JP2007243536A5 - - Google Patents
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- Publication number
- JP2007243536A5 JP2007243536A5 JP2006062368A JP2006062368A JP2007243536A5 JP 2007243536 A5 JP2007243536 A5 JP 2007243536A5 JP 2006062368 A JP2006062368 A JP 2006062368A JP 2006062368 A JP2006062368 A JP 2006062368A JP 2007243536 A5 JP2007243536 A5 JP 2007243536A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrically connected
- package
- piezoelectric
- vibrating piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000758 substrate Substances 0.000 claims 33
- 239000004020 conductor Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Claims (6)
前記圧電振動子と並列に配置される基板と、
前記基板の上面に配置され、前記圧電振動片に電気的に接続される電子部品と、
前記パッケージの前記基板側の側面および前記基板の前記上面に付着し、前記圧電振動子と前記基板との間を機械的に接続する樹脂部と、
を備えることを特徴とする圧電デバイス。 A piezoelectric vibrator comprising a piezoelectric vibrating piece and a package containing the piezoelectric vibrating piece;
A substrate disposed in parallel with the piezoelectric vibrator;
An electronic component disposed on the upper surface of the substrate and electrically connected to the piezoelectric vibrating piece;
A resin part that adheres to the side surface of the package on the substrate side and the upper surface of the substrate, and mechanically connects the piezoelectric vibrator and the substrate;
A piezoelectric device comprising: a.
前記基板の前記上面に、前記電子部品に電気的に接続された配線パターンが形成され、
前記導電パターンと前記配線パターンとが、導電材料により電気的及び機械的に接続されている
ことを特徴とする請求項１に記載の圧電デバイス。 A conductive pattern electrically connected to the piezoelectric vibrating piece is formed on the side surface of the package,
A wiring pattern electrically connected to the electronic component is formed on the upper surface of the substrate,
The conductive pattern and the wiring pattern are electrically and mechanically connected by a conductive material.
The piezoelectric device according to claim 1 .
前記第１の基板は、平面視して前記第２の基板の外形の外側に位置する突出部を有し、
前記突出部の上面に、前記圧電振動片に電気的に接続された導電パターンが形成され、
前記基板の前記上面に、前記電子部品に電気的に接続された配線パターンが形成され、
前記導電パターンと前記配線パターンとが、ワイヤボンディングまたは導電材料により、電気的に接続されている
ことを特徴とする請求項１に記載の圧電デバイス。 The package includes a first substrate that constitutes a bottom substrate of the package, and a second substrate that is disposed on the first substrate,
The first substrate has a protrusion located outside the outer shape of the second substrate in plan view,
A conductive pattern electrically connected to the piezoelectric vibrating piece is formed on the upper surface of the protrusion,
A wiring pattern electrically connected to the electronic component is formed on the upper surface of the substrate,
The conductive pattern and the wiring pattern are electrically connected by wire bonding or a conductive material.
The piezoelectric device according to claim 1 .
前記第２の基板は、平面視して前記第１の基板の外形の外側に位置する突出部を有し、
前記突出部に、前記圧電振動片に電気的に接続された導電パターンが形成され、
前記基板の前記上面に、前記電子部品に電気的に接続された配線パターンが形成され、
前記導電パターンと前記配線パターンとが、導電材料により、電気的及び機械的に接続されている
ことを特徴とする請求項１に記載の圧電デバイス。 The package includes a first substrate that constitutes a bottom substrate of the package, and a second substrate that is disposed on the first substrate,
The second substrate has a protrusion located outside the outer shape of the first substrate in plan view,
A conductive pattern electrically connected to the piezoelectric vibrating piece is formed on the protrusion,
A wiring pattern electrically connected to the electronic component is formed on the upper surface of the substrate,
The conductive pattern and the wiring pattern are electrically and mechanically connected by a conductive material.
The piezoelectric device according to claim 1 .
前記第１の基板は、平面視して前記第２の基板の外形の外側に位置する突出部を有し、
前記突出部の上面に、前記圧電振動片に電気的に接続された導電パターンが形成され、
前記基板は、クランク状に曲げられたフレキシブル基板であって、前記クランク状の端部が前記突出部の上面に配置され、
前記クランク状の端部の下面に前記電子部品と電気的に接続された配線パターンが形成され、
前記導電パターンと前記配線パターンとが電気的に接続されている
ことを特徴とする請求項１に記載の圧電デバイス。 The package includes a first substrate that constitutes a bottom substrate of the package, and a second substrate that is disposed on the first substrate,
The first substrate has a protrusion located outside the outer shape of the second substrate in plan view,
A conductive pattern electrically connected to the piezoelectric vibrating piece is formed on the upper surface of the protrusion,
The substrate is a flexible substrate bent into a crank shape, and the crank-shaped end portion is disposed on an upper surface of the protruding portion,
A wiring pattern electrically connected to the electronic component is formed on the lower surface of the crank-shaped end,
The conductive pattern and the wiring pattern are electrically connected
The piezoelectric device according to claim 1 .
前記第２の基板の上面に、前記圧電振動片に電気的に接続された検査用導電パターンが形成されている
ことを特徴とする請求項１に記載の圧電デバイス。 The package includes a first substrate that constitutes a bottom substrate of the package, and a second substrate that is disposed on the first substrate,
A test conductive pattern electrically connected to the piezoelectric vibrating piece is formed on the upper surface of the second substrate.
The piezoelectric device according to claim 1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006062368A JP2007243536A (en) | 2006-03-08 | 2006-03-08 | Piezoelectric device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006062368A JP2007243536A (en) | 2006-03-08 | 2006-03-08 | Piezoelectric device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007243536A JP2007243536A (en) | 2007-09-20 |
| JP2007243536A5 true JP2007243536A5 (en) | 2009-04-23 |
Family
ID=38588632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006062368A Withdrawn JP2007243536A (en) | 2006-03-08 | 2006-03-08 | Piezoelectric device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007243536A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5489453B2 (en) * | 2008-12-25 | 2014-05-14 | 日本電波工業株式会社 | Crystal oscillator for surface mounting |
| JP5506201B2 (en) * | 2009-01-29 | 2014-05-28 | 日本電波工業株式会社 | Electronic card with crystal oscillator |
| JP2010283650A (en) * | 2009-06-05 | 2010-12-16 | Daishinku Corp | Piezoelectric oscillator |
| WO2011155600A1 (en) * | 2010-06-11 | 2011-12-15 | 株式会社大真空 | Oscillator |
| JP7224921B2 (en) * | 2019-01-09 | 2023-02-20 | 日本ルメンタム株式会社 | Optical module and method for manufacturing optical module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04247679A (en) * | 1991-02-01 | 1992-09-03 | Tdk Corp | Connection portion of electrical circuit and manufacture thereof |
| JP4058760B2 (en) * | 2001-10-31 | 2008-03-12 | セイコーエプソン株式会社 | Piezoelectric vibration device and real-time clock |
| JP4378980B2 (en) * | 2002-03-25 | 2009-12-09 | セイコーエプソン株式会社 | Electronic components with control terminals |
| JP2004312285A (en) * | 2003-04-04 | 2004-11-04 | Toyo Commun Equip Co Ltd | Surface mounted piezoelectric oscillator |
| JP2005110017A (en) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | High frequency filter module and its manufacturing method |
| JP2005244639A (en) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | Temperature compensated crystal oscillator |
-
2006
- 2006-03-08 JP JP2006062368A patent/JP2007243536A/en not_active Withdrawn
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