JP2005340605A - Aligner and its adjusting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aligner and its adjusting method, wherein, for example, in a plurality of projection optical units, an image plane curve or an image plane tilt caused by a deflection of a mask is well adjusted. <P>SOLUTION: The projection optical unit has a deflection compensation optical face (24a) which is disposed near a second board (P) and is formed in a required curved shape in response to a deflection component of a first board, for making compensation for effects of the deflection component of the first board (M) corresponding to the projection optical unit. The projection optical unit has a tilt compensation optical plane (25) which is disposed near the first board and is formed in a required tilted planar plane shape in response to a tilt component of the first board, for making compensation for influences of the tilt component of the first board corresponding to the projection optical unit. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus and an adjustment method thereof, and in particular, projects a mask pattern onto a photosensitive substrate while moving the mask and the photosensitive substrate relative to a projection system (projection optical system) including a plurality of projection optical units. The present invention relates to a multi-scanning projection exposure apparatus that performs exposure.

  In recent years, liquid crystal display panels are frequently used as display elements for personal computers and televisions. The liquid crystal display panel is manufactured by patterning a transparent thin film electrode on a plate into a desired shape by a photolithography technique. As an apparatus for this photolithography process, a projection exposure apparatus that projects and exposes an original pattern formed on a mask onto a photoresist layer on a plate through a projection optical system is used.

  Recently, there is an increasing demand for a liquid crystal display panel having a large area, and in accordance with this demand, it is desired to expand the exposure area in this type of projection exposure apparatus. In order to enlarge the exposure area, a so-called multi-scanning projection exposure apparatus has been proposed (see, for example, Patent Document 1). In a multi-scanning projection exposure apparatus, a mask pattern is projected and exposed on a plate while moving the mask and the plate with respect to a plurality of projection optical units.

JP 2000-39557 A

  For example, in a multi-scanning projection exposure apparatus, if a large size mask is used, the influence of the deflection cannot be ignored. That is, because the mask pattern surface is curved due to the bending of the mask, the formed mask pattern image is also curved (curved surface). In particular, in the projection optical unit disposed at the end, the mask pattern surface is inclined due to the bending of the mask, so that the formed mask pattern image is also inclined (image surface inclination).

  The present invention has been made in view of the above problems, and provides an exposure apparatus in which, for example, a plurality of projection optical units have well-adjusted field curvature and field tilt caused by mask deflection. For the purpose.

  In addition, the present invention provides an adjustment method capable of satisfactorily adjusting the curvature of field and the inclination of the image plane caused by the deflection of the mask, for example, in a multi-scanning projection exposure apparatus including a plurality of projection optical units. The purpose is to provide.

In order to solve the above-mentioned problem, in the first embodiment of the present invention, the first substrate and the second substrate are moved relative to each other in the first direction with respect to the projection optical system, and the pattern formed on the first substrate is In an exposure apparatus that performs projection exposure onto the second substrate via a projection optical system,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
At least one projection optical unit of the plurality of projection optical units is arranged in the vicinity of the first substrate or the second substrate in order to compensate for the influence of the deflection component of the first substrate corresponding to the projection optical unit. The exposure apparatus is characterized in that it has a deflection compensating optical surface that is arranged in a predetermined curved shape corresponding to the deflection component.

In the second aspect of the present invention, the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is moved through the projection optical system. In an exposure apparatus that performs projection exposure on two substrates,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
At least one projection optical unit of the plurality of projection optical units is arranged in the vicinity of the first substrate or the second substrate in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit. And an inclination compensation optical surface formed in a required inclination plane shape corresponding to the inclination component.

In the third aspect of the present invention, the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is moved through the projection optical system. In a method for adjusting an exposure apparatus that performs projection exposure on two substrates,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of a pattern of the first substrate on the second substrate,
In at least one projection optical unit of the plurality of projection optical units, in order to compensate for the influence of the deflection component of the first substrate corresponding to the projection optical unit, the vicinity of the first substrate or the second substrate An adjustment method is provided that includes a deflection adjustment step of adjusting a predetermined optical surface arranged in a predetermined curved surface according to the deflection component.

In the fourth aspect of the present invention, the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is transferred to the first optical system via the projection optical system. In a method for adjusting an exposure apparatus that performs projection exposure on two substrates,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
In at least one projection optical unit of the plurality of projection optical units, in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit, the vicinity of the first substrate or the second substrate An adjustment method is provided that includes an inclination adjustment step of adjusting a predetermined optical plane arranged in a predetermined inclination plane according to the inclination component.

In the fifth aspect of the present invention, in the exposure apparatus for projecting and exposing the pattern formed on the first substrate onto the second substrate via the projection optical system,
The projection optical system is disposed in the vicinity of the first substrate or the second substrate to compensate for the influence of the deflection component of the first substrate, and is formed in a required curved surface shape corresponding to the deflection component. An exposure apparatus having a deflection compensation optical surface is provided.

