JP2007189380A - Piezoelectric device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which is not broken by injection pressure during resin molding even if a bottom plate constituting a package of a piezoelectric vibrator is made thin. <P>SOLUTION: The piezoelectric device has a package 21 containing a piezoelectric vibration chip 40 and an IC 30 fixed on the reverse surface of the package 21, the package 21 and IC 30 molded with resin 12. In this case, the IC 30 which is employed has a die size which is sufficiently large to straddle reverse surfaces at positions corresponding to opposed side walls 22a and 22a constituting a cavity 24 of the package 21 for storing the piezoelectric vibration chip 40, and is arranged straddling the reverse surfaces. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a piezoelectric device and an electronic apparatus having the piezoelectric device mounted thereon, and in particular, a piezoelectric device and an electronic apparatus in which a piezoelectric vibrator and an electronic component that controls the piezoelectric vibrator are integrally molded with a resin. About.

A piezoelectric device such as a piezoelectric oscillator having a piezoelectric vibrator and an electronic component for controlling the piezoelectric vibrator, for example, a semiconductor element (IC) provided with an oscillation circuit, is integrally molded with a resin that can be easily shaped. The technology is widely known. Today, in response to the demand for downsizing and thinning of electronic devices using such piezoelectric devices, the above-described piezoelectric devices themselves are also being downsized and thinned.
As described above, the technology most promising at present for reducing the size and thickness of a piezoelectric device in which a piezoelectric vibrator and an IC are integrated and resin-molded is adopted in the piezoelectric device disclosed in Patent Document 1. Technology.

The piezoelectric device disclosed in Patent Document 1 is a piezoelectric oscillator, in which an IC is mounted at the center of the back surface (bottom surface) of a package of a piezoelectric vibrator that accommodates a piezoelectric vibrating piece, and the IC is molded with resin together with the piezoelectric vibrator. It is based on doing. In Patent Document 1, in a piezoelectric device having such a basic configuration, the piezoelectric device is miniaturized by contriving the form of bonding between a lead used as a terminal for external mounting and a piezoelectric vibrator.
JP 2004-297770 A

The technique disclosed in Patent Document 1 can be said to be a very effective means for reducing the size of the piezoelectric device.
However, even when the piezoelectric device is miniaturized using the technology as described above, the market trend is further miniaturization and thinning.

  Here, when the piezoelectric vibrator and the IC are molded with resin, as shown in FIG. 10, the device composed of the piezoelectric vibrator 1 and IC 2 is placed in the mold 3 and the resin 4 is injected into the device. The outer shape is formed. The injection of the resin 4 is performed at a relatively high pressure in order to prevent the generation of voids due to mixing of bubbles and the like. For this reason, when the bottom plate of the vibrator package 5 is thinly formed in order to reduce the thickness of the piezoelectric device, there is a possibility that the bottom plate portion may not withstand the resin injection pressure at the time of molding and may be damaged. . For this reason, it is difficult to reduce the thickness by simply reducing the thickness of the constituent members of the vibrator package 5.

  Therefore, in the present invention, even when the substrate constituting the package of the piezoelectric vibrator is thinned, the piezoelectric device which does not cause breakage due to the injection pressure at the time of resin molding, and the electronic apparatus equipped with this piezoelectric device The purpose is to provide.

  In order to achieve the above object, a piezoelectric device according to the present invention includes a vibrator package containing a piezoelectric vibrating piece therein, and an electronic component fixed to the back surface of the vibrator package. A piezoelectric device in which the electronic component is molded with a resin, and the electronic component has at least one installation surface on a back surface of the vibrator package at a position corresponding to a side wall constituting a cavity for accommodating the piezoelectric vibrating piece. It is characterized in that the parts are arranged in an overlapping manner. With such a configuration, the resin injection pressure during resin molding loaded on the vibrator package can be reduced. For this reason, even when the thickness of the bottom plate of the vibrator package is reduced, it is possible to prevent the vibrator package from being damaged during resin injection. Therefore, it is possible to realize a reduction in thickness of the entire piezoelectric device.

