JP2006319233A - Brittle member treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus where a hard member is peeled from a brittle member so that the elongation of an adhesive tape is effectively prevented when transferring the brittle member stuck on the hard member on a frame. <P>SOLUTION: A semiconductor wafer W is an object A to be treated which is stuck on a glass plate P with a double-sides adhesive tape S. After the semiconductor wafer is stuck on a dicing tape DT applied on a ring frame RF, the glass plate P is peeled and the semiconductor wafer W is transferred. A reinforcing tape RT is stuck on the outside of the dicing tape DT, thereby preventing the elongation of the dicing tape DT by the reinforcing tape RT in the time when peeling the glass plate P. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a brittle member processing apparatus and processing method, and more particularly to a brittle member processing apparatus having a function of transferring a semiconductor wafer subjected to back grinding to a ring frame.

  Conventionally, a semiconductor wafer with a circuit surface formed (hereinafter simply referred to as “wafer”) is subjected to back surface grinding with a protective sheet applied to the circuit surface, and then the wafer is integrated into a ring frame. A mounting process is performed, and a peeling process for peeling the protective sheet from the wafer is performed.

  An example of a wafer processing apparatus that performs the processing is described in Patent Document 1. In this wafer processing apparatus, a wafer is disposed on the inner peripheral side of the ring frame, and a mounting device for attaching a mounting tape to the wafer and the ring frame so as to integrate them, and a wafer attached to the circuit surface side of the wafer. And a peeling device for peeling the protective sheet from the wafer while adhering the peeling tape to the protective sheet and pulling the peeling tape obliquely upward.

JP 2000-68293 A

According to the structure of the said patent document 1, integration of a wafer and a ring frame, ie, a mount, and the peeling process of a protection sheet can be performed in a series of processes.
However, since the recently required wafer thickness is on the order of several tens of μm, the protective sheet secures sufficient rigidity to support the wafer during grinding when the protective sheet is simply pasted on the circuit surface. It is not possible to achieve ultra-thin grinding while maintaining surface smoothness. In addition, after grinding, the protective sheet is required to have heat resistance and corrosion resistance due to the surface treatment such as sputtering and metal deposition on the back surface of the wafer, but the protective sheet made of resin cannot meet such requirements. This is the actual situation.
Therefore, a hard member such as a glass plate having a certain rigidity or plate thickness is attached to the circuit surface via a double-sided adhesive sheet, and the wafer is not damaged by using the rigidity or plate thickness of the hard member. Ultra-thin back grinding is performed.

  However, when such an extremely thin wafer is a processing target, the apparatus described in Patent Document 1 cannot separate the hard member from the wafer. It is necessary to peel off the wafer, which causes a disadvantage that the sequence of processing is hindered and the working efficiency is greatly reduced.

Therefore, the present inventor has proposed a wafer processing apparatus that peels off a hard member that supports a wafer and transfers the wafer to a ring frame (Japanese Patent Application No. 2004-343736).
However, in the proposed wafer processing apparatus, it is necessary to determine the performance of the adhesive tape (dicing tape) in consideration of the push-up when the wafer chip is picked up in the subsequent process. That is, when picking up a chip, when pushing up the chip from the back side of the dicing tape, it is necessary to use a soft material (so-called low-waist material) so that the target chip can be pushed up smoothly, When the hard member is peeled off when transferred to the ring frame, the adhesive tape may be stretched to cause a trouble in peeling.

[Object of invention]
The object of the present invention is to effectively prevent the expansion of the adhesive tape when transferring a brittle member affixed to a hard member to a frame, thereby eliminating the obstacle when peeling the hard member from the brittle member. An object of the present invention is to provide a brittle member processing apparatus.

In order to achieve the above object, the present invention provides a first adhesive tape provided on a predetermined frame by using a brittle member attached to a hard member as an object to be processed and peeling the brittle member from the hard member. In the processing equipment for brittle members to be transferred,
The second adhesive tape is attached to the opposite side of the surface of the first adhesive tape to which the brittle member is adhered, and the transfer is performed.

Further, the present invention uses a semiconductor wafer attached to a hard member via a double-sided adhesive tape as an object to be processed, and transfers the semiconductor wafer to a first adhesive tape attached to a ring frame by peeling the semiconductor wafer from the hard member. In the processing apparatus of the brittle member to be made,
The second adhesive tape is attached to the opposite side of the surface of the first adhesive tape to which the semiconductor wafer is adhered, and the transfer is performed.

