JP2012096286A - Laser irradiation apparatus, laser irradiation method, and insulating film forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a resist pattern with high quality.SOLUTION: The laser irradiation apparatus includes: a laser light source emitting a pulsed laser beam; a stage for holding a substrate; a coating apparatus for coating a resist material on the substrate held by the stage; a first propagation optical system for collecting and propagating the pulsed layer beam emitted from the laser light source onto the resist material coated by the coating apparatus and curing the resist material in a propagation position; a second propagation optical system for propagating the pulsed laser beam emitted from the laser light source onto the resist material cured by the pulsed laser beam propagated by the first propagation optical system and removing the resist material in the propagation position; and an optical path switching apparatus for making the pulsed laser beam emitted from the laser light source selectively incident on the first propagation optical system or the second propagation optical system.

Description

  The present invention relates to an apparatus and a method for irradiating a laser beam, and an apparatus for forming an insulating film.

  Solder resist is a circuit board that exposes the necessary conductor (copper foil) for soldering a printed wiring board with conductor wiring formed on the base material, and prevents solder from attaching to the parts that do not require soldering. It is an insulating film formed on top.

  As a method for forming a solder resist pattern on a printed wiring board, for example, the following methods are known. First, the printed wiring board is polished in order to improve the adhesion of the solder resist. Next, a resist material is applied to the entire surface of the wiring board, and the solvent is evaporated (temporary drying). And after exposing through a mask and hardening the resist of the exposed part, an unexposed part is removed by image development. Further, heat is applied to cure the resist (heat drying). In this specification, for the sake of convenience, this solder resist forming method will be referred to as a whole surface coating method. When a printed wiring board is produced using the whole surface coating method, a wiring board having a defect in the solder resist pattern portion is discarded.

  Also, a method for forming a solder resist pattern in which a resist material (ink) is applied only to a resist pattern formation region and its vicinity using, for example, an ink jet printer and cured is also known (see, for example, Patent Document 1). This forming method is referred to as a partial coating method. Compared with the full surface coating method, the partial coating method can achieve a significant reduction in the number of steps and greening.

  However, the amount of ink droplets used in the partial coating method is a few picoliters at the minimum, and the size when the ink droplets land on the printed wiring board is, for example, 40 μm to 50 μm in diameter as shown in FIG. It becomes. Therefore, when the solder resist pattern is formed with this landing-size ink, the pad (land) opening diameter is limited to about 200 μm when the surface mounting component is mounted on the printed wiring board, and the opening diameter of about 50 μm required for the package substrate is As shown in FIG. 10B, it is difficult to realize due to the deterioration of roundness. For this reason, practical application of the partial coating method is difficult, and super-ink jets with an ink discharge amount of femtoliter order are currently being developed mainly by the National Institute of Advanced Industrial Science and Technology. .

JP-A-7-263845

  An object of the present invention is to provide a laser irradiation apparatus and a laser irradiation method capable of forming a resist pattern with high quality.

  It is another object of the present invention to provide an insulating film forming apparatus capable of forming an insulating film pattern having no defect.

  According to one aspect of the present invention, a laser light source that emits a pulsed laser beam, a stage that holds a substrate, a coating apparatus that applies a resist material onto the substrate held on the stage, and a pulse that emits the laser light source A first propagation optical system for condensing and propagating a laser beam on the resist material applied by the coating apparatus and curing the resist material at a propagation position, and a pulse laser beam emitted from the laser light source A second propagation optical system that propagates on the resist material cured by the pulsed laser beam propagated by the first propagation optical system and removes the resist material at the propagation position; and the laser light source is emitted. An optical path switching device that selectively makes a pulse laser beam incident on the first propagation optical system or the second propagation optical system. Laser irradiation apparatus is provided.

  According to another aspect of the present invention, a laser light source that emits a pulsed laser beam, a stage that holds a substrate, a coating apparatus that applies a resist material onto the substrate held on the stage, and the laser light source include: A propagation optical system that condenses and propagates the emitted pulsed laser beam on the resist material, and the resist material applied by the coating apparatus by the pulsed laser beam propagated by the propagation optical system. A laser irradiation apparatus is provided that performs curing and partial removal of the cured resist material.

  Furthermore, according to another aspect of the present invention, a laser light source that emits a pulsed laser beam, a stage that holds a substrate, a coating apparatus that applies a resist material onto the substrate held on the stage, and the coating apparatus A curing light source that emits light for curing the resist material applied on the substrate and a pulse laser beam emitted from the laser light source are propagated to the resist material that is cured by the light emitted from the curing light source. There is provided a laser irradiation apparatus having a propagation optical system for removing the resist material at the propagation position.

  According to another aspect of the present invention, a laser light source that emits a pulse laser beam, a stage that holds a processing object on which a resist is formed, and a pulse laser beam that is emitted from the laser light source are converted into the processing object. A first propagation optical system that propagates onto the resist and removes the resist at the propagation position, a coating device that applies a resist material onto the workpiece held on the stage, and a pulse emitted from the laser light source A second propagation optical system for condensing and propagating a laser beam on the resist material applied by the coating apparatus and curing the resist material at a propagation position; and a pulsed laser beam emitted from the laser light source. There is provided a laser irradiation apparatus having an optical path switching device that selectively enters the first propagation optical system or the second propagation optical system.

  Furthermore, according to another aspect of the present invention, a laser light source that emits a pulsed laser beam, a stage that holds a processing object on which a resist is formed, and a resist material is applied on the processing object that is held on the stage And a propagating optical system for condensing and propagating the pulse laser beam emitted from the laser light source onto the workpiece held on the stage, the pulse propagating by the propagating optical system Laser irradiation for performing at least one of (i) partial removal of the resist formed on the processing object and (ii) curing of the resist material applied on the processing object by the coating apparatus by the laser beam. An apparatus is provided.

  According to another aspect of the present invention, a laser light source that emits a pulsed laser beam, a stage that holds a processing object on which a resist is formed, and a resist that is formed on the processing object include the laser light source A propagation optical system that propagates the pulse laser beam emitted from the substrate and removes the resist at the propagation position, a coating apparatus that applies a resist material onto the processing object held on the stage, and the processing object by the coating apparatus There is provided a laser irradiation apparatus having a curing light source that emits light for curing a resist material applied thereon.

  Further, according to another aspect of the present invention, (a) a step of applying a resist material on a substrate, (b) a step of curing the applied resist material, and (c) curing in the step (b). And a step of patterning by removing the resist material at the incident position, and applying a laser beam to the resist material.

  According to another aspect of the present invention, (a) a process object on which a resist is formed, the process object having a defect in the resist portion, and (b) on the process object. A step of removing the resist at the incident position by causing a laser beam to enter the defective portion of the formed resist, or (c) applying a resist material to the defective portion due to non-formation of the resist, and then focusing the focused laser beam There is provided a laser irradiation method including at least one of a step of forming a resist by irradiation and curing.

  Furthermore, according to another aspect of the present invention, an insulating material is applied on a substrate, an insulating film is formed on a coating apparatus, and whether or not the insulating film is properly formed by the coating apparatus is inspected. An inspection apparatus that detects a position where the insulating film is not properly formed; and a repair apparatus that detects a position where the insulating film is not properly formed, which is detected by the inspection apparatus. An insulating film forming apparatus is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the laser irradiation apparatus and laser irradiation method which can form a resist pattern with high quality can be provided.