  In addition, a piezoelectric device according to the present invention for achieving the above object includes a vibrator package containing a piezoelectric vibrating piece therein, and an electronic component fixed to the back surface of the vibrator package, and the vibrator A piezoelectric device in which a package and the electronic component are molded with a resin, and the electronic component straddles between back surfaces at positions corresponding to opposing side walls constituting a cavity accommodating the piezoelectric vibrating piece in the vibrator package. A material having a large die size may be adopted and disposed across the back surface. By adopting such a configuration, the electronic component arranged across the back surface at the position corresponding to the opposite side wall serves as a beam for protecting the bottom plate of the vibrator package, and thus substantially vibrates. The bottom plate of the child package will be reinforced. For this reason, even when the thickness of the bottom plate of the vibrator package is reduced, it is possible to prevent the vibrator package from being damaged when the resin is injected. Therefore, it is possible to realize a reduction in thickness of the entire piezoelectric device.

  Further, in the piezoelectric device having the above-described configuration, the electronic component has a rectangular shape, and is provided on each of the back surfaces at positions corresponding to the opposing side walls that form the cavity for housing the piezoelectric vibrating piece in the vibrator package. The diagonal of the installation surface may be arranged. Even in such a configuration, as in the piezoelectric device having the above configuration, the electronic component is disposed across the back surface at a position corresponding to the opposite side wall. It will serve as a beam that protects the bottom plate. For this reason, the bottom plate of the vibrator package is substantially reinforced, and even when the thickness of the bottom plate of the vibrator package is reduced, it is possible to prevent the vibrator package from being damaged during resin injection. . Therefore, it is possible to realize a reduction in thickness of the entire piezoelectric device.

  Further, in the piezoelectric device having the above configuration, a lead frame that penetrates the resin mold portion is attached to the piezoelectric vibrator, and the lead frame corresponds to each of the cavity and the side wall in the vibrator package. It is desirable to arrange it across the back of the position. By adopting such a configuration, the bottom plate of the vibrator package that serves as the ceiling of the cavity is suspended by the lead frame, so that the reinforcing effect of the bottom plate of the vibrator package in the piezoelectric device described above can be enhanced. it can.

In the piezoelectric device as described above, the electronic component may be a semiconductor element having an oscillation circuit built therein. With this configuration, the piezoelectric device can function as a piezoelectric oscillator.
Further, the piezoelectric device having the above-described configuration may be configured such that a plurality of electronic components are attached to one piezoelectric vibrator. By arranging a plurality of electronic components following the configuration of the piezoelectric device, the reinforcing effect of the bottom plate of the vibrator package can be enhanced.

  In addition, an electronic apparatus according to the present invention for achieving the above object is characterized by mounting any one of the above-described piezoelectric devices. By mounting a piezoelectric device that can be made thin, the electronic device itself can be made thin and highly integrated.

  Hereinafter, embodiments of a piezoelectric device and an electronic apparatus according to the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited only to the embodiments described below, and the technical scope of the present invention corresponds to various ones as long as the main part is not changed.

First, a first embodiment according to the piezoelectric device of the present invention will be described with reference to FIGS. 1 is a plan view of the piezoelectric device, and FIG. 2 is a cross-sectional view taken along the line AA in FIG.
The piezoelectric device 10 of this embodiment has a piezoelectric vibrator 20 and a semiconductor element (IC) 30 having a circuit for controlling oscillation of the piezoelectric vibrator 20, and these are molded with a resin 12. This is a piezoelectric oscillator.

