JP2007266403A - Cooling device for electronics equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device for an electronics equipment having a structure capable of capturing an air bubble in a flow channel in a common storage tank with either horizontal or vertical state. <P>SOLUTION: A storage tank 19 in communication with the flow channel 17 with a coolant circulated through a continuous hole 70 is provided, a regulatory part 71 gradually tapered to an inside of the tank 19 is provided in a periphery of the hole 70, a taper part 80 gradually tapered from a downstream to an upstream of the coolant flow direction is provided in the flow channel 17 in the vicinity of the continuous hole; and a space 85 in communication with both the channel 17 and the tank 19 by a periphery surface 84 of the taper part 80 and an inner periphery surface 72 of a regulatory part 71, and capable of temporarily storing the air bubble in the channel 17 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling device, and more particularly to a cooling device suitable for cooling an electronic component mounted on an electronic device.

  Electronic devices often have a plurality of electronic components that generate heat during operation. For example, it is known that a CPU (Central Processing Unit) mounted on a computer generates a lot of heat during its operation. Furthermore, the amount of heat generated by the CPU and the like has been steadily increasing as the amount of processing increases and the processing speed increases in recent years. On the other hand, an electronic component mounted on an electronic device generally has a limited use environment temperature for reasons such as heat resistance reliability and temperature dependence of operating characteristics. Therefore, in an electronic device provided with an electronic component that generates heat during operation, a cooling device is required for efficiently cooling the inside of the electronic device and the electronic component mounted therein.

Here, methods for cooling the inside of an electronic device and electronic components mounted thereon are roughly classified into an air cooling method and a liquid cooling method. The liquid cooling type cooling device has at least a pump and a flow path, and cools the electronic component by heat exchange between the refrigerant circulating in the flow path and the electronic component by the action of the pump (for example, Patent Document 1). reference). However, in the liquid cooling type cooling device having the basic structure as described above, when bubbles generated in the flow path due to a temperature change or the like flow into the pump, problems such as abnormal noise and pressure drop occur. There was a problem such as. Therefore, Patent Document 2 proposes a technique in which a liquid storage tank is provided in the middle of the flow path through which the refrigerant circulates and air bubbles in the flow path are captured (trapped) by the liquid storage tank. Furthermore, in Patent Document 2, not only when the electronic apparatus is used in a horizontal state, but also when used in a vertical state, two liquid storage tanks are provided in the middle of the flow path in order to capture bubbles in the flow path. It is disclosed. That is, a notebook personal computer or the like is generally used in a flat position on a desk, but may be used in a vertical position by standing on a stand or hanging on a wall. In this case, the relative positional relationship between the bubbles in the flow path having a specific gravity lighter than that of the refrigerant and the liquid storage tank when the electronic device is in a flat state (horizontal state) and in a vertical state (vertical state) However, in some cases, bubbles that were sufficiently trapped in the horizontal state cannot be trapped sufficiently in the vertical state. Therefore, Patent Document 2 discloses a cooling device having the basic structure shown in FIG. This cooling device has a pump 200, a flow path 201 developed in a two-dimensional plane, and a flat-type liquid storage tank 202 and a vertical-type liquid storage tank 203 provided in the middle of the flow path 201. Both liquid storage tanks 202 and 203 serve to alleviate pressure fluctuations in the flow path 201 and capture bubbles in the flow path 201. However, the flat-type liquid storage tank 202 plays the above role only when the electronic device on which the cooling device is mounted is used in a flat position, and the vertical-type liquid storage tank 203 is used in a vertical position. It plays the above role only if.
JP 2003-67087 A WO2005 / 001674 pamphlet ([0079] to [0089], FIG. 26, FIG. 27)

  It is a well-known fact that there is a strong demand for downsizing, thinning, and weight reduction of electronic devices, and electronic components are mounted with extremely high density. Therefore, when mounting a cooling device on an electronic device, it is desirable that the cooling device itself be as small, thin, and lightweight as possible, and it is desirable that the degree of freedom in the layout of electronic components is not hindered by the presence of the cooling device. . However, in the cooling device disclosed in Patent Document 2, it is necessary to provide two different liquid storage tanks of a flat type and a vertical type in the middle of the flow path.