  In this invention, the 1st and 2nd adhesive tape can take the structure that it affixes sequentially via a double sticking unit.

  The first adhesive tape is an ultraviolet curable adhesive tape.

  Further, the second adhesive tape is an adhesive tape having a lower adhesive strength than the first adhesive tape.

  The second adhesive tape is higher in rigidity than the first adhesive tape.

  Furthermore, the second adhesive tape has a smaller outer shape than the first adhesive tape.

According to the present invention, since the adhesive tape for supporting the semiconductor wafer on the ring frame has a two-layer structure of the first adhesive tape and the second adhesive tape, the hard member attached to the semiconductor wafer is peeled off. It is possible to prevent the adhesive tape from being stretched by the peeling force when it is done, and the hard member can be peeled reliably and smoothly.
Further, the second adhesive tape is peeled off after the transfer is performed, so that the support for picking up the chip of the semiconductor wafer will be supported by the first adhesive tape in the subsequent process. It is possible to sufficiently push up the tip.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic perspective view in which a brittle member processing apparatus according to the present invention is applied to a wafer processing apparatus, and FIG. 2 is a cross-sectional view for explaining the wafer processing steps over time. The figure is shown. Here, as shown in FIG. 2A, the processing object A according to the present embodiment is made of ultraviolet curable adhesive on the circuit surface (lower surface in the drawing) side of the wafer W as a brittle member. A glass plate P as a hard member is bonded via a double-sided pressure-sensitive adhesive sheet S. In addition, the double-sided pressure-sensitive adhesive sheet S in the present embodiment has a three-layer structure having an ultraviolet curable pressure-sensitive adhesive on one surface of the base sheet and a weakly viscous pressure-sensitive adhesive on the other surface. As shown in FIG. 2B, the processing object A includes a dicing tape DT constituting the first adhesive tape in a state where the wafer W is disposed on the inner peripheral side of the ring frame RF, and a second dicing tape DT. Are integrated via a reinforcing tape RT constituting the adhesive tape. Then, as shown in FIG. 2C, after the glass plate P is peeled off at the interface between the double-sided pressure-sensitive adhesive sheet S and the glass plate P, as shown in FIG. Further, as shown in FIG. 2E, the double-sided pressure-sensitive adhesive sheet S left on the circuit surface side of the wafer W is peeled from the wafer W, and finally the dicing tape DT is placed inside the ring frame RF. Through this process, only the wafer W is left (see FIG. 2F).

  In FIG. 1, the wafer processing apparatus 10 takes out the processing objects A accommodated in the magazine 11 one by one through the robot arm 12 and at the same time, cures the ultraviolet curable pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet S. Irradiation device 13, alignment device 16 for transferring and positioning processing object A irradiated with ultraviolet rays by ultraviolet irradiation device 13, mounting device 17 for integrating processing object A with ring frame RF, and processing A peeling device 20 for peeling the glass plate P from the object A to transfer the wafer W to the ring frame RF, and peeling for peeling the reinforcing tape RT and the double-sided adhesive sheet S left on the circuit surface side of the wafer W. An apparatus 21 and a stocker 23 for storing the wafer W after the double-sided adhesive sheet S is peeled off while being supported by the ring frame RF are provided. It is configured.

  In the magazine 11, a large number of processing objects A are held in a substantially horizontal posture, and are accommodated in a multi-stage shape with the back side of the wafer W being the top side. The robot arm 12 that takes out the processing object A from the magazine 11 includes a multi-joint arm portion 12A and a lifting body 12B that supports the multi-joint arm portion 12A. The distal end side of the articulated arm portion 12A has a bifurcated shape, and is configured to include a suction portion (not shown) at the distal end portion of the branch, thereby sucking the back surface side (upper surface side) of the processing object A. In addition to being transferred to the ultraviolet irradiation device 13, the processing object A positioned by the alignment device 16 is attracted and transferred to the mounting device 17 side.

  The ultraviolet irradiation device 13 includes a slide table 27 movable along a pair of guide rails 25, 25 arranged substantially parallel to each other, and an ultraviolet irradiation unit 28 positioned above the slide table 27. The slide table 27 moves along the guide rail 25 with the processing object A placed thereon, thereby curing the ultraviolet curable adhesive layer side of the double-sided pressure-sensitive adhesive sheet S so as to prepare for peeling described later. It has become.

