JP2007146219A - Vacuum vapor deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus capable of performing the vapor deposition of a plurality of dissimilar materials on a member for vapor deposition at a uniform component ratio by moving at least one of the member for vapor deposition and an evaporation source straight. <P>SOLUTION: The vacuum vapor deposition apparatus is provided with: an evaporation device 12 for heating and vaporizing first and second dissimilar vapor deposition materials; a glass substrate 13 for performing the vapor deposition of the first and second evaporation material vaporized from the evaporation device 12 in a vacuum vapor deposition container 11; and a substrate holding and moving device for moving the glass substrate 13 in the x direction. The evaporation device 12 has nozzle sets 25A, 25B arranging a first nozzle cylinder 25a and a second nozzle cylinder 25b close to each other which emit the first and second evaporation materials toward the glass substrate 13 after diffusing the first and second evaporation materials introduced from the evaporation units 21A, 21B by first and second diffusion containers 23A, 23B, and the nozzle sets 25A, 25B are arranged in line in the crossing direction orthogonal to the moving direction of the glass substrate 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a vacuum deposition apparatus that deposits a plurality of different materials heated and vaporized by an evaporation apparatus on the deposition member while moving at least one of the deposition target member and the evaporation apparatus in a linear direction.

  2. Description of the Related Art Conventionally, a film forming apparatus that manufactures an organic EL display by moving a substrate, which is a member to be deposited, in a linear direction, discharging a material from an opening arranged along a line direction orthogonal to the moving direction, and depositing the material. It is disclosed in Patent Document 1.

  The basic structure of the organic EL display is such that a hole transport layer, a light emitting layer, and a cathode are sequentially disposed on an anode (transparent electrode) disposed on a glass substrate, and at least the light emitting layer is formed by depositing an organic material. It is formed by.

  Generally, when a thin film is formed on a glass substrate by vapor deposition, an organic material evaporation source is placed in a vacuum vessel, the evaporation source is heated in a vacuum state, and the vapor is also placed in the vacuum vessel. A thin film is formed by adhering to the surface of the substrate.

  When the organic material is vapor-deposited, a dopant material that is a trace addition component may be mixed with a host material that is a main component. In this case, two different materials are mixed in different proportions and at a uniform component amount ratio. It needs to be deposited on top.

As described above, as an apparatus and method for depositing a plurality of different materials, as shown in Patent Document 2, two cells are arranged at a lower position facing a member to be deposited in a vacuum chamber, and each cell is discharged. There is one in which different materials are discharged from the holes. Further, as shown in Patent Documents 3 and 4, there are materials in which materials generated by separately provided evaporation sources are mixed and discharged in a mixing chamber.
JP2004-269948 JP 2003-297565 A JP2002-30418 JP2003-155555A

  By the way, it is known that the deposited film thickness deposited on the deposition target member shows a distribution according to a so-called cosine law. However, as shown in Patent Document 2, different materials are put in different cell chambers and deposited at the same time. In such a case, in the film thickness distribution according to the cosine law of the material released from the discharge holes at the distant positions, the component amount ratio does not become constant depending on the part, so the quality cannot be said to be constant.

  That is, as shown in FIG. 12, when the structure of Patent Document 2 is applied to Patent Document 1 and vapor deposition is performed on the substrate 3 that moves linearly, the evaporation apparatus 1 for the host material is arranged at the front in the moving direction of the substrate 3. If the evaporation apparatus 2 for dopant material is disposed at the rear of the movement direction of the substrate 3 and vapor deposition is performed, even if the component amount ratios of different materials in the entire vapor deposition film formed on the substrate 3 are equal, The component ratio of the host material deposited first is large on the substrate side of the film thickness, and the component ratio of the dopant material deposited next is large on the surface side of the film thickness. There is a problem that it becomes uniform. In addition, the curve shown between the straight lines which show the discharge | release range of the evaporators 1 and 2 in FIG. 12 is an evaporation flow distribution curve.

