JP5506201B2 - Electronic card with crystal oscillator - Google Patents
Electronic card with crystal oscillator Download PDFInfo
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- JP5506201B2 JP5506201B2 JP2009017582A JP2009017582A JP5506201B2 JP 5506201 B2 JP5506201 B2 JP 5506201B2 JP 2009017582 A JP2009017582 A JP 2009017582A JP 2009017582 A JP2009017582 A JP 2009017582A JP 5506201 B2 JP5506201 B2 JP 5506201B2
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- bottom wall
- cover
- crystal
- terminal
- card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
本発明は水晶発振器を備えた電子カードを技術分野とし、特に厚みを小さく維持して電子部品の実装密度を高めた電子カードに関する。 The present invention relates to an electronic card provided with a crystal oscillator, and more particularly to an electronic card in which the thickness is kept small and the mounting density of electronic components is increased.
（発明の背景）
電子カード例えばＳＩＭカードは使用許可情報や電話番号等の個人情報を登録した認証カードとして、携帯電話等に内蔵される。近年では、ＳＩＭカードにＧＰＳ機能を取り込むことが検討され、これに対応した高さの小さい水晶発振器を内蔵することが求められている。この場合、ＳＩＭカードは厚みを例えば0.76ｍｍとすることから、水晶発振器の厚みは概ね0.5ｍｍ以下が求められる。
(Background of the Invention)
An electronic card such as a SIM card is built in a mobile phone or the like as an authentication card in which personal information such as use permission information and a telephone number is registered. In recent years, it has been studied to incorporate a GPS function into a SIM card, and it is required to incorporate a crystal oscillator with a small height corresponding to this. In this case, since the SIM card has a thickness of, for example, 0.76 mm, the thickness of the crystal oscillator is required to be approximately 0.5 mm or less.
（従来技術の一例）
第５図（ａｂ）は一従来例を説明するＳＩＭカードの断面図及び電子部品の平面的な配置図である。
(Example of conventional technology)
FIG. 5 (ab) is a cross-sectional view of a SIM card and a planar layout of electronic components for explaining a conventional example.
ＳＩＭカードは表面実装発振器１及びその他の電子部品２をカード基板３の一主面に配設し、表面実装発振器１を含む電子部品２上を樹脂４によってモールドしてなる。カード基板３の一主面には各電子部品２の接続する回路端子５や図示しない配線パターンを有し、他主面には照合端子６を有する。照合端子６はＳＩＭカードが挿入される携帯電話内の照合端子と電気的に接続する。 The SIM card is formed by disposing a surface mount oscillator 1 and other electronic components 2 on one main surface of a card substrate 3 and molding the electronic component 2 including the surface mount oscillator 1 with a resin 4. One main surface of the card substrate 3 has circuit terminals 5 to which each electronic component 2 is connected and a wiring pattern (not shown), and the other main surface has a matching terminal 6. The verification terminal 6 is electrically connected to a verification terminal in the mobile phone into which the SIM card is inserted.
表面実装発振器１は容器本体７に水晶片８とＩＣチップ９を並設して収容し、金属カバー１０を被せて密閉封入する。容器本体７は底壁７ａ及び枠壁７ｂを有する凹状とした積層セラミックからなり、外底面に電源、出力、アース及びＡＦＣ等の外部端子（不図示）を有する。水晶片８は両主面に励振電極１１ａを有し、例えば水晶片８の一端部両側に引出電極１１ｂを延出する「第６図（ａ）」。引出電極１１ｂの延出した水晶片８の一端部両側は、容器本体７の内底面の水晶保持端子に導電性接着剤１２等によって固着し、電気的・機械的に接続する。 The surface-mount oscillator 1 accommodates a crystal piece 8 and an IC chip 9 in a container body 7 side by side, and covers a metal cover 10 so as to be hermetically sealed. The container body 7 is formed of a concave laminated ceramic having a bottom wall 7a and a frame wall 7b, and has external terminals (not shown) such as a power source, an output, a ground, and AFC on the outer bottom surface. The crystal piece 8 has excitation electrodes 11a on both main surfaces, and for example, an extraction electrode 11b is extended on both sides of one end of the crystal piece 8 (FIG. 6 (a)). Both ends of one end of the crystal piece 8 from which the extraction electrode 11b extends are fixed to the crystal holding terminal on the inner bottom surface of the container body 7 by the conductive adhesive 12 or the like, and are electrically and mechanically connected.