  Further, it is possible to provide an insulating film forming apparatus capable of forming an insulating film pattern having no defect.

It is the schematic which shows the laser irradiation apparatus by a 1st Example. It is a top view which shows the land formed in the circular shape of diameter 50 micrometers. (A)-(C) are schematic which shows the laser irradiation apparatus by a 2nd Example. It is the schematic which shows the modification of the laser irradiation apparatus by 2nd Example. It is the schematic which shows the laser irradiation apparatus by a 3rd Example. (A) And (B) is a schematic top view of the printed wiring board 60 which shows the irradiation position of a laser beam. It is the schematic which shows the other example of the laser irradiation method performed using the laser irradiation apparatus by a 3rd Example. (A) And (B) is the schematic which shows the laser irradiation apparatus by the 4th Example. It is process drawing shown about the outline of the defect part repair (repair) of the soldering resist pattern of a printed wiring board. (A) And (B) is the schematic which shows the problem of a prior art. (A) is a schematic plan view showing an example of a printed wiring board 60 having a defective portion in a solder resist pattern, and (B) shows an example of coordinates defined corresponding to the printed wiring board 60. (C) is a schematic plan view showing a resist adhesion state in the region 60A. It is a top view which shows the outline of the insulating film formation system (solder resist formation apparatus) by an Example.

  FIG. 1 is a schematic view showing a laser irradiation apparatus according to the first embodiment. The laser irradiation apparatus according to the first embodiment includes a laser light source 21, a mask 22, a folding mirror 23, a galvano scanner 24, an fθ lens 25, a control device 30, an inkjet printer 40, a lamp light source 45, and a stage 50. The

  Control device 30 includes a storage device 30a which is a memory, for example. The stage 50 includes a chuck plate 50a for attracting and holding a printed wiring board (substrate) 60, which is an object to be held, and can move the printed wiring board 60 in the in-plane direction. The stage 50 is, for example, an XYθ stage. Using the laser irradiation apparatus according to the first embodiment, a solder resist pattern is formed on the printed wiring board 60 held on the stage 50 by using a partial coating method.

  The stage 50 moves the printed wiring board 60 in the X axis positive direction at a constant speed. The ink jet printer 40 applies an ultraviolet curable ink (resist material) 41 to a part of the printed wiring board 60 (a predetermined region on the printed wiring board 60).

  The storage device 30a stores data (gerber data) such as a region where a solder resist is to be formed and a position where a land is to be formed on the printed wiring board 60. The control device 30 emits (discharges) the ink 41 by the ink jet printer 40 and performs wiring by the stage 50 so that the ink 41 is applied to a predetermined area on the printed wiring board 60 based on the stored contents of the storage device 30a. The movement of the plate 60 is controlled. Here, the predetermined area is, for example, an area including a position where a resist is to be formed and a position where a land is to be formed.

  The lamp light source 45 is arranged in the direction in which the wiring board 60 is moved with reference to the position where the ink 41 is applied to the printed wiring board 60. The lamp light source 45 emits diffusing ultraviolet light, and cures the ink 41 applied on the printed wiring board 60. An outline of the solder resist pattern is formed in a predetermined region of the printed wiring board 60 by the cured ink 41. The thickness of the ink 41 is, for example, 20 μm to 30 μm.

  The laser light source 21 includes, for example, an Nd: YAG laser oscillator and a nonlinear optical crystal, and a pulse laser beam (ultraviolet) that is a third harmonic (wavelength 355 nm) of the Nd: YAG laser in accordance with a control signal supplied from the control device 30. Light). The oscillation frequency is, for example, 10 kHz to 100 kHz. Using a laser beam emitted from the laser light source 21, patterning such as land formation is performed on the outline of the solder resist pattern (ink 41).

  The laser beam has a light-transmitting region and a light-shielding region, and is incident on a mask 22 that shapes the cross-sectional shape of the laser beam in the shape of the light-transmitting region. The translucent region of the mask 22 is, for example, circular. The laser beam transmitted through the light transmitting region of the mask 22 is reflected by the folding mirror 23 and enters the galvano scanner 24. The galvano scanner 24 includes two oscillating mirrors, and changes the emission direction of the incident laser beam in a two-dimensional direction for emission.

  The laser beam emitted from the galvano scanner 24 is condensed by the fθ lens 25 and irradiated onto the ink 41. The fθ lens 25 transfers the shape of the translucent area of the mask 22 onto the ink 41. The laser beam forms, for example, a circular incident region having a diameter of 50 μm, is incident on the ink 41, and the ink 41 at the incident position is removed by ablation.

  The emission direction of the laser beam emitted from the galvano scanner 24 and the incident position on the ink 41 are controlled by the control device 30. Based on the data on the position where the land is to be formed, which is stored in the storage device 30a, the control device 30 galvanometers so that the laser beam is incident on a predetermined position on the printed wiring board 60 and the land is formed. The operations of the scanner 24 and the stage 50 are controlled.

  A plurality of shots of laser pulses are continuously irradiated at the same position on the ink 41 to form a circular hole penetrating the ink 41 layer. On the bottom surface of the hole, the copper foil under the ink 41 is exposed in a circular shape having a diameter of 50 μm, and a land is formed. FIG. 2 shows a plan view of lands (laser beam incident area, ink 41 removal area) formed in a circular shape having a diameter of 50 μm.

  Laser beam irradiation is performed with the stage 50 stopped. When lands are formed at a plurality of predetermined positions in the beam scanning range of the galvano scanner 24, the printed wiring board 60 is moved by the stage 50, and lands are formed at different positions on the printed wiring board 60.

The pulse energy density of the laser beam incident on the ink 41 is not less than the value at which the cured ink 41 is removed and less than the value at which copper is processed (ablated), for example, 1 J / cm ² .

  When the laser irradiation apparatus according to the first embodiment is used, high-precision and high-resolution patterning such as forming a land having an opening diameter of 50 μm is performed by irradiating the ink 41 applied to the land formation position with a laser beam. It can be carried out. For example, the resist pattern can be formed with a resolution higher than the resolution of the ink droplets ejected from the inkjet printer 40. For this reason, it becomes possible to form a solder resist pattern with high quality. In addition, since the galvano scanner 24 scans the laser beam, high-speed processing can be realized.

  In the embodiment, the ink 41 is applied to a predetermined region on the printed wiring board 60 and cured, and after the outline of the solder resist pattern is formed on the entire printed wiring board 60, the laser beam is irradiated to irradiate the irradiation position. The ink 41 is removed to form a land, but the laser beam irradiation can be performed in parallel with the application and curing of the ink 41. That is, after forming the outline of the resist pattern in a part of the printed wiring board 60, a land can be formed in that part. In addition, a laser beam having a wavelength other than the ultraviolet region, such as a second harmonic of an Nd: YAG laser, can be used.

  3A to 3C are schematic views showing a laser irradiation apparatus according to the second embodiment. In the first embodiment, the ink 41 applied on the printed wiring board 60 is cured using the lamp light source 45, but in the second embodiment, the laser beam emitted from the laser light source 21 is used. Do.

  The laser irradiation apparatus according to the second embodiment includes an optical path switching device 26, a homogenizer 27, and a folding mirror 28. The optical path switching device 26 includes folding mirrors 26a and 26b.