  In order to solve this problem, as shown in FIG. 13, a plurality of deposition prevention plates 4 are arranged to control the evaporation of the material, but this does not change the evaporation flow distribution itself of each material. Since the material of the portion blocked by the deposition preventing plate 4 does not adhere to the substrate 3, there arises a problem that the utilization efficiency of the material is lowered.

  Furthermore, as shown in Patent Documents 3 and 4, the material after mixing is discharged from a large number of discharge holes, thereby shortening the distance between the deposition target member and the discharge holes and reducing the utilization efficiency of the material. Although it is easy to make the component amount ratio uniform, when different materials are released after mixing, it becomes difficult to handle different materials having different temperature differences.

  This is because the organic material for manufacturing the display part of the organic EL display has low stability, and the dissociation temperature (higher than the evaporation temperature) at which the dissociation material loses its performance due to the dissimilar evaporation temperature differs. to cause. That is, when different materials are heated independently in the crucible, it is only necessary to set the temperature to be equal to or higher than the evaporation temperature and lower than the decomposition temperature, but there are relatively few restrictions. It is necessary to prevent the material from being deteriorated due to vapor deposition and decomposition by maintaining it at a temperature equal to or higher than all the evaporation temperatures of the materials mixed in the process, and there are more restrictions than when individually heating with a crucible. Become.

  Some products such as organic EL displays are on the market, but it is not an established field. Especially, what kind of materials may appear in the future, and there are restrictions due to evaporation temperature and decomposition temperature. A configuration in which the apparatus receives a large amount is not desirable.

  The present invention solves the above-described problems, and when vapor deposition is performed on a member to be vapor-deposited by relatively moving the member to be vapor-deposited and the evaporation source, vacuum deposition can be performed on the member to be vapor-deposited at a uniform component amount ratio. An object is to provide an apparatus.

  The invention according to claim 1 is a plurality of evaporation devices for heating and vaporizing different kinds of vapor deposition materials, a member to be vapor deposited for vaporizing a plurality of evaporation materials vaporized from the evaporation device in a vacuum vapor deposition container, An evaporation device and a moving device for moving at least one of the members to be deposited in a linear direction, a plurality of evaporation units for heating and evaporating different kinds of vapor deposition materials to the evaporation device, and introducing from each of the evaporation units A plurality of diffusing portions for diffusing the evaporated material, and a nozzle group that is provided in each of the diffusing portions and discharges the evaporated material toward the deposition target member. The nozzle set includes a plurality of nozzles that are disposed close to each other, and the nozzle set is arranged in a line in a direction crossing the moving direction of the moving device.

  According to a second aspect of the present invention, in the first aspect of the present invention, each nozzle set is configured such that nozzles that discharge different kinds of evaporation materials are arranged in front and rear positions in the moving direction of the moving device.

  According to a third aspect of the present invention, in the first aspect of the present invention, each nozzle set includes nozzles that discharge different kinds of evaporation materials at front and rear positions in a direction transverse to the moving direction of the moving device. is there.

According to a fourth aspect of the present invention, in the first aspect of the present invention, each nozzle set includes nozzles that discharge different kinds of evaporation materials from adjacent nozzle sets at staggered positions.
According to a fifth aspect of the present invention, in the first aspect of the invention, each nozzle set is arranged on the center side and the outer peripheral side so that the nozzles that discharge different kinds of evaporation materials are fitted on the same axis. It is a thing.

  According to the first aspect of the present invention, the nozzle set in which the nozzles that discharge different kinds of evaporation materials are arranged close to each other is arranged in a line shape in a direction crossing the moving direction by the moving device, so that the different kinds discharged from the nozzles. The evaporation flow distributions of the evaporation materials substantially overlap, so that different evaporation materials can be deposited on the deposition target member with a uniform component amount ratio. In addition, since different kinds of evaporation materials are introduced from the evaporation source to the plurality of nozzles via the diffusing portion, it is possible to discharge uniformly and form a vapor deposition film having a uniform thickness.

