JP2011176075A - Wiring circuit board aggregate sheet and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board aggregate sheet and a method for manufacturing the wiring circuit board aggregate sheet allowing easy inspection on the propriety of a wiring circuit board by a simple constitution while preventing distortion and/or damage. <P>SOLUTION: An aggregate sheet 1 of suspension substrates with circuits includes a plurality of suspension substrates 2 with circuits, and support sheets 3 formed of metal support boards 5 to support the suspension substrates 2 with circuits in an aligned state. A discrimination mark 4 for discriminating the propriety of the suspension substrate 2 with a circuit by the piercing of a needle 19 is formed to include at least one layer selected from a group composed of a base insulating layer 7, a conductor pattern 8 and a cover insulating layer 9 exposed from a support opening 18 penetrating the thickness direction of the metal support layer 6. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wired circuit board assembly sheet and a manufacturing method thereof, and more particularly to a wired circuit board assembly sheet suitably used for a suspension board with circuit and a manufacturing method thereof.

  The suspension board with circuit mounted on the hard disk drive is manufactured as a suspension board assembly sheet with circuit in which a plurality of suspensions with circuit are formed on a metal support board. In addition, it is known that the suspension board assembly sheet with circuit is provided with a determination mark for determining pass / fail in correspondence with the suspension board with circuit.

  For example, it is proposed that when a wiring pattern is determined to be defective, a through hole penetrating the thickness direction is formed at a predetermined position of the substrate by a punching punch to form a defect mark (determination mark). (For example, refer to Patent Document 1).

  Further, it has been proposed that an opening is formed in a support sheet made of a metal support substrate, and a discrimination mark is formed from a removal portion disposed in the opening and a joint portion connecting the removal portion and the support sheet. (For example, refer to Patent Document 2). In Patent Document 2, when the suspension board with circuit is determined to be defective, the joint portion of the determination mark is cut by punching with a mold or suction with a suction device, thereby removing the removal portion, thereby attaching the circuit. It is confirmed that the suspension board is defective.

JP 2007-201085 A JP 2004-186467 A

  However, since the defect mark of Patent Document 1 is formed by penetrating a punching punch through a substrate including a metal support substrate, the metal support substrate has high rigidity in terms of its function. It may be difficult to punch the substrate with a punch.

  Further, even if the substrate is punched by the punching punch, a large stress is applied to the substrate around the defective mark during the punching. For this reason, the stress causes distortion and / or damage to the substrate around the defective mark.

  On the other hand, in the discrimination mark of Patent Document 1, since it is necessary to form a removal portion and a joint portion, a lot of man-hours and labor are required. Moreover, in order to cut | disconnect a joint part and to remove a removal part, it is necessary to prepare a metal mold | die or a suction device.

  Further, since the removed portion after removal from the suspension assembly sheet with circuit is generated as waste, it is necessary to process such removed portion.

  An object of the present invention is to provide a printed circuit board assembly sheet capable of easily inspecting the quality of a printed circuit board with a simple configuration while preventing distortion and / or damage, and a method for manufacturing the same. .

  In order to achieve the above object, a wired circuit board assembly sheet of the present invention comprises a plurality of wired circuit boards and a metal support board, and includes a support sheet that supports the wired circuit boards in an aligned state. In the assembly sheet, the wired circuit board includes a metal support layer made of the metal support substrate, a base insulating layer formed on the metal support layer, and a conductor pattern formed on the base insulating layer. And a cover insulating layer formed on the base insulating layer so as to cover the conductor pattern, and provided with a determination mark for determining the quality of the printed circuit board by a needle piercing, The mark is selected from the group consisting of the base insulating layer, the conductor pattern, and the cover insulating layer exposed from an opening that penetrates the thickness direction of the metal support substrate. It is characterized in that it comprises a single layer even without.

  In the wired circuit board assembly sheet of the present invention, it is preferable that the discrimination mark is formed from the base insulating layer and the conductor pattern.

  In the wired circuit board assembly sheet of the present invention, it is preferable that the discrimination mark is formed from the conductor pattern.

  In the wired circuit board assembly sheet of the present invention, it is preferable that the discrimination mark is formed from the base insulating layer.

  In the wired circuit board assembly sheet of the present invention, it is preferable that the discrimination mark is formed from the conductor pattern and the insulating cover layer.

  Further, the method for manufacturing a wired circuit board assembly sheet according to the present invention includes a metal support layer made of a metal support substrate, a base insulating layer formed on the metal support layer, and a base insulating layer. A plurality of printed circuit boards each having a conductive pattern and a cover insulating layer formed on the base insulating layer so as to cover the conductive pattern; and the metal supporting board, the wiring circuit boards being aligned. A step of preparing a printed circuit board assembly sheet including a support sheet to be supported in a state, a step of forming a determination mark for determining the quality of the printed circuit board, a piercing step of piercing a needle into the determination mark, and A discriminating step for discriminating the quality of the printed circuit board based on the presence or absence of the needle piercing in the piercing step, wherein the step of forming the discrimination mark includes Forming at least one layer selected from the group consisting of the base insulating layer, the conductor pattern, and the cover insulating layer, which is exposed from an opening penetrating the thickness direction of the metal support substrate. It is characterized.