  An object of the present invention is to provide a cooling device capable of sufficiently capturing bubbles in a flow path by a common liquid storage tank regardless of whether the electronic device is in a horizontal or vertical state.

  The cooling device for electronic equipment of the present invention that achieves the above object includes a flow path through which a refrigerant can circulate, a pump that circulates the refrigerant in the flow path, and a liquid storage tank that communicates with the flow path through a communication hole. A cooling device for electronic equipment having a capture portion that captures bubbles in the flow path and guides the captured bubbles to the storage tank side in the flow path near the communication hole. It is characterized by.

  It is desirable that a space capable of temporarily storing bubbles captured by the capturing unit is formed between the capturing unit and the liquid storage tank.

  In addition, a cylindrical restriction portion that gradually tapers toward the inside of the liquid storage tank is provided around the communication hole, and the space is formed by the inner surface of the restriction portion and the outer surface of the capturing portion. Is desirable.

  Further, it is desirable that the trapping portion has a tapered shape that gradually tapers from the downstream side in the flow direction of the refrigerant in the flow path toward the upstream side.

  Moreover, it is desirable that the upstream end of the trapping portion in the refrigerant flow direction is located on the upstream side of the opening center of the restricting portion.

  Moreover, it is desirable that the maximum diameter portion of the capturing portion is in close contact with the inner surface of the flow path.

  In the cooling apparatus for electronic equipment according to the present invention, air bubbles in the flow path can be captured by the common liquid storage tank not only when the apparatus is placed flat but also obliquely and vertically.

  Hereinafter, an example of an embodiment of a cooling device for an electronic device according to the present invention will be described in detail with reference to the drawings. Throughout the drawings, similar components are denoted by the same reference numerals.

  FIGS. 1A to 1C are schematic views showing the basic structure of the electronic apparatus cooling apparatus of this example. The electronic apparatus cooling apparatus of the present example connects the first cooling panel 1, the second cooling panel 2, the first cooling panel 1 and the second cooling panel 2, and the first cooling panel 1 is connected to the second cooling panel. 2 has connecting portions 3 and 4 that are pivotally supported so as to be openable and closable in a direction indicated by an arrow in FIG.

  The electronic apparatus cooling apparatus of the present example is a CPU or other heat generating component that generates heat by circulating a coolant such as water or antifreeze liquid through a flow path formed in the first cooling panel 1 and the second cooling panel 2. It has a function of cooling X. Reference numeral 5 shown in FIG. 1A is a virtual representation of a battery included in an electronic device in which the cooling device is mounted, and the second cooling panel 2 has a shape that avoids the installation area of the battery 5. It has become. But the shape of the 1st cooling panel 1 and the 2nd cooling panel 2 shown in figure is an example. The shape of the 1st cooling panel 1 and the 2nd cooling panel 2 is suitably determined by the various restrictions at the time of mounting in an electronic device.

  The first cooling panel 1 is formed of a metal material having good thermal conductivity such as copper (Cu) or aluminum (Al). As shown in FIG. 1, a flow path 11 and a microchannel structure 12 are formed inside the first cooling panel 1. Air cooling fins 13 are respectively provided on the upper and lower surfaces of the first cooling panel 1, and the flow path 11 in the area 13A where the air cooling fins 13 are provided is shown in FIG. Meander. Referring to FIG. 1A again, a cooling fan 14 is provided in the vicinity of the air cooling fin 13. The cooling fan 14 supplies cooling air to the air cooling fins 13 provided in the first cooling panel 1.

  The first cooling panel 1 will be described in more detail with reference to FIGS. 3 and 4. The first cooling panel 1 is obtained by joining the lower heat radiating plate 20 shown in FIG. 3 and the upper heat radiating plate 30 shown in FIG. 4 by a joining technique such as diffusion bonding, brazing bonding, or laser welding. As shown in FIG. 3, a groove 21 having a width of 6.0 mm and a depth of 1.5 mm and a narrow groove 22 having a width of 0.5 mm and a depth of 1.5 mm are formed in the lower radiator plate 20. The flow path 11 and the microchannel structure 12 are formed by covering with the upper radiator plate 30. The formation of the grooves 21 and the narrow grooves 22 on the lower heat sink 20 may be performed by a method of forming these grooves by pressing, a method of forming these grooves in a formed state, a method of forming by grinding, or the like. It is done.

