display device)>
<Touch panel molding (C)>
The touch panel molded body (C) is manufactured through the following manufacturing process (see FIG. 13).

  FIG. 13 is an explanatory diagram of a manufacturing process of the touch panel molded body (C). Fig.13 (a) is a top view of the film obtained through the process in which an island-like electrode and extraction wiring are formed in a touchscreen film, and the process in which a design printing layer is formed. FIG. 13 (b1) is a perspective view of a touch panel film heating forming body (α) obtained through a process in which the film of FIG. 13 (a) is heated and formed. FIG. 13B2 is a cross-sectional view taken along line XX in FIG. FIG.13 (c) is XX sectional drawing in a film insert molding process. FIGS. 13 (d1) and 13 (d2) are cross-sectional views in the reinforcing material molding step. FIG. 13E1 is a cross-sectional view taken along the line XX of the flexible printed circuit board (FPC) connection touch panel molded body (B). FIG. 13E2 is a cross-sectional view taken along the line YY of the flexible printed circuit board (FPC) connection touch panel molded body (B).

The touch panel molded body (C) 50 </ b> C includes a reinforcing frame 96. However, the touch panel molded body (B) 50 </ b> B does not include the reinforcing frame 96.

  13 (a) and 13 (b) are the same as FIGS. 1 (a) and 1 (b). The touch panel molded body (C) 50C is obtained in the same manner as the touch panel molded body (B) 50B. First, the mesh-like conductor patterns 20, 30, and 18 were formed on the touch panel film 40. Next, the design print layer 43 was formed. A touch panel film on which the mesh-like conductor patterns 20, 30, 18 and the design print layer 43 were formed was obtained. The film was heat formed. Thereby, the touch panel heating forming body (α) 50α was obtained.

  Film insert molding (primary molding) was performed using the touch panel heating and forming body (α) 50α. Thereafter, reinforcement material molding (secondary molding) was performed. A touch panel molded body (C) 50C was obtained by the two-stage molding. In the two-stage molding (primary molding and secondary molding), the concave mold 95c is used as a common mold.

First, the inner surface of the hollow portion 63 of the touch panel heating forming body (α) 50α was set on the convex portion of the convex mold 95a (see FIG. 13C). The outer surface of the hollow portion 63 of the touch panel heating forming body (α) 50α was set in the concave portion of the concave mold 95c. Mold matching between the convex mold 95a and the concave mold 95c was performed.
The fluidized molding resin material (transparent resin 60) was injected and filled between the concave portion of the concave mold 95c and the outer surface of the touch panel heating forming body (α) 50α. A primary molded body was obtained by cooling and solidification (primary molding).

  Next, mold opening was performed. With the primary molded body left in the concave mold 95c, the convex mold 95a was changed to the convex mold 95b. Secondary molding was performed. By this secondary molding, a reinforcing frame 96 was formed on the inner surface of the hollow portion 63 of the transparent resin 60 that was cooled and solidified by the primary molding (see FIG. 13D).

  In the secondary molding, the convex mold 95b was set inside the hollow portion 63 of the transparent resin 60 that was cooled and solidified by the primary molding. Mold matching between the concave mold 95c and the convex mold 95b was performed. The fluidized molding resin material was injected and filled between the side surface of the convex portion of the convex mold 95b and the inner side surface of the touch panel heating forming body (α) 50α. A secondary molded body was obtained by cooling and solidification (secondary molding).

  Alternatively, a reinforcing frame 96 in a temporarily cured state (for example, a B-stage thermosetting resin) is set in the hollow portion 63 of the transparent resin 60 that is cooled and solidified by the primary molding. The convex portion of the convex mold 95 b was set in the frame of the reinforcing frame 96. The temporarily cured reinforcing frame 96 is sandwiched between the transparent resin 60 cooled and solidified by primary molding and the convex portion of the convex mold 95b. The temporary curing reinforcing frame 96 was fully cured by heating. Also by this, a secondary molded body was obtained.

  Alternatively, the temporarily cured reinforcing frame 96 is set on the outer surface of the convex portion of the convex mold 95b by secondary molding. The convex part of the convex mold 95b was set inside the hollow part 63 of the transparent resin 60 that was cooled and solidified by primary molding. A temporarily cured reinforcing frame 96 is sandwiched between the transparent resin 60 and the convex portion of the convex mold 95b. In this state, the temporarily cured reinforcing frame 96 was heated and fully cured. Also by this, a secondary molded body was obtained.

  The molding resin material in the secondary molding is different from the molding resin material (transparent resin 60) in the primary molding. For example, a molding resin material filled with inorganic particles to increase the strength. The molding resin material need not be transparent. For example, it is a thermosetting resin (for example, epoxy resin, unsaturated polyester resin, phenol resin, urea resin, polyurethane resin, silicone resin, etc.) filled with inorganic particles.

  In this way, a touch panel molded body (C) 50c was obtained. The touch panel molded body (C) 50c includes a reinforcing frame 96, a transparent resin case 62, and a touch panel heating forming body (α). The three are integrated. The design print layer 43 is sandwiched between the touch panel film 40 and the transparent resin case 62. The design print layer 43 is completely sealed.

