JP2011049210A - Method for transferring thin-film element group - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for transferring a thin-film element group 110 wherein the manufacturer's original substrate 100 can be protected against breaking when the thin-film element group is transferred from the manufacturer's original substrate 100 to a transfer destination substrate 200. <P>SOLUTION: The method for transferring a thin-film element group includes a surface treatment process where either the periphery 130 of the manufacturer's original substrate 100 on which the thin film element group 110 is formed or the periphery 230 of the transfer destination substrate 200 is subjected to water-repellent treatment, an adhesive coating process where the surface of either the manufacturer's original substrate 100 or the transfer destination substrate 200 is coated with a water-soluble adhesive 150, a substrate arrangement process where the surfaces of the manufacturer's original substrate 100 and the transfer destination substrate 200 are stuck while facing each other, an adhesive curing process, and a substrate peeling process where the thin-film element group 110 is transfer destination to the transfer destination substrate 200 by peeling the manufacturer's original substrate 100 from the transfer destination substrate 200. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for transferring a thin film element group, and more particularly to a method for manufacturing a circuit board including a thin film element group by transferring the thin film element group from a manufacturer substrate on which the thin film element group is manufactured to another transfer destination substrate.

  Semiconductor circuits using thin-film semiconductor devices such as electrophoretic display devices (EPD), liquid crystal display devices (LCD), and electroluminescent (EL) display devices can prevent damage due to impact such as dropping of electronic devices. In order to improve flexibility or reduce weight, it may be formed on a plastic substrate or the like. A thin film circuit board using plastic or the like as a substrate forms a thin film semiconductor circuit (TFT circuit) as a thin film element group on a manufacturer substrate made of a glass substrate, and the thin film element group is transferred to a plastic substrate or the like as a transfer destination substrate. A transfer method is used.

  Conventionally, when manufacturing such a circuit board, an adhesive is filled between the manufacturer substrate on which the thin film element group is formed and the transfer destination substrate to cure and bond, and then from the manufacturer substrate to the transfer destination substrate. The thin film element group was transferred. The said method is described in patent document 1 (Unexamined-Japanese-Patent No. 2001-51296), patent document 2 (Unexamined-Japanese-Patent No. 2004-327836), etc.

JP 2001-51296 A JP 2004-327836 A

  However, in the conventional method, when the transfer destination substrate is peeled from the manufacturer substrate and the thin film element group is transferred to the transfer destination substrate, the manufacturer substrate or the transfer destination substrate is cracked, and the thin film element group can be transferred to the transfer destination substrate. There were no failures frequently.

  Therefore, in view of the above-described problems, one of the objects of the present invention is to reduce a defect in which the manufacturer substrate or the transfer destination substrate is broken when the thin film element group is transferred from the manufacturer substrate to the transfer destination substrate. Is to provide a transfer method.

  In order to solve such a problem, a thin film element group transfer method according to one aspect of the present invention is a thin film element group transfer method in which a thin film element group formed on a manufacturer substrate surface is transferred to a transfer destination substrate surface. A surface treatment step of creating a water-repellent region by performing water-repellent treatment on at least one of the peripheral part of the manufacturer's substrate and the peripheral part of the transfer-destination substrate; and at least one of the surface of the manufacturer's substrate and the surface of the transfer-destination substrate An adhesive application step of applying a water-soluble adhesive, a substrate placement step of arranging the manufacturer substrate surface and the transfer destination substrate surface to face each other with the water-soluble adhesive therebetween, and curing the water-soluble adhesive An adhesive curing step; and a substrate peeling step of transferring the thin film element group to the transfer destination substrate by peeling the manufacturer substrate from the transfer destination substrate.

  In a conventional thin film element group transfer method, when transferring a thin film element group from a manufacturer substrate to a transfer destination substrate, an adhesive is applied to almost the entire surface of the manufacturer substrate, and then the adhesive is cured to transfer the manufacturer substrate and the transfer destination substrate. A method has been used in which the substrate is bonded, and then the manufacturer substrate and the transfer destination substrate are peeled off. However, as a result of investigation by the inventors of the present application, in the above-described conventional method, the adhesive filled between the manufacturer substrate and the transfer destination substrate adheres to the transfer destination substrate even outside the peelable region of the manufacturer substrate. Excess adhesive was cured covering the end surface (edge portion) of the manufacturer's substrate and the end surface (edge portion) of the transfer destination substrate. When the adhesive is cured in a state where the end face of the manufacturer's substrate and the end face of the transfer destination substrate are covered or outside the peelable region, the manufacturer's substrate becomes difficult to peel from the transfer destination substrate. As a result, it has been found that an unintended extra force is applied to the manufacturer substrate or the transfer destination substrate at the time of peeling, thereby inducing a defect that the substrate breaks.

  On the other hand, according to the method of one aspect of the present invention, by providing a water-repellent region in at least one of the peripheral portion of the end surface of the manufacturer substrate and the peripheral portion of the end surface of the transfer destination substrate, the water-soluble adhesive is applied to the portion. Is difficult to adhere. As a result, even if the temporary water-soluble adhesive remains or leaks, the end surface of the manufacturer's substrate and its peripheral portion and the end surface of the transfer destination substrate and its peripheral portion will not adhere. Alternatively, the adhesive strength is significantly weakened at the site. Therefore, when the manufacturer substrate is peeled off from the transfer destination substrate, it is possible to remarkably reduce a defect that the manufacturer substrate or the transfer destination substrate breaks.

  In the adhesive application step, a water-soluble adhesive is applied to the surface of the smaller substrate between the manufacturer substrate and the transfer destination substrate, and in the substrate arrangement step, the smaller area in the plan view. The substrate having the larger area is arranged so as to cover the entire surface of the substrate.

  When applying a water-soluble adhesive, the adhesive is applied to the smaller substrate and the larger substrate is covered from the top. Therefore, when the manufacturer substrate and the transfer destination substrate are bonded together, Even if the water-soluble adhesive leaks from the substrate, it is possible to prevent the leaked water-soluble adhesive from adhering to the edge or the back surface of the larger substrate positioned above.

  Further, it has an enclosing means forming step for forming enclosing means on the surface of the substrate having the smaller area before the adhesive coating step, and the enclosing means is inside the water-repellent region at the time of the substrate placing process and the thin film. It is formed so as to surround the element group, and the water-soluble adhesive is applied to the inside of the enclosing means in the adhesive application step.

  According to such a method, in the adhesive application step of applying the water-soluble adhesive to at least one of the manufacturer substrate surface and the transfer destination substrate surface, the water-soluble adhesive is removed from between the manufacturer substrate and the transfer destination substrate. Leakage defects can be reduced.

  Further, the enclosing means is characterized by being formed of an enclosing adhesive having a viscosity of 5000 cps or more and 50000 cps or less.

  The height of the enclosing means for preventing the water-soluble adhesive from leaking is 10 μm to 100 μm, but if an adhesive having a viscosity of 5000 cps or more is used, the enclosing means having this height can be easily created. On the other hand, when an adhesive having a viscosity of 50000 cps or less is used, a surrounding means is easily formed using a commercially available dispensing device (dispenser). It is preferable that the enclosing adhesive used for the enclosing means is incompatible with the water-soluble adhesive. This is because if the water-soluble adhesive is not compatible with the enclosing adhesive that forms the enclosing means, the probability of an accident in which the enclosing means is destroyed and the water-soluble adhesive leaks during the substrate placement process is reduced.

