JP2013225713A - Production method of optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an efficient production method of an optical device.SOLUTION: A production method of an optical device includes the steps for: preparing an overall substrate 33 including lattice-like regions 32 corresponding to respective substrates 38 of the optical device; collectively molding on the overall substrate 33 through transfer molding an overall member 34 for protection including a member 39 for protection provided in each of the regions 32 and functioned to reflect light emitted from a chip 3; mounting the chip 3 in each of the regions 32; electrically connecting electrodes which the chip 3 and the substrate 38 have, respectively; fixing the overall substrate 33 with the overall member 34 for protection to one of molding dies composed of an upper die 41 and a lower die 40 which are confronted with each other; collectively molding an overall member for sealing including a plurality of sealing members on the overall substrate 33 with the overall member 34 for protection through compression molding; and separating an intermediate which is formed by the step for collectively molding the overall member for sealing, for the unit of each region 32.

Description

  The present invention relates to a method for producing an optical device having a chip made of an optical element.

  A conventional optical device production method will be described with reference to FIG. 5 (1)-(4) are cross-sectional views showing a conventional method for producing an optical device, and FIG. 5 (5) is a plan view showing a semi-finished product with a lens of the optical device. Here, the production of a light emitting diode package (LED package) will be described as an example. In addition, in order to make it easy to understand, any drawing used in the following description is schematically omitted or exaggerated as appropriate.

  In the conventional production method, as shown in FIG. 5A, first, the LED chip 3 is die-bonded to the upper surface 2 of the lead frame 1, and the electrodes of the lead frame 1 and the LED chip 3 are not shown. ) Is wire-bonded using the wire 4. Next, as shown in FIG. 5 (2), the cured resin is formed into a predetermined range excluding the space around the LED chip 3 and the wire 4 on the upper surface 2 and a predetermined range on the lower surface 5 by, for example, transfer molding. A protective member 6 is formed. The protection member 6 has a function of protecting the LED chip 3 and the wire 4 and, in some cases, has a function of reflecting light emitted from the LED chip 3 upward in the drawing. Further, when the protective member 6 is formed, the concave portion 7 is formed in the protective member 6 on the upper surface 2 side. The semi-finished product 8 corresponding to the LED package as one complete product is manufactured by the steps so far. In the semi-finished product 8, a portion protruding from the protective member 6 in the lead frame 1 functions as a lead of the LED package. Further, from the state shown in FIG. 5 (2), secondary molding may be performed as necessary, and the space around the LED chip 3 and the wire 4 may be filled with a translucent cured resin.

  Next, as shown in FIG. 5 (3), an adhesive (not shown) is applied to the recess 7 of the semi-finished product 8, and a translucent member made of a translucent material, that is, a lens member 9 is prepared. To do. Thereafter, the lens member 9 is held and conveyed by suction or the like, and is aligned with the concave portion 7 of the semi-finished product 8. The lens member 9 is manufactured individually by injection molding, and is composed of a translucent portion 10 having a shape made of a part of a sphere and functioning as a convex lens, and a flat flange portion 11 extending from the bottom thereof. It has a planar shape.

  Next, as shown in FIG. 5 (4), the lens member 9 is lowered and placed on the recess 7, and the adhesive is cured to bond the semi-finished product 8 and the lens member 9 of FIG. Glue. Thereby, the semi-finished product 12 with a lens shown in FIGS. 5 (4) and 5 (5) is completed. After the above steps, the lead is bent to complete the LED package.

  In addition to the production methods described above, the following production methods are known depending on the structure of the LED package. As a second production method, a multilayer ceramic substrate was used instead of the lead frame 1, a metal cap was attached to the upper surface of the multilayer ceramic substrate instead of the protective member 6, and the metal cap was provided on the top surface of the metal cap. A production method for attaching a lens (translucent member) to a hole has been proposed (see, for example, Patent Document 1). The lens used in this method is a convex lens having a circular plane shape and a middle convex cross-sectional shape. As a third production method, a light emitting diode pellet (LED chip) on a lead frame is resin-sealed to form a photoelectric conversion element base having a square planar shape, and a rectangular shape in plan view is formed on the base. A production method for mounting a transparent resin plate (translucent member) in which a flat plate portion and a convex lens portion are integrated has been proposed (for example, see Patent Document 2). This transparent resin plate with a lens is molded by an injection molding method, that is, an injection molding method.

  However, according to the conventional technology described above, there are the following problems. First, in the first and second production methods, the lens (including the lens member in the first production method) has a circular planar shape and a middle convex cross-sectional shape. Thereby, even if it has a flange part of a small area, mistakes are likely to occur when handling such as picking up and transporting the lens by grasping and adsorbing. Further, since the handling jig easily comes into contact with the portion of the lens through which light is transmitted (the translucent portion 10 in FIG. 5), there is a possibility that the quality may be deteriorated by scratching this portion. Next, in any of the first to third production methods, it is necessary to store, pick up, and transport the lens in the state of individual pieces, so the management of inventory and the process are complicated. Next, in any of the first to third production methods, it is necessary to manufacture the lens and the semi-finished product in units of one unit and to attach one lens to one semi-finished product. It is difficult to improve production efficiency when producing

JP 2003-163382 A (page 3, FIG. 1, FIG. 2, FIG. 4) Japanese Patent Laid-Open No. 4-348088 (page 2 to page 3, FIGS. 1 to 3)

  The problem to be solved by the present invention is that it is difficult to improve the production efficiency when producing an optical device, and the quality may be lowered.