In a sixth aspect of the present invention, in an adjustment method for an exposure apparatus that projects and exposes a pattern formed on a first substrate onto a second substrate via a projection optical system,
In order to compensate the influence of the deflection component of the first substrate in the projection optical system, a predetermined optical surface arranged in the vicinity of the first substrate or the second substrate is formed into a required curved surface shape corresponding to the deflection component. The adjustment method characterized by including the bending adjustment process adjusted to (3) is provided.

  In a typical embodiment of the present invention, in a multi-scanning projection exposure apparatus including a plurality of projection optical units, the mask deflection component is disposed near the mask (first substrate) or the photosensitive substrate (second substrate). A deflection compensating optical surface formed in a required curved surface shape corresponding to (curving component) is introduced. Therefore, for example, by the action of a deflection compensating optical surface obtained by adding a toric surface or a spherical surface curved in a direction opposite to the bending direction of the mask to the designed optical surface, the curvature of field generated due to the bending of the mask is improved. Adjustments can be made to compensate for the effects of the corresponding mask deflection components.

  In addition, an inclination compensation optical surface is introduced which is arranged in the vicinity of the mask or the photosensitive substrate and is formed in a required inclination plane according to the inclination component of the mask. Therefore, for example, the tilt of the image plane caused by the deflection of the mask is caused by the action of the tilt-compensating optical surface having a tilted flat surface obtained by adding a tilted plane inclined in the direction opposite to the tilt direction of the mask to the design optical plane. It can be adjusted well to compensate for the influence of the corresponding mask tilt component. As a result, in the exposure apparatus of the present invention, the fine pattern of the mask can be exposed with high accuracy, and as a result, a highly accurate liquid crystal display element or the like can be manufactured as a good microdevice.

Embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view schematically showing the overall configuration of an exposure apparatus according to an embodiment of the present invention. In the present embodiment, the present invention is applied to a multi-scanning projection exposure apparatus that projects and exposes a mask pattern onto a plate while moving the mask and the plate relative to a projection system (projection optical system) including a plurality of projection optical units. Applicable.

  In other words, in the present embodiment, the adjustment method of the present invention is applied to a multi-scanning projection exposure apparatus. In FIG. 1, the X axis is set along a direction (scanning direction) in which a mask (photosensitive substrate) coated with a mask on which a predetermined circuit pattern is formed and a resist is moved. In the plane of the mask, the Y axis is set along the direction (scanning orthogonal direction) perpendicular to the X axis, and the Z axis is set along the normal direction of the plate.

  The exposure apparatus of this embodiment includes an illumination system IL for uniformly illuminating a mask M supported in parallel to the XY plane via a mask holder (not shown) on a mask stage (not shown) MS. . Referring to FIG. 1, the illumination system IL includes a light source 1 made of, for example, an ultrahigh pressure mercury lamp. The light source 1 is positioned at the first focal position of an elliptical mirror 2 having a reflecting surface made of a spheroid. Therefore, the illumination light beam emitted from the light source 1 forms a light source image at the second focal position of the elliptical mirror 2 via the reflecting mirror (plane mirror) 3. A shutter (not shown) is disposed at the second focal position.

  The divergent light beam from the light source image formed at the second focal position of the elliptical mirror 2 is imaged again via the relay lens system 4. In the vicinity of the pupil plane of the relay lens system 4, a wavelength selection filter (not shown) that transmits only a light beam in a desired wavelength region is disposed. In the wavelength selection filter, g-line (436 nm) light, h-line (405 nm), and i-line (365 nm) light are simultaneously selected as exposure light. In the wavelength selection filter, for example, g-line light and h-line light can be simultaneously selected, and h-line light and i-line light can be simultaneously selected. It is also possible to select only light.

  An incident end 5 a of the light guide 5 is disposed in the vicinity of a position where a light source image is formed by the relay lens system 4. The light guide 5 is a random light guide fiber configured by randomly bundling a large number of fiber strands, and has the same number of incident ends 5a as the number of light sources 1 (one in FIG. 1) and a projection system (projection). Optical system) The number of projection ends 5b to 5f is the same as the number of projection optical units (five in FIG. 1) constituting the PL. Thus, the light incident on the incident end 5a of the light guide 5 propagates through the inside thereof, and then is emitted from the five exit ends 5b to 5f.

  The divergent light beam emitted from the exit end 5b of the light guide 5 is converted into a substantially parallel light beam by a collimator lens (not shown), and then enters a fly-eye integrator (optical integrator) 6b. The fly-eye integrator 6b is configured by arranging a large number of positive lens elements vertically and horizontally and densely so that the central axis extends along the optical axis AX. Therefore, the light beam incident on the fly-eye integrator 6b is wavefront-divided by a large number of lens elements, and a secondary light source consisting of the same number of light source images as the number of lens elements is formed on the rear focal plane (ie, near the exit surface). To do.