ＩＣチップ９は図示しない発振回路や温度補償機構を集積化し、回路機能面となる一主面にＩＣ端子１３を有する「第６図（ｂ）」。そして、例えばバンプ１４を用いた超音波熱圧着等のフリップチップボンディングによって内底面の回路端子５に固着し、電気的・機械的に接続する。ＩＣ端子１３（回路端子５）中の水晶端子は水晶保持端子に、電源、出力、アース及びＡＦＣ等のＩＣ端子１３はこれに対応した外部端子に、図示しない配線路によって電気的に接続する。カード基板３は例えばガラスエポキシ材を母材とする。 The IC chip 9 integrates an oscillation circuit and a temperature compensation mechanism (not shown), and has an IC terminal 13 on one main surface as a circuit function surface (FIG. 6B). Then, for example, it is fixed to the circuit terminals 5 on the inner bottom surface by flip chip bonding such as ultrasonic thermocompression bonding using the bumps 14 and is electrically and mechanically connected. A crystal terminal in the IC terminal 13 (circuit terminal 5) is electrically connected to a crystal holding terminal, and an IC terminal 13 such as a power source, output, ground, and AFC is electrically connected to an external terminal corresponding thereto by a wiring path (not shown). The card substrate 3 uses, for example, a glass epoxy material as a base material.
このようなものでは、水晶片８とＩＣチップ９とを容器本体７の内底面に並設するので、水晶片８とＩＣチップ９とを垂直方向に配置した表面実装発振器１よりも高さ寸法を小さく例えば0.5ｍｍ以下にできる。したがって、カード基板３の厚みや樹脂モールドを考慮しても現行の規格である0.76ｍｍ以下を達成する。なお、水晶発振器の高さが他の電子部品２よりも最も大きい。また、図中の符号２Ａはその他の電子部品２の配置領域である。 In such a case, since the crystal piece 8 and the IC chip 9 are arranged side by side on the inner bottom surface of the container body 7, the height dimension is higher than that of the surface-mounted oscillator 1 in which the crystal piece 8 and the IC chip 9 are arranged in the vertical direction. For example, 0.5 mm or less. Therefore, even if the thickness of the card substrate 3 and the resin mold are taken into consideration, the current standard of 0.76 mm or less is achieved. The height of the crystal oscillator is the largest compared to the other electronic components 2. Further, reference numeral 2A in the figure is an arrangement area of other electronic components 2.
（従来技術の問題点）
しかしながら、上記構成の表面実装発振器１を用いたＳＩＭカードでは、高さ寸法を満足するものの、ＩＣチップ９と水晶片８とを並設することから、平面外形を大きくする。したがって、カード基板に対する占有積を大きくし、その他の電子部品２の配置領域を狭める問題があった。
(Problems of conventional technology)
However, in the SIM card using the surface mount oscillator 1 having the above configuration, although the height dimension is satisfied, since the IC chip 9 and the crystal piece 8 are arranged in parallel, the planar outer shape is enlarged. Therefore, there is a problem that the occupied area with respect to the card substrate is increased and the arrangement area of the other electronic components 2 is narrowed.
（発明の目的）
本発明はカード基板に対する表面実装発振器の占有積を小さくして実装密度を高めた電子カードを提供することを目的とする。
(Object of invention)
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic card having a small mounting area of a surface-mounted oscillator with respect to a card substrate and an increased mounting density.