The piezoelectric vibrator 20 includes a piezoelectric vibrating piece 40 and a vibrator package (hereinafter simply referred to as a package) 21 for housing the piezoelectric vibrating piece 40. The piezoelectric vibrating piece 40 is a substrate made of a piezoelectric material, and can be selected from various materials such as quartz (SiO ₂ ), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), and the like. In the present embodiment, the following description is given assuming that crystal is selected. The piezoelectric vibrating piece 40 has a difference in the shape of the piezoelectric substrate, the shape of an excitation electrode (not shown) for exciting vibration, and the like depending on the vibration characteristics and the like. As the shape of the piezoelectric substrate, a rectangular flat plate type or a tuning fork type shape is well known. The package 21 includes a base 22 having a cavity (rectangular shape in this embodiment) 24 for accommodating the piezoelectric vibrating piece 40, and a lid 28 that is a lid for sealing the opening of the base 22. Consists of. The base 22 is often formed by sintering a member such as ceramic in a box shape, and the lid 28 may be a flat plate made of metal, glass, or quartz. Many. In selecting a member constituting the lid 28, it is desirable to select a member whose thermal expansion coefficient is close to that of the member constituting the base 22. Further, an internal terminal (not shown) is provided inside the base 22, and the internal terminal is an external terminal 26 (26 a, 26 b, 26 c, 26 d) provided on the back surface of the bottom plate 22 b of the base 22, that is, the bottom surface of the package 21. Is electrically connected.

  In the piezoelectric vibrator 20 according to this embodiment, the piezoelectric vibrating piece 40 having the above-described configuration is mounted on an internal terminal (not shown) provided in the base 22 having the above-described configuration using a conductive adhesive 42 or the like, and the lid having the above-described configuration. 28, the opening of the base 22 is hermetically sealed.

  The IC 30 may be used for a general oscillator as its circuit structure and function. The standard of the IC 30 employed in this embodiment is the die size. In this embodiment, as shown in FIG. 1 and FIG. 2, at least the long side of the long side and the short side defining the die size has a cavity 24 provided in the base 22 of the package 21. Adopt a longer one than the short side length. In the present embodiment, it is assumed that the long side length of the IC 30 is longer than the short side length of the cavity 24 and shorter than the short side length of the outer shape of the base 22. Such a die size IC 30 has a larger die size than an IC used in a general piezoelectric oscillator. Specifically, when the die size of an IC generally used for a piezoelectric oscillator is 1.0 mm × 1.0 mm, the die size of the IC used in this embodiment is about 1.5 mm × 2.0 mm. It will be a thing. The standard of the die size is a reference value, and the actual value is a value that varies depending on the size of the package 21 and the technical level at the time of implementation.

  The IC 30 having the die size as described above is mounted on the back surface of the package 21 of the piezoelectric vibrator 20 having the above configuration, that is, the back surface of the bottom plate 22b of the base 22. When mounting the IC 30 on the back surface of the package 21, as shown in FIGS. 1 and 2, a part of the mounting surface of the IC 30 overlaps the back surface of the bottom plate 22 b at a position corresponding to the side wall 22 a constituting the cavity 24. To. In the present embodiment, the IC 30 is disposed so as to straddle the back surface of the bottom plate 22b at a position corresponding to the opposing side walls 22a, 22a (see FIG. 2). In addition, the IC 30 is preferably mounted on the back surface of the package 21 with an entire non-active surface of the IC 30 as an adhesive surface using an adhesive (not shown) or the like. By doing so, the IC 30 and the bottom plate 22b of the base 22 are integrated, and the IC 30 functions as a beam that supports the bottom plate 22b as the ceiling portion of the cavity 24 (because the piezoelectric vibrator is shown reversed in the figure). It will bear.

In the piezoelectric vibrator 20 of the present embodiment, a plurality of lead frames 14 (14a, 14b, 14c, 14d) and 16 (16a, 16b) serving as support points at the time of molding are arranged. The lead frames 14 and 16 include a lead 14 serving as a mounting electrode for mounting the piezoelectric device 10 and an auxiliary lead 16 for assisting support of the piezoelectric device 10 during molding. In the present embodiment, the lead 14 is bonded to the back surface of the package 21 using the insulating adhesive 15, so that the external terminal 26 provided on the back surface of the package 21 and the lead 14 are overlapped. The piezoelectric device 10 as a whole can be reduced in size.
The terminal 32 and the lead 14 provided in the IC 30 or the external terminal 26 of the piezoelectric vibrator 20 are configured to be electrically connected by wire bonding using the bonding wire 18.