  Further, the lower heat radiating plate 20 is formed with an opening B that is an inlet through which the refrigerant flows into the flow path 11 and an opening C that is an outlet through which the refrigerant flows out of the flow path 11. A metal tube 23 shown in FIG. 1 is connected to the opening B, and a metal tube 24 shown in FIG. As the metal tubes 23 and 24, flexible metal tubes are used so as not to obstruct the opening and closing of the first cooling panel 1 with respect to the second cooling panel 2.

  In the cooling device, the area where the microchannel structure 12 on the lower surface of the lower heat sink 20 of the first cooling panel 1 is formed consumes a large amount of power, and is a small area with a CPU that generates heat locally and other areas. It is mounted on the electronic device so as to be in contact with the upper surface of the heat generating component X. Heat generated by the heat generating component X is transmitted to the refrigerant flowing through the microchannel structure 12 via the lower heat radiating plate 20. The microchannel structure 12 is formed in an area where the lower heat sink 20 of the first cooling panel 1 is in contact with the heat generating component X with an area larger than the area. In this example, the microchannel structure 12 is formed by 38 narrow grooves 22 arranged in parallel.

  As shown in FIG. 5, between the channel 11 and the microchannel structure 12, the width gradually increases from the channel 11 side toward the macrochannel structure 12 side, and the width of the microchannel structure 12 at the end. An extension 15 that is the same as is formed. Furthermore, a guide plate 16 for diffusing the refrigerant flowing from the flow path 11 in the width direction of the microchannel structure 12 is formed in the extended portion 15. The guide plate 16 includes a pair of left and right first guide plates 16a, second guide plates 16b, and third guide plates 16c that are sequentially arranged from the upstream side of the refrigerant flow. The length of each guide plate is longer in the upstream guide plate, the first guide plate 16a is longer than the second guide plate 16b, and the second guide plate 16b is longer than the third guide plate 16c. Each guide plate is inclined by an angle θ with respect to the flow direction of the refrigerant. The angle θ is larger as the guide plate is located upstream. That is, the inclination angle θ of the first guide plate 16a is larger than the inclination angle θ of the second guide plate 16b, and the inclination angle θ of the second guide plate 16b is larger than the inclination angle θ of the third guide plate 16c.

  Next, the second cooling panel 2 will be described in detail with reference to FIGS. The second cooling panel 2 is formed of a metal material having good thermal conductivity such as copper (Cu) or aluminum (Al). As shown in FIG. 6, a flow path 17 is formed inside the second cooling panel 2, and a circulation pump 18 and a liquid storage tank 19 are provided on the upper surface. The second cooling panel 2 is obtained by joining the lower heat radiating plate 40 and the upper heat radiating plate 50 shown in FIGS. 7 and 8 by a joining technique such as diffusion bonding, brazing bonding, or laser welding. A groove 41 having a width of 20.0 mm and a depth of 0.8 mm is formed in the lower heat radiating plate 40, and the flow path 17 is formed by covering the groove 41 with the upper heat radiating plate 50. In addition, formation of the groove | channel 41 to the lower side heat sink 40 can consider the method of forming the groove | channel 41 with a press, the method of shape | molding in the state which formed the groove | channel 41, and the method of forming the groove | channel 41 by grinding. Further, the groove 41 may be formed in the upper heat radiating plate 50 or may be formed in both the upper heat radiating plate 50 and the lower heat radiating plate 40.

  A plurality of support portions 42 are formed at predetermined intervals in the central portion of the flow path 17 of the second cooling panel 2, that is, in the central portion of the groove 41 formed in the lower radiator plate 40. The support part 42 is for ensuring the strength when the lower heat sink 40 and the upper heat sink 50 are joined. As the width of the channel 17 becomes wider and the depth becomes shallower, the cooling performance is improved, while the pressure resistance performance is lowered. Therefore, from the viewpoint of the cooling performance, it is required to make the width of the flow path 17 as wide as possible and to make the depth shallow, but this will reduce the pressure resistance performance. For this reason, the pressure resistance is improved by the support portion 42. However, the formation position of the support portion 42 is not limited to the central portion of the flow path 17, and the support portions 42 may be arranged in a lattice shape or a zigzag shape, for example. In this example, support portions 42 having a width of 0.5 mm and a length of 2.0 mm are formed at intervals of 20.0 mm in the center of the channel 17 having the above dimensions.

