JP2006031599A - Semiconductor device and production method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces possibility that an IC chip is broken or that wire breakage is generated in connection of the IC chip and a wiring line formed on a base material, when or after producing a semiconductor device wherein a semiconductor substrate with the IC chip mounted on the base material is sealed by a resin, and suppresses reduction of a function in the semiconductor substrate, and also to provide a production method therefor. <P>SOLUTION: A non-contact type IC tag 10 has: an inlet 15 comprising the base material 11, and the IC chip 13 and an antenna 12 provided on one face thereof and electrically connected to each other; a magnetic material layer 20 disposed such that the magnetic material layer 20 covers the IC chip 13 and the antenna 12 constituting the inlet 15; and a casing 25 comprising a first resin member 21 and a second resin member 23 provided to envelop the inlet 15 disposed with the magnetic material layer 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor device and a manufacturing method thereof, and more particularly to a semiconductor device in which a semiconductor substrate having an IC chip mounted on a base substrate is sealed with a resin and a manufacturing method thereof.

  In recent years, RDIF media such as non-contact type IC tags, non-contact type IC labels, or non-contact type IC cards that can write and read information in a non-contact state can be used. Has been. Since these RFID media can write and read information in a non-contact state, and depending on the specifications, information can be written and read simultaneously on a plurality of RFID media, it is rapidly spreading. It's getting on.

11A and 11B are schematic views showing an example of a conventional non-contact IC tag, in which FIG. 11A is a plan view showing an internal structure, and FIG. 11B is a cross-sectional view taken along the line CC of FIG.
The non-contact type IC tag 100 of this example is bonded to an inlet 110 in which an antenna 102 is formed on a resin sheet 101 and an IC chip 103 is mounted, and an adhesive 111 is bonded to the inlet 110. The top sheet 112 is constituted.

  The antenna 102 is formed in a coil shape on the resin sheet 101, and both ends thereof are connected to the IC chip 103 by the contacts 104. The IC chip 103 can write and read information through the antenna 102 in a non-contact state. The top sheet 112 is made of a resin film or the like, and is adhered to the surface of the inlet 110 on which the IC chip 103 is mounted to protect the IC chip 103.

  When the non-contact type IC tag 100 is brought close to an information writing / reading device (not shown) provided outside, a current flows through the antenna 102 due to electromagnetic induction from the information writing / reading device. 102 is supplied to the IC chip 103 from the contact point 104 via the contact 104, whereby information is written from the information writing / reading device to the IC chip 103 in a non-contact state, or information written to the IC chip 103 is transferred to the information chip. Read by a read / write device.

  Here, in a semiconductor substrate in which an IC chip is mounted on a base substrate like the non-contact IC tag 100, a protective member such as a surface sheet is bonded to the surface on which the IC chip is mounted. Thus, the IC chip is protected.

  Further, the surface of the semiconductor substrate on which the IC chip is mounted is covered with a resin, and then the surface of the semiconductor substrate on which the IC chip is mounted is covered with a resin, whereby the IC chip Has been devised (see, for example, Patent Document 1). In this technology, first, a surface of a semiconductor substrate on which an IC chip is mounted is covered with a resin, then a mold is placed on the semiconductor substrate, and the resin is placed in the mold. The surface of the semiconductor substrate on which the IC chip is mounted is coated with resin. As a result, the semiconductor substrate on which the IC chip is mounted is sealed with resin, so that the protection against the IC chip can be enhanced compared to the case where a protective member such as a surface sheet is bonded on the semiconductor substrate. it can.

  In addition, the antenna is wound around the base substrate and the substrate on which the IC chip is mounted is fixed in the mold, and the resin is injected into the mold, whereby the antenna is wound around the base substrate and the IC chip is mounted. A technique for manufacturing an RFID tag in which a mounted substrate is sealed with a resin has been devised (see, for example, Patent Document 2). Also in this technique, the protection against the IC chip can be enhanced as compared with the case where a protective member such as a surface sheet is bonded on the semiconductor substrate.

  However, as described above, in the case where the IC chip is protected by supplying the resin onto the semiconductor substrate on which the IC chip is mounted on the base substrate and sealing the semiconductor substrate with the resin, When resin is supplied, the IC chip may be damaged by the pressure or heat generated by the resin supply, or the connection between the wiring formed on the base substrate and the IC chip may be broken. .

  In addition, in a semiconductor device in which a semiconductor substrate on which an IC chip is mounted on a base substrate is sealed with a resin, the resin expands due to a change in the surrounding environment, in particular, an increase in the ambient temperature after the manufacture. There is a possibility that pressure is applied to the IC chip by the resin and the IC chip is damaged, or the connection between the wiring formed on the base substrate and the IC chip is broken.

Moreover, in patent document 1 or 2, the kind of article | item which attaches a non-contact-type IC tag is not examined. In order for the non-contact type IC tag to operate, the electromagnetic wave transmitted from the information writing / reading device is sufficiently taken into the antenna of the non-contact type IC tag, and an electromotive force higher than the operating electromotive force of the IC chip is induced. However, when the non-contact type IC tag is attached to the surface of the metal article, the magnetic flux is parallel to the surface of the metal article on the surface of the metal article. For this reason, the magnetic flux crossing the antenna of the non-contact type IC tag is reduced and the induced electromotive force is lowered, so that there is a problem that the IC chip becomes inoperable due to being lower than the operating electromotive force of the IC chip.
JP 2003-68775 A JP 2002-298116 A

  The present invention has been made in view of the above circumstances, and the IC chip is damaged during or after the manufacture of the semiconductor device in which the semiconductor substrate on which the IC chip is mounted on the base substrate is sealed with resin. A semiconductor device and a method for manufacturing the same that reduce the possibility that the connection between the wiring formed on the base substrate and the IC chip will be broken, and further suppress the deterioration of the function of the semiconductor substrate. The purpose is to provide.

  In order to solve the above-described problems, the present invention covers a base substrate, an inlet provided on one surface of the base substrate and an antenna and an IC chip, and an antenna and an IC chip constituting the inlet. There is provided a semiconductor device comprising a magnetic layer arranged in this manner, and a housing made of a resin provided so as to enclose an inlet in which the magnetic layer is arranged.

