JP2008076184A - Mounting state inspection method for electronic component, mounting state inspection device for electronic component, and manufacturing method of electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To certainly, automatically determine goodness/badness of a mounting state of an electronic component mounted on a transparent substrate using an anisotropic conductive film. <P>SOLUTION: This mounting state inspection method of the electronic component comprises a process (S4) of performing differentiation filter processing of emphasizing a projecting section formed on an electrode disposed on the transparent substrate when the electronic component is mounted on a real transparent electrode via an anisotropic conductive film, a process (S5) of pattern-matching the projecting section emphasized by the differentiation filter processing with a previously prepared indentation model and extracting, as an indentation candidate, the projecting section whose matching rate is a set value or more, processes (S6 and S7) of determining the projecting section when difference between the contrast values of the projecting section extracted as the indentation candidate is a set value or more, a process (S9) of counting the number of projecting sections determined to be indentations, and processes (S11 and S12) of determining the goodness/badness of the mounting state of the electronic component mounted on the transparent substrate according to whether the counted number as the indentations is the set value or more. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting state inspection method, an electronic component mounting state inspection device, and an electronic device manufacturing method, and more particularly to thermocompression bonding of an electronic component to a transparent substrate provided with electrodes via an anisotropic conductive film. The present invention relates to an electronic component mounting state inspection method, an electronic component mounting state inspection device, and an electronic device manufacturing method.

  As a method for inspecting the mounting state of an electronic component mounted on a substrate provided with electrodes, there is known a method that utilizes the fact that the electrical resistance value increases when the mounting state is defective. This inspection method includes a method of measuring an electrical resistance value of a mounting portion and a method of confirming a function that can be achieved when the mounting state is good. As an example of the latter, if the liquid crystal display display control electronic component is mounted on the liquid crystal display glass substrate, the mounted display control electronic component is driven to display the liquid crystal display on the screen. The quality of the mounting state is determined from the screen state.

  In recent years, electronic parts are increasingly mounted on a transparent substrate provided with electrodes via an anisotropic conductive film containing conductive particles. In this case, a method using a differential interference microscope is known as a method for determining whether the electronic component is mounted properly. Specifically, the transparent substrate on which the electronic component is mounted is observed with a differential interference microscope from the back side in the mounting direction of the electronic component, and the number of indentations formed on the electrode by counting against the conductive particles is counted. . When the number of indentations is large, it is determined that the mounting state is good. The observation by the differential interference microscope is performed by an inspector who determines whether the mounting state is good or bad.

  Furthermore, the invention described in the following Patent Documents 1 and 2 is known as an invention for automatically determining the quality of a mounted state by observing an indentation formed on an electrode.

  The invention described in Patent Document 1 captures an image of an electrode projected by a differential interference microscope, and determines whether or not the raised portion is an indentation based on the shape of the raised portion present in the captured image. Judgment. However, a specific determination method for determining whether or not an impression is present is not described.

The invention described in Patent Document 2 captures an image of an electrode projected by a differential interference microscope, binarizes the gray value of the captured image, and binarizes white and black areas and shapes. It is determined whether or not there is an indentation. Or it is determined whether it is an impression from the standard deviation of the gray value of the image | photographed image.
JP 2003-269934 A JP 2005-227217 A

  However, in the invention described in the above publication, the following points are not considered.

  As described in Patent Document 2, when determining an indentation from the area and shape of white or black when binarized, a foreign matter or a bump itself sandwiched between a bump and an electrode of an electronic component at the time of mounting In some cases, the convex portion of the electrode caused by the deformation is determined as an indentation.

  Similarly, when determining the indentation from the standard deviation of the gray value of the image, the foreign matter sandwiched between the bump and the electrode of the electronic component during mounting and the deformation of the bump itself affect the standard deviation of the gray value, A portion that is not indented may be determined to be indented.

  That is, if the person in charge of inspection looks at the convex portion formed on the electrode, even if it can be determined that it is not an indentation from the shape or shading, it may be erroneously determined as an indentation by automation.

  The present invention has been made to solve such a problem, and its object is to provide an anisotropic method for automatically inspecting the mounting state of an electronic component mounted on a transparent substrate using an anisotropic conductive film. Provided are an electronic component mounting state inspection method, an electronic component mounting state inspection device, and an electronic device manufacturing method capable of reliably determining an indentation formed on an electrode by being pressed by conductive particles in the conductive film It is to be.

  A first feature according to an embodiment of the present invention is that, in the electronic component mounting state inspection method, a transparent substrate on which the electronic component is mounted via an anisotropic conductive film is disposed on the back surface of the surface on which the electronic component is mounted. A step of imaging by imaging with a differential interference microscope from the side, a step of detecting the position of the electrode provided on the transparent substrate from the captured image using the shape of the electrode registered in advance, Pattern matching between the step of performing differential filter processing for emphasizing the convex portion formed on the electrode, and the indented model prepared in advance with the convex portion emphasized by the differential filter processing, and the matching rate is set When the difference between the step of extracting the convex portion that is equal to or greater than the value as an indentation candidate and the gray value of the convex portion extracted as the indentation candidate is equal to or greater than a set value, the convex portion is determined to be an indentation. Craft And a step of counting the number of indentations determined, and a step of determining whether the electronic component is mounted on the transparent substrate according to whether or not the number counted as indentations is equal to or greater than a set value. Is.

