JP2003060474A - Piezoelectric device, and mobile telephone apparatus and electronic appliance utilizing the piezoelectric device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric device, and mobile telephone apparatuses and electronic apparatuses which utilize the piezoelectric device whose shock resistance is made superior, owing to the fastening of its piezoelectric vibrating piece being firm, even when its constitution is made compact. SOLUTION: A tuning-fork type piezoelectric vibrating piece 32 stored in the piezoelectric device 30 has a base portion 51, fastened to the side of a package 36 and has a pair of vibrating arms 34, 35 extended in parallel with each other from the base portion, and further, there are made into curved-form or chamfered shapes of both the end portions 57, 57 present on the opposite side of the base portion 51 to the vibrating arms which are both the end potions in its width direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric device having a tuning fork type piezoelectric vibrating piece built in a package.

[0002]

2. Description of the Related Art In recent years, devices such as HDDs (hard disk drives), mobile computers, and small information devices such as IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems are small and thin. The piezoelectric devices used in these devices are required to be small and thin. At the same time, there is a demand for a surface-mounting type piezoelectric device that can be mounted on both sides of a circuit board of an apparatus.

[0003]

FIG. 14 is a schematic plan view showing an example of the structure of a piezoelectric device which is under trial manufacture under the demand for miniaturization as described above. FIG.
FIG. 14 is a schematic cross-sectional view showing the configuration of a small piezoelectric device.
(B) is a figure which expands and shows the part A of Fig.14 (a). In FIG. 14, the piezoelectric device 1, which is under trial production, contains the piezoelectric vibrating piece 2 inside the package 6. The piezoelectric vibrating piece 2 is formed by using, for example, a quartz substrate. This piezoelectric vibrating piece 2 is a package 6
Is formed into a tuning fork type having a base portion 11 joined to the electrode portion and a pair of vibrating arms 4 and 5 extending in parallel from the base portion 11, and a driving metal electrode (not shown) is formed on the surface thereof.

The package 6 is formed by stacking a plurality of ceramic substrates to form a predetermined internal space S inside. In the internal space S, the base portion 11 of the piezoelectric vibrating piece 2 described above is bonded and fixed on the electrode portions 3 and 3 to the inner bottom portion of the package 6 via the conductive adhesive 7 or the like. The tip of the resonator element 2 is a free end. Then, a lid 9 made of a light-transmitting material such as glass, that is, a light-transmitting material, is joined to the open upper end of the package 6 through a brazing material such as low-melting glass. Are sealed by.

The piezoelectric device 1 is configured as described above, and when the driving voltage from the outside is transmitted to the piezoelectric vibrating piece 2 via the electrode portion 3 and the conductive adhesive 7, the piezoelectric vibrating piece 2 is formed. By transmitting a voltage from the excitation electrode (not shown) to the piezoelectric material, the pair of vibrating arms 4 and 5 generate bending vibration and vibrate at a predetermined frequency. By outputting this predetermined frequency to the outside, it is possible to obtain the output of the predetermined frequency.

Here, the piezoelectric device 1 is a tuning fork type piezoelectric vibrating piece 2 as shown in the drawings because of the above-mentioned demand for miniaturization.
Using, the dimensions of FIG. 14A are set as follows, for example. In the figure, the total length a of the package 6 is 3.20 mm, the total width b of the package 6 is 1.50 mm,
The total length d of the piezoelectric vibrating piece 2 is 2.20 mm, and the distance c between the base 11 of the piezoelectric vibrating piece 2 and the inner wall of the package 6 is 0.1 m.
m, the tips of the vibrating arms 4 and 5 of the piezoelectric vibrating piece 2 and the package 6
The distance e from the inner wall is 0.1 mm.

The piezoelectric device 1 thus miniaturized
When bonding the piezoelectric vibrating reed 2 in the package 6, the conductive adhesives 7, 7 are applied on the electrode portions 3, 3 formed on the inner bottom of the package 6, as described above,
The base portion 11 of the piezoelectric vibrating reed 2 is placed on it, and is lightly pressed from above to spread the conductive adhesives 7, 7 under the base portion 11 and then cured.

