JP2006242222A - Integrated gas control device and its method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an integrated gas control device which is highly integrated with piping equipment to be mounted thereon, for improving the foot-print performance of a whole manufacturing device, when mounted on the manufacturing device such as a semiconductor manufacturing device by miniaturizing a control device body, and to provide its method. <P>SOLUTION: A plurality of opening portions 14 are formed in surface and reverse 13a, 13b of a flow path plate 13 having a gas flow path 12, in communication with the flow path. The opening portions 14 are arranged in zigzag along the surface and reverse 13a, 13b of the flow path plate 13. The piping equipment 100 is arranged in each of the opening portions 14 to hold the surface and reverse 13a, 13b of the flow path plate 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides an integrated gas control device for controlling the flow rate of a gas fluid such as a process gas by mounting various piping devices such as a manual valve, an automatic valve, and a mass flow controller in a process step such as semiconductor and liquid crystal. The present invention relates to an integrated gas control method.

  An integrated gas control device configured by mounting piping equipment such as an integrated valve is usually provided with a base plate provided with a substantially rail-shaped mounting portion that is one base rail for one fluid control line. A flow path block, which is a joint in which a gas flow path is formed inside, is installed on the base rail, and the flange portion provided on the piping equipment is bolted in a state where each piping equipment is placed on the flow path block. Tightened with and firmly attached. A gasket is installed between the piping equipment and the flow block, and when tightening the bolts, the gasket is crushed so as to sandwich the gasket to seal between the piping equipment and the flow block by metal touch. The structure prevents gas leakage from the connection.

  Inside the channel block, a channel hole for connecting the inlet side and outlet side channels of adjacent piping devices is formed, and this channel hole is formed by drilling with a processing machine or the like, for example. The The flow path hole is provided so as to open to one surface side of the flow path block, and the inlet side and the outlet side of the adjacent one side piping device are provided at the inlet side and the outlet side of the flow path hole. The flow path on the outlet side of the equipment is attached and fixed so as to be connected, and each piping equipment is arranged on one side of the flow path block in a predetermined order to constitute the flow path of the integrated gas control apparatus as a whole.

As this type of integrated gas control device, for example, a unit mounting surface and a gas flow path connecting between piping devices are formed intermittently, and such an opening at the end of the flow channel is opened in the mounting surface. There is one in which integrated units such as a filter, a regulator, and a valve are connected to the base block (for example, see Patent Document 1). Each integrated unit is bolted to the mounting surface of the base block by a mounting plate and fixed to one surface side of the base block.
The gas flow path inside the base block is located between the integrated units, and is a V-shaped flow path having a flow path opened on one side in a V shape, and a supply flow in which one flow path is opened on each end face side. It is formed by a channel and a discharge channel, and connects the ports of adjacent integrated units.

  In addition, in a process gas line for a gas panel assembly for handling process gas, the mounting device has an internal gas passage for supplying gas such as process gas and extends from the manifold surface in a gas flow communication state with the connection port. There is a process gas line with a single body manifold having a plurality of device connection ports along the manifold surface in communication with the internal gas passages for (see, for example, Patent Document 2). A flow path is formed by drilling a hole in the manifold, and adjacent active device regions are connected to one side of the manifold by a connection hole having a V-shaped cross section formed by the opening and the hole. The gas can be supplied from the device to the next device through the connection hole.

Further, for example, there is an integrated gas control device as shown in FIG. This gas control device 1 is used for connecting a flow path of each piping device 4 such as a valve, a regulator, and a pressure sensor to the base body 2 by forming a concave flow path hole 3 inside the plate-shaped base body 2. The gas outlet 5 and the gas inlet 6 are formed. Each piping device 4 is attached to the surface 2a side which is one direction side with respect to the base body 2, and at the time of installation, the piping device 4 is placed so that the flow path is aligned with the gas outlet 5 and the gas inlet 6. In this state, the mounting plate 7 fixed to each piping device 4 is fixed and fixed with fixing bolts 8, and the piping device 4 is mounted in a state of being arranged side by side on the base body 2.
Thus, in the integrated gas control device including the integrated gas control device of Patent Documents 1 and 2 and FIG. 5, in each case, each piping device is attached to one surface side of the base body.
Further, the mounting interval of the piping devices 4 is usually determined as basic performance. For example, the mounting pitch between the piping devices except the mass flow controller 9 is generally set to 40 mm.
JP 2000-171000 A JP-T-2001-521120