  According to the third aspect of the present invention, in each nozzle set, the nozzles that discharge different kinds of evaporation materials are arranged in a staggered position, so that the evaporation flows of different kinds of evaporation materials can be further mixed, and a more uniform component amount can be obtained. A vapor deposition film having a specific ratio can be formed.

  According to the fifth aspect of the present invention, the nozzles that discharge different kinds of evaporation materials are arranged in the same axial center in each nozzle set, so that the evaporation flows of the different kinds of evaporation materials overlap, and the different kinds of materials in the vapor deposition film overlap. The component amount ratio can be made more uniform.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Embodiment 1]
A first embodiment of a vacuum evaporation apparatus will be described with reference to FIGS.

  As shown in FIGS. 1-3, this vacuum evaporation apparatus manufactures the display part of an organic electroluminescent display, for example, In the evaporation chamber 11a of the vacuum evaporation container 11, for example, two types of vapor deposition materials are made into a glass substrate ( Vapor deposition is performed on the vapor deposition member 13. Here, of the two types of vapor deposition materials, the host material which is the main component of the two types is referred to as the first vapor deposition material A, and the doping material which is the trace addition component is referred to as the second vapor deposition material B. The materials obtained by heating and evaporating A and B are referred to as a first evaporation material and a second evaporation material, respectively.

  The vacuum deposition apparatus includes a vacuum deposition container 11 that is connected to a vacuum pump (not shown) to form a deposition chamber 11a, and an evaporation apparatus 12 that heats and vaporizes the first and second deposition materials A and B, respectively. And a substrate holding and moving device (moving device) 14 that holds the glass substrate 13 at a constant height via a plurality of holding rollers 14a and moves the glass substrate 13 at a predetermined speed along a horizontal moving direction (hereinafter referred to as x direction) is doing.

  The evaporation device 12 is provided outside at a lower portion of the vacuum evaporation container 11 and heats and vaporizes the first evaporation part (evaporation part) 21A for heating and vaporizing the first evaporation material A and the second evaporation material B. An evaporating section (evaporating section) 21B, and first and second induction pipes 22A and 22B for introducing the first and second evaporating materials evaporated from the first and second evaporating sections 21A and 21B into the vapor deposition chamber 11a, respectively. And a discharge portion 23 provided in the vapor deposition chamber 11a for discharging the first and second evaporation materials toward the glass substrate 13, respectively. The first and second guide tubes 22A and 22B are provided with vacuum vapor deposition. First and second flow rate control valves 24A and 24B for adjusting the flow rates of the first and second evaporation materials are interposed outside the container 11, respectively.

  The first evaporator 21A and the second evaporator 21B include cells (crucibles) 21a and 21a for storing the first and second vapor deposition materials A and B, respectively, and the first and first cells accommodated in the cells 21a and 21a. (2) Heating devices 21b and 21b for heating and vaporizing the vapor deposition materials A and B are provided.

  The discharge part 23 includes a first diffusion container (diffusion part) 23A and a second diffusion container (diffusion part) 23B arranged with a predetermined gap in two upper and lower stages, and a plurality of nozzle sets 25A and 25B. And a nozzle group 25 having the same. The first and second diffusion containers 23A and 23B have a horizontally long box shape, and are arranged along a transverse direction (hereinafter referred to as y direction) orthogonal to the x direction. A diffusion space (also referred to as a buffer space) for uniformly dispersing the first evaporation material is formed in the first diffusion container 23A, and a first guide pipe 22A penetrating the second diffusion container 23B is connected thereto. Further, a diffusion space (also referred to as a buffer space) for uniformly dispersing the second evaporation material is formed in the second diffusion container 23B, and a second guide tube 22B is further connected.

