JP2006245174A - Positioning stage, pattern forming equipment, inspection device, position correction method, substrate supporting part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positioning stage capable of correcting position of a large substrate, for reduced burden of a cost for position correction. <P>SOLUTION: A pattern forming equipment 101 applies ink on a substrate 105 from an ink jet head unit 103 provided to a gantry 119 for pattern formation. A substrate shifting stage 113 for shifting a substrate 105 to an accurate position is provided with a bar mirror for measuring position and angle of the substrate 105. An X-axis of a first bar mirror is normal direction of a reflecting surface, while the direction at a specified angle from both directions of X-axis and Y-axis of a second bar mirror is normal direction of the reflecting surface. By obliquely providing the second bar mirror, a bar mirror having a conventional width can be used without employing a bar mirror of special width, even if the size of substrate 105 increases for high effect in cost. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a positioning stage that positions a substrate on which a pattern such as a color filter is formed and a substrate such as an inspection apparatus.

  In recent years, there has been an increasing demand for liquid crystal color displays characterized by space-saving and low power consumption as computer displays. In addition, demand for liquid crystal color displays is increasing for applications such as liquid crystal televisions, and the enlargement of screens has been accelerated.

  Conventionally, a glass plate is used as the base material of the color filter constituting the liquid crystal panel. On the glass substrate, a black matrix and three color filter layers of red, green and blue constituting the color filter are generated. The color filter substrate generated in this manner and the TFT substrate generated in a separate process are bonded together, liquid crystal is injected between the substrates, and a deflection film is bonded to complete a liquid crystal panel.

  As a device for forming a color filter pattern in a liquid crystal display on a substrate, three colored inks of R (red), G (green), and B (blue) are ejected onto the substrate by an inkjet method to form a colored layer pattern. There is a pattern forming apparatus.

  10 and 11 are diagrams showing an arrangement and positioning method of an inkjet head in a conventional inkjet pattern forming apparatus.

  As shown in FIG. 10, the conventional pattern forming apparatus includes a Y-direction adjustment mechanism 504 and a θ-direction adjustment mechanism 505 for each inkjet head unit.

  As shown in FIG. 11, the conventional inkjet pattern forming apparatus adjusts each inkjet head 501 in the Y direction (y1, y2, y3,...) And the θ direction (φ) when the inter-pattern pitch is changed. Then, the position of the nozzle hole 502 is adjusted to the position of the predetermined pattern 503 on the substrate to be coated.

  That is, in the pattern forming apparatus, while moving the substrate mounted on the positioning stage to an accurate position, ink is ejected from the ink jet head (see FIGS. 10 and 11) to form a pattern on the substrate.

  Further, there is a method in which a reflecting plate (bar mirror) is mounted on a positioning stage for positioning the substrate, and the substrate position is controlled with high accuracy using a laser or the like. For example, there is a technique that corrects a measurement error related to the tilt of the stage caused by an error of a plane mirror mounted on the positioning stage to improve positioning accuracy (see Patent Document 1).

  By the way, in recent years, the glass used for the liquid crystal substrate has been reduced in thickness, and the glass size has been increased in order to improve productivity. X2200 mm) or the like is used.

  In the process of pattern formation, inspection, etc. by moving the glass substrate, when correcting the yawing (left and right shake due to rotation) by the movement of the substrate support and the position correction, it was mounted on the substrate support that fixes the substrate The measurement light is reflected on the bar mirror to detect the position shift of the substrate support portion. The bar mirror is an expensive reflector that has a polished surface and requires high flatness accuracy. The bar mirror reflects the measurement light emitted from the laser measuring device set at a predetermined position. The reflected light is received by the light receiving unit of the laser measuring device, and the laser measuring device detects the distance from the bar mirror. In general, the bar mirror is mounted on the front side surface of the substrate support portion and the side surface parallel to the coating direction at positions orthogonal to each other (see FIG. 4).

JP 2003-203842 A

However, with an increase in size of the substrate, it is difficult to obtain a bar mirror having a width that can be mounted on the entire side surface in the application direction of the substrate support portion that holds the substrate. At present, the maximum width of a bar mirror that can be created is about 1000 mm. Since the surface processing accuracy decreases as the width of the bar mirror becomes wider, there is a problem that the production becomes difficult, and even if it can be created, the cost burden increases.
In recent years, there is a problem that a bar mirror having a width of 2200 mm or more to be mounted on the entire side surface in the coating direction of the substrate is necessary in order to support a generation substrate such as G7 (1900 mm × 2200 mm).

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a positioning stage or the like that enables position correction of a large substrate and reduces the cost burden of position correction.

  A first invention for achieving the above-described object is a positioning stage for positioning a substrate, wherein a linear moving means for linearly moving a substrate support portion supporting the substrate in a first direction, and the substrate support A second linear movement means for linearly moving the portion in a second direction orthogonal to the first direction, and a first linear device mounted on the substrate support portion and having the first direction as a normal direction of the reflecting surface. A reflector, a second reflector that is mounted on the substrate support portion and has a direction perpendicular to both the first direction and the second direction as a normal direction of the reflecting surface; and the first A first position correction unit that irradiates the first reflector with the first measurement light, analyzes the reflected light and corrects the position of the substrate support, and irradiates the second reflector with the second measurement light. And second position correction means for analyzing the reflected light and correcting the position of the substrate support portion; A positioning stage that is characterized by having a.