  Further, it is preferable that the enclosing means and the water repellent area are separated by a distance of 1 mm or more and 5 mm or less, and the enclosing means is formed inside the water repellent area. Usually, the enclosing means is drawn by a printing machine such as a dispensing device with a width of about 0.5 mm to about 1.0 mm. The enclosing means is formed with a width xmm and a position ymm away from the water repellent area. The shortest distance from the water repellent area to the enclosing means is ymm, and the average distance from the water repellent area to the center line of the enclosing means is ( x / 2 + y) mm. Usually, the enclosure means is pressed during the substrate placement process to increase its width from 2 mm to 3 mm. At this time, even when the enclosing means having the thickest width of 1.0 mm is widest and has a width of 3 mm, if the enclosing means is formed 1 mm or more away from the water-repellent region, it will be repelled. It does not spread to the water area. That is, it is possible to reduce a defect that the enclosing means formed of the adhesive spreads to the peripheral portion subjected to the water repellent treatment and overflows. On the other hand, the area outside the enclosure means after being compressed and expanded is not bonded at all, so that the area is not transferred. Since this region cannot be used for a thin film electronic circuit, it is desirable from the viewpoint of increasing productivity to be as narrow as possible. Taking into account fluctuations in the line width and center line position after the enclosing means are compressed and spread, if the enclosing means is formed at a distance of 5 mm or less from the initial water-repellent area, the unused area that is not transferred Can be made as small as 1 mm to 2 mm, and productivity is improved.

  The enclosing adhesive is a pressure-sensitive adhesive, a sealant, or a water-soluble adhesive.

  Further, before the substrate placement step, there is a substrate installation step in which the substrate having the smaller area is installed on a stage having an installation surface having a smaller area than the substrate having the smaller area.

  In the present application, the manufacturer substrate and the transfer destination substrate are compared with the smaller substrate facing down, and a water-soluble adhesive is applied thereto. Next, the larger substrate is covered from above. If the stage on which this work is performed is even smaller than the substrate with the smaller area, even if the water-soluble adhesive leaks from between the temporary manufacturer substrate and the transfer destination substrate, the leaked water-soluble adhesive will be installed on the stage. Therefore, it is possible to prevent a defect that the manufacturer substrate and the transfer destination substrate are bonded at the end surface portions of the both substrates without staying on the surface.

  The water-soluble adhesive preferably has a viscosity of 1 cps or more and 50 cps or less.

  According to such a method, since the water-soluble adhesive spreads sufficiently in the inner region of the surrounding means on the manufacturer's substrate, the location where there is no water-soluble adhesive (such as bubbles without water-soluble adhesive) is minimized. And minimize transfer defects. Needless to say, a portion where no water-soluble adhesive is present is not bonded, resulting in transfer failure.

  Also, after the substrate peeling step, a second bonding step in which the transfer destination substrate surface onto which the thin film element group has been transferred and the second transfer destination substrate surface are opposed to each other and a second adhesive is interposed therebetween. And a second transfer step of transferring the thin film element group to the second transfer destination substrate by peeling the transfer destination substrate from the second transfer destination substrate, and an adhesive for removing the water-soluble adhesive. And an agent removing step.

  According to such a method, it is possible to transfer the thin film element group from the manufacturer substrate to the second transfer destination substrate by performing the transfer twice.

  In the surface treatment step, it is preferable to perform water repellent treatment on both the peripheral portion of the manufacturer substrate on which the thin film element group is formed and the peripheral portion of the transfer destination substrate.

  According to such a method, a water-repellent region is formed in the peripheral portion of both substrates, so that even if the temporary water-soluble adhesive leaks into the water-repellent region, the defect that the water-repellent regions are bonded to each other is remarkably reduced. As a result, when the manufacturer substrate is peeled off from the transfer destination substrate, a problem that the manufacturer substrate or the transfer destination substrate breaks is more effectively prevented.

  Further, the surface treatment step includes a step of creating a hydrophilic region by performing a hydrophilic treatment on the outside of the water-repellent region formed on the surface of the manufacturer substrate or the surface of the transfer destination substrate.

  According to such a method, water-soluble adhesives are wet and spread well at the manufacturer's substrate and the transfer-destination substrate, except for the peripheral portion, so that the water-soluble adhesive and the water-repellent treatment region are formed except for the water-repellent treatment region. Since the number of places where no agent is present is minimized, transfer defects are significantly reduced. The transfer failure occurs when there is no water-soluble adhesive or when the adhesive strength of the water-soluble adhesive is weak. Therefore, the transfer failure decreases as the water-soluble adhesive spreads.

  Further, the water repellent region is in a range of 1 mm or more and 10 mm or less from an end face of the manufacturer substrate or the transfer destination substrate.

  According to such a method, it is possible to obtain a water repellent effect while increasing the area where the thin film element group on the manufacturer substrate can be formed.

  Further, as the water repellent treatment performed in the surface treatment step, fluorine plasma treatment is performed.

  In addition, as a water repellent treatment performed in the surface treatment step, an oil is applied.

The figure which shows the manufacturer board | substrate before performing a water repellent process. The figure which shows the transcription | transfer destination board | substrate before performing a water repellent process. The figure which shows the manufacturer board | substrate which performed the water repellent process. The figure which shows the transfer destination board | substrate which performed the water repellent process. The figure which shows the manufacturer board | substrate with which the surrounding means was formed. The figure which shows the manufacturer board | substrate of the state which apply | coated the water-soluble adhesive inside the surrounding means. The figure which shows the state which bonded the manufacturer board | substrate and the transfer destination board | substrate. The figure which shows the process of irradiating a manufacture board | substrate and a transfer destination board | substrate with an ultraviolet-ray, and hardening a water-soluble adhesive. The figure which shows the process of peeling a manufacture board | substrate and a transfer destination board | substrate. The figure which shows the state which bonded together the transfer destination board | substrate and the 2nd transfer destination board | substrate. The figure which shows the state which peeled the transfer destination board | substrate and the 2nd transfer destination board | substrate. The figure which shows the state which removed the water-soluble adhesive and surrounding means on a 2nd transfer destination board | substrate. The 1st figure which shows one effect | action of this embodiment. The 2nd figure which shows one effect | action of this embodiment. The 3rd figure which shows one effect | action of this embodiment. The 4th figure which shows one effect | action of this embodiment.

An embodiment according to the present invention will be specifically described with reference to the drawings according to the following configuration. However, the following embodiments are merely examples of the present invention, and do not limit the technical scope of the present invention. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and the description may be abbreviate | omitted.
1. Definition 2. Embodiment (1) Surface treatment process (water repellent treatment and hydrophilic treatment)
(2) Enclosing means forming step (formation of enclosing means)
(3) Adhesive application process (application of water-soluble adhesive)
(4) Substrate installation step and substrate placement step (bonding of the manufacturer substrate and the transfer destination substrate)
(5) Adhesive curing process (curing of water-soluble adhesive)
(6) Substrate peeling step (peeling between the manufacturer's substrate and the transfer destination substrate)
(7) Second bonding step (bonding of transfer destination substrate and second transfer destination substrate)
(8) Second transfer step (peeling of the transfer destination substrate and the second transfer destination substrate)
(9) Adhesive removal step (removal of water-soluble adhesive)
3. Summary 4. Supplement

<1. Definition>
First, terms used in this specification are defined as follows.