However, there are the following problems in the work of joining and fixing the piezoelectric vibrating piece 2 as described above. FIG. 15 shows a region where the piezoelectric vibrating piece 2 is fixed,
It is a top view which expands and shows the upper part of the base 11 of the piezoelectric vibrating piece 2 in FIG. 14 (a). When the piezoelectric vibrating reed 2 is housed in the package 6 and is intended to be securely fixed, a relatively large amount of the conductive adhesive 7 is applied on the electrode portion 3, and the base portion 11 is placed on the conductive adhesive 7 to conduct the electric conduction. The adhesive agent 7 is cured. In the case of FIG. 15, the piezoelectric vibrating piece 2 contains a large amount of conductive adhesive 7.
Thus, there is an advantage that the piezoelectric device 1 is firmly fixed on the electrode part 3 and is not easily broken even when an external impact is applied to the piezoelectric device 1.

However, when a large amount of the conductive adhesive 7 is applied, it spreads laterally as shown in FIG. 15, and not only the entire base 11 but also the base 11 and the widened portion 12 near the base end of the vibrating arm 4. In some cases, the conductive adhesive 7 may wrap around to the notch 13 existing between and. Here, the notch 13 is provided so that the vibration from the vibrating arm 4 does not easily leak to the base 11, and the conductive adhesive 7 wraps around the notch 13 and vibrates as illustrated. Arm 4
When the conductive adhesive 7 is used to fix even a portion close to the position, the original function of the cutout portion 13 is impaired after fixing,
In some cases, the CI (crystal impedance) value may increase.

In order to avoid such a situation, the amount of the conductive adhesive 7 is limited, and for example, as shown by the hatched lines in FIG. 15, a range corresponding to the vicinity of the center of the base 11 is provided. When a small amount of the conductive adhesive 7 is applied on the electrode part 3 and the base part 11 is placed from above and lightly pressed,
In some cases, the state shown in 6 may occur.

That is, FIG. 16 shows the relationship between the bottom surface 11b of the base portion 11 of the piezoelectric vibrating piece 2 and the conductive adhesive agent 7. A small amount of the conductive adhesive agent 7 is pressed from above by the base portion 11. Also, since the amount is insufficient, the bottom surface 1 of the base 11 is
There is a case where it does not go around the entire 1b. In particular, FIG.
As shown in (b) and FIG. 15, both corners of the base 11 on the side of the end 11c are formed at right angles, so that the conductive adhesive 7 does not go around the corners. , A gap or notch 14 is formed. Since the gap 14 is not fixed by the conductive adhesive 7,
When an impact is applied to the piezoelectric device 1 from the outside, stress is concentrated and there is a risk that the device is broken.

The object of the present invention is to solve the above-mentioned problems, and even if the piezoelectric vibrating reed is firmly fixed even with a small size, the piezoelectric vibrating piece has excellent impact resistance. An object of the present invention is to provide a device, a mobile phone device and an electronic device using the device.

[0013]

The above-mentioned object is defined in claim 1.
According to another aspect of the invention, there is provided a piezoelectric device having a package in which a tuning-fork type piezoelectric vibrating piece is fixed in a cantilever manner and accommodated therein, and a lid body fixed to the package. The piezoelectric vibrating piece includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion, and both widthwise opposite ends of the base portion on the side opposite to the vibrating arms are curved or chamfered. It is achieved by a piezoelectric device which is said to be. According to the structure of claim 1, since both ends of the piezoelectric vibrating reed in the width direction on the side opposite to the vibrating arms of the base portion are curved or chamfered, corner portions are formed in the region of the bottom surface of the base portion. Does not exist.
Therefore, even when a relatively small amount of conductive adhesive is used, this adhesive adheres to the entire bottom surface of the base. For this reason, there is no gap on the bottom surface of the corner without the conductive adhesive attached.
The piezoelectric vibrating reed is firmly fixed because there is no place where stress is concentrated and a region that easily breaks is not formed. here,
The piezoelectric device broadly includes a piezoelectric element in which a piezoelectric vibrating piece is housed in a package such as a piezoelectric vibrator or a piezoelectric oscillator.

