JP2008015968A - Conductive member for non-contact type data carrier and its manufacturing method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly make conductive the conductive layers of the both sides of a conductive member for a non-contact type data carrier. <P>SOLUTION: A raw material sheet configured by forming conductive layers 3c and 4a made of metallic foils on the both sides of an insulating base material 2 is placed on a heated base 6, and an ultrasonic vibrator 7 having a pressurizing part 7a shaped like a polygonal pyramid or a polygonal pyramid pedestal in which concave sections are formed in the metallic foil is heated so that the elongation at break of the metallic foil can not be exceeded, and brought into contact with the conductive layer 3c of the raw material sheet from the upper part of the base, and while an ultrasonic wave with transverse vibration is applied to the ultrasonic vibrator, the concave sections 5 are formed on the conductive layer by the pressurizing part, and the concave sections are welded through the insulating base materials to the opposite conductive layer 4a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a conductive member for a non-contact type data carrier such as an IC tag and a manufacturing method and apparatus thereof.

  Non-contact type IC tags, IC cards, and the like are each provided with a conductive layer made of metal foil on the front and back surfaces of an insulating substrate. For example, an antenna is formed on the front conductive layer, and a bridge connecting the end portions of the antenna is formed on the back conductive layer. Conventionally, through-holes have been used for the electrical connection between the antenna and the bridge, but in recent years, ultrasonic welding has come to be used.

  This ultrasonic welding is performed by the following procedure. First, a material sheet in which a conductive layer is formed on each of the front and back surfaces of an insulating base is placed on a heated base. Next, an ultrasonic vibrator heated from above the conductive layer is brought into contact, and ultrasonic waves are applied to the ultrasonic vibrator. The insulating base material is softened by heat transfer from the base or the like, and the upper conductive layer pressed by the ultrasonic vibrator penetrates into the lower conductive layer through the softened insulating base material. This recess is welded to the lower conductive layer by frictional heat generated by ultrasonic vibration (see, for example, Patent Document 1).

  The base and the ultrasonic transducer are both heads having a spherical tip, the material sheet is sandwiched between both heads, and the conductive layers on the front and back are recessed to the center in the thickness direction of the material sheet. It has also been attempted to join them with frictional heat (see, for example, Patent Document 2).

JP-A-9-263079 JP 2004-134678 A

  In the conventional ultrasonic welding method, since the spherical surface or the sharp end surface formed on the ultrasonic transducer is pressed against the conductive layer and welded, the welding may be uncertain. In addition, the conductive layer may be broken or cracked. Furthermore, since a deep and steeply recessed portion is formed on the surface of the insulating base material, even if the surface is covered with a coating layer and desired items are displayed by printing, the recessed portion is likely to appear on the surface. Printing may not be performed properly.

  Therefore, an object of the present invention is to provide means that can solve the above-described problems.

  In order to solve the above problems, the present invention employs the following configuration.

  That is, in the invention according to claim 1, the conductive layers (3, 4) each made of a metal foil are formed on the front and back surfaces of the insulating base (2), and the recesses ( 5) is a non-contact type data carrier conductive member welded to the other conductive layer (4) through the insulating base (2), and the polygonal pyramid or the poly The concave portion (5) is formed on the truncated pyramid.

  The insulating substrate (2) is a synthetic resin sheet and can be formed of polyethylene terephthalate, polyethylene naphthalate, or the like. The metal foil is formed of aluminum, copper, phosphor bronze, SUS, or an alloy. The metal foil is fixed to the surface of the insulating substrate through, for example, a thermoplastic adhesive layer. The recessed part (5) formed in the conductive layer (3) is formed in a polygonal pyramid or a polygonal frustum so that the metal foil does not exceed its breaking elongation. The inclined surface of the polygonal pyramid or the polygonal frustum is preferably 7 ° to 45 °, more preferably 15 ° to 30 ° with respect to the surface of the insulating base (2). The polygonal pyramid or the polygonal frustum may be a desired pyramid or a truncated pyramid such as a triangle, a square, or a hexagon.

