JP2007305837A - Multi-piece wiring board and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which has a defective/non-defective display unit capable of displaying defective/non-defective of each of wiring boards and easily recognizing it, and can be efficiently manufactured while suppressing an increase in an area and adverse effects on the products; and to provide a manufacturing method thereof. <P>SOLUTION: The multi-piece wiring substrate 10 has a plurality of wiring boards 1A-3A, 1B-3B and 1C-3C; and a defective/non-defective display unit M1 in which defective/non-defective display pads 1a-1c, 2a-2c and 3a-3c corresponding to the wiring boards 1A-3A, 1B-3B and 1C-3C are collectively formed, and its upper surface is covered with a solder resist film 7. If a wiring board is determined as defective in an inspection step, a solder resist film 7 on a defective/non-defective display pad corresponding to the wiring board is removed. The presence or absence solder resist film 7 on the defective/non-defective pads 1a-1c, 2a-2c and 3a-3c are each confirmed, and thus, the defective/non-defective of a wiring board can be recognized corresponding to each of the pads. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring board on which an electronic component is mounted by an electronic component mounting apparatus, and in particular, a multi-piece wiring board in which a plurality of wiring boards and a pass / fail display portion of each wiring board are formed on the same base material, And a manufacturing method thereof.

  In recent years, as a method for efficiently manufacturing a wiring board on which components such as circuit elements are mounted, a large number of wiring boards are arranged on a single base sheet and manufactured together, and finally the boundary line of the wiring board A so-called multi-cavity wiring board is known in which a large number of wiring boards are obtained at the same time. In such a multi-cavity wiring board, in the process of manufacturing a plurality of wiring boards at a time, one or a plurality of defective products among the plurality of wiring boards are included due to manufacturing variations and defects. May end up. If a multi-piece wiring board containing defective products is put in, for example, an automatic component mounting apparatus as it is and components are mounted, the components are also mounted on the defective wiring substrate, resulting in waste of components. For this reason, a method is used in which a defect display (bad mark) is attached to a wiring board that has been determined to be defective in the inspection process so that a non-defective product and a defective product can be identified in a subsequent process. By this method, for example, the presence or absence of a defective display can be recognized by an image recognition device, and a wiring board with a defective display can be skipped without performing a component mounting process, and a component can be mounted only on a good wiring board. In addition to the method of attaching a defect display to the wiring board that has been determined to be defective as a result of the inspection as described above, a pass / fail display section corresponding to the position of each wiring board of the multi-piece wiring board is prepared, A method for displaying pass / fail and position has been proposed.

  As a method for displaying the inspection result of each wiring board of the multi-cavity wiring board, for example, a method of forming a pass / fail display portion corresponding to each wiring board in an empty area of the multi-cavity wiring board is known. . This pass / fail display part is a perforation that can be easily broken out in the empty area of a multi-piece wiring board, and uses the pass / fail display part corresponding to the wiring board determined to be defective. Then, the defect is displayed by folding. The defective display part is irradiated with transmitted light, and the transmitted light is detected by a photodetector to determine the notched state and determine whether components can be mounted (see, for example, Patent Document 1).

  In addition, a pass / fail display piece corresponding to each wiring board is detachably provided in an empty area of the multi-piece wiring board, and the pass / fail display piece corresponding to the wiring board determined to be defective by inspection is removed. Thus, a method for discriminating good products from defective products is also known (see, for example, Patent Document 2).

JP 9-2104080 A JP 2000-183261 A

However, in the multi-piece wiring board described in Patent Document 1, when the pass / fail display portion is folded, stress is locally applied, causing the board to warp, the component mounting portion cracking or cutting, There was a possibility that the wiring board would be soiled by scraps of the base material of the part.
Further, in the multi-cavity wiring board described in Patent Documents 1 and 2, it is disadvantageous for miniaturization because a space for disposing the pass / fail display part and the pass / fail display piece that can be folded is relatively wide. In addition, there is a problem that it takes time to recognize the state of the defective display unit by an image recognition device or a photodetector.
The present invention has been made to solve the above-mentioned problems, and its purpose is to display the quality of each wiring board while suppressing the increase in area and adverse effects on the product, and easily An object of the present invention is to provide a multi-piece wiring board that has a good / bad display section that can be identified and can be efficiently manufactured, and a manufacturing method thereof.

  In order to solve the above-described problem, the present invention is a multi-piece wiring board having a plurality of wiring boards and a pass / fail display part for displaying pass / fail judgment results of the wiring boards, and the pass / fail display part includes: The same number of pass / fail display pads as the wiring substrate formed on a part of the multi-cavity wiring substrate are formed, and at least a part of the pass / fail display pad is formed on the pass / fail display pad. It is a summary.

  According to this configuration, by removing at least a part of the film on the pass / fail display pad, it is possible to perform pass / fail indication of the corresponding wiring board. Since the pass / fail display pads corresponding to each wiring board are formed collectively on a part of the wiring board, a plurality of wiring boards can be confirmed to be good or defective by checking one limited area. Can be efficiently identified in a short time. In addition, since the pass / fail indication of each wiring board can be performed in a smaller space than the pass / fail display section shown in Patent Documents 1 and 2 described above, it is advantageous for downsizing of the multi-piece wiring board. .

  The present invention is a multi-cavity wiring board having a plurality of wiring boards and a pass / fail display section for displaying a pass / fail judgment result of the wiring board, and the pass / fail display section includes a part of the multi-cavity wiring board. A pass / fail display pad having the same number of electrical conductivity as the wiring board formed collectively, and a common pad electrically connected to each of the pass / fail display pads, and at least on the pass / fail display pad, It is good also as a structure which has the film in which one part was formed so that removal was possible.

