JP2009006480A - Grinding device - Google Patents
Grinding device Download PDFInfo
- Publication number
- JP2009006480A JP2009006480A JP2008263753A JP2008263753A JP2009006480A JP 2009006480 A JP2009006480 A JP 2009006480A JP 2008263753 A JP2008263753 A JP 2008263753A JP 2008263753 A JP2008263753 A JP 2008263753A JP 2009006480 A JP2009006480 A JP 2009006480A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- gas
- temperature
- polishing liquid
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 70
- 238000005498 polishing Methods 0.000 claims description 132
- 238000007664 blowing Methods 0.000 claims description 19
- 238000002347 injection Methods 0.000 abstract description 19
- 239000007924 injection Substances 0.000 abstract description 19
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 42
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本発明は、研磨液槽内の研磨液に研磨対象物を浸して、研磨対象物の表面に気体を噴射することによって研磨を実施する研磨装置に関する。 The present invention relates to a polishing apparatus that performs polishing by immersing a polishing object in a polishing liquid in a polishing liquid tank and injecting gas onto the surface of the polishing object.
従来、水等の液体と研磨材とを混合した研磨液を噴射ノズルから噴射させて研磨対象物の表面を研磨する、という方法が知られている。この場合には、研磨材が直接噴射ノズルの通路中を通過するので、噴射ノズルの先端に研磨材が付着して目詰まりを起こすという問題がある。また、研磨材が高速で噴射ノズルの細い通路を通過することになるので、通路内壁の摩耗の原因になり、通路内壁が摩耗すると、噴射ノズルの通路の径が変わることになり、このような状況で研磨を実施すると、研磨液の流量変化に伴う研磨速度の変化により、研磨対象物の表面にむらができる原因になる。 Conventionally, a method of polishing a surface of an object to be polished by spraying a polishing liquid obtained by mixing a liquid such as water and an abrasive from an injection nozzle is known. In this case, since the abrasive directly passes through the passage of the injection nozzle, there is a problem that the abrasive adheres to the tip of the injection nozzle and causes clogging. In addition, since the abrasive passes through the narrow passage of the injection nozzle at high speed, it causes wear of the inner wall of the passage, and when the inner wall of the passage is worn, the diameter of the passage of the injection nozzle changes, and When polishing is performed under the circumstances, the surface of the object to be polished becomes uneven due to the change in the polishing rate accompanying the change in the flow rate of the polishing liquid.
一方、被加工物のバリ取りを行う装置として特許文献1に記載の液中表面加工装置が公開されている。ここでは、この装置は、タンク内の研磨剤混入液中に被加工物が載置され、この被加工物の加工対象表面へ向けてノズル装置から加工流体が高圧噴射されるようになっており、この加工流体として各種液体及び気体が利用可能である旨記載されている。但し、この特許文献1では、加工流体として気体を用いた実施形態は記載されていないものである。
しかしながら、この特許文献1に記載のものは、バリ取りを行う装置であるため、高精度の表面研磨が要求される光学素子等の研磨に適用するのは難しいものである。 However, since the device described in Patent Document 1 is a deburring device, it is difficult to apply it to polishing of optical elements and the like that require highly accurate surface polishing.
そこで、本発明者らは、研磨材と水などの液体からなる研磨液で満たした研磨液槽内に研磨対象物を浸して噴射ノズルから気体を噴射する研磨装置を特許出願している(但し、現時点では未公開)。この噴射ノズルから気体を噴射することにより、この気体に巻き込まれた研磨液によって研磨対象物の表面研磨を行うものである。 Therefore, the inventors have applied for a patent on a polishing apparatus that immerses a polishing object in a polishing liquid tank filled with a polishing liquid consisting of a polishing material and a liquid such as water and injects a gas from an injection nozzle (however, , Not yet published). By injecting gas from this injection nozzle, the surface of the object to be polished is polished with the polishing liquid entrained in this gas.
しかし、図2に示すように、気体14の噴射を用いて研磨対象物を研磨する際に、噴射ノズル15から噴射された気体14は、研磨液中で急激に膨張することにより温度低下する。従って、この気体噴射による研磨を実行し続けると研磨液の温度も低下することになり、単位時間当たりの研磨除去量が低下し、研磨対象物の研磨加工時間が長くなってしまい、研磨の安定性に欠ける、という現象を本発明者らは見出した(図3参照)。
However, as shown in FIG. 2, when the object to be polished is polished by using the injection of the
そこで、本発明は、研磨速度を一定に保ち研磨の安定性を保つことが可能な研磨装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a polishing apparatus capable of maintaining a constant polishing rate and maintaining polishing stability.