The positioning stage is a device that supports a substrate on which a pattern is formed or an inspection substrate and moves to a target accurate position in a pattern forming device or an inspection device that manufactures a color filter or the like by an inkjet method or the like. The color filter is used in a display device such as an LCD (Liquid Crystal Display Panel) and an organic EL (Electroluminescence Display).
As the linear moving means, a slide mechanism (slide rail, slider, etc.), a linear motor, or the like can be used.
The substrate support part is a member that adsorbs and fixes the substrate, for example.
The reflector is a bar mirror or the like that requires high flatness accuracy to reflect the measurement light.

  The positioning stage according to the first aspect of the invention is a linear movement means for linearly moving the substrate support portion for supporting the substrate in the first direction (X-axis direction) and a linear movement for linearly moving in the second direction (Y-axis direction). Means. Further, the substrate support portion includes a first reflector having a first direction (X-axis direction) as a normal direction of the reflecting surface, a first direction (X-axis direction), and a second direction (Y-axis). A second reflector having a direction that forms a predetermined angle θ (0 degree <θ <90 degrees) with both directions of the reflecting surface as a normal direction of the reflecting surface. The pattern forming apparatus irradiates the first reflector with the first measurement light, analyzes the reflected light, and corrects the position of the substrate support portion (yaw correction with respect to the X-axis direction). The second reflector is irradiated with the second measurement light, and the reflected light is analyzed to correct the position of the substrate support portion (horizontal straightness correction with respect to the X-axis direction, Y-direction position correction). Position correction means.

The positioning stage is preferably provided with a rotating means for rotating the substrate support portion that supports the substrate. The rotating means is a rotating mechanism, and a direct drive motor or the like can be used. The first position correcting means (yaw correction with respect to the X-axis direction) is a rotating means.
The yaw correction is to correct yawing (left and right shake due to rotation) with respect to the traveling direction of the substrate.

  In the positioning stage, at least one of the first position correcting unit and the second position correcting unit may perform length measurement by optical triangulation using a laser beam and perform position correction. That is, the measurement light is irradiated from a laser measuring device or the like, and the reflected light reflected by the bar mirror is received by a light receiving element such as a CCD (Charge Coupled Devices) of the laser measuring device, and the position of the positioning stage is measured.

  In the positioning stage, at least one of the first position correction unit and the second position correction unit may perform position correction using position information acquired by the laser interferometer. That is, a laser interferometer is used to irradiate the positioning stage with measurement light, and the interference fringes reflected and measured by the bar mirror are converted into position information through pulse output, and the position of the positioning stage is measured.

  The positioning stage according to the first aspect of the invention has a reflecting surface having a direction that forms a predetermined angle θ (0 ° <θ <90 °) with both the first direction (X-axis direction) and the second direction (Y-axis direction). Since the second reflector having the normal direction is attached, the width of the second reflector can be shortened and the cost burden can be reduced.

  A second invention is a pattern forming apparatus that includes the positioning stage according to any one of claims 1 to 5 and performs pattern formation on the substrate.

  The pattern forming apparatus of the second invention is an apparatus for forming a pattern such as a color filter on a substrate, and moves the substrate to a target position by the positioning stage according to the first invention.

  A third invention is an inspection apparatus that includes the positioning stage according to any one of claims 1 to 5 and inspects the substrate.

  An inspection apparatus of a third invention is an inspection apparatus for inspecting a substrate, and moves the substrate to a target position by the positioning stage according to the first invention.

  A fourth invention is a position correction method for correcting the position of a substrate, wherein a first linear movement step of linearly moving a substrate support portion supporting the substrate in a first direction; and A second linear moving step for linearly moving in a second direction orthogonal to the first direction; and a first reflector mounted on the substrate support portion and having the first direction as a normal direction of the reflecting surface. A first position correcting step of irradiating the first measuring light and analyzing the reflected light to correct the position of the substrate support; and the first direction and the second direction mounted on the substrate support. A second measuring light is irradiated to a second reflector whose normal direction is the direction of the reflecting surface at a direction that forms a predetermined angle with both of the above directions, and the reflected light is analyzed to correct the position of the substrate support portion. And a position correction step.

  4th invention is the invention regarding the position correction method of the board | substrate in the positioning stage which is 1st invention.

  In a positioning stage for positioning a substrate, a fifth invention is a substrate support portion for supporting the substrate, wherein the first direction is a normal direction and the first reflector that reflects measurement light; A substrate support unit comprising: a second reflector that reflects the measurement light with a direction that forms a predetermined angle with both the first direction and the second direction orthogonal to each other as a normal direction. .

  5th invention is the invention regarding the board | substrate support part in the positioning stage which is 1st invention.

  ADVANTAGE OF THE INVENTION According to this invention, the positioning stage etc. which enable position correction of a large sized substrate and reduce the cost burden of position correction can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a configuration of a pattern forming apparatus 101 according to the present embodiment.

(1. Pattern forming apparatus 101)
FIG. 1 is a schematic perspective view of the pattern forming apparatus 101. The θ axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Y-axis indicates the inkjet application width direction, and the X-axis indicates the application direction. The θ axis, the Y axis, and the X axis are perpendicular to each other.