  According to this configuration, it is possible to electrically identify whether each wiring board is a non-defective product or a defective product by confirming continuity between the common pad and the pass / fail display pad. Since each pass / fail display pad is formed collectively on a part of the wiring substrate, for example, a probe head in which probe needles are arranged corresponding to the positions of the pass / fail display pads and the common pad is used. Therefore, it is possible to collectively detect that each wiring board is a good product or a defective product.

In the method of manufacturing a multi-cavity wiring board according to the present invention, the same number of pass / fail display pads as a wiring board formed in a part of a region different from the region where the wiring substrate is formed are formed. A method of manufacturing a multi-cavity wiring board, in which a film is formed on the upper surfaces of a plurality of pass / fail display pads, and an inspection for determining whether each of the plurality of wiring boards is a non-defective product or a defective product. The process, the pass / fail display process for displaying that each of the plurality of wiring boards is non-defective or defective by causing a difference in the state of the coating, and each of the plurality of wiring boards is non-defective or defective. And a pass / fail detection step for detecting the pass / fail by the difference in the state of the film on the pass / fail display pad.
The main purpose of the present invention is to cause a difference in the state of the film by removing at least a part of the film in the pass / fail display step.

According to this configuration, in a series of manufacturing processes such as base sheet manufacturing of a multi-cavity wiring board to mounting electronic components, various inspections are performed to determine that each wiring board is a non-defective product or a defective product. The determination result can be displayed by making a difference in the state of the film on the pass / fail display pad. Then, by detecting the difference in the state of the film on the pass / fail display pad, it is possible to perform processing such as mounting electronic components only on the non-defective wiring board.
Here, the difference in the film for displaying or identifying the quality of each wiring board is caused by removing at least a part of the film. For example, if all the coating on the pass / fail display pad corresponding to the wiring board determined to be defective is removed to expose the pass / fail display pad, the wiring corresponding to the pass / fail display pad without the coating on the upper surface The substrate can be easily identified as defective. In addition, if not all of the film on the pass / fail display pad, but removing to a predetermined depth so that the color of the surface of the pass / fail display pad is visible, the pass / fail display pad on which the film is not removed Thus, it is possible to detect and identify the difference in the hues of, for example, an image processing apparatus or the like. As a result, electronic components and the like can be selectively mounted only on non-defective wiring boards, so that electronic components and the like are not wasted, and the manufacturing cost can be reduced.
Furthermore, since each of the pass / fail display pads is formed on a part of the wiring board, it is possible to identify the pass / fail of each distribution board in a short time by checking one limited area. Therefore, an efficient method for manufacturing a multi-piece wiring board can be provided.

  In the method for manufacturing a multi-cavity wiring board according to the present invention, the difference in the state of the film is caused by removing at least a part of the film by irradiating the laser beam.

  According to this configuration, since the coating is removed while being dissolved and vaporized by heating and decomposition with laser light, it is possible to perform pass / fail indication with little mechanical damage to the multi-piece wiring board. As a result, as in the method disclosed in Patent Document 1 described above, it is possible to avoid the occurrence of occurrence of cracks or cutting of the mounting portion of the electronic component, as a result of stress being applied to the multi-piece wiring substrate and the substrate being warped. . Also, if a laser beam irradiation apparatus is prepared, it is possible to display the quality of each wiring board while minimizing an increase in the number of processes.

  This invention is good also as a structure which detects the difference in the state of the said film on the said quality display pad using an optical method at a quality detection process.

  For a method for optically detecting the difference in the state of the film on the pass / fail display pad, for example, the presence or absence of the film, the image of the pass / fail display pad with or without the film on the upper surface by, for example, an image processing apparatus. There are a method of identifying the feature by increasing the number of features, a method of irradiating light to the pass / fail display pad portion, and a method of detecting a difference in reflected light that changes depending on the presence or absence of a film by a photodetector. By these methods, it is possible to identify whether each wiring board is a non-defective product or a defective product while suppressing an increase in processes and causing little damage to the product.

  The present invention includes a plurality of wiring boards, a pass / fail display pad having the same number of electrical conductivity as the wiring board formed in a part of a region different from the area where the wiring boards are formed, and the plurality of pass / fail displays. A method of manufacturing a multi-cavity wiring board having a common pad electrically connected to each of the pads, a film forming step of forming a film on the upper surfaces of a plurality of pass / fail display pads, and the plurality of wiring boards An inspection process for determining whether each of the wiring boards is a non-defective product or a defective product, and removing the coating so that at least a part of the pass / fail display pad is exposed to indicate that each of the plurality of wiring boards is a non-defective product or a defective product. Detecting the electrical characteristics between the common pad and each of the pass / fail display pads, and whether or not each of the plurality of wiring boards is non-defective or defective. Quality detection step and may be configured to have a identifies by.

  According to this configuration, it is possible to electrically identify whether each wiring board is a non-defective product or a defective product by confirming conduction between the conductive common pad and the pass / fail display pad. In addition, since each pass / fail display pad is formed in a part of a multi-piece wiring board, for example, a probe head in which probe needles are arranged corresponding to the positions of the pass / fail display pads and the common pad. If it is used, it can be detected in a short time collectively that each wiring board is a good product or a defective product.

(First embodiment)
Hereinafter, a first embodiment of a multi-piece wiring board according to the present invention will be described with reference to the drawings.

  FIG. 1A is a plan view of a multi-piece wiring board, and FIG. 1B is a cross-sectional view taken along the line aa in FIG. FIG. 1 shows a state in which no electronic component or the like is mounted.

  A multi-piece wiring board 10 shown in FIGS. 1A and 1B has a plurality of wiring boards 1A to 3A and 1B to 3B arranged vertically and horizontally on a base sheet 1 made of an insulating material such as glass epoxy resin. , 1C to 3C, and pass / fail display portions M1 having the same number of pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c as the wiring boards 1A to 3A, 1B to 3B, and 1C to 3C are formed.