  A second feature of the embodiment of the present invention is that, in the electronic component mounting state inspection method, a transparent substrate on which the electronic component is mounted via an anisotropic conductive film is disposed on the back surface of the surface on which the electronic component is mounted. A step of imaging by imaging with a differential interference microscope from the side, a step of detecting the position of the electrode provided on the transparent substrate from the captured image using the shape of the electrode registered in advance, When binarizing the gray value of the image of the convex portion formed on the detected electrode, a step of determining that there is a foreign object when the area of a portion that is equal to or greater than a threshold is equal to or greater than a set value, and the detected electrode When the gray value of the image of the convex portion formed in the binarization is binarized, the step of determining that there is a foreign object when the area of the portion that is equal to or smaller than the threshold is equal to or larger than the set value, and the convex Laplacian to emphasize the edges A portion that is equal to or less than a threshold value when binarizing the gray value of the image after removing the convex portions formed by being pressed by the conductive particles in the anisotropic conductive film after performing the filtering process And determining the presence or absence of foreign matter when the area of the image is equal to or larger than a set value, and the gray value of the image after performing differential filter processing in accordance with the size of the foreign matter in the direction in which the shade change of the differential interference microscope appears. A step of determining a foreign object when the area of a portion that is equal to or greater than a threshold value is equal to or greater than a set value.

  According to a third aspect of the present invention, in the electronic component mounting state inspection apparatus, the transparent substrate on which the electronic component is mounted via the anisotropic conductive film is used as the back surface of the surface on which the electronic component is mounted. The differential interference microscope projected from the side, the imaging unit that captures an image projected by the differential interference microscope, and the positions of the electrodes provided on the transparent substrate are registered in advance from the captured images Electrode position detecting means for detecting using the shape of the electrode, differential filter processing means for performing differential filter processing for emphasizing the convex portion formed on the electrode, and the convex portion emphasized by the differential filter processing; Pattern matching with an indentation model prepared in advance, and an indentation candidate extracting means for extracting the convex portion having a matching rate equal to or higher than a set value as an indentation candidate, and the extracted indentation candidate When the difference between the shade values of the shape portion is equal to or greater than a set value, the indentation determining means for determining that the convex portion is an indentation, the counting means for counting the number of indentations determined to be indentations, and the indentation are counted as indentations. And pass / fail judgment means for judging pass / fail of the mounting state of the electronic component on the transparent substrate depending on whether or not the number is equal to or greater than a set value.

  According to a fourth aspect of the present invention, in the electronic component mounting state inspection apparatus, the transparent substrate on which the electronic component is mounted via the anisotropic conductive film is used as the back surface of the surface on which the electronic component is mounted. The differential interference microscope projected from the side, the imaging unit that captures the image projected by the differential interference microscope, and the position of the electrode provided on the transparent electrode from the captured image are registered in advance When binarizing the gray value of the detected image of the convex portion formed on the electrode position detecting means and the detected electrode using the shape of the electrode, the area of the portion that is equal to or greater than the threshold is equal to or greater than the set value In the case of binarizing the gray value of the detected image of the convex portion formed on the electrode and the first foreign matter determining means that determines that there is a foreign matter in the case, the area of the portion that is less than or equal to the threshold is greater than or equal to the set value The second difference that determines that there is a foreign object in some cases The convex portion formed by pressing the conductive particles in the anisotropic conductive film after performing a Laplacian filter processing for emphasizing an edge on the convex portion formed on the electrode with a determination unit When the gray value of the image after removal is binarized, a third foreign matter determination unit that determines that there is a foreign matter when the area of the portion that is equal to or smaller than the threshold is equal to or larger than a set value, and the light intensity change of the differential interference microscope If the gray value of the image after applying the differential filter processing in accordance with the size of the foreign object in the direction in which the image appears is binarized, it is determined that there is a foreign object if the area of the part that is equal to or greater than the threshold is equal to or greater than the set value. And a fourth foreign matter determining means.

  According to a fifth aspect of the present invention, in the method for manufacturing an electronic device, the electronic device is manufactured using a component in which the electronic component is mounted on the transparent substrate on which the electrode is provided via an anisotropic conductive film. The process includes a step of inspecting by the electronic component mounting state inspection method according to any one of claims 1 to 6.

  ADVANTAGE OF THE INVENTION According to this invention, the quality determination of the mounting state of the electronic component on the transparent substrate performed using an anisotropic conductive film can be performed accurately.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.