  The alignment device 16 includes a plate member 30 having a substantially rectangular outer shape in plan view, a center table 31 provided at the center of the plate member 30, and a plate member 30 supported by the plate member 30 and spaced apart from each other in a plane. It is provided with a pair of convex portions 32 and 32 that are provided so as to be accessible and have a substantially semicircular arc shape in plan view. The central table 31 is provided so as to be rotatable in a substantially horizontal plane. The center table 31 rotates the processing object A and performs positioning for specifying the crystal direction of the wafer W by a camera or the like (not shown). By approaching, the wafer W can be centered. At a lateral position between the alignment device 16 and the ultraviolet irradiation device 13, a slider 36 that can be moved via a rodless cylinder 35, and supported by the slider 36 so as to be movable up and down, and a bifurcated branching portion on the tip side. The suction arm 37 is provided, and the suction arm 37 sucks the processing object A and transfers the processing object A from the ultraviolet irradiation device 13 to the alignment device 16 side.

  As shown in FIGS. 1 and 3, the mounting device 17 includes a mount table 40 that supports the ring frame RF and the processing object A, and a dicing tape DT that integrates the ring frame RF and the processing object A. Attached and configured with first and second pasting units 41A and 41B in a double state in which a reinforcing tape RT is pasted on the upper surface side of the dicing tape DT, that is, the side opposite to the surface to which the wafer W adheres. Has been. The ring frame RF is stocked in a state of being stacked on a stock table 42 disposed on the side of the mount table 40, and the uppermost ring frame RF is mounted on the mount table by the transfer arm 43 having the suction portion 43A. 40. The transfer arm 43 is supported by a slide block 45 that is movable via a single-axis robot 44. Further, the stock table 42 is supported by the lifting robot 46 so as to be able to move up and down, and increases the thickness of the ring frame RF each time the suction portion 43A of the transfer arm 43 sucks and transfers the ring frame RF. It is like that.

  The mount table 40 is provided so as to be movable up and down on a slide base 48 that is movable along a pair of guide rails 47, 47, and when the transfer arm 43 is positioned on the mount table 40, the ring frame RF is provided. It is provided so that it can be raised to a height position where it is received.

  The first attaching unit 41A attaches the dicing tape DT to the ring frame RF and the back surface (upper surface in the drawing) of the wafer W. The dicing tape DT in the present embodiment employs a strip-shaped release sheet attached to one surface of a belt-shaped ultraviolet curable resin tape as the original fabric L1, and the surface of the resin tape in the original fabric L1. By forming closed-loop cuts therein, dicing tape DT having a substantially circular shape in plan view is formed at predetermined intervals. The first sticking unit 41A is rotatably supported in a plane of a plate-like frame F directed in a substantially vertical plane, and has a predetermined tension by a torque motor (not shown) provided on the back side of the frame F. A feed roll 50A that supports the original fabric L1 so that the original fabric L1 can be fed out, a peel plate 51A that peels off the dicing tape DT by rapidly reversing the feeding direction of the fed original fabric L1, and the peel plate 51A A press roll 52A disposed along the front edge, a drive roll 55A that imparts a winding force to the original fabric L1, a nip roll 56A that sandwiches the original fabric L1 between the drive roll 55A, and an original fabric from which the dicing tape DT has been peeled off A winding roll 53A that fixes and winds the lead end of L1 and a guide roll 54A that is arranged in the middle of the feeding path. It is. The take-up roll 53A is connected to an output shaft of a motor (not shown) provided on the back side of the frame F in the drive roll 55A by a pulley, and the raw roll L1 from which the dicing tape DT has been peeled off via a sliding belt. It is configured so that it can be wound without slack.

  The second pasting unit 41B has substantially the same device configuration as the first pasting unit 41A. Therefore, the same reference numerals used in the description of the first sticking unit 41A are the same, and “B” is appended to the numbers and description thereof is omitted. The raw fabric L2 used in the second pasting unit 41B employs a strip-shaped release sheet adhered to one surface of a strip-shaped resin tape, and the surface of the resin tape in the original fabric L2 By forming cuts in a closed loop shape inside, reinforcing tape RT having a substantially circular shape in plan view is formed at predetermined intervals. This reinforcing tape RT has a lower adhesive strength than that of the dicing tape DT and has a rigidity higher than that of the dicing tape DT, that is, a material having a strong waist. Further, the outer diameter of the reinforcing tape RT is set smaller than the outer diameter of the dicing tape DT.