  In the wired circuit board assembly sheet and the manufacturing method thereof according to the present invention, since the discrimination mark is exposed from the opening of the metal support board, the discrimination mark can ensure excellent visibility. Therefore, a needle can be easily pierced into such a discrimination mark.

  Moreover, since the puncture hole formed by the needle puncture is formed in the discrimination mark having excellent visibility, it is possible to ensure excellent visibility. Therefore, even if it is a small hole by needle piercing, the presence or absence of such a piercing hole can be easily determined, and the quality of the printed circuit board can be easily determined.

  In addition, the discrimination mark includes at least one layer selected from the group consisting of a base insulating layer, a conductor pattern, and a cover insulating layer that are exposed from the opening of the metal supporting substrate and have a relatively higher flexibility than the metal supporting substrate. The needle can be pierced into the discrimination mark while preventing the wiring circuit board and / or the support sheet from being distorted and / or damaged due to the stress described above.

  Furthermore, the quality of the printed circuit board can be easily determined with a simple configuration in which a needle is inserted into the determination mark.

FIG. 1 shows a plan view of a suspension board assembly sheet with circuit, which is an embodiment of the wired circuit board assembly sheet of the present invention. FIG. 2 is an enlarged plan view of the suspension board with circuit of the suspension board with circuit assembly sheet shown in FIG. FIG. 3 is a sectional view taken along line AA of the suspension board with circuit shown in FIG. FIG. 4 is an enlarged plan view of the discrimination mark in the suspension board with circuit shown in FIG. FIG. 5 is a process diagram showing a manufacturing method of a suspension board assembly sheet with circuit, which is an embodiment of the manufacturing method of the wired circuit board assembly sheet of the present invention, wherein (a) prepares a metal supporting board. (B) forming a base insulating layer on the metal support substrate, (c) forming a conductor pattern on the base insulating layer, and (d) on the base insulating layer. Shows the step of forming the insulating cover layer. FIG. 6 is a process diagram showing a manufacturing method of the suspension board assembly sheet with circuit, which is an embodiment of the manufacturing method of the wired circuit board assembly sheet of the present invention, following FIG. Forming a support opening in the metal support substrate; (f) piercing the needle into the discrimination mark of the defective suspension board with circuit; and (g) piercing the discrimination mark by pulling the needle out of the discrimination mark. Step (h) of forming the hole shows a step of removing the defective suspension board with circuit from the support sheet. FIG. 7 shows an enlarged cross-sectional view of a discrimination mark (an embodiment formed from a conductor pattern) of a suspension board with circuit of a suspension board with circuit assembly sheet which is another embodiment of the wired circuit board assembly sheet of the present invention. . FIG. 8 is an enlarged plan view of the discrimination mark shown in FIG. FIG. 9 is a discrimination mark (an embodiment formed from a substantially X-shaped base insulating layer) of the suspension board with circuit of the suspension board with circuit aggregate sheet as another embodiment of the wired circuit board assembly sheet of the present invention. The expanded sectional view of is shown. FIG. 10 is an enlarged plan view of the discrimination mark shown in FIG. FIG. 11 shows a discrimination mark (embodiment formed from a substantially circular base insulating layer) of the suspension board with circuit of the suspension board with circuit aggregate sheet as another embodiment of the wired circuit board assembly sheet of the present invention. An enlarged sectional view is shown. FIG. 12 is an enlarged plan view of the discrimination mark shown in FIG. FIG. 13 is an enlarged view of a discrimination mark (an embodiment formed from a conductor pattern and a cover insulating layer) of a suspension board with circuit of the suspension board with circuit sheet as another embodiment of the wired circuit board assembly sheet of the present invention. A cross-sectional view is shown. FIG. 14 is an enlarged plan view of the discrimination mark shown in FIG.

  FIG. 1 is a plan view of a suspension board assembly sheet with circuit as an embodiment of the wired circuit board assembly sheet of the present invention, and FIG. 2 is a suspension board with circuit of the suspension board assembly sheet with circuit shown in FIG. FIG. 3 is a sectional view taken along line AA of the suspension board with circuit shown in FIG. 2, FIG. 4 is an enlarged plan view of the discrimination mark on the suspension board with circuit shown in FIG. FIG. 6 is a process diagram showing a method for manufacturing a suspension board assembly sheet with circuit, which is an embodiment of the method for manufacturing a wired circuit board assembly sheet of the present invention.

  In FIG. 1 and FIG. 2, the insulating base layer 7 and the insulating cover layer 9 described later are omitted to clearly show the relative arrangement of the conductor pattern 8 and the discrimination mark 4.

  In FIG. 1, a suspension board assembly sheet with circuit 1 includes a suspension board with circuit 2 as a plurality of wired circuit boards, and a support sheet 3 that supports the suspension board with circuit 2.

  The suspension board with circuit 2 is arranged in an aligned state in the support sheet 3 at intervals, and is supported on the support sheet 3 via a severable support portion 17.