  In the electronic component mounting state inspection apparatus X according to the first embodiment of the present invention, as shown in FIG. 1, an inspection in which an electronic component 3 is mounted on a transparent substrate 1 via an anisotropic conductive film 2 is used. An XY stage 5 on which the object 4 is placed, a differential interference microscope 6, a CCD camera 7 as an imaging unit, a display unit 8 for displaying inspection contents and inspection results, a cleaning device 9, and a control unit 10. And are provided.

  As shown in FIG. 2, the inspection object 4 includes an electrode 11 provided on one surface of the transparent substrate 1, and an electronic component 3 is mounted on the side where the electrode 11 is provided via an anisotropic conductive film 2. Yes. The electronic component 3 is mounted by thermocompression bonding. In the anisotropic conductive film 2, conductive particles 2b are dispersed in an adhesive resin 2a having insulating properties. When the electronic component 3 is mounted, the conductive particles 2b are sandwiched between the bumps 3a and the electrodes 11 of the electronic component 3 and crushed, so that the bumps 3a and the electrodes 11 can be energized. In addition, when the conductive particles 2b sandwiched between the bumps 3a and the electrodes 11 are pressed, the electrodes 11 are formed with indentations 11a that are the marks pressed by the conductive particles 2b.

  As shown in FIG. 3, the differential interference microscope 6 incorporates a pair of wedge-shaped prisms 12a and 12b, which are interference devices, in an ordinary optical microscope. It is a conventionally known microscope that can be observed instead. Therefore, by using the differential interference microscope 6, it is possible to observe a minute convex portion of the electrode 11, which cannot be observed with a normal optical microscope, for example, an indentation 11a as a difference in light and shade. The differential interference microscope 6 is arranged in a direction in which the transparent substrate 1 is projected from the back side of the transparent substrate 1 on which the electronic component 3 is mounted on the side on which the electronic component 3 is mounted.

  The differential interference microscope 6 is provided with an adjustment mechanism (not shown) for adjusting the position of the movable prism 12b with respect to one fixed prism 12a. By moving the prism 12b by this adjusting mechanism, the observable contrast can be adjusted. Therefore, by adjusting the position of the prism 12b at the time of manufacturing the differential interference microscope 6, when each differential interference microscope 6 projects the same inspection object 4, the same gray level difference can be obtained.

  Further, the brightness of the illumination of the differential interference microscope 6 can be adjusted so as to be constant by using an average of gray values of captured images or using an illuminometer. By performing this illuminance adjustment, when the differential interference microscopes 6 project the same inspection object 4, the same light / dark difference can be obtained.

  The CCD camera 7 that is an imaging unit is provided integrally with the differential interference microscope 6 and captures an image projected by the differential interference microscope 6.

  The cleaning device 9 cleans the surface of the transparent substrate 1 on the side projected by the differential interference microscope 6. If dust adheres to the surface of the transparent substrate 1 projected by the differential interference microscope 6, it will interfere with the imaging of the electrode 11 due to the influence, and the indentation 11 a cannot be detected, or foreign matter may be in contact with the electrode 11. It may be determined that the object is sandwiched between the bumps 3a. In order to prevent such a problem, it is conceivable to clean the transparent substrate 1 in advance. In addition, when the frequency of dust adhesion is low, a method of cleaning the portion only when the indentation 11a cannot be detected or when it is determined that a foreign object is sandwiched between the electrode 11 and the bump 3a. There is also. As a cleaning method, a method of removing dust by blowing gas, a method of suctioning, a method of removing with a brush, and the like can be considered. In particular, in the case of cleaning with a brush, it is effective to combine the rotation and translation of the brush. With only rotation, the center of rotation becomes zero speed, so the foreign matter in this part cannot be removed. Moreover, if only parallel movement is performed, there is a possibility that dust may be moved to an adjacent inspection range.

  The control unit 10 includes a ROM that stores various programs and various fixed data, a RAM that temporarily stores data input from the differential interference microscope 6 and the CCD camera 7, and a program and fixed data stored in the ROM. A CPU that performs various arithmetic processes using the data and data stored in the RAM, and a recording unit that records a part of the input data and the arithmetic result of the CPU in association with the inspection object 4 are provided. Yes.

  The mounting state inspection device X for the electronic component 3 shown in FIG. 1 is disposed in a part of a manufacturing line for electronic devices. In the electronic equipment manufacturing line, an electronic component mounting state inspection device X is disposed on the downstream side of the mounting device on which the electronic component 3 is mounted on the transparent substrate 1 via the anisotropic conductive film 2.

  FIG. 4 is a flowchart illustrating the mounting state inspection performed by the mounting state inspection apparatus X performed on the inspection object 4 in which the electronic component 3 is mounted on the transparent substrate 1 with the anisotropic conductive film 2 interposed therebetween. It demonstrates with reference to the process drawing shown in FIG. Note that the inspection of the mounting state is performed under the control of the control unit 10.

  In the control unit 10, it is determined whether or not the inspection object 4 has been transported to the inspection position projected by the differential interference microscope 6 (S1). When the inspection object 4 is conveyed to the inspection position (YES in S1), an image projected by the differential interference microscope 6 is captured by the CCD camera 7 (S2). FIG. 5A shows a captured image captured by the CCD camera 7. A plurality of convex portions 13 appear on the electrode 11 in the captured image. These convex portions 13 include indentations 11 a generated by being pressed by the conductive particles 2 b when the electronic component 3 is mounted.