  The touch panel molded body (A) 50A and the touch panel molded body (C) 50C are the same (see FIGS. 13 (e) and 1 (e)). Therefore, the description is omitted.

<I / O integrated device (III)>
An input / output integrated device (III) (comprising a touch panel having a touch panel molded body (C) and a display device) will be described.

  FIG. 14 is an explanatory view of the input / output integrated device (III). FIG. 14A is a cross-sectional view taken along the line XX (position similar to the position of the XX line). FIG. 14B is a cross-sectional view taken along the line YY (the same position as the YY line).

  The input / output integrated device (III) 50III in FIG. 14 is the same as the input / output integrated device (I) 50I in FIG. FIG. 14 is a diagram in which the touch panel molded body (A) 50A is replaced with a touch panel molded body (C) 50C (see FIG. 1). Therefore, the description is omitted.

<Input / output integrated device (IV) (comprising a touch panel comprising a touch panel molded body (D) and a display device)>
<Touch panel molding (D)>
The touch panel molded body (D) is manufactured through the following manufacturing process (see FIG. 15).

  FIG. 15 is an explanatory diagram of a manufacturing process of the touch panel molded body (D). Fig.15 (a) is a top view of the film obtained through the process in which an island-like electrode and extraction wiring are formed in a touch panel film. FIG.15 (b) is a perspective view of the touch-panel film heating forming body ((beta)) by which the film of Fig.15 (a) was heat-formed. FIG.15 (c) is a top view of the design film in which the design printing layer was formed. FIG.15 (d) is a perspective view of the design film heating forming body by which the design film of FIG.15 (c) was heat-formed. FIG. 15 (e1) is a cross-sectional view in the film insert molding process. FIG. 15 (e2) is a perspective view of the touch panel molded body (D). FIG. 15E3 is a cross-sectional view taken along the line XX. FIG. 15F1 is a sectional view taken along line XX of the flexible printed circuit board (FPC) connection touch panel molded body (D). FIG. 15F2 is a cross-sectional view taken along line YY of the flexible printed circuit board (FPC) connection touch panel molded body (D).

  A mesh-like conductor pattern similar to that shown in FIG. 1A was formed on the touch panel film 40 (see FIG. 15A). The touch panel film 40 on which the mesh-like conductor pattern was formed was set in a mold before heat softening and cooling solidification. It was molded into a case (box) shape by vacuum pressure or compressed air. Thereafter, unnecessary portions were trimmed (finishing and punching). Thereby, the touch panel heating forming body (β) 50β was obtained (see FIG. 15B). The touch panel heating forming body (β) 50β has a rectangular parallelepiped hollow portion.

  A design printing layer 43 similar to that shown in FIG. 1A was formed on the design film 42 (see FIG. 15C). The design film 42 on which the design print layer 43 was formed was set in a mold before being softened by heating and solidified by cooling. It was molded into a case (box) shape by vacuum pressure or compressed air. Thereafter, unnecessary portions were trimmed (finishing and punching). Thereby, a design film heating and forming body (γ) 50γ was obtained (see FIG. 15D). The design film heating forming body (γ) 50γ has a rectangular parallelepiped hollow portion inside.

  The touch panel heating forming body (β) 50β and the design film heating forming body (γ) 50γ were used, and a touch panel molding (D) 50D was obtained by double film insert molding (see FIG. 15E). The touch panel molded body (D) 50D includes a hollow portion 63 therein.

  The inner surface of the hollow portion of the touch panel heating forming body (β) 50β was set on the convex portion of the convex mold 97a. The outer surface of the hollow portion of the heating forming body (γ) 50γ was set in the concave portion of the concave mold 97b. Mold matching between the convex mold 97a and the concave mold 97b was performed. The fluidized molding resin material (transparent resin 60) was injected and filled between the outer surface of the touch panel heating forming body (β) 50β and the inner surface of the design film heating forming body (γ) 50γ. After cooling and solidification, mold opening was performed. A touch panel molded body (D) 50D was obtained (see FIG. 15E). The touch panel molded body (D) 50D includes a hollow portion 63 therein.

  The touch panel molded body (D) 50D is an integrated product of the transparent resin case 62, the touch panel heating forming body (β) 50β, and the design film heating forming body (γ) 50γ. The design printing layer is sandwiched between the design film and the transparent resin case 62. The design printing layer is completely sealed.

  The touch panel molded body (A) 50A and the touch panel molded body (D) 50D are the same (see FIG. 15 (f) and FIG. 1 (e)). Therefore, the description is omitted.

  FIG. 16 is a perspective view of the touch panel film heating forming body (β). FIG. 17 is an explanatory diagram of a touch panel film heating forming body (β). FIG. 17A is a rear view. FIG. 17B is a left side view. FIG. 17C is a plan view. FIG. 17D is a right side view. FIG. 17E is a front view. FIG. 18 is a bottom view of the touch panel film heating forming body (β).