本発明に係る第1の研磨装置は、研磨液槽(11)内の研磨液(13)に研磨対象物(12)を浸し、該研磨対象物の表面に気体(14)を噴射することによって前記表面の研磨を行う研磨装置(10)であって、研磨時間中の前記研磨液の温度を一定に保つための温度調節手段(18、22)を備え、前記温度調節手段は、前記研磨液槽の壁面に気体(24)を吹き付ける気体吹付手段(22)を設置し、該気体吹付手段により吹き付ける気体の温度を制御することにより、前記研磨液の温度を一定に保つ研磨装置としたことを特徴とする。 The first polishing apparatus according to the present invention immerses the polishing object (12) in the polishing liquid (13) in the polishing liquid tank (11) and injects a gas (14) onto the surface of the polishing object. A polishing apparatus (10) for polishing the surface, comprising temperature adjusting means (18, 22) for maintaining a constant temperature of the polishing liquid during a polishing time, wherein the temperature adjusting means comprises the polishing liquid A polishing apparatus for keeping the temperature of the polishing liquid constant by installing a gas blowing means (22) for blowing gas (24) on the wall surface of the tank and controlling the temperature of the gas blown by the gas blowing means. Features.
本発明に係る第2の研磨装置は、研磨液槽(11)内の研磨液(13)に研磨対象物(12)を浸し、該研磨対象物の表面に気体(14)を噴射することによって前記表面の研磨を行う研磨装置(10)であって、研磨時間中の前記研磨液の温度を一定に保つための温度調節手段(18、22)を備え、前記温度調節手段は、前記研磨液槽の壁面に所定の温度の気体(24)を吹き付ける気体吹付手段(22)を設置し、該気体吹付手段により吹き付ける気体の送風量を制御することにより、前記研磨液の温度を一定に保つ研磨装置としたことを特徴とする。 The second polishing apparatus according to the present invention immerses the polishing object (12) in the polishing liquid (13) in the polishing liquid tank (11) and injects a gas (14) onto the surface of the polishing object. A polishing apparatus (10) for polishing the surface, comprising temperature adjusting means (18, 22) for maintaining a constant temperature of the polishing liquid during a polishing time, wherein the temperature adjusting means comprises the polishing liquid Polishing that keeps the temperature of the polishing liquid constant by installing a gas blowing means (22) for blowing a gas (24) of a predetermined temperature on the wall surface of the tank and controlling the amount of gas blown by the gas blowing means It is a device.
なお、ここでは、本発明をわかりやすく説明するため、実施の形態を表す図面の符号に対応づけて説明したが、本発明が実施の形態に限定されるものでないことは言及するまでもない。 Here, in order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings representing the embodiments, but it goes without saying that the present invention is not limited to the embodiments.
請求項1に記載の発明によれば、研磨液槽内の研磨液に研磨対象物を浸し、該研磨対象物の表面に気体を噴射することによって前記表面の研磨を行う研磨装置であって、研磨時間中の前記研磨液の温度を一定に保つための温度調節手段を備えるので、研磨速度が一定であり、安定した研磨が実施可能となる。この効果に加えて、前記温度調節手段は、前記研磨液槽の壁面に気体を吹き付ける気体吹付手段を設置し、該気体吹付手段により吹き付ける気体の温度を制御することにより、前記研磨液の温度を一定の温度に保つので、より研磨速度が一定で、安定した研磨が実施可能となる。 According to the first aspect of the present invention, there is provided a polishing apparatus that polishes the surface by immersing a polishing object in a polishing liquid in a polishing liquid tank and injecting a gas onto the surface of the polishing object. Since the temperature adjusting means for keeping the temperature of the polishing liquid constant during the polishing time is provided, the polishing rate is constant and stable polishing can be performed. In addition to this effect, the temperature adjusting means is provided with gas blowing means for blowing gas onto the wall surface of the polishing liquid tank, and the temperature of the polishing liquid is controlled by controlling the temperature of the gas blown by the gas blowing means. Since the temperature is kept constant, the polishing rate is more constant and stable polishing can be performed.