  According to such a configuration, it is possible to absorb an external impact by the magnetic layer and to prevent the antenna and the IC chip constituting the inlet from vibrating due to the external impact. It is possible to effectively prevent the IC chip from being destroyed. In addition, since a housing made of resin is provided so as to wrap an inlet in which a magnetic layer is arranged, and a magnetic layer is provided so as to cover the surface of the base substrate on which the antenna and the IC chip are provided, When the semiconductor device of the present invention is bent, force is uniformly applied to the entire inlet provided with the magnetic layer, so that the semiconductor device of the present invention has flexibility. Further, since the magnetic layer provided so as to cover the antenna and the IC chip functions as a magnetic body, the magnetic flux is captured by the antenna through the magnetic layer, so that electromagnetic induction from the information writing / reading device causes Inductive electromotive force sufficient to operate the IC chip on the antenna can be generated. In addition, the pressure directly applied to the IC chip by supplying the resin can be absorbed by the magnetic layer, so that the IC chip is damaged, or the antenna provided on the base substrate and the IC chip are disconnected at the contact point. Can be effectively prevented.

  The present invention is arranged so as to cover a base substrate, an inlet made of an antenna and an IC chip, which are provided on one surface of the base substrate and electrically connected to each other, and the other surface of the base substrate constituting the inlet. Provided is a semiconductor device comprising a magnetic layer and a housing made of a resin provided so as to enclose an inlet provided with the magnetic layer.

  According to such a configuration, it is possible to absorb an external impact by the magnetic layer and to prevent the antenna and the IC chip constituting the inlet from vibrating due to the external impact. It is possible to effectively prevent the IC chip from being destroyed. In addition, a housing made of resin is provided so as to enclose the inlet with the magnetic material layer, and a magnetic material layer is provided so as to cover the surface of the base substrate opposite to the surface on which the antenna and IC chip are provided. Since the gap formed by the antenna and IC chip is filled with the second resin member, when the semiconductor device of the present invention is bent, force is uniformly applied to the entire inlet provided with the magnetic layer. Therefore, the semiconductor device of the present invention has flexibility. Furthermore, since the magnetic layer provided to cover the surface opposite to the surface on which the antenna and IC chip of the base substrate are provided functions as a magnetic material, magnetic flux is captured by the antenna through the magnetic material layer. Therefore, it is possible to generate an induced electromotive force sufficient to operate the IC chip in the antenna by electromagnetic induction from the information writing / reading device.

  In the semiconductor device configured as described above, the magnetic layer is preferably a composite made of a binder and magnetic powder or magnetic flakes.

  According to such a configuration, the complex formed of the magnetic layer can efficiently and easily fill the gap formed by the antenna or IC chip without damaging the antenna or IC chip.

  The present invention includes a step of forming an inlet by providing an antenna and an IC chip that are electrically connected to each other on one surface of a base substrate, and a magnetic material layer so as to cover the antenna and the IC chip constituting the inlet. A first step for covering at least a part of the magnetic layer among the inlets provided with the magnetic layer, and a recess for fitting at least a portion of the inlet where the magnetic layer is disposed. A step of molding a resin member, a step of fitting at least a part of the magnetic layer of the inlet provided with the magnetic layer, and the magnetic layer fitted in the first resin member. Resin is supplied onto the arranged inlet, a second resin member is molded with the resin, and the second resin member covers the magnetic layer with the first resin member. Provided is a method for manufacturing a semiconductor device, which includes a step of covering a non-covered portion, forming a housing made of a first resin member and a second resin member, and enclosing the inlet in which the magnetic layer is arranged by the housing To do.

  According to this configuration, after the inlet in which the magnetic layer is disposed is accommodated in the recess provided in the first resin member so that at least a part of the magnetic layer is accommodated, the first resin member Since the resin is supplied from the side of the inlet where the antenna and the IC chip are not provided so as to cover the uncovered portion, the pressure directly applied to the IC chip by the supply of the resin is reduced, so the IC chip is damaged. It is possible to effectively prevent the antenna and the IC chip provided on the base substrate from being disconnected at the contact points. In addition, the pressure directly applied to the IC chip by supplying the resin can be absorbed by the magnetic layer, so that the IC chip is damaged, or the antenna provided on the base substrate and the IC chip are disconnected at the contact point. Can be effectively prevented.

  The present invention provides a step of forming an inlet by providing an antenna and an IC chip that are electrically connected to each other on one surface of a base substrate, and magnetically covers the other surface of the base substrate that constitutes the inlet. A step of arranging a body layer, and a recess for fitting at least a part of the magnetic layer disposed on the other surface of the inlet, and at least one of the magnetic layers among the inlets disposed with the magnetic layer. A step of molding a first resin member for covering the portion, a step of fitting at least a part of the magnetic layer into the recess among the inlets in which the magnetic layer is disposed, and the first resin member A resin is supplied onto the inlet in which the magnetic material layer fitted is arranged, a second resin member is molded with the resin, and the first resin is provided among the inlets in which the magnetic material layer is arranged with the second resin member. Resin part Manufacturing a semiconductor device comprising a step of covering a portion not covered with a first resin member, forming a housing made of a first resin member and a second resin member, and enclosing the inlet in which the magnetic layer is arranged by the housing Provide a method.

  According to this configuration, after the inlet in which the magnetic layer is disposed is accommodated in the recess provided in the first resin member so that at least a part of the magnetic layer is accommodated, the first resin member Resin is supplied from the side of the inlet where the antenna and IC chip are mounted so as to cover the uncovered portion, and the magnetic layer functions as a shock absorber, and is directly applied to the IC chip by supplying the resin. Since the pressure can be dispersed by the magnetic material layer, it is possible to effectively prevent the IC chip from being damaged or the antenna provided on the base substrate and the IC chip from being disconnected at the contact point. .

  The semiconductor device of the present invention is arranged so as to cover the base substrate and an inlet made of an antenna and an IC chip which are provided on one surface of the base substrate and electrically connected to each other, and cover the antenna and the IC chip constituting the inlet. Since it includes a magnetic layer and a housing made of a resin provided so as to enclose the inlet in which the magnetic layer is arranged, an external impact can be absorbed by the magnetic layer. Since it is possible to prevent the antenna and the IC chip constituting the inlet from vibrating due to an external impact, it is possible to effectively prevent the antenna and the IC chip from being destroyed. In addition, since a housing made of resin is provided so as to wrap an inlet in which a magnetic layer is arranged, and a magnetic layer is provided so as to cover the surface of the base substrate on which the antenna and the IC chip are provided, When the semiconductor device of the present invention is bent, force is uniformly applied to the entire inlet provided with the magnetic layer, so that the semiconductor device of the present invention has flexibility. Further, since the magnetic layer provided so as to cover the antenna and the IC chip functions as a magnetic body, the magnetic flux is captured by the antenna through the magnetic layer, so that electromagnetic induction from the information writing / reading device causes Inductive electromotive force sufficient to operate the IC chip on the antenna can be generated. In addition, the pressure directly applied to the IC chip by supplying the resin can be absorbed by the magnetic layer, so that the IC chip is damaged, or the antenna provided on the base substrate and the IC chip are disconnected at the contact point. Can be effectively prevented. Furthermore, since the joint between the antenna and the IC chip is weak in durability against impact and pressure, the durability can be further increased by providing the magnetic layer so as to cover the IC chip and the antenna.