  The pattern forming apparatus 101 is an apparatus that manufactures a color filter by an inkjet method. The pattern forming apparatus 101 discharges ink containing three color pigments of R (red), G (green), and B (blue) onto a light-transmitting substrate by an inkjet method, and cures and colors each ink. A pixel portion is formed, and a color filter pattern is formed on the substrate.

  The pattern forming apparatus 101 includes a suction table 107, a substrate moving stage 113, a θ-axis moving stage 109, a moving stage 114, a moving bar 111, a holding unit 115, a surface plate 117, an inkjet head unit 103, a gantry 119, a slide rail 121, and a sliding unit. 122, bar mirrors 123-1 to 123-2, laser measuring instruments 125-1 to 125-3, an alignment camera 127, and the like.

  The suction table 107 is a table that sucks and fixes the substrate 105 on which the color filter pattern is formed. The suction of the substrate 105 is realized by reducing the pressure and vacuum of the air between the suction table 107 and the substrate 105, for example. In this case, the suction table 107 is provided with a small hole (not shown) for sucking air, and at the time of suction, air is sucked through the hole by a vacuum pump (not shown) or the like.

  A substrate moving stage 113 as a base support unit is mounted with bar mirrors 123-1 and 123-2 that support the substrate 105 and the suction table 107 and detect displacement of the substrate 105.

  The substrate moving stage 113 is supported by the θ-axis moving stage 109 and the moving stage 114, rotates with the rotational movement of the θ-axis moving stage 109, and moves in the X-axis direction with the movement of the moving stage 114. The substrate moving stage 113 moves linearly in the Y-axis direction along a slide rail or the like (not shown) laid on the moving bar 111 together with the θ-axis moving stage 109 and the moving stage 114.

  Although not described in the present embodiment, the substrate moving stage 113 can be integrated with the θ-axis moving stage 109. That is, the substrate moving stage 113 may be configured to be rotatable.

  The θ-axis moving stage 109 is a rotating stage and is rotatably supported on a predetermined rotating shaft by a controllable motor such as a step motor, a servo motor, or a direct drive motor. The θ-axis moving stage 109 rotates the substrate moving stage 113 and the suction table 107 in the θ direction based on a control amount output from the control unit 201 (see FIG. 6 described later).

  The moving stage 114 includes a suction table 107, a substrate moving stage 113, and a θ-axis moving stage 109, and is a stage that moves linearly in the X-axis direction (coating direction) along with the movement of the moving bar 111. 107, the substrate moving stage 113, and the θ-axis moving stage 109 are linearly moved in the Y-axis direction along a slide rail or the like (not shown) laid on the moving bar 111. The moving bar 111 is supported by a controllable motor such as a step motor, a servo motor, or a linear motor so as to be movable in a predetermined axial direction, and is based on a control amount output from the control unit 201 (see FIG. 6 described later). Then, the suction table 107, the substrate moving stage 113, and the θ-axis moving stage 109 are moved in the X-axis direction.

  The moving bar 111 linearly moves in the X-axis direction along a slide rail or the like (not shown) laid on a holding portion 115 provided in parallel in one direction (X-axis direction) at both ends of the surface plate 117.

  The control unit 201 counts a signal such as a pulse output from the laser interferometer (laser measuring devices 125-1 to 125-3) and converts it into position information, and each control amount based on the amount is controlled by the θ axis. It outputs to the motor etc. which drive the moving stage 109, the moving stage 114, and the moving bar 111. In addition, you may arrange | position a linear scale etc. separately.

  The surface plate 117 is a plate made of stone or ceramic and requiring high flatness accuracy. In this embodiment, the substrate moving stage 113 on which the substrate 105 is mounted, the θ-axis moving stage 109, the moving stage 114, and the like move along the surface plate 117. Although not shown, it is desirable to provide a mechanism for moving the θ-axis moving stage 109, the moving stage 114, and the like on the surface plate 117 by air levitation.

  The ink jet head unit 103 is a unit in which a plurality of ink jet heads whose positions have been adjusted are arranged (see FIG. 10). The ink jet head unit 103 ejects ink onto the substrate 105 to form a pattern.

  The inkjet head unit 103 is connected to the gantry 119 via the slide part 122 and the slide rail 121, and linearly moves in the coating width direction (Y-axis direction). The slide part 122 and the slide rail 121 are mechanisms for adjusting the position of the inkjet head unit 103 in the Y-axis direction. As the moving mechanism, for example, a linear motor, a slide mechanism, or the like can be used. It is desirable to use an air levitation mechanism for the slide rail 121.

Note that precision measuring means such as a linear scale and a laser interferometer are disposed on the slide rail 121, and the motor is feedback-controlled based on the detected value of the linear scale and the like.
Further, a vertical movement mechanism may be provided in the θ vertical direction.
The gantry 119 is a portal frame fixed to the surface plate 117. A plurality of gantry 119 may be provided, or a slide rail drive or the like may be provided on gantry 119 to move in the X-axis direction.