“Apply”: “Apply” means not only to apply to a predetermined substance, but also to supply to a predetermined area on a predetermined substance, or to interpose or fill between a predetermined substance and a substance. including.
“Manufacturer substrate surface”: refers to the surface of the manufacturer substrate on which a thin film element group to be transferred to the transfer destination substrate is formed.
“Transfer destination substrate surface”: refers to the surface of the transfer destination substrate on which the thin film element group is transferred from the manufacturer substrate.

<2. Embodiment>
The present embodiment, which is an aspect of the present invention, relates to a method for transferring a thin film element group, and more particularly, to a method for manufacturing a circuit board by transferring a thin film element group formed on the surface of a manufacturer substrate to a transfer destination substrate. Among them, one of the characteristic processes is a process of performing water repellent treatment on the peripheral part of the manufacturer substrate and the transfer destination substrate. Below, the transfer method of the thin film element group including the said process is demonstrated for every process.

<(1) Surface treatment process (water repellent treatment and hydrophilic treatment)>
First, the steps of water repellent treatment and hydrophilic treatment performed on the manufacturer substrate and the transfer destination substrate will be described with reference to FIGS. Here, an example in which both the water repellent treatment and the hydrophilic treatment are performed is shown. However, if the water-soluble adhesive is sufficiently wetted and spreads on the substrate surface during the adhesive application step, the hydrophilic treatment is not necessarily performed. In short, water repellent treatment is essential in the surface treatment step, but hydrophilic treatment is optional. In the following, an example in which the water repellent treatment is performed after the hydrophilic treatment is performed is shown. However, on the contrary, the water repellent treatment may be performed and then the hydrophilic treatment may be performed. Furthermore, in the following example, surface treatment is performed on both the manufacturer substrate and the transfer destination substrate, but the effect is recognized even if the surface treatment step is performed only on one of the substrates.

  FIG. 1 is a view showing a manufacturer substrate 100 before a surface treatment such as a water repellent treatment. In FIG. 1, the upper diagram is a plan view of the manufacturer's substrate 100 as viewed from the surface (above), and the lower diagram is a cross-sectional view taken along a1-a2 of the plan view. As shown in FIG. 1, a thin film element group 110 is formed on a manufacturer substrate 100, and a release layer 120 is formed between the manufacturer substrate 100 and the thin film element group 110. The manufacturer substrate 100 is made of glass or the like. The thin film element group 110 is a semiconductor circuit including a plurality of thin film transistors (TFTs), thin film diodes, thin film resistors, thin film capacitors, and the like. The release layer 120 is made of a material having a property of peeling by applying predetermined energy. The characteristic of peeling is that the bonding force between atoms or molecules of the material constituting the peeling layer 120 disappears by providing light or energy with a certain intensity, or the peeling layer and the thin film element group This is a property that causes peeling as a result of a decrease in the adhesive force at the interface or the interface between the release layer and the manufacturer's substrate, or ablation of the release layer itself. As the composition of the peeling layer 120, for example, amorphous (amorphous) silicon (a-Si) or the like is used.

  FIG. 2 is a view showing the transfer destination substrate 200 before the surface treatment such as water repellent treatment is performed. The upper view is a plan view seen from the transfer destination substrate surface, and the lower view is a cross-sectional view taken along b1-b2 of the plan view. It is. The transfer destination substrate 200 and the manufacturer substrate 100 have different areas. Whichever is larger, in this example, the transfer destination substrate is made larger than the manufacturer substrate. Needless to say, the transfer destination substrate may be smaller than the manufacturer substrate. Large and small substrates represent the size of the area and mean the length of the sides, and more specifically, the relationship that a large substrate can include a small substrate. If the manufacturer's substrate and the transfer destination substrate are made different sizes, even if the water-soluble adhesive overflows, the overflowing water-soluble adhesive will be removed by lowering the smaller substrate during the subsequent substrate placement process. It is possible to eliminate the defect of joining the two substrates by going around the back surface of the larger upper substrate. Since the smaller substrate is placed down during the substrate placement process, in this application, a water-soluble adhesive is applied to the surface of the smaller substrate during the adhesive application step, and then the larger substrate is included from the top to the smaller substrate. Arrange in the form As described above, either the manufacturer substrate or the transfer destination substrate may be enlarged. If the manufacturer's substrate is made smaller than the transfer destination substrate, the manufacturer's substrate is turned down and a larger transfer destination substrate is placed after applying a water-soluble adhesive thereto. Since the release substrate is provided on the manufacturer's substrate, it does not transmit ultraviolet light. On the other hand, since an ultraviolet light transmissive substrate can be used as the transfer destination substrate, when the ultraviolet light transmissive transfer destination substrate is on the upper side, ultraviolet light can be irradiated from the upper side in a later adhesive curing step. Thus, it is not necessary to invert the two substrates sandwiching the water-soluble adhesive, and the ultraviolet light is irradiated from above, so that a commercially available UV-curable water-soluble adhesive should be used for the water-soluble adhesive. Is possible. Further, since the ultraviolet light is irradiated as it is in the state in which both the substrates are overlapped in the substrate arranging step, it is possible to solve the problem that both the substrates are displaced or the water-soluble adhesive leaks into the displaced time signature. On the other hand, if the manufacturer substrate is made larger than the transfer destination substrate, the transfer destination substrate is turned down and a water-soluble adhesive is applied thereto. Although a thin film element layer is provided on the surface of the manufacturer's substrate and various materials are exposed on the surface, a substrate having a uniform surface can be used as the transfer destination substrate. In this case, since the surface of the transfer destination substrate is homogeneous, the water-soluble adhesive spreads uniformly, and the effect of reducing adhesion failure appears.

  The thin film element group 110 configured on the manufacturer substrate 100 transfers the transfer destination substrate 200 as the final substrate of the circuit board to be incorporated into the final product, and the second transfer destination after temporary transfer to the transfer destination substrate 200. In some cases, the image is transferred again to the substrate. In the present embodiment, a method in which the thin film element group 110 is temporarily transferred to the transfer destination substrate 200 and then transferred to the second transfer destination substrate will be described as an example. When the thin film element group 110 is finally transferred to the second transfer destination substrate, the transfer destination substrate 200 is a substrate that is only temporarily transferred, so it is not always necessary to have high flexibility and resistance to impact. . On the other hand, when the thin film element group 110 is finally transferred to the transfer destination substrate 200, the transfer destination substrate 200 may be a flexible material or a material having high resistance to impact according to the application. . Examples of the transfer destination substrate 200 having flexibility include a plastic substrate, a thin metal substrate, fiber, paper, cloth, and the like.