  That is, a substantial surface light source composed of a large number of light source images is formed on the rear focal plane of the fly-eye integrator 6b. The optical integrators (6b to 6f) are not limited to fly-eye integrators, but are diffractive optical elements, micro fly-eye lenses composed of a collection of micro lens elements, or internal reflection type rod integrators ( You may employ | adopt the structure containing a hollow pipe or a light pipe, a rod-shaped glass rod, etc.).

  The light beam from the secondary light source is limited by an aperture stop (not shown) disposed in the vicinity of the rear focal plane of the fly-eye integrator 6b, and then enters the condenser lens system 7b. The aperture stop is arranged at a position optically conjugate with the pupil plane of the corresponding projection optical unit PL1, and has a variable aperture for defining a range of a secondary light source that contributes to illumination. The aperture stop changes the aperture diameter of the variable aperture, thereby determining an σ value (on the pupil plane relative to the aperture diameter of the pupil plane of each of the projection optical units PL1 to PL5 constituting the projection system PL). Of the secondary light source image) is set to a desired value.

  The light flux through the condenser lens system 7b illuminates the mask M on which a predetermined transfer pattern is formed in a superimposed manner. Similarly, divergent light beams emitted from the other exit ends 5c to 5f of the light guide 5 are also collimated lenses, fly-eye integrators 6c to 6f (reference numerals are not shown), aperture stops, and condenser lens systems 7c. The masks M are illuminated in a superimposed manner through ˜7f (reference numerals not shown). That is, the illumination system IL illuminates a plurality of trapezoidal regions (the field region of the projection optical unit) arranged in the Y direction on the mask M (a total of five in FIG. 1).

  In the above example, in the illumination system IL, the illumination light from one light source 1 is equally divided into five illumination lights via the light guide 5, but is limited to the number of light sources and the number of projection optical units. Various modifications are possible without this. That is, if necessary, two or more light sources are provided, and the illumination light from these two or more light sources is equally divided into a required number (the number of projection optical units) of illumination light through a light guide with good randomness. You can also In this case, the light guide has the same number of incident ends as the number of light sources, and has the same number of exit ends as the number of projection optical units.

  The light from each illumination area on the mask M is a projection system PL including a plurality (five in total in FIG. 1) of projection optical units PL1 to PL5 arranged along the Y direction so as to correspond to each illumination area. Is incident on. Here, the configuration of each of the projection optical units PL1 to PL5 is the same. The configuration of each projection optical unit in the present embodiment will be specifically described below.

  FIG. 2 is a diagram schematically showing the configuration of the projection optical unit according to the present embodiment. As shown in FIG. 2, the projection optical unit of this embodiment (typically, the projection optical unit PL1 or the like) forms a primary image (intermediate image) of the mask pattern based on the light from the mask M, as shown in FIG. The image optical system K1 and a second image-forming optical system K2 that forms an erect image (secondary image) of the same size as the mask pattern on the plate P based on the light from the primary image. Here, the first imaging optical system K1 and the second imaging optical system K2 have basically the same configuration. In addition, in the vicinity of the primary image formation position (intermediate image plane) of the mask pattern, there are a field area (illumination area) of the projection optical unit on the mask M and a projection area (exposure area) of the projection optical unit on the plate P. A field stop FS to be defined is provided. If the illumination system IL includes an illumination field stop and an illumination area on the mask M is defined by the illumination field stop, the illumination field stop FS can be omitted.

  The first imaging optical system K1 is obliquely arranged at an angle of 45 ° with respect to the mask surface (XY plane) so as to reflect light incident along the −Z direction from the mask M in the −X direction. A first right-angle prism P1 having a reflecting surface P1a is provided. The first imaging optical system K1 includes, in order from the first right-angle prism P1 side, a first refractive optical system S1 and a first concave reflecting mirror M1 having a concave surface directed to the first right-angle prism P1 side. . Here, the first refractive optical system S1 includes five lenses L11 to L15 arranged in a reciprocating optical path formed by the first concave reflecting mirror M1.

  Specifically, the first refractive optical system S1 includes, in order from the first right-angle prism P1 side, a biconvex lens L11, a negative meniscus lens L12 having a concave surface facing the first right-angle prism P1 side, a biconvex lens L13, The lens includes a concave lens L14 and a positive meniscus lens lens L15 having a concave surface facing the first right-angle prism P1. The first refractive optical system S1 and the first concave reflecting mirror M1 are disposed along an optical axis AX1 extending in the X direction, and constitute a first catadioptric optical system as a whole. The light incident on the first right-angle prism P1 along the + X direction from the first catadioptric optical system is -Z by the second reflecting surface P1b obliquely provided at an angle of 45 ° with respect to the mask surface (XY plane). Reflected in the direction.