  In order to solve the above-described problems, an optical device production method according to the present invention includes a substrate (38), a chip (3) that is mounted on a first surface of the substrate (38) and includes an optical element, A protective member (39) provided on the first surface for the purpose of protecting the chip (3), and a translucent seal provided on the first surface for the purpose of sealing the chip (3) A method of producing an optical device comprising a member for use (50), which is divided by a virtually provided dicing line (23) and is formed in a lattice shape so as to correspond to the substrate (38) ( 32) preparing the entire substrate (33) having the step 32), attaching the chip (3) to each of the regions (32), and wire bonding the electrodes of the chip (3) and the substrate (38) to each other. Or electrically by flip chip bonding Protecting the entire protective member (34) having the following step and the protective member (39) provided in each of the regions (32) in all the dicing lines (23) in each of the adjacent regions (32) An overall member for protection in one of a step of forming by batch forming by transfer molding so that the members (39) are connected to each other, and a molding die comprising the upper die (41) and the lower die (40) facing each other In the step of fixing the whole substrate (33) with (34) and the whole substrate (33) with the protective whole member (34), the region (32) is covered in each of the regions (32). The step of collectively molding the whole sealing member (45) having a plurality of sealing members (50) by compression molding and the step of collectively molding the whole sealing member (45) And a step of attaching the chip (3) after the step of collectively forming the protective overall member (34). The step of collectively molding the whole sealing member (45) includes the step of opening the mold and the cavity (42) of one of the molds opened by the flowable resin (44). A step of filling the chip, and a step of immersing the chip (3) in the fluid resin (44) in the cavity (42); and the fluid resin (44) in the cavity (42) when the mold is clamped. And forming the entire sealing member (45) made of the cured resin by molding the cured resin all together, covering the chip (3) with the cured resin without any gaps, and a protective member (39 ) Has a function of reflecting the light emitted from the chip (3), and in the step of electrically connecting, the electrical connection between the electrodes of the chip (3) and the substrate (38), In the step corresponding to the inside of the protective member (39) in plan view and immersed, each of the light transmitting part spaces corresponding to the light transmitting part functioning as a lens in the optical device is provided in the cavity (42). And a communication space that is formed in the entire range in a plan view around the light-transmitting portion space and communicates with the light-transmitting portion spaces, is filled with a fluid resin (44), and the entire sealing member In the step of collectively molding (45), the light transmitting portion (48) made of a cured resin cured in each of the light transmitting portion spaces and the communication portion (49) made of a cured resin cured in each of the communication spaces. And is characterized by molding .

  The optical device production method according to the present invention includes a substrate (38), a chip (3) made of an optical element mounted on a first surface of the substrate (38), and protecting the chip (3). A protective member (39) provided on the first surface for the purpose of sealing, and a translucent sealing member (25) provided on the first surface for sealing the chip (3); And an entire substrate having regions (32) formed in a lattice shape so as to correspond to the substrate (38), each of which is divided by virtually provided dicing lines (23). (33) preparing step, attaching the chip (3) to each of the regions (32), and connecting the electrodes of the chip (3) and the substrate (38) to each other by wire bonding or flip chip bonding. Connection process and area 32), the protective whole member (34) having the protective member (39) provided in each of the protective members (39) in each of the dicing lines (23) in each of the adjacent regions (32). In the step of forming together by transfer molding, and in the entire substrate (33) with the protective whole member (34), the region (32) is covered in the region (32). An intermediate formed by a step of collectively providing a whole sealing member (45) having a plurality of sealing members (50) and a step of collectively providing a whole sealing member (45) ( 46) and the step of attaching the chip (3) after the step of collectively forming the protective whole member (39). In the step of collectively providing the whole sealing member (45), each region (32) is made of a curable resin and functions as a lens, and the periphery of the transmissive part (10) made of a curable resin. The whole sealing member (19) which has a communication part (24) formed in the entire range in plan view and is integrally molded in advance by transfer molding. The protective member (39) has a function of reflecting the light emitted from the chip (3), and in the step of electrically connecting the chip (3) and the substrate (38), The electrodes are each electrically connected to each other at a portion corresponding to the inside of the protective member (39) in plan view.

  The optical device production method according to the present invention includes a substrate (38), a chip (3) made of an optical element mounted on a first surface of the substrate (38), and protecting the chip (3). A protective member (39) provided on the first surface for the purpose of sealing, and a translucent sealing member (25) provided on the first surface for sealing the chip (3); And an entire substrate having regions (32) formed in a lattice shape so as to correspond to the substrate (38), each of which is divided by virtually provided dicing lines (23). (33) preparing step, attaching the chip (3) to each of the regions (32), and connecting the electrodes of the chip (3) and the substrate (38) to each other by wire bonding or flip chip bonding. Connection process and region 32), the protective whole member (34) having the protective member (39) provided in each of the protective members (39) in each of the dicing lines (23) in each of the adjacent regions (32). In the step of forming together by transfer molding, and in the entire substrate (33) with the protective whole member (34), the region (32) is covered in the region (32). An intermediate formed by a step of collectively providing a whole sealing member (45) having a plurality of sealing members (50) and a step of collectively providing a whole sealing member (45) ( 46) and the step of attaching the chip (3) after the step of collectively forming the protective whole member (39). In the step of collectively providing the whole sealing member (45), each region (32) is made of a curable resin and functions as a lens, and the periphery of the transmissive part (10) made of a curable resin. The whole sealing member (19) having a communication part (24) formed in the entire range in a plan view and integrally molded in advance by compression molding is provided. The protective member (39) has a function of reflecting the light emitted from the chip (3), and in the step of electrically connecting the chip (3) and the substrate (38), The electrodes are each electrically connected to each other at a portion corresponding to the inside of the protective member (39) in plan view.