  This suspension board with circuit 2 is mounted with a magnetic head (not shown) of a hard disk drive, and the magnetic head is subjected to an air flow when the magnetic head and the magnetic disk (not shown) run relatively. On the other hand, the magnetic disk is supported while maintaining a minute gap. The suspension board with circuit 2 is integrally formed with a conductor pattern 8 for connecting a magnetic head and a read / write board (not shown).

  As will be described later, the conductor pattern 8 has a magnetic head side connection terminal 12 for connection to the connection terminal of the magnetic head and an external side for connection to the connection terminal of the read / write board, as shown in FIG. The connection terminal 13 and the wiring 11 for connecting the magnetic head side connection terminal 12 and the external side connection terminal 13 are integrally provided.

  As shown in FIG. 3, the suspension board with circuit 2 includes a metal support layer 6, a base insulating layer 7 formed on the metal support layer 6, and a conductor pattern 8 formed on the base insulating layer 7. A cover insulating layer 9 is provided on the insulating base layer 7 so as to cover the conductor pattern 8.

  As shown in FIG. 1, the metal support layer 6 is formed from a metal support substrate 5 (see FIG. 5A) together with a support sheet 3 to be described later, and has a shape corresponding to the outer shape of the suspension board with circuit 2. It is formed from a flat strip-like thin plate extending in the direction. As shown in FIG. 2, the metal support layer 6 is provided with a slit 14 formed so as to sandwich the magnetic head side connection terminal 12 at the distal end portion (one longitudinal end portion) of the suspension board with circuit 2. ing. The slit 14 defines the mounting part 10 for mounting the magnetic head.

  Furthermore, as shown in FIG. 3, the metal support layer 6 has a support opening 18 described later.

  As a metal that forms the metal support substrate 5 including the metal support layer 6, for example, a metal having high mechanical strength and high rigidity, such as stainless steel and 42 alloy, is used. Preferably, stainless steel is used. Moreover, the thickness of the metal support board | substrate 5 containing the metal support layer 6 is 10-100 micrometers, for example, Preferably, it is 15-50 micrometers.

  The base insulating layer 7 is formed on the entire upper surface of the metal support layer 6. The insulating base layer 7 is disposed so as to correspond to the conductor pattern 8. The base insulating layer 7 is formed so as to cover the support opening 18 of the metal support layer 6 as will be described later.

  As an insulator forming the base insulating layer 7, for example, polyimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polyvinyl chloride resin, etc. have high elasticity and high A synthetic resin having flexibility is used. Preferably, a polyimide resin is used. The insulating base layer 7 has a thickness of, for example, 3 to 30 μm, or preferably 5 to 15 μm.

  As shown in FIG. 2, the conductor pattern 8 includes a plurality of (six) wirings 11 arranged in parallel with a space between each other, the magnetic head side connection terminals 12 that are continuous from the tip of the wirings 11, and the wirings 11. An external connection terminal 13 continuous from the end (the other end in the longitudinal direction) is integrally provided. As a conductor forming the conductor pattern 8, for example, a relatively flexible and highly tough metal foil such as copper, nickel, gold, solder, or an alloy thereof is used. From the viewpoints of conductivity, inexpensiveness and workability, copper foil is preferably used.

  Moreover, the thickness of the conductor pattern 8 is 3-20 micrometers, for example, Preferably, it is 7-15 micrometers. The width of each wiring 11 is, for example, 5 to 500 μm, preferably 10 to 200 μm. The width of each magnetic head side connection terminal 12 and each external side connection terminal 13 is, for example, 20 to 800 μm, preferably 30 to 500 μm. Moreover, the space | interval between each wiring 11, the space | interval between each magnetic head side connection terminal 12, and the space | interval between each external side connection terminal 13 are 5-500 micrometers, for example, Preferably, it is 10-200 micrometers.

  As shown in FIG. 3, the insulating cover layer 9 is formed as a pattern corresponding to a portion where the conductor pattern 8 is formed on the upper surface of the insulating base layer 7. Specifically, the insulating cover layer 9 covers the wiring 11 and is formed in a pattern that exposes the magnetic head side connection terminals 12 and the external side connection terminals 13 although not shown in FIG. As an insulator for forming the insulating cover layer 9, an insulator similar to the above-described insulating base layer 7 is used, and a polyimide resin is preferably used. The insulating cover layer 9 has a thickness of, for example, 2 to 20 μm, preferably 4 to 15 μm.

  The support sheet 3 includes a metal support substrate 5, and more specifically, as shown in FIGS. 1 and 2, in the method for manufacturing the suspension board assembly sheet with circuit 1 described later (see FIG. 5A). The metal support substrate 5 is formed together with the support portion 17 and the metal support layer 6 by partially removing the metal support substrate 5 so as to correspond to the outer shape of the suspension board with circuit 2.

  Further, the support sheet 3 has a substantially frame in plan view that surrounds the suspension board with circuit 2 between the inner peripheral edge of the support sheet 3 and the outer peripheral edge of the suspension board with circuit 2 that surrounds the suspension board with circuit 2. A gap groove 16 is formed.