  The touch panel film heating formed body (α) 50α of FIG. The touch panel film heating forming body (β) 50β of the present embodiment is an example in which the design print layer 43 is not provided. That is, the touch panel film heating forming body (β) 50β of the present embodiment does not include a design printing layer. Therefore, the description is omitted.

  FIG. 19 is a plan view of the design film.

  The design print layer 43 (see FIG. 19) formed on the design film 42 of the present embodiment is the same as the design print layer 43 formed on the touch panel film 40 of FIG. The design print layer is not formed in the main surface input region 10 (most region of the region 12 serving as the main surface of the touch panel). The said area | region is the transparent opening area | region 44 which has a light transmittance. A design printing layer was formed on the outer peripheral portion of the opening region 44.

  For example, guide keys for various operations and a transparent background are formed by the design printing layer 43 in the portions (portions indicated by dotted lines) that become the side surface input regions 15a and 15b. A light-impermeable layer (design print layer 43) was printed on the outer peripheral portion of the opening region 44 and the region that does not become the side surface input region (the region on the right side and the lower side in FIG. 19) (see FIG. 19). ). The touch panel terminal opening 16 is an opening in which the design print layer from which the touch panel terminal 18 is exposed is not formed.

  FIG. 20 is a perspective view of a design film heating and forming body.

  The design film heating and forming body (γ) 50γ includes a rectangular parallelepiped hollow portion therein. An opening region 44 is formed on the main surface of the design film 42. The opening area 44 is a transparent area having light transmittance where the design printing layer 43 is not formed. A light-impermeable design print layer 43 is formed on the outer periphery of the opening region 44. Side surface input regions 15a and 15b are formed on the side surfaces. The outer peripheries of the side surface input areas 15 a and 15 b are surrounded by the design print layer 43. A touch panel terminal portion opening 16 is provided.

  FIG. 21 is an explanatory diagram of a design film heating and forming body. FIG. 21A is a rear view. FIG. 21B is a left side view. FIG. 21C is a plan view. FIG. 21D is a right side view. FIG. 21E is a front view.

  The main surface input region 10 is provided as an opening region 44 in the main surface portion ((xy) surface) 12 of the design film heating forming body (γ) 50γ. The main surface input area 10 occupies most of the main surface portion ((xy) surface) 12. The side surface input region 15a is provided on the back surface (side surface) of the design film heating forming body (γ) 50γ. The side surface input region 15b is provided on the left side surface of the design film heating forming body (γ) 50γ. The touch panel terminal portion opening 16 and the design printing layer 43 are provided on the front surface (side surface) of the design film heating forming body (γ) 50γ. A touch panel terminal portion 18 and a through hole 19 are provided in the touch panel terminal portion opening 16. The design print layer 43 shields the lead wiring 22 and the lead wiring 32. A design print layer 43 that shields the lead wiring 32 is provided on the right side surface of the design film heating forming body (γ) 50γ (see FIG. 21).

  The bottom view of the design film heating forming body (γ) 50γ is the bottom view of the touch panel film heating forming body (α) of FIG. 8 (however, the touch panel film 40 is replaced by the design film 42. The island-shaped electrodes 20, 30 and the drawers The wirings 22 and 32, the through hole 19, and the touch panel terminal portion 18 (18a and 18b) are removed). Therefore, the description is omitted.

<Input / output integrated device (IV)>
An input / output integrated device (IV) (comprising a touch panel having a touch panel molded body (D) and a display device) will be described.

  FIG. 22 is an explanatory diagram of the input / output integrated device (IV). FIG. 22A is a cross-sectional view taken along the line XX (position similar to the position of the XX line). FIG. 22B is a cross-sectional view taken along the line YY (the same position as the YY line).

  The input / output integrated device (IV) 50IV of this embodiment is the same as the input / output integrated device (I) 50I of FIG. FIG. 22 is the same as FIG. 1 (however, touch panel molded body (A) 50A is replaced with touch panel molded body (D) 50D). Therefore, the description is omitted.

<Manufacturing process of touch panel molded bodies (A) to (D)>
FIG. 23 is an explanatory diagram of a manufacturing process of a touch panel molded body. The manufacturing process of the touch panel molded bodies (A) to (D) will be described in comparison.

  The manufacturing process of the touch panel molded body of FIGS. 1 to 8, 11, 13, and 15 to 21 is shown in comparison with FIG. First, island-shaped electrodes 20 and 30, interelectrode wires 21 and 31, and lead wires 22 and 32 were formed on the touch panel film 40. Next, the design print layer 43 was formed. Then, the touch-panel film heating forming body ((alpha)) 50 (alpha) was produced by heating forming. This touch panel heating forming body (α) 50α was used, and a touch panel molded body (A) 50A was obtained by film insert molding and film in-mold molding. The touch panel heating formed body (α) 50α was used, and a touch panel molded body (B) 50B was obtained by film insert molding. The touch panel heating forming body (α) 50α was used, and a touch panel molded body (C) 50C was obtained by film insert molding and reinforcement molding.