  In this non-contact type data carrier conductive member, the concave portion (5) may be single, but a plurality of the concave portions (5) may be formed adjacent to each other. By forming a plurality of adjacent portions, the concave portions (5) are arranged densely, and the conductive layers (3, 4) can be more reliably joined.

  In this non-contact type data carrier conductive member, one of the conductive layers (3, 4) on the front and back surfaces of the insulating base (2) includes an antenna, the other includes a bridge, both ends of the antenna and both ends of the bridge The recessed part (5) may be formed between the two parts.

  Further, the conductive member for non-contact type data carrier can be an antenna in which an IC chip (10) is mounted, and the front and back surfaces of the insulating base (2) are conductive layers (3, 4). It can also be covered with a coating layer (11, 12, 14, 15) from above.

  The conductive member for a non-contact type data carrier according to the present invention is a base (1a) obtained by heating a material sheet (1a) in which conductive layers (3, 4) each made of a metal foil are formed on the front and back surfaces of an insulating substrate (2) ( 6) An ultrasonic transducer having a polygonal pyramid or a polygonal frustum pressing portion (7a) which is placed on and forms a recess (5) in the metal foil so as not to exceed the breaking elongation of the metal foil. (7) is heated and brought into contact with the conductive layer (3) of the material sheet (1a) from above the base (6), while applying ultrasonic waves of lateral vibration to the ultrasonic vibrator (7), 7a) by forming the recess (5) in the conductive layer (3) and welding the recess (5) to the opposite conductive layer (4) through the insulating base (2). Can be manufactured.

  The vibration direction of the lateral vibration applied to the ultrasonic transducer (7) may be any of the A direction and the B direction illustrated in FIG. 6, but a plurality of ultrasonic transducers (7) are arranged as described later. When a plurality of locations are welded at the same time, it is desirable to apply lateral vibration in a direction perpendicular to a line connecting the ultrasonic transducers (7).

  Further, the non-contact data carrier conductive member according to the present invention is based on a material sheet (1a) in which conductive layers (3, 4) made of metal foil are formed on the front and back surfaces of the insulating base (2) ( 6) An ultrasonic transducer (7) that is placed on top and forms a recess (5) in the metal foil so as not to exceed the breaking elongation of the metal foil. The material sheet (1a) from above the base (6) The concave portion (5) is formed in the conductive layer (3) while applying ultrasonic waves of lateral vibration to the ultrasonic transducer (7) and contacting the conductive layer (3). It can also be produced by passing 5) through the insulating substrate (2) and welding to the opposite conductive layer (4).

  In the method for manufacturing the non-contact type data carrier conductive member, one or both of the base (6) and the ultrasonic transducer (7) can be heated. This heating softens the thermoplastic adhesive for bonding the insulating base material (2) and the conductive layer of the material sheet (1a) to the (3,4) insulating base material (2), and forms the recess (5). Sometimes the metal foil can easily penetrate the insulating substrate (2) and the like.

  The heating temperature of the base (6) and the ultrasonic vibrator (7) is preferably the glass transition point of the resin constituting the insulating base (2). For example, when the resin is polyethylene terephthalate, the heating temperature is 80 ° C to 120 ° C. It is. The conductive layers (3, 4) are attached to the insulating substrate (2) through, for example, a thermoplastic adhesive layer, and the thermoplastic adhesive layer is easily melted at the glass transition temperature.

  The force for pressing the conductive layer (3) with the ultrasonic transducer (7) is desirably 100N to 400N. The transverse vibration applied to the ultrasonic transducer (7) is the direction in which the plane of the insulating substrate (2) extends, and preferably the frequency is about 40 kHz, the amplitude is about 19 μm, and the application time is 0.1 second to 0.3 seconds.

  In this method of manufacturing a non-contact type data carrier conductive member, a plurality of depressions (5) are provided adjacent to each other by providing a plurality of pressing portions (7a) adjacent to the ultrasonic transducer (7). You may make it form.