  FIG. 3 is a view showing the manufacturer substrate 100 that has been subjected to water repellent treatment. The upper diagram is a plan view as seen from the manufacturer substrate surface (above), and the lower diagram is a cross-sectional view taken along a1-a2 of the plan view. . The surface treatment process for the manufacturer substrate 100 may be subjected to a hydrophilic treatment in addition to the water repellent treatment. A region where the water repellent treatment is not performed on the substrate surface is a hydrophilic treatment region. In the present embodiment, a method for performing both the water repellent treatment and the hydrophilic treatment will be described. First, a hydrophilic treatment is performed on the entire surface of the manufacturer substrate on which the thin film element group 110 is formed on the manufacturer substrate 100. The hydrophilic treatment is preferably performed to such an extent that the water droplet contact angle is 40 ° or less in order to show an appropriate affinity with the water-soluble adhesive, and the superhydrophilic treatment having a water droplet contact angle of less than 15 ° is a water-soluble adhesive. This is more preferable because it shows a better affinity with the adhesive. The hydrophilic treatment can be carried out by various conventionally known methods, and the following methods may be used. When the manufacturer substrate 100 and the transfer destination substrate 200 are glass, the simplest hydrophilic treatment method is pure water cleaning, and the oil and fat components adhering to the surface of the manufacturer substrate 100 are washed away. At this time, it is more effective to use a surfactant such as soap. Various materials such as metals, silicon oxide films, and organic resins appear on the surface of the thin film element group 110 formed on the manufacturer's substrate. An effective hydrophilic treatment method for such a substance is an oxidation treatment such as oxygen plasma or ozone irradiation. Further, water plasma treatment such as introducing hydrogen into the oxygen plasma, introducing water vapor into the oxygen plasma, or introducing water vapor into the inert gas plasma is also effective. By these hydrophilic treatments, hydroxyl groups can be induced on the substrate surface via an oxide film, reducing the surface energy against water and increasing the adhesive strength of the water-soluble adhesive. When the glass substrate is washed as described above, the water droplet contact angle becomes about 25 °, and when the oxidation treatment or the water plasma treatment is performed, the water droplet contact angle becomes super hydrophilic with a water droplet contact angle of less than 15 °.

  Next, the peripheral portion 130 of the manufacturer substrate 100 is subjected to water repellent treatment to form a water repellent region. As shown in FIG. 3, the peripheral portion 130 where the water repellent treatment is performed here is an end surface (side surface portion) of the manufacturer's substrate 100, a predetermined range following the end surface on the manufacturer's substrate surface, and a back surface of the manufacturer's substrate. A predetermined range following the end face is included. The predetermined range for forming the peripheral portion 130 is preferably a region having a width of at least 1 mm from the end surface on the manufacturer substrate surface and the manufacturer substrate back surface. This is because if the peripheral portion 130 serving as the water-repellent region is too narrow, the effect of preventing adhesion when the water-soluble adhesive 150 (described later) leaks is weakened. On the other hand, if the range of the peripheral part 130 becomes too wide, the area of the circuit part made up of the thin film element group becomes small, so that the distance from the end face is preferably less than 10 mm. Ideally, the water repellent area should be 2 mm or more and 6 mm or less from the edge of the substrate in order to ensure that the water repellent treatment is performed stably, the water repellent treatment effect can be reliably obtained, and the circuit area is maximized. It can be said. The water repellent treatment can be performed by various conventionally known methods, and the following methods may be used.

A first example is a method of irradiating a water repellent treatment region with fluorine plasma. That is, the inner region (hereinafter referred to as “non-peripheral portion”) excluding the peripheral portion 130 on the surface of the manufacturer substrate 100 subjected to the hydrophilic treatment is covered with a photoresist, and then plasma using a substance containing fluorine is used. Process. Fluorine-containing materials used for the fluorine plasma treatment include tetrafluoromethane (CF ₄ ), nitrogen trifluoride (NF ₃ ), sulfur hexafluoride (SF ₆ ), hydrogen fluoride (HF), fluorine gas ( F ₂ ) and the like. In particular, it is preferable to use tetrafluoromethane (CF ₄ ), which is easy to handle from the viewpoint of safety. After the plasma treatment, the photoresist is removed.

The second example is a method of applying a water repellent substance to the water repellent treatment region. Specifically, oil or wax is applied to the peripheral portion 130 of the manufacturer substrate 100. Fats and oils refer to esters of higher fatty acids and mono- or divalent higher alcohols, but also include neutral fats, higher fatty acids, hydrocarbons and the like that exhibit similar properties. More specific examples of fats and oils include triacyl glycerose (Chemical Formula 3), which is an ester of fatty acid (Chemical Formula 1) and glycerin (Chemical Formula 2).

In addition to fats and oils, waxes such as alkyl ketene dimer wax (Chemical Formula 4) and dialkyl ketone wax (Chemical Formula 5) are used.

Here, R and R ¹ to R ⁷ are linear or branched alkyl groups having about 10 to 30 carbon atoms (C _n H _{2n + 1} , n = 10 to 31), or about 10 to 30 carbon atoms. Or an alkenyl group having a straight chain or branched chain (C _n H _2n−1 , n = 10 to 31). In order to show good water repellency, since R and R ¹ to R ⁷ are preferably saturated compounds, an alkyl group is preferred to an alkenyl group. In addition, some or all of the hydrogen atoms contained in R and R ¹ to R ⁷ may be substituted with fluorine atoms.

As more preferred fats and oils, R ¹ to R ³ are linear alkyl having 11 to 17 carbon atoms, and glyceride (C ₃ H ₅ (OCOC ₁₁ H ₂₃ ) of lauric acid (CH ₃ — (CH ₂ ) ₁₀ —COOH). ₃ , carbon number of saturated alkyl group n = 11), glyceride of myristic acid (CH _3- (CH ₂ ) ₁₂ -COOH) (C ₃ H ₅ (OCOC ₁₃ H ₂₇ ) ₃ , carbon number of saturated alkyl group n = 13), glycerides of palmitic acid (CH _3- (CH ₂ ) ₁₄ -COOH) (tripalmitin, C ₃ H ₅ (OCOC ₁₅ H ₃₁ ) ₃ , saturated carbon number n = 15), stearic acid (CH _{3 - (CH 2) 16 -COOH} ) glycerides _{(tristearin, C 3 H 5 (OCOC 17} H 35) 3, carbon atoms of the saturated alkyl group n = 17) And the like.

As the wax, R ⁴ to R ⁷ are more preferably linear alkyl having 11 to ¹⁷ carbon atoms. As the ketene dimer, myristyl ketene dimer, palmityl ketene dimer, stearin ketene dimer, or behenyl ketene dimer is particularly preferable. As the dialkyl ketone, palmitone or stearone is particularly preferable. Moreover, the paraffin wax etc. which are manufactured from petroleum and have as a main component a linear paraffinic hydrocarbon (normal paraffin) having about 20 to 30 carbon atoms can also be used.