  The semiconductor device of the present invention covers a base substrate, an inlet made of an antenna and an IC chip provided on one surface of the base substrate, and the other surface of the base substrate constituting the inlet. Since the magnetic material layer and the housing made of resin provided so as to enclose the inlet provided with the magnetic material layer are provided, it is possible to absorb external impacts by the magnetic material layer. In addition, since it is possible to prevent the antenna and the IC chip constituting the inlet from vibrating due to an external impact, it is possible to effectively prevent the antenna and the IC chip from being destroyed. In addition, a housing made of resin is provided so as to enclose the inlet with the magnetic material layer, and a magnetic material layer is provided so as to cover the surface of the base substrate opposite to the surface on which the antenna and IC chip are provided. Since the gap formed by the antenna and IC chip is filled with the second resin member, when the semiconductor device of the present invention is bent, force is uniformly applied to the entire inlet provided with the magnetic layer. Therefore, the semiconductor device of the present invention has flexibility. Furthermore, since the magnetic layer provided to cover the surface opposite to the surface on which the antenna and IC chip of the base substrate are provided functions as a magnetic material, magnetic flux is captured by the antenna through the magnetic material layer. Therefore, it is possible to generate an induced electromotive force sufficient to operate the IC chip in the antenna by electromagnetic induction from the information writing / reading device.

  The method for manufacturing a semiconductor device of the present invention includes a step of forming an inlet by providing an antenna and an IC chip that are electrically connected to each other on one surface of a base substrate, and covering the antenna and the IC chip that constitute the inlet. A step of arranging the magnetic layer and a recess into which at least a part of the inlet provided with the magnetic layer is fitted, and at least a part of the magnetic layer is provided among the inlets provided with the magnetic layer. A step of molding a first resin member for covering, a step of fitting at least a part of the magnetic layer in the inlet provided with the magnetic layer, and a step of fitting into the first resin member. A resin is supplied onto the inlet on which the magnetic layer is arranged, a second resin member is molded with the resin, and the front of the inlet on which the magnetic layer is arranged with the second resin member. Covering a portion not covered with the first resin member, forming a housing made of the first resin member and the second resin member, and enclosing the inlet in which the magnetic layer is arranged by the housing; The first resin member is covered with the first resin member after accommodating the inlet in which the magnetic layer is disposed so that at least a part of the magnetic layer is accommodated in the recess provided in the first resin member. Since the resin is supplied from the side of the inlet where the antenna and the IC chip are not provided so as to cover the unexposed portion, the pressure directly applied to the IC chip by the supply of the resin is reduced. It is possible to effectively prevent the antenna provided on the base substrate and the IC chip from being disconnected at the contact point. In addition, the pressure directly applied to the IC chip by supplying the resin can be absorbed by the magnetic layer, so that the IC chip is damaged, or the antenna provided on the base substrate and the IC chip are disconnected at the contact point. Can be effectively prevented.

  The method of manufacturing a semiconductor device of the present invention includes a step of forming an inlet by providing an antenna and an IC chip that are electrically connected to one surface of a base substrate, and the other of the base substrates constituting the inlet. A step of disposing a magnetic layer so as to cover the surface, and a recess into which at least a part of the magnetic layer disposed on the other surface of the inlet is fitted, and the inlet including the magnetic layer, A step of molding a first resin member for covering at least a part of the magnetic layer, a step of fitting at least a portion of the magnetic layer into the recess of the inlet provided with the magnetic layer, Resin is supplied onto the inlet having the magnetic layer fitted in the first resin member, the second resin member is molded with the resin, and the magnetic layer is disposed with the second resin member. Inlet A portion that is not covered with the first resin member is covered, a housing made of the first resin member and the second resin member is formed, and the inlet in which the magnetic layer is arranged is wrapped by the housing. Since the process has a step, the inlet provided with the magnetic layer is accommodated in the recess provided in the first resin member so as to accommodate at least a part of the magnetic layer, and then covered with the first resin member. Resin is supplied from the side of the inlet where the antenna and IC chip are mounted so as to cover the unexposed portion, and the magnetic layer functions as a shock absorber, and pressure applied directly to the IC chip by supplying the resin Therefore, it is possible to effectively prevent the IC chip from being broken or the antenna provided on the base substrate and the IC chip from being disconnected at the contact point.

The present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are schematic views showing a non-contact type IC tag as a first embodiment of a semiconductor device according to the present invention. FIG. 1A is a plan view showing an internal structure, and FIG. It is sectional drawing which follows the -A line.

  In FIG. 1, reference numeral 10 is a non-contact type IC tag, 11 is a base substrate, 12 is an antenna, 13 is an IC chip, 14 is a contact, 15 is an inlet, 20 is a magnetic layer, 21 is a first resin member, Reference numeral 22 denotes a recess, 23 denotes a second resin member, and 25 denotes a housing.

  This non-contact type IC tag 10 includes a base substrate 11 and an inlet 15 comprising an antenna 12 and an IC chip 13 provided on one surface thereof and electrically connected to each other, and an antenna 12 and an IC constituting the inlet 15. A magnetic body layer 20 disposed so as to cover the chip 13, and a housing 25 including a first resin member 21 and a second resin member 23 provided so as to enclose the inlet 15 in which the magnetic body layer 20 is disposed; It is roughly composed.

In the non-contact type IC tag 10, the antenna 12 is formed in a coil shape on one surface of the base substrate 11, and both ends thereof are electrically connected to the IC chip 13 by the contacts 14.
The magnetic layer 20 is arranged so as to cover the antenna 12 and the IC chip 13 provided on one surface of the base substrate 11 and the entire area of the one surface of the base substrate 11. Note that the magnetic layer 20 only needs to be provided at least slightly beyond the thickness of the antenna 12 or the IC chip 13.