According to a second aspect of the present invention, in the structure of the first aspect, both widthwise end portions of the base portion on the side opposite to the vibrating arm are:
It is characterized in that it is formed in a curved shape including a part of an ellipse or an ellipse. According to the configuration of claim 2, since both ends in the width direction of the base portion of the piezoelectric vibrating reed opposite to the vibrating arm are formed in a curved shape including a part of an ellipse or an ellipse. In the same manner as in the above case, there is no corner at this location, and there is no gap where the conductive adhesive does not adhere.

According to a third aspect of the present invention, in the structure of the first or second aspect, the piezoelectric vibrating piece has a notch portion between a base end portion of the vibrating arm and the base portion. ,
The conductive adhesive applied between the bottom surface of the base portion of the piezoelectric vibrating piece and the electrode portion of the package is applied inside the cutout portion. Claim 3
According to the structure of claim 1, since the piezoelectric vibrating piece can be firmly fixed with a relatively small amount of the conductive adhesive according to the structure of claim 1 or 2, the conductive material can be made conductive without using a large amount of the conductive adhesive. Since the adhesive does not reach the notch,
An increase in the CI value can be effectively prevented without impeding the function of the cutout portion.

According to a fourth aspect of the present invention, in the structure according to any one of the first to third aspects, an opening is formed in the bottom of the package, and the opening is filled with a sealing material. According to the structure of claim 4, after mounting the piezoelectric vibrating reed in the package and sealingly fixing the lid, the lid is made of a transparent material, so that the lid is externally mounted. After irradiating with laser light through the piezoelectric vibrating piece, the metal coating for frequency adjustment provided on the piezoelectric vibrating piece is evaporated and the frequency is adjusted, and then the sealing material is pulled while the package is evacuated through the opening. Can be filled. That is, the package can be vacuum-sealed after the frequency is adjusted with the piezoelectric vibrating piece mounted.

Further, according to the invention of claim 5, the above object is to provide a package in which the tuning fork type piezoelectric vibrating reed is fixed in a cantilever manner and accommodated therein, and a lid fixed to the package. A piezoelectric device having a tuning fork type piezoelectric vibrating piece, and a base fixed to the package side,
Equipped with a pair of vibrating arms extending in parallel from this base,
This is achieved by a piezoelectric device in which at least both ends of the base in the width direction on the side opposite to the vibrating arm have an inward slope toward the bottom surface. According to the configuration of claim 5,
Since the bottom surfaces of both ends in the width direction of the base portion of the piezoelectric vibrating piece have an inwardly inclined bottom surface, the base portion is placed on the conductive adhesive. Even when used in a small amount, it wraps around along this slope, so there is no gap where the conductive adhesive does not adhere. For this reason,
Since no gap is created on the bottom of the corner without the conductive adhesive attached, there is no place where stress is concentrated due to external impact, and there is no area where breakage easily occurs. Is firmly fixed.

According to a sixth aspect of the present invention, in the configuration of the fifth aspect, the piezoelectric vibrating piece has a notch portion between a base end portion of the vibrating arm and the base portion, and the piezoelectric vibrating piece is provided. The conductive adhesive applied between the bottom surface of the base part and the electrode part of the package is applied inside the cutout part. According to the structure of claim 6, according to the structure of claim 5, the piezoelectric vibrating piece can be firmly fixed with a relatively small amount of the conductive adhesive, so that a large amount of the conductive adhesive is not used and the conductive Since the adhesive does not reach the notch, it is possible to effectively prevent the CI value from increasing without impeding the function of the notch.

According to a seventh aspect of the present invention, in the structure of the fifth or sixth aspect, an opening is formed in the bottom of the package, and the opening is filled with a sealing material.

