JP2006024107A - Stacking method of rfid inlet, and rfid inlet stacked body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacking method of RFID inlets stacking the inlets on various support bodies without damaging an IC chip or the like with heat in radiating ultraviolet rays. <P>SOLUTION: In the stacking method of the RFID inlets, the support bodies and the RFID inlets having an antenna section and an IC chip on a substrate are stacked. Surfaces of the support bodies 71 are coated with an ultraviolet ray curing type adhesive 68, and ultraviolet rays are radiated to the ultraviolet ray curing type adhesive 68. After that, before the ultraviolet ray curing type adhesive is cured, the RFID inlets 72 are superimposed and bonded. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an RFID inlet stacking method and an RFID inlet stack.

  In recent years, in order to automate personal information management, physical distribution management, quality management, and the like, an RFID (Radio Frequency Identification) system capable of exchanging information on an IC chip without contact with a reader has received much attention. Such an RFID system uses an RFID inlet in which an antenna portion and an IC chip connected to the antenna portion are provided on the surface of a thin film substrate. As such RFID inlets, for example, “V720 series tag inlet” (trade name) manufactured by OMRON Corporation, FIG. 1 of JP-A-2003-58853, and the like are known.

By the way, the RFID inlet (hereinafter, “RFID inlet” may be abbreviated as “inlet” in this specification) is very thin and the antenna portion is exposed. Inferior in impact resistance, weather resistance, chemical resistance, etc. Therefore, the inlet is not usually used as it is, but is used in the form of an RFID inlet laminate by being laminated on a support such as a synthetic resin film.
As a method of laminating the inlet on the support in this way, it is conceivable to use a dry laminate that is generally known as a laminating method. However, such a lamination device is generally large and unsuitable for use in laminating relatively narrow inlets. Moreover, when performing design printing, you have to transfer a laminated body from a laminating apparatus to a printing machine.
On the other hand, as a method of laminating and bonding the inlets with a printing press, it is conceivable to bond the inlet coated with an adhesive to a support. However, when an adhesive is used, there is a problem that dust adheres to the edge of the adhesive during and after lamination, which is not preferable as a method for laminating an inlet as an electronic component.

In this regard, as a lamination method that can be laminated by a printing machine and can prevent dust from adhering, it is conceivable to laminate and bond the inlet using an ultraviolet curable adhesive. For example, in JP-A-2003-346114, a liquid ultraviolet curable adhesive is applied to an inlet, and a synthetic resin film is laminated thereon as a support. A method is disclosed in which an adhesive is cured by irradiating ultraviolet rays from above a synthetic resin film to bond them together.
However, in the method described in the above publication, the IC chip of the inlet may be damaged by the radiant heat of the ultraviolet irradiation lamp that becomes extremely high. In addition, since ultraviolet rays are irradiated from above the support, it is necessary to use a support that is excellent in ultraviolet transparency, and thus there is a problem that the support to be laminated is limited.

Japanese Patent Laid-Open No. 2003-58853, FIG. JP 2003-346114 A, [0025] to [0028] and FIG.

  Therefore, the present invention provides an RFID inlet laminating method and an RFID inlet laminating body in which an IC chip or the like is not damaged by heat at the time of ultraviolet irradiation, and an inlet can be laminated on various supports. And

  As a first means for solving the above-mentioned problems, the present invention provides a method for laminating an RFID inlet in which an RFID inlet having an antenna part and an IC chip on a base material and a support are laminated. Provided is a method for stacking RFID inlets, in which an ultraviolet curable adhesive is applied to the surface, the ultraviolet curable adhesive is irradiated with ultraviolet rays, and then the RFID inlets are overlapped and bonded before the ultraviolet curable adhesive is cured. .

  In the above laminating method, an ultraviolet curable adhesive is applied to the support and then irradiated with ultraviolet rays, so that no heat is applied to the inlet. Therefore, damage to the IC chip or the like can be prevented. In addition, since the ultraviolet curable adhesive is irradiated with ultraviolet rays before the inlets are overlapped, both can be laminated and adhered satisfactorily regardless of the material of the support or the inlet base material.

Further, according to a second means of the present invention, an RFID inlet including an antenna portion and an IC chip is laminated on a support via an adhesive layer, and the adhesive layer has a slow-curing property. An RFID inlet laminate comprising an ultraviolet curable adhesive is provided.
In the RFID inlet laminate, since the adhesive layer is made of a slow-curing ultraviolet curable adhesive, the RFID inlet and the support can be bonded after being irradiated with ultraviolet rays. Therefore, the IC chip or the like is not damaged by the heat at the time of ultraviolet irradiation, and a laminate in which the inlet and the support are firmly bonded can be configured.