本発明は、特許請求の範囲（請求項１）に示したように、一主面側に密閉容器を形成する底壁及び前記底壁が延出して前記一主面側に電子部品が搭載される平坦部を有するカード基板と、前記カード基板の一端側を表面実装発振器の密閉容器の底壁として兼用し、前記表面実装発振器の密閉容器の底壁の一端側に、凹状としたカバーの開口端面を接合して前記密閉容器が形成され、
前記密閉容器は、前記カバーの底壁と枠壁からなる積層セラミックであり、
前記凹状とした前記カバーの底壁に水晶保持端子が形成され、前記水晶保持端子に導電性接着剤によって水晶片の一端部両側を固着して当該水晶片を前記カバーの底壁に固着されており、
前記表面実装発振器の密閉容器の底壁に回路端子を有し、前記回路端子にはＩＣチップのＩＣ端子を電気的に接続して、前記ＩＣチップを前記水晶片と共に前記カード基板に対して垂直方向に配置し、
前記ＩＣ端子中の電源、出力、アース及びＡＦＣ端子は、積層セラミックからなる前記カード基板の貫通電極及び積層面を経て前記平坦部に延出しており、
前記カバーの前記開口端面を前記表面実装発振器の密閉容器の底壁に固着してなり、
前記カバーの底壁の外表面には、前記水晶片と電気的に接続した水晶検査端子を有し、
前記カバーの前記凹状とした開口端面の内周側に、前記水晶片と電気的に接続した導出電極を有し、
前記カバーの前記凹状とした開口端面に、当該開口端面を周回する封止金属膜を形成してなり、
前記導出電極と前記封止金属膜に対応して前記表面実装発振器の密閉容器の底壁に形成された電極および封止金属膜に、前記導出電極と前記封止金属膜を共晶合金によって接続したことを特徴とする電子カードである。
According to the present invention, as shown in claims (Claim 1), a bottom wall forming a sealed container on one principal surface side and the bottom wall extend so that an electronic component is mounted on the one principal surface side. A card board having a flat portion and one end side of the card board as a bottom wall of a sealed container of a surface mount oscillator, and a concave cover opening on one end side of the bottom wall of the sealed container of the surface mount oscillator the sealed container is formed by joining the end faces,
The sealed container is a laminated ceramic composed of a bottom wall and a frame wall of the cover,
The concave and the crystal holding terminals are formed on the bottom wall of the cover, is secured to the crystal piece by fixing one end portion sides of the crystal piece by a conductive adhesive to the crystal holding terminals on a bottom wall of said cover And
Has a circuit terminal in the bottom wall of the closed container of the surface mounting oscillator, said circuit terminal electrically connecting the IC terminals of the IC chip, the IC chip with respect to both the card substrate and the crystal piece Placed vertically ,
The power supply, output, ground, and AFC terminal in the IC terminal extend to the flat portion through the through electrode and the laminated surface of the card substrate made of laminated ceramic,
The opening end surface of the cover is fixed to the bottom wall of the sealed container of the surface mount oscillator,
The outer surface of the bottom wall of the cover has a crystal inspection terminal electrically connected to the crystal piece,
On the inner peripheral side of the concave opening end face of the cover, there is a lead electrode electrically connected to the crystal piece,
Formed on the concave opening end surface of the cover is a sealing metal film that goes around the opening end surface,
Corresponding to the lead electrode and the sealing metal film, the lead electrode and the sealing metal film are connected by an eutectic alloy to the electrode and the sealing metal film formed on the bottom wall of the sealed container of the surface mount oscillator. The electronic card is characterized by the above.
このような構成であれば、水晶片及びＩＣチップを収容する密閉容器の底壁をカード基板が兼用するので、従来例での表面実装発振器の独立した底壁を不要にする。したがって、水晶片とＩＣチップとを密閉容器内に垂直方向に配置しても高さ寸法を小さく維持できる。そして、水晶片とＩＣチップを並設した場合よりも、表面実装発振器としての平面外形を小さくできる。これにより、カード基板に対する表面実装発振器の占有積を小さくして実装密度を高める。 With such a configuration, since the card substrate also serves as the bottom wall of the sealed container that accommodates the crystal piece and the IC chip, an independent bottom wall of the surface mount oscillator in the conventional example is unnecessary. Therefore, the height dimension can be kept small even if the crystal piece and the IC chip are arranged vertically in the sealed container. Further, the planar outer shape as the surface mount oscillator can be made smaller than when the crystal piece and the IC chip are arranged in parallel. As a result, the occupation product of the surface mount oscillator with respect to the card substrate is reduced to increase the mounting density.