  Further, as shown in FIG. 8, the upper radiator plate 50 includes an opening (branch hole) 51 communicating with the liquid storage tank 19, a refrigerant inlet 52 for returning the refrigerant from the flow path 17 to the circulation pump 18, and a circulation pump. A refrigerant outlet 53 through which the refrigerant is sent out from the flow path 18 toward the flow path 17, an opening A that is an outlet from which the refrigerant flows out of the flow path 17, and an opening D that is an inlet through which the refrigerant flows into the flow path 17 are formed. ing. A metal tube 23 shown in FIG. 1 is connected to the opening A, and a metal tube 24 shown in FIG. Note that a microchannel structure similar to the microchannel structure 12 may be formed on the second cooling panel 2.

  Next, the flow of the refrigerant in the electronic apparatus cooling apparatus of this example will be described. The refrigerant discharged from the circulation pump 18 provided on the upper surface of the second cooling panel 2 is sent to the flow path 17 formed in the second cooling panel 2 through the refrigerant outlet 53, and the opening A, metal It flows into the first cooling panel 1 through the pipe 23 and the opening B. The refrigerant flowing into the first cooling panel 1 flows through the flow channel 11 formed in the first cooling panel 1 and flows into the microchannel structure 12.

  The refrigerant that has flowed into the microchannel structure 12 absorbs the heat generated in the heat generating component X, passes through the meandering flow path 11 formed in the area where the air cooling fins 13 are provided, the opening C, the metal tube 24, and It flows into the second cooling panel 2 through the opening D. The refrigerant that has flowed into the second cooling panel 2 passes through the flow path 17 formed in the second cooling panel 2, passes under the branch hole 51 that communicates with the liquid storage tank 19, and reaches the refrigerant inlet 52. Return to the circulation pump 18 again. By circulating the refrigerant by the circulation pump 18 in this way, the heat generated by the heat generating component X is diffused throughout the first cooling panel 1 and the second cooling panel 2 by heat transfer, thereby enhancing the heat dissipation effect.

  Next, the configuration of the circulation pump 18 attached to the upper radiator plate 50 of the second cooling panel 2 will be described in detail with reference to FIGS. 9 and 10. 9A and 9B are diagrams showing the configuration of the circulation pump 18, wherein FIG. 9A is an exploded perspective view and FIG. 9B is a cross-sectional view. FIG. 10 is a cross-sectional view showing a method for mounting the circulation pump 18.

  As shown in FIG. 9, the circulation pump 18 includes a pump housing 60, a rubber resin O-ring 61, a piezoelectric diaphragm 62, and a top plate 63 that holds the piezoelectric diaphragm 62. The pump housing 60 is formed with a suction port 64 and a discharge port 65 respectively communicating with the refrigerant inlet 52 and the refrigerant outlet 53 formed in the upper radiator plate 50 of the second cooling panel 2. A space serving as a chamber 66 is formed. The suction port 64 has a first check valve 67 that prevents backflow from the pump chamber 66 to the flow path 17, and the discharge port 65 has a second check valve 68 that prevents backflow from the flow path 17 to the pump chamber 66. Are provided. Both check valves 67 and 68 are metal thin plate reed valves, and are mounted on the bottom surface of the pump housing 60 by spot welding or screwing.

  The piezoelectric diaphragm 62 is a piezoelectric flexural diaphragm that is a drive source of the circulation pump 18, and is configured by joining a piezoelectric element and an elastic plate, and is a watertight mold so that the piezoelectric element does not directly contact the coolant. Is given. As the piezoelectric element, a piezoelectric ceramic or a piezoelectric single crystal can be used. As the elastic plate, a copper alloy such as phosphor bronze, a metal thin plate such as a stainless alloy, a carbon fiber thin plate, a resin thin plate such as a PET plate, or the like can be used. The detailed structure of the piezoelectric diaphragm 62 may be a unimorph, bimorph, or the like, or a laminated structure in which piezoelectric elements are laminated.