  As shown in FIGS. 1, 4, and 5, the transfer device 20 supports the suction frame 60 that supports the glass plate P of the processing object A, and the ring frame RF at a position that does not interfere with the glass plate P. Peeling trigger part forming apparatus for forming a peeling trigger part 62 (see FIG. 2B) at the boundary between the pair of arms 61 and 61 and the glass plate P and the ultraviolet curable adhesive layer of the double-sided PSA sheet S 63, and a driving means 64 that relatively moves the suction table 60 and the arms 61 and 61 so that the glass plate P and the double-sided pressure-sensitive adhesive sheet S start to peel from the peeling trigger portion 62.

  As shown in FIG. 5, the suction table 60 has a top surface shape having a concave portion 60 </ b> A having a substantially U shape in plan view at the center thereof. The arc portion of the U-shaped portion is provided in substantially the same shape as the outer peripheral shape of the glass plate P, and the ring frame RF is placed on the arm 61 so as to press the glass plate P in the arc direction of the U-shaped portion. The processing object A can be positioned in the X direction when it is slid. In addition, a large number of suction holes 60B are provided on the bottom surface of the recess 60A. The concave portion 60 is set to a depth corresponding to the thickness of the glass plate P, whereby the peeling trigger portion 62 is formed at the upper surface position of the glass plate P, that is, the interface outer peripheral portion of the double-sided pressure-sensitive adhesive sheet S. It is comprised so that can be formed. The suction table 60 is provided so as to be able to be lifted and lowered via a lifting device (not shown). After the suction table 60 is temporarily lowered, the wafer W and the glass plate P are peeled off, and then the double-sided adhesion of the wafer W is performed. The sheet S and the glass plate P are kept from being bonded again.

  Steps 61A and 61A are respectively formed on the pair of arms 61 and 61 so as to restrict the displacement in the Y direction when the ring frame RF is placed. A connecting bar 66 is provided between one end side of the arms 61, that is, one end portion in front of the left side in FIG. 4, and the connecting bar 66 can be held so as to restrict the movement of the ring frame RF. Two chuck members 68, 68 are provided.

  As shown in FIG. 5, the peeling trigger part forming device 63 is attached to a single-axis robot 70, a standing block 71 movable along the single-axis robot 70, and an upper end portion of the standing block 71. And a blade member 72. The leading end side of the blade member 72 is provided so as to be able to advance and retreat along the upper surface of the suction table 60 when the upright block 71 moves along the single-axis robot 70. Therefore, when the leading edge 72A of the blade member 72 advances toward the center of the suction table 60, the leading edge 72A enters from the outer peripheral edge side of the glass plate P and the double-sided adhesive tape S, and the glass plate P and double-sided adhesive tape S A gap is formed at the interface with the ultraviolet curable pressure-sensitive adhesive layer, and the gap is formed as a peeling trigger portion 62.

  The driving means 64 extends through the blocks 74, 74 provided at the ends of the pair of arms 61, 61, and rotates around the rotating shaft 75 and a rotating shaft 75 supported by a support frame (not shown). The arm 61, 61 is driven by the motor M. The arm 61, 61 is centered on the rotation shaft 75, and one end on the side where the connecting bar 66 is provided is a free end. It can be rotated. That is, the arms 61 and 61 are rotatably provided between an initial position where the arms 61 and 61 are kept substantially horizontal and a position where the free end rises and the entire arm 61 stands.

  A transfer arm 78 that is movable via a single-axis robot 77 is provided at a lateral position between the transfer device 20 and the mount device 17, and the transfer arm 78 includes the dicing tape DT and a reinforcing member. The processing object A integrated with the ring frame RF is adsorbed via the tape RT and transferred to the transfer device 20.

  Moreover, the glass plate removal apparatus 80 is provided in the right side area | region in FIG. The glass plate removing device 80 includes a slider 82 that is movable along a cylinder 81 that extends in the Y-axis direction, a suction arm 85 that is supported via a Z-axis cylinder 83 provided on the slider 82, and a glass plate P. And a lifting type collection table 86 that can be collected in a multi-stage form.