Reference is made to FIG. The homogenizer 27 condenses the laser beam (third harmonic of the Nd: YAG laser having a wavelength of 355 nm) emitted from the laser light source 21 on the ink 41 applied to a predetermined region on the printed wiring board 60 by the inkjet printer 40. To do. Further, the shape of the beam incident area on the ink 41 is shaped into, for example, a rectangular shape having a major axis direction (Y-axis direction in the drawing) of 30 mm and a minor axis direction (X-axis direction in the drawing) of 0.1 mm, and a laser in the incident area. Uniform beam intensity. The pulsed laser beam is applied to the printed wiring board 60 from a direction perpendicular to the printed wiring board 60, for example, with a pulse energy density of 20 mJ / cm ² and an overlapping rate of 20% in the minor axis direction. The ink 41 at the position irradiated with the laser beam is cured. The stage 50 applies the ink 41 by the inkjet printer 40 and irradiates the laser beam via the homogenizer 27 while moving the printed wiring board 60 in the positive direction of the X axis at a constant speed. An outline of the solder resist pattern is formed.

  FIG. 3B is a schematic plan view showing the relationship between the laser beam incident area and the ink 41 application position.

  Inkjet nozzles (ink ejection portions, ink ejection portions) of the inkjet printer 40 are arranged along the Y-axis direction. The incident position of the laser beam and the application position of the ink 41 are separated by 20 mm to 30 mm in the X-axis direction. The length of the laser beam incident area in the major axis direction (Y axis direction) is equal to or longer than the length along the Y axis direction of the area where the ink 41 is applied (the length in the nozzle arrangement direction). Somewhat long.

  Reference is made to FIG. After the outline of the solder resist pattern is formed on the entire printed wiring board 60, a laser beam is irradiated to a predetermined position on the printed wiring board 60 based on the data on the position where the land is to be stored, which is stored in the storage device 30a. To form a land.

  The folding mirror 26 a can be attached and detached on the optical path of the laser beam between the laser light source 21 and the homogenizer 27. When the folding mirror 26a is not disposed on the optical path, the laser beam is incident on the ink 41 through the homogenizer 27 as shown in FIG. 3A, and the ink 41 at the incident position is cured. When the folding mirror 26a is arranged on the optical path, the laser beam is sequentially reflected by the folding mirrors 26a and 26b and enters the mask 22 as shown in FIG. The folding mirror 26b is a fixed mirror that emits the laser light source 21 and receives the laser beam reflected by the folding mirror 26a when the folding mirror 26a is disposed on the optical path of the laser beam. Control of switching of the optical path of the laser beam by the optical path switching device 26 (attachment / detachment of the folding mirror 26a to / from the optical path) is performed by the control device 30.

  The course and action of the laser beam after exiting the mask 22 are the same as in the first embodiment shown in FIG. The laser beam is scanned by the galvano scanner 24 to form, for example, a circular incident region having a diameter of 50 μm, and is incident on the ink 41 applied and cured on the printed wiring board 60. By removing by ablation, the copper foil of the printed wiring board 60 is exposed and a land is formed.

The laser beam has a relatively small pulse energy density (for example, 20 mJ / cm ² ) when the ink 41 is cured, and a relatively large pulse energy density (for example, 1 J / cm) when the cured ink 41 is removed. cm ² ) to be incident on the ink 41.

  The laser irradiation apparatus according to the second embodiment may include a condenser lens on the optical path of the laser beam between the homogenizer 27 and the ink 41. The optical path can be switched using an acousto-optic element or a galvanometer mirror.

  The laser irradiation apparatus according to the second embodiment uses a laser beam emitted from the laser light source 21 for both curing of the applied ink 41 and removal of the cured ink 41 (patterning such as land formation). Do it. For this reason, in addition to the effect which 1st Example has, the lamp light source 45 is unnecessary.

  Further, the laser irradiation apparatus according to the second embodiment irradiates the ink 41 with a focused laser beam (converged light) instead of the diffused light emitted from the lamp light source 45 and cures it. Nozzle clogging caused by the reflected laser beam entering the nozzles of the inkjet printer 40 can be prevented.

  In the second embodiment, the laser beam that has passed through the homogenizer 27 is incident from a direction perpendicular to the printed wiring board 60. The laser beam is preferably incident in a direction that does not face the application position of the ink 41 (nozzle placement position of the ink jet printer 40). For example, in the embodiment shown in FIG. 3B, it is preferable that the laser beam is incident so as not to have a component in the negative X-axis direction.

  FIG. 4 is a schematic view showing a modification of the laser irradiation apparatus according to the second embodiment. The modification differs from the second embodiment in that a light guard member 40a having a light shielding function is provided in the nozzle portion of the inkjet printer 40. The light guard member 40 a is installed in a direction facing the incident position of the laser beam via the homogenizer 27. Since the laser irradiation apparatus according to the modification includes the light guard member 40a, the laser beam for curing the ink 41 applied to the printed wiring board 60 is incident in the direction toward the application position of the ink 41. However, the laser beam is prevented from entering the nozzle and nozzle clogging does not occur.

  Furthermore, the light guard member 40a may be installed in a direction facing the incident position of the laser beam via the galvano scanner 24. By installing at least one of the incident position of the laser beam via the homogenizer 27 and the incident position of the laser beam via the galvano scanner 24, an effect of preventing nozzle clogging can be achieved.

  FIG. 5 is a schematic view showing a laser irradiation apparatus according to the third embodiment. The third embodiment is different from the second embodiment in that a laser beam for curing the ink 41 is scanned in a two-dimensional direction and incident on the ink 41.

  In the third embodiment, when the folding mirror 26a is not disposed on the beam optical path, the laser beam emitted from the laser light source 21 has a translucent area and a light-shielding area, and has a cross-sectional shape of the laser beam in the shape of the translucent area. Is incident on a mask 31 for shaping The translucent region of the mask 31 is, for example, a square shape. The laser beam that has passed through the light-transmitting region of the mask 31 is reflected by the folding mirror 32, condensed by the condenser lens 33, and enters the galvano scanner 34. The galvano scanner 34 changes the emission direction of the incident laser beam in a two-dimensional direction and emits it. The laser beam emitted from the galvano scanner 34 is scanned on the printed wiring board 60 to cure the ink 41 at the laser beam incident position. The emission direction of the laser beam emitted from the galvano scanner 34 and the incident position on the printed wiring board 60 are controlled by the control device 30.

  6A and 6B are schematic plan views of the printed wiring board 60 showing the irradiation position of the laser beam. As shown in FIG. 6A, the shape of the translucent area of the mask 31 is transferred by the condenser lens 33, and the laser beam forms a square-shaped incident area with a side of 2 mm, for example, on the printed wiring board 60. It is incident on the applied ink 41. The laser beam is scanned by the galvano scanner 34 on the printed wiring board 60 in the direction of the arrow, for example, so that the overlapping rate is 20%. The arrow direction is a direction that forms an angle θ clockwise with respect to the Y-axis negative direction. By providing the angle θ, as shown in FIG. 6B, the irradiation region of the laser beam is orthogonal to the constant speed movement direction (X-axis positive direction) of the printed wiring board 60 by the stage 50. Laser beam scanning is performed in such a manner that the irradiation area of the laser beam extending in the Y-axis direction on the printed wiring board 60 in the direction that forms an angle θ clockwise with respect to the negative Y-axis direction is 20% in the X-axis direction Repeated to form at the overlap rate. By irradiating the laser beam, the applied ink 41 is cured, and an outline of the solder resist pattern is formed.