  Further, a plurality of support portions 17 are formed on the support sheet 3 so as to cross the gap grooves 16.

  As shown in FIG. 3, the suspension board with circuit 2 is provided with a discrimination mark 4 in which a puncture hole 15 (see FIG. 6G) to be described later is formed.

  As shown in FIG. 1, the discrimination marks 4 are respectively provided corresponding to the suspension boards with circuits 2 and are arranged in the suspension board with circuits 2 in plan view. Specifically, as shown in FIG. 2, the discrimination mark 4 is arranged between the magnetic head side connection terminal 12 and the external side connection terminal 13 in the longitudinal direction, between the wirings 11 adjacent to each other in the width direction, and in the width direction. They are arranged at intervals.

  Further, the discrimination mark 4 is partitioned by a support opening 18 as an opening of the metal support layer 6 as shown in FIG.

  The support opening 18 of the metal support layer 6 is formed so as to penetrate the thickness direction of the metal support layer 6, and is formed in a substantially circular shape in a bottom view as shown by a broken line in FIG.

  The discrimination mark 4 is provided in order to form a puncture hole 15 (see FIG. 6G) by piercing the needle 19 in the piercing step (described later). Specifically, as shown in FIG. An insulating layer 7 and a conductor pattern 8 are formed. That is, the discrimination mark 4 is formed from the base insulating layer 7 and the conductor pattern 8 exposed from the support opening 18 of the metal support layer 6.

  The insulating base layer 7 that forms the discrimination mark 4 is formed continuously with the insulating base layer 7 disposed corresponding to the conductor pattern 8 (wiring 11).

  On the other hand, the conductor pattern 8 forming the discrimination mark 4 is formed independently so as to be separated from the wiring 11. Specifically, as shown in FIG. 4, the conductor pattern 8 corresponding to the discrimination mark 4 is formed in a pattern including the discrimination mark 4 when projected in the thickness direction. The shape is formed so that the peripheral edge surrounds the discrimination mark 4. The conductor pattern 8 corresponding to the discrimination mark 4 is arranged concentrically with the discrimination mark 4 when projected in the thickness direction.

  An inner diameter (inner diameter of the support opening 18 of the metal support layer 6) D1 of the discrimination mark 4 is, for example, 50 to 1000 μm, or preferably 100 to 600 μm. When the inner diameter D1 of the determination mark 4 is less than the above range, it may be difficult to reliably pierce the needle 19 in the piercing process. Further, when the inner diameter D1 of the discrimination mark 4 exceeds the above-described range, it may be difficult to confirm the puncture hole 15 formed in the discrimination mark 4 by the piercing process.

  Moreover, the diameter D2 of the conductor pattern 8 corresponding to the discrimination mark 4 is, for example, 200 to 2000 μm, or preferably 400 to 1500 μm.

  Next, a method for manufacturing the suspension board assembly sheet with circuit 1 will be described with reference to FIGS.

  In this method, first, as shown in FIG. 5A, a metal support substrate 5 is prepared. As shown in FIG. 1, the metal support substrate 5 is formed in a substantially rectangular flat plate shape in plan view.

  Next, in this method, the base insulating layer 7 is formed on the metal supporting substrate 5 as shown in FIG. The base insulating layer 7 is formed in a pattern corresponding to the suspension board with circuit 2.

  In order to form the base insulating layer 7, for example, a synthetic resin solution (varnish) is applied to the entire upper surface of the metal support substrate 5 in the above-described pattern, dried, and then heated and cured as necessary. . Further, when using a photosensitive synthetic resin to form the base insulating layer 7, it is applied to the entire upper surface of the metal support substrate 5, and then the photosensitive synthetic resin is exposed and developed. The above-described pattern is formed, and then heat-cured as necessary. Furthermore, the method for forming the insulating base layer 7 is not limited to the above method. For example, a synthetic resin is previously formed on a film having the above-described pattern, and the film is formed on the entire upper surface of the metal supporting substrate 5. It can also stick through the adhesive layer.

  Next, in this method, as shown in FIG. 5C, the conductor pattern 8 corresponds to the magnetic head side connection terminal 12, the external side connection terminal 13, the wiring 11, and the discrimination mark 4 on the base insulating layer 7. The pattern is formed as described above. In order to form the conductor pattern 8, a known patterning method such as an additive method or a subtractive method is used. Preferably, the additive method is used.

  Next, in this method, as shown in FIG. 5D, the insulating cover layer 9 is formed on the insulating base layer 7 with the above-described pattern.

  In order to form the insulating cover layer 9, for example, the above-described synthetic resin solution is applied to the upper surface of the insulating base layer 7 including the conductor pattern 8 in the above-described pattern, dried, and then, if necessary, Heat cure. Further, in the case where a photosensitive synthetic resin is used to form the insulating cover layer 9, it is applied to the entire upper surface of the insulating base layer 7 including the conductor pattern 8, and then the photosensitive synthetic resin. Is exposed and developed to form the above-described pattern, and then heat-cured as necessary. Furthermore, the method for forming the insulating cover layer 9 is not limited to the above method. For example, a synthetic resin is previously formed on a film having the above-described pattern, and the film is formed on the entire upper surface of the insulating base layer 7 by a known method. It can also be attached via an adhesive layer.