  The piezoelectric device 10 of this embodiment forms a body by molding the piezoelectric vibrator 20, the IC 30, the lead frames 14, 16, and the like, which are arranged as described above, with the resin 12. The package 21 that has received the resin injection pressure at the time of molding is not damaged. This is achieved by the IC 30 that relaxes the pressure at the time of resin injection acting on the back surface of the package 21 between the side walls 22a of the cavity 24 (actually, between the back surfaces of the bottom plate 22b corresponding to the side walls 22a). It is an action. That is, since the resin injection pressure acting on the active surface of the IC 30 acts in a distributed manner on the side wall 22a of the cavity 24, the thickness of the bottom plate 22b of the package 21 is substantially increased at the portion where the IC 30 is bonded. It is possible to obtain the effect. Further, even if the mounting surface of the IC 30 is not overlapped with the bottom plate 22b, the distance from the boundary between the side wall 22a serving as a fulcrum and the bonding surface of the IC 30 to the center of the bottom plate 22b receiving pressure is shortened. This will increase the strength against.

  By arranging the IC 30 with respect to the piezoelectric vibrator 20 as described above, it is possible to improve the strength of the bottom plate 22b of the package 21 (base 22) against the resin injection pressure during resin molding. Thereby, even if the thickness of the bottom plate 22b of the package 21 is further reduced, it is possible to prevent the package 21 from being damaged at the time of resin injection. Therefore, the piezoelectric device 10 can be further reduced in thickness. Further, by making the die size of the IC 30 to be adopted larger than the conventional one, it is possible to give a wide circuit configuration to the IC 30 and to allow the IC 30 to have various functions.

  Next, a second embodiment according to the piezoelectric device of the present invention will be described with reference to FIG. The basic configuration of the piezoelectric device of this embodiment shown in FIG. 3 is the same as that of the piezoelectric device 10 shown in the first embodiment described above. Accordingly, parts having the same function are denoted by the same reference numerals plus 100, and detailed description thereof is omitted.

  The difference between the piezoelectric device 110 according to the present embodiment and the piezoelectric device 10 according to the first embodiment is that a lead 114 (114a, 114b, 114c, 114d) that functions as a mounting electrode for the device and an auxiliary device are used. When a lead frame such as the lead 116 (116a, 116b) is attached to the piezoelectric vibrator 120, the attachment position exceeds the position corresponding to the side wall 122a of the package 121, that is, in the side wall 122a and the area inside the side wall 122a. It is attached to the back surface of the bottom plate (22b shown in FIG. 2). By attaching the lead 114 and the auxiliary lead 116 in such an arrangement, the bottom plate as the ceiling of the cavity 124 is suspended by the lead frames 114 and 116 as in the effect of the arrangement of the IC 30 described in the first embodiment. Thus, the bottom plate of the package 21 is reinforced. For this reason, it is possible to further improve the strength of the bottom plate of the package 121 with respect to the resin injection pressure during resin molding. Other configurations and operational effects are the same as those of the piezoelectric device 10 shown in the first embodiment.