  The alignment camera 127 images a predetermined portion of the substrate 105 (such as an alignment mark (not shown) formed on the substrate) in order to detect the θ-direction angle and the XY coordinates of the substrate 105 that is sucked and fixed to the suction table 107. Camera. The captured image of the alignment camera 127 is input to the control unit 201 (see FIG. 6 described later) of the pattern forming apparatus 101. The alignment camera 127 is fixedly supported on a frame (not shown) of the pattern forming apparatus 101.

  The control unit 201 (see FIG. 6 described later) performs a process of extracting the θ direction angle and the XY coordinates of the substrate 105 based on the captured image. The control unit 201 (see FIG. 6 to be described later) compares the extracted data with predetermined data to calculate a deviation thereof, and calculates a control amount so as to reduce the deviation.

  The control unit 201 (see FIG. 6 to be described later) controls the position of each stage by outputting respective control amounts to the θ-axis moving stage 109, the moving stage 114, the moving bar 111, and the like. As described above, the control unit 201 (see FIG. 6 described later) controls the substrate 105 to have a predetermined θ-direction angle and a predetermined XY coordinate based on the captured image of the alignment camera 127.

  That is, the pattern forming apparatus 101 controls the position of the θ-axis moving stage 109, the moving stage 114, the moving bar 111, etc., and positions the substrate 105 so that a predetermined θ-direction angle and a predetermined XY coordinate are obtained.

  After positioning the substrate 105, the pattern forming apparatus 101 moves the moving bar 111 in the X-axis direction (coating direction) and conveys the substrate 105 to a predetermined position below the inkjet head unit 103.

  The pattern forming apparatus 101 forms a pattern on the substrate 105 by ejecting ink from the nozzle holes of the inkjet head unit 103 at a predetermined timing, and moves the moving bar 111 by a predetermined distance in the X-axis direction. Pattern formation of the entire length in the X direction is performed. Further, the moving bar 111 is returned to the initial position, and the moving stage 114 and the inkjet head unit 103 are moved to predetermined positions in the Y-axis direction (coating width direction).

Further, the pattern forming apparatus 101 performs pattern formation on the entire length of the substrate 105 in the X-axis direction by ejecting ink from the nozzle holes of the inkjet head unit 103 and moving the moving bar 111 at a predetermined timing. The substrate 105 is moved by a predetermined distance in the X-axis direction while performing pattern formation, and then the head unit 103 is moved in the Y-axis direction to perform the next pattern formation while returning the X-axis direction to the initial position. May be.
The pattern forming apparatus 101 repeats the above processing steps to form a pattern on the entire substrate 105.

  FIG. 2 is a view of the pattern forming apparatus 101 described with reference to FIG. When the substrate moving stage 113 is viewed from the direction A, the bar mirror 123-1 is mounted so that the direction A is the normal direction of the reflecting surface (parallel to the Y axis) (see FIGS. 1 and 2). Further, the lower part (not limited to the lower part) of the bar mirror 123-1 gives the substrate moving stage 113 an angle with respect to both the X axis and the Y axis. A bar mirror 123-2 is attached to the portion having the angle.

FIG. 3 is a view of the substrate moving stage 113 as viewed from above in the θ direction, and the bar mirror 123-1 and the bar mirror 123-2 form a predetermined angle.
The bar mirror is an expensive reflecting mirror that requires high flatness accuracy on the surface, reflects measurement light emitted from a laser measuring device set at a predetermined position, and is used for length measurement.

  As shown in FIGS. 2 and 3, it is not necessary to attach the bar mirrors 123-1 and 123-2 to the entire width of the substrate moving stage 113 in the Y-axis direction, and the bar mirror 123-1 having the minimum required width with high dimensional accuracy. , 123-2 is preferred.

  In FIG. 1, a bar mirror 123-1 reflects the irradiation from the laser measuring devices 125-1 and 125-2. The laser measuring devices 125-1 and 125-2 irradiate measurement light in the X-axis direction (normal direction to the bar mirror 123-1). The bar mirror 123-2 reflects the irradiation from the laser measuring device 125-3. The laser measuring device 125-3 irradiates the bar mirror 123-2 with measurement light in the normal direction.

  The measurement light emitted from each of the laser measuring devices 125-1 to 125-3 is reflected by the bar mirror 123-1 or 123-2 and received by the light receiving unit of the original laser measuring device. In this embodiment, the laser measuring devices 125-1 to 125-3 are, for example, laser interferometers, and output interference fringes of incident waves and reflected waves as pulses to the control unit 201 (described later). The laser measuring devices 125-1 to 125-3 may be devices that install the light emitting unit and the light receiving unit at different positions.

  Although not shown in FIG. 1, a vibration isolator is provided below the surface plate 117 during the operation of the pattern forming apparatus 101 and during conveyance to prevent vibration of the surface plate 117 and to improve the accuracy of pattern formation. To maintain.

(2. Yaw correction and horizontal straightness correction)
FIG. 4 is a diagram for explaining conventional yaw correction and horizontal straightness correction, and FIG. 5 is a diagram for explaining yaw correction and horizontal straightness correction in the present embodiment.

  4 and 5 are views of the substrate moving stage 113 and the substrate 105 as viewed from above the θ axis. The suction table 107, the θ-axis moving stage 109, and the moving stage 114 are not shown.