（実施態様項）
本発明の請求項２では、前記密閉容器は底壁及び前記底壁上に積層された内壁段部を有する枠壁からなる容器本体と前記容器本体の開口端面を封止する金属カバーとからなり、前記底壁上には前記ＩＣチップが固着され、前記内壁段部には前記水晶片の引出電極の延出した外周部が固着される。これにより、ＩＣチップの上方に水晶片を配置して両者が垂直方向となる平面外形を小さくした表面実装発振器が得られる。
(Embodiment section)
According to a second aspect of the present invention, the sealed container includes a container main body including a bottom wall and a frame wall having an inner wall step portion laminated on the bottom wall, and a metal cover for sealing the opening end surface of the container main body. The IC chip is fixed on the bottom wall, and the outer peripheral portion of the crystal piece lead electrode extended is fixed to the inner wall step. As a result, a surface-mounted oscillator in which a crystal piece is disposed above the IC chip and the planar outer shape in which both are perpendicular to each other is reduced can be obtained.
同請求項３では、前記カード基板は少なくとも２層とした積層セラミックからなり、前記ＩＣチップの外部端子となるＩＣ端子は前記積層セラミックの積層面を経て前記平坦部に延出する。これにより、密閉容器の密閉度を維持して外部端子を導出できる。 According to a third aspect of the present invention, the card substrate is made of at least two layers of laminated ceramic, and an IC terminal serving as an external terminal of the IC chip extends to the flat portion through the laminated surface of the laminated ceramic. Thereby, the external terminal can be derived while maintaining the sealing degree of the sealed container.
（第１実施形態）
以下、第１図（電子カード及び表面実装発振器の断面図）によって、本発明の第１実施形態を説明する。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。
(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIG. 1 (a cross-sectional view of an electronic card and a surface-mounted oscillator). In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
電子カードは、前述したように、他主面には照合端子６を有するカード基板３の一主面に表面実装発振器１及び電子部品２を設けて樹脂４によってモールドする（所謂樹脂モールド）。ここでは、カード基板３は二層とした積層セラミックからなり、さらに一端側に容器本体７を形成する下枠層７ｂ及び上枠層７ｃを積層してなる「第１図（ａ）」。 As described above, the electronic card is molded with the resin 4 by providing the surface mount oscillator 1 and the electronic component 2 on one main surface of the card substrate 3 having the collation terminal 6 on the other main surface (so-called resin molding). Here, the card substrate 3 is made of a laminated ceramic having two layers, and further, a lower frame layer 7b and an upper frame layer 7c that form a container body 7 are laminated on one end side (FIG. 1 (a)).
要するに、カード基板３は密閉容器を形成する容器本体７の底壁７ａを兼用する。逆に言えば、容器本体７を形成する底壁７ａを延出して他の電子部品２の搭載される平坦部を形成する。容器本体７の下枠壁７ｂの開口部は上枠壁のそれより小さく、これにより内壁段部を形成する。そして、容器本体７の内底面に設けた回路端子５にはＩＣチップ９をフリップチップボンディングによって固着して電気的・機械的に接続する。 In short, the card substrate 3 also serves as the bottom wall 7a of the container body 7 that forms a sealed container. In other words, the bottom wall 7a that forms the container body 7 is extended to form a flat portion on which another electronic component 2 is mounted. The opening of the lower frame wall 7b of the container body 7 is smaller than that of the upper frame wall, thereby forming an inner wall step. The IC chip 9 is fixed to the circuit terminal 5 provided on the inner bottom surface of the container body 7 by flip chip bonding, and is electrically and mechanically connected.