請求項2に記載の発明によれば、研磨液槽内の研磨液に研磨対象物を浸し、該研磨対象物の表面に気体を噴射することによって前記表面の研磨を行う研磨装置であって、研磨時間中の前記研磨液の温度を一定に保つための温度調節手段を備えるので、研磨速度が一定であり、安定した研磨が実施可能となる。この効果に加えて、前記温度調節手段は、前記研磨液槽の壁面に所定の温度の気体を吹き付ける気体吹付手段を設置し、該気体吹付手段により吹き付ける気体の送風量を制御することにより、前記研磨液の温度を一定に保つので、より研磨速度が一定で、安定した研磨が実施可能となる。 According to the invention of claim 2, a polishing apparatus for polishing the surface by immersing a polishing object in a polishing liquid in a polishing liquid tank and injecting a gas onto the surface of the polishing object, Since the temperature adjusting means for keeping the temperature of the polishing liquid constant during the polishing time is provided, the polishing rate is constant and stable polishing can be performed. In addition to this effect, the temperature adjusting means is provided with a gas blowing means for blowing a gas of a predetermined temperature on the wall surface of the polishing liquid tank, and by controlling the amount of gas blown by the gas blowing means, Since the temperature of the polishing liquid is kept constant, the polishing rate is more constant and stable polishing can be performed.
以下、本発明の実施の形態について説明する。
[発明の実施の形態1]
Embodiments of the present invention will be described below.
Embodiment 1 of the Invention
図1は、本発明の実施の形態1に係る研磨装置10の概念図である。
FIG. 1 is a conceptual diagram of a
まず、構成を説明する。 First, the configuration will be described.
研磨装置10は、研磨液13に研磨対象物12を浸すための研磨液槽11と、研磨対象物12に気体14を噴射させるための噴射ノズル15とを備えている。研磨液層11の周囲には、送風機22からの気体24を吹き付ける温度安定用ノズル23が設置されて、直接、研磨液層11に対面している。そして、その送風機22が温度コントローラー18に接続され、この温度コントローラー18が温度計16に接続されている。この送風機22及び温度コントローラー18等により、「温度調節手段」が構成されている。
The
その研磨液槽11は、所定の容量の研磨液13が貯留可能な大きさの四角形の箱形状を呈し、内部の略中央部に研磨対象物12が配設できるように構成されている。
The polishing
その研磨液13は、研磨材と水とを混合したもので、この研磨材としては、酸化物系(CeO2 、ZrO2 、Al2 O3 )の研磨材、コロイダルシリカ等が用いられる。
The polishing
また、研磨対象物12としては、蛍石、石英、紫外線用多成分ガラス、低熱膨張ガラス、シリコン、無電解ニッケル等が用いられる。
As the
さらにまた、温度コントローラー18は、研磨液13の温度を計測するための温度計16に接続されている。
Furthermore, the
このようなものにあっては、噴射ノズル15から気体14が噴射され、その気体14に巻き込まれた研磨液13が、研磨対象物12の表面に衝突することにより、この研磨対象物12の表面が研磨される。噴射された気体14は、図2で示したように、急激に温度低下するが、温度計16で計測された温度を基に、所定の温度になるように温度コントローラー18が演算を行い、演算結果を送風機22にフィードバックさせることにより、送風機22から送出される気体24の温度を制御したり、所定の温度の気体24の送風量を制御することによって、研磨液13の温度を一定に調節するようにしている。これにより、研磨速度を一定に保つことができ、安定した研磨が実施可能となる。
In such a case, the
また、研磨材と混合させる液体として、水など沸点が比較的高く、化学反応性のない液体の場合は、研磨液13、若しくは研磨液槽11をヒーター(図示せず)で直接加熱する手法(以下、「直接加熱法」という。)が好適であるが、アルコール類やその他有機溶媒のように沸点が比較的低くて化学反応性が高く、場合によっては引火する液体を使用する場合には、直接加熱法によると、熱が局所に集中して、局所的に沸点を超えてしまったり、又、液体の変性を引き起こす虞がある。そこで、気体24を用いて研磨液槽11を加温することとすれば、研磨液槽11を穏やかに加温することができる。
In addition, when the liquid to be mixed with the abrasive is a liquid having a relatively high boiling point such as water and no chemical reactivity, a method of directly heating the
なお、本発明の実施の形態1の変形例として、噴射ノズル15から噴射される気体14自体を所定の温度に暖めて、噴射ノズル15から噴出させても良い。また、噴射ノズル15自体を所定の温度に暖めることにより、研磨液13を暖めるためのヒーターとして用いても良い。これらの構成を用いることで、研磨液13の温度を一定に保つことが可能となる。したがって、研磨速度を一定に保つことができ、安定した研磨が実施可能となる。
As a modification of the first embodiment of the present invention, the
10……研磨装置
11……研磨液槽
12……研磨対象物
13……研磨液
14……気体
15……噴射ノズル
16……温度計
18……温度コントローラー
22……送風機
23……温度安定用ノズル
24……気体
DESCRIPTION OF
Claims (2)
研磨時間中の前記研磨液の温度を一定に保つための温度調節手段を備え、
前記温度調節手段は、前記研磨液槽の壁面に気体を吹き付ける気体吹付手段を設置し、該気体吹付手段により吹き付ける気体の温度を制御することにより、前記研磨液の温度を一定に保つことを特徴とする研磨装置。 A polishing apparatus that polishes the surface by immersing a polishing object in a polishing liquid in a polishing liquid tank and injecting a gas onto the surface of the polishing object,
Comprising a temperature adjusting means for keeping the temperature of the polishing liquid constant during the polishing time;