  As shown in FIG. 4, the nozzle group 25 includes a plurality of nozzle sets 25A and 25B arranged in a line at predetermined intervals t along the y direction, and each nozzle set 25A and 25B is a first diffusion. A first nozzle cylinder (nozzle) 25a protruding at a predetermined position on the upper surface of the container 23A and a second nozzle cylinder (nozzle) 25b protruding at a predetermined position of the second diffusion container 23B are close to each other in the x direction. Is arranged. The first nozzle set 25A and the second nozzle set 25B are alternately arranged in the y direction, and the first nozzle cylinder 25a and the second nozzle cylinder 25b are arranged in opposite positions, and the first nozzle cylinder 25a as a whole The second nozzle cylinders 25b are arranged in a so-called staggered pattern.

  Here, “adjacent arrangement” means a state in which the first nozzle cylinder 25a and the second nozzle cylinder 25b are arranged with a predetermined gap δ (for example, about 15 mm or less) shown in FIG. Shall be included.

  The first nozzle cylinder 25a protrudes from the upper surface of the first diffusion container 23A, and the second nozzle cylinder 25b has a base end connected to the upper surface of the second diffusion container 23B and a distal end at the first diffusion container. As shown in FIG. 11 (a), the first nozzle cylinder 25a of the first diffusion container 23A disposed at the upper part is inserted into the through hole of 23A through the heat insulating member and protruded from the upper surface thereof. Instead of the shape, a nozzle port (nozzle) 25a ′ opened in the upper surface plate of the first diffusion container 23A may be used.

  The substrate holding and moving device 14 employs, for example, a roller-driven linear moving mechanism shown in the figure, and holds both side portions of the glass substrate 13 from below by holding rollers 14a arranged at predetermined intervals in the x direction. The glass substrate 13 is moved in the x direction at a predetermined speed by rotating the holding roller 14a by a driving device (not shown). In addition to the roller drive type, other known linear movement mechanisms such as a screw shaft type and a rack and pinion type may be employed.

  Each of the first and second diffusion containers 23A and 23B is provided with a heater (not shown) for preventing cooling and adhesion of the first and second evaporation materials. A heat insulating cover (not shown) is provided which covers the first and second diffusion containers 23A and 23B and has openings formed at corresponding positions of the first and second nozzle cylinders 25a and 25b. Further, a cooling plate (not shown) can be provided on the heat insulating cover to effectively dissipate radiant heat.

  The vacuum deposition apparatus is provided with a film thickness control device 26 that adjusts the film thickness deposited on the glass substrate 13 as shown in FIG. The film thickness control device 26 detects the detection signal of the film thickness sensor 27 disposed above the nozzle group 25 in the vacuum vapor deposition chamber 11 and the first and second evaporation units 21A and 21B at the start of the vapor deposition operation. When a certain amount of evaporation is detected based on the detection signals of the temperature sensors 28A and 28B installed in the cells 21a and 21a, the heating devices 21b and 21b of the first and second evaporators 21A and 21B are kept at a constant temperature. The first and second flow rate control valves 24A and 24B are opened at a predetermined opening degree while the glass substrate 13 is held at a predetermined speed, and the glass substrate 13 is moved at a predetermined speed by the substrate holding and moving device driving unit 14b to deposit on the glass substrate 13. A film is formed. Further, when controlling the film thickness, the temperature of the cells 21a, 21a is kept constant, and the film thickness can be controlled uniformly by controlling the evaporation flow rate by the first and second flow control valves 24A, 24B. .

  In the first embodiment, as shown in FIGS. 4 and 5, when the deposition distance H from the first and second nozzle cylinders 25a, 25b to the glass substrate 13 is determined, the upstream side (downstream side) in the x direction. ) From the first and second nozzle cylinders 25a and 25b to the movement start point (movement end point) of the front side (rear side) of the glass substrate 13 is determined. Also, the distance between the nozzle cylinder and the substrate side from the first and second nozzle cylinders 25a and 25b of the outermost first and second nozzle sets 25A and 25B in the y direction to both sides of the glass substrate 13: y0 is also sufficient. Determined long. Here, x0 ≧ y0 is set, but the central portion of the glass substrate 13, the front and rear side portions, and the left and right side portions in the moving direction may be appropriately set so that the film thickness is uniform. The nozzle cylinder-substrate side distance: y0 is such that the interval (pitch) between the nozzle sets 25A and 25B in y0 arranged in a line is smaller than the central portion, or the first and second nozzle cylinders 25a in y0. , 25b can be shortened as appropriate by increasing the diameter.