  When the imaging by the CCD camera 7 is completed, the position of the electrode 11 provided on the transparent substrate 1 is detected from the captured image by pattern matching using the shape of the electrode 11 registered in advance ( S3). Here, the electrode position detecting means is executed. FIG. 5B shows a state where the electrode positions are surrounded by marks indicated by broken lines.

  When the electrode position is detected, differential filter processing for enhancing the convex state of the convex portion 13 formed on the electrode 11 is performed (S4). Here, differential filter processing means is executed. FIG. 5C shows a state in which the convex state of the convex portion 13 is emphasized and the convex portion 13 is clearly displayed by performing differential filter processing.

  After the differential filter processing is performed, the convex portion 13 in which the convex state is emphasized and the indentation model 14 prepared in advance are pattern-matched, and the convex portion 13 having a matching rate equal to or higher than a set value is used as an indentation candidate. Extracted (S5). Here, indentation candidate extraction means is executed. In the extraction of the indentation candidate, the convex portion 13 that can become the indentation 11a is extracted based on the shape. FIG. 5D shows a state in which the convex portion 13 extracted as the indentation candidate is surrounded by square marks.

  As shown in FIG. 6, the indentation model 14 used in pattern matching is created by superimposing a plurality of images (indentation images) 15 obtained by capturing actual indentations to obtain an average value. Since the shape of the indentation 11a varies depending on the shape, material, size of the conductive particles 2b and the pressurizing conditions at the time of mounting, a method of creating an indentation model by a theoretical method obtains a representative of the actual indentation shape. Is difficult. Furthermore, when the actual impression image 15 is used, the influence due to the change in the shape of each impression can be reduced by using the plurality of impression images 15 in an overlapping manner. The meaning of overlapping is to take the sum of the gray values of the same coordinates of each impression image 15 and divide by the number of impression images 15.

  After the extraction of the indentation candidate is completed, it is determined whether or not the difference between the shade values of the convex portion 13 extracted as the indentation candidate is equal to or larger than a set value (S6). When the difference between the shade values of the convex portion 13 is equal to or larger than the set value (YES in S6), the convex portion 13 is determined to be the indentation 11a (S7). Here, indentation determination means is executed. On the other hand, when the difference between the shade values of the convex portion 13 is equal to or smaller than the set value (NO in S6), it is determined that the convex portion 13 is not the indentation 11a (S8). FIG. 5E shows a state in which the square mark is left on the convex portion 13 determined to be the indentation 11a and the square mark is erased from the convex portion 13 determined not to be the indentation 11a. Has been.

  After the determination that the extracted convex portion 13 is an indentation (S7) and the determination that the extracted convex portion 13 is not an indentation (S8), the convexity that is determined to be an indentation is determined. The number of the shaped portions 13 is counted (S9). Here, a counting means for counting the number of indentations 11a is executed.

  After the number of indentations 11a is counted, it is determined whether or not the counted number of indentations 11a is equal to or greater than a set value (S10). If the counted number of indentations 11a is above the set value (YES in S10), it is determined that the mounting state is good (S11), and if the counted number of indentations 11a is equal to or less than the set value. (NO in S10), it is determined that the mounting state is defective (S12). Here, a pass / fail judgment means for judging pass / fail of the mounting state of the electronic component 3 on the transparent substrate 1 based on whether or not the counted number of indentations 11a is equal to or larger than a set value is executed.

  In such a configuration, in the electronic component mounting state inspection apparatus X, when the electronic component 3 is mounted on the transparent substrate 1 via the anisotropic conductive film 2, the convex portion 13 generated in the electrode 11 is changed to the convex portion 13. Whether or not the shape portion 13 is the indentation 11a is automatically determined. In this automatic determination, first, pattern matching between the convex portion 13 and the indentation model 14 is performed, and the convex portion 13 whose outer shape is similar to the indentation 11a is extracted as an indentation candidate (S5 in the flowchart of FIG. 4). Next, from the extracted indentation candidates, the indentation 11a is determined to have an intensity difference equal to or greater than a set value (S6 to S8 in the flowchart of FIG. 4). By performing such a two-stage determination, it is possible to determine whether or not the impression 11a is the same as when the inspector visually determines.

  Then, the number determined to be the indentation 11a is counted (S9 in the flowchart of FIG. 4), and when the count number is equal to or larger than the set value, it is determined that the mounting state is good (FIG. 4). In steps S10 to S11).

  Therefore, automatic determination as to whether the electronic component 3 is mounted on the transparent substrate 1 is good or bad can be made with high accuracy.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. Note that, in the second embodiment and subsequent embodiments, the same components as those described in the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  The basic structure of the mounting state inspection apparatus X of the second embodiment is the same as that of the first embodiment, and electrode position correcting means is added to the second embodiment. The electrode position correcting means is a process executed by the control unit 10, and when detecting the positions of a plurality of electrodes 11 located in the same captured image, the detection result differs from the other electrodes 11 by a set value or more. This is a process of correcting the detection position of the electrode 11 based on the detection result of the other electrode 11.