  After the outline of the solder resist pattern is formed on the entire printed wiring board 60, the control device 30 places the folding mirror 26a on the beam optical path to switch the optical path, and the land is formed by the operation of the galvano scanner 24.

  The laser irradiation apparatus according to the third embodiment can be configured not to use the mask 31. In this case, the laser beam for curing the ink is incident on the ink 41 by forming a circular incident region having a diameter of 2 mm, for example.

  FIG. 7 is a schematic view showing another example of a laser irradiation method performed using the laser irradiation apparatus according to the third embodiment.

  The stage 50 holds the printed wiring board 60 and moves it in the positive direction of the X axis. The ink jet printer 40 applies the ink 41 to a predetermined area on the printed wiring board 60. The controller 30 prints the printed wiring board 60 on the basis of the data (position data on the printed wiring board 60 on which the ink 41 is to be applied) stored in the storage device 30a. The ejection (ejection) of the ink 41 by the inkjet printer 40 and the movement of the wiring board 60 by the stage 50 are controlled so that the ink 41 is applied to the upper predetermined region. Further, the control device 30 operates the galvano scanner 34 and the stage 50 based on the data stored in the storage device 30a so that the laser beam is incident on the area on the printed wiring board 60 where the ink 41 is applied. Control. In this case, for example, the stage 50 may move the printed wiring board 60 at a predetermined constant speed when the application area of the ink 41 is on the scanning line of the laser beam, and at the maximum possible speed when there is not.

  The laser beam is radiated onto the ink 41 by the galvano scanner 34 and scanned so as not to irradiate the printed wiring board 60 to which the ink 41 is not applied. The ink 41 at the position irradiated with the laser beam is cured.

  After the curing of the ink 41 applied to a predetermined area of the printed wiring board 60 is completed and the outline of the solder resist pattern is formed on the entire printed wiring board 60, the control device 30 places the folding mirror 26a on the beam optical path. Then, the optical path is switched, and the land is formed by the operation of the galvano scanner 24.

  In this example, the operations of the galvano scanner 34 and the stage 50 are controlled, and the laser beam is incident on the area where the ink 41 is applied. This is performed by controlling the operation of either the galvano scanner 34 or the stage 50. It is also possible.

  According to the laser irradiation method of this example, resist pattern formation can be performed at high speed and with high energy efficiency. Moreover, since the ink 41 non-application part of the printed wiring board 60 is formed, for example with copper foil, the absorption factor of the light of an ultraviolet region is high. Therefore, it is possible to prevent deterioration of the non-coated portion due to irradiation of the laser beam for curing the ink 41 and improve the processing quality. Further, when the ink 41 is cured, the ink 41 is irradiated with a laser beam and absorbed, so that there is an effect of preventing the reflected light from entering the nozzles of the ink jet printer 40.

  Note that, by using a laser beam having a wavelength at which copper does not absorb energy, the quality of the non-coated portion can be maintained even when the laser beam is incident on the non-coated portion.

  FIGS. 8A and 8B are schematic views showing a laser irradiation apparatus according to the fourth embodiment. In the third embodiment, the optical path of the laser beam for curing the applied ink 41 and the optical path of the laser beam for removing the cured ink 41 by ablation are switched by the optical path switching device 26. In the embodiment, both when the ink 41 is cured and when it is removed, scanning is performed by the same galvano scanner 34 and the laser beam is incident on the ink 41. For this reason, the fourth embodiment does not include the optical path switching device 26, the mask 22, the folding mirror 23, the galvano scanner 24, and the fθ lens 25. On the other hand, an expander 35 and a field lens 36 are included.

  The expander 35 expands the beam diameter of the incident laser beam so that the expansion ratio is variable, and emits the beam. By changing the beam diameter, the energy density of the laser beam emitted from the expander 35 and the energy density of the laser beam incident on the ink 41 can be changed. The expansion ratio of the beam diameter of the expander 35 can be controlled by the control device 30.

  FIG. 8A shows a case where the applied ink 41 is cured by laser beam irradiation. The laser beam emitted from the laser light source 21 is expanded in beam diameter by the expander 35 and enters the mask 31. The translucent region of the mask 31 is, for example, a square shape. The laser beam that has passed through the light transmitting region of the mask 31 is reflected by the folding mirror 32, collected by the condenser lens 33, and the emission direction is changed to a two-dimensional direction by the galvano scanner 34. The ink 41 is scanned. The shape of the translucent area of the mask 31 is transferred onto the ink 41 by the condenser lens 33.

  The field lens 36 is detachable on the optical path of the laser beam between the mask 31 and the condenser lens 33. The control device 30 attaches / detaches the field lens 36 to / from the optical path. The field lens 36 and the condensing lens 33 constitute a transfer magnification changing optical system that transfers the shape of the translucent region of the mask 31 onto the ink 41 in a variable transfer magnification manner.

In an application for curing the ink 41, the field lens 36 is not disposed on the optical path of the laser beam between the mask 31 and the condenser lens 33. At this time, the laser beam is incident on the ink 41 by forming, for example, a square-shaped incident area (relatively large incident area) having a side of 2 mm. The pulse energy density at the incident surface is, for example, 20 mJ / cm ² (relatively small pulse energy density). The laser beam is scanned over the ink 41 in the manner or method described with reference to FIGS. 6A and 6B or FIG.

  FIG. 8B shows a case where the cured ink 41 is removed by laser beam irradiation. The laser beam emitted from the laser light source 21 is expanded in beam diameter by the expander 35 and enters the mask 31. The expansion ratio of the beam diameter is larger than when the ink 41 is cured. At this time, the energy density of the laser beam emitted from the expander 35 is smaller than when the ink 41 is cured.

The laser beam that has passed through the light-transmitting region of the mask 31 passes through the field lens 36, the folding mirror 32, and the condenser lens 33, and the emission direction is changed to a two-dimensional direction by the galvano scanner 34. Scan. The shape of the translucent area of the mask 31 is transferred onto the ink 41 by the field lens 36 and the condenser lens 33. Since the field lens 36 is arranged on the optical path of the laser beam, the transfer magnification is reduced (the reduction ratio is increased), and the laser beam is incident on a square-shaped incident area having a side of 0.1 mm (incident with a relatively small size). Region) is formed and incident on the ink 41, and the ink 41 at the incident position is removed by ablation. The pulse energy density at the incident surface is, for example, 1 J / cm ² (relatively high pulse energy density).

The control device 30 is configured so that the pulse energy density on the ink 41 when the field lens 36 is disposed on the optical path of the laser beam is 1 J / cm ^{2 and the} pulse energy density when the field lens 36 is not disposed is 20 mJ / cm ² . The attachment / detachment (transfer magnification) of the field lens 36 on the optical path and the expansion rate of the beam diameter by the expander 35 are controlled.

  The laser irradiation apparatus according to the fourth embodiment can reduce the number of optical members such as a galvano scanner.

  For example, it is possible to repair (repair) a defective portion of the printed wiring board using the laser irradiation apparatus according to the fourth embodiment.