  On the other hand, the second imaging optical system K2 reflects light incident along the −Z direction from the second reflecting surface P1b of the first right-angle prism P1 with respect to the plate surface (XY plane) so as to reflect in the −X direction. A second right-angle prism P2 having a first reflecting surface P2a inclined at an angle of 45 ° is provided. The second imaging optical system K2 includes, in order from the second right-angle prism P2 side, a second refractive optical system S2 and a second concave reflecting mirror M2 having a concave surface directed to the second right-angle prism P2 side. . Here, the second refractive optical system S2 includes five lenses L21 to L25 arranged in a round-trip optical path formed by the second concave reflecting mirror M2.

  Specifically, the second refractive optical system S2 includes, in order from the second right-angle prism P2 side, a biconvex lens L21, a negative meniscus lens L22 having a concave surface facing the second right-angle prism P2, a biconvex lens L23, The lens includes a concave lens L24 and a positive meniscus lens lens L25 having a concave surface facing the second right-angle prism P2. The second refractive optical system S2 and the second concave reflecting mirror M2 are disposed along the optical axis AX2 extending in the X direction, and constitute a second catadioptric optical system as a whole. The light incident on the second right-angle prism P2 along the + X direction from the second catadioptric optical system is − by the second reflecting surface P2b obliquely provided at an angle of 45 ° with respect to the plate surface (XY plane surface). Reflected in the Z direction and reaches the plate P set at the final image plane.

  In the optical path between the mask M and the first right-angle prism P1, a focus adjustment member 21 including a pair of wedge-shaped declination prisms 21a and 21b is disposed. The pair of declination prisms 21a and 21b are set to have a wedge-shaped cross-sectional shape complementary to each other in the XZ plane in the reference state. The second deflection prism 21b is configured to be capable of reciprocating along the X direction. Therefore, by reciprocating the second declination prism 21b along the X direction, the optical path length between the mask M and the first reflecting surface P1a of the first right-angle prism P1 changes, and as a result, the first imaging optics. The formation position of the mask pattern image formed via the system K1 and the second imaging optical system K2 moves in the Z direction.

  As a result, the focus adjustment member 21 can adjust the distance between the object image points of the projection optical unit, that is, focus adjustment by moving the second declination prism 21b in the X direction. Note that the focus adjusting member 21 can be configured such that, for example, the opposite side (left side in FIG. 2) of the first declination prism 21a can reciprocate in the Z direction. In this case, only the dimension in the X direction of the mask pattern image formed via the first imaging optical system K1 and the second imaging optical system K2 changes due to the rotation of the first deflection prism 21a around the Y axis. . Thus, the focus adjusting member 21 adjusts only the magnification in the X direction of the projection optical unit by rotating around the Y axis of the first declination prism 21a (tilt of the first declination prism 21a), that is, anisotropic. Magnification adjustment can be performed.

  An image shift member 22 including a pair of parallel flat plates 22a and 22b is disposed in the optical path between the focus adjustment member 21 and the first right-angle prism P1. The pair of parallel flat plates 22a and 22b are set so that each optical plane is parallel to the XY plane in the reference state. The first parallel flat plate 22a is configured to be rotatable about the X axis, and the second parallel flat plate 22b is configured to be rotatable about the Y axis. Accordingly, the position of the mask pattern image formed via the first imaging optical system K1 and the second imaging optical system K2 moves in the Y direction by the rotation of the first plane-parallel plate 22a around the X axis (image). shift.

  Similarly, the position of the mask pattern image formed via the first imaging optical system K1 and the second imaging optical system K2 moves in the X direction by the rotation of the second plane parallel plate 22b around the Y axis ( Image shift). Thus, in the image shift member 22, the first imaging optical system K1 and the second imaging are combined by a combination of the rotation of the first parallel plane plate 22a around the X axis and the rotation of the second plane parallel plate 22b around the Y axis. The formation position of the mask pattern image formed via the optical system K2 can be moved two-dimensionally in the XY plane, that is, the image formation position of the projection optical unit can be shifted two-dimensionally.

  On the other hand, in the optical path between the second right-angle prism P2 and the plate P, a magnification adjusting member 23 including three lens components 23a to 23c is disposed. The magnification adjusting member 23 is composed of, for example, a negative lens 23a, a positive lens 23b, and a negative lens 23c sequentially from the second right-angle prism P2 side. Here, each lens component 23a-23c is comprised so that relative movement is possible along an optical axis direction (Z direction).

  Therefore, in the magnification adjusting member 23, a mask pattern image formed via the first imaging optical system K1 and the second imaging optical system K2 by the relative movement of the lens components 23a to 23c along the optical axis direction. Can be changed isotropically in the XY plane, that is, the isotropic magnification of the projection optical unit can be adjusted. In addition, in the optical path between the magnification adjusting member 23 and the plate P, a substantially parallel planar deflection compensation member 24 is disposed. A specific configuration and operation of the deflection compensation member 24 will be described later.