  FIG. 7A shows a captured image captured by the CCD camera 7 and having a plurality of electrodes 11. FIG. 7B shows a state in which the position of the electrode 11 is detected by pattern matching using the shape of the electrode 11 registered in advance. A range surrounded by a broken line is a range detected as the electrode 11 is located.

  In the captured image of FIG. 7A, it is captured that the bubbles 16 generated when the anisotropic conductive film 2 is attached exist near the D electrode 11. For this reason, when the position of the electrode 11 is detected, the position of the electrode 11 of D is erroneously detected due to the influence of the bubble 16 as shown in FIG.

  Therefore, the detection position of the D electrode 11 is corrected by the electrode position correcting means based on the detection result of the other electrode 11. In FIG. 7C, the electrode positions of the electrodes 11 after correcting the detection positions of the D electrodes 11 are indicated by broken lines.

  A specific procedure for correcting the electrode position by the electrode position correcting means will be described with reference to FIG.

  FIG. 8 is a graph showing the detection positions of all the electrodes 11 and the corrected positions of the electrodes 11. First, an average value of detection positions is obtained for all the electrodes 11, and an average value line indicated by a broken line is drawn.

  After the average value line is drawn, the electrode 11 that is more than the set value preset for the average value line is searched for. Here, it is assumed that the D electrode 11 is separated from the average value line by a set value or more.

  If there is an electrode 11 that is more than the set value from the average value line, the average value of the detection positions is obtained for the other electrodes 11 excluding the electrode 11, and a corrected average value line indicated by a solid line is drawn.

  After drawing the corrected average value line, the position of the D electrode 11 is corrected so as to be positioned on the corrected average value line.

  Therefore, even when the position of the electrode 11 is erroneously detected due to a foreign matter such as the bubble 16, the detection position of the electrode 11 can be corrected. For this reason, it can be prevented that the number of indentations 11a in the electrode 11 is small and the mounting state is determined to be defective due to the erroneous detection of the position of the electrode 11.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG.

  The basic structure of the mounting state inspection apparatus X of the third embodiment is the same as that of the first embodiment. In the third embodiment, the average brightness change in one electrode 11 is the same. And a means for subtracting the average tendency of the obtained change in brightness from the brightness in the electrode 11. These means are processes executed by the control unit 10.

  Depending on the characteristics of the differential interference microscope 6, the transparent substrate 1 may be entirely tilted and the brightness within the same electrode 11 may change. Then, when the brightness in the same electrode 11 changes, the gray value of the indentation 11a in the electrode 11 changes, and the indentation 11a may be determined as a foreign object. As a countermeasure against this phenomenon, the average tendency of the brightness change of the same electrode 11 is obtained and subtracted from the original brightness of the electrode 11 to reduce the influence of the brightness change in the electrode 11.

  FIG. 9A shows a captured image in which the brightness within the same electrode 11 is changed. FIG. 9B shows an image in which the convex portion 13 including the indentation 11a formed on the electrode 11 is erased and smoothed, and only the brightness change tendency of the indentation 11a is extracted. . FIG. 9C shows the brightness in the electrode 11 by subtracting the change in brightness in the electrode 11 shown in FIG. 9B from the captured image shown in FIG. 9A. An image in which the influence of the change is reduced is shown.

  In such a configuration, even when the brightness in the same electrode 11 changes due to the characteristics of the differential interference microscope 6, the influence of the change in the brightness in the same electrode 11 is reduced and the indentation 11a is determined with high accuracy. This can be performed, and the accuracy of determining whether the electronic component 3 is mounted or not can be improved.

(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to FIG.

  The basic structure of the fourth embodiment is the same as that of the first embodiment, and the mounting state inspection apparatus X of the fourth embodiment includes an NG label printer 17, a recording unit 18, and a re-use unit. An inspection device 19 is added.

  The NG label printer 17 prints an NG label with a bar code attached to the inspection object 4 when it is determined that the inspection object 4 has a bad mounting state of the electronic component 3.

  In the recording unit 18, when it is determined that a certain inspection object 4 has a bad mounting state of the electronic component 3, the barcode information pasted on the inspection object 4 and the determination result that it is defective, Specifically, information such as a defect determination location, defect determination content, and a defect determination image is recorded in association with each other.

  The re-inspection apparatus 19 is provided with a barcode reader 20, a display unit 21, and a differential interference microscope 22. The barcode reader 20 can read the barcode of the NG label. When the barcode of the NG label attached to the inspection object 4 is read by the barcode reader 20, the defect determination result recorded in the recording unit 18 in association with the barcode is displayed on the display unit 21, Display means are executed.