In the wiring board 1A, a plurality of electrode terminals 8a to 8e and connection wirings 9a to 9e for connecting a part of each of the electrode terminals 8a to 8e are formed on the base sheet 1 with a conductive material such as copper. Yes. Each of the plurality of electrode terminals 8a to 8e is a plurality of counter electrodes, and by mounting a surface mount type electronic component such as a resistor or a transistor between the counter electrodes and electrically joining them with solder or the like, One circuit is configured. In addition, an insulating material such as an epoxy resin is formed on the base sheet 1 on which the electrode terminals 8a to 8e and the connection wirings 9a to 9e are formed, with the electrode terminals 8a to 8e and the mounting position of the electronic component opened. A solder resist film 7 is formed as a coating made of
In the base material sheet 1, wiring boards 2A, 3A, 1B to 3B, and 1C to 3C having the same configuration as the wiring board 1A are arranged vertically and horizontally by perforations (not shown) formed at respective boundary lines. It can be separated.

  The pass / fail display portion M1 is the same as the electrode terminals 8a to 8e and the connection wires 9a to 9e in a region different from the region where the wiring boards 1A to 3A, 1B to 3B, and 1C to 3C are formed on the base sheet 1. A plurality of pass / fail display pads 1a to 1c, 2a to 2c, 3a to 3c formed of a conductive material such as copper, one common pad 5, and one all non-defective display pad 6 are formed. The pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c are formed in the same number corresponding to the wiring boards 1A to 3A, 1B to 3B, and 1C to 3C, respectively. In FIG. 1A, pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c are formed in the same arrangement as the corresponding wiring boards 1A to 3A, 1B to 3B, and 1C to 3C. However, the arrangement is not limited to this, and the arrangement may be different as long as the number is the same.

  The pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c are electrically connected in parallel by the connection wiring 4, and are electrically connected to one end of the common pad 5 by the connection wiring 4 drawn from one end thereof. They are connected in series. Further, all non-defective display pads 6 are electrically connected in series to the connection wiring 4 drawn from the other end of the common pad 5. In addition, on the surfaces of pass / fail display pads 1a to 1c, 2a to 2c, 3a to 3c, common pad 5 and all non-defective display pads 6, a metal having good conductivity and corrosion resistance such as gold (Au) is used. It is desirable to deposit by plating or the like. Accordingly, it is possible to effectively prevent the surface of each pad from being oxidized and corroded, and it is possible to strengthen the solder bonding between the electrode terminals 8a to 8e and each electrode of the electronic component. In addition, in the method of determining the electrical quality of a wiring board using a quality display pad, which will be described later, the contact resistance with an electrical external contact such as a probe needle can be reduced, so the quality is determined more accurately. There is an effect that can be done.

A solder resist film 7 made of an insulating material is covered on the pass / fail display portion M1 so as to cover the pass / fail display pads 1a to 1c, 2a to 2c, 3a to 3c and all the pass / fail display pads 6 by screen printing or the like. Is formed. An opening 8 is formed in the solder resist film 7 on the common pad 5 so that the common pad 5 is exposed.
Each of the wiring boards 1A to 1C, 2A to 2C, 3A to 3C having the above-described configuration and the pass / fail display portion M1 are collectively formed using a technique such as photolithography or plating.

(Second Embodiment)
Next, in the process of manufacturing the multi-cavity wiring board 10 of the first embodiment, a method of performing various inspections in each manufacturing process and displaying the pass / fail judgment result of each wiring board, and after the pass / fail display A method for identifying the quality of each wiring board of the multi-cavity wiring board 10 and flowing in the process will be described with reference to the drawings.
FIG. 2 is a flowchart for explaining a method of displaying the quality of the wiring board in the manufacturing process of the multi-cavity wiring board 10. FIGS. 3A and 3B show an example of the multi-piece wiring board 10 in a state where the quality is displayed. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along the line bb in FIG. It is. 4A and 4B show the multi-piece wiring board 10 in a state where the quality is displayed when all the wiring boards are determined to be non-defective, FIG. 4A is a plan view, and FIG. 4B is a plan view. It is a cc line sectional view of). FIG. 5 is a flow chart for explaining a method of identifying and flowing the quality of each wiring board of the multi-piece wiring board 10 displayed as good or bad in a subsequent process. FIG. 6 is an explanatory diagram schematically showing an open / short inspection machine used in the method for identifying the quality of each wiring board according to the present embodiment and a state in which the quality of each wiring board is judged using the open / short inspection machine. is there.

(Wiring board pass / fail indication method)
As shown in FIG. 2, first, in step S <b> 1, various inspections are performed on the quality of the wiring boards 1 </ b> A to 3 </ b> A, 1 </ b> B to 3 </ b> B, and 1 </ b> C to 3 </ b> C of the multi-piece wiring board 10. For inspection, visual inspection using a visual inspection, a microscope, or an automatic visual inspection device that optically determines visual quality, and visual inspection to determine the quality of the visual quality, and an electrical characteristic inspection machine to obtain desired electrical characteristics. For example, there is an electrical characteristic test to determine whether or not
Then, it is confirmed whether or not there is a defective wiring board whose quality such as appearance and electrical characteristics is out of a predetermined allowable range (step S2).

  If there is a defective wiring board whose quality is out of the predetermined range (YES in step S2), the solder resist film 7 on the pass / fail display pad corresponding to the defective wiring board is removed. Then, at least a part of the surface of the pass / fail display pad is exposed (step S3). FIG. 3 exemplifies the multi-piece wiring board 10 in which the wiring boards 3A, 1B, and 2C are determined to be defective, and the solder resist film 7 on the pass / fail display pads 3a, 1b, and 2c corresponding to the respective multi-wiring boards is removed. Has been.