  Further, the optical device production method according to the present invention is the above-described production method, wherein in the step of providing the overall protection member (34), the chip (3) to be mounted in each of the regions (32) is protected. An overall protective member (34) is provided so that the member (39) can be surrounded.

  The optical device production method according to the present invention is characterized in that, in each of the regions (32), the upper surface of the chip (3) is located lower than the upper surface of the protective member (39) in the production method described above. And

  In the optical device production method according to the present invention, in the above production method, the substrate (38) is a bonding electrode provided on the first surface and a second surface opposite to the first surface. And at least an external electrode provided on the surface.

  Further, the optical device production method according to the present invention is the above-described production method, wherein in the separation step, the intermediate body (36) is replaced with the optical device (37) using any one of a rotary blade, laser light, and wire saw. It is characterized by separating.

  Moreover, the method for producing an optical device according to the present invention includes the step of handling the optical device (37) by sandwiching a side surface of the optical device (37) after the separating step in the above-described production method. Features.

  The optical device production method according to the present invention is characterized in that, in the above production method, the entire substrate is a printed circuit board.

  The optical device production method according to the present invention is characterized in that, in the production method described above, the chip is an LED chip.

  According to the present invention, regarding the optical device (37) in which the protective member (39) and the sealing member (25) are provided on the substrate (38), the overall protective member (34) is provided on the entire substrate (33). Are collectively formed by transfer molding, and the chip (3) is mounted on each of the regions (32) formed in a lattice shape on the entire substrate (33), and the entire member for sealing is formed on the entire substrate (33). The optical device (37) is formed by forming the intermediate body (36) by collectively providing (19) by compression molding or bonding, and separating the intermediate body (36) into each region (32) unit. Form. As a result, the man-hours can be reduced and the substrate and protection can be reduced as compared with the case where optical devices are individually produced using a substrate, a chip, a protective member, and a sealing member corresponding to one optical device. It is possible to simplify the management and conveyance of the member for sealing and the member for sealing. Therefore, the production efficiency when producing the optical device (37) can be improved.

1 (1) to 1 (4) are partial cross-sectional views illustrating the optical device production method according to Reference Example 1 in the order of steps, and FIG. 1 (5) is a perspective view illustrating a completed lens member. FIGS. 2 (1) to 2 (4) are partial cross-sectional views showing the optical device production method according to Reference Example 2 in the order of steps, and FIG. 2 (5) is a plan view showing a semi-finished product with a lens of the optical device. 3 (1) to 3 (4) are partial cross-sectional views illustrating the optical device production method according to the first embodiment in the order of steps, and FIG. 3 (5) is a cross-sectional view illustrating the completed optical device. 4 (1) to 4 (4) are partial cross-sectional views illustrating the optical device production method according to the second embodiment in the order of steps, and FIG. 4 (5) is a cross-sectional view illustrating the completed optical device. 5 (1)-(4) are cross-sectional views showing a conventional method for producing an optical device, and FIG. 5 (5) is a plan view showing a semi-finished product with a lens of the optical device.

  A method for producing an optical device, the step of preparing an entire substrate (33) having regions (32) formed in a lattice shape so as to correspond to the substrate (38), and a chip in each region (32) (3) is provided in each of the regions (32), the step of electrically connecting the electrodes of the chip (3) and the substrate (38) to each other by wire bonding or flip chip bonding, and the region (32). The protective overall member (34) is provided in one of the step of providing the protective overall member (34) having the protective member (39) and the molding die composed of the opposing upper die (41) and lower die (40). In the step of fixing the attached whole substrate (33) and the whole substrate (33) with the protecting whole member (34), the whole sealing member (45) having a plurality of sealing members (50) is provided. Work to form in batch And a step of separating the intermediate formed by the step of collectively molding the whole sealing member (45) into each region (32) unit, and collectively molding the whole sealing member The process includes a step of filling the cavity (42) of the lower mold (40) with the fluid resin (44), and clamping the mold to mold the chip (3) with the fluid resin (44). A step of immersing the resin in a resin, and a step of forming the whole sealing member (45) made of the cured resin by curing the flowable resin (44) and collectively molding the cured resin. Cover the chip (3) without any gaps. The protective member (39) has a function of reflecting light emitted from the chip (3). In the electrical connection step, the electrodes of the chip (3) and the substrate (38) are electrically connected to each other at a portion corresponding to the inside of the protective member (39) in plan view.