  Next, in this method, as shown in FIG. 6 (e), slits 14 (FIG. 2) and support openings 18 are formed in the metal support layer 6, and gap grooves 16 are formed in the metal support substrate 5.

  In order to form the slit 14, the support opening 18 and the gap groove 16, for example, etching, drilling, or the like is used. Preferably, etching is used.

  Thereby, the suspension board with circuit 2 on which the mounting portion 10 and the discrimination mark 4 are formed, the support sheet 3, and the support portion 17 can be obtained.

  Thereafter, in the obtained suspension board assembly with circuit 1, for example, first, the presence or absence of disconnection of the wiring 11 of the suspension board with circuit 2 is inspected (inspection step). For example, a known continuity test or optical test is used to determine whether or not the wiring 11 is disconnected.

  Next, as shown in FIGS. 6 (f) and 6 (g), when the suspension board with circuit 2 is determined to be defective by the above inspection, the determination mark 4 corresponding to the suspension board with circuit 2 is pierced. Hole 15 is formed (piercing process).

  Specifically, in the piercing step, as shown in FIG. 6F, the needle 19 is pierced into the discrimination mark 4 on the suspension board with circuit 2 that is discriminated as a defective product.

  As a material for forming the needle 19, for example, a metal having high mechanical strength and high rigidity, such as iron, stainless steel, or nickel, is used.

  The diameter D3 (portion excluding the tip) of the needle 19 is smaller than the inner diameter D1 of the discrimination mark 4 and is, for example, 50 to 90%, preferably 50 to 70% with respect to the inner diameter D1 of the discrimination mark 4. Furthermore, it can be made sufficiently smaller than the diameter of the punching punch as described in Patent Document 1 (usually about 0.5 to 2.0 mm), specifically, for example, 25 to 900 μm. The thickness is preferably 50 to 550 μm.

  Specifically, in the perforating process, first, as shown by the phantom line in FIG. 6F, the needle 19 is disposed above the discrimination mark 4 with a gap. In the arrangement of the needle 19, the tip end (lower end) of the needle 19 and the center of the discrimination mark 4 and the center of the conductor pattern 8 corresponding to the discrimination mark 4 are positioned in the longitudinal direction and the width direction.

  Next, as indicated by the arrow and the solid line in FIG. 6 (f), the needle 19 is lowered to sequentially pierce the conductor pattern 8 of the discrimination mark 4 and the base insulating layer 7.

  The needle 19 is pierced so as to penetrate the conductor pattern 8 and the base insulating layer 7 in the thickness direction.

  Thereafter, as shown in FIG. 6G, the needle 19 is raised and pulled out from the discrimination mark 4.

  Thereby, a pierced hole 15 is formed in the conductor pattern 8 of the discrimination mark 4 and the base insulating layer 7.

  The puncture hole 15 is formed in a substantially circular shape in plan view, and the inner diameter D4 is, for example, 40 to 1000 μm, preferably 90 to 600 μm.

  Thereafter, the fact that the puncture hole 15 is formed in the discrimination mark 4 is observed, for example, visually or with an optical sensor such as a CCD camera (discrimination step).

  For example, the determination step is performed by paying attention only to the determination mark 4 and observing whether or not the puncture hole 15 is formed in the determination mark 4.

  Thus, it can be determined that the suspension board with circuit 2 having the puncture hole 15 in the determination mark 4 is a defective product.

  After that, as shown in FIG. 6 (h), the supporting portion 17 corresponding to the suspension board with circuit 2 determined to be defective is cut and processed so that the defective suspension board with circuit 2 is removed from the support sheet 3. Remove.

  On the other hand, in the suspension board with circuit 2 that has been determined to be non-defective in the determination step, since the puncture hole 15 is not formed in the determination mark 4, it is confirmed that the puncture hole 15 is not formed in the determination mark 4. Or, it is observed with an optical sensor such as a CCD camera. Thereby, it can be determined that the suspension board with circuit 2 is a non-defective product. Thereafter, as shown in FIG. 6H, the non-defective circuit suspension board 2 is separated from the support sheet 3 (separation process), and the non-defective circuit suspension board 2 is mounted on the hard disk drive (mounting process). ).

  In the suspension board assembly sheet with circuit 1 and the manufacturing method thereof, since the discrimination mark 4 is exposed from the support opening 18 of the metal support layer 6, the discrimination mark 4 ensures excellent visibility. be able to. Therefore, the needle 19 can be easily pierced into the discrimination mark 4.

  Moreover, since the piercing hole 15 formed by the piercing of the needle 19 is formed in the discrimination mark 4 having excellent visibility, it is possible to ensure excellent visibility. Therefore, even if the puncture hole 15 is a small hole due to the puncture of the needle 19, the presence or absence of the puncture hole 15 can be easily determined, and the quality of the suspension board with circuit 2 can be easily determined.