  The first resin member 21 accommodates at least a part of the inlet 15 provided with the magnetic layer 20, that is, at least a part of the magnetic layer 20 covering the antenna 12 and the IC chip 13 constituting the inlet 15. It has a sufficiently large recess 22. The surface 20 a opposite to the surface in contact with the base substrate 11 of the magnetic layer 20 is in contact with the bottom surface 22 a of the recess 22, and at least a part of the side surface 20 b of the magnetic layer 20 is the inner surface of the recess 22. At least a part of the magnetic layer 20 is accommodated in the recess 22 so as to be in contact with 22 b, and at least a part of the magnetic layer 20 is covered with the first resin member 21. The second resin member 23 is disposed so as to face the first resin member 21 and to be continuous with the first resin member 21. The portion not covered with the resin member 21 is covered. As a result, the inlet 15 provided with the magnetic layer 20 is sealed by the casing 25 including the first resin member 21 and the second resin member 23.

  As the base material 11, at least the surface where the antenna 12 and the IC chip 13 are provided is made of an electrically insulating material. Examples of such a base substrate 11 include woven fabrics, nonwoven fabrics, mats, papers or combinations thereof made of inorganic fibers such as glass fibers and alumina fibers, or organic fibers such as polyester fibers and polyamide fibers, or combinations thereof. Composite substrate, polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer resin substrate, polyvinyl alcohol Resin base material, polyvinyl chloride resin base material, polyvinylidene chloride resin base material, polystyrene resin base material, polycarbonate resin base material, acrylonitrile-butadiene styrene copolymer resin base material, polyethersulfone base resin base Plastic base materials such as materials, or mats on these Selected from well-known materials such as surface treatments such as surface treatment such as surface treatment such as surface treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment, or various easy adhesion treatments. it can. Among these, a film or sheet made of polyethylene terephthalate (PET) or polyimide is preferably used.

The antenna 12 is a conductor made of a conductive film made of a conductive paste, a conductive foil, or the like.
Examples of the conductive paste forming the conductor forming the antenna 12 include conductive particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium, rhodium, and the like, and carbon powder (carbon black, carbon nanotube, etc.). What mix | blended this with the resin composition is mentioned. Examples of the resin composition forming the conductive paste include a thermosetting resin composition, a photocurable resin composition, an osmotic drying resin composition, and a solvent volatile resin composition.

When a thermosetting resin composition is used as the above resin composition, a coating film can be obtained at 200 ° C. or lower, for example, about 100 to 150 ° C. This is due to contact, and a resistance value on the order of 10 ⁻⁵ Ω · cm is obtained.
Moreover, when a photocurable resin composition is used as said resin composition, the hardening time of an electrically conductive paste can be shortened and manufacturing efficiency can be improved.

  Specifically, the conductive paste in which the conductive fine particles as described above are blended with the resin composition contains 60% by mass or more of the conductive fine particles, and includes only the thermoplastic resin or the thermoplastic resin and the crosslinkable resin (particularly, Blended resin composition of polyester and isocyanate-based crosslinked resin, etc., containing polyester resin at 10% by mass or more, that is, solvent volatile type or cross-linked / thermoplastic combined type (however, thermoplastic resin at 50% by mass or more) Containing) or conductive fine particles in an amount of 50% by mass or more, and only a crosslinkable resin (such as a phenol-cured epoxy resin or a sulfonium salt-cured epoxy resin), or a thermoplastic resin and a crosslinkable resin. A blended resin composition, ie, a cross-linked type or a cross-linked / thermoplastic type is preferably used. That.

  Further, when the non-contact type IC tag 10 further requires bending resistance, a flexibility-imparting agent can be blended in the conductive paste. Examples of the flexibility imparting agent include a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, a polyvinyl acetate flexibility imparting agent, and a thermoplastic elastomer flexibility. Property imparting agent, natural rubber-based flexibility imparting agent, synthetic rubber-based flexibility imparting agent and the like. In the semiconductor device of the present invention, these flexibility imparting agents are used alone or in combination of two or more.

  Examples of the conductive foil that forms the conductor forming the antenna 12 include copper foil, silver foil, gold foil, and platinum foil.

  The IC chip 13 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 12. Anything applicable to RDIF media such as an IC card can be used.

The magnetic layer 20 is a composite composed of a binder and powder made of a magnetic material (hereinafter also referred to as “magnetic powder”) or flakes made of a magnetic material (hereinafter also referred to as “magnetic flake”). It is.
In this composite, magnetic powder or magnetic flakes are dispersed almost uniformly in the binder, and the magnetic layer 20 functions uniformly as a magnetic material over the entire area. Moreover, since the magnetic body layer 20 contains the binder which has the elasticity as shown below, it functions also as an elastic body.

Examples of the magnetic powder include carbonyl iron powder, atomized powder such as permalloy, and reduced iron powder.
As magnetic flakes, carbonyl iron powder, atomized powder such as permalloy, reduced iron powder, etc., are refined with a ball mill etc. to make a fine powder, and then the flakes obtained by mechanically flattening this fine powder or iron And flakes obtained by colliding a molten metal of a cobalt-based or cobalt-based amorphous alloy with a water-cooled copper plate.

As the binder, an elastic material is used, and examples of such a material include thermoplastic resins, thermosetting resins, and reactive resins.
Examples of the thermoplastic resin include vinyl chloride, vinyl acetate, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile copolymer, acrylate ester-acrylonitrile copolymer. , Acrylic ester-vinyl chloride-vinylidene chloride copolymer, acrylic ester-vinylidene chloride copolymer, methacrylic ester-vinylidene chloride copolymer, methacrylic ester-vinyl chloride copolymer, methacrylic ester-ethylene copolymer Polymer, polyvinyl fluoride, vinylidene chloride-acrylonitrile copolymer, acrylonitrile-butadiene copolymer, polyamide resin, polyvinyl butyral, cellulose derivative (cellulose acetate butyrate, cellulose diacetate, cellulose tria Tate, cellulose propionate, nitrocellulose), styrene butadiene copolymer, polyurethane resin, polyester resin, amino resin, or polymers such as styrene rubber, fluorine rubber, silicon rubber, ethylene-propylene copolymer rubber Synthetic rubber materials and the like.

  Examples of the thermosetting resin or reactive resin include phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, alkyd resin, silicone resin, polyamine resin, urea formaldehyde resin, and the like.

  Examples of the material forming the first resin member 21 and the second resin member 23 include thermoplastic resins such as polyethylene, polypropylene, polyester, polyamide, polystyrene, polyvinyl alcohol, vinylidene chloride, and polyethylene terephthalate.

  In this embodiment, the inlet 15 in which the antenna 12 is formed in a coil shape on one surface of the base substrate 11 is exemplified, but the semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, the antenna constituting the inlet may be formed in a pole shape or a loop shape on the base substrate.