  In such a configuration, the inspector who performs the re-inspection reads the barcode of the NG label attached to the inspection object 4 with the barcode reader 20, and displays the determination result that is defective on the display unit 21. Can be displayed. Furthermore, if necessary, a portion determined to be defective can be reinspected using the differential interference microscope 22 based on the displayed determination result, and reinspection can be performed efficiently.

  When a serial number called a chip ID is attached to the transparent substrate 1, the chip ID can be read by a dedicated reader, and an NG label printer for printing an NG label is not necessary.

(Fifth embodiment)
A fifth embodiment of the present invention will be described with reference to FIG.

  The basic structure of the fifth embodiment is the same as that of the first embodiment. The mounting state inspection apparatus X of the fifth embodiment includes a differential interference microscope 22 for re-inspection and an inspection object. A transport mechanism 23 for transporting the XY stage 5 on which the object 4 is placed from the observation position by the differential interference microscope 6 to the observation position by the differential interference microscope 22 is added.

  When the inspection object 4 placed on the XY stage 5 is observed by the differential interference microscope 6 and the mounting state is determined to be defective, the conveyance mechanism 23 causes the XY stage 5 together with the inspection object 4 to be inspected. It is transported to an observation position by the differential interference microscope 22 and re-inspection of the mounting state is performed by an inspector.

  In such a configuration, in the step of automatically determining the quality of the mounting state, the inspection object 4 determined to be defective in the mounting state is automatically transported to a position where re-inspection is performed by an inspector. Therefore, reinspection can be easily performed.

(Sixth embodiment)
A sixth embodiment of the present invention will be described with reference to FIG.

  The basic structure of the sixth embodiment is the same as that of the fifth embodiment. In the sixth embodiment, the inspection result of the mounting state of the inspection object 4 that is the object of re-inspection A recording unit 24 is provided for recording information relating to re-examination in association with each other.

  The inspection result of the mounting state of the inspection object 4 that has been subject to re-inspection includes a defect determination location, a defect determination content, a defect determination image, and the like. Information on the reexamination includes the name of the reexamination inspector as a result of the reexamination.

  In such a configuration, the mounting state inspection result for the inspection object 4 that has been subject to re-inspection and information related to re-inspection are recorded in association with each other, so that the mounting state is good in re-inspection. If the inspection object 4 determined to be later becomes defective, it can be used for investigation of the cause of the defect from various information recorded in the recording unit 24.

(Seventh embodiment)
A seventh embodiment of the present invention will be described with reference to FIGS.

  The basic structure of the seventh embodiment is the same as that of the first embodiment. In the seventh embodiment, it is determined whether or not a foreign object is included in the mounting location of the inspection object 4. Foreign matter determination means is added.

  When the electronic component 3 is mounted on the transparent substrate 1 using the anisotropic conductive film 2, products in which foreign matter has entered the mounting portion are collected and classified at the actual production site. (1) Brightness of the foreign matter portion Is expensive. (2) The foreign matter portion has a low luminance. (3) Clear convex shape. (4) A gently convex shape. Could be classified. Therefore, the presence or absence of foreign substances classified into these four is determined by the foreign substance determination means.

  Determination of the presence / absence of a foreign substance by the foreign substance determination unit will be described with reference to a flowchart shown in FIG. 13 and a process diagram shown in FIG. This foreign matter determination is performed under the control of the control unit 10 of the mounting state inspection apparatus X.

  In the control unit 10, it is determined whether or not the inspection object 4 has been transported to the inspection position projected by the differential interference microscope 6 (S1). When the inspection object 4 is conveyed to the inspection position (YES in S1), an image projected by the differential interference microscope 6 is captured by the CCD camera 7 (S2). In FIG. 14 (1-a), a captured image including a foreign object 30 with a high luminance is shown, (2-a) shows a captured image including a foreign object 31 with a low luminance, and (3-a) is clearly shown. The captured image including the convex foreign material 32 is shown, and the captured image including the gently convex foreign material 33 is shown in (4-a).

  When the imaging by the CCD camera 7 is completed, the position of the electrode 11 provided on the transparent substrate 1 is detected from the captured image by pattern matching using the shape of the electrode 11 registered in advance ( S3). Here, the electrode position detecting means is executed. FIGS. 13 (1-b), (2-b), (3-b), and (4-b) show states in which the electrode positions are surrounded by marks indicated by broken lines.

  After the electrode position is detected, the first foreign matter determining means (S21), the second foreign matter determining means (S22), the third foreign matter determining means (S23), and the fourth foreign matter determining means (S24) are executed. Is done.

  In the first foreign matter determining means, the grayscale value of the imaged electrode 11 is binarized (FIG. 14 (1-c)), and the area of the portion 34 that is greater than or equal to the threshold is greater than or equal to the set value. It is determined that there is a foreign object.

  In the second foreign matter determination means, the gray value of the imaged electrode 11 is binarized (FIG. 14 (2-c)), and the area of the portion 35 that is equal to or smaller than the threshold is equal to or larger than the set value. It is determined that there is a foreign object.