容器本体７の内壁段部に設けた水晶保持端子５ａには引出電極１１ｂの延出した水晶片８の一端部両側を導電性接着剤１２によって固着する。これにより、水晶片８とＩＣチップ９とを垂直方向に配置する。水晶保持端子５ａは例えば内壁段部の端面電極を経て、ＩＣ端子１３中の水晶端子が固着する回路端子５に電気的に接続する。また、ＩＣ端子１３中の電源、出力、アース及びＡＦＣ端子は貫通電極及び積層面を経て平坦部に延出する「第１図（ｂ）」。 The both sides of one end of the crystal piece 8 where the extraction electrode 11 b extends are fixed to the crystal holding terminal 5 a provided on the inner wall step portion of the container body 7 by the conductive adhesive 12. Thereby, the crystal piece 8 and the IC chip 9 are arranged in the vertical direction. The crystal holding terminal 5a is electrically connected to the circuit terminal 5 to which the crystal terminal in the IC terminal 13 is fixed, for example, through the end face electrode of the inner wall step. Further, the power supply, output, ground, and AFC terminal in the IC terminal 13 extend to the flat portion through the through electrode and the laminated surface (FIG. 1B).
そして、ここでは例えばカード基板３の他主面に水晶検査端子１５を設け、水晶保持端子５ａと電気的に接続する。水晶検査端子１５は例えば水晶片８及びＩＣチップ９を密閉封入した後の、水晶振動子のクリスタルインピーダンス（ＣＩ）等の振動特性を測定する端子となる。これは、封止後の振動系の変化によってＣＩの増加を招くこと等があることから有用となる。 Here, for example, a crystal inspection terminal 15 is provided on the other main surface of the card substrate 3, and is electrically connected to the crystal holding terminal 5a. The crystal inspection terminal 15 is a terminal for measuring vibration characteristics such as crystal impedance (CI) of the crystal resonator after the crystal piece 8 and the IC chip 9 are hermetically sealed. This is useful because CI may increase due to a change in the vibration system after sealing.
これらは、例えば第２図（ａｂｃ）に示したように、シート状カード基板３Ａ即ちシート状底壁７Ａ、シート状下枠壁７Ｂ、及びシート状上枠壁７Ｃを形成する。シート状底壁７Ａは平坦状として二層とする。シート状下枠壁７Ｂ及びシート状上枠壁７Ｃは、いずれも、例えば水平方向とした上下の連結部１６ａに、複数の下枠壁７ａが間隔をおいて設けられた垂直板１６ｂの両端が連結して並べられる。但し、前述のように、シート状下枠壁
７Ｂの各枠壁７ｂの開口部はシート状上枠壁７Ｃのそれよりも小さい。
These form, for example, a sheet-like card substrate 3A, that is, a sheet-like bottom wall 7A, a sheet-like lower frame wall 7B, and a sheet-like upper frame wall 7C, as shown in FIG. 2 (abc). The sheet-like bottom wall 7A is flat and has two layers. In both the sheet-like lower frame wall 7B and the sheet-like upper frame wall 7C, for example, both ends of a vertical plate 16b in which a plurality of lower frame walls 7a are provided at intervals in upper and lower connecting portions 16a in the horizontal direction. They are connected and arranged. However, as described above, the opening of each frame wall 7b of the sheet-like lower frame wall 7B is smaller than that of the sheet-like upper frame wall 7C.
そして、シート状底壁７Ａ、下枠壁７Ｂ及び上枠壁７Ｃに図示内貫通電極を含む回路パターンを印刷して下地電極（ＷやＭo）を形成した後に積層する。次に、これらの積層体を焼成した後、例えば図示しないシーム溶接用の金属リングを開口端面に接合した後、電界メッキによって、下地電極上にＮi及びＡu膜を順次に形成する。最後に、積層体をＡ−Ａ及びＢ−Ｂ線に沿って縦横に切断して容器本体７を含む個々のカード基板３を得る。 Then, a circuit pattern including the illustrated through electrode is printed on the sheet-like bottom wall 7A, lower frame wall 7B, and upper frame wall 7C to form a base electrode (W or Mo), and then laminated. Next, after firing these laminates, for example, a metal ring for seam welding (not shown) is joined to the opening end face, and then Ni and Au films are sequentially formed on the base electrode by electroplating. Finally, the laminate is cut vertically and horizontally along the lines AA and BB to obtain individual card substrates 3 including the container body 7.