Reference example 1

  Reference Example 1 of the present invention will be described with reference to FIGS. 1 (1) to 1 (4) are partial cross-sectional views showing the optical device production method according to this reference example in the order of steps, and FIG. 1 (5) is a perspective view showing a completed lens member. In any of the drawings shown below, the same components as those shown in FIG. 5 are denoted by the same reference numerals and description thereof is omitted. In the following description, an LED chip will be described as an example of an optical element, and an LED package will be described as an example of an optical device. The present invention can be applied not only to an LED chip but also to a light receiving element that converts received light into an electrical signal, for example, a chip such as a photodiode (PD) or a solid-state imaging element. In addition, the present invention can be applied to a light emitting element that emits light in accordance with the received electrical signal, for example, a chip such as a laser diode (LD). In addition, the present invention can be applied to modules used for optical communication. That is, the present invention can be applied to optical elements.

  In this reference example, a lens member that adheres to a semi-finished product (see the semi-finished product 8 in FIG. 5 (3)) having a substrate, an LED chip, and a protective member, that is, a translucent member, is formed including a plurality of lens members. It is characterized in that the molded body is formed by separating the molded body after resin molding at once. According to the method for producing an optical device according to this reference example, first, as shown in FIG. 1 (1), a lower mold 13 and an upper mold 14 facing each other are prepared, and a cavity 15 provided in the lower mold is formed. Then, a predetermined amount of granular resin material 16 made of a thermosetting resin having translucency is supplied. A plurality of concave portions corresponding to the shape of the lens member is formed in the cavity 15 in a lattice shape. Further, the resin material 16 may be in the form of powder, lump, or sheet in addition to the illustrated granular shape, and a thermoplastic resin having a certain translucency may be used. Further, a resin material that is liquid at normal temperature may be injected into the cavity 15.

  Next, as shown in FIG. 1 (2), the upper mold 14 is lowered from the state of FIG. 1 (1), the lower mold 13 and the upper mold 14 are clamped, and the resin material 16 is pressed. Then, the resin material 16 is heated and melted using heaters (not shown) provided in the lower mold 13 and the upper mold 14 to generate the fluid resin 17 in the cavity 15. Thereafter, the fluid resin 17 is cured to form a molded body 19 made of the cured resin 18 as shown in FIG. Thereby, the molded object 19 was shape | molded collectively using what is called compression molding. Here, the molded body 19 can also be molded collectively using transfer molding.

  Next, as shown in FIG. 1 (3), the upper die 14 is raised to open the lower die 13 and the upper die 14. And after taking out the molded object 19, it hold | maintains the molded object 19 using means, such as adsorption | suction, and conveys it to the cutting device used at the next process.

  Next, as shown in FIG. 1 (4), the molded body 19 is temporarily fixed to the stage 21 using a dicing sheet 20 having appropriate tackiness, in other words, weak adhesive force. Then, using the rotary blade 22, along the virtual dicing line 23 provided on the molded body 19, molding is performed in the Y direction (front-rear direction in the figure) and the X direction (left-right direction in the figure). The body 19 is cut. As a result, the molded body 19 is separated into pieces, and the translucent member shown in FIG. 1 (5), that is, the translucent part 10 functioning as a convex lens, and the flat flange part 24 having a rectangular planar shape. The lens member 25 having the above is completed. The lens member 25 having the rectangular planar shape corresponds to the translucent member according to the present invention. Here, after the molded body 19 is cut to form all the lens members 25, all the lens members 25 are temporarily fixed to the dicing sheet 20, and are transported, stored, shipped, and the like.

  Next, an adhesive (not shown) is applied to the concave portion 7 of the semi-finished product 8 in the same manner as in FIG. Thereafter, the lens member 25 is held by suction or the like, and further separated and conveyed from the dicing sheet 20 to be aligned with the concave portion 7. In this reference example, the concave portion 7 shown in FIG. 5 has a rectangular planar shape corresponding to the flange portion 24 of FIG.

  Next, as in FIG. 5 (4), the lens member 25 is lowered and placed on the recess 7, and the adhesive is cured. Thereby, the semi-finished product with lens (see the semi-finished product 12 with lens in FIGS. 5 (4) and (5)) is completed. The lead device is bent after the above steps to complete the optical device (LED package) according to this reference example.

  As described above, according to the present reference example, the molded body 19 formed in one batch is individually provided for the optical device in which the lead frame is provided with the protective member and the lens member 25 fixed to the top surface. A lens member 25 formed by being separated into pieces is used. Therefore, compared to the case where the lens members are individually formed by injection molding or the like, the production efficiency is improved when the optical device is produced, and inventory management, storage, transportation, and the like are simplified. The lens member 25 has a flat and wide flange portion 24 and a rectangular planar shape. Thereby, when the lens member 25 is handled, the flange portion 24 can be grasped or attracted to the flange portion 24. Even if the area of the flange portion 24 is small, the lens member 25 can be held by sandwiching the side surface at each side. Therefore, when the lens member 25 is handled, occurrence of mistakes and deterioration of quality due to scratches on the light transmitting portion 10 are suppressed.

  In this reference example, the molded body 19 was cut using the rotary blade 22. Not limited to this, when forming the molded body 19, a groove is formed at the position of the dicing line 23, and the molded body 19 is separated into individual lens members 25 by being bent at the groove portion and separated from each other. Also good.