  Further, since the discrimination mark 2 is exposed from the support opening 18 of the metal support layer 6 and is formed from the base insulating layer 7 and the conductor pattern 8 having higher flexibility than the metal support layer 6, the metal support layer is provided at the time of piercing. The needle 19 can be pierced into the discrimination mark 4 while preventing the suspension board with circuit 2 from being distorted and / or damaged due to the large stress applied to the circuit 6.

  Furthermore, it is possible to easily determine the quality of the suspension board with circuit 2 with a simple configuration in which the needle 19 is inserted into the determination mark 4.

  Furthermore, since the needle 19 is pierced into the discrimination mark 4 from above in the above piercing step, the needle 19 and the discrimination mark 4 are exposed from the conductor pattern 8 around the conductor pattern 8. Since a clear contrast with the base insulating layer 7 can be used, positioning can be performed easily and reliably.

  On the other hand, in the piercing step, the needle 19 can also be pierced into the discrimination mark 4 from below. According to this method, it is possible to use the clear contrast between the needle 19 and the discrimination mark 4 between the base insulating layer 7 exposed from the support opening 18 of the metal support layer 6 and the metal support layer 6 around it. Therefore, positioning can be performed easily and reliably.

  Further, in the suspension board assembly sheet with circuit 1, since the discrimination mark 4 is formed from the base insulating layer 7 and the conductor pattern 8, the base insulating layer having high elasticity when the needle 19 is pulled out from the discrimination mark 4. 7, a force (restoring force) for closing the puncture hole 15 is generated. However, since the restoring force generated in the insulating base layer 7 can be suppressed by the conductive pattern 8 having high toughness, the puncture hole 15 can be formed reliably.

  FIG. 7 is an enlarged cross-sectional view of a discrimination mark (embodiment formed from a conductor pattern) of a suspension board with circuit of a suspension board assembly circuit with circuit which is another embodiment of the wired circuit board assembly sheet of the present invention. 8 is an enlarged plan view of the discrimination mark shown in FIG. 7, and FIG. 9 is a discrimination mark for a suspension board with circuit of a suspension board assembly sheet with circuit according to another embodiment of the wired circuit board assembly sheet of the present invention. FIG. 10 is an enlarged plan view of the discrimination mark shown in FIG. 9, and FIG. 11 is another view of the printed circuit board assembly sheet of the present invention. FIG. 1 is an enlarged cross-sectional view of a discrimination mark (an embodiment formed from a conductor pattern and a cover insulating layer) of a suspension board with circuit of the suspension board with circuit assembly sheet according to the embodiment. 11 is an enlarged plan view of the discrimination mark shown in FIG. 11, and FIG. 13 is a discrimination mark (abbreviated) of the suspension board with circuit of the suspension board assembly sheet with circuit which is another embodiment of the wired circuit board assembly sheet of the present invention. FIG. 14 is an enlarged cross-sectional view of a discrimination mark shown in FIG. 13.

  In addition, in each subsequent drawing, about the member corresponding to each above-mentioned part, the same referential mark is attached | subjected and the detailed description is abbreviate | omitted.

  Next, a suspension board assembly sheet with circuit which is another embodiment of the wired circuit board assembly sheet of the present invention will be described with reference to FIGS.

  In the description of FIG. 3 described above, the support opening 18 of the metal support layer 6 is formed in a substantially circular shape when viewed from the bottom, but the shape is not particularly limited. For example, as illustrated in FIG. It can also be formed in a rectangular shape.

  In FIG. 8, the support opening 18 is formed in a substantially rectangular shape extending in the longitudinal direction.

  In the description of FIG. 3 described above, the discrimination mark 4 is formed from the base insulating layer 7 and the conductor pattern 8. However, for example, as shown in FIG.

  In FIG. 7, the discrimination mark 4 is defined by a support opening 18 of the metal support layer 6 and a base opening 20 of the base insulating layer 7.

  The base opening 20 of the base insulating layer 7 is formed so as to penetrate in the thickness direction of the base insulating layer 7, and is formed at the same position as the support opening 18 of the metal support layer 6 when projected in the thickness direction. Yes.

  As shown in FIG. 8, the conductor pattern 8 is formed in a substantially rectangular shape that is long in the width direction so as to pass through the center in the longitudinal direction of the base opening 20 of the base insulating layer 7 along the width direction. Specifically, the conductor pattern 8 is provided on both outer sides in the width direction of the base opening 20 of the base insulating layer 7 and is disposed so as to straddle the base opening 20 of the base insulating layer 7 in the width direction. .

  In addition, the conductor pattern 8 exposes both ends in the longitudinal direction of the base opening 20 of the base insulating layer 7.

  In the suspension board assembly sheet with circuit 1 shown in FIGS. 7 and 8, both ends in the longitudinal direction of the base opening 20 of the base insulating layer 7 are exposed from the conductor pattern 8, and light is completely transmitted in the vertical direction. Therefore, the discrimination mark 4 made of the insulating base layer 7 sandwiched between both longitudinal ends of the base opening 20 of the insulating base layer 7 can ensure even better visibility.