  When the quality of all the wiring boards 1A to 1C, 2A to 2C, and 3A to 3C of the multi-piece wiring board 10 is a non-defective product within a predetermined range (NO in step S2), FIG. As in the multi-piece wiring substrate 10 shown in b), the solder resist film 7 on the all-good display pad 6 is removed to expose at least a part of the surface of the all-good display pad 6 (step S4). As described above, when all the wiring boards 1A to 3A, 1B to 3B, and 1C to 3C are determined to be non-defective products, the inspection process is ended here.

In the present embodiment, the pass / fail display pads 1a to 1c, 2a to 2c, 3a to 3c and the solder resist film 7 on the upper surfaces of all non-defective product display pads 6 are removed by laser processing. A laser beam of a predetermined spot diameter is irradiated from a laser irradiation device toward the all-good display pad 6 or the solder resist film 7 on the pass / fail display pad corresponding to the wiring board determined to be defective. A part of the solder resist film 7 is removed by decomposition. As the type of laser, a CO ₂ laser, an Nd: YAG laser or the like generally used for drilling an organic material such as the solder resist film 7 can be applied. By adjusting the output amount of the laser beam, Only the photoresist film 7 on the all non-defective display pad or the pass / fail display pad can be selectively removed. It is not necessary to remove the photoresist film 7 until the entire surface of the pass / fail display pad is exposed, as long as a hole of a size that can reliably contact the tip of the probe needle used in the pass / fail detection method described later is formed. Good.

  FIGS. 3A and 3B show an example of the multi-piece wiring substrate 10 from which the photoresist film 7 on the pass / fail display pad corresponding to the wiring substrate determined to be defective is removed by the above method. The multi-cavity wiring board 10 of FIG. 3 shows an example in which the wiring boards 3A, 1B, and 2C are determined to be defective in the previous process inspection. That is, the solder resist film 7 on the pass / fail display pads 3a, 1b and 2c corresponding to the wiring boards 3A, 1B and 2C is removed, and the pass / fail display pad 1b shown as a representative example in FIG. As described above, the surfaces of the pass / fail display pads 3a and 2c are also exposed.

  In the present embodiment, the method of removing the solder resist film 7 on the pass / fail display pad corresponding to the wiring board determined to be defective has been described. However, the present invention is not limited to this, and it corresponds to the wiring board determined to be non-defective. The solder resist film 7 on the pass / fail display pad may be removed. For example, this method is effective when selecting a non-defective wiring board from a flow lot of a multi-piece wiring board in which defective wiring boards are frequently generated due to defects in the manufacturing process.

(Wiring board pass / fail identification method)
Next, a description will be given of a method in which the multi-piece wiring board 10 on which the quality of each wiring board is indicated by the above-described method is identified and flowed in a subsequent process.
FIG. 5 shows, for example, whether or not each wiring board is good and bad when mounting electronic components on a multi-piece wiring board using an automatic mounting apparatus such as an automatic component mounting apparatus (chip mounter). Shows the flow of implementation. Here, as an example, a method for identifying the quality of each wiring board of the multi-piece wiring board 10 shown in FIG. 3 will be described.

  First, as shown in step S11, the multi-piece wiring board 10 is inserted into the base material sheet supply apparatus of the automatic mounting apparatus. The multi-cavity wiring board 10 inserted in the base sheet supply apparatus moves through the base sheet supply path and is sent to the mounting processing area.

The multi-piece wiring board 10 sent to the mounting processing area is subjected to an image recognition device equipped with a CCD camera provided in the automatic mounting apparatus, and the correctness of the board direction and the position of the board are within the allowable range of the mounting position. Whether or not it exists is detected. For example, a reference position mark (not shown) is formed at a predetermined diagonal position of the multi-piece wiring board 10, and an image indicating whether or not the position and shape of the reference position mark is a predetermined position and shape. Detection is performed by the recognition device (step S12).
If it is determined that the position and shape of the multi-cavity wiring board 10 are not normal (NO in step S13), a flow for not performing the mounting process is selected, and the multi-cavity wiring board 10 is the base of the automatic mounting apparatus. The sheet is discharged to the material sheet discharging apparatus side (step S18).

  If it is determined that the multi-piece wiring board 10 is in a predetermined position (YES in step S13), the process proceeds to the next step S14, and the pass / fail display unit M1 is used to check whether the multi-piece wiring board 10 is defective. The presence and position of a good wiring board are detected. In this embodiment, the presence / absence of a defective wiring board and its position are electrically detected using an open / short inspection machine 50 shown in FIG.

The open / short inspection machine 50 includes a power source, a voltmeter for measuring the power of the power source, an ammeter, a plurality of probe needles P1a to P1c, P2a to P2c, P3a to P3c, P5, And a probe head P on which P6 is disposed. The probe needles P1a to P1c, P2a to P2c, P3a to P3c, P5, and P6 are the pass / fail display pads 1a to 1c, 2a to 2c, 3a to 3c of the pass / fail display unit M1, the common pad 5, and all non-defective products display. It is arranged corresponding to each position with the pad 6. The tip of each probe needle has a spring property within a predetermined movable range by a spring mechanism provided inside.
The probe head P includes a lifting device (not shown) and is disposed in the mounting area of the automatic mounting device. When the probe head P is lowered by the lifting device, the probe needles P1a to P1c, P2a to P2c, P3a to P3c, P5, P6 A large number of tips are brought into contact with the surface of the wiring board 10. At this time, the tips of the probe needles P1a to P1c, P2a to P2c, P3a to P3c, P5, and P6 have a constant pressure on the surface side of the multi-piece wiring substrate 10 due to the vertical spring property of each probe needle. Touching while adding.
A contact point for connecting to the probe needles P1a to P1c, P2a to P2c, and P3a to P3c corresponding to each pass / fail display pad is connected to the other end of the measuring unit connected to the probe needle P5 corresponding to the common pad 5. A switch SW1 capable of switching connection is provided at either the CON10 or the contact CON6 connected to the probe needle P6 side corresponding to the all non-defective display pad 6. Further, the contact CON10 is connected to the contacts CON1a to CON1c, CON2a to CON2c, and CON3a to CON3c connected to the probe needles P1a to P1c, P2a to P2c, and P3a to P3c corresponding to the pass / fail display pads, respectively. A possible switch SW2 is provided.