  FIG. 4 is a view showing a transfer destination substrate 200 that has been subjected to a water repellent treatment. An upper view is a plan view seen from the transfer destination substrate, and a lower view is a cross-sectional view. Similarly to the surface treatment for the manufacturer substrate 100, both the water repellent treatment and the hydrophilic treatment may be performed on the transfer destination substrate 200. Here, a method of performing both water repellent treatment and hydrophilic treatment will be described. In addition, the water repellent treatment and the hydrophilic treatment for the transfer destination substrate 200 can be performed by the same method as the water repellent treatment and the hydrophilic treatment for the manufacturer substrate 100, but the portions to be subjected to the water repellent treatment are different. The explanation is centered. The water repellent treatment for the transfer destination substrate 200 is performed on the peripheral portion 230. Here, the non-peripheral portion excluding the peripheral portion 230 in the transfer destination substrate 200 has substantially the same area as the non-peripheral portion excluding the peripheral portion 130 on the surface of the manufacturer's substrate 100, and has substantially the same side length. It consists of. That is, the water-repellent treatment region is provided so that the region to be bonded with the water-soluble adhesive is substantially equal on both substrates. Nearly equal means that the water-repellent region is created so that the non-peripheral portion of the manufacturer's substrate and the region excluding the peripheral portion of the transfer destination substrate have the same side length and the same area, excluding manufacturing errors. means. As described above, in this example, since the transfer destination substrate is made larger than the manufacturer substrate, the width of the peripheral portion 230 in the transfer destination substrate 200 is wider than the width of the peripheral portion 130 in the manufacturer substrate 100. As a result, the area of the hydrophilic non-peripheral part is almost the same on both substrates. The “width” here refers to the distance from the end surface to the non-peripheral portion of the substrate.

  Up to this point, the water-repellent treatment region has been formed on both the manufacturer substrate and the transfer destination substrate, but the water repellent treatment may be performed only on either the manufacturer substrate 100 or the transfer destination substrate 200. If water repellent treatment is applied to either substrate, even if the temporary water-soluble adhesive 150 overflows in a later step, the water-soluble adhesive 150 does not adhere in the water-repellent treatment region (or the adhesive strength is significantly weakened) The manufacturer substrate 100 and the transfer destination substrate 200 can be easily separated. When the water repellent treatment is performed only on the transfer destination substrate 200, there is an advantage that the thin film element group 110 formed on the manufacturer substrate 100 is not contaminated by the water repellent treatment. Ideally, both the manufacturer substrate 100 and the transfer destination substrate 200 are subjected to water repellency treatment, which makes it easier and more reliable to peel off the manufacturer substrate 100 and the transfer destination substrate 200 in a later step. You can do it.

<(2) Enclosing means forming step (formation of enclosing means)>
Next, the manufacturer substrate 100 and the transfer destination substrate are compared, and the surrounding means 140 is formed on the surface of the smaller substrate. Here, an example will be described in which the manufacturer's substrate is smaller than the transfer destination substrate as before. That is, an example in which the surrounding means 140 is formed on the manufacturer substrate will be described.

  FIG. 5 is a view showing the manufacturer's substrate 100 on which the surrounding means 140 is formed. The upper view is a plan view seen from the surface of the manufacturer's substrate (above), and the lower view is a cross-sectional view. As shown in FIG. 5, the surrounding means 140 is a non-peripheral portion inside the peripheral portion 130 of the manufacturer substrate 100 in a plan view, and is formed on the release layer 120 so as to surround the thin film element group 110. The That is, the surrounding means is formed in the hydrophilic region. At this time, the surrounding means 140 is formed so that the distance from the surrounding means 140 to the peripheral portion 130 is 1 mm or more and 5 mm or less. If the surrounding means 140 is formed at a distance of 1 mm or more from the peripheral portion 130, even if the surrounding means 140 formed of an adhesive is pressed and spreads when the manufacturer substrate 100 and the transfer destination substrate 200 are bonded together, the surrounding means 140 The means 140 does not spread to the peripheral portion 130 where the water repellent treatment is performed. The peripheral portion 130 subjected to the water-repellent treatment is poor in the applicability of the adhesive forming the surrounding means, so that the surrounding means is interrupted, and as a result, a malfunction that does not function as the surrounding means 140 may occur. If the surrounding means is formed 1 mm or more away from the peripheral part, this problem can be prevented. Further, if the surrounding means 140 is formed at a distance of 5 mm or less from the peripheral portion 130, a wider device region (region where the thin film element group is formed) can be obtained, which is preferable from the viewpoint of improving productivity. Such a surrounding means 140 is preferably formed of an enclosing adhesive and has a viscosity of not less than 5000 cps and not more than 50000 cps. Here, the adhesive means a pressure-sensitive adhesive, a sealant, or a water-soluble adhesive. When the viscosity of the surrounding means 140 is 5000 cps or more, the height of the surrounding means is about 10 μm to 100 μm, and the water-soluble adhesive is difficult to leak even after the water-soluble adhesive 150 is applied to the inside. If the viscosity is 50000 cps or less, the surrounding means 140 can be easily formed using a commercially available dispensing device (dispenser). Note that the adhesive forming the surrounding means 140 and the water-soluble adhesive 150 are preferably different adhesives and are incompatible materials.

<(3) Adhesive application process (application of water-soluble adhesive)>
Next, a water-soluble adhesive 150 is applied to the inside of the surrounding means on the surface of the smaller substrate on which the surrounding means 140 is formed.

  FIG. 6 shows that the smaller substrate (manufacturer substrate in this example) of the manufacturer substrate and the transfer destination substrate is placed on the stage 300, and the water-soluble adhesive 150 is placed inside the surrounding means 140 on the surface of the smaller substrate. The state of application (filling) is shown. When applying the water-soluble adhesive 150, the manufacturer substrate 100 is placed on the stage 300. Then, as shown in FIG. 6, the water-soluble adhesive 150 is applied to the hydrophilic region on the inner side of the surrounding means 140 so as not to leak from the surrounding means 140. The water-soluble adhesive 150 is preferably a low-viscosity water-soluble adhesive having a viscosity of 1 cps or more and 50 cps or less. If a low-viscosity water-soluble adhesive having a viscosity of 50 cps or less is used, the water-soluble adhesive 150 cleanly wets and spreads on the surface of the manufacturer-treated substrate 100 or the transfer-destination substrate that has been subjected to hydrophilic treatment. Are bonded uniformly and strongly without defects. Moreover, since the thing with the lowest viscosity of an adhesive agent is about 1 cps, if it is 1 cps or more, the choice of an adhesive agent will spread and it will become possible to select the optimal adhesive agent from various kinds of adhesive agents. After the adhesive application step, the manufacturer substrate and the transfer destination substrate are bonded together in the next step (substrate arrangement step). These two steps (adhesive application step and substrate arrangement step) are preferably performed on the same stage 300. . This is because if the same stage is used, there is no need to move the smaller substrate to which the adhesive is applied, so that it is possible to eliminate the defect that the low-viscosity water-soluble adhesive flows over the surrounding means.