  Therefore, the needle 19 can be pierced with the discrimination mark 4 more easily. In addition, the presence or absence of the puncture hole 15 formed in the determination mark 4 can be determined more easily, and the quality of the suspension board with circuit 2 can be determined even more easily.

  Further, since the discrimination mark 4 is formed only from the conductor pattern 8, there is no need to suppress the restoring force for closing the puncture hole 15 by the base insulating layer 7 when the needle 19 is pulled out from the discrimination mark 4, and the puncture hole 15 can be formed more reliably.

  On the other hand, as shown in FIGS. 9 to 12, the discrimination mark 4 can be formed only from the base insulating layer 7.

  9 and 10, the support opening 18 of the metal support layer 6 is formed in a substantially circular shape when viewed from the bottom.

  The base insulating layer 7 is formed so as to include the support opening 18 of the metal support layer 6 when projected in the thickness direction, and is formed in a substantially X shape in plan view. That is, the insulating base layer 7 includes two straight portions 21 that intersect (orthogonal) each other, and the intersecting portions (orthogonal portions, intersections) of the respective straight portions 21 are disposed on the support opening 18. Yes. Specifically, it is arranged so that the intersection of the straight portions 21 includes the support opening 18 of the metal support layer 6 when projected in the thickness direction.

  Further, the base opening 20 of the base insulating layer 7 is formed in a substantially fan shape in a plan view as a portion excluding the straight portion 21, and is disposed outside the support opening 18 with a gap. The base opening 20 of the base insulating layer 7 exposes the upper surface of the metal support layer 6.

  In the suspension board assembly sheet with circuit 1, since the discrimination mark 4 is formed at the intersection (intersection) of the straight portion 21 of the base insulating layer 7, the discrimination mark 4 ensures even better visibility. can do. In particular, the discrimination mark 4 that is observed using the contrast between the straight portion 21 of the insulating base layer 7 and the metal support layer 6 exposed from the base opening 20 of the insulating base layer 7 ensures exceptional visibility. can do.

  Therefore, the needle 19 can be pierced particularly easily into the discrimination mark 4.

  Further, the presence / absence of the puncture hole 15 formed in the determination mark 4 can be determined with particular ease, and the quality of the suspension board with circuit 2 can be determined with particular ease.

  Moreover, since the discrimination mark 4 is formed only from the insulating base layer 7, when the needle 19 is inserted into the discrimination mark 4, it can be easily inserted into the insulating base layer 7 having high flexibility. Therefore, the piercing process can be easily performed.

  Furthermore, since the discrimination mark 4 has excellent visibility, even if the discrimination mark 4 is provided compactly in a narrow space in the suspension board with circuit 2, the piercing step and the discrimination step can be performed reliably.

  In the description of FIG. 10, the base insulating layer 7 is formed in a substantially X shape in plan view, but the shape thereof is not particularly limited. For example, as shown in FIG. You can also

  11 and 12, the insulating base layer 7 includes a circular portion 22 including the support opening 18 of the metal support layer 6 when projected in the thickness direction.

  The circular portion 22 is partitioned by a substantially circular base opening 20 in plan view. The base opening 20 is formed so as to surround the support opening 18 of the metal support layer 6 when projected in the thickness direction.

  Thus, the circular portion 22 is formed independently so as to be separated from the base insulating layer 7 outside the base opening 20 by the base opening 20 of the base insulating layer 7.

  The circular portion 22 is formed concentrically with the support opening 18 of the metal support layer 6 when projected in the thickness direction.

  In the suspension board assembly sheet with circuit 1, since the discrimination mark 4 is formed concentrically with the circular portion 22 of the base insulating layer 7, the discrimination mark 4 ensures even better visibility. can do. In particular, the discrimination mark 4 that is observed using the contrast between the circular portion 22 of the base insulating layer 7 and the metal support layer 6 exposed from the base opening 20 of the base insulating layer 7 ensures particularly excellent visibility. can do.

  Therefore, the needle 19 can be pierced particularly easily into the discrimination mark 4.

  Further, the presence / absence of the puncture hole 15 formed in the determination mark 4 can be determined with particular ease, and the quality of the suspension board with circuit 2 can be determined with particular ease.

  Furthermore, since the discrimination mark 4 has exceptionally excellent visibility, the piercing step and the discrimination step can be reliably performed even if the discrimination mark 4 is provided compactly in a narrow space in the suspension board with circuit 2.

  In the above description, the discrimination mark 4 is formed from at least the base insulating layer 7 or the conductor pattern 8. However, for example, as shown in FIG. 13, it can also be formed from at least the insulating cover layer 9.

  13 and 14, the discrimination mark 4 is formed of a conductor pattern 8 and a cover insulating layer 9 that covers the surface of the conductor pattern 8.

  The insulating cover layer 9 is formed on the upper surface and the outer peripheral side surface of the conductor pattern 8 corresponding to the discrimination mark 4.