  Further, the lens member 25 has been described as an example of the translucent member according to the present invention. The translucent member according to the present invention is not limited to this, and the lens member integrated with the lens barrel (the portion formed of the protective member 6 and the lens member 9 on the upper side of the substrate 1 in FIG. 5 (3)). It is good.

Reference example 2

  Reference Example 2 of the present invention will be described with reference to FIGS. FIGS. 2 (1) to (4) are partial cross-sectional views showing the optical device production method according to this reference example in the order of steps, and FIG. 2 (5) is a plan view showing a semi-finished product with a lens of the optical device. In this reference example, when the molded body is cut, the molded body is temporarily fixed to the stage, and the lens member separated by cutting the molded body is bonded to the semi-finished product with a lens. Is performed by one double-sided adhesive sheet. According to this reference example, first, as shown in FIG. 2 (1), the double-sided adhesive sheet 26 having a three-layer structure is attached to the lower surface of the molded body 19. The double-sided adhesive sheet 26 includes a base material 27, a temporary fixing temporary adhesive layer 28 that is formed on one surface (lower surface in the drawing) and has a weak adhesive force, and the other surface of the base material 27 ( It is composed of a main fixing layer 29 for fixing that is formed on the upper surface in the drawing and has a strong adhesive force. Then, the main adhesive layer 29 of the double-sided adhesive sheet 26 is attached to the lower surface of the molded body 19. Further, the main adhesive layer 29 corresponding to one lens member 25 is provided in a frame shape so as to exist below the flange portion 24 and not below the light transmitting portion 10. For example, when a transparent material such as acrylic is used as the main adhesive layer 29, the main adhesive layer 29 may be provided on the entire lower surface of the lens member 25.

  Next, instead of the dicing sheet 20 shown in FIG. 1 (4), the double-sided adhesive sheet 26 is used, and the molded body 19 is temporarily fixed to the stage 21 by the temporary adhesive layer 28. Then, the molded body 19 is cut along the dicing line 23 using the rotary blade 22.

  Next, the lens member 25 separated by cutting is peeled off from the temporary adhesive layer 28 on the stage 21. Thereby, as shown in FIG. 2B, the lens member 25 is formed in which the main adhesive layer 29 and the base material 27 are adhered to the lower surface in this order.

  Next, as shown in FIG. 2 (3), the lens member 25 is held and transported by sucking the flange portion 24 using the suction holder 30. Then, as shown in FIG. 2 (4), the lens member 25 is aligned with the semi-finished product 31, lowered, brought into contact with the upper surface of the semi-finished product 31, and further pressurized. Thereby, the lens member 25 is bonded to the upper surface of the semi-finished product 31. Thereafter, lead bending is performed to complete the optical device (LED package) according to this reference example.

  As described above, according to this reference example, the temporary fixing means used when cutting the molded body 19 into pieces and the permanent fixing means for bonding the separated lens member 25 to the semi-finished product 31. As an example, one double-sided adhesive sheet 26 is used. Thereby, since the process of apply | coating an adhesive agent to the semi-finished product 31 can be abbreviate | omitted, the production efficiency at the time of producing an optical device can be improved.

  A first embodiment of the present invention will be described with reference to FIG. 3 (1) to 3 (4) are partial cross-sectional views showing the optical device production method according to this embodiment in the order of steps, and FIG. 3 (5) is a cross-sectional view showing the completed optical device. According to the method for producing an optical device according to the present embodiment, first, as shown in FIG. 3A, an entire substrate 33 made of a printed circuit board or the like in which regions 32 corresponding to the optical device are formed in a lattice shape is prepared. To do. Then, the chip 3 is mounted on each region 32 having a rectangular planar shape, and wire bonding is performed using the wire 4.

  Next, as shown in FIG. 3B, the entire protective member 34 that surrounds the chip 3 in each region 32 is formed by batch transfer molding. Further, in this step, the entire protective member independently and integrally formed independently of the entire substrate 33 may be aligned and bonded to the entire substrate 33. By these methods, the protective whole member 34 can be provided collectively on the whole substrate 33.

  Next, as shown in FIG. 3 (3), a molded body 19 formed in a lump using a translucent resin is prepared (see FIG. 1 (3)). An adhesive sheet 35 is preferably pasted on the lower surface of the molded body 19 in advance. The adhesive sheet 35 has the same function as the main adhesive layer 29 shown in FIG. Then, after positioning the molded body 19 with respect to the entire substrate 33, the molded body 19 is lowered and pressed against the top surface (upper surface in the drawing) of the protective overall member 34. As a result, the molded body 19 and the protective overall member 34 are bonded together.

  Next, as shown in FIG. 3 (4), an intermediate body 36 formed by bonding the molded body 19 and the protective whole member 34 is temporarily fixed to a stage (not shown). Then, using the rotary blade 22, along the dicing line 23 virtually provided in the intermediate body 36, it is intermediate between the Y direction (front-rear direction in the figure) and the X direction (left-right direction in the figure). Cut the body 36. Thereby, the intermediate body 36 is separated into individual regions 32 and separated into individual pieces.