  In the method for manufacturing a conductive member for a non-contact data carrier, the material sheet (1a) includes one of the conductive layers (3, 4) on the front and back surfaces of the insulating base (2), and the other is a bridge. The two integrated ultrasonic transducers (7b, 7c) are simultaneously applied to both ends of the antenna or both ends of the bridge, respectively, and the two ultrasonic transducers (7b, 7c) are applied simultaneously. On the other hand, while applying ultrasonic waves of transverse vibration that oscillates in the direction (A) perpendicular to the line connecting the two end portions, one conductive layer (3) is passed through the insulating base material (2) to conduct on the opposite side. You may make it weld to a layer (4).

  The non-contact data carrier conductive member manufacturing apparatus according to the present invention mounts a material sheet (1a) in which conductive layers (3, 4) each made of a metal foil are formed on the front and back surfaces of an insulating substrate (2). Ultrasonic transducer having a base (6) to be placed and a polygonal pyramid or polygonal frustum pressing portion (7a) for forming a recess (5) in the metal foil so as not to exceed the breaking elongation of the metal foil (7), the ultrasonic vibrator (7) is brought into contact with the conductive layer of the material sheet (1a) from above the base (6), and ultrasonic waves of lateral vibration are applied to the ultrasonic vibrator (7). Meanwhile, the depressed portion (5) is formed in the conductive layer (3) by the pressing portion (7a), and the depressed portion (5) is passed through the insulating base material (2) to form the opposite conductive layer (4 ) To be welded.

  In this manufacturing apparatus, only one pressing portion (7a) of a polygonal pyramid or a polygonal frustum may be provided on the ultrasonic transducer, but a plurality of pressing portions (7a) may be provided adjacent to each other.

  Moreover, as a manufacturing apparatus, the base (6) which mounts the raw material sheet | seat (1a) in which the electrically conductive layer (3, 4) which each consists of metal foil was formed in the front and back of the insulating base material (2), and said metal An ultrasonic vibrator (7) for forming a recess (5) in the metal foil so as not to exceed the breaking elongation of the foil, and the ultrasonic vibrator (7) is formed from above the base (6) with a material sheet ( The concave portion (5) is formed in the conductive layer (3) while contacting the conductive layer (3) of 1a) and applying ultrasonic waves of transverse vibration to the ultrasonic transducer (7). It is also possible to adopt a configuration in which the part (5) is welded to the opposite conductive layer (4) through the insulating base (2).

  Further, as a manufacturing apparatus, one of the conductive layers (3, 4) on the front and back surfaces of the insulating base (2) includes an antenna, and the other includes both ends of the antenna or a bridge in the material sheet (1a) including a bridge. Two ultrasonic transducers (7b, 7c) that are respectively applied to both ends of each of the two ultrasonic transducers (7b, 7c). While applying ultrasonic waves of transverse vibration oscillating in a direction (A) perpendicular to the line connecting the two ends to the child (7b, 7c), one conductive layer (3) is attached to the insulating base material (2). It is also possible to weld to the opposite conductive layer (4).

  According to the conductive member for a non-contact type data carrier according to the present invention, a shallow concavity of a polygonal pyramid or a polygonal frustum in which the metal foil of the conductive layer (3) does not exceed its breaking elongation on the surface of the conductive layer (3). Since the part (5) is formed, the conductive layers (3, 4) on the front and back sides can be more reliably welded without causing breakage or cracks in the conductive layer (3). For non-contact data carriers The reliability of the conductive member as an IC tag or the like can be improved. Further, when the surface is covered with the coating layers (11, 14), the surface is hardly uneven, and desired items can be appropriately displayed from above the coating layers (11, 14) by printing or the like.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
As shown in FIGS. 1 to 4, a thermoplastic adhesive layer (not shown) is formed in a predetermined pattern on the front and back surfaces of the insulating member 2 in the non-contact data carrier conductive member 1 or the material sheet 1a thereof. The conductive layers 3 and 4 having the same pattern are laminated and fixed on the thermoplastic adhesive layer.