  As described above, since the mounting pitch of the piping equipment is determined to be a constant value as the basic performance, it is necessary to mount the piping equipment according to this mounting pitch. When the piping devices 4 are mounted side by side on one plane of the base body 2 as in the integrated gas control device 1 of FIG. 5, each piping device 4 needs to have a mounting dimension that is at least the dimension of the mounting plate 7. Become. In addition, when this is expressed as the total of spans (intervals between the piping devices 4), for example, the number of spans sandwiched between five piping devices 4 mounted on the right side of the mass flow controller 9 in the figure is four. In the flow direction of the gas flow path (line), span 4 (pieces) × span pitch length l: 40 (mm) = 160 (mm) or more Mounting dimensions were required. Since the length l of the pitch is a minimum length necessary for fixing the piping device 4 to the base body 2, the entire length of the integrated gas control device 1 cannot be further reduced. The seed gas control apparatus 1 has a long stick length (the entire length of the gas control apparatus) Y, which is the distance between the connecting portions 2b and 2c that connect external flow paths (not shown). For this reason, the installation place of the gas control apparatus 1 was limited.

  For this reason, for example, when an apparatus such as a semiconductor manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) is provided using an integrated gas control apparatus, there arises a problem that an arrangement space of the integrated gas control apparatus in the manufacturing apparatus increases. Ensuring this installation space was a major design constraint when designing the device. As described above, the integrated gas control device of the type in which the piping device 4 is arranged in parallel on one plane of the base body 1 is large in size, so that it is difficult to lay out the entire manufacturing device. There was a problem in terms of the footprint and the footprint. As described above, this type of integrated gas control device is difficult to achieve high integration due to limited installation locations in the manufacturing apparatus.

  The present invention has been developed in view of the conventional problems, and an object of the present invention is an integrated gas control device that can be equipped with piping equipment by high integration, and by downsizing the control device main body. An object of the present invention is to provide an integrated gas control device and an integrated gas control method capable of improving the footprint of the entire manufacturing apparatus when mounted on a manufacturing apparatus such as a semiconductor manufacturing apparatus.

  In order to achieve the above object, the invention according to claim 1 is provided with a plurality of openings communicating with the flow path on the front and back surfaces of the flow path plate having the gas flow path. The integrated gas control device is arranged in a zigzag state along the front and back surfaces, and the piping device is disposed in each opening so as to sandwich the front and back surfaces of the flow path plate.

  The invention according to claim 2 is the integrated gas control device in which the plurality of openings are composed of an inlet and an outlet of a piping device arranged on the front and back surfaces of the flow path plate.

  The invention according to claim 3 is an integrated gas control device in which piping equipment is disposed in openings formed on the front and back surfaces of the flow path plate, and the piping equipment is disposed in a staggered manner on the front and back surfaces of the flow path plate. .

  In the invention according to claim 4, in the gas flow path, the tapered flow path and the reverse tapered flow path are sequentially formed from the outlet side flow path of the primary side piping equipment to the inlet side flow path of the secondary side piping equipment. It is the integrated gas control apparatus which was formed.

  The invention according to claim 5 is the integrated gas control device in which the piping device is a valve, a regulator, a pressure sensor, a mass flow controller, or other devices.

  The invention according to claim 6 supplies the gas fluid to the gas flow path formed in the flow path plate, and has an inlet and an outlet that are arranged in a zigzag state along the front and back surfaces of the flow path plate. This is an integrated gas control method in which gas control is performed with piping equipment that is sequentially supplied to the openings having the flow path and sequentially arranged in a zigzag manner in the openings on the front and back surfaces of the flow path plate.

The invention according to claim 1 is an integrated gas control device that can efficiently mount piping equipment and reduce the overall size, and a predetermined number of piping equipment is mounted in a limited space by high integration. Therefore, it is an integrated gas control device that can be applied to any installation location. Therefore, by mounting this integrated gas control device main body on a manufacturing apparatus such as a semiconductor manufacturing apparatus, it is possible to save space in the entire manufacturing apparatus and improve the footprint.
Furthermore, it can be installed around gas-type devices such as directly attached to the chamber, can be flexibly adapted to various installation locations, and it is easy to change the line configuration of piping equipment mounted on the control device body. An integrated gas control device that can be implemented.
In addition, for example, a flow path plate can be configured easily from a single plate-like member, and by making the flow path plate into a plate shape, man-hours can be reduced in manufacturing processes such as welding and polishing, It is an integrated gas control device that can be easily manufactured.