  Through the steps up to here, the optical device 37 (LED package) according to the present embodiment shown in FIG. This optical device 37 includes a substrate 38 in which the entire substrate 33 is separated, a chip 3 mounted on the upper surface of the substrate 38, a protection member 39 provided so as to surround the chip 3, and a protection member. And a lens member 25 which is a translucent member bonded to the upper surface of 39. The optical device 37 is electrically connected to another printed circuit board or the like (not shown) by an external electrode (not shown) provided on the lower surface of the substrate 38.

  As described above, according to the present embodiment, the protective whole member 34 surrounding the chip 3 attached to each region 32 of the whole substrate 33 is formed in a lump and is formed in a lump and has translucency. The molded body 19 is bonded onto the protective overall member 34 to form an intermediate body 36, and the intermediate body 36 is separated into units of each region 32 to complete the optical device 37. Therefore, the production efficiency of the optical device is greatly improved as compared with the production method (see FIG. 5) in which the lens member is bonded to each semi-finished product. Further, the lens member 25 included in the optical device 37 is integrally handled as the molded body 19 until the intermediate body is cut. Thus, the molded body 19 can be gripped or adsorbed using a portion (peripheral portion) that does not correspond to the lens member 25 in the molded body 19. Therefore, when the molded body 19 is handled, it is possible to prevent occurrence of mistakes and quality deterioration due to scratches on the lens member 25. Moreover, since the optical device 37 has a rectangular planar shape, handling of the optical device 37 is facilitated by sandwiching the side surface, and damage to the lens member 25 can be prevented.

  A second embodiment of the present invention will be described with reference to FIG. 4 (1) to 4 (4) are partial cross-sectional views showing the optical device production method according to this embodiment in the order of steps, and FIG. 4 (5) is a cross-sectional view showing the completed optical device. According to the optical device production method of the present embodiment, first, as in the case shown in FIG. 3 (1), the chip 3 is mounted in each region 32 of the entire substrate 33 and wire bonding is performed using the wires 4. I do. And the lower mold | type 40 and the upper mold | type 41 which oppose each other are prepared. Here, a cavity 42 is formed in the lower mold 40, and a plurality of recesses corresponding to the respective chips 3 are formed in a lattice shape in the cavity 42. Then, as shown in FIG. 4A, the entire substrate 33 is fixed to the upper mold 41 by a method such as suction. In addition, as in the case shown in FIG. 1A, a predetermined amount of granular resin material 43 made of a thermosetting resin having translucency is supplied to the cavity 42.

  Next, as shown in FIG. 4 (2), the resin material 43 is heated and melted to produce a fluid resin 44 in the cavity 42, and the lower mold 40 and the upper mold 41 are clamped. Here, in order to heat the resin material 43, a heater (not shown) provided in the lower mold 40 is used. Further, instead of or in addition to the heater, a contact type heating plate or a non-contact type halogen lamp inserted between the lower mold 40 and the upper mold 41 may be used.

  Next, as shown in FIG. 4 (3), the fluid resin 44 is cured to form a molded body 45 made of a cured resin, and an intermediate body 46 having the entire substrate 33 and the molded body 45 is formed. Then, the upper mold 41 is raised to open the lower mold (not shown) and the upper mold 41. The molded body 45 functions as an entire sealing member that collectively seals the chips 3 on the entire substrate 33. Through the steps so far, the intermediate body 46 is formed in a lump using compression molding. It should be noted that transfer molding may be used instead of compression molding to form the cured resin and simultaneously mold the intermediate body 46.

  Next, as shown in FIG. 4 (4), the intermediate body 46 is temporarily fixed to a stage (not shown). And using the rotary blade 22, along the dicing line 23 virtually provided in the intermediate body 46, it is intermediate in the Y direction (front-rear direction in the figure) and the X direction (left-right direction in the figure). Cut the body 46. Thereby, the intermediate body 46 is separated into individual regions 32 and separated into individual pieces.

  Through the steps so far, the optical device 47 (LED package) according to the present embodiment shown in FIG. The optical device 47 includes a substrate 38 in which the entire substrate 33 is separated, a chip (not shown) mounted on the upper surface of the substrate 38, a convex lens-shaped light transmitting portion 48, and a flat flange portion 49. In addition, a translucent member for sealing the chip, that is, a lens member 50 is provided.

  As described above, according to the present embodiment, the chips 3 attached to the respective regions 32 of the entire substrate 33 are collectively sealed to form the intermediate body 46, and the intermediate body 46 is divided into units of each region 32. Thus, the optical device 47 is completed. Thereby, the production efficiency of the optical device is further greatly improved as compared with the production method (see FIG. 5) in which the lens member is bonded to each semi-finished product. Further, the production efficiency is improved as compared with the production method (see FIG. 3) in which the protective member is formed. In addition, the intermediate body 46 can be gripped or adsorbed by using a portion of the intermediate body 46 that does not correspond to the lens member 50 (a peripheral portion of the molded body 45). Therefore, when the intermediate body 46 is handled, it is possible to prevent the occurrence of mistakes and the deterioration of quality due to the lens member 50 being damaged. In addition, since the optical device 47 has a rectangular planar shape, handling of the optical device 47 is facilitated by sandwiching the side surface, and damage to the lens member 50 can be prevented.