  The insulating base material 2 is formed of a synthetic resin sheet or a sheet obtained by laminating them. The thickness of the insulating substrate 2 is approximately 30 μm to 70 μm. The insulating substrate 2 is formed in a rectangular shape in the illustrated example, but may have other desired shapes. For example, polyethylene terephthalate (PET) can be used as the synthetic resin.

  The conductive layers 3 and 4 are made of, for example, aluminum foil. The thickness of the aluminum foil is about 3 μm to 15 μm.

  Of the conductive layers 3 and 4, the conductive layer 3 on the surface of the insulating base 2 is formed in an antenna pattern and a capacitor electrode pattern, respectively. In addition, the conductive layer 4 on the back surface of the insulating base material 2 among the conductive layers 3 and 4 is formed in a bridge pattern and a pattern of the other electrode of the capacitor, respectively. 1 to 4A and 4B, reference numeral 3a denotes a conductive layer corresponding to the antenna pattern, reference numeral 3b denotes a conductive layer corresponding to one electrode pattern of the capacitor, and reference numeral 4a corresponds to a bridge pattern. A conductive layer, 4b, indicates a conductive layer corresponding to the pattern of the other electrode of the capacitor.

  The antenna pattern is a spiral pattern in the illustrated example, but other patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern can be used depending on the communication frequency band.

  The bridge pattern is an elongated rectangle in the illustrated example, but can be appropriately changed to other shapes.

  The capacitor pattern is formed in a long and narrow rectangle for one electrode, while the other electrode is formed in a number of electrically connected strips. After the non-contact type data carrier conductive member 1 is completed, the capacitance is adjusted by cutting the conductive layer 4c between the strips, and the resonance frequency as the non-contact type data carrier conductive member 1 is adjusted. Can be corrected to an optimum value.

  The laminated sheet shown in FIG. 4 (A) is a material sheet 1a of the non-contact type data carrier conductive member 1, and as shown in FIGS. 4 (B) and 5, a conductive layer 3c corresponding to the pattern at both ends of the antenna. And the conductive layer 4a corresponding to the bridge pattern are joined to ensure electrical continuity between the conductive layers 3 and 4.

  This electrical continuity is performed by ultrasonically welding the conductive layer 3c corresponding to the pattern at both ends of the antenna and the conductive layer 4a corresponding to the bridge pattern in the thickness direction of the insulating base 2. As a result, the recessed portion 5 formed in one conductive layer 3 penetrates the insulating substrate 2 and is joined to the other conductive layer 4. Reference numeral 5a in the figure denotes a joint.

  As shown in FIGS. 5 and 6, the recessed portion 5 is formed to be a quadrangular pyramid so that the metal foil of the conductive layer 3 does not exceed its breaking elongation. As shown in FIG. 8, when the original length of the longest extending portion of the metal foil in the square pyramid is H and the length after the extension is h, the strain ε is ε = 100 × (h−H) / H (%). When the breaking elongation of the metal foil is δ, the recessed portion 5 is formed so that ε <δ. For example, the breaking elongation of a 35 μm electrolytic copper foil is about 5%, the breaking elongation of a rolled copper foil of 35 μm is about 21%, the breaking elongation of an aluminum alloy foil having a crystal grain size of 5 to 10 μm is about 14%, and the crystal grain size is 30. The breaking elongation of the aluminum alloy foil of ˜100 μm is about 7%. The slope of the quadrangular pyramid in the recessed portion 5 formed so as not to exceed such elongation at break becomes a gentle slope.

  It is possible to form only one concave portion 5 for each of the conductive layers 3c and 4a at both ends of the antenna and the bridge, but it is desirable that the plurality of concave portions 5 be adjacent to each other as shown in the drawing. It is formed. The reliability of electrical continuity is enhanced by providing a plurality. In the illustrated example, nine concave portions 5 are provided, but may be two to eight or ten or more. In the illustrated example, the recessed portions 5 are provided densely without a gap, but a slight gap may be provided.