According to the RFID inlet laminating method of the present invention, since the inlet is bonded using an ultraviolet curable adhesive, it is possible to stack the inlet using a printing apparatus, and dust or the like adheres to the inlet. Can also be prevented. Furthermore, there is no risk of damage to the IC chip or the like due to heat during ultraviolet irradiation, and even if the support or inlet base material has low ultraviolet transparency, both can be laminated and adhered satisfactorily.
Further, the RFID inlet laminated body of the present invention can provide an IC chip or the like that is not damaged during lamination and that the inlet and the support are well bonded to each other, so that water or gas or the like hardly penetrates between layers. Therefore, electronic information can be satisfactorily read by the reader / writer device.

Hereinafter, the present invention will be specifically described with reference to the drawings.
In FIG. 1, reference numeral 1 denotes an RFID inlet laminate in which supports 3 and 3 ′ are laminated on the front and back surfaces of an RFID inlet 2 via an adhesive layer 4 made of an ultraviolet curable adhesive. A design printing layer 5 is provided on the support 3.

As shown in FIG. 2, the RFID inlet 2 includes at least a module unit 25 including an antenna 22 and an IC chip 23 electrically connected to the antenna 22 on an inlet base 21. A device that can read / write or read electronic information in a non-contact manner and includes an RFID tag, a wireless IC tag, a non-contact IC, a non-contact data carrier, and the like is also included.
Specifically, the RFID inlet 2 includes a base material 21 serving as a support such as an antenna 22 and a single or mixture of metals such as Al, Cu, Sn, Ag, Au provided on one surface of the inlet base material 21. The antenna 22 is made of a conductive material such as, an IC chip 23 disposed at the end of the antenna 22, and a connection portion 24 that connects the IC chip 23 to the end of the antenna 22.
The base material 21 is not particularly limited as long as it is insulative. For example, one or two kinds of polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyolefins such as polypropylene, polyimides, polyamides, polyvinyl chloride, and polycarbonates are used. A single-layer or multi-layer resin film, paper, synthetic paper, or the like formed from the above mixture can be used, or a laminated film thereof. Among them, it is preferable to use a polyester film such as polyethylene terephthalate because it has relatively good heat resistance, chemical resistance, and dimensional stability. For example, the base material 21 having a thickness of about 20 to 100 μm is used.
The antenna 22 is formed on one surface of the substrate 21 by a known means such as an etching method or a paste screen printing method. The line pattern of the antenna 22 may be not only a circular shape but also various endless shapes such as a circular shape as shown in FIG. 3A, and straight lines on the left and right sides of the IC chip 23 as shown in FIG. It may be an end shape extending in a shape.
The connection unit 24 is configured by a metal plate or the like that electrically connects the end of the antenna 22 and the IC chip 23.

The supports 3 and 3 ′ are not particularly limited, and various types of synthetic resin films, foamed resin sheets, paper, synthetic paper, and laminates thereof can be used. Further, the supports 3 and 3 ′ provided on the front and back surfaces of the inlet 2 can be made of different types or the same types. For example, the front side support 3 is a synthetic resin film, the back side support 3 'is a foamed resin sheet, the front side support 3 is paper, and the back side support 3' is a synthetic resin film. The support 3 is a foamed resin sheet and the backside support 3 ′ is made of paper or the like, and both the front and back supports 3 and 3 ′ are foamed resin sheets. Examples where 'is composed of a synthetic resin film are exemplified. Among them, it is preferable that at least one of the supports 3 has a foamed resin sheet because impact resistance and heat resistance are good, and in particular, the supports 3 on both the front and back sides sandwiching the inlet 2. More preferably, 3 ′ has a foamed resin sheet. Examples of the foamed resin sheet include thermoplastic resin foam sheets such as polyethylene, polypropylene, polystyrene, and polyurethane. The expansion ratio is preferably about 1.3 to 60 times, particularly about 2 to 20 times. The foamed resin sheet has a thickness of about 80 to 400 μm. It is preferable to use such a foamed resin sheet because the inlet 2 can be protected.
In addition, the design printing layer 5 printed on the support body 3 displays a predetermined display such as a product name and a picture by a known printing method.

  As the ultraviolet curable adhesive 4 that bonds the support 3 and the inlet 2, a slow curable ultraviolet curable adhesive that cures with time after ultraviolet irradiation is used. The slow-curing UV curable adhesive is cured in several tens of seconds to several hours after being irradiated with UV rays, and the curing speed depends on the type and amount of the polymerizable compound or curing agent to be blended. It can be set as appropriate depending on the conditions of the ultraviolet rays to be irradiated. As such an adhesive, for example, it is composed of a mixture containing a photopolymerizable compound and an isocyanate compound that are cured by ultraviolet rays, and the photopolymerizable compound reacts by ultraviolet irradiation to exhibit excellent initial adhesive force, and then curing is completed. An adhesive (for example, Japanese Patent Publication No. 7-103356) is exemplified. By using such a slow-curing ultraviolet curable adhesive, the support 3 and the inlet 2 can be bonded at the initial stage of superposition, and both can be firmly bonded as the curing reaction proceeds.