  Next, a third embodiment according to the piezoelectric device of the present invention will be described with reference to FIG. In the following embodiments, in order to simplify the description, only the arrangement form of the electronic components with respect to the back surface of the piezoelectric vibrator is characteristically shown in the drawings, and other configurations such as a lead frame and bonding wires are not shown. The example of the first embodiment, the second embodiment, and a general piezoelectric device already known at the time of filing of the present application will be followed. In FIG. 4, parts having the same functions as those of the piezoelectric device shown in the first embodiment are denoted by reference numerals obtained by adding 200 to the reference numerals shown in FIG. And

  In FIG. 4, a region surrounded by a two-dot chain line at the center of the back surface of the package 221 indicates the die size of the IC 230 employed in the present embodiment. Note that the die size of the IC 230 employed in the piezoelectric device of the present embodiment may be the same as the die size of an IC used in a general piezoelectric oscillator. According to the above example, the die size of the IC 230 is 1 mm square. As can be seen from FIG. 4, when the die-sized IC 230 is arranged at the center of the back surface of the package 221, the adhesive surface is not overlapped on the back surface of the bottom plate (22b shown in FIG. 2) corresponding to the side wall. Can not. For this reason, when the arrangement form of the IC 230 is set at the center of the back surface of the package 221 as in the past, the bottom plate of the package 221 may be damaged by the resin injection pressure generated during resin molding.

  Therefore, in the present embodiment, the arrangement position of the IC 230 with respect to the back surface of the package 221 is shifted to the back surface of the bottom plate corresponding to any side wall 222a constituting the cavity 224, and only one side corresponds to the side wall 222a. It was arranged on the back of the bottom plate at the position. Even when the arrangement of the IC 230 with respect to the back surface of the package 221 is as described above, the resin injection pressure applied to the bottom plate of the package 221 during resin molding can be reduced. Therefore, as in the first and second embodiments, even when the bottom plate of the package 221 is thinned, the bottom plate of the package 221 that has been subjected to resin injection pressure is not damaged, and the piezoelectric device is thin. Can be realized. In addition, if the IC 230 is arranged as in the present embodiment, the components constituting the piezoelectric device can be the same as the piezoelectric device having the conventional configuration, so that no significant design change is required. Become.

  Next, a fourth embodiment according to the piezoelectric device of the present invention will be described with reference to FIG. Note that the piezoelectric device shown in the present embodiment is characterized only in that the arrangement form of ICs as electronic components is different in comparison with the piezoelectric device shown in the third embodiment. Therefore, portions having the same functions are denoted by the same reference numerals as those shown in FIG. 4 in the drawing, and detailed description thereof will be omitted.

  The piezoelectric device according to the present embodiment is characterized in that the arrangement position of the IC 230 is shifted to a corner of the package 221, that is, a position where the side wall 222a constituting the cavity 224 intersects. By arranging the IC 230 in such an arrangement, the IC 230 is placed on the back surface of the bottom plate (22b shown in FIG. 2) corresponding to each of the long side wall 222a1 and the short side wall 222a2 in the package 221. It becomes possible to arrange | position and it becomes possible to maintain the stable adhesion state. Further, since the IC 230 is supported by the two orthogonal side walls 222a1 and 222a2, the resin injection pressure acting on the active surface of the IC 230 is distributed to the side walls 222a1 and 222a2, and the bottom plate of the package 221 It becomes possible to relieve the pressure applied to the. Thus, since the IC 230 of this embodiment is supported by the two side walls 222a1 and 222a2, the bottom plate of the package 221 is more than the piezoelectric device according to the third embodiment that is supported by one side wall. The pressure resistance of can be improved.

  Next, a fifth embodiment of the piezoelectric device of the present invention will be described with reference to FIG. Note that the piezoelectric device shown in the present embodiment is characterized only in that the arrangement form of ICs as electronic components is different in comparison with the piezoelectric device shown in the third embodiment. Therefore, portions having the same function are denoted by the same reference numerals as those in FIG. 4 and detailed description thereof is omitted.