  The circulating pump 18 having the above configuration is mounted as shown in FIG. First, as shown in FIG. 10A, the pump housing 60 is fixed to and integrated with the upper radiator plate 50 of the second cooling panel 2 by a joining technique such as metal diffusion joining, brazing joining, or laser welding. At this time, the suction casing 64, the discharge port 65, the space serving as the pump chamber 66, the first check valve 67, and the second check valve 68 are processed or mounted in the pump housing 60 in advance.

  Next, as shown in FIG. 10 (b), an O-ring 61 is fitted and a piezoelectric diaphragm 62 is placed thereon to form a pump chamber 66. Thereafter, the O-ring 61 is brought into close contact with the top plate 63 to ensure watertightness, and the periphery of the piezoelectric diaphragm 62 is fixed. At this time, the top plate 63 may be fixed to the pump housing 60 by a screw separate from the top plate 63, and screws formed around the top plate 63 are formed on the pump housing 60. The screw may be screwed to the screw.

  As explained so far, pressure loss and liquid leakage are prevented by joining the circulation pump 18 to the second cooling panel 2 and integrating them. Moreover, since the circulation pump 18 and the 2nd cooling panel 2 are integrated, thickness reduction is possible and it becomes cheap. Specifically, the thickness (height) of the electronic device cooling apparatus of the present example is 7.0 mm or less at the maximum portion where the circulation pump 18 is disposed.

  As mentioned above, although the structure of the circulation pump 18 was demonstrated, the structure demonstrated here is an example and the structure of the circulation pump 18 is not limited to the said structure.

  Next, the configuration of the liquid storage tank 19 will be described. As shown in FIG. 6, the liquid storage tank 19 has a hollow disk shape, and is provided on the flow path 17 before the circulation pump 18 (before refrigerant flows into the circulation pump 18). More specifically, as shown in FIG. 11, the communication hole 70 formed in the bottom surface of the liquid storage tank 19 and the branch hole 51 formed in the upper radiator plate 50 of the second cooling panel 2 communicate with each other. Are arranged as follows. Therefore, bubbles generated in the flow path 11 (FIGS. 1 and 2) and the flow path 17 due to temperature change and other factors pass due to the difference in specific gravity with the refrigerant when passing below the branch hole 51 of the flow path 17. It is trapped in the liquid storage tank 19. As a result, the bubbles do not continue to circulate endlessly in the flow paths 11 and 17, and the bubbles do not enter the circulation pump 18 and cause a problem. Furthermore, bubbles (air) accumulated in the upper part of the liquid storage tank 19 serve to alleviate pressure fluctuations in the flow paths 11 and 17 due to expansion and contraction of the refrigerant accompanying a temperature change.

  On the other hand, when the air in the liquid storage tank 19 flows out again into the flow path 17, the air may enter the circulation pump 18 and cause a problem. Therefore, a restricting portion 71 having a trapezoidal conical cross section is provided around the communication hole 70. More specifically, a restricting portion 71 that is gradually tapered from the branch hole 51 side toward the inside (upper part) of the liquid storage tank 19 is provided. With this restricting portion 71, even when the electronic device cooling apparatus is turned upside down, the air in the liquid storage tank 19 can be kept in the liquid storage tank 19 as much as possible. Here, in order not to return the air in the liquid storage tank 19 to the flow path 17, it is necessary that the upper end of the restricting portion 71 is always immersed in the refrigerant. Therefore, the volume of the liquid storage tank 19 and the amount of the refrigerant are set so that the liquid level of the refrigerant is always located above the upper end of the restricting portion 71.