<(4) Substrate installation step and substrate placement step (bonding of manufacturer substrate and transfer destination substrate)>
Next, the process proceeds to the substrate placement step, where the manufacturer substrate 100 and the transfer destination substrate 200 are bonded together. In order to bond the two substrates together, the smaller substrate coated with the water-soluble adhesive must be placed on the stage 300 of the apparatus where the bonding is performed. This is the substrate installation process. The stage 300 on which the substrate placement process is performed has an installation surface on which the substrate is installed, and the area of the installation surface is further smaller than the smaller substrate of the manufacturer substrate and the transfer destination substrate. The small area here means that the area value is small and at the same time each side of the substrate is compared with each side of the corresponding stage, and the side of the stage is shorter on all sides. It means that the smaller board completely covers the installation surface. Specifically, a rectangular substrate or a square substrate is generally used for both the manufacturer substrate and the transfer destination substrate, and the stage 300 also has a rectangular or square quadrangular or circular installation surface. When both the substrate and the stage are square, the short side of the stage is shortened by 2 mm (1 mm on one side when the substrate is placed) to 10 mm (5 mm on one side when the substrate is placed) shorter than the shorter side of the stage. The long side is shorter than the long side of the smaller substrate by 2 mm (1 mm on one side when the substrate is placed) to 10 mm (5 mm on one side when the substrate is placed). When the stage is circular, the diameter of the stage is shortened by 2 mm (1 mm on one side when the substrate is placed) to 10 mm (5 mm on one side when the substrate is placed) shorter than the shorter side of the smaller substrate. In this case, as will be described in detail later with reference to FIGS. 15 and 16, even if the temporary water-soluble adhesive leaks out, the leaked water-soluble adhesive does not stay on the stage and drops downward. This is because the substrate and the transfer destination substrate are not bonded to each other at the end surface portion (edge portion), and the substrate cracking defect during the peeling process is reduced.

  The substrate placement process must be performed prior to the substrate placement process and may be performed immediately before, but more preferably is performed before the enclosure means forming process. That is, the substrate coated with the water-soluble adhesive may be placed on the stage 300 where the substrate placement step is performed, but more preferably, the enclosing means forming step, the adhesive coating step, and the substrate placement step are performed after the substrate placement step. This is performed continuously on the same stage 300. In this case, it is not necessary to move the substrate coated with the water-soluble adhesive, and as described above, it is possible to eliminate the defect that the low-viscosity water-soluble adhesive flows out over the surrounding means. Ideally, the enclosing means forming step, the adhesive applying step, the substrate arranging step, and the subsequent adhesive curing step are performed on the same stage 300 after the substrate setting step. Thus, since the substrate does not move at all from the formation of the surrounding means to the curing of the adhesive, it is possible to completely eliminate the water-soluble adhesive outflow defect due to the movement of the substrate.

  FIG. 7 shows a state immediately after the substrate placement step, in which the manufacturer substrate 100 and the transfer destination substrate 200 are bonded together. In the plan view, the manufacturer substrate 100 and the transfer destination substrate 200 are such that the larger substrate (the transfer destination substrate 200 in this example) covers the entire surface of the smaller substrate (the manufacturer substrate 100 in this example). Paste to. When these substrates are bonded together, first, the atmosphere is evacuated and air bubbles are removed from the low-viscosity water-soluble adhesive 150. A bubble part becomes adhesion failure and becomes a transfer defect in a subsequent substrate peeling process. Therefore, this defoaming process reduces transfer defects caused by bubbles. In order to remove bubbles efficiently, the vacuum is maintained at 100 Pa or less for 1 second or more. This is because bubbles remain in a low vacuum of 100 Pa or more. When a low-viscosity water-soluble adhesive having a viscosity of 50 cps or less is filled in the atmosphere, defoaming proceeds while a vacuum of 100 Pa or less is reached. Therefore, the pressure should be 100 Pa or less for only a short time of about 1 second. The vacuuming from the atmosphere to 100 Pa is performed between 5 seconds and 120 seconds. When vacuuming is performed in less than 5 seconds, the water-soluble adhesive 150 scatters and finishes, and when it takes 120 seconds or more, the composition of the water-soluble adhesive is visibly changed and the amount of adhesive is significantly reduced. This is because it cannot be secured. In order to secure the adhesive quality and keep the amount of adhesive as designed, the period of maintaining the vacuum degree of 100 Pa or less is set to 120 seconds or less from the start of evacuation. Specifically, the optimum condition is a method in which a vacuum of 50 Pa to 60 Pa is applied over 20 to 25 seconds from the atmosphere, and this vacuum is maintained for 20 to 40 seconds. After removing the bubbles from the water-soluble adhesive 150 in this way, the larger substrate (transfer destination substrate 200 in this example) is placed on the smaller substrate (manufacturer substrate 100 in this example) in a vacuum. The atmosphere is then returned to the atmosphere.

<(5) Adhesive curing step (curing of water-soluble adhesive)>
Next, as shown in FIG. 8, ultraviolet light 400 is applied to the bonded manufacturer substrate 100 and transfer destination substrate 200 to cure the water-soluble adhesive 150. Note that in order to cure the water-soluble adhesive 150, it is only necessary to supply some energy in accordance with the characteristics of the water-soluble adhesive 150, and the supply energy form is not necessarily ultraviolet light irradiation. For example, if the water-soluble adhesive is a thermosetting type, heat energy is supplied.

<(6) Substrate Peeling Step (Peeling of Manufacturer Substrate and Transfer Destination Substrate)>
Next, as shown in FIG. 9, the laser beam 500 is irradiated from the manufacturer substrate 100 side, and the manufacturer substrate 100 and the transfer destination substrate 200 are separated by the release layer 120. After this step, the thin film element group 110 is transferred to the transfer destination substrate 200 with the cured water-soluble adhesive 150 interposed therebetween.

  In this embodiment, the thin film element group is transferred again from the transfer destination substrate 200 to the second transfer destination substrate after the substrate peeling step, and the second transfer destination substrate is used as a circuit board incorporated in the final product. May be the final substrate. When the transfer destination substrate 200 is the final substrate, the circuit board manufacturing process ends with the process of peeling the manufacturer substrate 100 and the transfer destination substrate 200 from each other.

<(7) Second bonding step (bonding of transfer destination substrate and second transfer destination substrate)>
Next, the transfer destination substrate 200 and the second transfer destination substrate 600 are bonded together.

  FIG. 10 shows a state where the transfer destination substrate 200 and the second transfer destination substrate 600 are bonded together. When the transfer destination substrate 200 and the second transfer destination substrate 600 are bonded together, the transfer destination substrate 200 to which the thin film element group 110 has been transferred is opposed to the second transfer destination substrate 600, and a water-insoluble adhesive is interposed therebetween. to paste together. In the present embodiment, the second transfer destination substrate 600 is a final substrate of a circuit board to be incorporated into a final product, and thus is formed of a desired material as a manufactured circuit board. For example, when a circuit board having a flexible substrate is manufactured, flexible plastic or the like is used as the substrate.

<(8) Second transfer step (peeling of transfer destination substrate and second transfer destination substrate)>
Next, as shown in FIG. 11, the transfer destination substrate 200 and the second transfer destination substrate 600 are peeled off. In the step of peeling the transfer destination substrate 200 and the second transfer destination substrate 600, a peeling layer is provided on the transfer destination substrate 200 in advance as in the step of peeling the manufacturer substrate 100 and the transfer destination substrate 200. Alternatively, a method of irradiating laser light or the like from the transfer destination substrate 200 side may be used. In addition, other conventional methods such as dissolving the water-soluble adhesive 150 in water may be used.

<(9) Adhesive removal step (removal of water-soluble adhesive)>
Finally, as shown in FIG. 12, the water-soluble adhesive 150 and the surrounding means 140 remaining on the second transfer destination substrate 600 are removed. For removal of the water-soluble adhesive 150 and the surrounding means 140, a method of washing with pure water or the like may be used, or other conventional methods may be used.