  FIG. 9 is a process diagram illustrating an outline of defect repair (repair) of a solder resist pattern of a printed wiring board. The wiring board on which the solder resist pattern is formed by the whole surface coating method or the partial coating method is first subjected to an inspection process in step S101. If no defect is detected in the inspection process, the process ends without proceeding to the repair process.

  If a defect is detected, the process proceeds to step S102, and information on the detected defect, for example, the position and content of the defect, the repair content to be applied to the defect, and the like are stored in the storage device 30a of the control device 30, for example. (Defect information setting). Also, a printed wiring board in which defect information is set is prepared (defective wiring board preparation). The control device 30 controls the operation of each part of the laser irradiation device based on the stored contents of the storage device 30a, and repairs the defect of the solder resist pattern of the printed wiring board.

For example, if a resist is formed at an unnecessary or harmful position, or if a coating failure has occurred even when the resist is formed at an appropriate position, the process proceeds to step S103. First, the printed wiring board on which defect information is set is held on the stage 50, and the repaired portion (defect position) is moved to the scanning range of the galvano scanner 34. Then, the laser beam is irradiated, and the resist formed at unnecessary or harmful positions or defective coating positions is removed by ablation. When removing the resist, a field lens 36 is disposed on the optical path of the laser beam, and the beam diameter is adjusted by the expander 35 so that the laser beam is irradiated onto the resist with a pulse energy density of, for example, 1 J / cm ^2. adjust. For example, a laser beam whose beam incident area is a square having a side of 0.1 mm is scanned by the galvano scanner 34 to remove an unnecessary or harmful position or a resist at a poorly applied position.

  When the outer shape (contour) of the range of the resist to be removed is formed with a straight line, the incident region of the laser beam is a square, and when formed with a curve, the mask 31 having a circular light transmitting region is provided. By using and shaping the beam incident area into a circular shape, a higher quality restoration can be realized.

  If a resist is formed at an unnecessary or harmful position, the repair of that portion is completed.

  In the case of poor application, after removing the resist at the defective portion, the ink is reapplied to the position (step S104) and cured (step S105). Ink re-application is performed on the stage 50 by placing the repaired portion at the ink application position of the inkjet printer 40. The ink is cured by moving the reapplication position (restoration point) to the scanning range of the galvano scanner 34 on the stage 50 and irradiating the ink reapplication position with a pulse energy density smaller than that in the case of resist removal. .

When curing the ink, the field lens 36 is removed from the optical path of the laser beam, and the beam diameter is adjusted by the expander 35 so that the laser beam is irradiated onto the ink at a pulse energy density of 20 mJ / cm ^2. To do. For example, a laser beam whose beam incident area is a square having a side of 2 mm is scanned over the ink by the galvano scanner 34 to cure the reapplied ink.

If the defect content is, for example, no formation of a resist, the process proceeds from step S102 to step S106. Ink is applied to the non-formed portion (step S106) and cured (step S107) to form a resist. Ink application is performed by placing a resist non-formation portion on the ink application position of the inkjet printer 40 on the stage 50. The ink is cured by moving the ink application portion to the scanning range of the galvano scanner 34 on the stage 50 and irradiating the ink with a laser beam at 20 mJ / cm ² , for example.

  When all the defects of the printed wiring board to be repaired are repaired to be performed (step S108), the process returns to step S101 to perform re-inspection. If no defect is detected, the repair is completed, and if a defect is detected, the process proceeds to step S102 and the above process is repeated.

  The defective part of the printed wiring board can also be repaired by using a laser irradiation apparatus according to another embodiment. It is possible to repair a defective portion and form a resist pattern with high quality.

  In this case, for example, when the laser irradiation method described with reference to FIG. 7 is performed, the control device 30 is on the printed wiring board 60 on which the laser beam is incident based on the defect information stored in the storage device 30a. Control the position.

  FIG. 11A is a schematic plan view showing an example of a printed wiring board 60 having a defective portion in a solder resist pattern. A pattern to be drawn is defined on the printed wiring board 60. In FIG. 11A, a region to which the solder resist is to be attached is shown with hatching, and a region to which the solder resist is not attached is shown as white. The region where the solder resist is not attached is, for example, an inner region of a pattern such as a quadrangle, a circle, or a straight line having a certain width.

  FIG. 11B shows an example of coordinates defined corresponding to the printed wiring board 60. In the printed wiring board 60, for example, the X coordinate along the horizontal direction (row direction) of the wiring board 60 and the Y coordinate along the vertical direction (column direction) are defined by a plurality of pixels 60B arranged in a matrix. ing. In the figure, the coordinates of the area in the upper left pixel are represented by [X000, Y000].

  FIG. 11C is a schematic plan view showing a resist adhesion state in a region (a partial region of the printed wiring board 60) 60A in FIG. In this figure, the area where the solder resist is attached is hatched. A region where the resist is not attached despite the position where the resist is to be attached is shown as a resist non-formation portion 61. In addition, although the resist is not necessary or harmful, a region where the resist is adhered is shown as a resist unnecessary or harmful portion 62.

  FIG. 12 is a plan view schematically illustrating an insulating film forming system (solder resist forming apparatus) according to an embodiment. For example, a solder resist pattern having no defective portion can be formed on the printed wiring board 60 using the system shown in FIG. For example, even if the defect shown in FIG. 11C occurs in the step of applying the solder resist to the printed wiring board 60 on which the solder resist is not formed, the defective portion is repaired and the solder resist without the defect A pattern is formed.

  The insulating film forming system according to the embodiment includes an alignment device 70, a coating device 71, a first main curing device 72, an inspection device (inspection table) 73, a repair device 74, a second main curing device 75, an arm 76, and conveyors 77 and 78. , And a control device 79.

  The conveyor 77 is a conveying means for conveying the printed wiring board 60 on which the solder resist is not formed to the alignment device 70 from the outside of the system, and the conveyor 78 is a print in which the solder resist is appropriately applied from the inspection device 73 to the outside of the system. It is a transport means for transporting the wiring board 60. The arm 76 carries the printed wiring board 60 between the devices 70 to 75. The control device 79 controls the processing for the wiring board 60 in each of the devices 70 to 75 and the conveyance of the wiring board 60 by the arm 76 and the conveyors 77 and 78. The control device 79 includes a storage device 79a that is a memory, for example.

  The alignment device 70 detects the alignment mark formed on the surface of the printed wiring board 60 carried in by the conveyor 77, and aligns the printed wiring board 60 based on the detection result. The alignment apparatus 70 includes, for example, a CCD camera as a stage and an alignment mark detector. An alignment mark of the printed wiring board 60 placed on the stage is photographed by the CCD camera. Imaging by the CCD camera is controlled by the control device 79. Further, the image data (detection result) obtained by the CCD camera is transmitted to the control device 79.

  The control device 79 processes the image data acquired by the CCD camera, and grasps the position of the printed wiring board 60 and the posture (orientation) in the direction in the plane of the wiring board 60 (in the horizontal plane). The alignment device 70 corrects (changes) the posture of the printed wiring board 60 in the horizontal plane direction under the control of the control device 79 (θ correction).

  The printed wiring board 60 subjected to θ correction is conveyed by the arm 76 to the coating device 71 in a state in which the orientation in the horizontal plane direction after θ correction is maintained.