  The recessed portion 5 is a quadrangular pyramid in the illustrated example, but may be a quadrangular pyramid instead of the quadrangular pyramid. Moreover, it can be set as various polygonal pyramids, such as a hexagonal pyramid as shown to FIG. 9 (A) and a triangular pyramid as shown to the same figure (B). 9 (A) and 9 (B), each portion with a grain represents one recessed portion 5. Of course, these polygonal pyramids can be changed to a polygonal frustum.

  Ultrasonic welding for obtaining the electrical continuity is performed as follows.

  As shown in FIG. 5, the raw material sheet 1 a is placed on the heated base 6, and the ultrasonic transducer 7 having the pressing portion 7 a having a quadrangular pyramid whose side surface is gently inclined is heated to start from above the base 6. A concave pyramid or a quadrangular pyramid having a gently inclined side surface on the conductive layer 3a at the pressing portion 7a while applying a lateral vibration ultrasonic wave to the ultrasonic vibrator 7 while being in contact with the conductive layer 3a of the material sheet 1a. The portion 5 is formed, and the recessed portion 5 is passed through the insulating substrate 2 and welded to the opposite conductive layer 4a. This welding is performed sequentially or simultaneously on both ends of the antenna.

  As shown in FIG. 5, the base 6 has a flat surface on which the material sheet 1a is placed. One conductive layer 4a of the material sheet 1a contacts this flat surface. As shown in FIGS. 5 and 7, the ultrasonic transducer 7 has a plurality of pressing portions 7 a on the surface facing the base 6. The pressing portion 7a is formed as a quadrangular pyramid protrusion that substantially matches the shape and size of the concave portion 5 described above. The inclination angle θ of the gently inclined side surface of the quadrangular pyramid is about 30 degrees with respect to the surface of the insulating base 2.

  The base 6 and the ultrasonic vibrator 7 are heated by a built-in electric heater, burner or the like. In FIG. 5, reference numerals 17 and 18 denote heating wires of an electric heater embedded in the base 6 and the ultrasonic vibrator 7, respectively. The heating means such as the heating wire may be provided only in the ultrasonic vibrator 7 or may be provided only in the base 6. The heating temperature is the glass transition point of the resin constituting the insulating base material 2, and is 80 ° C to 120 ° C when the resin is polyethylene terephthalate.

  When the conductive layers 3 and 4 are attached to the insulating base material 2 via the thermoplastic adhesive layer, a thermoplastic adhesive that melts at the same temperature is used.

  The ultrasonic vibrator 7 presses the conductive layer 3c, and the pressing force is 100N to 400N. Further, lateral vibration is applied to the ultrasonic transducer 7. The vibration direction of the lateral vibration is the extending direction of the plane of the insulating base material 2. For example, the transverse vibration has a frequency of about 40 kHz and an amplitude of about 19 μm. The application time of the transverse vibration is 0.1 second to 0.3 second. The insulating base material 2 is softened by heat transfer from the base 6 and the like, and the concave portion 5 of the conductive layer 3c penetrates the insulating base material 2 to the conductive layer 4a on the opposite side by the pressing of the pressing piece 7a, and the ultrasonic vibration is generated. The concave portion 5 of the upper conductive layer 3c is welded to the lower conductive layer 4a by the frictional heat generated by the application. Thereby, welding of the conductive layers 3 and 4 of the front and back is performed appropriately, without producing the fracture | rupture and a crack in the conductive layer 3 of an antenna or a bridge.

  In the first embodiment, two ultrasonic vibrators 7 shown in FIG. 7 are prepared, and a vibration element (not shown) such as a crystal vibration element is connected to each ultrasonic vibrator 7, so that two ultrasonic vibrations are provided. The children 7 are applied simultaneously or sequentially to the conductive layers 3c at both ends of the antenna. In this case, the direction of the transverse vibration of the ultrasonic transducer 7 may be either the A direction or the B direction in FIG. 6, or may be other directions. Further, in the illustrated example, the ultrasonic transducer 7 is applied from the antenna side, but the ultrasonic transducer 7 may be applied from the bridge side by applying the antenna side to the base 6.