The temperature adjusting means is provided with gas blowing means for blowing gas onto the wall surface of the polishing liquid tank, and the temperature of the polishing liquid is kept constant by controlling the temperature of the gas blown by the gas blowing means. Polishing equipment.
研磨時間中の前記研磨液の温度を一定に保つための温度調節手段を備え、
前記温度調節手段は、前記研磨液槽の壁面に所定の温度の気体を吹き付ける気体吹付手段を設置し、該気体吹付手段により吹き付ける気体の送風量を制御することにより、前記研磨液の温度を一定に保つことを特徴とする研磨装置。 A polishing apparatus that polishes the surface by immersing a polishing object in a polishing liquid in a polishing liquid tank and injecting a gas onto the surface of the polishing object,
Comprising a temperature adjusting means for keeping the temperature of the polishing liquid constant during the polishing time;
The temperature adjusting means is provided with gas blowing means for blowing a gas at a predetermined temperature onto the wall surface of the polishing liquid tank, and the temperature of the polishing liquid is kept constant by controlling the amount of gas blown by the gas blowing means. A polishing apparatus characterized by being kept at
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008263753A JP4710952B2 (en) | 2008-10-10 | 2008-10-10 | Polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008263753A JP4710952B2 (en) | 2008-10-10 | 2008-10-10 | Polishing equipment |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004064245A Division JP4228146B2 (en) | 2004-03-08 | 2004-03-08 | Polishing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009006480A true JP2009006480A (en) | 2009-01-15 |
JP4710952B2 JP4710952B2 (en) | 2011-06-29 |
Family
ID=40322094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008263753A Expired - Fee Related JP4710952B2 (en) | 2008-10-10 | 2008-10-10 | Polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4710952B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110666703A (en) * | 2019-09-12 | 2020-01-10 | 武汉大学 | Closed autogenous abrasive material jet device and experimental method using same |
CN114643508A (en) * | 2020-12-21 | 2022-06-21 | 无锡飞云球业股份有限公司 | Efficient burn-free hard grinding operation method for steel balls |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6213528A (en) * | 1985-07-11 | 1987-01-22 | Nippon Steel Corp | Apparatus for heat treating hot rolled rail |
JPH01147051A (en) * | 1987-12-03 | 1989-06-08 | Toshiba Corp | Method and apparatus for flame spraying inner surface of thin-walled cylindrical body |
JPH01242719A (en) * | 1988-03-24 | 1989-09-27 | Nippon Steel Corp | Equipment for heat-treating hot-rolled rail |
JPH0839428A (en) * | 1994-07-22 | 1996-02-13 | Yamaguchi Pref Gov | Coolant supplying device for both dry type cutting grinding wheel and wet type cutting grinding wheel |
JPH10303155A (en) * | 1997-04-24 | 1998-11-13 | Hitachi Ltd | Polishing method and polishing device |
JPH11347935A (en) * | 1998-06-10 | 1999-12-21 | Ebara Corp | Polishing device |
JP2000079553A (en) * | 1998-09-02 | 2000-03-21 | Nec Corp | Polishing device and polishing method |
JP2000158330A (en) * | 1998-11-30 | 2000-06-13 | Speedfam-Ipec Co Ltd | Manufacturing device for highly flat material |
JP2002113663A (en) * | 2000-10-05 | 2002-04-16 | Sugino Mach Ltd | Method and device for working of under-liquid surface |
-
2008
- 2008-10-10 JP JP2008263753A patent/JP4710952B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6213528A (en) * | 1985-07-11 | 1987-01-22 | Nippon Steel Corp | Apparatus for heat treating hot rolled rail |
JPH01147051A (en) * | 1987-12-03 | 1989-06-08 | Toshiba Corp | Method and apparatus for flame spraying inner surface of thin-walled cylindrical body |
JPH01242719A (en) * | 1988-03-24 | 1989-09-27 | Nippon Steel Corp | Equipment for heat-treating hot-rolled rail |