  Here, when the diameters of the first and second nozzle cylinders 25a and 25b of each nozzle set 25 are set to be the same and x0 ≧ y0, the film thickness uniformity is ± 5 at an evaporation rate of 10 Å / sec. %.

  In the above configuration, the cell 21a is heated by the heating device 21b in the first evaporation section 21A to vaporize the first vapor deposition material A, and the vaporized first evaporation material diffuses from the first induction tube 22A to the first diffusion container 23A. It is introduced into the space and uniformly dispersed, and the first evaporation material is further discharged upward from the first diffusion container 23A through the first nozzle cylinder 25a. In addition, the cell 21a is heated by the heating device 21b in the second evaporation section 21B to vaporize the second vapor deposition material B, and the vaporized second evaporation material B enters the diffusion space of the second diffusion container 23B from the second induction tube 22B. Introduced and uniformly dispersed, the second evaporation material is further discharged upward from the second diffusion container 23B through the second nozzle cylinder 25b. Then, both the first evaporation material released from the first nozzle cylinder 25a and the second evaporation material released from the second nozzle cylinder 25b are deposited on the glass substrate 13 moved by the substrate holding and moving device 14, respectively. .

  According to the first embodiment, the first and second nozzle cylinders in which the first and second evaporation materials uniformly dispersed in the first and second diffusion containers 23A and 23B in the evaporator 12 are arranged in proximity to each other. 25a and 25b are emitted toward the glass substrate 13, respectively. As a result, the respective evaporative flows spread in a substantially overlapping state according to the cosine law, and the first and second nozzle sets 25A and 25B having the second nozzle cylinders 25a and 25b are arranged in a line in the y direction. A vapor deposition film having a uniform component amount ratio can be formed on the entire glass substrate 13 moved in the x direction.

  In addition, since the first and second nozzle cylinders 25a and 25b of the first and second nozzle sets 25A and 25B arranged in a line are arranged in a staggered manner, there is no unevenness in the component amount ratio in the film thickness direction. A vapor-deposited film can be formed.

In addition, as shown to Fig.6 (a), the staggered arrangement | positioning which the 1st, 2nd nozzle cylinder 25a, 25b of each nozzle set 25E shifted in the y direction may be sufficient.
In addition, as shown in FIG. 6B, the first and second nozzle cylinders 25a and 25b are not arranged in a staggered manner, but the first and second nozzle cylinders 25a and 25D of the first and second nozzle groups 25C and 25D are arranged. 25b may be arranged in a state of being substantially in contact with the y direction, and the first and second nozzle sets 25C and 25D may be arranged in a line at a predetermined interval t ′ along the y direction. Here, the first nozzle set 25C and the second nozzle set 25D are arranged so that the positions of the first and second nozzle cylinders 25a and 25b are reversed in the y direction, and the first nozzle cylinder 25a is on the inner side. The first nozzle set 25C is arranged on one side of the center line CL in the y direction, and the second nozzle set 25D is arranged on the other side.

[Embodiment 2]
In the second embodiment, the first and second nozzle cylinders 25a and 25b of the first and second nozzle sets 25A and 25B in the first embodiment are formed as double tube nozzles fitted concentrically. This will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  That is, as shown in FIGS. 7 to 9, all the nozzle sets 35 </ b> A in the nozzle group 35 include a first nozzle cylinder (nozzle) 35 a protruding from the upper plate of the first diffusion container 23 </ b> A and the second diffusion container. A second nozzle cylinder (nozzle) 35b which is inserted through a heat insulating member (not shown) into the vertical through hole 23a of the first diffusion container 23A from 23B and protrudes on the first diffusion container 23A, and the second The nozzle cylinder 35b is arranged on the same axis in the first nozzle cylinder 35a to form a double pipe nozzle, and is arranged on the first diffusion container 23A in a line shape along the y direction at a predetermined pitch. Yes.