  On the touch panel film 40, island-shaped electrodes 20 and 30, inter-electrode wirings 21 and 31, and lead-out wirings 22 and 32 were formed. Thereafter, a touch panel film heating formed body (β) 50β was produced by heating forming. A design print layer 43 was formed on the design film 42. Thereafter, a design film heat-formed body (γ) 50γ was produced by heat forming. The touch panel film heating forming body (β) 50β and the design film heating forming body (γ) 50γ were used, and a touch panel molding (D) 50D was produced by film insert molding.

  The input / output integrated device (I) 50I includes a touch panel molded body (A) 50A. The input / output integrated device (II) 50II includes a touch panel molded body (B) 50B. The input / output integrated device (III) 50III includes a touch panel molded body (C) 50C. The input / output integrated device (IV) 50IV includes a touch panel molded body (D) 50D.

<Modified example of manufacturing process of touch panel molded body>
A modification of the manufacturing process of the touch panel molded body will be described.
The following process is mentioned as a modification of the touch panel molded body manufacturing process. The film insert process of the touch panel molded body (B) (C) (D) manufacturing process was replaced with a film insert molding process and a film in-mold molding process (similar to the manufacturing process of the touch panel molded body (A)). Thereby, a touch panel molded body (B ′) (C ′) (D ′) was obtained. The touch panel molded bodies (B ′) (C ′) (D ′) are obtained by providing a hard coat layer 45 on the outermost layer of the touch panel molded bodies (B), (C), and (D).

  A film-in-mold molding process was applied to the touch panel molded bodies (B), (C), and (D). As a result, a touch panel molded body (B ′) (C ′) (D ′) in which the hard coat layer 45 was provided on the outermost layer of the touch panel molded bodies (B), (C), and (D) was obtained.

In the manufacturing process of the touch panel molded bodies (A) to (D), the heating temperature of the resin film during the formation of the touch panel heating forming body (α), the touch panel heating forming body (β), and the design film heating forming body (γ) is preferably Is the softening temperature of the resin. The softening temperature is preferably 300 ° C. or lower. Such resins include, for example, PET (melting point: 258 ° C.), PEN (melting point: 269 ° C.), PE (melting point: 135 ° C.), PP (melting point: 163 ° C.), polystyrene (melting point: 230 ° C.), polyvinyl chloride. (Melting point: 180 ° C.), polyvinylidene chloride (melting point: 212 ° C.), TAC (melting point: 290 ° C.) and the like.
In the manufacturing process of the touch panel molded bodies (A) to (D), the heating temperature for fluidizing the molded resin material (injection temperature of the molded resin material) is the melting temperature of the resin. For example, the temperature is about 240 ° C. for acrylic resins, about 280 ° C. for polyester resins, about 200 ° C. for polyamide resins, and about 270 ° C. for resins such as ABS, polystyrene, and polycarbonate.

<Modified example of pattern of island electrode and lead wiring formed on touch panel film>
In the touch panel film (a) (see FIG. 2) in which the mesh conductor (island electrodes 20 and 30, inter-electrode wirings 21 and 31, lead wirings 22 and 32, touch panel terminal portion 18) pattern is formed on the touch panel film 40, The lead wiring 32 is formed on the right side of the main surface portion 12 (in the touch panel molded body, one side surface ((xz) surface) perpendicular to the y direction corresponds). The lead wires 22 and 32 and the touch panel terminal portion 18 are formed below the main surface portion 12 (in the touch panel molded body, one side surface ((yz) surface) perpendicular to the x direction corresponds).

  In the touch panel film (a) (see FIG. 2), the touch panel film (b) (see FIG. 24), and the touch panel film (c) (see FIG. 25), mesh-like conductor patterns such as island-shaped electrodes 20 and 30 are formed. The left side of the main surface portion 12 (in the touch panel molding, the other side surface ((xz) surface) perpendicular to the y direction corresponds) and the upper side of the main surface portion 12 (in the touch panel molding body, the other side perpendicular to the x direction) The side surface (the (yz) surface) corresponds).

  In the touch panel molded bodies (A) to (D) in which the touch panel film (a) is used, the touch panel terminal portion 18 to which the lead wiring 22 and the lead wiring 32 are connected has one side surface ((yz)) perpendicular to the x direction. Surface).

  The lead-out wiring 22 passes through the intersection angle part (ridge line part) of the two surfaces of the main surface ((xy) surface) and one side surface ((xz) surface). The lead-out wiring 22 and the lead-out wiring 32 pass through two intersecting corners (ridge lines) of the main surface ((xy) plane) and one side surface ((yz) plane). The lead-out wiring 32 passes through two intersecting corners (ridge lines) between one side ((yz) plane) and one side ((xz) plane).

  The touch panel film in which the mesh conductor pattern such as the island-shaped electrodes 20 and 30 is formed on the touch panel film 40 is not limited to the touch panel film (a) in FIG. Some examples are shown in FIGS. Even with these mesh-like conductor patterns, a touch panel molded body is produced in the same manner as the touch panel molded bodies (A) to (D).