  In this embodiment, the magnetic layer 20 is disposed so as to cover the antenna 12 and the IC chip 13 provided on one surface of the base substrate 11 and the entire area of the one surface of the base substrate 11. However, the semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, it is only necessary that the magnetic layer is disposed so as to cover at least the antenna and the IC chip provided on one surface of the base substrate.

  Further, in this embodiment, an example in which a part of the surface 20 a and the side surface 20 b opposite to the surface in contact with the base substrate 11 of the magnetic layer 20 is covered with the first resin member 21 is shown. The semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, the first resin member may cover the entire side surface of the magnetic layer, or the entire side surface of the magnetic layer and a part or all of the side surface of the base substrate. Good.

  In the non-contact type IC tag 10 of this embodiment, the antenna 12 and the IC chip 13 constituting the inlet 15 are covered, and the entire surface of the base substrate 11 on which the antenna 12 and the IC chip 13 are provided is covered. A body layer 20 is provided, and a gap formed by the antenna 12 and the IC chip 13 is filled with the magnetic body layer 20, and the magnetic body layer 20 is a composite made of a binder and magnetic powder or magnetic flakes. Since it functions as an elastic body, it can absorb external shocks by the magnetic layer 20, and can prevent the antenna 12 and the IC chip 13 from vibrating due to external shocks. 12 and the IC chip 13 can be effectively prevented from being destroyed.

  Further, in the non-contact type IC tag 10, a casing 25 made of resin is provided so as to wrap the inlet 15 provided with the magnetic layer 20, and the surface of the base substrate 11 on which the antenna 12 and the IC chip 13 are provided. Since the magnetic layer 20 made of a soft magnetic material is provided so as to cover the entire area of the substrate, and the gap formed by the antenna 12 and the IC chip 13 is filled with the magnetic layer 20, the non-contact type IC tag 10 is bent. In this case, since force is uniformly applied to the entire inlet 15 in which the magnetic layer 20 is arranged, the non-contact type IC tag 10 can be flexible.

  Further, in the non-contact type IC tag 10, the magnetic layer 20 provided so as to cover the antenna 12 and the IC chip 13 also functions as a magnetic body, so that the magnetic flux is captured by the antenna 12 through the magnetic layer 20. Therefore, an induced electromotive force sufficient for operating the IC chip 13 in the antenna 12 can be generated by electromagnetic induction from the information writing / reading device. In addition, since the magnetic layer 20 only needs to be provided to a degree slightly larger than the thickness of the antenna 12 or the IC chip 13, the combined thickness of the magnetic layer 20, the antenna 12, and the IC chip 13 can be reduced. Therefore, the thickness can be reduced as compared with the conventional non-contact type IC tag.

Next, with reference to FIGS. 2 to 5, a method for manufacturing the non-contact type IC tag 10 will be described as a first embodiment of a method for manufacturing a semiconductor device according to the present invention.
In this embodiment, first, a conductive paste is printed in a predetermined pattern by screen printing on one surface 11a of the base substrate 11, and then the conductive paste is dried or a conductive foil is applied. Then, the antenna 12 having a predetermined pattern as shown in FIG. 2A is formed by etching.

  When the antenna 12 is formed by etching after attaching a conductive foil to one surface 11 a of the base substrate 11, first, the conductive foil is formed on the entire surface of the one surface 11 a of the base substrate 11. Paste. Next, an etching resistant paint is printed on the conductive foil in a predetermined pattern by a silk screen method. Since the antenna 12 is normally formed in a coil shape, a pole shape, or a loop shape, the etching resistant paint is printed in a coil shape, a pole shape, or a loop shape. This etching resistant paint is dried and solidified, and then immersed in an etching solution to dissolve and remove the portion of the conductive foil that has not been coated with the etching resistant paint. The antenna 12 is formed by remaining on one surface 11a of the substrate 11.

  Next, the IC chip 13 is placed at a predetermined position on the one surface 11 a of the base substrate 11 through a conductive adhesive so that the contact provided on the IC chip 13 overlaps the contact provided on the antenna 12. The IC chip 13 is adhered to the base substrate 11 by applying a predetermined pressure to the IC chip 13, and the antenna 12 is connected via the contact provided on the antenna 12 and the contact provided on the IC chip 13. 2 and the IC chip 13 are electrically joined to each other to form an inlet 15 as shown in FIG.

  Next, the antenna 12 and the IC chip 13 provided on one surface of the base substrate 11, and the base substrate by applying a magnetic paint containing magnetic powder or magnetic flakes and a binder by screen printing or the like. 11 is applied so as to cover the entire area of one surface. After the magnetic paint is applied, the base substrate is left at room temperature or heated at a predetermined temperature for a predetermined time to be dried and solidified, as shown in FIG. 2 (c). 11 and the magnetic layer 20 covering the entire area of the one surface of the base substrate 11 are formed.

  As the magnetic coating material, a liquid material is used in which at least magnetic powder or magnetic flakes and a binder are dispersed in an organic solvent.

  Next, as shown in FIG. 3A, in order to mold the first resin member, a first mold 31 provided with a recess 31a, a protrusion 32a, and a resin supply port 32b were provided. The second mold 32 is closed so that the concave portion 31a and the convex portion 32a face each other. Thereby, a space 33 is formed by the first mold 31 and the second mold 32.

In addition, the recessed part 31a provided in the 1st metal mold | die 31 has comprised the same depth as the thickness of a 1st resin member, and has comprised the same shape as the external shape of a 1st resin member.
Further, the convex portion 32a provided on the second mold 32 has the same height as the depth of the concave portion formed in the first resin member, and has the same outer shape as the shape of the concave portion. Yes.
Further, the supply port 32 b provided in the second mold 32 is from a surface opposite to the surface where the convex portion 32 a of the second mold 32 is provided, that is, from the outer surface of the second mold 32. The second mold 32 is penetrated over the convex part 32 a and is provided at a position facing the concave part 31 a provided in the first mold 31.

 Next, in this state, a resin is supplied from the supply port 32b provided in the second mold 32 to mold the first resin member, and the first mold 31 and the second mold 32 are The space 33 formed by the above is filled with resin, and the first resin member 21 having the recesses 22 is molded as shown in FIG.

  The method of supplying the resin from the supply port 32b to the space 33 may be an injection method or an injection method, but the injection method is preferable because it can improve production efficiency.

  Next, after removing the second mold 32 from the first mold 31, as shown in FIG. 4A, the first mold 31 is molded into the recess 31 a of the first mold 31. The surface 20a opposite to the surface in contact with the base substrate 11 of the magnetic layer 20 is in contact with the bottom surface 22a of the recess 22 in the concave portion 22 formed by the convex portion 32a of the second mold 32, and the magnetic layer The inlet 15 provided with the magnetic layer 20 is accommodated so that at least a part of the side surface 20b of the 20 is in contact with the inner side surface 22b of the recess 22 and at least a part of the magnetic layer 20 is accommodated.