  In the third foreign matter determining means, a Laplacian filter process for emphasizing the edge is performed on the convex portion formed on the electrode 11 (FIG. 14 (3-c)), and the conductive particles in the anisotropic conductive film 2. A process of erasing the convex portion (indentation) formed by being pressed by 2b is performed (FIG. 14 (3-d)), and the gray value of the image from which the indentation has been erased is binarized (FIG. 14 (3-e )), It is determined that there is a foreign object when the area of the portion 36 which is equal to or smaller than the threshold is equal to or larger than a set value.

  In the fourth foreign matter determination means, differential filter processing in accordance with the size of the foreign matter is performed in the direction in which the density change of the differential interference microscope 6 appears (FIG. 14 (4-c)), and differential filter processing is performed. The gray value of the subsequent image is binarized (FIG. 14 (4-d)), and it is determined that there is a foreign object when the area of the portion 37 that is equal to or greater than the threshold is equal to or greater than the set value.

  After the foreign matter determination in steps S21 to S24 is performed, if it is determined that there is a foreign matter in any step, it is determined that the mounting state is defective, and if it is determined that there is no foreign matter in all steps. It is determined that the mounting state is good (S25).

  In such a configuration, the automatic determination of whether the mounting state is good or defective is good by determining whether or not a foreign substance exists in the mounting part using the anisotropic conductive film 2. It can be carried out.

  In the seventh embodiment, the means for obtaining the average tendency of the change in brightness in one electrode 11 described in the third embodiment (see FIG. 9), and the obtained brightness It is possible to add a means for subtracting the average tendency of the change from the brightness in the electrode 11. Thereby, the influence of the change in the brightness within the same electrode 11 can be reduced, and the presence / absence determination of the foreign matter can be performed with high accuracy, and the accuracy of the determination of whether the electronic component 3 is mounted or not can be improved.

  Note that the mounting state inspection apparatus X described in each of the above-described embodiments can be incorporated in the middle of an electronic equipment production line. Accordingly, during the manufacturing process of the electronic device using the component in which the electronic component 3 is mounted on the transparent substrate 1 on which the electrode 11 is provided via the anisotropic conductive film 2, 7. The electronic device manufacturing method including the step of inspecting the mounting state by the electronic component mounting state inspection method can be realized.

It is a front view which shows the mounting state inspection apparatus of the electronic component which concerns on the 1st Embodiment of this invention. It is a vertical front view which shows the test target object in which the electronic component was mounted in the transparent substrate through the anisotropic conductive film. It is a schematic diagram which shows the structure of a differential interference microscope. It is a flowchart explaining the inspection process of the mounting state in the mounting state inspection apparatus performed with respect to a test target object. It is process drawing explaining the inspection process of the mounting state in the mounting state inspection apparatus performed with respect to a test target object. It is explanatory drawing about preparation of the indentation model used by pattern matching. It is process drawing explaining the electrode position correction at the time of a test | inspection in the mounting condition inspection apparatus of the electronic component which concerns on the 2nd Embodiment of this invention. It is a graph explaining the electrode position correction by an electrode position correction means. FIG. 11 is a process diagram for explaining the reduction of the influence of the change in brightness in an electrode at the time of inspection in the electronic component mounting state inspection apparatus according to the third embodiment of the present invention. It is a front view which shows the mounting state inspection apparatus of the electronic component which concerns on 4th Embodiment. It is a front view which shows the mounting state inspection apparatus of the electronic component which concerns on 5th Embodiment. It is a front view which shows the mounting state inspection apparatus of the electronic component which concerns on 6th Embodiment. It is a flowchart explaining the process of the foreign material detection by the mounting state inspection apparatus of the electronic component which concerns on 7th Embodiment. It is process drawing explaining the process of a foreign material detection.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Transparent substrate, 2 ... Anisotropic conductive film, 3 ... Electronic component, 6 ... Differential interference microscope, 7 ... Imaging part, 9 ... Cleaning device, 11 ... Electrode, 11a ... Indentation, 13 ... Convex part, 14 ... Indentation model, 21 ... display section, 22 ... differential interference microscope, 23 ... transport mechanism, 24 ... recording section

Claims (10)