  In this embodiment, the intermediate body 46 having the entire substrate 33 and the molded body 45 made of a cured resin is molded in a lump. Instead of this, a member that replaces the portion made of the cured resin may be integrally formed in advance using a translucent resin, and the formed member may be used as the entire sealing member. In this case, first, the whole sealing member is integrally formed in advance independently and independently of the whole substrate 33. Specifically, a portion of the molded body 45 excluding a predetermined space around the LED chip 3 and the wire 4, in other words, the molded body 19 shown in FIG. Corresponding portions are collectively formed as a whole sealing member. Next, the whole sealing member is aligned and bonded to the whole substrate 33. Thereby, the whole member for sealing which functions as a protection member and a lens member can be collectively provided on the whole substrate 33, and an intermediate can be formed. Next, the intermediate is separated into 32 units for each region and separated into individual pieces. The optical device thus obtained has a configuration in which the lens member 25 and the protection member 39 shown in FIG. 3 (5) are integrated and made of a translucent resin.

  In Reference Examples 1 and 2 and Examples 1 and 2, the lens members 25 and 50 have convex lens-like light transmitting portions 10 and 48 and flat flange portions 24 and 49. However, the present invention is not limited to this, and the entire lens members 25 and 50 may be formed so as to form a convex lens-like light transmitting portion. In this case, the dicing sheet (see the dicing sheet 20 in FIG. 1 (4)) is expanded after cutting, and the side surfaces of the lens members 25 and 50 or the side surfaces of the optical devices 37 and 47, that is, the convex lens-like light transmission. You can grab parts other than the part. Thereby, when handling the lens members 25 and 50 and the optical devices 37 and 47, respectively, it is possible to prevent occurrence of mistakes and deterioration of quality.

  Further, wire bonding was used for electrical connection between electrodes of the chip and the substrate. Alternatively, other connection methods may be used. For example, the chip may be flip-chip bonded so as to emit or receive light through an opening provided in the substrate.

  Moreover, the molded object 19 and the intermediate bodies 36 and 46 were each cut | disconnected using the rotary blade 22. FIG. However, the present invention is not limited to this, and laser cutting (melting), cutting with a wire saw or the like may be used.

  Further, the lens member 25 is arranged so as to be convex toward the outside of the optical device. Not limited to this, the lens member 25 may be arranged so as to be convex on the inner side of the optical device. In addition, the lens member 25 may have a shape that is convex on both sides, or may have a shape having a convex lens-shaped light transmitting portion and a light reflecting wall provided around the convex portion. About these points, it is the same also in the molded object 19 of Example 1, and the whole member for sealing in the writing of Example 2.

  Further, for example, when a lens member is not required as in a certain type of light receiving element or the like, a flat plate member may be used as the translucent member. Alternatively, a flat molded body may be molded in a lump and bonded to the entire protective member to form an intermediate body, and then the intermediate body may be separated to complete an individual optical device (see FIG. 3 (3), (4)). Furthermore, it is good also as replacing with the lens member 50 shown by FIG. 4 and having a flat member. In these cases, the flat plate member corresponds to the translucent member according to the present invention.

  The present invention can also be applied when the optical device has a light receiving element or when the optical device has both a light emitting element and a light receiving element.

  Further, the present invention is not limited to the above-described first and second embodiments, and can be arbitrarily combined, changed, or selected as necessary within the scope not departing from the gist of the present invention. Can be adopted.

1 Lead frame (substrate)
2 Upper surface 3 LED chip (chip)
4 Wire 5 Lower surface 6, 39 Protection member 7 Recessed portion 8, 31 Semi-finished product 9 Lens member 10 Translucent portion 11, 24, 49 Flange portion (communication portion)
12 Semi-finished product with lens 13, 40 Lower mold 14, 41 Upper mold 15, 42 Cavity 16, 43 Resin material 17, 44 Flowable resin 18 Cured resin 19 Molded body (entire member for sealing)
20 Dicing sheet 21 Stage 22 Rotary blade 23 Dicing line 25, 50 Lens member (translucent member, sealing member)
26 Double-sided adhesive sheet 27 Base material 28 Temporary adhesive layer 29 Main adhesive layer 30 Adsorption holder 32 Region 33 Overall substrate 34 Overall member for protection 35 Adhesive sheet 36, 46 Intermediate 37, 47 Optical device 38 Substrate 45 Molded body (sealing) For the whole material)
48 Translucent part

Claims (10)