  As shown in FIGS. 1 and 5, the wafer W from which the glass plate P has been peeled off by the transfer device 20 and transferred to the ring frame RF is transferred to the release device 21 side via the reverse transfer device 88. It will be posted. The reverse transfer device 88 includes a single-axis robot 89 disposed along the Y-axis direction, a single-axis robot 91 for lifting supported by a slider 90 that moves along the single-axis robot 89, and the lift robot. The lifting / lowering slider 92 moves along the single-axis robot 91, and a reverse suction arm 93 rotatably supported by the lifting / lowering slider 92. The reverse suction arm 93 is provided so that after the upper surface portion of the ring frame RF is sucked, the reverse suction arm 93 is transferred to the peeling suction table 100 or receives the ring frame RF from the receiving device 94 described later when the ring frame RF is reversed. It has been.

  As shown in FIGS. 1 and 6, the receiving device 94 includes a Z-axis single-axis robot 96, a slider 97 supported by the Z-axis single-axis robot 96, and a lift adsorption arm supported by the slider 97. 98, and the lifting / lowering adsorption arm 98 is adapted to adsorb the ring frame RF portion and transfer it to the reversing adsorption arm 93 after peeling of a reinforcing tape RT described later.

  As shown in FIG. 6, the peeling device 21 is disposed between a pair of guide rails 101 and 101 that support the peeling suction table 100 movably along the X direction, and between these guide rails 101. The feed screw shaft 102 extending through a nut member (not shown) located on the lower surface side of the peeling suction table 100 and a peeling unit 105 for peeling the reinforcing tape RT and the double-sided adhesive sheet S are configured.

  The peeling unit 105 includes a peeling tape supply unit 106, a peeling tape bonding unit 107, and a peeling tape pulling unit 108. The peeling tape supply unit 106 is disposed in a plane of the first elevating plate 111 supported so as to be movable up and down along the first cylinder 110 extending in the Z-axis direction, and the first elevating plate 111. , A support roll 112 that supports the peeling tape PT wound in a roll shape, a guide roll 113 of the peeling tape PT, and a guide member 115 that guides the peeling tape PT in a substantially horizontal posture. . The guide member 115 includes a substantially L-shaped bracket 120 connected to the horizontal cylinder 117, and the bracket 120 has a long side located in a substantially horizontal plane and guides the peeling tape PT on the upper surface side. Is provided.

  The peeling tape bonding portion 107 includes a second cylinder 121 extending in the Z-axis direction, a second lifting plate 122 supported by the second cylinder 121 so as to be lifted and lowered, and the second lifting plate 122. The cutter blade 123 is disposed in the plane, the cutter receiver 124 is located below the cutter blade 123, and the welding unit 125 is provided at a position adjacent to the cutter blade 123. The cutter receiver 124 is supported by a cylinder (not shown) provided on the back surface of the second lifting plate 122 so as to be able to protrude and retract with respect to the surface of the second lifting plate 122, and the cutter blade 123 has a cutter receiver 124. It is provided so that it can move forward and backward. The welding unit 125 includes a heat block 129 at the lower end of the piston rod 128 extending downward from the lower end of the cylinder body 127. The heat block 129 attaches the peeling tape PT to the reinforcing tape RT or the double-sided adhesive on the wafer W. It is configured to be welded to the sheet S.

  The peeling sheet pulling portion 108 includes a cylinder 130 along the guide rail 101 at a position facing the peeling tape supply portion 106 and the peeling tape bonding portion 107, a slider 132 moving along the cylinder 130, and The chuck 136 is provided at the tip of the arm 134 supported by the slider 132. The chuck 136 includes a lower jaw 136A and an upper jaw 136B, and is provided so as to sandwich and hold the peeling tape PT by closing the space between the lower jaw 136A and the upper jaw 136B. Therefore, after the chuck 136 sandwiches the peeling tape PT and a part of the peeling tape PT is welded to the reinforcing tape RT or the double-sided pressure-sensitive adhesive sheet S, the chuck 136 is placed on the right side in FIGS. Is moved, the reinforcing tape RT or the double-sided pressure-sensitive adhesive sheet S is pulled and gradually peeled off from the surface of the dicing tape DT and the wafer W. Note that the peeled reinforcing tape RT and double-sided adhesive sheet S are discarded in a disposal box (not shown).