  According to the invention which concerns on Claim 2, it is an integrated gas control apparatus which can arrange | position piping equipment to the front and back of a flow-path plate efficiently, and can reduce a control apparatus main body.

  According to the third aspect of the present invention, the integrated gas control device can be formed while being made compact as a whole, and the length at the time of installation can be greatly shortened, and it can be attached to any location.

  According to the invention of claim 4, since the outlet side channel and the inlet side channel of the piping equipment to be connected can be formed in a straight line, the gas fluid can flow smoothly without stagnation. This is an integrated gas control device that can prevent the occurrence of gas. Further, the integrated gas control device can easily form the flow path.

  According to the invention which concerns on Claim 5, various piping equipment can be mounted, the combination of piping equipment is changed according to required flow path structure, and the control apparatus main body which exhibits a desired gas control function is comprised. An integrated gas control device that can.

  According to the invention which concerns on Claim 6, it is possible to perform control while smoothly flowing the gas fluid to the integrated gas control device in which a predetermined number of piping devices are installed in a limited space by high integration. This is an integrated gas control method that can prevent the internal gas fluid from staying or prevent the generation of particles to reliably control the gas with high precision.

An embodiment of an integrated gas control device according to the present invention, its operation, and an integrated gas control method will be described in detail with reference to the drawings.
1 to 4 show an integrated gas control apparatus according to the present invention. The integrated gas control device main body 10 is provided with a gas control line 11 for controlling supply of fluid such as process gas. The gas control line 11 is configured by communicating each piping device 100 provided in a vertical shape with the gas flow path 12 provided in the plate-shaped flow path plate 13, and the piping device 100 is connected to the flow path plate 13. The control device main body 10 is configured by mounting. In the present embodiment, as shown in FIG. 2, a plurality of gas flow paths 12 are arranged side by side on the fluid plate 10, and piping devices 100 are arranged in each gas flow path 12 to form a plurality of gas control lines 11. I have to.

  A plurality of openings 14 communicating with the gas flow path 12 are formed in the front and back surfaces 13 a and 13 b of the flow path plate 13, and the openings 14 are arranged on the front and back faces 13 a and 13 b of the flow path plate 13. It consists of the inlet 14a and the outlet 14b of the piping apparatus 100, and this opening part 14 is arrange | positioned in zigzag state along the front and back surfaces 13a and 13b of the flow-path plate 13, as shown in FIG. The inlet side channel 100b and the outlet side channel 100c of the piping device 100 disposed in the opening 14 are connected to the inlet port 14a and the outlet port 14b, respectively. The gas flow path 12 is formed by sequentially forming a tapered flow path and a reverse tapered flow path from the outlet side flow path 100 c of the primary side piping device 100 to the inlet side flow path 100 b of the secondary side piping device 100. .

The opening 14 is processed by a control processing machine having a drill drill or the like (not shown), and is formed so as to be penetrated while providing a predetermined inclination from the thickness direction of the flow path plate 13 at the time of processing. The controlled processing machine can be controlled by computer control or the like, and can continuously process one plate-like member to form the opening 14, thereby enabling processing in a short time.
In FIG. 1, the pitch length (pitch between the piping devices 100) p from one set of openings 14 to the other openings 14 is formed by the same length, and thus the mounting interval of the piping devices 100 is set as described above. When the same mounting area in the mounting direction of each piping device 100 is made the same, the piping device 100 can be connected to any opening 14, and the flow of the control device main body 10 can be changed. Even if the mounting position or mounting order of the piping device 100 is changed due to a change in the path or the like, the piping device 100 can be mounted and there is no need to newly form a flow path plate.
Here, if the length p of the pitch from the opening 14 to the other opening 14 is 40 mm, the five piping devices 100 mounted on the right side of the mass flow controller 107 in the control device body 10 are mounted. As shown in FIG. 1, the mounting dimension may be the length p of the pitch of two spans, and the mounting dimension of span 2 (pieces) × span pitch length p: 40 (mm) = 80 (mm) Can be suppressed. This mounting dimension is significantly shorter than 160 (mm), which is the mounting dimension when five piping devices in FIG. 5 are arranged side by side, and therefore, the control device body 10 will be described later. The stick length X (the overall length of the control device main body 10) X, which is the distance between the connecting portions 22 and 23, can be greatly reduced with respect to the stick length Y in FIG.