  “Yaw correction” in FIGS. 4 and 5 is correction of the rotation direction when the substrate moving stage 113 advances in the X-axis direction (ink application direction).

  Further, the horizontal straightness correction in FIGS. 4 and 5 is correction of a shift in the Y-axis direction (ink application width direction) on the XY horizontal plane of the substrate moving stage 113.

  In FIG. 4, a bar mirror 124-1 is mounted on the side surface perpendicular to the X axis of the substrate moving stage 113, and laser measuring instruments 125-1 and 125-2 are disposed on the normal line of the bar mirror 124-1. Further, a bar mirror 124-2 is mounted on a side surface perpendicular to the Y axis of the substrate moving stage 113, and a laser measuring device 125-4 is disposed on the normal line of the bar mirror 124-2.

  The substrate moving stage 113 proceeds in the B direction (see FIG. 4) along the X axis in the process of forming a pattern by the above-described inkjet head unit 103. If the position information calculated from the laser measuring instruments 125-1 and 125-2 is equal, it is determined whether or not the measured value is correct. If correction is necessary, the substrate moving stage 113 is moved in the X-axis direction ( By moving the moving stage 114), position correction in the X direction is performed.

  If the position information calculated from the laser measuring devices 125-1 and 125-2 is different, yaw correction is performed in the X-axis direction. That is, the θ-axis moving stage 109 is rotationally moved to a position where the position information calculated from the laser measuring devices 125-1 and 125-2 is equal. Further, if correction is necessary, the position is corrected by moving the substrate moving stage 113 in the X-axis direction.

  If the position information calculated from the laser measuring device 125-4 before and after the movement is different after the X-axis direction position correction and the yaw correction by the laser measuring devices 125-1 and 125-2, the Y-axis of the substrate moving stage 113 is different. Correct the horizontal straightness of the direction. That is, the substrate moving stage 113 is translated in the Y-axis direction (by moving the moving stage 114) so that the position information calculated from the laser measuring instrument 125-4 becomes a predetermined value before the movement. Perform position correction (horizontal straightness correction).

  As described above, in the conventional yaw correction and horizontal straightness correction, in order to perform correction over the entire length of the substrate 105, the bar mirror 125 having substantially the same width (w1) as the length “l” of the substrate 105 in the X-axis direction. -4 had to be worn. However, with the recent increase in size of the substrate 105, the length “l” in the X-axis direction of the substrate 105 may exceed 2000 mm, making it difficult to obtain a bar mirror.

  FIG. 5 shows yaw correction and horizontal straightness correction of the pattern forming apparatus 101 in the present embodiment. In the present embodiment, a bar mirror 123-1 is mounted on a side surface perpendicular to the X axis of the substrate moving stage 113, and laser measuring instruments 125-1 and 125-2 are disposed on the normal line of the bar mirror 123-1. In addition, a bar mirror 123-2 is mounted on a side surface that is not perpendicular to both the X axis and the Y axis, and the laser measuring instrument 125-3 is disposed on the normal line of the bar mirror 123-2.

  The substrate moving stage 113 proceeds in the B direction (see FIG. 5) along the X axis in the process of forming a pattern by the above-described inkjet head unit 103. First, the X-axis direction position correction and the yaw correction by the laser measuring devices 125-1 and 125-2 are the same as the conventional method (described in FIG. 4).

  After the X-axis direction position correction and yaw correction by the laser measuring devices 125-1 and 125-2 are completed, the position information calculated from the laser measuring device 125-3 before and after the movement and the laser measuring device 125-1 or 125-2. Based on the calculated position information, the control unit 201 (see FIG. 6) calculates and corrects the horizontal straightness of the substrate moving stage 113 in the Y-axis direction. That is, the position correction (horizontal straightness correction) is performed by translating the substrate moving stage 113 in the Y-axis direction so that the position information calculated from the laser measuring instrument 125-3 becomes a predetermined value.

  The yaw correction and horizontal straightness correction in the present embodiment can be dealt with by using the bar mirror 125-3 having a short width (w2) with respect to the length “l” in the X-axis direction of the substrate 105. Therefore, it is possible to reduce the cost burden by using the existing bar mirror that can be manufactured with higher accuracy as the width is shorter.

(3. Control of pattern forming apparatus 101)
FIG. 6 is a diagram illustrating the configuration of the pattern forming apparatus 101 from the viewpoint of control. The pattern forming apparatus 101 includes a control unit 201, a positioning unit 209, a measurement unit 211, an ink discharge unit 213, and the like.

  The control unit 201 is a device that performs operation control, arithmetic processing, and the like of each device constituting the pattern forming device 101, and a computer or the like can be used, for example. The control unit 201 includes a CPU (Central Processing Unit) 203, a memory 205, a storage device 207, and the like.

  The CPU 203 calls a program stored in the storage device 207, a ROM (Read Only Memory: not shown), a storage medium (not shown), and the like to the memory 205 and executes it, and performs arithmetic processing and operation control processing.

The memory 205 is a ROM (not shown), a RAM (Random Access Memory: not shown), and the like, and holds various types of information permanently or temporarily.
A storage device 207 such as a hard disk may be used to hold various data such as various setting values and pattern formation history.