The RFID inlet laminated body 1 having the above-described configuration can be used as various secondary processed products (applications) by appropriately forming it into a shape. For example, it can be used in the form of an affixing label that is affixed to an article or the like, a necking label (tag) that is hung on the neck of a container, and a cylindrical label that is wound around the body of a container.
Moreover, it can also be used as an IC card by using a relatively high rigidity as the support 3 and molding it into a rectangular shape. Furthermore, the support body 3 can be used in the form of a heat-shrinkable cylindrical label that is fitted into the body of a container and shrink-fitted by forming a cylindrical shape using a material having heat-shrinkability.
In the RFID inlet laminated body 1, since the adhesive layer 4 is made of a slow-curing ultraviolet curable adhesive, the inlet 2 and the support 3 can be bonded after being irradiated with ultraviolet rays, as will be described later. Therefore, it is possible to prevent the IC chip 23 and the like from being damaged by the heat generated by the ultraviolet lamp. In addition, since the ultraviolet curable adhesive can be bonded by irradiating ultraviolet rays before the inlet 2 is superimposed on the ultraviolet curable adhesive, curing spots of the ultraviolet curable adhesive hardly occur, and the inlet 2 and the support 3 are firmly bonded. The laminated body 1 can be configured.

  Note that the RFID inlet laminate 1 of the present invention is not limited to the configuration in which the supports 3 and 3 ′ are laminated on the front and back surfaces of the inlet 2. For example, as shown in FIG. The support 3 may be stacked. In this case, the support 3 is bonded to the formation surface of the module portion 25 of the inlet 2. Although the design print layer 5 is not shown in FIG. 4, design printing is performed on the front surface (or back surface) of the support 3 or the back surface of the inlet base material 21. However, the inlet laminate 1 of the present invention may have a configuration in which design printing is not performed.

Next, a method for stacking RFID inlets according to the present invention will be described.
In FIG. 5, reference numeral 60 denotes a printing apparatus. The printing apparatus 60 includes a roll mounting unit 61, a printing unit 62 that performs printing on the original sheet 71, an application unit 63 that applies an ultraviolet curable adhesive, and an ultraviolet irradiation that irradiates the ultraviolet curable adhesive with ultraviolet rays. A part 64; an introduction part 65 for superposing the inlet original fabric 72 on the sheet original fabric 71; a crimping part 66; and a winding part 67 for winding up the obtained laminate 73.
Specifically, a sheet material roll is mounted as the support 3 on the roll mounting unit 61, and the sheet material 71 is sent out by a feed roller (not shown). Design printing is performed on the back surface of the original sheet 71 sent to the printing unit 62 using ultraviolet curable ink by letterpress printing or flexographic printing, and the ink is cured by irradiation with ultraviolet rays. When performing multicolor printing, the printing process is repeated. Thereafter, the printed sheet material 71 is sent to the application unit 63. Next, a slow-curing ultraviolet curable adhesive 68 is applied to the surface of the sheet original fabric 71 with a gravure roll 631 provided in the application unit 63.
As the ultraviolet curable adhesive, an adhesive as exemplified above is used, and preferably has a viscosity of about 300 to 1000 mPa · s (however, the viscosity is measured according to JIS K 2283). Moreover, since there exists a possibility that an air bubble may arise in the uneven | corrugated | grooved part of the IC chip 23 and the antenna 22 of the inlet 2 to laminate | stack when the application thickness is too thin, about 5-30 micrometers is preferable.

Next, the raw sheet 71 coated with the ultraviolet curable adhesive 68 is irradiated with ultraviolet rays having a wavelength of 150 to 500 nm by an ultraviolet lamp provided in the ultraviolet irradiation unit 64. Even when such ultraviolet rays are irradiated, the slow-curing ultraviolet curable adhesive 68 is not instantly cured. Next, the inlet raw fabric 72 is fed out from the inlet raw fabric roll, and the surface of the inlet raw fabric 72 where the module portion 25 is formed faces the ultraviolet curable adhesive 68 while the ultraviolet curable adhesive 68 is uncured. And overlap.
Here, as shown in FIG. 6, the inlet raw fabric 72 has module portions 25 such as an IC chip 23 and an antenna 22 arranged in parallel on one surface of the base film original fabric 211 at a predetermined interval in the longitudinal direction. Consists of configuration.
Next, by passing the superposed sheet original 71 and inlet original 72 between the pressure-bonding rolls 66, both are laminated and bonded via an ultraviolet curable adhesive 68 that can be cured with time. The obtained laminate 73 is wound up in a roll shape at the winding unit 67. After that, by cutting the laminate 73 into a suitable shape, the inlet laminate 1 in which the support 3 is laminated on one side of the inlet 2 as shown in FIG. 4 can be obtained.