  Through the above steps, as shown in FIG. 12, it is possible to transfer the thin film element group 110 to the second transfer destination substrate 600 and manufacture a desired circuit board.

<3. Summary>
As described above, according to the thin film element group transfer method in the present embodiment, at least one of the peripheral portion 130 of the manufacturer substrate 100 and the peripheral portion 230 of the transfer destination substrate 200 is subjected to water repellent treatment. The water-soluble adhesive 150 is difficult to adhere to the part. If neither the manufacturer substrate 100 nor the transfer destination substrate 200 is subjected to water repellent treatment and the stage 300 is larger than the manufacturer substrate 100 and the transfer destination substrate 200, the following state is obtained. That is, as shown in FIG. 13, the water-soluble adhesive 150 adheres so as to cover the end surface of the manufacturer substrate 100 and the end surface of the transfer destination substrate 200. In this state, when the water-soluble adhesive 150 is cured by irradiating the ultraviolet ray 500, the water-soluble adhesive 150 is covered with the end face of the manufacturer substrate 100 and the end face of the transfer destination substrate 200 as shown in FIG. Harden and finish. In this state, if a force is applied to peel the manufacturer substrate 100 and the transfer destination substrate 200, the manufacturer substrate 100 or the transfer destination substrate is broken and finished. However, by using the thin film element group transfer method in the present embodiment, the water-soluble adhesive 150 is prevented from adhering to the end face of the manufacturer's substrate 100 and the end face of the transfer destination substrate 200, and the end face portion Can prevent curing of adhesive. Thus, when the manufacturer substrate 100 is peeled from the transfer destination substrate 200, it is possible to prevent a defect that the manufacturer substrate 100 or the transfer destination substrate breaks. When the water repellent treatment is performed only on the peripheral portion of one of the substrates, even if the temporary water-soluble adhesive 150 overflows, it does not adhere in the water repellent treatment region (adhesive strength becomes extremely weak). This facilitates separation of the manufacturer substrate 100 and the transfer destination substrate 200. When the water repellent treatment is performed only on the transfer destination substrate 200, the thin film element group 110 formed on the manufacturer substrate 100 can be prevented from being contaminated by the water repellent treatment. However, it is more preferable to perform water repellent treatment on both the manufacturer substrate 100 and the transfer destination substrate 200 because the manufacturer substrate 100 and the transfer destination substrate 200 can be more reliably peeled off.

  Further, in the method according to the present embodiment, the area of the manufacturer substrate 100 and the area of the transfer destination substrate 200 are different. When these substrates are bonded together, they are bonded so that the larger substrate covers the entire surface of the smaller substrate in plan view. Therefore, even if leaking from between these temporary provisions during the substrate placement process, it is possible to prevent the water-soluble adhesive 150 from flowing into the upper side of the larger substrate, so that both substrates are bonded at the end of the substrate. The bug has been resolved.

  In the method according to the present embodiment, before the water-soluble adhesive 150 is applied to the smaller substrate, the thin film element group 110 is enclosed inside the peripheral portion 130 of the smaller substrate in plan view. An enclosing means 140 is formed and filled with a low-viscosity water-soluble adhesive. Accordingly, defects that the water-soluble adhesive 150 leaks from between the manufacturer substrate 100 and the transfer destination substrate 200 are reduced.

  Moreover, the surrounding means 140 in this embodiment is formed with the adhesive agent whose viscosity is 5000 cps or more and 50000 cps or less. In this way, since the adhesive having a viscosity of 5000 cps or more is used as the material of the surrounding means 140, the water-soluble adhesive 150 is difficult to leak out, and the surrounding means 140 having a preferred height of about 10 μm to about 100 μm is formed. It becomes possible. Further, since an adhesive having a viscosity of 50000 cps or less is used, the surrounding means 140 can be easily formed by using a commercially available dispensing device (dispenser).

  The adhesive is preferably incompatible with the water-soluble adhesive 150. According to this, it is possible to prevent the enclosure means 140 from being destroyed due to the water-soluble adhesive 150 being compatible with the adhesive forming the enclosure means 140.

  Moreover, it is preferable to form the surrounding means 140 at a distance of 1 mm or more and 5 mm or less from the peripheral portion 130. If the surrounding means 140 is formed at a distance of 1 mm or more from the peripheral portion 130 in this way, the surrounding means 140 formed of an adhesive is pressed and spread when the manufacturer substrate 100 and the transfer destination substrate 200 are bonded together. Even if it exists, it can prevent that the said surrounding means 140 spreads to the peripheral part 130 by which the water-repellent process was carried out. That is, it is possible to prevent the surrounding means 140 formed of an adhesive from spreading to the peripheral portion 130 subjected to the water-repellent treatment, and the adhesive force between the surrounding means 140 and the manufacturer's substrate 100 is weakened and cannot function as the surrounding means 140. I can do it. In addition, it is preferable to form the surrounding means 140 with a distance of 5 mm or less from the peripheral portion 130 because a device area can be widened and productivity is improved.

  Further, in this embodiment, at least when the manufacturer substrate 100 and the transfer destination substrate 200 are bonded together, on the stage 300 having an installation surface having a smaller area than the smaller substrate in plan view, Install the smaller board. Accordingly, when the small substrate and the large substrate installed on the stage 300 are bonded together, even if the water-soluble adhesive leaks between the temporary substrates, the stage 300 and the smaller substrate The problem of staying in and around the room can be resolved. FIG. 15 and FIG. 16 are diagrams for explaining this, and a smaller substrate (manufacturer substrate 100 in this example) and a larger substrate (transfer destination substrate 200 in this example) mounted on the stage 300 are pasted. When combined, the state when the water-soluble adhesive 150 leaks out is shown. As shown in FIG. 15, even if the water-soluble adhesive leaks out, the stage 300 has an area smaller than both substrates in the configuration of the present application, so that the water-soluble adhesive 150 does not collect on the stage 300. Leaks down. Since the water-soluble adhesive 150 is cured by irradiating the ultraviolet ray 400 after the water-soluble adhesive 150 is dripped, it is possible to prevent the manufacturer substrate 100 and the transfer destination substrate 200 from being bonded to each other by the leaked adhesive. Yes, it is possible (Figure 16). Even if the temporary water-soluble adhesive leaks, the peripheral portion is water-repellent, so that this region does not adhere, and the substrate can be peeled easily and stably. Further, if the enclosure means forming step is performed after the substrate installation step, and the adhesive application step, the substrate placement step, and the adhesive application step are performed on the same stage 300, the water-soluble adhesive 150 flows out by moving the substrate. Since it can prevent, it is preferable.

  Further, the water-soluble adhesive 150 in the present embodiment has a viscosity of 1 cps or more and 50 cps or less. Accordingly, the water-soluble adhesive 150 is sufficiently spread inside the surrounding means 140 on the manufacturer's substrate 100, and the manufacturer's substrate 100 and the transfer destination substrate 200 can be easily bonded together. Moreover, since a thing with a viscosity of 1 cps or more can be used, it becomes possible to select from various kinds of adhesives.