  The positioning unit 209 is a device that arranges the substrate 105 and the inkjet head unit 103 at predetermined positions. That is, in FIG. 1, a θ-axis moving stage 109 that moves the substrate 105, a moving stage 114, a moving bar 111, a slide part 122 that moves the inkjet head unit 103, and the like serve as a positioning part 209. Although not shown, an apparatus for adjusting the position and angle of at least one inkjet head constituting the inkjet head unit 103 is also one of the positioning unit 209.

  The measurement unit 211 is a device that measures position information of the substrate 105. According to FIG. 1, an alignment camera 127 that captures an image of a predetermined portion (an alignment mark formed on the substrate) of the substrate 105, laser measuring instruments 125-1 to 125-3 that perform position correction in each axial direction, and a bar mirror 123- 1, 123-2, and although not shown, a measurement unit 211 is a linear scale, a linear scale head, or the like for performing feedback control of a motor or the like.

  The ink discharge unit 213 is a device that discharges ink. The ink jet head unit 103 which is the ink discharge unit 213 forms a pattern by discharging ink from the ink jet head onto the substrate 105.

(4. Pattern formation flowchart)
FIG. 7 is a diagram simply showing a flowchart of pattern formation on the substrate 105 of the color filter according to the present embodiment. The flowchart of FIG. 7 will be described with reference to FIGS. 1 to 6 as appropriate.

  The control unit 201 of the pattern forming apparatus 101 loads a program (execution program, OS program, etc.) stored in the storage device 207 by the CPU 203 and various data necessary for executing the program onto the memory 205, and Perform the steps.

  The control unit 201 of the pattern forming apparatus 101 fixes the substrate 105 on which the color filter pattern is formed to the suction table 107 (step 1001). That is, a vacuum pump (not shown) or the like is driven through a small hole (not shown) for sucking air provided on the suction table 107 to suck air and reduce the pressure between the substrate 105 and the vacuum. As a result, the substrate 105 is fixed.

  Next, the control unit 201 sets the substrate 105 to an initial position in accordance with a predetermined location (an alignment mark (not shown) formed on the substrate) or the like on the substrate 105 (step 1002). That is, the control unit 201 acquires the alignment mark data of the substrate 105 by the alignment camera 127 that is the measurement unit 211, and positions the positioning unit 209 (the θ-axis moving stage 109, the moving stage 114, and the movement so that the predetermined position is obtained). The control amount is output to the bar 111) to move the substrate 105 to the initial position.

  The next step 1003 (step 1004 to step 1007) is a step according to the present embodiment. When the positioning unit 209 moves the substrate moving stage 113 (step 1004), the measuring unit 211 performs the substrate moving stage 113. If the position of the substrate moving stage 113 is not correct (NO in step 1006), the control unit 201 corrects the position of the substrate moving stage 113 (step 1007).

When a laser interferometer is used as the laser measuring instrument 125 of the measuring unit 211, the control unit 201 counts pulse signals and the like that are output by the laser interferometer by obtaining interference fringes and converts them into position information. The control unit 201 outputs a correction control amount to the positioning unit 209 based on the position information.
The details of step 1003 will be described in detail with reference to FIG.

  In parallel with the positioning step 1003 for measuring and correcting the position of the substrate moving stage 113, the control unit 201 applies ink from the ink ejection unit 213 to the substrate 105 to form a pattern (step 1008). That is, the pattern forming apparatus 101 always performs position correction of the substrate moving stage 113, starts ink discharge and stops ink discharge at a predetermined timing, and forms a pattern on the substrate 105.

  When pattern formation on the entire substrate 105 (X-axis direction and Y-axis direction) is completed (YES in step 1009), the pattern formation process is completed. That is, the control unit 201 performs pattern formation (step 1008) on the entire substrate 105 while performing movement and position correction (step 1003) of the substrate movement stage 113.

  Next, a detailed flowchart of step 1003 in FIG. 7 will be described with reference to FIG. FIG. 9 is a diagram for explaining the movement and position correction of the substrate moving stage 113.

  In FIG. 9, for the sake of explanation, the planar shape of the substrate moving stage 113 is different from the actual substrate moving stage 113 shown in FIGS. 1 to 3. In FIG. 9, the bar mirror 123-1 having a normal direction in the X-axis direction and the bar mirror 123-2 having an oblique direction with respect to the X-axis and the Y-axis are simply illustrated on the same plane.

  In FIG. 9, first, the substrate moving stage 113 on which the substrate 105 (not shown) is mounted is disposed at the position P1. The control unit 201 instructs the positioning unit 209 to move the substrate moving stage 113 to the position P2 in the X-axis direction. The position P3 is the actual movement position of the substrate movement stage 113 with respect to the target position P2. In the present embodiment, the control unit 201 of the pattern forming apparatus 101 measures the position of the substrate moving stage 113 and determines and corrects the deviation.

  In FIG. 8, first, the positioning unit 209 moves the substrate moving stage 113 (step 1004), that is, the control unit 201 moves the substrate moving stage 113 at the position P1 (see FIG. 9) to the target position P2 in the B direction. In order to do this, the moving stage 114 and the moving bar 111 are moved (step 1501).