  In the suspension board assembly sheet with circuit 1, the discrimination mark 4 is formed from the conductor pattern 8 and the cover insulating layer 9, so that when the needle 19 is pulled out from the discrimination mark 4, the cover insulating layer 9 having high elasticity is A force (restoring force) for closing the puncture hole 15 is generated. However, the restoring force that closes the puncture hole 15 by the cover insulating layer 9 when the needle 19 is pulled out from the discrimination mark 4 can be suppressed by the conductive pattern 8 having high toughness, and the puncture hole 15 is reliably formed. can do.

  In the above description, one determination mark 4 is provided for each suspension board with circuit 2, but the number is not particularly limited, and for example, a plurality of determination marks 4 may be provided.

  In the above description, the discrimination mark 4 is provided on the metal support layer 6, but it can also be provided on the support sheet 3 as indicated by an imaginary line in FIG. 1, for example.

  In that case, the discrimination mark 4 is defined by a support opening 18 that penetrates the thickness direction of the support sheet 3.

  In such a suspension board assembly sheet with circuit 1, the discrimination mark 2 is formed so as to be exposed from the support opening 18 of the support sheet 3, so that support caused by a large stress applied to the support sheet 3 during piercing is provided. The needle 19 can be pierced into the discrimination mark 4 while preventing the sheet 3 from being distorted and / or damaged.

  In the above description, the discrimination mark 4 is provided between the wirings 11 adjacent in the width direction between the magnetic head side connection terminal 12 and the external side connection terminal 13 in the longitudinal direction, but the arrangement is not particularly limited. . The discrimination mark 4 can be provided, for example, on the front side (one side in the longitudinal direction) of the magnetic head side connection terminal 12 or on the rear side (the other side in the longitudinal direction) of the external side connection terminal 13. It can also be provided on both outer sides in the width direction.

  Further, in the above description, the puncture hole 15 by the puncture of the needle 19 is formed in the discrimination mark 4 on the suspension board with circuit 2 that is discriminated as a defective product in the puncture process, but for example, the reverse is true. You can also. That is, in the piercing process, the piercing hole 15 by the piercing of the needle 19 is formed in the discrimination mark 4 on the suspension board with circuit 2 determined to be non-defective, and the suspension board with circuit 2 without the piercing hole 15 is defective. Can be determined.

  In the above description, the wired circuit board assembly sheet and the manufacturing method thereof according to the present invention are described as the suspension board assembly sheet with circuit 1 including the suspension board with circuit 2 and the manufacturing method thereof. The wired circuit board and the manufacturing method thereof are not limited to this, for example, another wired circuit board aggregate sheet such as a flexible wired circuit board aggregate sheet provided with a flexible wired circuit board provided with the metal support layer 6 as a reinforcing layer. And its manufacturing method can be widely applied.

1 Suspension board assembly sheet with circuit 2 Suspension board with circuit 3 Support sheet 4 Identification mark 5 Metal support board 6 Metal support layer 7 Base insulating layer 8 Conductive pattern 9 Cover insulating layer 18 Support opening 19 Needle

Claims (6)

In a wiring circuit board assembly sheet comprising a plurality of wiring circuit boards and a metal supporting board, and comprising a supporting sheet that supports the wiring circuit boards in an aligned state,
The wired circuit board includes a metal supporting layer made of the metal supporting substrate, a base insulating layer formed on the metal supporting layer, a conductor pattern formed on the base insulating layer, and the base insulating layer. And a cover insulating layer formed to cover the conductor pattern,
A determination mark for determining the quality of the printed circuit board by a needle puncture is provided,
The discrimination mark includes at least one layer selected from the group consisting of the base insulating layer, the conductor pattern, and the cover insulating layer, which is exposed from an opening penetrating the thickness direction of the metal supporting board. A feature is a printed circuit board assembly sheet.   The printed circuit board assembly sheet according to claim 1, wherein the discrimination mark is formed from the base insulating layer and the conductor pattern.   The wired circuit board assembly sheet according to claim 1, wherein the discrimination mark is formed from the conductor pattern.   The wired circuit board assembly sheet according to claim 1, wherein the discrimination mark is formed from the base insulating layer.   The wired circuit board assembly sheet according to claim 1, wherein the discrimination mark is formed from the conductor pattern and the insulating cover layer. A metal support layer comprising a metal support substrate; a base insulating layer formed on the metal support layer; a conductor pattern formed on the base insulating layer; and the conductor pattern on the base insulating layer. A printed circuit board assembly sheet comprising a plurality of printed circuit boards comprising a cover insulating layer formed so as to cover and a support sheet comprising the metal support board and supporting the wired circuit board in an aligned state. The process to prepare,
Forming a discrimination mark for discriminating the quality of the printed circuit board;
A piercing step of piercing the discrimination mark with a needle, and
Based on the presence or absence of piercing of the needle in the piercing step, comprising a determination step of determining the quality of the printed circuit board,
In the step of forming the discrimination mark, the discrimination mark is selected from the group consisting of the base insulating layer, the conductor pattern, and the cover insulating layer exposed from an opening penetrating the thickness direction of the metal support substrate. A method for producing a printed circuit board assembly sheet, comprising forming at least one layer.

Images