  As shown in FIG. 6, a final transfer device 140 is disposed on the side of the peeling tape bonding portion 107. The final transfer device 140 includes a cylinder 141 extending in the X-axis direction, a slider 142 supported by the cylinder 141, and a suction arm 144 supported by the slider 142 so as to be movable up and down. The adsorption arm 144 adsorbs the ring frame RF on the peeling table 100 that has moved downward, and between a pair of passage forming bodies 145 and 145 having an L-shaped cross section located on an extension line of the guide rail 101, The wafer W integrated with the ring frame RF is transferred. The ring frame RF transferred between the passage forming bodies 145 is configured to be accommodated in the stocker 23 via a kicker 146 disposed between the passage forming bodies 145.

  Next, the overall operation of the wafer processing apparatus 10 in this embodiment will be described.

  The processing objects A stored in the magazine 11 are taken out one by one by the robot arm 12 and transferred to the ultraviolet irradiation device 13. In the ultraviolet irradiation device 13, the ultraviolet curable pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet S is cured by irradiating ultraviolet rays through the glass plate P of the processing object A, and is prepared for peeling in a subsequent process.

  The processing object A that has been irradiated with ultraviolet rays is transferred to the alignment device 16 by the suction arm 37, and the alignment device 16 specifies and aligns the crystal orientation. Then, the aligned processing target A is transferred to the mount table 40 of the mount device 17 via the robot arm 12. At this time, the ring frame RF is previously transferred to the mount table 40 by the operation of the transfer arm 43.

  When the mount table 40 moves on the upper surface side of the processing object A and the ring frame RF transferred to the mount table 40 in a direction passing below the first sticking unit 41A and the second sticking unit 41B. The dicing tape DT and the reinforcing tape RT that are sequentially peeled off at the tip positions of the peel plates 51A and 51B of the units 41A and 41B are applied under the pressing force of the press rolls 52A and 52B. The ring frame RF is integrated.

  When the mount table 40 moves to the transfer device 20 side, the processing object A and the ring frame RF integrated in this manner are attracted and held by the transfer arm 78 waiting above the mount table 40 and rolled. It is transferred to the landing device 20. In the state where the transfer is completed, the glass plate P is received and held in the recess 60A provided in the central portion of the suction table 60 of the transfer device 20, while the ring frame RF has the arms 61, 61. In this state, the chuck member 68 provided on the side of the connecting bar 65 sandwiches the outer peripheral portion of the ring frame RF. Next, the peeling trigger part forming device 63 is operated, and the blade member 72 is moved forward along the upper surface of the suction table 60 toward the center of the processing object A, so that the UV curable pressure-sensitive adhesive layer of the glass plate P and the double-sided pressure-sensitive adhesive sheet S. When the tip blade 72A enters a predetermined amount at the interface at the outer peripheral edge portion, a gap is formed, and the separation trigger 62 is formed by the gap.

  Next, the motor M of the driving means 64 is driven, and the free ends of the pair of arms 61 and 61 are rotated away from the suction table 60 so as to be angularly displaced in the direction of rising from the initial horizontal position. As the displacement angle increases, the adhesion area between the glass plate P and the double-sided pressure-sensitive adhesive sheet S gradually decreases, and when the arm 61 rotates to a certain standing angle, for example, approximately 45 degrees, the adhesion area between the two becomes smaller. The wafer W is completely peeled off from the glass plate P together with the double-sided adhesive sheet S, and the wafer W is transferred to the ring frame RF. At this time, since the wafer W is supported by the dicing tape DT and the reinforcing tape RT, there is no inconvenience that the dicing tape extends, and the glass plate P can be peeled off reliably.

  When the peeling is completed, the arms 61 and 61 return to the initial horizontal posture. At this time, the suction table 60 is lowered in a direction to slightly lower the upper surface position, and the double-sided pressure-sensitive adhesive sheet S present on the lower surface side of the wafer W is maintained so as not to adhere to the glass plate P again. Then, the ring frame RF returned to the initial horizontal posture and the wafer W transferred to and integrated with the ring frame RF are sucked and held by the reverse suction arm 93 of the reverse transfer device 88 and transferred to the peeling table 100. (See FIG. 7A). At this stage, the wafer W on the peeling table 100 is placed so that the reinforcing tape RT is on the upper surface side. In addition, after the ring frame RF is transferred together with the wafer W, the glass plate P is left on the suction table 60 of the transfer device 20. It is adsorbed by the adsorption arm 85 and accommodated in the collection table 86.