The deep hole 15 shown in FIG. 4 is formed for mounting a gasket (not shown) made of stainless steel that seals the inlet / outlet channels 100 b and 100 c of the piping device 100 and the opening 14 of the channel plate 13. The gasket is formed in a substantially C-shaped cross section, and when a compressive force is applied, a seal shape called a so-called C seal, or a cross section in which two projections provided on the upper and lower sides exert a sealing force. There is a so-called W-seal seal shape that is formed in a substantially inverted U shape and seals on the upper side and the expanded surface side when a compressive force is applied, and any seal-shaped gasket may be used. . In addition, gaskets having other structures can be used.
An outer periphery of the deep hole 15 is cut into a circular shape by a control processing machine to form a mounting recess 17 for mounting the piping device 100.

When the control device main body 10 is configured, the piping device 100 is disposed in the openings 14 formed in the front and back surfaces 13a and 13b of the flow path plate 13, and the piping device 100 is staggered on the front and back surfaces 13a and 13b. It arrange | positions and it arrange | positions so that front and back 13a, 13b may be pinched | interposed when the piping apparatus 100 is each arrange | positioned at each opening part 14. As shown in FIG.
When the piping device 100 is mounted, the inlet-side flow channel 100b and the outlet-side flow channel 100c are flown in a state where a gasket is sandwiched between the lower surface side and the deep hole 15 formed flat on the body 100a of the piping device 100. While being connected to the inlet 14a and outlet 14b of the path plate 13, respectively, the pipe is fixed to the flow path plate 13 by fixing by an appropriate means, for example, a fixing means using a union nut (not shown) called a center lock means. The device 100 is securely mounted in a positioned state. The gasket has holes for fluid passage (not shown), and the inlet-side channel 100b, the outlet-side channel 100c, the inlet port 14a, and the outlet port 14b communicate with each other through these holes. The piping device 100 and the flow path plate 13 are sealed.

  When the piping device 100 is attached by the center lock means, the piping device 100 is not likely to be tilted from the state where it is positioned with respect to the flow path plate 13, so that there is no risk of one-side tightening and a tight seal state can be maintained. It becomes possible. In particular, if the connection is made while screwing and fixing using a union nut, the entire piping device 100 can be tightened in a balanced manner without generating a couple of forces by a simple operation, and the sealing performance is improved. Further, since the volume of the attachment portion can be suppressed, the size can be reduced.

As the mounting structure of the piping device 100, in addition to the center lock means using a union nut, for example, it is fixed by welding, or the piping device 100 is fixed from the upper side with four fixing bolts 18 as shown in FIG. It can also be fixed to the flow path plate 13 by tightening with the fixing bolt 18, and when fixed with the fixing bolt 18, the flow path plate 13 is attached by the mounting portion 19 which is a fixing block fixed to the piping device 100 on the front and back surfaces 13 a, 13 b side. Therefore, the fixing bolt 18 can be fixed to the overlapping portion of the mounting portion 19, whereby not only the fixing bolt 18 can be firmly tightened and fixed, but also the number of the fixing bolts 18 can be reduced. The block 19 on which the piping device 100 is mounted may be fixed with fixing bolts 18, but the other flow path plate 13 and the block 19 are integrally bonded using means for bonding the metal material surfaces, for example, friction stir welding. You may do it.
Moreover, the attachment structure of the piping apparatus 100 can also be attached by various structures besides this.

  In this embodiment, the piping device 100 includes an inlet-side manual valve 101 that opens and closes a flow path, an automatic valve 105 that opens and closes a flow path, and an automatic valve 109 that opens and closes a gas flow path. Valve, filter unit 102 for removing impurities contained in gas, regulator 103 for adjusting the pressure of gas, pressure transducer (pressure sensor) 104 for detecting the pressure of flowing gas, automatic valve, sensor, bypass, sensor inside An amplifier and the like are mounted, and further, a mass flow controller 107 that automatically controls a set flow rate value given by an electric signal without being affected by an environmental temperature to be used or a supply gas pressure, and other devices. When the mass flow controller 107 according to the present embodiment is mounted, it is necessary to form the interval between the openings 14 in accordance with the interval between the inlet and outlet channels (not shown), but the mass flow controller 107 is automatically installed inside. By dividing into a valve part having a valve and a sensor bypass part having a sensor, a bypass, and a sensor amplifier inside, and forming the attachment part of each divided unit in the same shape as the attachment part 19 of another piping device 100 It can also be mounted at the same pitch as other piping equipment 100.