JPH0839428A (en) * | 1994-07-22 | 1996-02-13 | Yamaguchi Pref Gov | Coolant supplying device for both dry type cutting grinding wheel and wet type cutting grinding wheel |
JPH10303155A (en) * | 1997-04-24 | 1998-11-13 | Hitachi Ltd | Polishing method and polishing device |
JPH11347935A (en) * | 1998-06-10 | 1999-12-21 | Ebara Corp | Polishing device |
JP2000079553A (en) * | 1998-09-02 | 2000-03-21 | Nec Corp | Polishing device and polishing method |
JP2000158330A (en) * | 1998-11-30 | 2000-06-13 | Speedfam-Ipec Co Ltd | Manufacturing device for highly flat material |
JP2002113663A (en) * | 2000-10-05 | 2002-04-16 | Sugino Mach Ltd | Method and device for working of under-liquid surface |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110666703A (en) * | 2019-09-12 | 2020-01-10 | 武汉大学 | Closed autogenous abrasive material jet device and experimental method using same |
CN110666703B (en) * | 2019-09-12 | 2021-04-16 | 武汉大学 | Closed autogenous abrasive material jet device and experimental method using same |
CN114643508A (en) * | 2020-12-21 | 2022-06-21 | 无锡飞云球业股份有限公司 | Efficient burn-free hard grinding operation method for steel balls |
Also Published As
Publication number | Publication date |
---|---|
JP4710952B2 (en) | 2011-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6427166B2 (en) | Processing system and method for providing a heated etchant | |
JP5889971B2 (en) | Foam supply system for stable precursor supply | |
KR101541212B1 (en) | Polishing method | |
WO2016204143A1 (en) | Substrate processing system and substrate processing method | |
JP4710952B2 (en) | Polishing equipment | |
KR20080017993A (en) | Apparatus for cleaning the substrate | |
KR101470560B1 (en) | Dryice injection cleaning device | |
US20070006904A1 (en) | Substrate cleaning system and substrate cleaning method | |
JP4228146B2 (en) | Polishing equipment | |
KR101604438B1 (en) | The apparatus of cleaning by di water a high temperature and mist formation | |
KR101381634B1 (en) | Apparatus for injecting multi-phase fluid | |
US20200001397A1 (en) | Laser processing apparatus | |
CN101371340B (en) | Method for smoothing wafer surface and apparatus used therefor | |
JPH11330039A (en) | Substrate processing device | |
JPH07161674A (en) | Device and method for processing semiconductor wafer | |
US20080083427A1 (en) | Post etch residue removal from substrates | |
KR20110029593A (en) | Apparatus and method of supplying solution | |
JP5568743B2 (en) | Atomizing device constant temperature water circulation system, atomizing device, and wiring forming device | |
KR101099541B1 (en) | Apparatus and method of supplying solution | |
JP2007327669A (en) | Drying gas supply method, drying gas supply device, and substrate treatment device using the same | |
JP2005246590A (en) | Spray nozzle, polishing device, polishing method, optical element and exposure device | |
JP4341432B2 (en) | Polishing apparatus and polishing processing method | |
JP2016203351A (en) | Processing device | |
JP2017082315A (en) | Method for manufacturing thermal spray member and spray coating apparatus | |
JP2005246587A (en) | Polishing apparatus, polishing method, optical element, and semicondutor exposure apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081010 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100727 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100729 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100922 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110307 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4710952 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140401 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |