JP2008306088A - Process control system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process control system which is capable of quickly analyzing information obtained by a device. <P>SOLUTION: The system has a first acquisition means (control monitoring part 20) for acquiring state information showing a state of each part of the device, a second acquisition means (control monitoring part 20) for acquiring control information regarding the control of the device, a means (timer 34) for associating the acquired state information with control information, a storage means (log storing device 2) for storing the state information and the control information made to correspond to each other, an input means (input device 4i) for receiving input of conditions of analysis on the occasion of an analytical processing, a storage means (RAM 4c) for storing the input conditions of analysis, an analytical means (CPU 4a) for applying the analytical processing to the state information according to the stored conditions of analysis by reference to the control information, and a presentation means (display device 4h) for presenting information obtained as the result of the analysis. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a process management system.

  In recent years, for example, when processing an object to be processed using a process apparatus (for example, a CVD apparatus) as disclosed in Patent Document 1, high process accuracy has been required.

JP 2003-17437 A (FIG. 1)

  By the way, in a process apparatus as shown in Patent Document 1, conventionally, an analog waveform indicating the state of each part of the apparatus is sampled and stored in a storage device. The cause was analyzed based on the stored information.

  However, since these operations are performed manually, there is a problem that analysis takes time. In addition, as described above, in recent years, a slight difference in the process greatly affects the performance of the processing object in connection with the increase in process accuracy. In order to detect manually, there exists a problem that much time is required.

  The present invention has been made based on the above circumstances, and an object of the present invention is to provide a process management system capable of quickly analyzing information obtained by an apparatus.

  In order to achieve the above object, the process management system of the present invention includes a first acquisition unit that acquires state information indicating the state of each unit of the apparatus, and a second acquisition unit that acquires control information related to control of the apparatus. The association means for associating the state information and the control information acquired by the first and second acquisition means, the storage means for storing the state information and the control information associated by the association means, and the control information And input means for receiving analysis conditions when performing analysis processing on the state information, storage means for storing analysis conditions input from the input means, and control information according to the analysis conditions stored in the storage means An analysis unit that performs an analysis process on the state information with reference to a display unit that presents information obtained as a result of analysis by the analysis unit. Thereby, it is possible to provide a process management system capable of quickly analyzing information obtained by the apparatus.

  In addition to the above-described invention, the process management apparatus according to another invention includes an input unit having a plurality of analysis condition templates, receiving input of analysis conditions using the template, and any of the plurality of templates. A first interface that receives the selection, and a second interface that receives the selection as to whether to execute each analysis condition input via the first interface. As a result, the analysis conditions can be easily input using the template in the first interface, and the analysis conditions to be executed in the second interface can be easily selected.

  In addition to the above-described invention, in the process management apparatus of another invention, information indicating the analysis condition selected in the first interface is displayed as text information on the second interface. Thereby, the set analysis conditions can be easily known.

  In addition to the above-described invention, the process management apparatus according to another invention, when the second interface performs a predetermined operation, duplicates the analysis condition input through the first interface. Thus, another new analysis condition is generated. Thereby, partially different analysis conditions can be easily generated.

  In addition to the above-described invention, the process management apparatus according to another invention is configured so that the presenting means presents information of the analysis result based on the analysis condition selected in the second interface as a graph. Thereby, the result of the analysis can be easily confirmed visually.

  In addition to the above-described invention, the process management apparatus of another invention has a third interface for designating the type of information acquired by the first acquisition unit and the second acquisition unit, In this interface, a template based on information designated via the third interface is displayed. Thereby, in the third interface, it is possible to easily select state information and control information to be analyzed.

  In addition to the above-described invention, the process management apparatus of another invention is supplied with status information and control information as an electronic file, and the first acquisition unit and the second acquisition unit each include a plurality of electronic files. I try to get it at the same time. For this reason, it is possible to know a change with time by performing analysis processing on a plurality of electronic files at the same time, for example, by analyzing electronic files generated at different times.

  ADVANTAGE OF THE INVENTION According to this invention, the process management system which can analyze rapidly the information obtained by an apparatus can be provided.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following, (A) a configuration example of the embodiment, (B) an outline of the operation of the embodiment, (C) details of the operation of the embodiment, and (D) a modified implementation mode will be described in this order.

(A) Configuration example of the embodiment

  FIG. 1 is a diagram showing a configuration example of an embodiment of a process management system of the present invention. As shown in this figure, the process management system includes a vacuum process device 1, a log storage device 2, a network 3, and an analysis device 4 as main components.

  Here, the vacuum process apparatus 1 includes, for example, a PVD (Physical Vapor Deposition) apparatus, a CVD (Chemical Vapor Deposition) apparatus, an etching apparatus, an implanter apparatus, a photolithography apparatus, and the like. In this example, as will be described later, a PVD apparatus is taken as an example.

  The log storage device 2 acquires and stores the log data generated in the vacuum process device 1 via the network 3 and stores the stored log data in the network 3 when requested by the analysis device 4. To send through.

  The network 3 is configured by, for example, a LAN (Local Area Network) or the like, and electrically connects the vacuum process device 1, the log storage device 2, and the analysis device 4 to each other. Is possible.

  The analysis device 4 is configured by a personal computer, for example, acquires log data stored in the log storage device 2 via the network 3, and executes various analysis processes.

  FIG. 2 is a diagram showing a detailed configuration example of the vacuum process apparatus 1 shown in FIG. In the example of this figure, the vacuum process apparatus 1 includes a chamber 10, a wafer stage 11, a wafer 12, a target 13, an ion reflector 14, a magnet 15, a control monitoring unit 20, a DC (Direct Current) power supply unit 21, and a gas supply unit 22. , Gas flow rate control unit 23, pressure detection unit 24, heater control unit 25, RF (Radio Frequency) power supply unit 26, temperature detection unit 27, electrostatic chuck unit 28, dry pump 29, turbo pump 30, dry pump 31, IR (Ion Reflector) The power supply unit 32, the communication unit 33, and the timer 34 are main components.

  Here, the chamber 10 is a hollow container made of, for example, quartz, stainless steel, aluminum, copper, alumina, titanium, or the like, shuts off the atmosphere, and creates a high vacuum / internal atmosphere corresponding to each process. Hold.

  The wafer stage 11 is a stage for placing the wafer 12 thereon. An electrostatic chuck mechanism (not shown) for adsorbing the wafer 12 by electrostatic force is disposed on the wafer stage 11 (upward in the figure). In addition, a heater and a temperature detection sensor (both not shown) are disposed inside.

  The wafer 12 to be processed is, for example, a silicon substrate, and in this apparatus, copper wiring is formed on the silicon substrate by PVD.

  The target 13 is made of, for example, a copper plate. When the argon plasma collides with the target 13, the constituent particles recoil and are deposited on the wafer 12.

  The ion reflector 14 is a cylindrical member configured to surround the target 13 and the wafer stage 11, and has a function of reflecting (accelerating) the ion by applying an electrical repulsive force to the ions.

  The magnet 15 is disposed above the target 13 and has a function of accelerating the application of Lorentz force to the argon ions in the plasma and increasing the efficiency with which copper molecules are released from the target 13.

  The control monitoring unit 20 as a part of the first acquisition unit, the second acquisition unit, and the association unit includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The microcomputer is configured to control each unit of the apparatus based on a program stored in the ROM, generate log data, and transmit the log data to the log storage apparatus 2 via the communication unit 33 and the network 3.

  The DC power supply unit 21 applies a DC voltage between them so that the target 13 is negative and the ground is positive, and turns argon gas filled in the space between the target 13 and the wafer 12 into plasma.

  The gas supply unit 22 supplies argon gas into the chamber 10 via the gas flow rate control unit 23.

  The gas flow rate control unit 23 is constituted by, for example, a mass flow controller or the like, and controls the flow rate of the gas supplied from the gas supply unit 22 according to the control of the control monitoring unit 20, and also controls the gas flow rate at that time. 20 is notified.

  The pressure detection unit 24 includes, for example, an ion gauge, a Pirani gauge, etc., measures the pressure inside the chamber 10, and notifies the control monitoring unit 20 of the measurement result.

  The heater control unit 25 controls the heater built in the wafer stage 11 according to the control of the control monitoring unit 20 so that the temperature of the wafer 12 becomes a desired temperature.

  The RF power supply unit 26 applies high-frequency power between the ground and the wafer stage, and applies an RF bias to the wafer 12 to charge the wafer 12 negatively and between the copper ions having a positive charge. Cause electrical attraction. Thereby, since copper ions collide with the wafer 12 at high speed, the copper ions reach the deep part of the recess formed in the wafer 12.

  The temperature detection unit 27 detects the temperature of the wafer stage 11 and notifies the control monitoring unit 20 of the detection result.

  The electrostatic chuck unit 28 controls the chuck mechanism provided on the wafer stage 11 according to the control of the control monitoring unit 20 to attract and fix the wafer 12.

  The dry pump 29 discharges the air existing inside the chamber 10 to the outside according to the control of the control monitoring unit 20, and puts the inside of the chamber 10 into a vacuum state.

  The turbo pump 30 is a pump for achieving a higher degree of vacuum than the dry pump 29 and discharges the gas inside the chamber 10 to the outside.

  The dry pump 31 is connected to the exhaust side of the turbo pump 30 and increases the efficiency of the turbo pump 30 by discharging the gas discharged from the turbo pump 30 to the outside.

  The IR power supply unit 32 applies a DC voltage so that the ion reflector 14 becomes positive and the ground becomes negative in accordance with the control of the control monitoring unit 20, and the ion reflector 14 reflects (accelerates) copper ions.

  When the communication unit 33 performs communication between the log storage device 2 and the control monitoring unit 20 via the network 3, for example, the communication unit 33 performs control related to a communication protocol.

  For example, the timer 34 as a part of the association means generates information such as date information (year, month, time) and supplies the information to the control monitoring unit 20. The control monitoring unit 20 uses the date / time information generated by the timer 34 as a time stamp.

  FIG. 3 is a diagram illustrating a detailed configuration example of the log storage device 2 illustrated in FIG. 1. As shown in this figure, the log storage device 2 includes a CPU 2a, a ROM 2b, a RAM 2c, an HDD (Hard Disk Drive) 2d, an I / F (Interface) 2f, and a bus 2g as main components.

  Here, the CPU 2a controls each part of the apparatus based on a program 2d1 stored in the HDD 2d and a program (not shown) stored in the ROM 2b, and executes various arithmetic processes. Further, the CPU 2a acquires and stores log data from the vacuum process apparatus 1 based on the program 2d1 stored in the HDD 2d, and reads and supplies the log data in response to a request from the analysis apparatus 4.

  The ROM 2b is a semiconductor storage device that stores basic programs and data executed by the CPU 2a. The RAM 2c is a semiconductor storage device that temporarily stores programs and data executed by the CPU 2a.

  The HDD 2d as a storage unit is a storage device that stores information in a hard disk, which is a magnetic storage medium, and reads out stored information. In this example, the HDD 2d stores a program 2d1 and log data 2d2. Here, the program 2d1 includes a program such as an operating system for controlling the log storage device 2, an application program for acquiring and storing log data, and the like. The log data 2d2 stores log data acquired from the vacuum process apparatus 1 by an application program started by executing the program 2d1.

  The I / F (Interface) 2 f executes processing related to a protocol when exchanging information with the vacuum process apparatus 1 via the network 3. The bus 2g is a signal line group that electrically connects the CPU 2a, the ROM 2b, the RAM 2c, the HDD 2d, and the I / F 2f, and enables information exchange between them.

  FIG. 4 is a diagram showing a detailed configuration example of the analysis apparatus 4 shown in FIG. As shown in this figure, the analysis device 4 is mainly configured by a CPU 4a, a ROM 4b, a RAM 4c, an HDD 4d, an image processing unit 4e, an I / F 4f, a bus 4g, a display device 4h, and an input device 4i.

  Here, the CPU 4a as the analysis unit controls each part of the apparatus and executes various arithmetic processes based on the program 4d1 stored in the HDD 4d and the program stored in the ROM 4b. Further, the CPU 4a acquires log data stored in the log storage device 2 based on the program 4d1, and executes analysis processing.

  The ROM 4b is a semiconductor storage device that stores basic programs and data executed by the CPU 4a. The RAM 4c as a storage means is a semiconductor storage device that temporarily stores programs and data to be processed by the CPU 4a. The RAM 4c stores the acquired log data and also stores analysis conditions.

  The HDD 4d is a storage device that writes information to a hard disk, which is a magnetic storage medium, and reads the written information. In this example, a program 4d1 is stored. The program 4d1 includes, for example, a program such as an operating system for controlling the analysis device 4 and an application program for acquiring and analyzing log data.

  The image processing unit 4e executes a drawing process according to a drawing command supplied from the CPU 4a, converts the obtained image into a video signal, and supplies the video signal to the display device 4h. The I / F 4f converts the data representation format and the like when exchanging information between the input device 4i and the network 3. The bus 4g is a signal line group that electrically connects the CPU 4a, the ROM 4b, the RAM 4c, the HDD 4d, the image processing unit 4e, and the I / F 4f, and enables information exchange between them.

  The display device 4h as the presenting means is configured by, for example, an LCD (Liquid Crystal Display) or a CRT (Cathode Ray Tube) display, and displays a video corresponding to the video signal supplied from the image processing unit 4e (not shown). ).

  The input device 4i as an input means is constituted by, for example, a keyboard or a mouse, and generates information according to the operation of the administrator of the vacuum process management system and supplies it to the CPU 4a via the I / F 4f.

(B) Overview of operation of the embodiment

  In the vacuum process management system of the present embodiment, when process processing on the wafer 12 is started in the vacuum process apparatus 1, the control monitoring unit 20 controls each part (DC power supply) of the apparatus based on a preset control program. Control unit 21, gas flow rate control unit 23, etc.) to execute process processing. At that time, the control monitoring unit 20 generates data (event data) as control information related to control, and adds an ID (hereinafter referred to as “wafer ID”) for specifying the wafer 12 to be processed. At the same time, the time stamp supplied from the timer 34 is pasted, and the control monitoring unit 20 sets data (trace data) indicating the state of each part of the apparatus as a predetermined period (for example, 1/10). (Second interval), and a time stamp supplied from the timer 34 is pasted, and the obtained information is transmitted to the log storage device 2 as log data.

  The log storage device 2 stores the log data supplied from the vacuum process device 1 in the HDD 2d as log data 2d2.

  For example, when a defect occurs in the manufactured wafer 12, the administrator of the vacuum process management system (hereinafter simply referred to as “manager”) operates the input device 4 i of the analyzer 4 to store the log. The log data 2d2 stored in the device 2 is acquired, subjected to analysis processing, and analyzed from various viewpoints to identify the cause of the malfunction.

  That is, the administrator first operates the input device 4 i of the analysis device 4 to start an application program for analysis (hereinafter simply referred to as “program”). When the program is started, an input screen (details will be described later) as a third interface shown in FIG. 10 is displayed. The administrator designates trace data and event data to be analyzed.

  As a result, the analysis device 4 downloads the designated trace data and log data onto the RAM 4c. Then, the analysis device 4 executes processing for associating the downloaded trace data with the event data with reference to the time stamp. Here, the event data includes, for example, data indicating the start of gas supply from the gas supply unit 22, the wafer ID of the wafer 12 to be processed, and a time stamp indicating the date and time when the gas supply is started. It is out. The trace data is data including data indicating the gas flow rate at each time point and a time stamp at that time point. The analysis device 4 associates the two pieces of data on the time axis by associating the event data with the time stamp of the same date and time with the trace data.

  Next, the administrator operates the input device 4i of the analysis device 4 to display an input screen (details will be described later) as a second interface shown in FIG. On this input screen, an analysis condition can be set by operating the “definition” button to display an input screen (details will be described later) as a first interface shown in FIG. 14 described later. In this input screen, analysis conditions can be set for each of a plurality of “definition” buttons. Further, on this input screen, whether or not to execute a plurality of input analysis conditions can be selected by checking a check box displayed at the left end of the screen.

  When the “definition” button on the input screen shown in FIG. 13 is operated, the input screen shown in FIG. 14 is displayed. On this input screen, one of the analysis condition templates 91 to 103 is selected by a radio button, and the analysis condition is set using the selected analysis condition template. In this example, the analysis condition template 100 is selected, and “the time during which DC Voltage is in the range of 200 to 250 but between 0 seconds after the DC-ON starts and 0 seconds after the DC-OFF ends” is the condition. Is set as

  When the above settings are completed, the administrator operates the input device 4i of the analysis device 4 to execute analysis processing. As a result, the analysis device 4 executes an analysis process according to the input analysis condition. Specifically, in the above-described example, the trace data “DC Voltage” is targeted, the event data “DC-ON” and “DC-OFF” are referred to, and “DC-ON start 0 seconds after The time during which DC Voltage is in the range of 200 to 250 within 0 seconds after the end of DC-OFF is analyzed. The information obtained as a processing result is displayed as a graph on the display device 4h.

  The administrator can identify the cause of the malfunction by referring to the information displayed in this way. Moreover, it is possible to prevent the problem from occurring again by changing the control program stored in the control monitoring unit 20 based on the identified problem.

(C) Details of operation of embodiment

  Next, the detailed operation of the embodiment of the present invention will be described. Hereinafter, (C-1) event data generation processing in the vacuum process apparatus 1, (C-2) trace data generation processing in the vacuum process apparatus 1, and (C-3) analysis processing in the analysis apparatus 4 will be described in this order. I do.

(C-1) Event data generation processing in the vacuum process apparatus 1

  FIG. 5 is an example of a flowchart for explaining details of processing for generating event data in the vacuum process apparatus 1 shown in FIG. Before explaining the flowchart shown in FIG. 5, an event occurring in the vacuum process apparatus 1 will be described with reference to FIG.

  In the vacuum process apparatus 1, copper as a target 13 is sputtered by plasma generated by argon gas and deposited on the wafer 12. In the vacuum process apparatus 1, a wafer cassette (not shown) that holds a plurality of wafers 12 is set in the vacuum process apparatus 1, and when the start of the process is instructed, the wafers 12 are extracted from the wafer cassette one by one. Then, it is placed on the wafer stage 11 in the chamber 10. Next, the dry pump 29 is driven until the inside of the chamber 10 reaches a predetermined degree of vacuum. When a predetermined degree of vacuum is reached, the turbo pump 30 and the dry pump 31 are driven continuously. As a result, when the inside of the chamber 10 reaches a predetermined degree of vacuum, the process shown in FIG. 6 is started (ST1: a process start event occurs).

  Next, the control monitoring unit 20 controls the IR power source unit 32 to start supplying IR power, and controls the electrostatic chuck unit 28 to function the electrostatic chuck mechanism (ST2). As a result, a DC voltage is applied so that the ion reflector 14 is positive and the ground is negative. Further, when the electrostatic chuck portion 28 functions, the wafer 12 is attracted and fixed to the wafer stage 11.

  Next, the control monitoring unit 20 starts the gas flow by controlling the gas flow rate control unit 23 (ST3). As a result, the argon gas supplied from the gas supply unit 22 is introduced into the chamber 10 after the flow rate is adjusted by the gas flow rate control unit 23.

  Subsequently, the control monitoring unit 20 controls the DC power supply unit 21 and applies a DC voltage (sputtering power) so that the target 13 is negative and the ground is positive (ST4: sputtering power on). As a result, glow discharge is started between the target 13 and the wafer stage 11, and as a result, the argon gas enters a plasma state. Since the atomic nucleus of argon gas (argon ions) in a plasma state has a positive charge, an attractive force works with the target to which a negative voltage is applied, so it is attracted and accelerated, Collides with the target 13. As a result, copper molecules are recoiled from the copper constituting the target 13. The recoiled copper molecules are deposited on the surface of the wafer 12.

  Subsequently, the control monitoring unit 20 controls the gas flow rate control unit 23 to decrease the flow rate of argon gas (ST5). Next, the control monitoring unit 20 controls the RF power supply unit 26 to apply high frequency power (RF power) between the wafer stage 11 and the ground (ST6: RF power on). In the plasma, since electrons have a higher mobility than ions, the electrons are separated from the copper molecules and ionized (to become copper ions). Since the separated electrons are collected on the wafer 12, the wafer 12 is negatively charged. As a result, an electrical attractive force acts between the positively charged copper ions and the negatively charged wafer 12, and the copper ions are accelerated and collide with the wafer 12. For this reason, copper ions reach the deep part of the recess formed in the wafer 12. Moreover, it is possible to prevent burr-like copper from being formed in the opening of the recess by colliding at high speed. Furthermore, since the speed toward the lower direction (the direction of the wafer 12) is larger than the speed toward the lateral direction in FIG. 2, the copper ions are uniform with respect to the inside of the recess having a high aspect ratio. A copper film can be formed.

  Since ionized copper has a positive charge, a repulsive force acts between the ion reflector 14 to which a positive voltage is applied, so that the copper ions are reflected (accelerated) by the ion reflector 14 and the inside of the plasma Pulled back to. Thereby, the efficiency of forming the copper film can be increased.

  Then, when a predetermined time elapses after the sputtering is started and the film thickness of the copper deposited on the wafer 12 reaches a predetermined thickness, the control monitoring unit 20 controls the DC power source unit 21 to perform the sputtering. The power is turned off, and the RF power supply unit 26 is controlled to turn off the RF power (ST7). Thereby, sputtering is completed.

  Subsequently, the control monitoring unit 20 controls the electrostatic chuck unit 28 to turn off the electrostatic chuck (ST8). Next, the control monitoring unit 20 controls the gas flow rate control unit 23 to stop the supply of argon gas from the gas supply unit 22 (ST9). Then, the control monitoring unit 20 ends the process (ST10).

  Thus, the process processing for one wafer 12 is completed. Thereafter, the wafer 12 that has been processed is removed from the chamber 10, the next wafer 12 is extracted from the wafer cassette and placed on the wafer stage 11 in the chamber 10, and the same processing as described above is performed. Is repeated. When processing for all the wafers 12 arranged in the wafer cassette is completed, processing for one lot is completed.

  Next, a process for acquiring event data when the above process is performed in the vacuum process apparatus 1 will be described with reference to FIG. When the processing of the flowchart shown in FIG. 5 is started, the following steps are executed.

  Step S10: The control monitoring unit 20 determines whether or not an event has occurred. If an event has occurred, the process proceeds to step S11. Otherwise, the same processing is repeated. That is, the control monitoring unit 20 proceeds to step S11 when any of the events shown in FIG. 6 occurs when performing control according to a control program (not shown), and otherwise, the control monitoring unit 20 proceeds to step S10. Repeat the process.

  Step S11: The control monitoring unit 20 generates event data. FIG. 7 shows an example of event data. In this example, each row shows event data for one record. The event data for one record has a time stamp (details will be described later), an actual module ID, a processing ID, a wafer ID, and a message. Here, the time stamp is information pasted in the process of step S12 described later. The actual module ID as the vacuum process apparatus identification information is an ID for specifying the chamber 10. In the embodiment of FIG. 1, the vacuum process apparatus 1 has only one chamber 10, but when the vacuum process apparatus 1 has a plurality of chambers, the system includes a plurality of vacuum process apparatuses. If it is, it is an ID assigned to each of the plurality of chambers. In this example, since there is one vacuum process apparatus 1, all the module IDs are “F1”.

  The process ID is an ID for specifying the type of process. In this example, “SP-S”, “IR-ON”, “SC-ON”, “GF-S”, and “DC-ON” are listed. Here, SP-S indicates “sputtering process start” in ST1 of FIG. IR-ON indicates “IR power supply start” in ST2 of FIG. SC-ON indicates “electrostatic chuck on” in ST2 of FIG. GF-S indicates “gas flow start” in ST3 of FIG. DC-ON indicates “sputtering power on” in ST4 of FIG.

  The wafer ID as the processing target identification information is an ID for specifying the wafer 12. Here, the number on the left side of the hyphen is a value for specifying the wafer cassette (lot). The number on the right side of the hyphen is a value indicating the processing order (wafer cassette slot) in the wafer cassette. In this example, since all the event data relates to the same wafer 12, “1-2” is stored as the wafer ID.

  The message is incidental information used in the analysis process. In this example, information such as STEP 1 and STEP 2 is given.

  In the process of step S11, among the information for one record shown in FIG. 7, “process ID” corresponding to the event is generated, and “actual module ID” and “wafer ID” corresponding to the chamber and the wafer are generated. Is further added, and a “message” corresponding to the process ID is added to generate event data.

  Step S12: The control monitoring unit 20 acquires date and time information at the time when the event occurs from the timer 34, and pastes it on the event data generated in step S11. At this time, the minimum unit of date and time information generated by the timer 34 is 1/10 second. For this reason, times less than 1/100 second are automatically rounded down or rounded off. Specifically, when the date and time information generated by the timer 34 is “2007/01/15 13: 11: 16.51”, “1” at the end of “13: 11: 16.51” is set. For example, the time stamp is rounded to “13: 11: 16.5”. Thereby, as will be described later, the unit of time coincides with the trace data.

  Through the above processing, as shown in FIG. 7, a time stamp composed of year, month, day, and time is added to the event data. Specifically, in the event data in the first row in FIG. 7, “2007/01/15 13: 11: 16.5” is added as a time stamp.

  Step S13: The control monitoring unit 20 transmits the event data generated in step S12 to the log storage device 2 via the communication unit 33 and the network 3. In the log storage device 2, the event data transmitted via the network 3 is received by the I / F 2f and stored as log data 2d2 in the HDD 2d. Thus, event data is stored in the HDD 2d in the form as shown in FIG. The event data transmission unit in step S13 may be transmitted, for example, when data for one record is completed, or may be transmitted when data for a predetermined number of records is collected. Alternatively, it may be transmitted collectively from the end of the process shown in FIG. 6 to the start of the next process (free time).

  Step S14: The control monitoring unit 20 determines whether or not to end the process. If it is determined that the process is not ended, the process returns to step S10 to repeat the same process, and otherwise the process ends. For example, if the administrator gives an instruction to end the process, the process ends. Otherwise, the process returns to step S10 and the same process is repeated.

  Through the above processing, an event log is generated and stored in the HDD 2d of the log storage device 2.

(C-2) Trace data generation processing in the vacuum process apparatus 1

  Next, with reference to FIG. 8, a generation process of trace data in the vacuum process apparatus 1 will be described. When the processing of the flowchart of FIG. 8 is started, the following steps are executed.

  Step S20: The control monitoring unit 20 refers to the date and time information generated by the timer 34, and determines whether or not a predetermined time has elapsed. For example, the control monitoring unit 20 refers to the date and time information generated by the timer 34, determines whether or not 1/10 second has elapsed since the end of the previous process, and determines that it has elapsed In step S21, the same processing is repeated in other cases. More specifically, when the date and time information generated by the timer 34 in the previous process is “2007/01/15 13: 11: 16.4”, the date and time information is “2007/01/15 13:11”. : 16.5 ", it is determined that a predetermined time has elapsed, and the process proceeds to step S21. Note that this processing may be executed by periodic interrupt processing (in units of 1/10 second) from the timer 34.

  Step S21: The control monitoring unit 20 acquires trace data as information indicating the state of each unit of the vacuum process apparatus 1. FIG. 9 shows an example of the trace data. In this example, each line shows trace data for one record. The trace data for one record is composed of “vacuum degree”, “IR voltage”, “gas flow rate”, “DC voltage”, “RF power”, “wafer temperature” and others.

  Here, “degree of vacuum” is information measured by the pressure detector 24 shown in FIG. The “IR voltage” is information indicating the voltage value of the DC voltage applied between the ion reflector 14 and the ground by the IR power supply unit 32. The “gas flow rate” is information indicating the flow rate per unit time of the gas supplied from the gas supply unit 22 into the chamber 10 by the gas flow rate control unit 23. “DC voltage” is information indicating a voltage value of a DC voltage applied between the target 13 and the ground by the DC power supply unit 21. “RF power” is information indicating the power value of the AC power applied between the wafer stage 11 and the ground by the RF power supply unit 26. The “wafer temperature” is information indicating the temperature of the wafer 12 detected by the temperature detection unit 27. Note that FIG. 9 is an example, and other information may be used.

  Since these pieces of information are sampled and acquired substantially at the same time, they are information indicating the state of each part of the vacuum process apparatus 1 at the moment of the date and time indicated by the time stamp described later.

  Step S22: The control monitoring unit 20 acquires date and time information at that time from the timer 34, and pastes it on the trace data acquired in step S21. At this time, since the minimum unit of the date and time information generated by the timer 34 is 1/10 second, for example, “2007/01/15 13: 11: 16.5” is pasted as the time stamp. Become. As a result, the time unit and the period coincide with the event data described above.

  Through the above processing, as shown in FIG. 9, a time stamp composed of year, month, day, and time is added to the trace data. Specifically, in the event data on the first line in FIG. 9, “2007/01/15 13: 11: 16.5” is added as a time stamp, which is the same as the time stamp on the first line in FIG. Match.

  Step S23: The control monitoring unit 20 transmits the trace data with the time stamp attached in Step S22 to the log storage device 2 via the communication unit 33 and the network 3. In the log storage device 2, the trace data transmitted via the network 3 is received by the I / F 2f and stored as log data 2d2 in the HDD 2d. Thereby, the trace data is stored in the HDD 2d in the form as shown in FIG. In addition, as a transmission unit of the trace data in step S23, for example, it may be transmitted when data for one record is completed, or may be transmitted when a predetermined number of records are collected. Alternatively, it may be transmitted collectively from the end of the process shown in FIG. 6 to the start of the next process (free time).

  Step S24: The control monitoring unit 20 determines whether or not to end the process. If it is determined not to end the process, the process returns to step S20 to repeat the same process, and otherwise the process ends. For example, if the administrator gives an instruction to end the process, the process ends. Otherwise, the process returns to step S20 to repeat the same process.

  Through the above processing, trace data is generated and stored in the HDD 2d of the log storage device 2.

  Note that the event data and the trace data generated as described above may be held in the log storage device 2 for about two months, for example, and these data after two months may be sequentially deleted from the HDD 2d. . At that time, the data to be deleted can be easily identified by referring to the time stamp. In addition, the holding period may be set according to a period during which a defect with respect to the wafer 12 is found. For example, when a defect is found in about one month, for example, it is held for about two months, and when a defect is found in about three months, it is held for about four months. Needless to say, the period may be other than this.

(C-3) Analysis processing in analysis device 4

  Next, analysis processing executed in the analysis device 4 shown in FIG. 4 will be described. When the administrator operates the input device 4i of the analysis device 4 to start an analysis application program included in the program 4d1, the CPU 4a acquires screen display data from the data area of the program 4d1, and performs image processing. Supplied to the unit 4e. The image processing unit 4e performs drawing processing based on the supplied screen display data, converts the obtained image into a video signal, and supplies the video signal to the display device 4h. As a result, an input screen 50 as shown in FIG. 10 is displayed on the display device 4h.

  The input screen 50 includes a data file area 51 for inputting information on a data file, a setting area 52 for specifying a work folder, a processing target data setting area 53 for setting processing target data, and various buttons 58 to 63. Is displayed.

  Here, in the data file area 51, a text box 51a for inputting a file name of an event file to be analyzed, a text box 51b for inputting a file name of a trace file to be analyzed, and a file input to the text box 51a Button 51c operated when reading an event file having a name, button 51d operated when reading a trace file having a file name input to the text box 51b, and a text box 51e for designating a target real module of the trace file. In addition, a button 51f for pulling down a candidate real module is displayed in the text box 51e.

  The setting area 52 can be selected from a text box 52a in which a working folder is input, a text box 52b in which the name of an application program for displaying a graph of analysis results is input, and text boxes 52a and 52b. Buttons 52c and 52d for displaying information are displayed.

  Further, in the processing target data setting area 53, trace data items are displayed, a trace data item area 54 for selecting desired trace data, information on event data, and desired event data are displayed. An event data area 55 for selecting a recipe, a recipe area 56 for performing a process related to a recipe, and an analysis condition area 57 for performing a process related to an analysis condition are displayed.

  Here, in the trace data item area 54, a display area 54a where the trace data is displayed, and buttons 54b to 54d which are operated when scrolling the information displayed in the display area 54a are displayed. In the event data area 55, a display area 55a for displaying an actual module, a display area 55b for displaying a wafer ID, and a display area 55c for displaying a process ID are displayed. In the recipe area 56, a button 56a operated when setting a recipe describing the flow of the process, a button 56b operated when saving the recipe, and a button 56c operated when reading the recipe are displayed. Has been. In the analysis condition area 57, a button 57a that is operated when defining the analysis condition, a button 57b that is operated when saving the analysis condition, and a button 57c that is operated when reading the analysis condition are displayed. Has been.

  The button 58 is a button operated when generating a histogram. The button 59 is a button operated when performing the primary analysis. The button 60 is a button operated when outputting the primary analysis result as a file. The button 61 is operated when outputting display data. The button 62 is a button that is operated when executing the analysis process. The button 63 is a button that is operated when the processing of the application program ends.

  In such an input screen 50, the administrator first inputs the file name of the event file to be analyzed in the text box 51a. Specifically, when the button 51c is operated, a list of readable files is displayed, and the administrator designates an event file to be analyzed. As a result, the CPU 4 a of the analysis device 4 acquires event data from the log storage device 2. That is, the CPU 4a requests the log storage device 2 to transmit the specified event data via the I / F 4f and the network 3. The CPU 2a of the log storage device 2 receives this request via the I / F 2f, acquires the specified event data from the log data 2d2 stored in the HDD 2d, and transmits it by the I / F 2f. As a result, the CPU 4a of the analysis device 4 receives event data via the I / F 4a. Then, the CPU 4a stores the received event data in a predetermined area of the RAM 4c. As a result, the event data area 55 displays a list of information included in the acquired event data (details will be described later).

  Next, the administrator sets a target real module to be analyzed in the text box 51e. Specifically, an actual module to be analyzed is selected from a pull-down menu displayed by operating the button 51f. The “real module” indicates a “chamber”, and a desired chamber is selected from a plurality of existing chambers.

  Next, the administrator inputs the file name of the trace file to be analyzed in the text box 51b. Specifically, when the button 51d is operated, a list of readable files is displayed, and the administrator designates a trace file to be analyzed. As a result, the CPU 4 a of the analysis device 4 acquires trace data from the log storage device 2. That is, the CPU 4a requests the log storage device 2 to transmit the specified trace data via the I / F 4f and the network 3. The CPU 2a of the log storage device 2 receives this request via the I / F 2f, acquires the specified trace data from the log data 2d2 stored in the HDD 2d, and transmits it by the I / F 2f. As a result, the CPU 4a of the analysis device 4 receives the trace data via the I / F 4a. Then, the CPU 4a stores the received event data in a predetermined area of the RAM 4c. As a result, a list of information included in the acquired trace data is displayed in the trace data item area 54 (details will be described later).

  FIG. 11 shows an example of an input screen when event data and trace data are read. In this example, “C: \ data \ event.dat” is input to the text box 51a as the file name of the event file to be analyzed. In the text box 51b, "C: \ data \ trace.dat" is input as the file name of the trace file to be analyzed. Further, “F1” is selected in the text box 51e as the target real module of the trace file. Note that “F1” corresponds to the chamber 10 of the vacuum process apparatus 1 in this example. In addition, these file names are merely examples, and other file names may be used.

  In the display area 54a of the trace data item area 54, a list of information corresponding to the trace data shown in FIG. 9 is displayed. Specifically, information “Vacuum” corresponding to the degree of vacuum, “IR Voltage” corresponding to the IR voltage, and other information are displayed. In the display area 55a of the event data area 55, a list of actual modules including “F1” corresponding to the chamber 10 of the vacuum process apparatus 1 is displayed. In the display area 55b, a list of wafer IDs included in the event data is displayed. In the display area 55c, a list of process IDs included in the event data is displayed.

  The administrator selects an item of trace data to be analyzed in the display area 54a shown in FIG. That is, the administrator selects an actual module in the display area 55a and selects a target wafer ID in the display area 55b. For example, the administrator selects all trace data items in the display area 54a, selects the actual module “F1” in the display area 55a, and further selects all wafer IDs in the display area 55b.

  In such a state, when the button 59 is operated by the administrator, processing for associating the event data with the trace data is executed. That is, the CPU 4a executes a process of associating the event data stored in the RAM 4c and the trace data with reference to the time stamp attached to each record unit. That is, a process of associating the event data with the time stamp having the same date and time information with the trace data is executed. Note that the trace data is periodically sampled in units of 1/10 second, but the event data is aperiodic data because it is generated when the event occurs. Accordingly, when these are associated with each other, the state is as shown in FIG. In the example of this figure, the process ID shown in FIG. 7 and the trace data shown in FIG. 9 are associated with each other. The dots between the lines indicate that the trace data between them is omitted.

  In this way, the trace data is labeled by associating the trace data with the event data with reference to the time stamp. By using the labeled trace data, data analysis processing can be performed easily and quickly as described later.

  In addition, by operating the button 60, the data associated as described above can be output as a file. The file output in this way can be referred to by a predetermined application program.

  Next, the administrator sets analysis conditions. Here, when setting a new analysis condition, the button 57a is operated, and when using an existing analysis condition, the button 57c is operated. Hereinafter, a case where a new analysis condition is set will be described.

  When the administrator operates the button 57a, the CPU 4a acquires input screen display data included in the program 4d1 and supplies it to the image processing unit 4e. The image processing unit 4e executes a drawing process and supplies the obtained image to the display device 4h. As a result, the input screen 70 shown in FIG. 13 is displayed on the display device 4h. In this example, check boxes 71 a to 80 a are displayed at the left end of the input screen 70. Further, buttons 71b to 80b are respectively displayed on the right side thereof. Further, text boxes 71c to 80c and text boxes 71d to 80d are displayed on the right side thereof. A display target analysis condition definition selection area 81 is displayed at the bottom of the input screen 70, and buttons 82 to 84 are displayed on the right side thereof.

  Here, the check boxes 71a to 80a specify whether or not to execute the analysis condition displayed on the right side thereof. That is, when the button 62 shown in FIG. 10 is operated, the check box is checked when the analysis condition (definition) displayed on the right side is executed. The buttons 71b to 80b are operated when setting the analysis conditions. When these buttons 71b to 80b are operated, the input screen 90 shown in FIG. 14 is displayed, and the analysis conditions are set on the input screen 90. Can do. In the text boxes 71c to 80c, the names of the respective analysis conditions (information input in the text box 104 in FIG. 14) are displayed. Further, text information indicating the analysis conditions set on the input screen 90 shown in FIG. 14 is displayed in the text boxes 71d to 80d. In the display target analysis condition definition selection area 81, which group of a plurality of definitions is displayed is selected by a radio button. In this example, since the radio buttons corresponding to the definitions 1 to 10 are selected, the definitions 1 to 10 are displayed. The button 82 is a button operated when copying (copying) a predetermined definition, as will be described later. The button 83 is a button operated when resetting a definition whose check box is checked. The button 84 is a button operated when closing the input screen 70.

  In such an input screen 70, for example, when the button 71b is operated, the CPU 4a acquires input screen display data included in the program 4d1 and supplies the data to the image processing unit 4e. The image processing unit 4e executes a drawing process and supplies the obtained image to the display device 4h. As a result, an input screen 90 as shown in FIG. 14 is displayed on the display device 4h. In this display example, analysis condition templates 91 to 103 are displayed in the input screen 90, and a text box 104 and buttons 105 and 106 are displayed below it.

  Here, templates 91 to 103 are templates for inputting analysis conditions. Specifically, the template 91 is set on the condition that the predetermined trace data “exceeds or falls below” the value y after x seconds after “start or end” of the predetermined event. In this example, “the time from“ 0 ”seconds after“ start ”of the event“ SP-S ”until the trace data“ PG ”exceeds“ 0 ”” ”is displayed as an initial state. In addition, the event data and the trace data options displayed from the read trace data and event data are displayed.

  The template 92 is set on the condition that the time until the result of the four arithmetic operations of the predetermined trace data and other predetermined trace data is within y plus or minus z% after x seconds from the “start or end” of the predetermined event. To do. The template 93 is set on the condition that the time from “start or end” x seconds after a predetermined event to y seconds after “start or end” of the predetermined event is set as a condition. The template 94 is “time, minimum value, maximum value, average value, or center in which the value of predetermined trace data is in a range of y plus or minus z% after x seconds after“ start or end ”of a predetermined event. Set "Value" as a condition. The template 95 has a “time,” in which a result obtained by performing four arithmetic operations on a predetermined trace data value and other trace data values after x seconds after “start or end” of a predetermined event is in a range of y plus or minus z%. “Minimum value, maximum value, average value, or median” is set as a condition. The template 96 has a value of predetermined trace data in a range of z plus or minus w% from x seconds after “start or end” of a predetermined event until “seconds” after “start or end” of the predetermined event. “Time, minimum value, maximum value, average value, or median” is set as a condition. The template 97 indicates that the result of the four arithmetic operations of the predetermined trace data and other trace data is z plus between x seconds after the “start or end” of the predetermined event and y seconds after the “start or end” of the predetermined event. “Time, minimum value, maximum value, average value, or median value” in the range of minus w% is set as a condition. The template 98 is “time, minimum value, maximum value, average value, or median value in which the value of the predetermined trace data is in the range from y to z after x seconds after“ start or end ”of the predetermined event. "Is set as a condition. The template 99 is “time, minimum value, maximum value” in which the result of four arithmetic operations of predetermined trace data and other trace data is in the range from y to z after x seconds after “start or end” of the predetermined event. , "Average value, or median value" is set as a condition. The template 100 has a “time” in which a value of predetermined trace data is in a range from z to w after x seconds from “start or end” of a predetermined event to “start or end” y seconds after the predetermined event. , Minimum value, maximum value, average value, or median value ”is set as a condition. In the template 101, the result of the four arithmetic operations of the predetermined trace data and other trace data is in the range from x to y between the “start or end” of the predetermined event and the “start or end” of the predetermined event. “Time, minimum value, maximum value, average value, or median” is set as a condition. The template 102 is set with a predetermined trace data value x seconds after “start or end” of a predetermined event as a condition. The template 103 indicates a time during which the predetermined trace data is “minimum value, maximum value, average value, or median value” between “start or end” of the predetermined event and “start or end” of the predetermined event. Set as a condition.

  The name of the analysis condition is input to the text box 104, and the name is displayed in the corresponding text box of the text boxes 71c to 80c in FIG. The button 105 is operated when registering the input analysis condition, and the button 106 is operated when canceling the input analysis condition.

  In such an input screen 90, the administrator operates various buttons of the template 100, for example, “DC Voltage is 200 or more and 250 or less between 0 seconds after the start of DC-ON and 0 seconds after the end of DC-OFF. It is assumed that after setting “time within the range of” as a condition, the corresponding radio button (the radio button displayed on the left side) is selected. Then, when “Spt Time” is input as the name of the analysis condition in the text box 104 and the button 105 is operated, a confirmation screen 120 shown in FIG. 15 is displayed on the display device 4h. In this confirmation screen 120, the message “Setting conditions are as follows. Are you sure?” And “DC Voltage is in the range of 200 or more and 250 or less between 0 seconds after DC-ON starts and 0 seconds after DC-OFF ends. Is displayed, and buttons 122 and 123 are displayed below it. With reference to the message displayed on the confirmation screen 120, the button 122 is operated when the displayed content is correct, and the button 123 is operated otherwise. When the button 122 is operated, the analysis conditions input on the input screen 90 shown in FIG. 14 are stored in the RAM 4c. Specifically, the condition selected by operating the button shown in FIG. 14 and the input information are stored.

  When the button 122 shown in FIG. 15 is operated, as shown in FIG. 16, the text box 71c of the input screen 70 displays “Spt Time” input to the text box 104 of FIG. In the text box 71d, text information indicating an analysis condition set using the template 100 (with a DC Voltage in the range of 200 to 250 between 0 seconds after the DC-ON starts and 0 seconds after the DC-OFF ends). A certain time) is displayed. In addition, a check indicating that this definition is executed is displayed in the left check box. By referring to these displays, the administrator can know the name and content of the analysis condition set as definition 1.

  In this state, when the button 84 shown in FIG. 11 is operated after the button 84 is operated, the analysis process based on the definition 1 is executed. Specifically, in the present example, the DC-OFF ends (FIG. 6) after 0 seconds from the start of the DC-ON (ST4 in FIG. 6) of the wafer 12 on which the process processing is executed in the chamber whose actual module ID is “F1”. 6 ST7) The time during which DC Voltage is in the range of 200 to 250 within 0 seconds is analyzed. In this case, the CPU 4a first searches the event data for a record whose actual module ID is “F1”. As a result, since the data shown in FIG. 7 is applicable, the data shown in FIG. 7 is acquired.

  Next, the CPU 4a searches the acquired data for “DC-ON” that is a process ID corresponding to DC-ON and “DC-OFF” that is a process ID corresponding to DC-OFF. Subsequently, the CPU 4a acquires a time stamp attached to each event data of the process ID “DC-ON” and the process ID “DC-OFF”.

  Subsequently, the CPU 4a acquires DC voltage trace data included in the period indicated by the two acquired time stamps. That is, when the two time stamps described above are used as the start point and the end point from the trace data shown in FIG. 9, the CPU 4a acquires the trace data related to the DC voltage included in these ranges. Through the above processing, trace data relating to the DC voltage belonging to the specified range of the specified wafer in the specified chamber is acquired.

  If there are a plurality of target wafers, the above-described process may be repeatedly performed for each wafer. When a plurality of trace data are targeted, a corresponding trace data group belonging to the period specified by the time stamp may be acquired.

  In addition, when a range is set based on the case where a certain amount of time has elapsed from a predetermined point in the trace data, the above-mentioned certain time is added to the time stamp of the corresponding trace data. The same process as described above may be executed with the given time as a reference.

  When determining the range using both event data and trace data, the range is determined with the trace data specified by the above-described processing satisfying a predetermined condition as a start point or an end point. What should I do?

  In addition, when obtaining the maximum value, minimum value, average value, and median value of the acquired trace data, the maximum value, minimum value, average value, and median value of the acquired trace data What is necessary is just to obtain | require the value which becomes. Further, when comparing the trace data (for example, calculating the correlation function), the correlation function may be calculated between the trace data.

  FIG. 17 is an example of a graph displayed on the display device 4h as a result of the above analysis processing. In this graph, the horizontal axis indicates slots and the vertical axis indicates time. From this graph, it can be seen that the time during which DC Voltage is in the range of 200 to 250 in the range from 0 seconds after the start of DC-ON to 0 seconds after the end of DC-OFF is about 35 seconds regardless of the slot. By referring to the graph of such an analysis result, the administrator can know the tendency of the DC voltage.

  The above is an explanation of the case where the definition is directly specified. However, in the embodiment of the present invention, a new definition can be generated by copying (copying) the definition. This point will be described next.

  When the button 82 is operated on the input screen 70 shown in FIG. 13, the CPU 4a acquires input screen display data included in the program 4d1 and supplies it to the image processing unit 4e. The image processing unit 4e executes a drawing process and supplies the obtained image to the display device 4h. As a result, the input screen 130 shown in FIG. 18 is displayed on the display device 4h. In this example, text boxes 131 and 133 and buttons 132, 134, and 135 are displayed. In the text box 131, the definition of the copy source is input. In the text box 133, the definition of the copy destination is input. The button 132 is a button that is operated when a list of definitions (input definitions) that are candidates for the copy source is displayed as a pull-down menu. The button 134 is operated when displaying a list of definitions (uninputted definitions) that are candidates for the copy destination as a pull-down menu. A button 135 is a button operated when copying the definition of the copy source to the definition of the copy destination.

  In such an input screen 130, for example, if “definition 1” is selected as the copy source, “definition 2” is selected as the copy destination, and the button 135 is operated, information on definition 1 stored in the ROM 4c. Is obtained and copied as information of definition 2. As a result, as shown in FIG. 19, the same information as definition 1 is displayed in definition 2 on input screen 70. That is, in this example, “Spt Time” is displayed in the text box 72c, and “DC Voltage is 200 or more, 250 between the DC-ON start 0 second and the DC-OFF end 0 second” in the text box 72d. The following time is displayed. Further, the check box 72a is checked.

  When the button 72b is operated on such an input screen 70, an input screen 90 shown in FIG. 20 is displayed. Since this example is a copy of Definition 1, the same information as in FIG. 14 is displayed at the beginning of the display. That is, in the template 100, “time during which DC Voltage is 200 or more and 250 or less between 0 seconds after DC-ON starts and 0 seconds after DC-OFF” is input as an analysis condition, and the corresponding radio button is checked. It is in the state. In such an input screen 90, “time” is changed to “maximum value” in the text box at the end (right end) of the template 100, and “Spt Time” is changed to “Spt Max” in the text box 104. Later, when the button 105 is operated, as shown in FIG. 21, “Spt Time” displayed in the text box 72c is changed to “Spt Max”, and “DC” displayed in the text box 72d is displayed. -The time during which DC Voltage is 200 or more and 250 or less between 0 seconds after ON start and 0 seconds after DC-OFF is "DC Voltage is 200 or more between 0 seconds after DC-ON start and 0 seconds after DC-OFF end". , 250 or less maximum value ”.

  In such a state, when the button 62 shown in FIG. 11 is operated after the button 84 is operated, the analysis processing corresponding to the definition 1 and the definition 2 is executed by the same flow as in the case described above. As a result, as an analysis result corresponding to definition 1, the graph shown in FIG. 17 is displayed on the display device 4h, and the graph shown in FIG. 22 is also displayed on the display device 4h. In the display example of FIG. 22, the horizontal axis is the slot, and the vertical axis is the voltage. The black circles indicate the maximum voltage of each lot. By referring to such a graph, the administrator can know the maximum value of the DC voltage in the specified range. Note that the graphs of FIGS. 17 and 22 may be displayed together on the same plane.

  In addition, although the above is description regarding one or two definitions, an analysis process can be performed similarly about three or more definitions. In that case, three or more types of graphs are displayed on the display device 4h. In the example of FIG. 21, only definitions 1 to 10 are displayed, but by selecting a radio button in the display target analysis condition definition selection area, definitions 11 to 20 or definitions 21 to 30 are displayed. It is also possible to set each definition and execute an analysis process including the set definition. In this example, there are 30 types of definitions, but it may be less or more.

  As described above, according to the embodiment of the present invention, it is possible to obtain desired trace data by using event data as a trigger by attaching a time stamp to each of event data and trace data and associating them with each other. Since it did in this way, the data of a desired timing can be searched quickly.

  In addition, according to the embodiment of the present invention, the trace data in a predetermined range is designated based on the event data, and the trace data included in this range is displayed or analyzed. Trace data in a specific range can be acquired and analyzed quickly and easily.

  Further, according to the embodiment of the present invention, since the wafer ID is added to the event data and stored, the trace data relating to the desired wafer can be retrieved easily and quickly. Further, since the lot and the code indicating the processing order (slot) in the lot are used as the wafer ID, it is possible to easily and quickly retrieve the trace data regarding the wafer in the predetermined processing order of the predetermined lot. it can. Similarly, since the real module ID for the chamber is added, even when there are a plurality of chambers, the trace data of the desired chamber can be searched and analyzed easily and quickly.

  Further, according to the embodiment of the present invention, an analysis condition is defined using any of a plurality of templates on the input screen 90 shown in FIG. 14, and a desired definition is defined on the input screen 70 shown in FIG. Selected and executed. As a result, the analysis conditions can be easily generated, and the analysis process can be executed by selecting the desired analysis conditions.

  Further, according to the embodiment of the present invention, the conditions set on the input screen 90 shown in FIG. 14 are displayed as text information on the confirmation screen 120 shown in FIG. 15 to prompt confirmation, and the input shown in FIG. It is also displayed on the screen 70. For this reason, the analysis conditions can be input without fail. It is also possible to easily know the analysis conditions that have been set.

  In addition, according to the embodiment of the present invention, the analysis conditions can be copied, so that when a plurality of similar conditions are generated, the operation of the administrator can be simplified.

(D) Modified embodiment

  The above-described embodiments are preferred examples of the present invention, but the present invention is not limited to these, and various modifications and changes can be made without departing from the scope of the present invention. is there.

  For example, in the above embodiment, as the vacuum process apparatus 1, an apparatus that performs copper sputtering by PVD has been described as an example, but other process apparatuses may be used. Specifically, as described above, a CVD apparatus, an etching apparatus, an implanter apparatus, and a photolithography apparatus can be used as the vacuum process apparatus 1. In the above description, the process apparatus under vacuum has been described as an example, but the process apparatus is not necessarily limited to vacuum.

  Moreover, although the case where there was one vacuum process apparatus 1 was described as an example in the above embodiment, a plurality of vacuum process apparatuses may exist. In that case, a plurality of vacuum process apparatuses may be distinguished by the actual module ID.

  Further, in the above embodiment, the log storage device 2 is configured independently of the vacuum process device 1, but these may be integrated. That is, the log storage device 2 may be configured as a part of the vacuum process device 1.

  In the above embodiment, the analysis device 4 is configured independently of the vacuum process device 1 and the log storage device 2. However, the analysis device 4 is configured as a part of the vacuum process device 1 or the log storage device 2. May be.

  In the above embodiment, the vacuum process apparatus 1, the log storage apparatus 2, and the analysis apparatus 4 are connected to each other via the network 3, but these are directly connected without using the network 3. You may make it do. Specifically, it can be directly connected by a USB (Universal Serial Bus) or other interface.

  In the above embodiment, as shown in FIG. 9, the trace data is always acquired at a constant cycle. However, for example, the acquisition cycle is changed during process processing and in other cases. You may do it. Specifically, during process processing, trace data is acquired at a short cycle (for example, 1/10 second), and trace data is acquired at a long cycle (for example, 1 second) in other cases. May be. Thereby, since the amount of trace data can be reduced, the required capacity of the HDD 2d can be reduced.

  In the above embodiment, the event data and the trace data are stored separately. However, for example, they may be stored after being associated in advance as shown in FIG. According to such a method, it is not necessary to perform the association process on the analysis device 4 side, so that the waiting time for the analysis process can be shortened.

  In the above embodiment, the analysis device 4 acquires all event data and trace data from the log storage device 2 and narrows down the range and the target after acquisition. However, the analysis device 4 receives the specification of the target and the range. After that, only necessary data may be acquired from the log storage device 2. According to such a method, analysis processing can be executed even when the amount of event data and trace data is larger than the capacity of the RAM 4c.

  In the above embodiment, the case of using the event data message is not mentioned, but the range may be specified using the message. Specifically, for example, the range can be specified using messages such as “STEP1” and “STEP2” shown in FIG.

  In the above embodiment, the trace data and the event data are processed for a single file, respectively. However, the processing may be performed for a plurality of trace data and event data. . According to such a method, for example, a change with time can be known by performing an analysis process on data that changes in time. When reading multiple data, if duplicate data in time (data with the same time stamp) is read, the data is duplicated and cannot be processed, so it does not overlap in time It may be determined in advance whether or not there is a temporal overlap with reference to the time stamp so that only data can be processed.

  The present invention can be applied to a management system for managing a vacuum process apparatus such as a PVD apparatus or a CVD apparatus, for example.

It is a block diagram which shows the structural example of the process management system which concerns on embodiment of this invention. It is a figure which shows the structural example of the vacuum process apparatus shown in FIG. It is a block diagram which shows the structural example of the log storage apparatus shown in FIG. It is a block diagram which shows the structural example of the analyzer shown in FIG. 3 is a flowchart showing an example of processing for generating event data in the vacuum process apparatus shown in FIG. 2. It is a figure which shows an example of the event performed in the vacuum process apparatus shown in FIG. It is a figure which shows an example of the event data produced | generated by the flowchart shown in FIG. It is a flowchart which shows an example of the process which acquires trace data in the vacuum process apparatus shown in FIG. It is a figure which shows an example of the trace data produced | generated by the flowchart shown in FIG. It is a figure which shows an example of the input screen displayed initially when an application program is started. FIG. 11 is a display example when predetermined event data and trace data are read on the screen shown in FIG. 10. FIG. It is an example of the event data matched with the primary analysis process, and trace data. It is an example of the input screen displayed when the button for defining an analysis condition is operated on the input screen shown in FIG. It is an example of the input screen displayed when the button for setting a definition is operated on the input screen shown in FIG. It is an example of the confirmation screen displayed when the button for registering an analysis condition is operated on the input screen shown in FIG. It is an example of the input screen displayed after confirming on the confirmation screen shown in FIG. It is an example of the graph displayed when the definition shown in FIG. 16 is performed. It is an example of the screen displayed when copying a definition. FIG. 19 is an example of an input screen when copying is executed on the screen shown in FIG. 18. FIG. It is an example of the input screen which shows the case where the analysis conditions after copying are reset. It is an example of the input screen on which the definition reset by the input screen of FIG. 20 was displayed. It is an example of the graph displayed when the analysis conditions defined in the input screen shown in FIG. 21 are performed.

Explanation of symbols

  1 vacuum process device, 2 log storage device, 2d HDD (storage means), 3 network, 4 analysis device, 4a CPU (analysis device), 4c RAM (storage device), 4h display device (presentation device), 4i input device ( Input means), 12 wafers (processing object), 20 control monitoring unit (first acquisition means, second acquisition means, part of correspondence means), 34 timer (part of correspondence means), 50 input screen (Third interface), 70 input screen (second interface), 90 input screen (first interface)

Claims (7)

First acquisition means for acquiring state information indicating the state of each part of the device;
Second acquisition means for acquiring control information relating to control of the device;
Association means for associating the state information acquired by the first and second acquisition means with the control information;
Storage means for storing the state information and the control information associated by the association means;
Input means for receiving input of analysis conditions when performing analysis processing on the control information and the state information;
Storage means for storing the analysis conditions input from the input means;
Analyzing means for analyzing the state information with reference to the control information according to the analysis conditions stored in the storage means;
Presenting means for presenting information obtained as a result of the analysis of the analyzing means;
A process management system comprising: The input means includes
A first interface having a plurality of analysis condition templates, receiving input of analysis conditions using the template, and receiving selection of any of the plurality of templates;
A second interface for receiving a selection as to whether or not to execute each analysis condition input via the first interface;
The process management system according to claim 1, further comprising:   3. The process management system according to claim 2, wherein information indicating an analysis condition selected in the first interface is displayed as text information on the second interface.   The second interface, when a predetermined operation is performed, duplicates the analysis condition input through the first interface and generates another new analysis condition. The process management system according to claim 2 or 3.   5. The process management system according to claim 2, wherein the presenting unit presents, as a graph, information on an analysis result based on the analysis condition selected in the second interface. A third interface for designating a type of information acquired by the first acquisition unit and the second acquisition unit;
The first interface displays a template based on information specified via the third interface.
6. The process management system according to claim 2, wherein The state information and the control information are supplied as an electronic file,
Each of the first acquisition unit and the second acquisition unit acquires a plurality of electronic files simultaneously;
The process management system according to any one of claims 1 to 6, wherein:

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