Further, according to the invention of claim 8, the above object is to provide a package in which the tuning fork type piezoelectric vibrating piece is fixed in a cantilever manner and accommodated therein, and a lid body fixed to this package. And a tuning fork type piezoelectric vibrating piece, which includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion. This is achieved by a mobile phone device in which a clock signal for control is obtained by a piezoelectric device in which both ends in the width direction opposite to the vibrating arm are curved or chamfered.

Further, according to the invention of claim 9, the above-mentioned object is a package in which a tuning fork type piezoelectric vibrating reed is fixed in a cantilever manner and accommodated therein, and a lid body fixed to this package. An electronic device using a piezoelectric device having, wherein the tuning fork type piezoelectric vibrating piece includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion. This is achieved by an electronic device in which a width direction opposite to the vibrating arm in the width direction has a curved or chamfered piezoelectric device to obtain a control clock signal.

[0022]

1 shows a piezoelectric device according to a first embodiment of the present invention. FIG. 1 (a) is a schematic plan view thereof, and FIG. 1 (b) is shown in FIG. 1 (a). 3 is a schematic cross-sectional view taken along line AA of FIG. In these drawings, the piezoelectric device 30 shows an example in which a piezoelectric vibrator is configured.
Accommodates the piezoelectric vibrating piece 32 in a package 36. The package 36 is formed by stacking a plurality of substrates using, for example, an aluminum oxide sintered body obtained by molding and sintering a ceramic green sheet. By forming a predetermined hole inside each of the plurality of substrates, a predetermined internal space S is formed inside when stacked.

In the interior space S of the package 36 in the vicinity of the left end in the figure, the laminated substrate serving as a base which is exposed to the interior space S and constitutes the bottom, has electrode portions 31, 31 plated with Au and Ni. Are formed at a predetermined interval as shown in FIG. Electrode parts 31, 31
Is connected to the outside and supplies a drive voltage. A conductive adhesive 43, on each of the electrode portions 31, 31
43 is applied, the base 51 of the piezoelectric vibrating piece 32 is placed on the conductive adhesives 43, 43, and the conductive adhesives 43, 43 are hardened to be bonded.

In this embodiment, as will be described later, the piezoelectric vibrating reed 32 can be firmly fixed even if a relatively small amount of the conductive adhesives 43, 43 is used. An extraction electrode (not shown) for transmitting a drive voltage is provided on a portion of the base portion 51 of the piezoelectric vibrating piece 32 that comes into contact with the conductive adhesives 43, 43.
Thus, in the piezoelectric vibrating piece 32, the driving electrode described later has electrode portions 31, 3 on the package 36 side.
1 and electrically conductive adhesives 43, 43, and electrically connected.

The piezoelectric vibrating reed 32 is made of, for example, crystal, and other than crystal, a piezoelectric material such as lithium tantalate or lithium niobate can be used. In the case of the present embodiment, the piezoelectric vibrating piece 32 is formed in a small size, and has a shape shown in the drawing in order to obtain required performance. That is, the piezoelectric vibrating piece 32 is formed so that the base portion 51 fixed to the package 36 side as described later and the one end portion of the base portion 51 are preferably partially narrowed from both sides to be constricted. Notch 53 provided in the
53 and widened portions 52, 52 which are regions formed wider than the cutout portions 53, 53. further,
The piezoelectric vibrating piece 32 is provided with a pair of vibrating arms 34 and 35 which are divided into two forks and extend in parallel toward the right side in the drawing with the widened portions 52 and 52 as the base ends, and the whole is like a tuning fork. A so-called tuning fork type piezoelectric vibrating piece having a shape is used. Accordingly, particularly in the piezoelectric vibrating piece 32 of this embodiment, the vibration of the pair of vibrating arms 34 and 35 is prevented from leaking into the base portion 51 on the fixed side as much as possible. , Is configured to reduce the CI value as much as possible.

A lid 39 is joined to the open upper end of the package 36 through a brazing material 33 such as low melting point glass to seal the package 36. The lid 39 is formed of a material that transmits light, for example, glass, in order to adjust the frequency described later.