そして、水晶片８及びＩＣチップ９を容器本体７に収容して金属カバー１０を金属リングに接合してこれらを密閉封入する。その後、水晶検査端子１５に図示しない測定器からのプローブを当接して振動特性を測定する。また、カード基板３の平坦部の一主面に導出した表面実装発振器１の各端子にプローブを当接して発振特性を測定する。そして、振動特性及び発振特性の規格を満足しないものを排除し、規格を満足したカード基板３の平坦部に電子部品２を搭載する。さらに、樹脂モールドして電子カードを形成する。 Then, the crystal piece 8 and the IC chip 9 are accommodated in the container body 7, and the metal cover 10 is joined to the metal ring, and these are hermetically sealed. Thereafter, a probe from a measuring instrument (not shown) is brought into contact with the crystal inspection terminal 15 to measure vibration characteristics. Further, a probe is brought into contact with each terminal of the surface mount oscillator 1 led out to one main surface of the flat portion of the card substrate 3 to measure the oscillation characteristics. The electronic component 2 is mounted on the flat portion of the card substrate 3 that satisfies the standards, excluding those that do not satisfy the standards of vibration characteristics and oscillation characteristics. Further, an electronic card is formed by resin molding.
なお、個々の容器本体７を有するカード基板３に分割した後、表面実装発振器１を形成して電子部品２を搭載し、樹脂モールドとしたが、例えばシート状底壁７Ａ、下枠壁７Ｂ及び上枠壁７Ｃの積層体の状態で樹脂モールドを含めたシート状の電子カードを形成し、その後、個々の電子カードに分割することもできる。 In addition, after dividing | segmenting into the card | curd board | substrate 3 which has each container main body 7, the surface mount oscillator 1 was formed, the electronic component 2 was mounted, and it was set as the resin mold, For example, sheet-like bottom wall 7A, lower frame wall 7B, It is also possible to form a sheet-like electronic card including a resin mold in the state of the laminated body of the upper frame wall 7C and then divide it into individual electronic cards.
このような構成であれば、カード基板３を表面実装発振器（容器本体７）の底壁７ａに兼用するので、この分の厚みに応じて高さ寸法を小さくできる。そして、水晶片８とＩＣチップ９とを垂直方向に配置するので、表面実装発振器１の平面外形をも小さくしてカード基板３に対する実装密度を高められる。したがって、カード基板の平坦部の面積を大きくして多くの電子部品を搭載できる。 With such a configuration, since the card substrate 3 is also used as the bottom wall 7a of the surface mount oscillator (container body 7), the height dimension can be reduced according to the thickness. Since the crystal piece 8 and the IC chip 9 are arranged in the vertical direction, the planar outer shape of the surface mount oscillator 1 can be reduced and the mounting density on the card substrate 3 can be increased. Therefore, it is possible to mount many electronic components by increasing the area of the flat portion of the card substrate.
そして、ここではカード基板３の他主面に水晶検査端子１５を形成するので、封止後の水晶振動子の振動特性を確認できる。なお、カード基板３となる底壁７ａは容器本体７から突出して形成したが、第３図に示したように、同一端面としても形成できる。これらは、積層体（第２図参照）の上枠壁から切断することによって同一端面に形成できる。 Here, since the crystal inspection terminal 15 is formed on the other main surface of the card substrate 3, the vibration characteristics of the crystal resonator after sealing can be confirmed. In addition, although the bottom wall 7a used as the card substrate 3 protrudes from the container main body 7, it can also be formed as the same end surface as shown in FIG. These can be formed on the same end surface by cutting from the upper frame wall of the laminate (see FIG. 2).