 At this time, the recess 22 formed in the first resin member 21 has a depth equivalent to the thickness of the magnetic layer 20 disposed on the one surface 11 a of the inlet 15 and the outer shape of the magnetic layer 20. It is formed so as to have a shape equivalent to the shape. That is, the convex portion 32 a provided on the second mold 32 has a height equivalent to the thickness of the magnetic layer 20 and an outer shape equivalent to the outer shape of the magnetic layer 20.

 Next, as shown in FIG. 4B, a portion of the inlet 15 provided with the magnetic layer 20 accommodated in the recess 22 of the first resin member 21 that is not covered with the first resin member 21. In order to mold the second resin member to be covered, the third mold 34 provided with the recess 34 a and the resin supply port 34 b and the first mold 31 are formed into the recess 22 of the first resin member 21. The mold 15 is closed so that the inlet 15 having the magnetic layer 20 accommodated therein is inserted into the recess 34a. Thereby, a space 35 is formed by the inlet 15, the first resin member 21, and the third mold 34.

In addition, the recessed part 34a provided in the 3rd metal mold | die 34 has comprised the same depth as the thickness of the 2nd resin member, and has comprised the same shape as the external shape of the 2nd resin member.
Further, the supply port 34b provided in the third mold 34 is recessed from the surface opposite to the surface where the recess 34a of the third mold 34 is provided, that is, from the outer surface of the third mold 34. 34a passes through the third mold 34 and faces the recess 31a provided in the first mold 31 when the first mold 31 and the third mold 34 are closed together. In the position.

 Next, in this state, the same resin as the resin obtained by molding the first resin member 21 is supplied from the supply port 34b provided in the third mold 34, and the inlet 15, the first resin member 21 and The space 35 formed by the third mold 34 is filled with resin, and as shown in FIG. 5A, the second resin member 23 is molded, and the first resin member 21 and the second resin are molded. The member 23 is integrated to form a casing 25, and the casing 15 seals the inlet 15 provided with the magnetic layer 20.

 The method of supplying the resin from the supply port 34b to the space 35 may be an injection method or an injection method, but the injection method is preferable because it can improve production efficiency.

  Thereafter, the first mold 31 and the third mold 34 are removed, and the non-contact type IC tag 10 as shown in FIG. 5B is obtained.

  In this embodiment, after accommodating the inlet 15 provided with the magnetic layer 20 so as to accommodate at least a part of the magnetic layer 20 in the recess 22 provided in the first resin member 21, Since the resin is supplied from the side of the inlet 15 where the antenna 12 and the IC chip 13 are not mounted so as to cover the portion not covered with the resin member 21, the pressure directly applied to the IC chip 13 by the supply of the resin Therefore, it is possible to effectively prevent the IC chip 13 from being damaged or the antenna 12 provided on the base substrate 11 and the IC chip 13 from being disconnected at the contact points. Further, since the pressure due to the resin supply can be absorbed by the magnetic layer 20 made of an elastic material, the IC chip 13 is damaged, or the antenna 12 and the IC chip 13 provided on the base substrate 11 are connected to the contact 14. It is possible to more effectively prevent disconnection at.

(Second embodiment)
FIG. 6 is a schematic view showing a non-contact type IC tag as a second embodiment of the semiconductor device according to the present invention, where (a) is a plan view showing the internal structure, and (b) is B in (a). It is sectional drawing which follows the -B line.

  In FIG. 6, reference numeral 40 is a non-contact type IC tag, 41 is a base substrate, 42 is an antenna, 43 is an IC chip, 44 is a contact, 45 is an inlet, 50 is a magnetic layer, 51 is a first resin member, 52 denotes a recess, 53 denotes a second resin member, and 55 denotes a housing.

  The non-contact type IC tag 40 includes a base substrate 41, an inlet 42 provided on one surface 41a of the antenna 42 and the IC chip 43, and a base substrate constituting the inlet 45. A magnetic layer 50 disposed so as to cover the other surface 41 b of 41, and a first resin member 51 and a second resin member 53 provided so as to enclose the inlet 45 in which the magnetic layer 50 is disposed. The housing 55 is schematically configured.

In the non-contact type IC tag 40, the antenna 42 is formed in a coil shape on one surface of the base substrate 41, and both ends thereof are electrically connected to the IC chip 43 by the contacts 44.
The magnetic layer 50 is disposed so as to cover the entire area of the other surface 41 b of the base substrate 41.

  The first resin member 51 accommodates at least a part of the inlet 45 provided with the magnetic layer 50, that is, at least a part of the magnetic layer 50 covering the other surface 41 b of the base substrate 41 constituting the inlet 45. It has a recess 52 that is large enough to do so. The surface 50 a opposite to the surface in contact with the base substrate 41 of the magnetic layer 50 is in contact with the bottom surface 52 a of the recess 52, and at least a part of the side surface 50 b of the magnetic layer 50 is the inner surface of the recess 52. At least a part of the magnetic layer 50 is accommodated in the recess 52 so as to be in contact with 52 b, and at least a part of the magnetic layer 50 is covered with the first resin member 51. In addition, the second resin member 53 is arranged so as to face the first resin member 51 and to be continuous with the first resin member 51, and the first resin member 53 among the inlets 45 in which the magnetic layer 50 is arranged. The portion not covered with the resin member 51, that is, the antenna 42 and the IC chip 43 provided on the one surface 41a of the base substrate 41, and the entire area of the one surface 41a of the base substrate 41 are covered. 42 or the IC chip 43 is filled. As a result, the inlet 45 provided with the magnetic layer 50 is sealed by the casing 55 including the first resin member 51 and the second resin member 53.

Examples of the base substrate 41 include those similar to the base substrate 11 described above.
The antenna 42 is formed of the same conductor as that of the antenna 12 described above.
Examples of the IC chip 43 include the same ones as the IC chip 13 described above.

Similar to the magnetic layer 20, the magnetic layer 50 is a composite composed of a binder and magnetic powder or magnetic flakes.
In this composite, magnetic powder or magnetic flakes are dispersed almost uniformly in the binder, and the magnetic layer 50 functions uniformly as a magnetic material over the entire area. Further, since the magnetic layer 50 includes the above-described binder having elasticity, it also functions as an elastic body.

  Examples of the material forming the first resin member 51 and the second resin member 53 include the same materials as those forming the first resin member 21 and the second resin member 23 described above.