  In the present embodiment, the transfer destination substrate 200 to which the thin film element group 110 has been transferred and the transfer destination substrate of the second transfer destination substrate 600 are opposed to each other and bonded together with an adhesive interposed therebetween. Then, the thin film element group 110 is transferred to the second transfer destination substrate 600 by peeling the transfer destination substrate 200 from the second transfer destination substrate 600, and then the water-soluble adhesive 150 is removed. Accordingly, the thin film element group 110 can be transferred from the manufacturer substrate 100 to the second transfer destination substrate 600.

  In this embodiment, when performing the water repellent treatment, the water repellent treatment is performed on both the peripheral portion 130 of the manufacturer substrate 100 on which the thin film element group 110 is formed and the peripheral portion 230 of the transfer destination substrate 200. Accordingly, when the manufacturer substrate 100 is peeled from the transfer destination substrate 200, it is possible to prevent the manufacturer substrate 100 from being broken and finished.

  Further, in the present embodiment, the non-peripheral portion outside the water-repellent region on the surface of the manufacturer substrate of the manufacturer substrate 100 is subjected to a hydrophilic treatment, and the non-periphery outside the water-repellent region of the transfer destination substrate 200 on the transfer destination substrate. Hydrophilic treatment is performed on the part. Accordingly, the manufacturer substrate 100 and the transfer destination substrate 200 can be easily bonded to each other by the water-soluble adhesive 150.

  In the present embodiment, the peripheral portion 130 on the manufacturer substrate surface of the manufacturer substrate 100 is in the range of 1 mm or more and 10 mm or less from the end surface of the manufacturer substrate 100. Accordingly, it is possible to obtain the effect of the water repellent treatment while increasing the area where the thin film element group 110 on the manufacturer substrate 100 can be formed. If the peripheral portion 130 to be subjected to the water repellent treatment is too narrow, the effect of preventing the water-soluble adhesive 150 from being bonded when the water-soluble adhesive 150 leaks is lost. Therefore, the peripheral portion 130 on the manufacturer substrate surface of the manufacturer substrate 100 is It is preferable that the distance is 1 mm or more from the end surface of the manufacturer substrate 100. On the other hand, if the range of the peripheral portion 130 becomes too wide, the surface area of the manufacturer's substrate becomes small. In order to stabilize the water repellent treatment, obtain the effect of performing the water repellent treatment, and maximize the manufacturer substrate surface area, it is more preferable to set the predetermined range in the peripheral portion 130 to 2 mm or more and 6 mm or less.

<4. Supplement>
In the embodiment, the water repellent treatment is performed on both the peripheral portion 130 of the manufacturer's substrate 100 and the peripheral portion 230 of the transfer destination substrate 200, but the water repellent treatment is performed on either one of these. May be. Further, although the hydrophilic treatment is performed on both the non-peripheral portion of the manufacturer substrate 100 and the non-peripheral portion of the transfer destination substrate 200, it may be performed only on one of them. Furthermore, the hydrophilic treatment is not necessarily performed.

  Further, as a method of performing hydrophilic treatment and water repellent treatment, in the embodiment, after hydrophilic treatment is performed on the entire surface of the manufacturer substrate 100 and the transfer destination substrate 200, the peripheral portion to be subjected to the water repellent treatment is repelled. Although the example which performs a water treatment is given, it is not the meaning limited to this. That is, for example, after the water repellent treatment is performed on the entire surface of the manufacturer substrate 100 and the transfer destination substrate 200, the non-peripheral portions may be subjected to a hydrophilic treatment.

DESCRIPTION OF SYMBOLS 100 ... Manufacturer substrate, 110 ... Thin film element group, 120 ... Release layer, 130 ... Peripheral part, 140 ... Means, 150 ... Water-soluble adhesive, 200 ... Transfer destination substrate, 230 ... Peripheral part , 300 ... Stage, 400 ... Ultraviolet light, 500 ... Laser light, 600 ... Second transfer destination substrate

Claims (13)

In the thin film element group transfer method of transferring the thin film element group formed on the manufacturer's substrate surface to the transfer destination substrate surface,
A surface treatment step of creating a water-repellent region by performing water-repellent treatment on at least one of the peripheral portion of the manufacturer substrate and the peripheral portion of the transfer destination substrate;
An adhesive application step of applying a water-soluble adhesive to at least one of the manufacturer substrate surface and the transfer destination substrate surface;
A substrate placement step of placing the manufacturer substrate surface and the transfer destination substrate surface opposite to each other via the water-soluble adhesive;
An adhesive curing step for curing the water-soluble adhesive;
And a substrate peeling step of transferring the thin film element group to the transfer destination substrate by peeling the manufacturer substrate from the transfer destination substrate. In the adhesive application step, a water-soluble adhesive is applied to the substrate surface of the smaller area between the manufacturer substrate and the transfer destination substrate,
2. The thin film element group transfer according to claim 1, wherein, in the substrate placement step, the substrate having the larger area is arranged so as to cover the entire surface of the substrate having the smaller area in plan view. Method. An enclosing means forming step for forming an enclosing means on the surface of the smaller substrate before the adhesive application step;
The enclosing means is formed so as to surround the thin film element group inside the water-repellent region during the substrate arranging step.
3. The thin film element group transfer method according to claim 2, wherein in the adhesive application step, the water-soluble adhesive is applied to the inside of the enclosing means.   4. The thin film element group transfer method according to claim 3, wherein the enclosing means is formed of an enclosing adhesive having a viscosity of 5000 cps or more and 50000 cps or less.   The method for transferring a thin film element group according to claim 3 or 4, wherein the enclosing adhesive is a pressure-sensitive adhesive, a sealant, or a water-soluble adhesive.   The substrate placing step of placing the substrate having the smaller area on a stage having an installation surface having a smaller area than the substrate having the smaller area is provided before the substrate placing step. The method for transferring a thin film element group according to any one of 2 to 5.   The thin film element group transfer method according to any one of claims 1 to 6, wherein the water-soluble adhesive applied in the adhesive application step has a viscosity of 1 cps or more and 50 cps or less. After the substrate peeling step, the second bonding step in which the transfer destination substrate surface to which the thin film element group has been transferred and the second transfer destination substrate surface are opposed to each other and the second adhesive is interposed therebetween, and
A second transfer step of transferring the thin film element group to the second transfer destination substrate by peeling the transfer destination substrate from the second transfer destination substrate;
The thin film element group transfer method according to any one of claims 1 to 7, further comprising an adhesive removing step of removing the water-soluble adhesive.   9. The thin film element according to claim 1, wherein in the surface treatment step, water repellent treatment is performed on both a peripheral portion of the manufacturer substrate and a peripheral portion of the transfer destination substrate. Group transfer method.   The surface treatment step includes a step of creating a hydrophilic region by applying a hydrophilic treatment to the outside of the water-repellent region formed on the surface of the manufacturer substrate or the surface of the transfer destination substrate. 10. The method for transferring a thin film element group according to any one of 9 above.   11. The thin film element group transfer method according to claim 1, wherein the water-repellent region is in a range of 1 mm or more and 10 mm or less from an end face of the manufacturer substrate or the transfer destination substrate. .   The method for transferring a thin film element group according to claim 1, wherein fluorine plasma treatment is performed as the water repellent treatment performed in the surface treatment step.   The method for transferring a thin film element group according to any one of claims 1 to 11, wherein fats and oils are applied as the water repellent treatment performed in the surface treatment step.