  The coating device 71 includes a stage that holds the printed wiring board 60 and a plurality of nozzles that discharge the insulating ink (resist material) as droplets toward the wiring board 60 that faces the stage and is held on the stage. The nozzle unit (inkjet printer 40) provided is included. The ink has, for example, ultraviolet curable properties. For example, ink is ejected onto the printed wiring board 60 by the coating device 71 toward a region shown by hatching in FIG. 11A (a region where a solder resist is to be attached), thereby forming a solder resist pattern. . The coating device 71 may include a light source that emits ultraviolet light. The solder resist applied on the printed wiring board 60 can be irradiated with ultraviolet light from a light source, and the solder resist can be temporarily cured.

  In addition, since θ correction is performed in the alignment apparatus 70, the coating apparatus 71 starts the process without performing θ correction.

  The printed wiring board 60 to which the solder resist is applied is conveyed to the first main curing device 72 by the arm 76. The first main curing device 72 includes a light source that emits ultraviolet light. The surface of the printed wiring board 60 on which the solder resist is applied is irradiated with ultraviolet light from a light source to perform the main curing of the solder resist. By the main curing, the solder resist of the printed wiring board 60 is solidified to the inside. In the main curing, the printed wiring board 60 is irradiated with ultraviolet light at a higher energy density than in the temporary curing. The temporary curing is a process for solidifying the surface region of the solder resist, for example, preventing diffusion, and the internal region of the solder resist is not completely solidified by the temporary curing.

  The printed wiring board 60 in which the applied solder resist is finally cured is conveyed from the first main curing device 72 to the inspection device (inspection table) 73 by the arm 76. The inspection device 73 inspects whether or not the solder resist is properly formed by the coating device 71 and detects a position where the solder resist is not properly formed.

  The inspection device 73 includes, for example, a stage that holds the printed wiring board 60, a detector that detects a defect of a solder resist applied on the printed wiring board 60, and a CCD camera as an example. The CCD camera photographs the solder resist on the printed wiring board 60 held on the stage. Imaging by the CCD camera is controlled by the control device 79. The captured image data (detection result) is transmitted to the control device 79.

  The control device 79 processes the image data acquired by the CCD camera, and determines the presence or absence of a defective portion in the formed solder resist pattern (for example, step S101 in FIG. 9). When no defective portion is detected, the printed wiring board 60 is carried out of the system from the inspection device 73 by the conveyor 78.

  When a defective portion is detected, the printed wiring board 60 is repaired (repaired) based on the detection result. The control device 79 sets defect information (for example, step S102 in FIG. 9). For example, when the defect shown in FIG. 11C is detected, the resist non-formation portion 61 is a region having a defect that application is not performed even though the resist is to be applied. The storage device 79a stores information that the application repair is performed. Further, the position of the resist non-formed portion 61 (the coordinates of the pixel 60B or the pixel 60B corresponding to the resist non-formed portion 61) is stored in the storage device 79a. Further, the resist unnecessary or harmful portion 62 is a region having a defect that the resist is applied even though the resist is unnecessary or harmful, and information that repair is performed to remove the resist. Is stored in the storage device 79a. Further, the position of the resist unnecessary or harmful place 62 (the coordinates of the pixel 60B or the pixel 60B corresponding to the resist unnecessary or harmful place 62) is stored in the storage device 79a.

  The printed wiring board 60 in which the defect information is set is conveyed from the inspection device 73 to the repair device 74 by the arm 76. The repair device 74 puts the position detected by the inspection device 73 where the solder resist is not properly formed into an appropriate state.

  The repair device 74 applies an ink to a position where the solder resist is to be formed but is not formed, and an application function for forming the solder resist, at least a position where the solder resist does not need to be formed (solder resist is removed). However, it has at least one, preferably both, of the removal function of removing the solder resist by irradiating the position where the solder resist is formed with a laser beam.

  The repair device 74 includes, for example, a coating device including a nozzle unit including a plurality of nozzles that discharge insulating ink as droplets toward the wiring board 60 in which defect information is set, and the wiring board in which defect information is set 60 includes a removing device that propagates the laser beam to 60 and removes the resist at the propagation point. It is good also as one apparatus provided with both the application | coating function and the removal function. In any case, since the area where ink is applied as a repair is narrower than the entire area where the solder resist is formed, the number of nozzles in the nozzle unit of the coating apparatus is not limited to the printed wiring board 60 where the solder resist is not formed. It is possible to make the number smaller than the number of nozzles of the coating device 71 that performs coating. The repair device 74 may be a device having only one of the application function and the removal function.

  Based on the set defect information (stored contents stored in the storage device 79a), ink is ejected toward the resist non-formation portion 61 by the application function of the repair device 74, and the resist is applied to the resist non-formation portion 61. (For example, step S106 in FIG. 9). Further, the removal function of the repair device 74 irradiates the laser beam to the resist unnecessary or harmful place 62, and the resist unnecessary or harmful place 62 is removed (for example, step S103 in FIG. 9).

  The printed wiring board 60 is conveyed from the repair device 74 to the second main curing device 75 by the arm 76. The second main curing device 75 includes a light source that irradiates ultraviolet light, and the printed wiring board 60 (the resist non-formation portion 61 after the resist is applied) is irradiated with ultraviolet light from the light source and applied solder. The resist is fully cured (for example, step S107 in FIG. 9).

  Thereafter, the printed wiring board 60 is conveyed from the second main curing device 75 to the inspection device 73 by the arm 76, and re-inspected whether or not the solder resist is properly applied (for example, step S101 in FIG. 9). When properly applied, the printed wiring board 60 is carried out of the system by the conveyor 78. If the proper application has not been performed, it is transported again to the repair device 74 to repair the inappropriate portion.

  If the repair content is only removal of the resist and does not include application of the resist, the repair content is transferred directly from the repair device 74 to the inspection device 73 without passing through the second main curing device 75. Further, when the second main curing device 75 is not provided and the resist is applied by the repair device 74, the printed wiring board 60 is transported to the first main curing device 72 and applied as a repair. The resist may be fully cured. Furthermore, it is possible to carry out the system by the conveyor 78 without performing re-inspection by the inspection device 73.

  The example shown in FIG. 9C did not include a defective coating, but when there is a defective coating, the printed wiring board 60 is transported from the inspection device 73 to the repairing device 74, and the defective coating portion is detected. After removing the resist (for example, step S103 in FIG. 9), the resist is applied (for example, step S104 in FIG. 9), and the second main curing device 75 performs main curing (for example, step S105 in FIG. 9) of the applied resist. Just do it.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto.

  For example, in the embodiment, ink is used as the resist material, but resin may be used.

  In the embodiment, the third harmonic of the Nd: YAG laser is used as the laser beam to be irradiated, but it is possible to use ultraviolet light emitted from another solid-state laser such as an Nd: YLF laser or a semiconductor laser. it can.

  Further, for example, the light guard member 40a may be provided in a laser irradiation apparatus according to another embodiment, not limited to the second embodiment. Further, the laser irradiation method performed using the laser irradiation apparatus according to all the embodiments is a direction in which the laser beam for curing the ink 41 and further the laser beam for removing the ink 41 (resist) are not directed to the application position of the ink 41. You may make it inject into.

  In the embodiment, the cured ink (resist) is removed by scanning the laser beam with a galvano scanner. However, it is also possible to remove the ink by moving the printed wiring board on the stage.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  For example, it can be used for forming a solder resist pattern.