  The basic operation of each projection optical unit in the present embodiment will be described below. As described above, the pattern formed on the mask M is illuminated with substantially uniform illuminance by the illumination light (exposure light) from the illumination system IL. The light traveling in the −Z direction from the mask pattern formed in each illumination area on the mask M passes through the focus adjustment member 21 and the image shift member 22, and the first imaging optical system K <b> 1 of each projection optical unit. And is deflected by 90 ° by the first reflecting surface P1a of the first right-angle prism P1.

  The light reflected in the −X direction by the first reflecting surface P1a of the first right-angle prism P1 reaches the first concave reflecting mirror M1 via the first refractive optical system S1. The light reflected by the first concave reflecting mirror M1 is incident on the second reflecting surface P1b of the first right-angle prism P1 along the + X direction again through the first refractive optical system S1. The light that is deflected by 90 ° on the second reflecting surface P1b of the first right-angle prism P1 and travels along the −Z direction forms a primary image of the mask pattern in the vicinity of the field stop FS. The lateral magnification in the X direction of the primary image is approximately +1 times, and the lateral magnification in the Y direction is approximately -1.

  The light traveling along the −Z direction from the primary image of the mask pattern enters the second imaging optical system K2, and is deflected by 90 ° by the first reflecting surface P2a of the second right-angle prism P2. The light reflected in the −X direction by the second right-angle prism P2 reaches the second concave reflecting mirror M2 via the second refractive optical system S2. The light reflected by the second concave reflecting mirror M2 enters the second reflecting surface P2b of the second right-angle prism P2 along the + X direction again through the second refractive optical system S2.

  The light that has been deflected by 90 ° on the second reflecting surface P2b of the second right-angle prism P2 and traveled along the −Z direction corresponds to the corresponding exposure region on the plate P via the magnification adjusting member 23 and the deflection compensating member 24. Then, a secondary image of the mask pattern is formed. Here, the lateral magnification in the X direction and the lateral magnification in the Y direction of the secondary image are both +1 times. In other words, the mask pattern image formed on the plate P through each projection optical unit is an equal-magnification erect image, and each projection optical unit constitutes an equal-magnification erect system. Each projection optical unit is a substantially telecentric optical system on both the mask M side and the plate P side.

  In this way, the light passing through the projection system PL composed of the plurality of projection optical units PL1 to PL5 is masked on the plate P supported in parallel to the XY plane via the plate holder on the plate stage (not shown) PS. A pattern image is formed. That is, as described above, each of the projection optical units PL1 to PL5 is configured as an equal-magnification erecting system. In the trapezoidal exposure area, an erect image that is the same size as the mask pattern is formed.

  Incidentally, the mask stage MS is provided with a scanning drive system (not shown) having a long stroke for moving the stage along the X direction which is the scanning direction. In addition, a pair of alignment drive systems (not shown) are provided for moving the mask stage MS by a minute amount along the Y direction which is the scanning orthogonal direction and rotating the mask stage MS by a minute amount around the Z axis. The position coordinate of the mask stage MS is measured by a laser interferometer MIF using a moving mirror and the position is controlled.

  A similar drive system is also provided in the plate stage PS. That is, a scanning drive system (not shown) having a long stroke for moving the plate stage PS along the X direction which is the scanning direction, and the plate stage PS is moved by a minute amount along the Y direction which is the scanning orthogonal direction. In addition, a pair of alignment drive systems (not shown) are provided for rotating the Z axis by a minute amount. The position coordinate of the plate stage PS is measured by a laser interferometer PIF using a moving mirror, and the position is controlled.

  Further, as a means for relatively aligning the mask M and the plate P along the XY plane, a pair of alignment systems AL is disposed above the mask M. As the alignment system AL, for example, an alignment system in which a relative position between a mask alignment mark formed on the mask M and a plate alignment mark formed on the plate P is obtained by image processing can be used.

  Thus, the mask M and the plate P are integrated with each other in the projection system PL including the plurality of projection optical units PL1 to PL5 by the action of the scanning drive system on the mask stage MS side and the scanning drive system on the plate stage PS side. By moving along the direction (X direction), the entire pattern area on the mask P is transferred (scanned exposure) to the entire exposure area on the plate P. The shape and arrangement of the plurality of trapezoidal exposure areas, and the shape and arrangement of the plurality of trapezoidal illumination areas, are described in detail in, for example, Japanese Patent Application Laid-Open No. 7-183212, etc. Is omitted.

  As described above, when the mask M having a large size is used in the exposure apparatus of the present embodiment, the pattern surface of the mask M is curved and tilted due to the deflection of the mask M, so that the mask pattern image is also curved (field curvature). ) And tilt (image plane tilt). FIG. 3 is a view for explaining the influence of mask deflection when a large mask is used in the exposure apparatus of the present embodiment. In the present embodiment, when a mask M having a large dimension in the scanning orthogonal direction, that is, the Y direction orthogonal to the scanning direction (X direction) is used, the mask M bends relatively large along the Y direction as shown in FIG. The influence of this bending cannot be ignored.