  FIG. 24 is a plan view of the touch panel film (b) on which island-shaped electrodes and lead wires are formed.

  In the touch panel film (b) in which the mesh-like conductor pattern is formed on the touch panel film 40, the lead-out wiring 32, the touch panel terminal portion 18 and the through hole 19 are on the right side of the main surface portion 12 (one perpendicular to the y direction of the touch panel molded body). (Corresponding to (xz) plane)). The lead-out wiring 22 and the touch panel terminal portion 18 are formed below the main surface portion 12 (corresponding to one side surface ((yz) surface) perpendicular to the x direction of the touch panel molded body). A mesh-like conductor pattern such as island-shaped electrodes 20 and 30 is formed above the main surface portion 12 (corresponding to one side surface ((yz) surface) perpendicular to the x direction of the touch panel molded body) (FIG. 24). reference). The electrode array 1 is formed at the center position (the (xy) plane) of the surface of the film. The electrode array 2 is formed at the center position (the (xy) plane) on the back surface of the film. The electrode array 3 is formed at the left position (the (xz) plane) and the upper position (the (yz) plane) of the surface of the film. The electrode row 4 is formed at the left position (the (xz) plane) and the upper position (the (yz) plane) of the back surface of the film.

  In the touch panel molded bodies (A) to (D) in which the touch panel film (b) is used, the touch panel terminal portion 18 to which the lead wiring 22 is connected is formed on one side surface ((yz) surface). The touch panel terminal portion 18 to which the lead wiring 32 is connected is formed on one side surface ((xz) surface).

  The lead-out wiring 22 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((yz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((xz) surface).

  FIG. 25 is a plan view of the touch panel film (c) on which island-shaped electrodes and lead-out wirings are formed.

  In the touch panel film (c) in which the mesh conductor pattern is formed on the touch panel film 40, the lead-out wiring 32 is on the right side of the main surface portion 12 (one side surface ((xz) surface) perpendicular to the y direction of the touch panel molded body). Applicable) and below the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead-out wiring 22 and the touch panel terminal portion 18 are formed below the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead wires 22 and 32 are connected to the touch panel terminal portion 18 (see FIG. 25).

  In the touch panel film (c), a mesh-like conductor pattern such as the island-shaped electrodes 20 and 30 is formed above the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The positions where the electrode rows 1, 2, 3, 4 in FIG. 25 are formed are almost the same as the positions where the electrode rows 1, 2, 3, 4 are formed in FIG.

  The lead-out wiring 22 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((yz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((xz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the side surface and the side surface.

  FIG. 26 is a plan view of the touch panel film (d) on which island-shaped electrodes and lead wires are formed.

  In the touch panel film (d) in which the mesh conductor pattern is formed on the touch panel film 40, the lead-out wiring 32 is on the right side of the main surface portion 12 (corresponding to one side surface ((xz) surface) of the touch panel molded body) and the main surface portion. 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead-out wiring 22 and the touch panel terminal portion 18 are formed below the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead wires 22 and 32 are connected to the touch panel terminal portion 18 (see FIG. 26).

  In the touch panel film (d), a mesh-like conductor pattern such as island electrodes 20 and 30 is formed above the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). Except for the point that the electrode rows are not formed on the (xz) plane, the positions where the electrode rows 1, 2, 3, 4 in FIG. 26 are formed, and the positions where the electrode rows 1, 2, 3, 4 are formed in FIG. Are almost the same.

  FIG. 27 is a plan view of the touch panel film (e) on which island-shaped electrodes and lead wires are formed.

  In the touch panel film (e) in which the mesh conductor pattern is formed on the touch panel film 40, the lead-out wiring 32 is on the right side of the main surface portion 12 (corresponding to one side surface ((xz) surface) of the touch panel molded body) and the main surface portion. 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead-out wiring 22 and the touch panel terminal portion 18 are formed below the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead wires 22 and 32 are connected to the touch panel terminal portion 18 (see FIG. 27).

  In the touch panel film (e), a mesh-like conductor pattern such as island-shaped electrodes 20 and 30 is formed on the left side of the main surface portion 12 (corresponding to one side surface ((xz) surface) of the touch panel molded body). . Except for the point that the electrode rows are not formed on the (yz) plane, the formation locations of the electrode rows 1, 2, 3, 4 in FIG. 27 and the formation locations of the electrode rows 1, 2, 3, 4 in FIG. Are almost the same.

  The lead-out wiring 22 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((yz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((xz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the side surface and the side surface.

  FIG. 28 is a plan view of the touch panel film (f) on which island-shaped electrodes and lead wires are formed.

  In the touch panel film (f) in which the mesh conductor pattern is formed on the touch panel film 40, the lead-out wiring 32 is on the right side of the main surface portion 12 (corresponding to one side surface ((xz) surface) of the touch panel molded body) and the main surface portion. 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead-out wiring 22 and the touch panel terminal portion 18 are formed below the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). The lead wires 22 and 32 are connected to the touch panel terminal portion 18 (see FIG. 28).