（第２実施形態）
以下、第４図（電子カードの一部拡大断面図）によって、本発明の第２実施形態を説明する。なお、第１実施形態と同一部分の説明は省略又は簡略する。
(Second Embodiment)
The second embodiment of the present invention will be described below with reference to FIG. 4 (partially enlarged sectional view of the electronic card). In addition, description of the same part as 1st Embodiment is abbreviate | omitted or simplified.
第２実施形態では、前述同様にカード基板３を密閉容器の底壁７ａに兼用する。ここでの密閉容器は底壁７ａに凹状としたカバー１７の開口端面を接合してなる。カバー１７は底壁１７ａと枠壁１７ｂを有する積層セラミックからなる。そして、特許文献３で示される手法によって表面実装発振器１を形成する。 In the second embodiment, the card substrate 3 is also used as the bottom wall 7a of the sealed container as described above. The sealed container here is formed by joining the open end face of the cover 17 having a concave shape to the bottom wall 7a. The cover 17 is made of a laminated ceramic having a bottom wall 17a and a frame wall 17b. And the surface mount oscillator 1 is formed by the method shown by patent document 3. FIG.
すなわち、カバー１７の開口端面の内周側に水晶片８と電気的に接続した導出電極１８を形成し、開口端面に周回する封止金属膜１９を形成する。そして、これらに対応した底壁７ａの電極及び金属膜と共晶合金２０によって接続し、底壁７ａの回路端子５と電気的に接続するとともに密閉容器を形成する。 That is, the lead-out electrode 18 electrically connected to the crystal piece 8 is formed on the inner peripheral side of the opening end surface of the cover 17, and the sealing metal film 19 is formed around the opening end surface. And it connects with the electrode and metal film of the bottom wall 7a corresponding to these by the eutectic alloy 20, is electrically connected with the circuit terminal 5 of the bottom wall 7a, and forms an airtight container.
なお、カバー１７の底壁１７ａには水晶保持端子５ａが形成されて導電性接着剤１２によって水晶片８の一端部両側が固着される。また、底壁７ａの回路端子５にはＩＣチップ９のＩＣ端子１３が電気的に接続する。そして、カバー１７の外表面には水晶片８と電気的に接続した水晶検査端子１５を有する。 A crystal holding terminal 5 a is formed on the bottom wall 17 a of the cover 17, and both ends of one end of the crystal piece 8 are fixed by the conductive adhesive 12. Further, the IC terminal 13 of the IC chip 9 is electrically connected to the circuit terminal 5 of the bottom wall 7a. The cover 17 has a crystal inspection terminal 15 electrically connected to the crystal piece 8 on the outer surface.
このような構成であって、第１実施形態と同様にカード基板３の一端側を表面実装発振器１の底壁７ａとして兼用するので、高さ寸法を小さくできる。そして、水晶片８とＩＣチップ９とを垂直方向に配置するので、実装密度を高める。ここでは、水晶片８をカバー１７の底壁１７ａに固着して、ＩＣチップ９を底壁７ａに固着する。したがって、第１実施形態のように、水晶片８を固着する内壁段部を要しないので、ＩＣチップ９の面積を大きくできる。 With such a configuration, since the one end side of the card substrate 3 is also used as the bottom wall 7a of the surface mount oscillator 1 as in the first embodiment, the height dimension can be reduced. Since the crystal piece 8 and the IC chip 9 are arranged in the vertical direction, the mounting density is increased. Here, the crystal piece 8 is fixed to the bottom wall 17a of the cover 17, and the IC chip 9 is fixed to the bottom wall 7a. Therefore, unlike the first embodiment, the inner wall step portion to which the crystal piece 8 is fixed is not required, so that the area of the IC chip 9 can be increased.