Furthermore, when manufacturing the inlet laminated body 1 by which the support body 3 was laminated | stacked on both surfaces of the inlet 2 as shown in FIG. 1, the sheet | seat raw material is further used as the support body 3 in the laminated body 73 obtained at the said process. What is necessary is just to laminate and bond the opposite.
Specifically, as shown in FIG. 7, the sheet raw material 74 is sent out from the sheet raw material roll, and in the same manner as in the above-described process, the surface of the sheet raw material 74 is slowly cured in the coating unit 63. An ultraviolet curable adhesive 68 is applied. Next, ultraviolet rays are irradiated by the ultraviolet lamp 64 to activate the ultraviolet curable adhesive. While the adhesive is uncured, the laminate 73 obtained by the above process (the sheet original 71 is laminated on one side of the inlet original 72) and the inlet original 72 side of the laminated original 73 is an ultraviolet curable adhesive. Overlapping facing. Next, by passing the superposed sheet raw material 74 and the laminated body 73 between the pressure-bonding rolls 66, both can be laminated and bonded via the ultraviolet curable adhesive 68. The obtained laminate 75 is similarly wound up in a roll form at the winding unit 67.

According to the RFID inlet laminating method of the present invention, the inlet laminate 1 can be continuously manufactured. Further, as shown in FIG. 5, the inlet 2 can be laminated and bonded as one step during printing using a printing device 60.
Further, in the lamination method of the present invention, the ultraviolet ray is irradiated before the ultraviolet ray curable adhesive is applied to the sheet original fabric 71 (support 3) and the inlet original fabric 72 (inlet 2) is overlaid. There is no possibility that the IC chip 23 or the like is damaged by the heat of time. Further, since the ultraviolet ray is irradiated on the ultraviolet curable adhesive without covering the support 3 or the inlet 2, the support 3 or the inlet 2 having a low ultraviolet transmittance such as a foamed resin sheet, a synthetic paper, or a colored paper is used. However, it is possible to sufficiently irradiate the adhesive with ultraviolet rays and to cure it without spots.

In the above-described stacking method, one line of the original sheet 72 is stacked on one sheet original 71, but a plurality of inlet originals 72 are arranged in the width direction of the sheet original 71. By introducing it, multi-row manufacturing is possible at a time.
Moreover, in the said lamination | stacking method, although the thing using the inlet raw fabric 72 with which the inlet 2 was connected continuously is illustrated, for example, each inlet 2 is made into the sheet raw fabric 71 via an ultraviolet curing adhesive. It is also possible to partially adhere to.
Furthermore, in the said lamination | stacking method, although the inlet was laminated | stacked after the printing process, you may print after laminating | stacking the inlet 2 on the contrary. Note that the RFID inlet laminating method of the present invention does not necessarily require a printing process, and is not limited to the one implemented in the printing apparatus.

The partially omitted vertical cross-sectional view showing an embodiment of the RFID inlet laminate. The top view which shows one Embodiment of RFID inlet, (B) is an AA line end view. (A), (b) is a top view which shows the modification of RFID inlet. The partially omitted vertical cross-sectional view showing a modification of the RFID inlet laminate. FIG. 3 is a schematic reference diagram showing each step in a method for stacking RFID inlets. The partial omission plan view showing an inlet raw fabric. FIG. 3 is a schematic reference diagram showing each step in a method for stacking RFID inlets.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... RFID inlet laminated body, 2 ... RFID inlet, 21 ... Inlet base material, 22 ... Antenna, 23 ... IC chip, 24 ... Connection part, 25 ... Module part, 3, 3 '... Support body, 4 ... Adhesive layer DESCRIPTION OF SYMBOLS 5 ... Design printing layer, 60 ... Printing apparatus, 61 ... Roll mounting part, 62 ... Printing part, 63 ... Application | coating part, 64 ... Ultraviolet irradiation part, 65 ... Inlet introduction part, 66 ... Crimping part, 67 ... Winding 68, UV curable adhesive, 71, 74 ... Original sheet, 72 ... Inlet original, 73, 75 ... Laminate

Claims (2)

An RFID inlet laminating method for laminating an RFID inlet having an antenna part and an IC chip on a substrate and a support,
An ultraviolet curable adhesive is applied to the surface of a support, and after irradiating the ultraviolet curable adhesive with ultraviolet rays, before the ultraviolet curable adhesive is cured, the RFID inlet is overlapped and bonded. A method for stacking RFID inlets. An RFID inlet laminate including an antenna part and an IC chip on a substrate is laminated on a support via an adhesive layer,
The RFID inlet laminate, wherein the adhesive layer is made of a slow-curing ultraviolet curable adhesive.

Images