Of course, as shown in FIG. 11 (b), the first nozzle cylinder 35a may be a first nozzle opening (nozzle) 35a 'opened in the upper plate of the first diffusion container 23A without forming the first nozzle cylinder 35a. .
According to the second embodiment, the plurality of nozzle groups 35 arranged in a line in a direction orthogonal to the moving direction of the glass substrate 13 are used as the second nozzle cylinder 35b that discharges the second evaporation material from each nozzle set 35A. The first nozzle cylinder 35a that discharges the first evaporating material is formed on the outer periphery of the double tube nozzle so as to be fitted on the same axis, so that the evaporating flows of the first and second evaporating materials are mutually connected. By overlapping and vapor-depositing on the glass substrate 13, it is possible to form a vapor-deposited film with a uniform film thickness on the glass substrate 13, and to make the component amount ratio of the first vapor-deposited material A and the second vapor-deposited material B even more uniform. be able to.

  In the first and second embodiments, the first evaporation unit 21A and the second evaporation unit 21B of the evaporation device 12 are arranged outside the vacuum evaporation container 11, but as in the following third embodiment, The entire evaporation apparatus 12 can also be disposed in the vacuum evaporation container 11.

[Embodiment 3]
In the first and second embodiments, the substrate holding / moving device 14 is provided and the glass substrate 13 is moved in the x direction. In the third embodiment, the evaporation device 12 is moved in the x direction by the evaporation source moving device 41. This will be described with reference to FIG. Note that the same members as those in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

  In the evaporation source moving device 41, a plurality of linear rails 42 are laid on the bottom of the vapor deposition chamber 11a, and a moving table 43 is movably installed on the linear rails 42 via linear bearings. The moving table 43 includes first and second evaporators 21A and 21B, first and second induction pipes 22A and 22B, first and second diffusion containers 23A and 23B, first and second flow control valves 24A, The evaporator 12 having 24B and the nozzle group 25 (or 35) is installed. A screw shaft type drive unit 45 that pushes and pulls the moving table 43 through a drive rod 44 is provided outside the vacuum deposition container 11.

  In the drive unit 45, the drive rod 44 is connected to a drive member 45b guided by a guide rod 45a, and a screw shaft 45d that is rotationally driven by a moving rotary drive device (electric motor) 45c is arranged in the x direction. It is installed. A female screw member 45e provided on the drive member 45b is screwed onto the screw shaft 45d, and the drive rod 44 is covered with a bellows 45f for vacuum sealing. Accordingly, the screw shaft 45d can be rotationally driven by the rotary drive device 45c for movement, the drive member 45b can be moved via the female screw member 45e, and the movable table 43 can be reciprocated in the x direction via the drive rod 44.

The glass substrate 13 is held by a substrate holder 46.
Further, before the vapor deposition operation is started, the evaporation apparatus 12 is moved to the rate adjusting section partitioned by the deposition preventing plate at one end (the left side in FIG. 10) in the vacuum vapor deposition chamber 11, and the evaporation flow density is measured by the film thickness sensor 27. Detect and adjust.

  According to the third embodiment, the evaporation source moving device 41 for moving the evaporation device 12 is provided in place of the substrate holding and moving device 14 of the first and second embodiments, and the glass substrate 13 is fixed by the substrate holder 46. By being held, the same effects as those of the first and second embodiments can be obtained.

In the first to third embodiments, the first and second diffusion containers 23A and 23B are arranged up and down. However, they can be arranged side by side in the moving direction of the glass substrate 13.
Further, although two kinds of different vapor deposition materials are used, three or more kinds can be used. In this case, a plurality of diffusion containers may be arranged in three or more stages in the vertical position, or may be installed in combination with the parallel arrangement in the x direction and the vertical arrangement, and the nozzle tube is bent or inclined. You can also.

  Further, the evaporation source moving device 41 and the member holding and moving device 14 can be arranged in parallel, and the evaporation device 12 and the glass substrate 13 can be moved in the relative directions to perform the deposition.