  For example, when paying attention to the projection optical unit PL3 disposed in the center, in the pattern area of the mask M corresponding to the projection optical unit PL3, the mask is aligned along the Y direction as indicated by the curve C3 due to the deflection of the mask M. Since the pattern surface is curved, the mask pattern image finally formed through the projection optical unit PL3 is also curved (curved field) along the Y direction. Therefore, in the projection optical unit PL3, it is necessary to perform field curvature correction (deflection compensation adjustment) in order to compensate for the influence of the deflection component (curvature component) of the corresponding mask M. Similarly, in other projection optical units other than the projection optical unit PL3, it is necessary to perform field curvature correction in order to compensate for the influence of the deflection component of the corresponding mask M as necessary.

  Further, for example, when attention is paid to the projection optical unit PL1 (or PL5) arranged at the end, in the pattern region of the mask M corresponding to the projection optical unit PL1, as indicated by the curve C1 due to the deflection of the mask M. Since the mask pattern surface is tilted while being curved along the Y direction, the mask pattern image finally formed via the projection optical unit PL1 is also tilted (image surface tilted) while being curved along the Y direction. Become. Therefore, in the projection optical unit PL1 (or PL5), it is necessary to perform image plane tilt correction (tilt compensation adjustment) in order to compensate for the influence of the tilt component of the corresponding mask M. Similarly, in other projection optical units (PL2, PL4) other than the projection optical unit PL3 arranged in the center, image plane tilt correction is performed to compensate for the influence of the tilt component of the corresponding mask M as necessary. Need to do.

  Therefore, in the present embodiment, in each of the projection optical units PL1 to PL5, in order to compensate for the influence of the deflection component (curved component) in the pattern area of the corresponding mask (first substrate) M, the plate (second substrate) P The deflection compensation member 24 is introduced in the vicinity of. The deflection compensation member 24 is an optical member that should be in a parallel plane when designed on the assumption that the mask M is not deflected (or when the bending component due to the deflection of the mask M is ignored). In the present embodiment, as shown in FIG. 4A, the surface on the plate P side (the lower surface in the figure) of the deflection compensation member 24 is used as the deflection compensation optical surface 24a, and required according to the deflection component of the mask M. It is formed in the curved shape.

  Specifically, the deflection compensation optical surface 24a is arranged on a plane 24b (shown by a broken line in the drawing) 24b which is a design optical surface designed on the assumption that the mask M is not deflected (−Z direction). ) And a toric surface curved in the opposite direction (+ Z direction) (surface having different power in the orthogonal direction), that is, a toric surface shape. In this way, due to the action of the deflection compensating optical surface 24a that is arranged in the vicinity of the image plane of the projection optical unit and is formed in a required curved surface shape corresponding to the deflection component of the mask M, for example, distortion aberration and magnification aberration, etc. It is possible to compensate for the influence of the corresponding deflection component (curvature component) of the mask M by satisfactorily adjusting the curvature of field generated due to the deflection of the mask M while suppressing side effects. When distortion occurs as a side effect, for example, the first right-angle prism P1 can be finely moved in the X direction for correction. Further, when magnification aberration occurs as a side effect, it can be corrected by using, for example, an isotropic magnification adjustment action of the magnification adjustment member 23.

  In the present embodiment, in order to compensate for the influence of the inclination component in the pattern area of the corresponding mask M in each projection optical unit (PL1, PL2, PL4, PL5) other than the projection optical unit PL3 arranged in the center. The tilt compensation optical surface 25 is introduced in the vicinity of the mask M. The tilt compensation optical surface 25 is formed on the first right-angle prism P <b> 1 side of the second declination prism 21 b that constitutes the focus adjustment member 21. When the surface of the second right-angle prism 21b on the first right-angle prism P1 side is designed on the assumption that the mask M does not bend (or when the inclination component due to the deflection of the mask M is ignored), An optical surface to be planar. In the present embodiment, as shown in FIG. 4B, the surface of the second declination prism 21b on the first right-angle prism P1 side (the surface on the lower side in the drawing) is used as the inclination compensation optical surface 25, and the inclination of the mask M It is formed in the required inclined flat shape according to the component.

  Specifically, for example, the tilt compensation optical surface 25 in the projection optical unit PL1 of FIG. 3 rises in the tilt direction (+ Y direction) of the mask M to the design optical plane 25a designed on the assumption that the mask M is not bent. It is formed in the shape of an inclined plane obtained by adding an inclined plane inclined in the direction opposite to the (inclination direction) (inclination direction descending in the + Y direction). In this manner, the mask of the mask is achieved while suppressing side effects related to aberrations by the action of the tilt compensation optical surface 25 arranged in the vicinity of the object plane of the projection optical unit and formed in the required tilt plane according to the tilt component of the mask M. It is possible to satisfactorily adjust the image plane inclination generated due to the deflection of M and compensate the influence of the corresponding inclination component of the mask M.