  In the touch panel film (f), the mesh-like conductor pattern such as the island-shaped electrodes 20 and 30 is on the left side of the main surface portion 12 (corresponding to one side surface ((xz) surface) of the touch panel molded body), on the right side of the main surface portion 12. (Corresponding to the other side surface ((xz) surface) of the touch panel molded body) and above the main surface portion 12 (corresponding to one side surface ((yz) surface) of the touch panel molded body). Except for the point that the electrode rows are also formed on the right (xz) plane, the formation locations of the electrode rows 1, 2, 3, 4 in FIG. 28 and the electrode rows 1, 2, 3, 4 in FIG. The formation location is almost the same.

  The lead-out wiring 22 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((yz) surface). The lead-out wiring 32 passes through an intersection corner (ridge line portion) between the main surface ((xy) surface) and one side surface ((xz) surface). The lead-out wirings 22 and 32 pass through an intersection corner (ridge line portion) between the side surface and the side surface.

  A mesh-like conductor pattern (island electrodes 20, 30 and inter-electrode wirings 21, 31) is formed on one of the side surfaces perpendicular to the x direction and one of the side surfaces perpendicular to the y direction of the touch panel molded body. Yes. Thereby, a side surface input region is formed. Lead wires 22 and 32 are formed on the side surface of the region that is not the side surface input region (see FIGS. 2, 24, and 25).

  On one of the side surfaces perpendicular to the x direction (or y direction) of the touch panel molded body, a mesh-like conductor pattern (island electrodes 20, 30 and inter-electrode wirings 21, 31) is formed. Thereby, a side surface input region is formed. Lead-out wirings 22 and 32 are formed on the side surface of the region that does not become the side surface input region (see FIGS. 26 and 27).

  A mesh-like conductor pattern (island electrodes 20, 30 and inter-electrode wirings 21, 31) is formed on one side surface perpendicular to the x direction and two side surfaces perpendicular to the y direction of the touch panel molded body. Yes. Thereby, a side surface input region is formed. Lead-out wirings 22 and 32 are formed on the side surface of the region that does not become the side surface input region (see FIG. 28).

  The touch panel film shown in FIGS. 2 and 24 to 28 is formed into a predetermined shape. Thereby, a touch panel molded body is obtained. Since the net-like conductor pattern (island electrodes 20, 30 and inter-electrode wirings 21, 31) is formed at the center of the touch panel finem, a main surface input region is formed. Since the mesh-like conductor pattern is formed on the periphery of the touch panel film, the side surface input area is formed. The touch panel molded body is a side surface perpendicular to the main surface of the touch panel molded body (e.g., (a) a side surface serving as a side surface input region, (b) a side surface on which the lead wires 22 and 32 are formed, and (c) a side surface input region. And (d) at least one of the side surfaces where the lead-out wirings 22 and 32 are not formed). Accordingly, the lead wires 22 and 32 do not have to be formed on the main surface of the touch panel molded body. This means that most areas of the main surface portion 12 of the touch panel can be main surface input areas. The frame area is as small as possible. The main surface input area becomes larger accordingly.

  In the above, the shapes and dimensions of the island-shaped electrode, the main surface input region, the side surface input region, the touch panel molded body, and the like are merely examples. The present invention is not limited to the above embodiment. Various improvements, modifications and variations based on the technical idea of the present invention are possible.

  According to the present invention, a touch panel in which an input area exists on the main surface and side surfaces is obtained. An input / output integrated device including the touch panel and a display device was obtained. This device has good operability.

DESCRIPTION OF SYMBOLS 1 1st electrode row | line | column 2 2nd electrode row | line | column 3 3rd electrode row | line | column 4 4th electrode row | line 10 Main surface input area 12 Main surface part 15a, 15b Side surface input area 16 Touch panel terminal part opening part 18 Touch panel terminal part 18a x Terminal portion 18b to which island electrodes arranged in the direction are connected Terminal portion 19 to which island electrodes arranged in the y direction are connected 19 Through hole 20 Island electrodes 21 arranged in the x direction Inter-electrode wiring 22 in the x direction x direction Lead wire 23 Isolated wire 30 on the formation surface of the lead wire in the x direction Island-like electrode 31 arranged in the y direction Wire between the electrodes 32 in the y direction Lead wire 33 in the y direction Carbon 34 Protective layer 40 Touch panel film 42 Design film 43 Design Print layer 44 Opening region 45 Hard coat layer 45a Temporarily cured layer 46 of hard coat material Peelable film 50α Touch panel film heating forming body (Α)
50β Touch panel film heating forming body (β)
50γ Designed film heating forming body (γ)
50A Touch Panel Molded Body (A)
50B Touch Panel Molded Body (B)
50C Touch Panel Molded Body (C)
50D Touch panel molding (D)
50I Input / output integrated device (I)
50II Integrated input / output device (II)
50III Input / output integrated device (III)
50IV Integrated input / output device (IV)
60 Transparent resin 62 Transparent resin case 63 Hollow portion 67 Upper box 69 Lower box 70 Flexible printed circuit board (FPC)
72 Mounting board terminal 73 Lead-out wiring 74 covered with protective layer Anisotropic conductive film (AFC)
75 Touch panel terminal portion covered with protective layer 76 Insulating layer 77 Wiring conductor layer 78 FPC terminal portion 79 Position of through hole 90 Display devices 91a, 93a, 95a, 95b, 97a Convex molds 91b, 93b, 95c, 97b Concave shape Mold 92 Mounting board 96 Reinforcement frame 100 Touch panel control / signal processing circuit 110 Display unit control / signal processing circuit 120 Input / output integrated device control / signal processing times