  Further, in the flow path 17 immediately below the branch hole 51, a cylindrical shape provided with a tapered capturing portion (hereinafter referred to as “taper portion 80”) that gradually tapers from the downstream side in the refrigerant flow direction toward the upstream side. A guide member 81 is provided. The guide member 81 is disposed at a position where the opening end surface 82 of the tapered portion 80 coincides with the opening center of the restricting portion 71 (shown by a chain line in FIG. 11), and the outer surface of the cylindrical portion 83 other than the tapered portion 80 is a flow path. Close to the inner surface of 17. That is, the refrigerant flowing in the flow path 17 flows through the inside of the guide member 81 to the downstream side of the guide member 81 and does not flow between the guide member 81 and the flow path 17 to the downstream side. .

  Here, when the electronic device cooling device has shifted from the state shown in FIG. 11 to the state shown in FIG. 12A, that is, when the electronic device cooling device has shifted from the flat state to the diagonally vertical state, the bubbles in the flow path 17 Is captured by hitting the outer peripheral surface 84 of the tapered portion 80 and temporarily stored in a space 85 surrounded by the outer peripheral surface 84 and the inner peripheral surface 72 of the restricting portion 71. When the amount of bubbles (air) exceeding the volume of the space 85 accumulates in the space 85, the air moves over the edge 73 of the restricting portion 71 and into the liquid storage tank 19. At this time, since the opening end surface 82 of the tapered portion 80 coincides with the opening center of the restricting portion 71, that is, the opening end surface 82 is located upstream of the edge 73 of the restricting portion, Air does not move into the flow path 17. In short, it is not always necessary to make the opening end surface 82 of the tapered portion 80 coincide with the opening center of the restricting portion 71 if the opening end surface 82 is positioned upstream of the edge 73 of the restricting portion.

  When the inclination of the electronic device cooling device is gentler than the state shown in FIG. 12A, bubbles trapped by hitting the outer peripheral surface 84 of the tapered portion 80 are prevented from the outer peripheral surface 84 and the regulation. It may move along the inner peripheral surface 72 of the portion 71 and reach the liquid storage tank 19. That is, it may flow directly into the liquid storage tank 19 without being temporarily stored in the space 85.

  On the other hand, when the electronic device cooling apparatus has shifted from the state shown in FIG. 11 or 12A to the state shown in FIG. 12B, that is, from the flat or oblique vertical state (vertical state). Also in the state, the bubbles in the flow path 17 are captured by the tapered portion 80 on the same principle as described above, and are temporarily stored in the space 85 and then moved to the liquid storage tank 19. When the electronic device cooling device is in the obliquely vertical state, the bubbles flowing in the flow path 17 mainly hit the area of the tapered portion outer peripheral surface 84 facing the branch hole 51. However, in the vertical state, it cannot be specified which area of the outer peripheral surface 84 of the tapered portion the bubble hits. However, since the outer peripheral surface 84 of the tapered portion is a continuous surface without corners, bubbles that hit any area also move in the circumferential direction of the tapered portion 80 along the outer peripheral surface 84, and finally into the space 85. Reach.

  As described above, in the electronic device cooling device of the present invention, not only when the device is in a horizontal state, but also in a slanting vertical or vertical state, air bubbles in the flow path are captured by a common storage tank. can do.

  The regulating portion 71 may be formed separately from the liquid storage tank 19 and may be retrofitted to the liquid storage tank 19 or may be integrally formed with the liquid storage tank 19. Further, the guide member 81 may be integrally formed with the upper radiator plate 50 or the lower radiator plate 40 of the second cooling panel 2 or may be retrofitted. Further, when a part of the guide member 81 is formed integrally with each of the upper heat radiating plate 50 and the lower heat radiating plate 40 and both the heat radiating plates 50 and 40 are joined, the guide member 81 is formed together with the flow path 17. It may be. Further, the shape of the liquid storage tank 19 is not limited to a disk shape, and can be changed as necessary. For example, an elongated rectangle, an oval shape, an oval shape, or the like can be formed along the flow path.