１ 表面実装発振器、２ 電子部品、３ カード基板、４ 樹脂モールド、５ 回路端子、６ 照合端子、７ 容器本体、８ 水晶片、９ ＩＣチップ、１０、１７ カバー、１１ 励振及び引出電極、１２ 導電性接着剤、１３ ＩＣ端子、１４ バンプ、１５ 水晶検査端子、１６ａ 連結部、１６ｂ 垂直板、１８ 導出電極、１９ 封止金属膜、２０ 共晶合金。 DESCRIPTION OF SYMBOLS 1 Surface mount oscillator, 2 Electronic components, 3 Card board, 4 Resin mold, 5 Circuit terminal, 6 Reference terminal, 7 Container body, 8 Crystal piece, 9 IC chip, 10, 17 Cover, 11 Excitation and extraction electrode, 12 Conductivity Adhesive, 13 IC terminal, 14 bump, 15 crystal inspection terminal, 16a connecting part, 16b vertical plate, 18 lead electrode, 19 sealing metal film, 20 eutectic alloy.
Claims (1)
前記密閉容器は、前記カバーの底壁と枠壁からなる積層セラミックであり、
前記凹状とした前記カバーの底壁に水晶保持端子が形成され、前記水晶保持端子に導電性接着剤によって水晶片の一端部両側を固着して当該水晶片を前記カバーの底壁に固着されており、
前記表面実装発振器の密閉容器の底壁に回路端子を有し、前記回路端子にはＩＣチップのＩＣ端子を電気的に接続して、前記ＩＣチップを前記水晶片と共に前記カード基板に対して垂直方向に配置し、
前記ＩＣ端子中の電源、出力、アース及びＡＦＣ端子は、積層セラミックからなる前記カード基板の貫通電極及び積層面を経て前記平坦部に延出しており、
前記カバーの前記開口端面を前記表面実装発振器の密閉容器の底壁に固着してなり、
前記カバーの底壁の外表面には、前記水晶片と電気的に接続した水晶検査端子を有し、
前記カバーの前記凹状とした開口端面の内周側に、前記水晶片と電気的に接続した導出電極を有し、
前記カバーの前記凹状とした開口端面に、当該開口端面を周回する封止金属膜を形成してなり、
前記導出電極と前記封止金属膜に対応して前記表面実装発振器の密閉容器の底壁に形成された電極および封止金属膜に、前記導出電極と前記封止金属膜を共晶合金によって接続したことを特徴とする電子カード。
A card board having a bottom wall forming a sealed container on one main surface side and a flat portion on which the bottom wall extends and an electronic component is mounted on the one main surface side, and one end side of the card substrate being a surface mount oscillator The closed container is formed by joining the opening end face of the concave cover to one end of the bottom wall of the closed container of the surface mount oscillator.
The sealed container is a laminated ceramic composed of a bottom wall and a frame wall of the cover,
The concave and the crystal holding terminals are formed on the bottom wall of the cover, is secured to the crystal piece by fixing one end portion sides of the crystal piece by a conductive adhesive to the crystal holding terminals on a bottom wall of said cover And
Has a circuit terminal in the bottom wall of the closed container of the surface mounting oscillator, said circuit terminal electrically connecting the IC terminals of the IC chip, perpendicular to the card substrate the IC chip together with the crystal blank Place in the direction,
The power supply, output, ground, and AFC terminal in the IC terminal extend to the flat portion through the through electrode and the laminated surface of the card substrate made of laminated ceramic,
The opening end surface of the cover is fixed to the bottom wall of the sealed container of the surface mount oscillator,
The outer surface of the bottom wall of the cover has a crystal inspection terminal electrically connected to the crystal piece,
On the inner peripheral side of the concave opening end face of the cover, there is a lead electrode electrically connected to the crystal piece,
Formed on the concave opening end surface of the cover is a sealing metal film that goes around the opening end surface,
Corresponding to the lead electrode and the sealing metal film, the lead electrode and the sealing metal film are connected by an eutectic alloy to the electrode and the sealing metal film formed on the bottom wall of the sealed container of the surface mount oscillator. An electronic card characterized by
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