When it is determined in step S13 that the multi-piece wiring board 10 has been arranged at a predetermined mounting position, the probe head P is lowered by the lifting device, and the probe needles P1a to P1c, P2a to P2c, P3a to P3c, A large number of tips of P5 and P6 are taken and brought into contact with the surface of the wiring board 10. In the case of the multi-piece wiring board 10 in which the pass / fail indication is shown in FIG. 3, the pass / fail display pads 1b, 2c, 3a from which the upper solder resist film 7 has been removed as shown in FIG. The probe needles P1b, P2c, P3a and P5 are in contact with the surface of the common pad 5, respectively. On the other hand, the upper and lower parts of the pass / fail display pads 1a, 1c, 2a, 2b, 3b, 3c and the non-defective product display pads 6 are covered with the solder resist film 7, so that the probe needles P1a, P1c, P2a, P2b, P3b, and P3c are in contact with the surface of the solder resist film 7. In this state, the measuring unit is connected to the contact CON10 side by the switch SW1 of the open / short inspection machine 50, and any one of the contacts CON1a to CON1c, CON2a to CON2c, CON3a to CON3c is connected by the switch SW2. FIG. 6 illustrates a state in which the measurement unit is connected to the CON 3c drawn from the probe needle P3c corresponding to the pass / fail display pad 3c. As a result, a closed circuit of the common pad 5, the measurement unit, and any one pass / fail display pad is formed. A predetermined voltage is applied to the closed circuit from the power supply of the measurement unit, and between the probe needle P5 corresponding to the common pad 5 and the probe needle corresponding to any pass / fail display pad selected by the switch SW2. Measure the value of the current flowing through the ampere meter. When the solder resist film 7 on the pass / fail display pad is removed, the corresponding probe needle is in contact with the pass / fail display pad, so that a current value within a predetermined range is measured by an ammeter. On the other hand, when the pass / fail display pad is covered with the solder resist film 7, the pass / fail display pad and the probe needle corresponding to the pass / fail display pad are blocked by the solder resist film 7 and are not in contact with each other. The measured current value becomes approximately zero. As a result, a wiring board corresponding to a pass / fail display pad for which a predetermined current value is measured by an ammeter can be determined as a defective product, and a wiring board corresponding to a pass / fail display pad having a measured current value of substantially zero is determined as a non-defective product. can do.
In this way, the determination result of the non-defective product or defective product of each wiring board in the multi-piece wiring board is recorded in a memory (not shown) of the automatic mounting apparatus, and each wiring board in the sequence of the automatic mounting apparatus in the subsequent steps. This is used to determine whether or not to perform mounting processing.

  As a result of detection in step S14, if it is determined that there is a defective wiring board (YES in step S15), if there is no non-defective wiring board in the multi-piece wiring board (NO in step S16), the mounting is performed. It is discharged from the automatic mounting apparatus without performing it (step 18). On the other hand, a multi-piece wiring board including a defective wiring board and a non-defective wiring board (YES in step S16) proceeds to step S17 to perform mounting processing.

As a result of detecting the defective wiring board by the method in step S14, if it is determined that there is no defective wiring board (NO in step S15), that is, it is determined that all the wiring boards are non-defective. In such a case, all good product display detection in step S19 is performed. The all-goods display detection is performed in the same manner as the defective wiring board detection in step 14 above, and the measurement unit is pulled out from the probe needle P6 corresponding to the all-good display pad 6 by the switch SW1 of the open / short inspection machine 50. Connected to the contact CON6. In this state, the current value between the probe needle P6 and the probe needle P5 is measured, and if the predetermined current value is measured, the solder resist 7 on the non-defective product display pad 6 is removed, that is, Since it can be determined that all non-defective products are displayed in the previous process inspection, the process proceeds to step S17 (YES in step S20).
On the other hand, if the measured value of the ammeter is substantially zero, it is determined that the solder resist 7 on the non-defective product display pad 6 has not been removed, and the results of various inspections in the previous process and the steps It is determined that there is an inconsistency in the result of determining that all the wiring boards are non-defective when the defective wiring board is detected in S14. For example, when a defective wiring board is detected, the probe head P and the multi-cavity wiring board 10 may be misaligned due to some trouble, and each pass / fail display pad may not be in contact with the corresponding probe needle. It is done. Therefore, the process returns to step S14 to detect the defective wiring board again (NO in step S20).

  The multi-cavity wiring board used in the flow of FIG. 5 must have undergone the flow of FIG. 2, but a multi-cavity wiring board that has not undergone the flow of FIG. If used, the flow of NO in step S15, NO in step S20, and again from step S14 is repeated many times. In the flow of FIG. 2, the same flow is repeated even when the quality of the wiring board is not properly displayed due to a defect in the means for removing the resist (for example, failure of the laser processing apparatus). In addition, even when the resist film is normally removed (indication of whether the wiring board is good or bad) in FIG. 2, even if the tip of the probe needle in FIG. There is a risk of repetition. Assuming such a case, for example, if the flow of NO in step S15 and step S20 and step S14 again is repeated a plurality of times, an alarm is issued to alert the operator, A flow may be added in which the multi-piece wiring board is advanced to step S18 and discharged without mounting electronic components.