Of course, the piping device 100 can be mounted on the control device main body 10 by a combination other than the above, and any combination can be used according to the type of fluid, the application, and the like. Further, for example, the manual valve 101 may have a manual operation mechanism with a toggle structure that is not repelled by a spring. If the mounting area in the mounting direction is the same as described above, the same manual valve may be used. Even in this case, a valve with a different operation method can be mounted. Furthermore, it is needless to say that other piping devices having different aspects can be attached as long as the piping devices have the same mounting area.
Further, a purge valve (not shown) may be mounted as a piping device. In this case, a purge flow path (not shown) is formed in the flow path plate 13, and the purge valve is mounted so as to be connected to the purge flow path. The gas fluid can be purged via the purge valve.

1, 3, and 4, an inlet-side communication channel 20 and an outlet-side communication channel 21 are formed on the side surface of the channel plate 13. The inlet-side communication channel 20 is formed to communicate with the outside so that a gas fluid can flow in from the inlet-side channel 100b side of the manual valve 101 which is a piping device on the inlet side. 21 is formed in communication with the outside so that the gas fluid can flow out from the outlet-side flow path 100c side of the automatic valve 109 which is piping equipment on the outlet side. When a fluid such as a gas flows into the main body of the flow path plate 13 from the inlet side communication flow path 20, the fluid is controlled by each piping device 10 and flows out from the outlet side communication flow path 21.
The connection parts 22 and 23 are connection parts provided in the inlet side communication flow path 20 and the outlet side communication flow path 21, and are provided so as to be connectable to other connection flow paths (not shown) via the connection parts 22 and 23. .

In FIG. 4, a mounting member 25 for mounting is provided on the side surface of the flow path plate 13 along the flow path direction, and the plate-shaped mounting member 25 is provided with a bolt mounting hole 26. By fixing to the side surface of the plate 13, the side surface side of the control device main body 10 can be attached. For example, it can be directly fixed to the outer peripheral surface of the chamber in a semiconductor manufacturing apparatus (not shown). The mounting member 25 may have a shape other than a plate shape. Further, a hole for fixing may be formed in the flow path plate 13 in advance, and the hole may be fixed using a bolt as the mounting member. Good.
When the mounting member 25 is provided, the control device main body 10 can be directly mounted on a wall surface portion such as a chamber as described above. Therefore, it is necessary to provide an installation location for a manufacturing apparatus such as a semiconductor manufacturing apparatus. This leads to a further improvement in the footprint of the entire manufacturing apparatus.

  In the above embodiment, the flow path plate 13 is formed from a single plate-like member, but may be formed by combining a plurality of plate-like members or block-like members. Further, the flow path plate 13 is preferably formed using stainless steel as a material, but may be a metal material other than stainless steel, or may be formed using a material having other corrosion resistance such as a resin.

Next, the operation of the integrated gas control device and the integrated gas control method in the above embodiment will be described.
In the integrated gas control apparatus of the present invention, a plurality of openings 14 communicating with the flow path are formed in the front and back surfaces 13a and 13b of the flow path plate 13, and the openings 14 are formed on the front and back surfaces 13a and 13a of the flow path plate 13. 13b is arranged in a zigzag state along the line 13b, and the piping device 100 is arranged in the zigzag state so as to sandwich the front and back surfaces 13a, 13b of the flow path plate 13 in the opening portion 14. In addition, the piping device 100 can be disposed on the front and back surfaces 13a and 13b, and the outlet side flow channel 100c and the inlet side flow channel 100b of the piping device 100 disposed on the front and back surfaces 13a and 13b are passed through the outlet 14c and the inlet 14b. Since the connection is made by the flow path 12, the installation length of the piping device 100 can be shortened, and compared with the stick length Y in FIG. 5 when the piping devices are mounted side by side on one plane. It is possible to shorten the stick length X of the entire controller body 10 in FIG. 1 and. In this case, the stick length X is the length from the connecting portion 22 to the connecting portion 23, and is the sum of the distance from the piping device 100 on both the left and right sides to the connecting portions 22, 23. Compared with the case where they are arranged side by side, the actual reduction is about 60%.