  In this embodiment, the inlet 45 in which the antenna 42 is formed in a coil shape on the one surface 41a of the base substrate 41 is illustrated, but the semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, the antenna constituting the inlet may be formed in a pole shape or a loop shape on the base substrate.

  In this embodiment, the magnetic layer 50 is disposed so as to cover the entire area of the other surface 41b of the base substrate 41. However, the semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, it is only necessary that the magnetic layer is disposed on the other surface of the base substrate so as to overlap with at least the antenna and the IC chip provided on one surface of the base substrate.

  Further, in this embodiment, an example is shown in which a part of the surface 50 a and the side surface 50 b opposite to the surface in contact with the base substrate 41 of the magnetic layer 50 is covered with the first resin member 51. The semiconductor device of the present invention is not limited to this. In the semiconductor device of the present invention, the first resin member may cover the entire side surface of the magnetic layer, or the entire side surface of the magnetic layer and a part or all of the side surface of the base substrate. Good.

  In the non-contact type IC tag 40 of this embodiment, the magnetic layer 50 is provided so as to cover the entire area of the other surface 41b of the base substrate 41 constituting the inlet 45, and the magnetic layer 50 is composed of a binder, magnetic It is a composite made up of body powder or magnetic flakes, functions as an elastic body, and the gap formed by the antenna 42 and the IC chip 43 is filled with the second resin member 53, so that external impact can be prevented. In addition to being able to be absorbed by the magnetic layer 50, it is possible to prevent the antenna 42 and the IC chip 43 from vibrating due to an external impact, so that the antenna 42 and the IC chip 43 are effectively destroyed. Can be prevented.

  Further, in the non-contact type IC tag 40, a housing 55 made of resin is provided so as to wrap the inlet 45 provided with the magnetic layer 50, and the soft magnetic material is covered so as to cover the entire area of the other surface 41b of the base substrate 41. Since the magnetic layer 50 made of material is provided and the gap formed by the antenna 42 and the IC chip 43 is filled with the second resin member 53, when the non-contact type IC tag 40 is bent, the magnetic layer 50 is magnetic. Since force is uniformly applied to the entire inlet 45 in which the body layer 50 is disposed, the non-contact type IC tag 40 can be flexible.

  Further, in the non-contact type IC tag 40, the magnetic layer 50 provided so as to cover the other surface 41b of the base substrate 41 also functions as a magnetic body, so that magnetic flux passes through the magnetic layer 50 and the antenna 42. Therefore, it is possible to generate an induced electromotive force sufficient for operating the IC chip 43 in the antenna 42 by electromagnetic induction from the information writing / reading device. In addition, since the magnetic layer 50 functions sufficiently even if it is provided thinner than the thickness of the base substrate 41, the combined thickness of the magnetic layer 50 and the inlet 45 can be reduced. The thickness can be made thinner than that of the contact type IC tag.

Next, with reference to FIGS. 7 to 10, a method for manufacturing the non-contact type IC tag 40 will be described as a second embodiment of the method for manufacturing a semiconductor device according to the present invention.
In this embodiment, first, a conductive paste is printed in a predetermined pattern on one surface 41a of the base substrate 41 by screen printing, and then the conductive paste is dried or a conductive foil is applied. Then, the antenna 42 having a predetermined pattern as shown in FIG. 7A is formed by etching.

  Next, the IC chip 43 is placed at a predetermined position on the one surface 41a of the base substrate 41 via a conductive adhesive so that the contact provided on the IC chip 43 overlaps the contact provided on the antenna 42. The IC chip 43 is adhered to the base substrate 41 by applying a predetermined pressure to the IC chip 43, and the antenna 42 is connected via the contact provided on the antenna 42 and the contact provided on the IC chip 43. 7 and the IC chip 43 are electrically joined to each other to form an inlet 45 as shown in FIG.

  Next, a magnetic paint containing magnetic powder or magnetic flakes and a binder is applied by screen printing or the like so as to cover the entire area of the other surface 41 b of the base substrate 41. After applying the magnetic paint, the base substrate is left at room temperature or heated at a predetermined temperature for a predetermined time to dry and solidify, as shown in FIG. 7C. A magnetic layer 50 covering the entire area of the other surface 41b of 41 is formed.

  As the magnetic coating material, a liquid material is used in which at least magnetic powder or magnetic flakes and a binder are dispersed in an organic solvent.

  Next, as shown in FIG. 8A, in order to mold the first resin member, a first mold 61 provided with a recess 61a, a protrusion 62a, and a resin supply port 62b were provided. The second mold 62 is closed so that the concave portion 61a and the convex portion 62a face each other. Thereby, a space 63 is formed by the first mold 61 and the second mold 62.

In addition, the recessed part 61a provided in the 1st metal mold | die 61 has comprised the same depth as the thickness of the 1st resin member, and has comprised the same shape as the external shape of the 1st resin member.
Further, the convex portion 62a provided in the second mold 62 has the same height as the depth of the concave portion formed in the first resin member, and has the same outer shape as the shape of the concave portion. Yes.
Further, the supply port 62 b provided in the second mold 62 is from a surface opposite to the surface on which the convex portion 62 a of the second mold 62 is provided, that is, from the outer surface of the second mold 62. The second mold 62 is penetrated over the convex part 62 a and provided at a position facing the concave part 61 a provided in the first mold 61.

 Next, in this state, a resin is supplied from the supply port 62b provided in the second mold 62 to mold the first resin member, and the first mold 61 and the second mold 62 are The space 63 formed by the above is filled with resin, and the first resin member 51 having the recess 52 is molded as shown in FIG.

  The method of supplying the resin from the supply port 62b to the space 63 may be an injection method or an injection method, but the injection method is preferable because it can improve production efficiency.

  Next, after removing the second mold 62 from the first mold 61, as shown in FIG. 9A, the first mold 61 is molded into the recess 61 a of the first mold 61. The surface 50a opposite to the surface in contact with the base substrate 41 of the magnetic layer 50 is in contact with the bottom surface 52a of the recess 52 in the concave portion 52 formed by the convex portion 62a of the second mold 62. The inlet 45 in which the magnetic layer 50 is disposed is accommodated so that at least a part of the side surface 50b of the 50 is in contact with the inner side surface 52b of the recess 52 and at least a part of the magnetic layer 50 is accommodated.

 At this time, the recess 52 formed in the first resin member 51 has a depth equivalent to the thickness of the magnetic layer 50 disposed on the other surface 41 b of the inlet 45 and the outer shape of the magnetic layer 50. It is formed so as to have a shape equivalent to the shape. That is, the convex portion 62 a provided in the second mold 62 has a height equivalent to the thickness of the magnetic layer 50 and has an outer shape equivalent to the outer shape of the magnetic layer 50.