  In step S17, a predetermined mounting process is performed by an automatic mounting apparatus such as electronic component mounting. At this time, electronic components are not mounted on the defective wiring board due to the presence and position information of the defective wiring board in the multi-cavity wiring board stored in the memory of the automatic mounting apparatus in step S14. The next non-defective wiring board is skipped and mounted. In this way, the multi-piece wiring board 10 in which the mounting process is performed only on the non-defective wiring board is discharged from the automatic mounting apparatus (step S18), and the series of mounting processes is completed.

  The effects of the above embodiment will be described below.

(1) In the first embodiment, the solder resist film 7 on the pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c formed on the pass / fail display portion M1 of the multi-piece wiring board 10 is removed. By doing so, it was set as the structure which displays the quality of wiring board 1A-3A, 1B-3B, 1C-3C corresponding to this. Then, by measuring the value of current flowing between the common pad 5 and each of the pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c using the probe head P, a defective wiring board is obtained. It was set as the structure which detects electrically presence and its position.
According to this configuration, the quality of each wiring board can be recognized by the quality display unit M1 formed collectively at a predetermined position of the multi-piece wiring board 10, so that the quality of the wiring board can be displayed with a small area. This can contribute to the downsizing of the multi-piece wiring board.
Moreover, since the pass / fail display pads 1a to 1c, 2a to 2c, and 3a to 3c are collectively formed at one place, the pass / fail of each wiring board can be detected by the probe head P in a short time. it can.

(2) In the above embodiment, the pass / fail display pad for displaying the presence and position of the defective wiring board is formed of the same conductive material as the electrode terminal and the connection wiring of the wiring board. The solder resist film 7 of the wiring board is commonly used for the film covering removably.
As a result, the pass / fail display pad can be formed simultaneously with the electrode terminal of the wiring board and the connection wiring by photolithography or the like, and the solder resist film 7 is also formed by applying simultaneously with the solder resist film 7 on the wiring board. can do. Therefore, it is possible to form the pass / fail display portion M1 for displaying pass / fail of each wiring board without increasing the number of steps.

(3) In the above embodiment, the solder resist film 7 on the pass / fail display pad corresponding to the wiring substrate determined to be defective is removed by laser processing.
According to this configuration, since the solder resist film 7 is removed while being dissolved and vaporized by heating and decomposition with laser light, generation of a residue of the removed solder resist film can be suppressed. Thereby, it is possible to prevent erroneous detection due to poor contact of the probe needle due to the solder resist residue on the pass / fail display pad, and contamination of the multi-piece wiring board 10.
Further, as in the method disclosed in Patent Document 1 described above, the multi-cavity wiring board is stressed as in the method of folding the pass / fail display portion provided in the empty area of the multi-cavity wiring board. Will not warp or crack or cut the mounting part of the electronic component.
Furthermore, the solder resist film 7 is masked and a part of the solder resist film 7 is removed without increasing the number of steps as in the method of removing the solder resist film with a resist stripping solution to display the quality of the wiring board. Can do.

(4) In the above-described embodiment, the configuration is such that the presence and position of defective wiring boards of the multi-cavity wiring board 10 are electrically detected using the open / short inspection machine 50. In addition, it is possible to perform mounting processing such as mounting electronic components only on non-defective wiring boards.
According to this configuration, as in the case of using a method for optically identifying the state of the pass / fail display mark by an image recognition device or the like, the setting of the image recognition range is changed when the substrate is changed to a different shade. There is no need and false detection is unlikely to occur. Therefore, it is possible to detect a defect in a wiring board having high detection accuracy regardless of the material of the multi-piece wiring board.
In addition, since electronic components can be selectively mounted only on non-defective wiring boards, waste of electronic components and the like can be eliminated, and an efficient multi-piece wiring board manufacturing method can be provided.

  The present invention is not limited to the above-described embodiments, and the following modifications can also be implemented.

(Modification 1)
In the multi-piece wiring board 10 of the first and second embodiments, the pass / fail display pads 1 a to 1 c, 2 a to 2 c, 3 a to 3 c and the common pad 5 are electrically connected by the connection wiring 4. Then, the quality of each of the plurality of wiring boards 1A to 3A, 1B to 3B, and 1C to 3C is recognized based on the presence / absence of conduction between each of the quality display pads 1a to 1c, 2a to 2c, 3a to 3c and the common pad 5. Although it was set as the structure, it is not restricted to this.
A pass / fail display pad corresponding to each wiring board is formed independently, and optically recognizes whether there is a solder resist film on the pass / fail display pad, in other words, whether the pass / fail display pad is exposed. It is good also as a structure which identifies the quality of each wiring board by this.

  FIG. 7 illustrates a multi-cavity wiring board that can recognize the quality of each of the plurality of wiring boards by an optical method. FIG. 7A is a plan view of the multi-cavity wiring board. FIG. 7B is a sectional view taken along line dd in FIG. In addition, this modification is characterized in that a plurality of pass / fail display pads are formed independently without being electrically connected, and the other configurations are the same as those of the above-described embodiments, and thus are common. Parts are denoted by the same reference numerals and description thereof is omitted.

  7A and 7B, a multi-cavity wiring board 40 includes a plurality of wiring boards 31A to 33A, 31B to 33B, and 31C to 33C arranged in a vertical and horizontal manner on a base sheet 31, and wirings thereof. A pass / fail display portion M2 having pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c as many as the substrates 31A to 33A, 31B to 33B, and 31C to 33C is formed.