It is a perspective view of the evaporation apparatus which shows Embodiment 1 of the vacuum evaporation system which concerns on this invention. It is a cross-sectional view which shows the same vacuum evaporation system. It is a schematic longitudinal cross-sectional view which shows the same vacuum evaporation system. It is a top view which shows the arrangement | positioning of the nozzle group of the same evaporation apparatus, and the relationship of a glass substrate. It is a front view which shows the arrangement | positioning of the nozzle group of the same evaporation apparatus, and the relationship of a glass substrate. It is a top view which shows the modification of arrangement | positioning of the 1st, 2nd nozzle cylinder of an evaporator, respectively, (a) shows the modification of zigzag arrangement, (b) shows the example of arrangement | positioning of ay direction. It is a perspective view of the evaporation apparatus which shows Embodiment 2 of the vacuum evaporation system which concerns on this invention. It is a cross-sectional view which shows the same vacuum evaporation system. It is a cross-sectional view which shows the diffusion container of the evaporation apparatus. It is Embodiment 3 of the vacuum evaporation system which concerns on this invention, and is a longitudinal cross-sectional view of an evaporation apparatus. FIG. 6 is a longitudinal sectional view showing a modified example of the nozzle set, where (a) shows a modified example of the nozzle set of the first embodiment, and (b) shows a modified example of the nozzle set of the second embodiment. It is a block diagram of the conventional vapor deposition apparatus in the case of vapor-depositing two materials on the moving board | substrate. It is a block diagram when an adhesion prevention board is added to the conventional vapor deposition apparatus.

Explanation of symbols

A 1st vapor deposition material B 2nd vapor deposition material 11 Vacuum vapor deposition container 11a Vapor deposition chamber 12 Evaporating device 13 Glass substrate 14 Substrate holding and moving device 21A First evaporating unit 21B Second evaporating unit 22A First induction tube 22B Second induction tube 23 Release Part 23A First diffusion container 23B Second diffusion container 24A First flow rate adjustment valve 24B Second flow rate adjustment valve 25 Nozzle group 25A, 25B Nozzle group 25a First nozzle cylinder 25a 'First nozzle port 25b Second nozzle cylinder 35 Nozzle group 35A Nozzle set 35a First nozzle cylinder 35b Second nozzle cylinder 41 Evaporation source moving device 46 Substrate holder

Claims (5)

A plurality of evaporation devices that heat and vaporize different types of vapor deposition materials, a vapor deposition member that vapor deposits a plurality of vaporization materials vaporized from the vaporization device in a vacuum vapor deposition container, and at least one of the evaporation device and the vapor deposition member A moving device for moving one side in a linear direction,
The evaporation device is provided with a plurality of evaporation units that heat and vaporize different kinds of vapor deposition materials, a plurality of diffusion units that diffuse the evaporation materials introduced from the evaporation units, and the diffusion units, respectively. And a group of nozzles that discharge the evaporation material toward the vapor deposition member,
The nozzle group has a nozzle set in which a plurality of nozzles that respectively discharge different types of vapor deposition materials are arranged close to each other, and the nozzle set is arranged in a line in a direction crossing the moving direction of the moving device. The vacuum vapor deposition apparatus according to claim 1, wherein each nozzle set includes nozzles that discharge different kinds of vapor deposition materials at front and rear positions in a movement direction of the movement apparatus. The vacuum deposition apparatus according to claim 1, wherein each nozzle set includes nozzles that discharge different kinds of deposition materials at front and rear positions in a direction transverse to the moving direction of the moving apparatus. The vacuum deposition apparatus according to claim 1, wherein each nozzle set includes nozzles that discharge different kinds of vapor deposition materials from adjacent nozzle sets at staggered positions. The vacuum deposition apparatus according to claim 1, wherein each nozzle set is arranged on a center side and an outer peripheral side so that nozzles that discharge different kinds of evaporation materials are fitted on the same axis.

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