Claims (29)

It has a case body made of an electrically insulating transparent resin film,
The case body includes a main surface portion, a side surface portion, and a hollow portion,
The hollow portion exists in a region formed by the main surface portion and the side surface portion,
The side portion is
Connected to the main surface,
Substantially orthogonal to the main surface portion,
There are four or more side portions that are substantially orthogonal,
At least two of the side surface portions are substantially orthogonal to the first direction of the main surface portion,
At least two of the side surface portions are substantially orthogonal to the second direction of the main surface portion,
The main surface portion includes a main surface input area,
At least one of the four or more side surfaces includes a side surface input region,
The main surface portion is provided with two or more first electrode rows and two or more second electrode rows,
The two or more first electrode rows are:
Provided at predetermined intervals,
Provided along the first direction;
The two or more second electrode rows are:
Provided at predetermined intervals,
Provided along the second direction;
Each of the first electrode row and the second electrode row is composed of two or more island-shaped electrodes and an inter-electrode wiring in which the island-shaped electrodes are electrically connected,
One or two or more third electrode rows and one or two or more fourth electrode rows are provided on the side surface portion having the side surface input region,
The third electrode row is provided on an extension of the first electrode row (and / or the second electrode row),
The fourth electrode row is provided along the direction of the second electrode row (and / or the first electrode row),
One end of the first lead wire is electrically connected to the end of the first electrode row or the end of the third electrode row,
The other end portion of the first lead wiring is formed on a side surface portion that does not include the side surface input region,
One end portion of the second lead-out wiring is electrically connected to the end portion of the second electrode row and the end portion of the fourth electrode row,
The other end portion of the second lead wiring is formed on a side surface portion that does not include the side surface input region,
The capacitive touch panel, wherein at least one of the first lead wiring and the second lead wiring passes through a ridge line portion that is a boundary between side surfaces adjacent to each other. The first electrode row is provided on one surface side of the main surface portion,
The second electrode row is provided on the other surface side of the main surface portion,
The third electrode row is provided on the surface side where the electrode row that is the source of the third electrode row is provided,
The capacitive touch panel according to claim 1, wherein the fourth electrode row is provided on a surface side on which the electrode row along which the fourth electrode row is provided. The first electrode row and the second electrode row are provided on one surface side of the main surface portion,
An electrically insulating spacer is provided at the intersection between the first electrode row and the second electrode row,
The third electrode row and the fourth electrode row are provided on one side of the side portion,
2. The capacitive touch panel according to claim 1, wherein an electrically insulating spacer is provided at an intersection between the third electrode row and the fourth electrode row. The capacitive touch panel according to claim 1, wherein the lead-out wiring passing through the ridge line portion is located on an inner surface side of the case body. The center position of the island electrode of the first electrode row and the center position of the island electrode of the second electrode row are at different positions when viewed from a direction orthogonal to the main surface portion. The capacitive touch panel according to claim 1. The island-like electrode of the first electrode row and the island-like electrode of the second electrode row are substantially not overlapped when viewed from a direction orthogonal to the main surface portion. The capacitive touch panel according to claim 1. The capacitive touch panel according to claim 1, wherein a visible light shielding layer is provided on a main surface portion outside the main surface input region and / or a side surface portion outside the side surface input region. 2. The capacitive touch panel according to claim 1, wherein a transparent resin layer is provided on the surface of the case body. The capacitive touch panel according to claim 1, wherein a hard coat layer is provided on the surface of the case body. A transparent resin layer is provided on the surface of the case body,
The capacitive touch panel according to claim 1, wherein a hard coat layer is provided on the surface of the transparent resin layer. The capacitive touch panel according to claim 1, wherein a reinforcing frame is provided inside a side surface portion of the case body. The capacitive touch panel according to claim 1, wherein the island-shaped electrode in the main surface input region is configured by a mesh-shaped conductor. The capacitive touch panel according to claim 1, wherein the electrode array in the main surface input region is configured by a mesh-like conductor. 14. The capacitive touch panel according to claim 12, wherein the conductor is made of one or more metals selected from the group consisting of Ag, Au, Cu, and Al. . An external connection terminal is formed on the side surface portion that does not include the side surface input region,
One of the other end of the first lead wiring and the other end of the second lead wiring is connected to the external connection terminal through a through hole,
2. The other end portion of the first lead wire and the other end portion of the second lead wire are connected to the external connection terminal without a through hole. Capacitive touch panel. 16. The capacitive touch panel according to claim 15, wherein a surface of the external connection terminal is covered with carbon. It has a case body made of an electrically insulating transparent resin film,
The case body includes a main surface portion, a side surface portion, and a hollow portion,