The plurality of pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c of the pass / fail display unit M2 are formed of the same conductive material such as copper as the wiring boards 31A to 33A, 31B to 33B, and 31C to 33C. . In addition, the pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c have a circular shape in the present modification, are formed at predetermined intervals on the base sheet 31, and the surface is formed by electrolytic plating or the like. A gold (Au) plating film (not shown) is extremely thinly applied. This gold plating film is simultaneously formed on the electrode terminals and connection wirings of the wiring boards 31A to 33A, 31B to 33B, and 31C to 33C. Note that the type of the plating film is not limited to gold (Au), and at least has no adverse effect on the bonding of the electrode terminal and the electronic component by solder, and in the image recognition of the pass / fail display pad by the image recognition device described later, the solder Any color that can be distinguished from the color of the resist film 37 may be used.
These pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c are formed in the same number as the wiring boards 31A to 33A, 31B to 33B, and 31C to 33C, and are associated with each other.
On the sheet base material 31 on which the pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c are formed, for example, a solder resist film 37 colored green is provided for each pass / fail display pad 31a to 31c, 32a to 32c. 32c, 33a to 33c are formed to cover.

  Next, in various manufacturing processes for manufacturing the multi-piece wiring board 40 described above, various inspections are performed to display the quality determination result of each wiring board, and the multi-piece wiring board 40 displayed as good or bad is displayed. A description will be given of a method of identifying and flowing the quality of each wiring board of the multi-cavity wiring board 40 when flowing in the process.

A method for displaying whether each of the wiring boards 31A to 33A, 31B to 33B, 31C to 33C of the multi-cavity wiring board 40 is a non-defective product or a defective product is the same as that of the first and second embodiments. A method similar to the pass / fail display method of the multi-piece wiring board 10 is used.
First, various inspections are performed on the quality of the appearance and electrical characteristics of the wiring boards 31A to 33A, 31B to 33B, 31C to 33C of the multi-cavity wiring board 40, and the quality of the appearance and electrical characteristics is within a predetermined allowable range. It is determined whether there is a defective wiring board that is out of the range.

  When there is a defective wiring board whose quality is out of the predetermined range, the solder resist film 37 on the pass / fail display pad corresponding to the defective wiring board is irradiated with laser light having a predetermined output amount. It is removed by irradiation to expose at least a part of the surface of the pass / fail display pad. The removal of the photoresist film 37 does not have to be performed until the entire surface of the pass / fail display pad is exposed, as long as it can be recognized and recognized from the surface of the photoresist 37 by an image recognition device or the like by a pass / fail detection method described later. . For example, when the image of the pass / fail display unit M2 is binarized and recognized by the image recognition device, if it can be recognized with distinction from the surface of the photoresist 37, a part of the photo resist 37 film remains on the pass / fail display pad. May be.

Next, a description will be given of a method in which the multi-piece wiring board 40 on which the quality of each wiring board is displayed by the above-described method is identified and flowed in a subsequent process.
In a subsequent process, for the method of identifying the quality of each wiring board of the multi-piece wiring board 40 of the present embodiment, for example, an image recognition apparatus having a CCD camera provided in an automatic mounting apparatus such as an automatic component mounting apparatus is used. .

After confirming the correctness of the set direction of the multi-piece wiring board 40 set at the mounting processing position of the automatic mounting apparatus, each of the wiring boards 31A to 33A, 31B to 33B, 31C to 33C is acceptable or Whether the product is defective or not is identified. For example, the image recognition device used for pass / fail identification is set so that the brightness of the image input from the CCD camera is increased and binarized for recognition. Then, the pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c are recognized as binarized images by the CCD camera of the image recognition apparatus. In this modification, the pass / fail display pad corresponding to the wiring board determined to be non-defective in the previous inspection step is covered with a solder resist film 37 having a color such as green, and is thus recognized as a dark image. Is done. In addition, since the pass / fail display pad corresponding to the wiring board determined to be defective is at least part of the solder resist film 37 is removed, the color of the gold plating film applied to the surface of the pass / fail display pad It is recognized as a bright image. In this way, the pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c are identified by the image information binarized brightly and darkly by the image recognition device, respectively, and whether the corresponding wiring board is a non-defective product, Or it is recognized whether it is inferior goods.
By the method described above, the determination results as to whether each of the wiring boards 31A to 33A, 31B to 33B, 31C to 33C in the multi-cavity wiring board 40 is a non-defective product or a defective product are recorded in the memory of the automatic mounting apparatus. In the subsequent manufacturing process, it is used to determine whether or not mounting processing is performed by an automatic mounting apparatus.

  The multi-piece wiring board 40 that has recognized the quality of each wiring board is subjected to predetermined mounting processing by an automatic mounting apparatus such as electronic component mounting. At this time, based on the information on the presence and position of the defective wiring board in the multi-cavity wiring board 40 stored in the memory of the automatic mounting apparatus, the defective wiring board is not mounted with electronic components or the like. Skipped to the wiring board to be processed. In this manner, the multi-cavity wiring board 40 is mounted only on the non-defective wiring board, and a series of steps by the automatic mounting apparatus is completed.