  In the present embodiment, the projection optical unit is manufactured based on a design on the assumption that the mask M is not bent (or a design that ignores the deflection of the mask M), that is, the projection before being mounted on the exposure apparatus. When the optical unit is used alone or after the projection optical unit is mounted on the exposure apparatus, the optical surface on the plate P side, which is initially formed in a flat shape of the deflection compensation member 24, is a required curved surface corresponding to the deflection component of the mask M. The optical surface of the second right-angle prism P1 side, which is initially formed in a planar shape perpendicular to the optical axis of the second deflection prism 21b, is tilted according to the tilt component of the mask M. It can be adjusted to a flat shape. Note that it is preferable to correct side effects such as distortion and magnification aberration that occur in association with the above-described deflection compensation adjustment when the projection optical unit is alone before being mounted on the exposure apparatus.

  Specifically, the deflection compensation member 24 initially manufactured as a flat planar plate is replaced with a deflection compensation member 24 having a deflection compensation optical surface 24a formed in a required curved shape corresponding to the deflection component of the mask M. The second deflection prism 21b, which is adjusted or initially manufactured as a normal deflection prism, has a second deflection prism 21 having a tilt compensation optical surface 25 formed in a required tilt plane according to the tilt component of the mask M. The angle prism 21b can be exchanged and adjusted. Alternatively, the optical surface on the plate P side of the deflection compensation member 24 that is initially manufactured in a planar shape is processed and adjusted to a required curved deflection compensation optical surface 24a corresponding to the deflection component of the mask M, or the initial The optical surface on the first right-angle prism P1 side of the second declination prism 21b manufactured in a flat shape is processed and adjusted to a desired tilt-planar tilt compensation optical surface 25 corresponding to the tilt component of the mask M. be able to.

  Furthermore, each projection optical unit can be designed in consideration of the bending of the mask M in advance. In this case, the deflection compensation member 24 having the deflection compensation optical surface 24a formed in a required curved surface shape corresponding to the deflection component of the mask M, and the tilt compensation optical surface having the required tilt plane shape corresponding to the tilt component of the mask M. The second declination prism 21b having 25 is manufactured according to a design that takes into account the bending of the mask M in advance. Then, each projection optical unit is assembled using the manufactured deflection compensation member 24 and the second declination prism 21b.

  In the above-described embodiment, the deflection compensation optical surface 24a is formed on the plate P side of the deflection compensation member 24. However, the present invention is not limited to this, and the deflection compensation member 24 is deflected on the second right-angle prism P2 side. An adaptive optical surface can also be formed. Further, for example, a deflection compensating optical surface can be formed on the lens component 23a, the lens component 23b, or the lens component 23c constituting the magnification adjusting member 23. In this case, the deflection compensation optical surface is obtained by adding a toric surface curved in the direction opposite to the deflection direction of the mask M to the designed optical surface designed on the assumption that the mask M is not bent.

  In the above-described embodiment, the deflection compensation optical surface 24a is formed on the deflection compensation member 24 arranged in the vicinity of the plate P, that is, in the vicinity of the image plane of the projection optical unit. However, an optical member (the first declination prism 21a, the second declination prism 21b, the first parallel plane plate 22a, or the second parallel plane plate 22b) disposed in the vicinity of the mask M, that is, in the vicinity of the object plane of the projection optical unit. It is also possible to form a deflection compensating optical surface. Also in this case, the deflection compensating optical surface can be obtained by adding a toric surface curved in the direction opposite to the bending direction of the mask M to the designed optical surface designed on the assumption that the mask M is not bent.

  In the above-described embodiment, the deflection compensating optical surface 24a obtained by adding a toric surface curved in the direction opposite to the deflection direction of the mask M to the design optical surface is used. However, since the illumination area on the mask M and the exposure area on the plate P corresponding to each projection optical unit have a trapezoidal shape extending in the Y direction and perform scanning exposure along the X direction, for example, the mask M Even if a deflection compensation optical surface obtained by adding a spherical surface curved in the direction opposite to the deflection direction to the design optical surface, an effect substantially equivalent to the case of the deflection compensation optical surface obtained by adding a toric surface is obtained. It is done.

  In the above-described embodiment, the tilt compensation optical surface 25 is formed on the first right-angle prism P1 side of the second declination prism 21b. However, the present invention is not limited to this, and the mask of the first declination prism 21a. An inclination compensation optical surface can be formed on the M side. However, the image plane inclination can be finely adjusted by slightly rotating the first deflection prism 21a about an axis perpendicular to the surface of the first deflection prism 21a on the first right-angle prism P1 side.