  In the illustrated example, nine pressing portions 7a are provided adjacent to the ultrasonic transducer. However, the number of the pressing portions 7a can be increased or decreased as appropriate, and may be provided so as to leave a small gap. Moreover, although the press piece 7a is formed as a convex part of a quadrangular pyramid, it is formed in the shape corresponding to the various forms of the recessed part 5 mentioned above.

  As shown in FIG. 1, the conductive layer 3a of the antenna pattern in the material sheet 1a of the non-contact data carrier conductive member 1 includes a conductive layer 3d corresponding to the IC chip connection electrode. As shown in FIG. 3, the IC chip 10 is placed on the conductive layer 3d of the IC chip connection electrode and electrically connected.

  In the non-contact type data carrier conductive member 1 in which the IC chip 10 is mounted on the insulating base 2, the front and back surfaces of the insulating base 2 are covered with the label covering layers 11 and 12 as shown in FIG. 11. Thus, the label-like IC tag 13 is obtained.

  In FIG. 11, reference numeral 11 a indicates a protective layer made of paper, a resin film, and the like, and reference numeral 11 b indicates an adhesive layer for bonding the protective layer 11 a to the surface of the insulating substrate 2 from above the conductive layer 3. The protective layer 11a is for protecting the conductive layer 3 forming the antenna pattern and the like, and desired contents are displayed on the surface thereof by printing or the like.

  As described above, since the concave portion 5 having a shallow and gently inclined side surface is formed on the surface of the conductive layer 3, when the surface is covered with the coating layer 11, the surface is unlikely to be uneven. For this reason, the content which should be displayed on the said protective layer 11a can be printed appropriately.

  In FIG. 11, reference numeral 12a denotes an adhesive layer applied from above the conductive layer 4 that forms a bridge pattern or the like on the back surface of the insulating substrate 2, and reference numeral 12b denotes a release layer coated on the adhesive layer 12a. Each of the release layers made of pattern paper or the like is shown. After peeling off the release layer 12b, the IC tag 13 can be attached to the product or the like by pressing the pressure-sensitive adhesive layer 12a against the product or the like. Of course, instead of the pressure-sensitive adhesive layer 12a and the release layer 12b, the back surface of the insulating base material 2 may be covered with the protective layer 11a and the adhesive layer 11b in the same manner as the front side of the insulating base material 2.

  Further, as shown in FIG. 12, the non-contact data carrier conductive member 1 of FIG. 3 is formed into an IC card 16 by covering the front and back surfaces of the insulating base 2 with card covering layers 14 and 15.

  In FIG. 12, reference numerals 14a and 15a denote core material layers that are placed on the front and back surfaces of the insulating base material 2 from above the conductive layers 3 and 4, respectively, and reference numerals 14b and 15b denote the surfaces of the core material layers 14a and 15a, respectively. The covering surface layer is shown. The core material layers 14a and 15a include a resin sheet or the like that gives strength as a card, and the surface layers 14b and 15b include printing ink or the like for displaying desired contents.

  Also in the case of this IC card 16, since the concave portion 5 having a shallow and gently inclined side surface is formed on the surface of the conductive layer 3 as described above, it is difficult for the surface to be uneven when the surface is covered with the coating layer 14. . For this reason, the contents to be displayed on the surface layer 14b can be printed appropriately.

  When the IC tag 13 and the IC card 16 having the above configuration are used, various kinds of information are read or written in the electromagnetic field by the reader / writer (not shown) with respect to the IC chip 10.

<Embodiment 2>
In the second embodiment, ultrasonic welding of the conductive layers 3c and 4a at both ends of the antenna and the bridge is performed as shown in FIGS. 10A and 10B instead of the ultrasonic vibrator 7 shown in FIG. Two ultrasonic transducers 7b and 7c are used.