The laser measuring instruments 125-1 to 125-3 measure the distance information of the substrate moving stage 113 at the position P1 before the movement, and hold it in the storage device 207 or the like. That is, the laser measuring device 125-3 distance _{a 1} to the point _{A 1,} the distance _{b 1} to the laser measuring device 125-1 points _{B 1,} a laser measuring device 125-2 distance _{c 1} to the point _{C 1} keeping. Incidentally, the yawing position _{P 1} in the substrate moving stage 113 is _corrected, a b ₁ = _c 1.
When a laser interferometer is used as the laser measuring devices 125-1 to 125-3, the control unit 201 counts pulse signals and the like output from the laser interferometer to obtain position information (distance).
Substrate moving stage 113 relative to the target position P _2, actually assumed that moved to the position P _3.

Next, the position measurement and determination (step 1005 and step 1006) described in FIG. 7 will be described in steps 1502 to 1506. The control unit 201 measures the X-direction position of the substrate 105 with the laser measuring devices 125-1 and 125-2 (step 1502). That is, the laser measuring device 125-1 distance _{b 2} to the point _{B 2,} laser measuring device 125-2 obtains the distance _{c 2} to the point _{C 2.}

The control unit 201 determines whether or not the moved substrate moving stage 113 has an inclination in the X-axis direction from the acquired data of the laser measuring instruments 125-1 and 125-2 (that is, the X-axis direction of the substrate moving stage 113). (Step 1503). That is, if b ₂ = c ₂ , the control unit 201 determines that there is no tilt in the X-axis direction of the substrate moving stage 113 (NO in step 1503).

However, although not described here, even if the measurement values of the laser measuring instruments 125-1 and 125-2 are b ₂ = c ₂ , the amount of movement of the substrate moving stage 113 in the X-axis direction (b ₂ − If b ₁ ) is different from the movement amount with respect to the movement target position P _{2, the} position of the substrate movement stage 113 is shifted in the X-axis direction. In this case, the control unit 201 moves the moving bar 111 to correct the position in the X-axis direction.

Here, returning to step 1503, if b ₂ and c ₂ of the acquired data of the laser measuring instruments 125-1 and 125-2 are not equal, the control unit 201 determines that the substrate moving stage 113 is inclined in the X-axis direction. It is determined that the yaw correction in the X-axis direction is necessary (YES in step 1503). Next, the control unit 201 proceeds to step 1007 for position correction, and performs angle correction of the substrate moving stage 113 by rotating the θ-axis moving stage 109 by a predetermined angle for yaw correction in the X-axis direction (step 1504). Return to step 1502.

Next, when there is no inclination in the X-axis direction (NO in step 1503), the control unit 201 acquires the measurement value (a ₂ + a _k ) of the point A _k of the laser measuring instrument 125-3, and A deviation in the Y-axis direction is calculated (step 1505).

That is, when the substrate moving stage 113 moves from the position P ₁ to the target position P _2, it moves a distance (b ₂ −b ₁ ) in the X-axis direction. Thus, from FIG. 9, the distance _{a 2} of point _{A 2} is calculated by the following equation (1).
a ₂ = a ₁ + (b ₂ −b ₁ ) sin θ (1)

Therefore, in the measured value (a ₂ + a _k ) of the point A _k after the movement, if a _k = 0, it can be seen that the Y-axis direction position of the substrate moving stage 113 has moved to the target position (YES in Step 1506). ), And proceeds to the next step 1008.

In the measured value (a ₂ + a _k ) of the point A _k after the movement, if a _k is not 0, the control unit 201 determines that the substrate moving stage 113 is displaced in the Y-axis direction (NO in Step 1506). ).

That is, in FIG. 9, the measurement value of the laser measuring device 125-3 deviation _{a k} of _(a 2 + _{a k),} to the "0" as the point _{A 3} is in the position of the point _{A 2,} the substrate The position is corrected by moving the moving stage 113 in the Y-axis direction (step 1507). The movement of the substrate moving stage 113 in the Y-axis direction is performed by moving the moving stage 114 in the Y-axis direction. As shown in FIG. 9, the correction distance in the Y-axis direction of the substrate moving stage 113 is calculated by the following equation (2).
Distance (A ₂ −A ₃ ) = a _k / cos θ (2)
When the correction of the position of the substrate moving stage 113 in the Y-axis direction is completed (step 1507), the process returns to step 1502.

(5. Other)
In the present embodiment, the bar mirror 123-1 having the X-axis direction as the normal direction of the reflecting surface and the bar mirror 123-2 having an angle in both the X-axis direction and the Y-axis direction are used as the side surface of the substrate moving stage 113. However, if the position detection, position correction, and yaw correction of the substrate moving stage 113 according to this embodiment are performed, the mounting position, number of mounting, mounting angle, and mounting length of the bar mirror are used. The above is not limited to the present embodiment. Further, the shape of the bar mirror is not limited to the present embodiment.

  Although the laser measuring instrument for detecting the position of the substrate moving stage 113 has been described as an apparatus including a light emitting unit and a light receiving unit at the same time in the present embodiment, it may be provided with a light emitting unit and a light receiving unit separately. In this case, the light emitting unit, the light receiving unit, and the bar mirror are arranged so that the incident angle from the light emitting unit to the bar mirror is equal to the reflection angle with respect to the light receiving unit.