A step of imaging a transparent substrate on which an electronic component is mounted via an anisotropic conductive film by imaging with a differential interference microscope from the back side of the surface on which the electronic component is mounted;
Detecting the position of the electrode provided on the transparent substrate from the captured image using the shape of the electrode registered in advance;
Applying differential filter processing to emphasize the convex portions formed on the electrodes;
Pattern-matching the convex portion emphasized by the differential filter processing and an indented model prepared in advance, and extracting the convex portion having a matching rate equal to or higher than a set value as an indentation candidate;
A step of determining that the convex portion is an indentation when a difference in gray value of the convex portion extracted as an indentation candidate is a set value or more;
Counting the number of indentations determined,
Determining whether the electronic component is mounted on the transparent substrate according to whether the number counted as an indentation is a set value or more;
A mounting state inspection method for an electronic component, comprising: A step of imaging a transparent substrate on which an electronic component is mounted via an anisotropic conductive film by imaging with a differential interference microscope from the back side of the surface on which the electronic component is mounted;
Detecting the position of the electrode provided on the transparent substrate from the captured image using the shape of the electrode registered in advance;
When binarizing the gray value of the image of the convex portion formed on the detected electrode, the step of determining the presence of foreign matter when the area of the portion that is equal to or greater than the threshold is greater than or equal to the set value;
When binarizing the gray value of the image of the convex portion formed on the detected electrode, a step of determining that there is a foreign object when the area of a portion that is equal to or less than a threshold value is equal to or greater than a set value;
After performing Laplacian filter processing for emphasizing an edge on the convex portion formed on the electrode, the convex portion formed by being pushed by conductive particles in the anisotropic conductive film is removed. When binarizing the gray value of the image, a step of determining that there is a foreign object when the area of the portion that is equal to or less than the threshold is equal to or greater than a set value;
When binarizing the gray value of the image after performing differential filter processing in accordance with the size of the foreign material in the direction in which the gray level change of the differential interference microscope appears, the area of the portion that is equal to or larger than the threshold is equal to or larger than the set value. A step of determining a foreign object in the case,
A mounting state inspection method for an electronic component, comprising:   2. The electronic component mounting state inspection method according to claim 1, wherein the indentation model is created by superimposing a plurality of images obtained by imaging indentations to obtain an average value.   When detecting the positions of the plurality of electrodes in the captured image, the electrodes having detection results different from each other by a set value or more compared to the other electrodes are determined based on the detection results of the other electrodes. The electronic component mounting state inspection method according to claim 1, further comprising a step of correcting the position of the electronic component.   The mounting state inspection method for an electronic component according to claim 1, further comprising a step of cleaning a surface of the transparent substrate facing the differential interference microscope. Obtaining an average trend of brightness change in the electrode to be detected;
Subtracting the average trend of the determined change in brightness from the brightness of the imaged image;
The electronic component mounting state inspection method according to any one of claims 1 to 5, further comprising: A differential interference microscope that reflects a transparent substrate on which an electronic component is mounted via an anisotropic conductive film from the back side of the surface on which the electronic component is mounted;
An imaging unit for imaging an image projected by the differential interference microscope;
Electrode position detection means for detecting the position of the electrode provided on the transparent substrate using the shape of the electrode registered in advance from the captured image;
Differential filter processing means for performing differential filter processing to emphasize the convex portions formed on the electrodes;
Indentation candidate extraction means for pattern-matching the convex portion emphasized by the differential filter processing and an indented model prepared in advance, and extracting the convex portion having a matching rate equal to or higher than a set value as an indentation candidate;
Indentation determining means for determining that the convex portion is an indentation when the difference in the shade value of the convex portion extracted as an indentation candidate is a set value or more,
Counting means for counting the number of indentations determined;
Pass / fail judgment means for judging pass / fail of the mounting state of the electronic component on the transparent substrate depending on whether or not the number counted as an indentation is a set value or more,
An electronic component mounting state inspection apparatus comprising: A differential interference microscope that reflects a transparent substrate on which an electronic component is mounted via an anisotropic conductive film from the back side of the surface on which the electronic component is mounted;
An imaging unit for imaging an image projected by the differential interference microscope;
Electrode position detection means for detecting the position of the electrode provided in the transparent electrode from the captured image using the shape of the electrode registered in advance,
A first foreign matter determination unit that determines that there is a foreign matter when the area of a portion that is equal to or greater than a threshold is equal to or greater than a set value when binarizing the detected shade value of the convex portion image formed on the electrode; ,
A second foreign matter judging means for judging the presence of foreign matter when the area of the portion that is equal to or smaller than the threshold is equal to or larger than a set value when binarizing the detected gradation value of the convex portion image formed on the electrode; ,
After performing Laplacian filter processing for emphasizing an edge on the convex portion formed on the electrode, the convex portion formed by being pushed by conductive particles in the anisotropic conductive film is removed. A third foreign matter determining unit that determines that there is a foreign object when the area of the portion that is equal to or smaller than the threshold is equal to or larger than a set value when the gray value of the image is binarized
When binarizing the gray value of the image after performing differential filter processing in accordance with the size of the foreign material in the direction in which the gray level change of the differential interference microscope appears, the area of the portion that is equal to or larger than the threshold is equal to or larger than the set value. A fourth foreign matter determining means for determining that there is a foreign matter in the case,
An electronic component mounting state inspection apparatus comprising:   9. The electronic component according to claim 7, further comprising a transport mechanism that transports the transparent substrate to be re-inspected from a position where the mounting state is inspected to a re-inspection position by a differential interference microscope for re-inspection. Mounting state inspection device.   The electronic component mounting state inspection according to any one of claims 1 to 6, during a manufacturing process of an electronic device using a component in which an electronic component is mounted on a transparent substrate provided with an electrode via an anisotropic conductive film. The manufacturing method of the electronic device characterized by including the process to test | inspect by a method.

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