Further, near the center of the bottom surface of the package 36, the openings 37 are provided by forming through holes 37a and 37b continuous with the two laminated substrates (not shown) constituting the package 36. ing. Of the two through holes that form the opening 37, the outer through hole 37b that is the second hole has a larger inner diameter than the first hole 37a that opens inside the package. . As a result, the opening 37 is a stepped opening,
Preferably, the stepped portion of the through hole 37b which is the second hole and the hole inner peripheral surface of the through hole 37a are coated with metal. By filling the opening 37 with the metal sealing material 38,
After fixing the lid 39 to the package 36, the package 36 can be sealed. Examples of the metal sealing material 38 filled in the opening 37 include gold (Au) and tin (S).
n) is used, and the step portion of the second hole 37a is used,
For the metal-coated portion on the inner peripheral surface of the hole, a configuration in which a gold-plated underlayer is plated with nickel is suitable.

Further, in this embodiment, the package 3
In the lowermost layer substrate of the laminated substrate constituting No. 6, a recess 42 corresponding to the thickness of this laminated substrate is formed by forming a hole in the vicinity of the right end in the figure. This recess 4
2 is located below the free end 32b of the piezoelectric vibrating piece 32. This effectively prevents the free end 32b of the piezoelectric vibrating piece 32 from abutting against the inner bottom surface of the package 36 when the free end 32b of the piezoelectric vibrating piece 32 is swung in the direction of the arrow when an external impact is applied to the package 36. .

Next, the piezoelectric vibrating piece 32 in the present embodiment.
The configuration of the base portion 51 will be described in detail. 2 is shown in FIG.
The part B of (a) is expanded and shown. In the figure, at the end portion 51a of the base portion 51 of the piezoelectric vibrating piece 32, both width direction end portions 57, 57 are curved. This curved portion is indicated by reference numeral 5 in FIG.
As indicated by reference numerals 7 and 57, both ends in the width direction of the base portion 51 correspond to the ends in the length direction.

Therefore, there is no sharp corner or right angled corners at both ends in the length direction of the base 51 and at both ends in the width direction. For this reason, as shown in FIG. 3, even when a relatively small amount of the conductive adhesive 43 is used, the conductive adhesive 43 does not contact the bottom surface 51 b of the base 51.
Adheres to the entire surface of. As a result, since the conductive adhesive 43 is not attached and no gap is formed on the bottom surface of the corner, there is no area where stress is concentrated due to an external impact, and a region which is easily broken is not formed. The piezoelectric vibrating piece 32 is firmly fixed.

Also, with a relatively small amount of conductive adhesive 43,
Since the piezoelectric vibrating piece 32 can be firmly fixed, a large amount of the conductive adhesive 43 is not used, and the conductive adhesive 43 does not reach the cutout portion 53 of the piezoelectric vibrating piece 32. C without impairing the function of the part 53
It is possible to effectively prevent an increase in the I value.

FIG. 4 is a schematic plan view showing a second embodiment of the piezoelectric device of the present invention. In the figure, the portions denoted by the same reference numerals as those in the first embodiment have the same configuration, and therefore, duplicate description will be omitted and different points will be mainly described.

The piezoelectric device 60 according to the second embodiment.
Except for the shape of the base portion 51 of the piezoelectric vibrating piece 32, all are the first
The configuration is the same as that of the above embodiment. FIG. 5 is an enlarged view of the portion C of FIG. As shown in the drawing, at the end in the length direction of the base portion 51, and at the both ends in the width direction (one end is shown in FIG. 5, the other end has the same structure).
56 is linearly and diagonally chamfered.

Therefore, also in the case of the second embodiment, there is no sharp corner or right-angled corners at both ends in the length direction of the base 51 and at both ends in the width direction. Therefore, as in the case described with reference to FIG. 3, even when a relatively small amount of the conductive adhesive 43 is used, the conductive adhesive 43 adheres to the entire bottom surface of the base 51. As a result, since the conductive adhesive 43 does not adhere to form a gap in the bottom surface of the corner, it receives an impact from the outside,
The piezoelectric vibrating reed 32 is firmly fixed because there is no place where stress is concentrated and a region that easily breaks is not formed.