  The piezoelectric device of this embodiment is characterized in that the arrangement form of the IC 230 is rotationally shifted. Thus, by rotating the arrangement form of the IC 230 and arranging the IC 230 by inclining the sides of the package 221, the package 221 can be used even for a small IC (assuming the IC is rectangular). The diagonal of the installation surface can be arranged across the back surface of the bottom plate (22b shown in FIG. 2) at a position corresponding to the opposing side walls 222a and 222a constituting the cavity 224. By doing so, the injection pressure of the resin applied to the active surface of the IC 230 is distributed to the side walls 222a and 222a of the package 221, so that the pressure applied to the bottom plate of the package 221 can be relieved. The same effects as those of the first and second embodiments described above can be obtained.

  Next, a sixth embodiment according to the piezoelectric device of the present invention will be described with reference to FIG. Note that the piezoelectric device shown in the present embodiment is characterized in that the piezoelectric device shown in the third to fifth embodiments is changed in the IC arrangement, whereas the die size of the IC. It is characterized by changing itself, and the substantial operational effect is the same as in the first and second embodiments. Therefore, portions having the same function are denoted by the same reference numerals as those in FIG. 4 and detailed description thereof is omitted.

  The piezoelectric device of the present embodiment is characterized in that the die size of the IC 230a is larger than the die size of the general IC 230 indicated by a two-dot chain line. By increasing the die size of the IC, the IC 230a is disposed across the back surface of the bottom plate (22b shown in FIG. 2) at a position corresponding to the opposing side walls 222a and 222a constituting the cavity 224 in the package 221. Is possible. Thereby, the same effect as the piezoelectric device shown in the first and second embodiments can be obtained.

  In each of the above embodiments, only the IC is cited as the electronic component, and only the arrangement form of the IC has been characterized. However, the piezoelectric device according to the present invention can also be applied to the case where electronic components other than an IC such as a thermistor mounted on a piezoelectric device such as a temperature compensated piezoelectric oscillator are mounted. FIG. 8 shows an example of this case, and the relationship between the electronic component and the piezoelectric vibrator will be described below. In addition, the piezoelectric device which concerns on each embodiment mentioned above, and the location which makes the function the same attach | subject the code | symbol which added 300 to the code | symbol of FIG. 1, and abbreviate | omits detailed description.

  Also in the piezoelectric device of this embodiment, the IC 330 is arranged on the back surface of the bottom plate (22b shown in FIG. 2) corresponding to the side wall 322a in the package 321, similarly to the piezoelectric devices shown in the various embodiments. Similarly, the electronic components 334a and 334b other than the IC such as the thermistor are desirably arranged on the back surface of the bottom plate corresponding to the side wall 322a. In this way, the electronic components that constitute the piezoelectric device and are arranged around the piezoelectric vibrator 320 are arranged on the back surface of the bottom plate corresponding to the side wall 322a of the package 321, that is, the bottom plate that is the ceiling of the cavity 324 and the side wall 322a. By arranging on the back surface of the bottom plate in the straddling position, the effect of reinforcing the strength of the bottom plate of the package 321 can be obtained, and even when the bottom plate is thinned, it is possible to withstand high resin injection pressure. Therefore, the piezoelectric device can be thinned. When the IC 330 and the other electronic components 334a and 334b are large-sized, as shown in the above embodiment, between the back surfaces of the bottom plates at positions corresponding to the opposed side walls 322a and 322a constituting the cavity 324. It is good to arrange so as to straddle.

  In the third embodiment and the following embodiments, the configuration of the lead frame and the bonding wire is not clearly shown in the drawings. However, the arrangement and connection form thereof are configured from FIGS. 1 to 3 and a known technique. It is possible.

Next, a configuration of a mobile phone device will be described with reference to FIG. 9 as an embodiment of an electronic apparatus in which each piezoelectric device (piezoelectric oscillator) described above is mounted.
In the cellular phone device 400, the audio signal from the transmitter is converted into an electric signal by the microphone 402, modulated by the signal switching unit 406 including a demodulator / codec, etc., converted in frequency by the transmission unit 408, and the antenna. 412 is transmitted to a base station (not shown).

  On the other hand, the signal transmitted from the base station is received via the antenna 412, frequency-converted by the receiving unit 414, converted into an audio signal by the signal switching unit 406, and output from the speaker 404.