  The reinforcing tape RT is peeled off when the peeling table 100 passes below the peeling device 21. That is, the peeling table 100 moves below the peeling unit 105, the peeling tape PT is welded to the end portion side of the reinforcing tape RT, and the chuck 136 that sandwiches the peeling tape PT moves in the lateral direction. The reinforcing tape RT can be peeled off from the dicing tape DT (see FIG. 7B). At this time, since the reinforcing tape RT is set to have an outer shape, that is, a diameter smaller than that of the dicing tape DT, there is no inconvenience that the dicing tape DT is peeled off from the ring frame RF. This is substantially the same as the previously proposed Japanese Patent Application No. 2004-343736.

  After the reinforcing tape RT is peeled off, the peeling table returns to the receiving device 94 side, and the wafer W integrated with the ring frame RF is attracted and raised by the receiving device 94, and the lower surface side thereof is lifted. The reverse suction arm 93 is positioned to suck the ring frame RF, reverse the top and bottom, and transfer again onto the peeling table 100, whereby the double-sided adhesive sheet S is exposed to the upper surface side. The Then, the double-sided pressure-sensitive adhesive sheet S is peeled off via the peeling unit 105 in the same manner as the operation of peeling off the reinforcing tape RT.

  The wafer W from which the double-sided pressure-sensitive adhesive sheet S has been peeled is adsorbed together with the ring frame RF and stored in the stocker 23. After reaching a predetermined stock amount, post-process processing such as dicing and die bonding is performed.

Therefore, according to such an embodiment, even when the glass plate P is used to grind the wafer W to an extremely thin thickness, the reinforcing tape RT is attached to the dicing tape DT. When the plate is peeled off, the inconvenience that the dicing tape is stretched can be eliminated and the glass plate can be peeled off reliably.
Further, since the reinforcing tape DT is peeled off from the dicing tape via the peeling unit, when the chip after dicing is picked up, the chip can be pushed up smoothly as before.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the present invention has been illustrated and described mainly with respect to specific embodiments, but the shape, position, or position of the above-described embodiments can be reduced without departing from the scope of the technical idea and object of the present invention. With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the war record embodiment, the case where the brittle member is the semiconductor wafer W has been shown, but the present invention can also be applied to the case of transferring another brittle plate-like body.

The schematic perspective view which shows the whole structure of a wafer processing apparatus. Sectional drawing which shows a series of processes in which a process target object is transferred to a ring frame. The schematic perspective view of a mounting apparatus. The schematic perspective view of a transfer device. The schematic perspective view which shows the state by which a wafer is transferred to the ring frame side by the transfer apparatus. The schematic perspective view of a peeling apparatus. Explanatory drawing of peeling operation | movement.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer processing apparatus 41A 1st sticking unit 41B 2nd sticking unit A Process target DT Dicing tape (1st adhesive tape)
RT reinforcing tape (second adhesive tape)
RF ring frame (holding member)
P glass plate (hard material)
S Double-sided adhesive sheet W Semiconductor wafer (brittle member)

Claims (7)

In the processing apparatus of the brittle member which makes the brittle member affixed to the hard member an object to be processed, peels the brittle member from the hard member and transfers it to the first adhesive tape provided in a predetermined frame,
An apparatus for treating a brittle member, wherein the transfer is performed by attaching a second adhesive tape to the opposite side of the surface of the first adhesive tape to which the brittle member is bonded. Processing of a brittle member having a semiconductor wafer attached to a hard member via a double-sided adhesive tape as an object to be processed, peeling the semiconductor wafer from the hard member and transferring it to a first adhesive tape attached to a ring frame In the device
An apparatus for treating a brittle member, wherein the transfer is performed by attaching a second adhesive tape to the opposite side of the surface of the first adhesive tape to which the semiconductor wafer is bonded. The brittle member processing apparatus according to claim 1 or 2, wherein the first and second adhesive tapes are sequentially affixed through two affixing units. 4. The brittle member processing apparatus according to claim 1, wherein the first adhesive tape is an ultraviolet curable adhesive tape. The brittle member processing apparatus according to claim 1, 2, 3, or 4, wherein the second adhesive tape is an adhesive tape having a lower adhesive strength than the first adhesive tape. The brittle member processing apparatus according to any one of claims 1 to 5, wherein the second adhesive tape has higher rigidity than the first adhesive tape. The brittle member processing apparatus according to claim 1, wherein the second adhesive tape has a smaller outer shape than the first adhesive tape.

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