  Next, an example of the mounting state of the electronic device cooling apparatus of this example on an electronic device will be described. FIG. 13A is a schematic perspective view showing an example of a mounted state, and FIG. 13B is a Z-Z ′ sectional view of FIG. These drawings show an example in which the electronic apparatus cooling apparatus of this example is mounted on a notebook personal computer. In the illustrated notebook computer 90, a liquid crystal panel 93 is pivotally supported by a casing 92 having a plurality of input keys 91 provided on the upper surface. The casing 92 has a thickness of 30 to 40 mm. Inside, a relatively large main electronic component having a different thickness, such as a DVD-RAM 94, an FD-RAM 95, an HDD 96, a battery 97, and a memory card 98, and heat generated by a CPU, etc. The motherboard 100 on which the component 99 is mounted is accommodated. And the cooling device for electronic devices of this example is arrange | positioned so that the 1st cooling panel 1 may be located above the motherboard 100, and the 2nd cooling panel 2 may be located below the motherboard 100. The area where the microchannel structure 12 is formed is in contact with the heat generating component 99.

  FIG. 13 shows an example of a mounting state of the electronic device cooling device of the present invention, and the electronic device on which the electronic device cooling device of the present invention is mounted is not limited to a notebook personal computer. Further, the mounting state can be changed as appropriate according to the layout of the electronic components in the electronic device and the like.

It is a figure which shows an example of embodiment of the cooling device for electronic devices of this invention, Comprising: (a) is a top view, (b) (c) is a side view of a different direction. It is an enlarged view which shows the flow path under an air cooling fin. (A) is a top view of the lower heat sink which comprises a 1st cooling panel, (b) is X-X 'sectional drawing of (a). (A) is a top view of the upper side heat sink which comprises a 1st cooling panel, (b) is a side view. It is an enlarged view which shows the enlarged part before a microchannel structure. It is a figure which shows a 2nd cooling panel, Comprising: (a) is a top view, (b) (c) is a side view of a different direction. (A) is a top view of the lower heat sink which comprises a 2nd cooling panel, (b) is Y-Y 'sectional drawing of (a). It is a top view of the upper side heat sink which comprises a 1st cooling panel. (A) is a disassembled perspective view of a circulation pump, (b) is sectional drawing. It is sectional drawing which shows the mounting state of a circulation pump. It is sectional drawing which shows a liquid storage tank and the flow path of the vicinity. (A) is sectional drawing which shows the liquid storage tank when the cooling device for electronic devices of this invention is set | placed diagonally vertically, and the flow path of the vicinity, (b) is the cooling device for electronic devices of this invention perpendicularly | vertically It is sectional drawing which shows the liquid storage tank when it was done, and the flow path of the vicinity. It is a figure which shows an example of the mounting state to the electronic device of the cooling device for electronic devices of this invention. It is a top view which shows an example of the conventional cooling device for electronic devices.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st cooling panel 2 2nd cooling panel 11, 17 Flow path 12 Micro channel structure 18 Circulation pump 19 Reservoir tank 20, 40 Lower heat sink 30, 50 Upper heat sink 70 Communication hole 71 Restriction part 72 Inner peripheral surface 80 Tapered portion 81 Guide member 82 Open end surface 83 Tube portion 84 Outer peripheral surface 85 Space

Claims (6)

A cooling apparatus for electronic equipment, comprising: a flow path through which a refrigerant can circulate; a pump that circulates the refrigerant in the flow path; and a liquid storage tank that communicates with the flow path through a communication hole;
The electronic apparatus cooling apparatus according to claim 1, further comprising: a capturing unit configured to capture air bubbles in the flow path in the vicinity of the communication hole and guide the captured air bubbles toward the liquid storage tank.   The electronic device cooling device according to claim 1, wherein a space capable of temporarily storing bubbles captured by the capturing unit is formed between the capturing unit and the liquid storage tank.   A cylindrical restricting portion that gradually tapers toward the inside of the liquid storage tank is provided around the communication hole, and the space is formed by the inner surface of the restricting portion and the outer surface of the capturing portion. The electronic device cooling device according to claim 2, wherein   4. The electronic device according to claim 1, wherein the trapping portion has a tapered shape that gradually tapers from a downstream side in a flow direction of the refrigerant in the flow path toward an upstream side. 5. Cooling system.   5. The electronic apparatus cooling device according to claim 3, wherein an end of the capturing part on the upstream side in the refrigerant flow direction is located on the upstream side with respect to an opening center of the restricting part. . 6. The electronic apparatus cooling device according to claim 4, wherein a maximum diameter portion of the capturing portion is in close contact with an inner surface of the flow path.

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