According to this configuration, the difference in color due to the presence or absence of the solder resist film 37 on each pass / fail display pad of the pass / fail display portions M2 formed collectively in one place is optically detected by an image recognition device or the like. Thus, the quality of each wiring board can be recognized. As a result, it is possible to recognize the quality of each wiring board in a short time compared to the method in which the quality display units are scattered at different locations on the multi-piece wiring board. Further, the pass / fail display pads 31a to 31c, 32a to 32c, and 33a to 33c can be manufactured at the same time as the wiring board by sharing the same conductive material as the electrode terminals and connection wiring of the wiring board and the same solder resist film 7. The pass / fail display portion M2 for displaying pass / fail of each wiring board can be formed without increasing the number of steps.
Also, compared to the method of electrically detecting defective wiring boards by bringing a probe needle or the like into contact with the pass / fail display section, it is possible to perform non-contact detection by an optical method. The quality of each wiring board can be detected with little damage to the wiring board. In addition, compared with an electrical detection method, for example, a contact failure due to contamination of the pass / fail display pad and a misdetection due to a displacement of the probe needle are less likely to occur.
Further, the presence and position of defective wiring boards of the multi-cavity wiring board 10 are detected by the difference in color between the pass / fail display pads 31a to 31c, 32a to 32c, 33a to 33c and the solder resist film 37. Yes. As a result, the image recognition range can be reduced when a substrate having a different hue is used, as in the case of using a method for identifying the presence / absence of a pass / fail indication mark by using an image recognition device without using a film such as the solder resist film 37. There is no need to change settings. Therefore, the quality of each wiring board can be identified with high detection accuracy regardless of the material of the multi-piece wiring board.

(A) is a top view of the multi-piece wiring board which concerns on 1st Embodiment, (b) is the sectional view on the aa line of Fig.1 (a). The flowchart figure explaining the manufacturing method of the multi-cavity wiring board which concerns on 2nd Embodiment. (A) is a top view which shows an example of the multi-piece wiring board manufactured by the manufacturing method of 2nd Embodiment, (b) is the bb sectional view taken on the line of Fig.3 (a). (A) is a top view which shows an example of the multi-piece wiring board manufactured by the manufacturing method of 2nd Embodiment, (b) is the cc sectional view taken on the line of Fig.3 (a). The flowchart figure explaining the manufacturing method of the multi-cavity wiring board of 2nd Embodiment. Explanatory drawing which shows notionally the method of performing quality discrimination of the multi-piece wiring board using the open / short inspection machine utilized for the manufacturing method of 2nd Embodiment. The top view of the multi-piece wiring board of the modification of this invention, (b) is the dd line sectional drawing of Fig.7 (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,31 ... Base material sheet, 1A-1C, 2A-2C, 3A-3C, 31A-31C, 32A-32C, 33A-33C ... Wiring board, 1a-1c, 2a-2c, 3a-3c, 31a-31c , 32a to 32c, 33a to 33c ... pass / fail display pads, 4 ... connection wiring, 5 ... common pads, 6 ... all non-defective product display pads, 7, 37 ... solder resist films as coatings, 8a-8e ... electrode terminals, 9a ˜9e: connection wiring, 10, 40: multi-cavity wiring board, M1, M2: pass / fail display unit, S3: removal of solder resist as a film on the pass / fail display pad to indicate that the wiring board is defective Pass / fail display step, S14... Pass / fail detection step for identifying defective substrates.

Claims (7)

A multi-piece wiring board having a plurality of wiring boards and a pass / fail display unit for displaying pass / fail judgment results of the wiring boards,
In the pass / fail display portion, the same number of pass / fail display pads as the wiring substrate formed collectively on a part of the multi-cavity wiring substrate are formed,
A multi-cavity wiring board comprising a film formed on at least a part of the pass / fail display pad so as to be removable. A multi-piece wiring board having a plurality of wiring boards and a pass / fail display unit for displaying pass / fail judgment results of the wiring boards,
The pass / fail display section is electrically connected to each of the pass / fail display pads having the same number of electrical conductivities as the wiring board formed on a part of the multi-piece wiring board and the pass / fail display pads. A common pad,
A multi-cavity wiring board having a film formed on at least a part of the pass / fail display pad so as to be removable. A method of manufacturing a multi-cavity wiring board in which a plurality of wiring boards and the same number of pass / fail display pads as the wiring board formed in a part of an area different from the area where the wiring board is formed are formed. There,
A film forming step of forming a film on the upper surface of the plurality of pass / fail display pads;
An inspection step of determining that each of the plurality of wiring boards is a non-defective product or a defective product;
A pass / fail display step for displaying that each of the plurality of wiring boards is a non-defective product or a defective product by causing a difference in the state of the film,
And a pass / fail detection step for detecting whether each of the plurality of wiring boards is a non-defective product or a defective product based on a difference in the state of the film on the pass / fail display pad. Production method. In the manufacturing method of the multi-cavity wiring board according to claim 3,
A method of manufacturing a multi-piece wiring board, wherein, in the pass / fail display step, the difference in the state of the film is generated by removing at least a part of the film. In the manufacturing method of the multi-cavity wiring board according to claim 3 or 4,
A method for producing a multi-cavity wiring board, wherein the difference in the state of the film is caused by removing at least a part of the film by irradiating a laser beam. In the manufacturing method of the multi-cavity wiring board according to claim 3,
A method for manufacturing a multi-piece wiring board, wherein, in the pass / fail detection step, a difference in the state of the film on the pass / fail display pad is detected using an optical method. A plurality of wiring board, a pass / fail display pad having the same number of conductivity as the wiring board formed in a part of a region different from the area where the wiring board is formed, and the plurality of pass / fail display pads. A method of manufacturing a multi-cavity wiring board having a common pad electrically connected to each of them,
Forming a film on the upper surfaces of the plurality of pass / fail display pads;
An inspection step of determining that each of the plurality of wiring boards is a non-defective product or a defective product;
A pass / fail display step for displaying that each of the plurality of wiring boards is a non-defective product or a defective product by removing the film so that at least a part of the pass / fail display pad is exposed, and
A pass / fail detection step for identifying that each of the plurality of wiring boards is a non-defective product or a defective product by detecting an electrical characteristic between each of the pass / fail display pads and the common pad. A method of manufacturing a multi-cavity wiring board characterized by the above.

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