A substrate, a chip made of an optical element mounted on a first surface of the substrate, a protection member provided on the first surface for the purpose of protecting the chip, and a purpose of sealing the chip A production method of an optical device comprising a translucent sealing member provided on the first surface,
Preparing an entire substrate having regions formed in a lattice shape so as to correspond to each of the substrates separated by a virtually provided dicing line;
Attaching the chip to each of the regions;
Electrically connecting electrodes each of the chip and the substrate by wire bonding or flip chip bonding;
The entire protective member having the protective member provided in each of the regions is collectively formed by transfer molding so that the protective members are connected to each other in all the dicing lines in each of the adjacent regions. Molding process;
Fixing the entire substrate with the protective whole member to one of the molds composed of an upper mold and a lower mold facing each other;
In the entire substrate with the protective whole member, the whole sealing member having a plurality of the sealing members is collectively formed by compression molding so as to cover all the regions in each of the regions. Process,
And a step of separating the intermediate formed by the step of collectively molding the whole sealing member into the region units,
Performing the step of mounting the chip after the step of collectively forming the entire protective member,
The step of collectively molding the whole sealing member,
Opening the mold, and
A step of making one of the molds opened by the mold filled with a fluid resin; and
Immersing the chip in a flowable resin in the cavity;
Forming the sealing whole member made of the cured resin by curing the flowable resin in the cavity in a state in which the mold is clamped and collectively molding the cured resin;
Cover the chip with the cured resin without gaps,
The protective member has a function of reflecting light emitted from the chip,
In the electrical connection step, electrical connection between the electrodes each of the chip and the substrate is performed in a portion corresponding to the inside of the protective member in plan view,
In the step of immersing, in the cavity, each of the light-transmitting portion spaces corresponding to the light-transmitting portion functioning as a lens in the optical device, and the entire area in a plan view around the light-transmitting portion space. Each of the communication spaces that are formed and communicate with each other for the light-transmitting portions is filled with the fluid resin,
In the step of collectively molding the whole sealing member, the light transmitting portion made of the cured resin cured in each of the light transmitting portion spaces and the cured resin cured in each of the communicating spaces. A method for producing an optical device, comprising forming a communicating portion. A substrate, a chip made of an optical element mounted on a first surface of the substrate, a protection member provided on the first surface for the purpose of protecting the chip, and a purpose of sealing the chip A production method of an optical device comprising a translucent sealing member provided on the first surface,
Preparing an entire substrate having regions formed in a lattice shape so as to correspond to each of the substrates separated by a virtually provided dicing line;
Attaching the chip to each of the regions;
Electrically connecting electrodes each of the chip and the substrate by wire bonding or flip chip bonding;
The entire protective member having the protective member provided in each of the regions is collectively formed by transfer molding so that the protective members are connected to each other in all the dicing lines in each of the adjacent regions. Molding process;
In the whole substrate with the whole protective member, a step of collectively providing a whole sealing member having a plurality of the sealing members so as to cover all the regions in each of the regions;
And a step of separating the intermediate formed by the step of providing the whole sealing member collectively into each region unit,
Performing the step of mounting the chip after the step of collectively forming the entire protective member,
In the step of collectively providing the whole sealing member, the translucent portion made of the curable resin and functioning as a lens in each of the regions and the entire range of the transmissive portion around the translucent portion made of the curable resin. The overall member for sealing that is integrally formed in advance by transfer molding to the top surface of the overall member for protection,
The protective member has a function of reflecting light emitted from the chip,
In the electrical connection step, the electrical connection between the electrodes of the chip and the substrate is performed in a portion corresponding to the inside of the protective member in plan view. Production method. A substrate, a chip made of an optical element mounted on a first surface of the substrate, a protection member provided on the first surface for the purpose of protecting the chip, and a purpose of sealing the chip A production method of an optical device comprising a translucent sealing member provided on the first surface,
Preparing an entire substrate having regions formed in a lattice shape so as to correspond to each of the substrates separated by a virtually provided dicing line;
Attaching the chip to each of the regions;
Electrically connecting electrodes each of the chip and the substrate by wire bonding or flip chip bonding;
The entire protective member having the protective member provided in each of the regions is collectively formed by transfer molding so that the protective members are connected to each other in all the dicing lines in each of the adjacent regions. Molding process;
In the whole substrate with the whole protective member, a step of collectively providing a whole sealing member having a plurality of the sealing members so as to cover all the regions in each of the regions;
And a step of separating the intermediate formed by the step of providing the whole sealing member collectively into each region unit,
Performing the step of mounting the chip after the step of collectively forming the entire protective member,
In the step of collectively providing the whole sealing member, the translucent portion made of the curable resin and functioning as a lens in each of the regions and the entire range of the transmissive portion around the translucent portion made of the curable resin. The entire sealing member formed integrally in advance by compression molding to the top surface of the entire protecting member,
The protective member has a function of reflecting light emitted from the chip,
In the electrical connection step, the electrical connection between the electrodes of the chip and the substrate is performed in a portion corresponding to the inside of the protective member in plan view. Production method. In the production method of the optical device according to any one of claims 1 to 3,
In the step of providing the whole protective member, the whole protective member is provided so that the protective member can surround the chip to be mounted in each of the regions. Method. In the method for producing an optical device according to any one of claims 1 to 4,
The method for producing an optical device according to claim 1, wherein an upper surface of the chip is positioned lower than an upper surface of the protective member in each of the regions. In the method for producing an optical device according to any one of claims 1 to 5,
The substrate has at least a bonding electrode provided on the first surface and an external electrode provided on a second surface opposite to the first surface. Production method. In the method for producing an optical device according to any one of claims 1 to 6,
In the separating step, the intermediate body is separated into the optical device by using any one of a rotary blade, a laser beam, and a wire saw. In the method for producing an optical device according to any one of claims 1 to 6,
A method for producing an optical device comprising the step of handling the optical device by sandwiching a side surface of the optical device after the separating step. In the method for producing an optical device according to any one of claims 1 to 6,
The method for producing an optical device, wherein the entire substrate is a printed circuit board. In the method for producing an optical device according to any one of claims 1 to 6,
The method for producing an optical device, wherein the chip is an LED chip.

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