 Next, as shown in FIG. 9B, a portion of the inlet 45 in which the magnetic layer 50 accommodated in the recess 52 of the first resin member 51 is arranged is not covered with the first resin member 51. In order to mold the second resin member to be covered, the third mold 64 provided with the recess 64 a and the resin supply port 64 b and the first mold 61 are formed into the recess 52 of the first resin member 51. The mold 45 is closed so that the inlet 45 provided with the magnetic layer 50 accommodated therein enters the recess 64a. Thereby, a space 65 is formed by the inlet 45, the first resin member 51, and the third mold 64.

In addition, the recessed part 64a provided in the 3rd metal mold | die 64 has comprised the same depth as the thickness of a 2nd resin member, and has comprised the same shape as the external shape of a 2nd resin member.
Further, the supply port 64b provided in the third mold 64 is recessed from the surface opposite to the surface where the recess 64a of the third mold 64 is provided, that is, from the outer surface of the third mold 64. 64 a passes through the third mold 64 and faces the recess 61 a provided in the first mold 61 when the first mold 61 and the third mold 64 are closed together. In the position.

 Next, in this state, the same resin as the resin obtained by molding the first resin member 51 is supplied from the supply port 64b provided in the third mold 64, and the inlet 45, the first resin member 51, and The space 65 formed by the third mold 64 is filled with resin, and as shown in FIG. 10A, the second resin member 53 is molded, and the first resin member 51 and the second resin are molded. The member 53 is integrated to form a housing 55, and the housing 45 seals the inlet 45 on which the magnetic layer 50 is arranged.

 The method of supplying the resin from the supply port 64b to the space 65 may be an injection method or an injection method, but the injection method is more preferable because it can improve production efficiency.

  Thereafter, the first mold 61 and the third mold 64 are removed to obtain a non-contact type IC tag 40 as shown in FIG.

  In this embodiment, after accommodating the inlet 45 in which the magnetic layer 50 is disposed so as to accommodate at least a part of the magnetic layer 50 in the recess 52 provided in the first resin member 51, The resin is supplied from the side of the inlet 45 where the antenna 42 and the IC chip 43 are mounted so as to cover the portion not covered with the resin member 51, but the magnetic layer 50 made of an elastic body absorbs the shock. Since it functions as a material and distributes the pressure directly applied to the IC chip 43 by supplying resin, the IC chip 43 is damaged, or the antenna 42 provided on the base substrate 411 and the IC chip 43 are disconnected at the contact points. Can be effectively prevented.

BRIEF DESCRIPTION OF THE DRAWINGS As 1st embodiment of the semiconductor device which concerns on this invention, it is the schematic which shows a non-contact-type IC tag, (a) is a top view which shows an internal structure, (b) is the AA line of (a). It is sectional drawing which follows. It is a schematic sectional drawing which shows the manufacturing method of 1st embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 1st embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 1st embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 1st embodiment of the semiconductor device which concerns on this invention. FIG. 4 is a schematic view showing a non-contact type IC tag as a second embodiment of the semiconductor device according to the present invention, where (a) is a plan view showing an internal structure, and (b) is a BB line in (a). It is sectional drawing which follows. It is a schematic sectional drawing which shows the manufacturing method of 2nd embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 2nd embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 2nd embodiment of the semiconductor device which concerns on this invention. It is a schematic sectional drawing which shows the manufacturing method of 2nd embodiment of the semiconductor device which concerns on this invention. It is the schematic which shows an example of the conventional non-contact-type IC tag, (a) is a top view which shows an internal structure, (b) is sectional drawing which follows the CC line of (a).

Explanation of symbols

10, 40 ... non-contact IC tag, 11, 41 ... base substrate, 12, 42 ... antenna, 13, 43 ... IC chip, 14, 44 ... contact, 15, 45. .... Inlet, 20, 50 ... Magnetic layer, 21, 51 ... First resin member, 22, 52 ... Recess, 23, 53 ... Second resin member, 25, 55 ..Case, 31, 61 ... first mold, 32,62 ... second mold, 33,63 ... space, 34,64 ... third mold.

Claims (5)

  An inlet comprising an antenna and an IC chip provided on one surface of the base substrate and electrically connected to each other; a magnetic layer disposed so as to cover the antenna and the IC chip constituting the inlet; and the magnetic And a housing made of a resin provided so as to wrap an inlet in which a body layer is arranged.   An inlet made of an antenna and an IC chip provided on one surface of the base substrate and electrically connected to each other; and a magnetic layer arranged to cover the other surface of the base substrate constituting the inlet; And a housing made of resin provided so as to enclose the inlet in which the magnetic layer is arranged.   The semiconductor device according to claim 1, wherein the magnetic layer is a composite composed of a binder and magnetic powder or magnetic flakes.   Providing an antenna and an IC chip electrically connected to each other on one surface of the base substrate to form an inlet; and providing a magnetic layer so as to cover the antenna and the IC chip constituting the inlet; And forming a first resin member for covering at least a part of the magnetic layer out of the inlet provided with the magnetic layer, and having a recess for fitting at least a part of the inlet provided with the magnetic layer. A step of fitting at least a part of the magnetic layer in the recess, and an inlet on which the magnetic layer fitted in the first resin member is arranged. A resin is supplied to the resin, a second resin member is molded with the resin, and the second resin member is not covered with the first resin member among the inlets in which the magnetic layer is disposed. Manufacturing a semiconductor device, comprising: forming a casing made of a first resin member and a second resin member, and enclosing the inlet in which the magnetic layer is arranged by the casing Method. A step of forming an inlet by providing an antenna and an IC chip that are electrically connected to each other on one surface of the base substrate, and a magnetic layer disposed so as to cover the other surface of the base substrate constituting the inlet. And a step of fitting at least a part of the magnetic layer disposed on the other surface of the inlet to cover at least a part of the magnetic layer among the inlets disposed with the magnetic layer. The step of molding the first resin member, the step of fitting at least a part of the magnetic layer into the concave portion of the inlet provided with the magnetic layer, and the step of fitting the first resin member into the first resin member Resin is supplied onto the inlet on which the magnetic layer is arranged, a second resin member is molded with the resin, and the first resin member among the inlets on which the magnetic layer is arranged with the second resin member. Covered A semiconductor device comprising: a step of covering an uncovered portion, forming a housing made of a first resin member and a second resin member, and enclosing the inlet in which the magnetic layer is arranged by the housing. Production method.

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