21 Laser light source 22 Mask 23 Folding mirror 24 Galvano scanner 25 fθ lens 26 Optical path switching devices 26a and 26b Folding mirror 27 Homogenizer 28 Folding mirror 30 Control device 30a Storage device 31 Mask 32 Folding mirror 33 Condensing lens 34 Galvano scanner 35 Expander 36 Field lens 40 Inkjet printer 40a Light guard member 41 Ink 50 Stage 50a Chuck plate 60 Printed wiring board 60A Region 60B Pixel 61 Resist non-formation location 62 Resist unnecessary or harmful location 70 Alignment device 71 Coating device 72 First main curing device 73 Inspection device 74 Repair device 75 Second main curing device 76 Arm 77, 78 Conveyor 79 Control device 79a Storage device

Claims (45)

A laser light source for emitting a pulsed laser beam;
A stage for holding a substrate;
A coating apparatus for coating a resist material on the substrate held on the stage;
A first propagation optical system for condensing and propagating a pulsed laser beam emitted from the laser light source onto the resist material applied by the coating apparatus, and curing the resist material at a propagation position;
The second propagation that propagates the pulse laser beam emitted from the laser light source onto the resist material cured by the pulse laser beam propagated by the first propagation optical system and removes the resist material at the propagation position. Optical system,
A laser irradiation apparatus comprising: an optical path switching device that selectively makes the pulse laser beam emitted from the laser light source enter the first propagation optical system or the second propagation optical system.   The first propagation optical system propagates a pulse laser beam having a relatively low pulse energy density onto the resist material, and the second propagation optical system is cured with a pulse laser beam having a relatively high pulse energy density. The laser irradiation apparatus according to claim 1, which propagates on the resist material.   The laser irradiation apparatus according to claim 1, wherein the first propagation optical system includes a beam scanner that scans a pulse laser beam in a two-dimensional direction and propagates the pulse laser beam on the resist material. A controller for controlling a position on the substrate through which a pulsed laser beam scanned by the beam scanner is propagated;
A storage device for storing data of a region on the substrate on which the resist material is to be applied by the coating device;
The laser irradiation apparatus according to claim 3, wherein the control device controls a position on the substrate to which a pulse laser beam scanned by the beam scanner is propagated based on data stored in the storage device.   The coating apparatus is a light shielding member provided in a portion for discharging the resist material, and is provided in a direction facing at least one of the positions where the pulse laser beam is propagated by the first and second propagation optical systems. The laser irradiation apparatus of any one of Claims 1-4 provided with a member. A laser light source for emitting a pulsed laser beam;
A stage for holding a substrate;
A coating apparatus for coating a resist material on the substrate held on the stage;
A propagation laser system that condenses and propagates the pulse laser beam emitted from the laser light source on the resist material;
A laser irradiation apparatus that cures the resist material applied by the coating apparatus and partially removes the cured resist material by a pulsed laser beam propagated by the propagation optical system.   The laser irradiation apparatus according to claim 6, wherein the propagation optical system is capable of changing a size of an incident region of a pulse laser beam incident on the resist material and a pulse energy density. The propagation optical system is
An expander that radiates and expands the beam diameter of the incident laser beam in a variable magnification ratio;
A mask having a light-transmitting region, which is disposed at a position where a laser beam emitted from the expander is incident;
A transfer magnification changing optical system for transferring the shape of the light transmitting region of the mask onto the resist material in a variable manner.
And a control device for controlling the enlargement ratio of the expander and the transfer magnification of the transfer magnification changing optical system.
When the controller hardens the resist material, a laser beam forms a relatively large size incident region and is incident on the resist material at a relatively small pulse energy density. When removing the hardened resist material by controlling the enlargement factor and the transfer magnification of the transfer magnification changing optical system, the laser beam forms a relatively small size incident region and a relatively large pulse energy. The laser irradiation apparatus according to claim 7, wherein an enlargement ratio of the expander and a transfer magnification of the transfer magnification changing optical system are controlled so as to be incident on the resist material cured at a density. A laser light source for emitting a pulsed laser beam;
A stage for holding a substrate;
A coating apparatus for coating a resist material on the substrate held on the stage;
A curing light source that emits light for curing the resist material coated on the substrate by the coating device;
A laser irradiation apparatus comprising: a propagation optical system that propagates a pulse laser beam emitted from the laser light source to the resist material cured by light emitted from the curing light source and removes the resist material at a propagation position. A laser light source for emitting a pulsed laser beam;
A stage for holding a workpiece on which a resist is formed;
A first propagation optical system that propagates the pulse laser beam emitted from the laser light source onto the resist of the workpiece and removes the resist at the propagation position;
A coating apparatus for coating a resist material on the workpiece held on the stage;
A second propagation optical system for condensing and propagating the pulse laser beam emitted from the laser light source onto the resist material applied by the coating apparatus and curing the resist material at the propagation position;
A laser irradiation apparatus comprising: an optical path switching device that selectively makes the pulse laser beam emitted from the laser light source enter the first propagation optical system or the second propagation optical system. Furthermore, a storage device that stores information on resist defects of the processing object,
Based on resist defect information stored in the storage device, (i) removal of the resist with a pulsed laser beam propagated by the first propagation optical system, (ii) application of a resist material by the coating device, and The laser irradiation apparatus according to claim 10, wherein at least one of curing of the resist material is performed by a pulse laser beam propagated by the second propagation optical system.   The first propagation optical system propagates a pulse laser beam having a relatively large pulse energy density onto the resist, and the second propagation optical system transmits a pulse laser beam having a relatively small pulse energy density to the resist material. The laser irradiation apparatus according to claim 10, which propagates upward.   The laser irradiation apparatus according to claim 10, wherein the second propagation optical system includes a beam scanner that scans a pulse laser beam in a two-dimensional direction and propagates the pulse laser beam on the resist material. And a controller for controlling a position on the substrate through which a pulsed laser beam scanned by the beam scanner is propagated,
The laser irradiation according to claim 13, wherein the control device controls a position on the substrate to which a pulsed laser beam scanned by the beam scanner is propagated based on defect information stored in the storage device. apparatus.   The coating apparatus is a light shielding member provided in a portion for discharging the resist material, and is provided in a direction facing at least one of the positions where the pulse laser beam is propagated by the first and second propagation optical systems. The laser irradiation apparatus of any one of Claims 10-14 provided with a member. A laser light source for emitting a pulsed laser beam;
A stage for holding a workpiece on which a resist is formed;
A coating apparatus for coating a resist material on the workpiece held on the stage;
A propagation optical system for condensing and propagating a pulsed laser beam emitted from the laser light source onto a workpiece held on the stage;
(I) partial removal of the resist formed on the workpiece by the pulsed laser beam propagated by the propagation optical system, and (ii) a resist material applied on the workpiece by the coating apparatus. A laser irradiation apparatus that performs at least one of curing.   The laser irradiation apparatus according to claim 16, wherein the propagation optical system is capable of changing a size of an incident area of a pulse laser beam incident on the workpiece and a pulse energy density. Furthermore, a storage device that stores information on resist defects of the processing object,
(Ii) partial removal of the resist formed on the object to be processed by the laser beam propagated by the propagation optical system based on information on the defect of the resist stored in the storage device; The laser irradiation apparatus of Claim 16 or 17 which performs at least one of hardening of the resist material apply | coated on the said workpiece with a coating device. The propagation optical system is
An expander that radiates and expands the beam diameter of the incident laser beam in a variable magnification ratio;