  As shown in FIGS. 10A and 10B, the two ultrasonic transducers 7b and 7c are integrated and vibrated simultaneously in the same direction by a common vibrating element (not shown). .

  In ultrasonic welding, the material sheet 1a is placed on a base having a larger area than the base shown in FIG. 5, and the two ultrasonic vibrators 7b and 7c are formed on the conductive layers 3c at both ends of the antenna. Each is applied at the same time. In this case, the direction of transverse vibration of the ultrasonic transducer 7 is set to the A direction in FIG. Thereby, the conductive layers 3c and 4a in the both ends of an antenna and a bridge are welded appropriately.

  In the illustrated example, the ultrasonic transducers 7b and 7c are applied from the antenna side. However, the ultrasonic transducers 7b and 7c may be applied from the bridge side by applying the antenna side to the base 6.

It is a surface view of the raw material sheet of the conductive member for non-contact type data carriers concerning the present invention. It is a reverse view of the raw material sheet shown in FIG. It is a surface view of the electroconductive member for non-contact type data carriers which mounted IC chip. 1A is a cross-sectional view taken along line IVA-IVA in FIG. 1, and FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. It is a conceptual diagram of the ultrasonic welding apparatus which welds the conductive layers of the front and back. It is an enlarged view of the principal part in FIG. It is an expansion perspective view of the ultrasonic transducer | vibrator in the ultrasonic welding apparatus shown in FIG. It is a schematic diagram of one recessed part, (A) is a top view, (B) is a BB line arrow directional view in figure (A). (A) (B) is a top view which shows the recessed part of another different shape. The other ultrasonic transducer | vibrator is shown, (A) is the front view, (B) is a bottom view. FIG. 4 is a partial cross-sectional view of a label-like IC tag including the non-contact data carrier conductive member shown in FIG. 3. FIG. 4 is a partial cross-sectional view of an IC card including the non-contact data carrier conductive member shown in FIG. 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Conductive member for non-contact-type data carriers 1a ... Material sheet 2 ... Insulating base material 3, 4 ... Conductive layer 5 ... Recessed part 6 ... Base 7 ... Ultrasonic vibrator 7a ... Pressing part 10 ... IC chip 11,12, 14, 15 ... coating layer

Claims (16)