FIG. 6 is a schematic plan view showing a third embodiment of the piezoelectric device of the present invention. In the figure, the portions denoted by the same reference numerals as those in the first embodiment have the same configuration, and therefore, duplicate description will be omitted and different points will be mainly described.

In the piezoelectric device 70 according to the third embodiment, the shape of the package 76 is slightly longer than that of the package 36 of the first embodiment, and the piezoelectric vibrating piece 32.
The configuration is the same as that of the first embodiment except for the shape of the base 51. FIG. 7 is an enlarged view of the portion D of FIG. As shown in the drawing, both side surfaces 71 including the end portion in the length direction of the base portion 51 and also the both end portions in the width direction (one end portion is shown in FIG. 7, and the other end portion has the same structure) 71
Is formed in a curved shape including a part of an ellipse or an ellipse.

Therefore, also in the case of the third embodiment, both side surfaces 71, 71 at both ends in the lengthwise direction of the base 51 and including both ends in the widthwise direction have corners protruding in an acute angle or a right angle. Does not exist. Therefore, as in the case described with reference to FIG. 3, even when a relatively small amount of the conductive adhesive 43 is used, the conductive adhesive 43 adheres to the entire bottom surface of the base 51. As a result, since the conductive adhesive 43 is not attached and no gap is formed on the bottom surface of the corner, there is no area where stress is concentrated due to an external impact, and a region which is easily broken is not formed. The piezoelectric vibrating piece 32 is firmly fixed.

FIG. 8 is a schematic plan view showing a fourth embodiment of the piezoelectric device of the present invention. In the figure, the portions denoted by the same reference numerals as those in the first embodiment have the same configuration, and therefore, duplicate description will be omitted and different points will be mainly described.

In the piezoelectric device 80 according to the fourth embodiment, except for the shape of the base portion 51 of the piezoelectric vibrating piece 32, the piezoelectric device 80 has the first shape.
The configuration is the same as that of the above embodiment. FIG. 9 is an enlarged view of the portion E of FIG. As shown in the drawing, at the end in the length direction of the base portion 51 and at the both ends in the width direction (in FIG. 9, one end is shown, and the other end has the same structure).
81 has a shape shown in FIG.

FIG. 10 is a partially enlarged perspective view of the base 51 with the bottom surface 51b facing upward so that the shapes of the both widthwise end portions 81, 81 can be clearly seen. As shown in the figure, both widthwise end portions 81, 81 of the base portion 51 have an inclined surface 82 having an inward inclination toward the bottom surface.
82 is provided. Here, the inclined surfaces 82 and 8 of FIG.
As shown in the drawing, the reference numeral 2 may be a flat inclined surface, or may be a curved surface slightly protruding outward or slightly concave inside.

This embodiment is configured as described above, and the base 51 is placed on the conductive adhesive 43 as shown in the partial cross-sectional view taken along the line aa in FIG. do it,
When lightly pressed, the conductive adhesive 43 wraps around the inclined surfaces 82, 82 even when a relatively small amount is used, so that there is no gap where the conductive adhesive 43 does not adhere. As a result, since the conductive adhesive 43 is not attached and no gap is formed on the bottom surface of the corner, there is no area where stress is concentrated due to an external impact, and a region which is easily broken is not formed. The piezoelectric vibrating piece 32 is firmly fixed.

FIG. 12 is a schematic sectional view showing the configuration of the fifth embodiment of the piezoelectric device of the present invention. In the figure, the piezoelectric device 90 shows an example in which a piezoelectric oscillator is formed by using the piezoelectric vibrating piece 32, and the portions denoted by the same reference numerals as those in the first embodiment have the same configuration.
A duplicate description will be omitted, and the description will focus on the differences.