A mask having a light-transmitting region, which is disposed at a position where a laser beam emitted from the expander is incident;
A transfer magnification changing optical system for transferring the shape of the light-transmitting region of the mask onto the object to be processed, with a variable transfer magnification,
And a control device for controlling the enlargement ratio of the expander and the transfer magnification of the transfer magnification changing optical system.
When the controller removes the resist formed on the workpiece, a laser beam forms an incident area of a relatively small size and enters the resist with a relatively large pulse energy density. As described above, when the expansion ratio of the expander and the transfer magnification of the transfer magnification changing optical system are controlled and the resist material applied on the workpiece is cured by the coating apparatus, the laser beam is relatively The enlargement ratio of the expander and the transfer magnification of the transfer magnification changing optical system are controlled so that a large-sized incident area is formed on the resist material and incident on the resist material with a relatively small pulse energy density. Or the laser irradiation apparatus of 18. A laser light source for emitting a pulsed laser beam;
A stage for holding a workpiece on which a resist is formed;
A propagation optical system that propagates the pulse laser beam emitted from the laser light source to the resist formed on the object to be processed, and removes the resist at the propagation position;
A coating apparatus for coating a resist material on the workpiece held on the stage;
A laser irradiation apparatus comprising: a curing light source that emits light for curing the resist material coated on the workpiece by the coating apparatus. Furthermore, a storage device that stores information on resist defects of the processing object,
Based on resist defect information stored in the storage device, (i) resist removal by a pulsed laser beam propagated by the propagation optical system, (ii) application of resist material by the coating device, and for curing The laser irradiation apparatus according to claim 20, wherein at least one of curing of the resist material is performed by light emitted from a light source.   The coating apparatus is a light-shielding member provided at a portion where the resist material is discharged, a position where the resist material is cured by light emitted from the curing light source, and a pulse laser beam propagates through the propagation optical system. The laser irradiation apparatus according to claim 20 or 21, further comprising a light shielding member provided in a direction facing at least one of the positions. (A) applying a resist material on the substrate;
(B) curing the applied resist material;
(C) A laser irradiation method including a step of performing patterning by making a pulse laser beam incident on the resist material cured in the step (b), removing the resist material at the incident position.   The laser irradiation method according to claim 23, wherein an outline of a resist pattern is formed on the whole or a part of the substrate in the steps (a) and (b).   The laser irradiation method according to claim 23 or 24, wherein in the step (b), a focused laser beam is incident on the resist material to cure the resist material.   The laser beam incident on the resist material in the step (b) and the laser beam incident on the cured resist material in the step (c) are laser beams emitted from the same laser light source. The laser irradiation method according to claim 25.   In the step (b), a pulse laser beam having a relatively small pulse energy density is incident on the resist material, and in the step (c), the pulse laser beam having a relatively large pulse energy density is cured. 27. The laser irradiation method according to claim 25 or 26, wherein the laser beam is incident on the resist material.   In the step (b), a relatively large size incident region is formed and a laser beam is incident on the resist material. In the step (c), a relatively small size incident region is formed. 28. The laser irradiation method according to claim 25, wherein a laser beam is incident on the cured resist material.   29. The laser irradiation method according to any one of claims 25 to 28, wherein in the step (b), a laser beam is scanned in a two-dimensional direction and incident on the resist material.   30. The laser irradiation method according to claim 29, wherein in the step (b), a laser beam is incident on the resist material, and a laser beam is not incident on the substrate on which the resist material is not applied.   The said process (b) WHEREIN: A laser beam is made to inject into the said resist material so that a laser beam may enter in the direction which does not go to the position which applies the said resist material. Laser irradiation method.   32. The step (c), wherein the laser beam is incident on the cured resist material so that the laser beam is incident in a direction not directed to a position where the resist material is applied. The laser irradiation method described in 1.   The resist material at the position where the pulse laser beam is incident in the step (c) is applied on the copper layer, and in the step (c), the pulse energy density is equal to or higher than the value at which the cured resist material is removed. The laser irradiation method according to any one of claims 23 to 32, wherein a pulsed laser beam that is less than a value at which copper is ablated is incident on the cured resist material. (A) a process object on which a resist is formed, the process of preparing a process object having a defect in the resist portion;
(B) a step of removing a resist at an incident position by making a laser beam incident on a defect portion of the resist formed on the workpiece;
Or
(C) A laser irradiation method including at least one of a step of applying a resist material to a defective portion due to non-formation of a resist, irradiating and curing a focused laser beam, and forming a resist. Furthermore, after the step (b),
35. The laser irradiation method according to claim 34, further comprising: (d) applying a resist material at a position where the resist is removed, and irradiating and curing the focused laser beam to form a resist.   36. The laser irradiation apparatus according to claim 35, wherein the laser beam used in the steps (b) to (d) is a laser beam emitted from the same light source.   In the step (b), a pulse laser beam having a relatively large pulse energy density is made incident on the defect portion of the resist. In the steps (c) and (d), a pulse having a relatively small pulse energy density is used. 37. The laser irradiation method according to claim 35 or 36, wherein a laser beam is applied to the coated resist material.   In the step (b), an incident region having a relatively small size is formed and a laser beam is made incident on the defect portion of the resist. In the steps (c) and (d), a relatively large size is entered. The laser irradiation method according to any one of claims 35 to 37, wherein an incident region is formed and the resist material coated with a laser beam is irradiated.   The laser irradiation method according to any one of claims 35 to 38, wherein in the steps (c) and (d), a laser beam is scanned in a two-dimensional direction to irradiate the applied resist material.   40. In the steps (c) and (d), the applied resist material is irradiated with a laser beam so that the laser beam is incident in a direction not directed to a position where the resist material is applied. The laser irradiation method according to any one of the above.   41. The method according to claim 34, wherein in the step (b), the laser beam is incident on a defective portion of the resist so that the laser beam is incident in a direction not directed to a position where the resist material is applied. The laser irradiation method as described. A coating apparatus that coats an insulating material on a substrate and forms an insulating film;
Inspecting whether or not the formation of the insulating film by the coating apparatus is properly performed, and detecting the position where the insulating film is not properly formed, and
An insulating film forming apparatus comprising: a repairing device that detects a position where the insulating film is not properly formed, which is detected by the inspection apparatus;   The repair device applies an insulating material to a position where an insulating film is to be formed but is not formed, and an insulating material coating function for forming the insulating film, at least at a position where no insulating film needs to be formed. 43. The insulating film forming apparatus according to claim 42, further comprising at least one of an insulating film removing function for removing the insulating film by irradiating a position where the insulating film is formed with a laser beam. And an alignment device that changes the orientation of the substrate in the in-plane direction before the insulating film is formed by the coating device,
44. The insulating film forming apparatus according to claim 42, wherein the substrate whose orientation in the in-plane direction of the substrate is changed by the alignment device is transported to the coating device in a state in which the orientation is maintained. Furthermore, a main curing device for solidifying the insulating film formed by the coating device to the inside,
45. The insulating film forming apparatus according to claim 42, wherein a substrate on which an insulating film solidified by the main curing apparatus is formed is transported to the inspection apparatus.

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