The hollow portion exists in a region formed by the main surface portion and the side surface portion,
The side portion is
Connected to the main surface,
Substantially orthogonal to the main surface portion,
There are four or more side portions that are substantially orthogonal,
At least two of the side surface portions are substantially orthogonal to the first direction of the main surface portion,
At least two of the side surface portions are substantially orthogonal to the second direction of the main surface portion,
The main surface portion includes a main surface input area,
At least one of the four or more side surfaces includes a side surface input region,
The main surface portion is provided with two or more first electrode rows and two or more second electrode rows,
The two or more first electrode rows are:
Provided at predetermined intervals,
Provided along the first direction;
The two or more second electrode rows are:
Provided at predetermined intervals,
Provided along the second direction;
Each of the first electrode row and the second electrode row is composed of two or more island-shaped electrodes and an inter-electrode wiring in which the island-shaped electrodes are electrically connected,
One or two or more third electrode rows and one or two or more fourth electrode rows are provided on the side surface portion having the side surface input region,
The third electrode row is provided on an extension of the first electrode row (and / or the second electrode row),
The fourth electrode row is provided along the direction of the second electrode row (and / or the first electrode row),
One end of the first lead wire is electrically connected to the end of the first electrode row or the end of the third electrode row,
The other end portion of the first lead wiring is formed on a side surface portion that does not include the side surface input region,
One end portion of the second lead-out wiring is electrically connected to the end portion of the second electrode row and the end portion of the fourth electrode row,
The other end portion of the second lead wiring is formed on a side surface portion that does not include the side surface input region,
At least one of the first lead wiring and the second lead wiring is a method of manufacturing a capacitive touch panel that passes through a ridge line portion that is a boundary between side surfaces adjacent to each other,
The conductor pattern constituting the first electrode row, the second electrode row, the third electrode row, the fourth electrode row, the first lead wire, and the second lead wire is Conductive pattern forming step formed on the electrically insulating transparent resin film,
After the said conductor pattern formation process, the said electrically insulating transparent resin film comprises the shaping | molding process shape | molded by the said case body, The manufacturing method of the capacitive touch panel characterized by the above-mentioned. The first electrode row is provided on one surface side of the main surface portion,
The second electrode row is provided on the other surface side of the main surface portion,
The third electrode row is provided on the surface side where the electrode row that is the source of the third electrode row is provided,
18. The capacitive touch panel manufacturing method according to claim 17, wherein the fourth electrode row is provided on a surface side on which the electrode row along which the fourth electrode row is provided. Method. The first electrode row and the second electrode row are provided on one surface side of the main surface portion,
An electrically insulating spacer is provided at the intersection between the first electrode row and the second electrode row,
The third electrode row and the fourth electrode row are provided on one side of the side portion,
18. The method of manufacturing a capacitive touch panel according to claim 17, wherein an electrically insulating spacer is provided at an intersection between the third electrode row and the fourth electrode row. 18. The method of manufacturing a capacitive touch panel according to claim 17, wherein the lead-out wiring passing through the ridge line portion is located on an inner surface side of the case body. The center position of the island electrode of the first electrode row and the center position of the island electrode of the second electrode row are at different positions when viewed from a direction orthogonal to the main surface portion. The method of manufacturing a capacitive touch panel according to claim 17. The island-like electrode of the first electrode row and the island-like electrode of the second electrode row are substantially not overlapped when viewed from a direction orthogonal to the main surface portion. The manufacturing method of the capacitive touch panel of Claim 17. After the conductor pattern forming step and before the forming step, the visible light shielding layer is at a position corresponding to the main surface portion outside the main surface input region and / or the side surface portion outside the side surface input region, The method of manufacturing a capacitive touch panel according to claim 17, further comprising a step of being provided. The method of manufacturing a capacitive touch panel according to claim 17, further comprising a step of providing a transparent resin layer at a position corresponding to the surface of the case body. The method of manufacturing a capacitive touch panel according to claim 17, further comprising a step of providing a hard coat layer at a position corresponding to the surface of the case body. 18. The method of manufacturing a capacitive touch panel according to claim 17, further comprising a step of providing a reinforcing frame inside the side surface of the case body. 18. The method of manufacturing a capacitive touch panel according to claim 17, wherein the island-shaped electrode in the main surface input region is configured by a mesh conductor. 18. The method of manufacturing a capacitive touch panel according to claim 17, wherein the electrode array in the main surface input region is configured by a mesh-like conductor. A display device;
A capacitive touch panel according to any one of claims 1 to 16, which is disposed on a display unit of the display device.

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