  The operation of the mobile phone device 400 in which such signal control is performed is entirely controlled by a CPU (Central Processing Unit) 416. The CPU 416 also controls the operation of an input / output unit 418 such as a liquid crystal screen and a keyboard, a memory 420 that records a control program, a telephone book, and the like, and a changeover switch 410 that controls transmission and reception of signals.

  In the mobile phone device having the basic configuration as described above, the above-described piezoelectric device is connected to the CPU 416 and plays a role of a basic clock of the CPU 416. In this way, by mounting the piezoelectric device having the above-described configuration, it is possible to achieve downsizing, thinning, or high integration of the mobile phone device.

1 is a plan view of a piezoelectric device according to a first embodiment. It is a figure which shows the AA cross section in FIG. It is a top view of the piezoelectric device which concerns on 2nd Embodiment. It is a figure which shows the characteristic part of the piezoelectric device which concerns on 3rd Embodiment. It is a figure which shows the characteristic part of the piezoelectric device which concerns on 4th Embodiment. It is a figure which shows the characteristic part of the piezoelectric device which concerns on 5th Embodiment. It is a figure which shows the characteristic part of the piezoelectric device which concerns on 6th Embodiment. It is a figure which shows other embodiment of the piezoelectric device which concerns on this invention. It is a figure which shows the structural example of the electronic device carrying the piezoelectric device which concerns on this invention. It is sectional drawing which shows the mode at the time of the resin molding of a piezoelectric device.

Explanation of symbols

  10 ......... Piezoelectric device, 12 ......... Resin, 14 (14a to 14d) ......... Lead (lead frame), 16 (16a, 16b) ......... Auxiliary lead (lead frame), 18 ......... Bonding wire 20 ......... Piezoelectric vibrator, 21 ......... Package (vibrator package), 22 ......... Base, 22a ......... Side wall, 22b ......... Bottom plate, 24 ......... Cavity, 26 (26a to 26d) ............ External terminal, 28... Lid, 30 ...... IC, 32 ...... Terminal, 40 ...... Piezoelectric vibrating piece, 42 ...... Conductive adhesive.

Claims (7)

A piezoelectric device having a vibrator package containing a piezoelectric vibrating piece therein and an electronic component fixed to the back surface of the vibrator package, wherein the vibrator package and the electronic component are molded with a resin,
The piezoelectric device according to claim 1, wherein the electronic component is arranged such that at least a part of an installation surface is overlapped with a back surface at a position corresponding to a side wall constituting a cavity for housing the piezoelectric vibrating piece in the vibrator package. A piezoelectric device having a vibrator package containing a piezoelectric vibrating piece therein and an electronic component fixed to the back surface of the vibrator package, wherein the vibrator package and the electronic component are molded with a resin,
The electronic component employs an electronic component having a die size that spans between the back surfaces at positions corresponding to opposing side walls that constitute the cavity that accommodates the piezoelectric vibrating piece in the vibrator package, and straddles between the back surfaces. A piezoelectric device characterized by being arranged by   The electronic component has a rectangular shape, and the diagonal of the installation surface is arranged on each of the back surfaces of the vibrator package at positions corresponding to the opposing side walls constituting the cavity for accommodating the piezoelectric vibrating piece. The piezoelectric device according to claim 1. A lead frame that penetrates the resin mold part is attached to the piezoelectric vibrator,
4. The piezoelectric device according to claim 1, wherein the lead frame is disposed across a back surface at a position corresponding to each of the cavity and the side wall of the vibrator package. 5.   The piezoelectric device according to claim 1, wherein the electronic component is a semiconductor element having an oscillation circuit built therein.   The piezoelectric device according to claim 1, wherein a plurality of electronic components are attached to one piezoelectric vibrator.   An electronic apparatus comprising the piezoelectric device according to any one of claims 1 to 6.

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