  For non-contact type data carriers in which conductive layers made of metal foil are formed on the front and back surfaces of the insulating base material, and the recesses formed in one conductive layer penetrate the insulating base material and are welded to the other conductive layer The conductive member for a non-contact type data carrier, wherein the concave portion is formed in a polygonal pyramid or a polygonal frustum so that the metal foil does not exceed its breaking elongation.   2. The non-contact type data carrier conductive member according to claim 1, wherein a plurality of recesses are formed adjacent to each other.   The conductive member for a non-contact type data carrier according to claim 1 or 2, wherein one of the conductive layers on the front and back surfaces of the insulating substrate includes an antenna, the other includes a bridge, both ends of the antenna and the bridge A conductive member for a non-contact type data carrier, wherein the concave portion is formed between both end portions.   4. The non-contact type data carrier conductive member according to claim 3, wherein an IC chip is mounted on the antenna.   5. The non-contact type data carrier conductive member according to claim 1, wherein the front and back surfaces of the insulating base material are covered with a coating layer from above the conductive layer. Conductive member for data carrier.   6. The non-contact type data carrier conductive member according to claim 1, wherein the conductive layer is formed of a copper foil or a copper alloy foil. .   6. The conductive member for a non-contact type data carrier according to claim 1, wherein the conductive layer is formed of an aluminum foil or an aluminum alloy foil. .   Polygonal pyramids that place a sheet of material on which conductive layers made of metal foil are formed on the front and back surfaces of an insulating base material on a base, and that form recesses in the metal foil so as not to exceed the breaking elongation of the metal foil. Alternatively, an ultrasonic vibrator having a pressing portion of a polygonal frustum is brought into contact with the conductive layer of the material sheet from above the base, and the ultrasonic wave of the lateral vibration is applied to the ultrasonic vibrator, and the conductive layer is applied to the conductive layer by the pressing portion. A method of manufacturing a conductive member for a non-contact type data carrier, wherein a concave portion is formed, and the concave portion is passed through the insulating base material and welded to the opposite conductive layer.   An ultrasonic wave in which a material sheet having a conductive layer made of a metal foil formed on the front and back surfaces of an insulating base material is placed on a base, and a recess is formed in the metal foil so as not to exceed the breaking elongation of the metal foil. The vibrator is brought into contact with the conductive layer of the material sheet from above the base, and while applying the ultrasonic vibration of the transverse vibration to the ultrasonic vibrator, the concave portion is formed in the conductive layer, and the concave portion is formed on the insulating base material. And manufacturing the conductive member for a non-contact type data carrier, wherein the conductive member is welded to the opposite conductive layer.   10. The method for manufacturing a non-contact data carrier conductive member according to claim 8 or 9, wherein one or both of the base and the ultrasonic transducer are heated. Manufacturing method of member.   9. The method of manufacturing a non-contact data carrier conductive member according to claim 8, wherein a plurality of depressions are formed adjacent to each other by providing a plurality of pressing portions adjacent to the ultrasonic transducer. A method of manufacturing a conductive member for a non-contact type data carrier.   12. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 8, wherein one of the conductive layers on the front and back surfaces of the insulating base includes an antenna, and the other includes a bridge. The two ultrasonic transducers that are integrated with each other at both ends or the both ends of the bridge at the same time, and transverse vibration that vibrates in the direction perpendicular to the line connecting the two end portions to the two ultrasonic transducers. A method for producing a conductive member for a non-contact data carrier, wherein one conductive layer is passed through the insulating substrate and welded to the opposite conductive layer while applying the ultrasonic wave.   A base for placing a material sheet on which conductive layers made of metal foil are formed on the front and back surfaces of the insulating base, and a polygonal pyramid that forms a recess in the metal foil so as not to exceed the elongation at break An ultrasonic vibrator having a pressing portion of a polygonal frustum, bringing the ultrasonic vibrator into contact with the conductive layer of the material sheet from above the base, and applying ultrasonic waves of lateral vibration to the ultrasonic vibrator, An apparatus for producing a conductive member for a non-contact type data carrier, wherein the pressing portion forms the concave portion in the conductive layer, and the concave portion is welded to the opposite conductive layer through the insulating base material. .   14. The non-contact data carrier conductive member manufacturing apparatus according to claim 13, wherein a plurality of polygonal pyramids or polygonal frustum pressing portions are formed adjacent to the ultrasonic transducer. Manufacturing device for conductive member for type data carrier.   A base on which material sheets each having a conductive layer made of metal foil are formed on the front and back surfaces of an insulating substrate, and ultrasonic vibration that forms a recess in the metal foil so as not to exceed the breaking elongation of the metal foil. The ultrasonic vibrator is brought into contact with the conductive layer of the material sheet from above the base, and the concave portion is formed in the conductive layer while applying the ultrasonic vibration of the transverse vibration to the ultrasonic vibrator, An apparatus for manufacturing a conductive member for a non-contact type data carrier, wherein the concave portion is passed through the insulating base material and welded to the opposite conductive layer.   16. The apparatus for manufacturing a non-contact data carrier conductive member according to claim 13, wherein one of the conductive layers on the front and back surfaces of the insulating base includes an antenna and the other includes a bridge. It has two integrated ultrasonic transducers that are respectively applied to both ends of the antenna or the bridge in the sheet, and each ultrasonic transducer is applied to each of the both ends at the same time. On the other hand, while applying ultrasonic waves of transverse vibration that vibrates in a direction perpendicular to the line connecting the two end portions, one conductive layer was passed through the insulating base material and welded to the opposite conductive layer. An apparatus for manufacturing a conductive member for a non-contact type data carrier.

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