In the package 91 of the piezoelectric device 90,
A recess 92 is formed near the center, and an electrode (not shown) is provided on the inner bottom of the recess 92. An integrated circuit 93 is mounted on this electrode, and the integrated circuit 93 is
A predetermined frequency dividing circuit or the like is configured and is electrically connected to the drive electrode of the piezoelectric vibrating piece 32, and the drive voltage output from the integrated circuit 93 is applied to the piezoelectric vibrating piece 32. In addition, the same configuration as that portion in the first to fourth embodiments is selectively used for the end portion in the length direction of the base portion 51 of the piezoelectric vibrating piece 32 and for the both end portions 94, 94 in the width direction. Has been adopted by.

The present embodiment is configured as described above, and also in the piezoelectric device 90 which is a piezoelectric oscillator, as in the first to fourth embodiments, on the bottom surface of the base 51 of the piezoelectric device 32. , Conductive adhesive 43
Since no gaps are formed on the bottom surface of the corners without adhering to each other, there is no place where stress is concentrated due to an external impact, and a region that is easily broken is not formed. Fixed.

FIG. 13 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention. In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice are provided, and further, an integrated circuit or the like as a control unit connected to a modulation and demodulation unit of a transmission / reception signal. Controller 3
It is equipped with 01. The controller 301 includes an information input / output unit 302 including an LCD as an image display unit and operation keys for inputting information, in addition to modulation and demodulation of transmission / reception signals.
Alternatively, it controls the information storage means 303 including a RAM and a ROM. Therefore, the controller 30
1, a piezoelectric device 30 is attached, and its output frequency is used as a clock signal suitable for the control content by a predetermined frequency dividing circuit (not shown) built in the controller 301. . The piezoelectric device 30 attached to the controller 301 is not limited to the piezoelectric device 30 alone, but may be the piezoelectric device 60 as shown in FIG. 12, which is an oscillator in which the piezoelectric device 30 and a predetermined frequency dividing circuit are combined. Good.

The controller 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to a transmitter 307 and a receiver 306. As a result, even if the basic clock from the controller 301 changes when the environmental temperature changes,
The transmitter 3 is modified by the temperature-compensated crystal oscillator 305.
07 and the receiving unit 306.

As described above, by using the piezoelectric device according to the above-described embodiment in the electronic device such as the portable telephone device 300 having the control unit, the piezoelectric vibrating piece of the piezoelectric device is firmly fixed. Therefore, it is possible to provide excellent shock resistance as the entire device.

The invention is not limited to the embodiments described above.
Various configurations other than the above-described configurations are adopted as the configuration of the end portion in the length direction of the base portion 51 of the piezoelectric vibrating piece 32 and the both end portions in the width direction as long as the conductive adhesive can be wrapped around. it can. Further, the respective configurations of the respective embodiments can be appropriately combined or omitted, and can be combined with other configurations not shown.

[0049]

As described above, according to the present invention, a piezoelectric device having excellent shock resistance by firmly fixing the piezoelectric vibrating piece even if it is made compact, and this device are provided. It is possible to provide a mobile phone device and an electronic device that are used.

[Brief description of drawings]

FIG. 1 shows a first embodiment of a piezoelectric device of the present invention, (a) is a schematic plan view thereof, and (b) is FIG. 1 (a).
A-A line schematic sectional view.

FIG. 2 is an enlarged view of a portion B of FIG.

3 is a schematic cross-sectional view showing the vicinity of the bottom surface of both ends in the width direction of the base portion of the piezoelectric vibrating piece of the piezoelectric device of FIG.

FIG. 4 is a schematic plan view of a second embodiment of the piezoelectric device of the present invention.

5 is an enlarged view of a portion C of FIG.

FIG. 6 is a schematic plan view of a third embodiment of the piezoelectric device of the present invention.

FIG. 7 is an enlarged view of a portion D of FIG.

FIG. 8 is a schematic plan view of a piezoelectric device according to a fourth embodiment of the invention.

9 is an enlarged view of a portion E of FIG.

10 is a partial schematic perspective view showing the shape near the bottom surface of the base portion of the piezoelectric vibrating piece of the piezoelectric device shown in FIG.

11 is a partial cross-sectional view taken along the line aa of FIG.