As described above, when the piping device 100 is disposed on the front and back surfaces 13a and 13b of the flow path plate 13, the control device main body 10 can be shortened, and the control device main body 10 can be installed even in a narrow place. Therefore, when a manufacturing apparatus such as a semiconductor manufacturing apparatus is configured using the control apparatus main body 10, an integrated gas control apparatus can be configured while a predetermined number of piping devices 100 are mounted in a limited installation location. By downsizing the control device main body 10, the footprint of the manufacturing apparatus can be improved, and the entire manufacturing apparatus can be highly integrated.
In addition, since the piping device 100 can be mounted and fixed directly on the plate-like flow path plate 13, no mounting base rail is required, and the number of parts can be reduced. Therefore, these can be improved also in terms of cost, delivery date, weight reduction, and design man-hours.

When a fluid is allowed to flow to the control device main body 10, a gas fluid is supplied to the gas flow path 12 formed in the flow path plate 13, and the gas flow path 12 passes through the front and back surfaces 13 a and 13 b of the flow path plate 13. Are sequentially supplied to the opening 14 having the inlet 14a and the outlet 14b arranged in a zigzag state along the pipe, and the gas control is performed by the piping device 100 sequentially arranged in the zigzag state in the opening 14. 10 is controlled. At this time, since the gas fluid flows linearly through the gas flow path 12 inside the control device main body 10, the gas fluid can flow smoothly, and the gas fluid stays inside the gas flow path 12 or particles are generated. To prevent you from doing.
When fluid is supplied from the inlet side communication channel 20, a plurality of gas channels 12 are provided in series on the channel plate 13, and supply of fluid is controlled from each communication channel 20 to control the gas channel 12. In addition to this, for example, when providing a purge flow path, a purge flow path of an adjacent gas flow path is connected in advance, and a part of the flow path is shared with another gas flow path. As a result, the flow path plate 13 can be further reduced in size, and the flow path can be further simplified, and control can be performed while further suppressing generation of particles and the like.

It is a partially cutaway side view showing one embodiment of an integrated gas control device in the present invention. It is a perspective view of the integrated gas control apparatus main body. It is explanatory drawing which showed the flow of the fluid. It is a partially cutaway perspective view showing an example of a flow path plate. It is the side view which showed the conventional gas control apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Control apparatus main body 12 Gas flow path 13 Flow path plate 13a Front surface 13b Back surface 14 Opening part 14a Inlet 14b Outlet 100 Piping equipment 100b Inlet side flow path 100c Outlet side flow path

Claims (6)

A plurality of openings communicating with the flow path are formed on the front and back surfaces of the flow path plate having the gas flow paths, and these openings are arranged in a zigzag state along the front and back surfaces of the flow path plate. An integrated gas control device characterized in that piping devices are arranged in the respective sections so as to sandwich the front and back surfaces of the flow path plate. 2. The integrated gas control device according to claim 1, wherein the plurality of openings include an inlet and an outlet of piping equipment disposed on the front and back surfaces of the flow path plate. The integrated gas control device according to claim 1 or 2, wherein piping devices are arranged in openings formed on the front and back surfaces of the flow path plate, and the piping devices are arranged in a staggered state on the front and back surfaces of the flow path plate. . The said gas flow path formed the taper flow path and the reverse taper flow path in order from the exit side flow path of the primary side piping equipment of the said flow path plate to the inlet side flow path of the secondary side piping equipment. 4. The integrated gas control apparatus according to any one of 3 above. The integrated gas control device according to any one of claims 1 to 4, wherein the piping device is a valve, a regulator, a pressure sensor, a mass flow controller, or other devices. A gas fluid is supplied to the gas flow path formed in the flow path plate, and the gas flow path is sequentially supplied to openings having an inlet and an outlet arranged in a staggered manner along the front and back surfaces of the flow path plate. An integrated gas control method characterized in that gas control is performed by piping equipment sequentially arranged in a staggered manner in the openings on the front and back surfaces of the flow path plate.

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