(6. Effects, etc.)
As described above, the pattern forming apparatus 101 according to the present embodiment has a cost that a conventional product can be used without increasing the width of the bar mirror by attaching the bar mirror obliquely even when the substrate size is increased. There is a positive effect. That is, there is an effect of reducing the cost burden associated with obtaining the bar mirror.

  In addition, when detecting the displacement of the position of the substrate moving stage 113 in the coating width direction, the cost burden can be reduced by adopting a bar mirror with a short width. In addition, the shorter the width, the higher the surface processing and manufacturing accuracy of the bar mirror and the higher the quality, so that there is an effect of maintaining or improving the position detection accuracy beyond the current level. As a result, there is an effect of maintaining or improving the pattern formation accuracy of the substrate 105.

  The technical scope of the present invention is not limited to the embodiment described above. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of pattern forming apparatus 101 in the present embodiment The figure which looked at the board | substrate 105 grade | etc., From the A direction of FIG. The figure which looked at the board | substrate movement stage 113 grade | etc., From the upper part of FIG. The figure explaining the conventional yaw correction and horizontal straightness correction The figure explaining the yaw correction and horizontal straightness correction in this Embodiment The figure explaining the data processing of the pattern formation apparatus 101 Flow chart of pattern formation Flow chart of substrate 105 movement / position correction Diagram explaining position correction Conventional inkjet head arrangement and positioning method Conventional inkjet head arrangement and positioning method

Explanation of symbols

101 ......... Pattern forming apparatus 103 ......... Inkjet head unit 105 ......... Substrate 107 ......... Suction table 109 ......... θ-axis moving stage 111 ......... Moving bar 113 ......... Substrate moving stage 114 ......... Moving stage 115 ......... Holding part 117 ......... Surface plate 119 ......... Gantry 121 ......... Slide rail 122 ......... Sliding parts 123-1, 123-2, 124-1, 124-2 ......... Bar mirror 125-1, 125-2, 125-3 .... Laser measuring device 127 .... Alignment camera 201 ..... Control unit 203 ..... CPU
205 ......... Memory 207 ......... Storage device 209 ......... Positioning unit 211 ......... Measurement unit 213 ......... Ink ejection unit 501 ......... Inkjet head 502 ......... Nozzle hole 503 ......... Pattern 504 ... ... Adjustment mechanism (Y direction)
505 ... Adjustment mechanism (θ direction)

Claims (11)

A positioning stage for positioning a substrate,
Linear movement means for linearly moving the substrate support portion supporting the substrate in a first direction;
Second linear movement means for linearly moving the substrate support portion in a second direction orthogonal to the first direction;
A first reflector mounted on the substrate support portion and having the first direction as a normal direction of a reflecting surface;
A second reflector mounted on the substrate support portion and having a direction that forms a predetermined angle with both the first direction and the second direction as a normal direction of the reflecting surface;
First position correction means for irradiating the first reflector with the first measurement light, analyzing the reflected light, and correcting the position of the substrate support;
Second position correction means for irradiating the second reflector with second measurement light, analyzing the reflected light, and correcting the position of the substrate support;
A positioning stage comprising: The first position correction means corrects the orientation of the substrate support portion with respect to the first direction,
The positioning stage according to claim 1, wherein the second position correcting unit corrects the position of the substrate support portion in the second direction. Comprising a rotating means for rotating the substrate support,
2. The positioning stage according to claim 1, wherein the first position correcting unit corrects the orientation of the substrate support portion with respect to the first direction by the rotating unit.   2. The positioning stage according to claim 1, wherein at least one of the first position correction unit and the second position correction unit performs length measurement by optical triangulation using a laser beam to perform position correction. .   2. The positioning stage according to claim 1, wherein at least one of the first position correction unit and the second position correction unit performs position correction using position information acquired by a laser interferometer. .   A pattern forming apparatus comprising the positioning stage according to claim 1 and performing pattern formation on the substrate.   An inspection apparatus comprising the positioning stage according to claim 1 and inspecting the substrate. A position correction method for correcting the position of a substrate,
A first linear movement step of linearly moving a substrate support portion supporting the substrate in a first direction;
A second linear movement step for linearly moving the substrate support portion in a second direction orthogonal to the first direction;
A first reflector that is mounted on the substrate support and has the first direction as the normal direction of the reflecting surface is irradiated with the first measurement light, and the reflected light is analyzed to correct the position of the substrate support. A first position correction step to be performed;
A second measuring light is irradiated to a second reflector that is mounted on the substrate support and has a direction normal to the reflecting surface that is at a predetermined angle with both the first direction and the second direction. A second position correction step for analyzing the reflected light and correcting the position of the substrate support portion;
A position correction method comprising: The first position correcting step corrects the orientation of the substrate support portion with respect to the first direction,
The position correction method according to claim 8, wherein the second position correction step corrects a position of the substrate support portion in the second direction.   9. The position correction method according to claim 8, wherein the first position correction step corrects the orientation of the substrate support portion with respect to the first direction by rotating the substrate support portion. In a positioning stage for positioning a substrate, a substrate support unit for supporting the substrate,
A first reflector that has a first direction as a normal direction and reflects measurement light;
A direction that forms a predetermined angle with both the first direction and the second direction perpendicular to each other, and a second reflector that reflects the measurement light;
A substrate support section comprising:

Images