FIG. 12 is a schematic cross-sectional view showing the configuration of a fifth embodiment of the piezoelectric device of the present invention.

FIG. 13 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to each embodiment of the present invention.

14A and 14B show a configuration of a prototype example of a microminiature piezoelectric device, in which FIG. 14A is a schematic plan view thereof, and FIG.
The enlarged view of the part A of 4 (a).

FIG. 15 is an explanatory view showing a state in which the piezoelectric vibrating piece of the piezoelectric device of FIG. 14 is bonded.

16 is a partial cross-sectional view showing how the piezoelectric vibrating reed of the piezoelectric device of FIG. 14 is bonded near the bottom of the base.

[Explanation of symbols]

30, 60, 70, 80, 90 Piezoelectric device 32 Piezoelectric vibrating piece 51 base 51a end 36,76 package 37 opening 38 Sealant 39 Lid 42 recess

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5J079 AA02 AA04 BA49 FA01 HA03                       HA07 HA09 HA16 HA25 HA29                       KA01 KA05                 5J108 BB02 BB04 CC06 CC08 EE03                       EE04 EE07 EE18 FF11 FF14                       GG03 GG09 GG16 GG17 JJ04

Claims (9)

[Claims] 1. A piezoelectric device having a package in which a tuning fork type piezoelectric vibrating reed is fixed in a cantilever manner and accommodated therein, and a lid body fixed to the package, wherein the tuning fork type piezoelectric vibrating piece is provided. The vibrating piece includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion, and both widthwise opposite ends of the base portion on the side opposite to the vibrating arms are curved or chamfered. Is characterized by
Piezoelectric device. 2. The piezoelectric element according to claim 1, wherein both end portions in the width direction of the base portion on the side opposite to the vibrating arm are formed in a curved shape including a part of an ellipse or an ellipse. device. 3. The piezoelectric vibrating piece has a cutout portion between the base end portion of the vibrating arm and the base portion, and a bottom surface of the base portion of the piezoelectric vibrating piece and an electrode portion of the package are formed. The conductive adhesive applied in between is applied to the inside of the cutout portion.
Or the piezoelectric device according to any one of 2). 4. The piezoelectric device according to claim 1, wherein an opening is formed at the bottom of the package and the opening is filled with a sealing material. 5. A piezoelectric device having a package in which a tuning-fork type piezoelectric vibrating piece is fixed in a cantilever manner and accommodated therein, and a lid body fixed to the package. The vibrating piece includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion, and at least both widthwise end portions of the base portion on the opposite side of the vibrating arm are directed toward the bottom surface. A piezoelectric device characterized by having an inwardly directed slope. 6. The piezoelectric vibrating piece has a cutout portion between the base end portion of the vibrating arm and the base portion, and a bottom surface of the base portion of the piezoelectric vibrating piece and an electrode portion of the package are formed. The conductive adhesive applied in between is applied to the inner side of the cutout portion.
The piezoelectric device according to. 7. The piezoelectric device according to claim 5, wherein an opening is formed at the bottom of the package, and the opening is filled with a sealing material. 8. A mobile phone device using a piezoelectric device having a package in which a tuning fork type piezoelectric vibrating reed is fixed in a cantilever manner and accommodated therein, and a lid fixed to the package. The tuning fork type piezoelectric vibrating piece includes a base portion fixed to the package side and a pair of vibrating arms extending in parallel from the base portion, and the width direction both end portions of the base portion on the opposite side to the vibrating arm are provided. A cellular phone device, wherein a clock signal for control is obtained by a curved or chamfered piezoelectric device. 9. An electronic apparatus using a piezoelectric device having a package in which a tuning fork type piezoelectric vibrating reed is fixed in a cantilever manner and accommodated therein, and a lid body fixed to the package, The tuning-fork type piezoelectric vibrating piece includes a base portion fixed to the package side, and a pair of vibrating arms extending in parallel from the base portion, and both widthwise end portions of the base portion on the opposite side to the vibrating arm, An electronic device, wherein a clock signal for control is obtained by a curved or chamfered piezoelectric device.