  Therefore, when coarse adjustment of the image plane tilt is performed using the tilt compensation optical surface and fine adjustment of the image plane tilt is performed by slightly rotating the first declination prism 21a, the influence of the rotation component around the optical axis is affected. It is not preferable to form an inclination compensation optical surface on the mask M side of the first declination prism 21a configured to receive the light. In general, it is not preferable to form the tilt compensation optical surface on an optical member that rotates around the optical axis (a broad concept including an optical member that is configured to be affected by the rotational component around the optical axis). Further, for example, a tilt compensation optical surface can be formed on the first parallel flat plate 22a or the second parallel flat plate 22b constituting the image shift member 22.

  In the above-described embodiment, the tilt compensation optical surface 25 is formed on the second declination prism 21b disposed in the vicinity of the mask M, that is, in the vicinity of the object plane of the projection optical unit. However, the tilt compensation optical surface can be formed on the optical member (for example, the deflection compensation member 24) disposed in the vicinity of the plate P, that is, in the vicinity of the image plane of the projection optical unit. That is, both the deflection compensation optical surface and the tilt compensation optical surface can be formed on one optical member arranged in the vicinity of the mask M or the plate P. In this case, it is also possible for one optical surface to serve as both the optical member deflection compensation optical surface and the tilt compensation optical surface.

  In the above-described embodiment, in all the projection optical units PL1 to PL5, the influence of the deflection component (curvature component) of the mask M is compensated using the deflection compensation optical surface 24a. However, the present invention is not limited to this, and it is also possible to introduce a deflection compensating optical surface only in a required projection optical unit. In the above-described embodiment, in all the projection optical units (PL1, PL2, PL4, PL5) other than the projection optical unit PL3, the influence of the inclination component of the mask M is compensated using the inclination compensation optical surface 25. Yes. However, the present invention is not limited to this, and it is also possible to introduce an inclination compensation optical surface only in a required projection optical unit.

  Now, referring again to FIG. 3, for example, when focusing on the projection optical unit PL3 arranged at the center, the distance between the object image points is the design value (without assuming the deflection of the mask M) by the central deflection amount DF3 of the mask M. It becomes shorter than the set distance between object image points). Therefore, in the projection optical unit PL3, it is necessary to perform focus adjustment in order to compensate for the influence of the deflection of the mask M. Similarly, in other projection optical units, it is necessary to perform focus adjustment to compensate for the influence of the deflection of the mask M as necessary.

  As a focus adjustment method in each projection optical unit, for example, the first right-angle prism P1 is moved in the + X direction by a movement amount corresponding to about ½ of the deflection amount of the corresponding mask M (first concave reflection along the optical axis AX1). A method of moving to the opposite side of the mirror M1 (see FIG. 2) can be used. However, in this method, there is a case where C-shaped distortion (nonlinear magnification error in which the magnification error changes in a C shape with respect to the change in image height) is generated by the movement of the first right-angle prism P1 in the X direction. When such C-shaped distortion occurs, a specific lens (for example, the lens L15) in the first imaging optical system K1 and a corresponding specific lens (for example, the lens L25) in the second imaging optical system K2. ) Is moved in the optical axis direction and in the opposite direction by the same amount of movement to correct the C-shaped distortion.

  Further, as a focus adjustment method in each projection optical unit, the first right-angle prism P1 is moved in the + X direction (to the side opposite to the first concave reflecting mirror M1 along the optical axis AX1 so as not to generate C-shaped distortion: FIG. 2), and the second rectangular prism P2 is moved in the −X direction by the amount of movement different from the amount of movement of the first rectangular prism P1 (to the second concave reflecting mirror M2 side along the optical axis AX2): FIG. The method of moving can be used.

  Further, for example, the length (optical path length) along the optical axis of the second deflection prism 21b (an optical member having the tilt compensation optical surface 25) or the deflection compensation optical surface 24 (an optical member having the deflection compensation optical surface 24a) is set. The focus adjustment in each projection optical unit can also be performed by appropriately changing between the projection optical unit PL3 disposed in the center and the other projection optical units.

  Further, in the above-described embodiment, the projection optical unit has the first imaging optical system K1 and the second imaging optical system K2 having the same configuration, and an upright erect image equal to the pattern of the mask M is displayed on the plate P. Is formed. However, the present invention is not limited to this, and various modifications can be made to the specific configuration, magnification, image orientation, and the like of the projection optical unit.

  The exposure apparatus according to the present embodiment is assembled by electrically, mechanically, or optically coupling the optical members and the stages in the present embodiment shown in FIG. 1 so as to achieve the functions described above. be able to. Then, the illumination system IL illuminates the mask (reticle) (illumination process), and the photosensitive substrate is scanned and exposed with a transfer pattern formed on the mask using the projection system PL including the projection optical units PL1 to PL5 ( By the exposure step, a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 5 shows an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of this embodiment shown in FIG. This will be described with reference to a flowchart.

  First, in step 301 of FIG. 5, a metal film is deposited on one lot of wafers. In the next step 302, a photoresist is applied on the metal film on the one lot of wafers. Thereafter, in step 303, using the exposure apparatus of the above-described embodiment, the image of the pattern on the mask is sequentially exposed to each shot area on the wafer of one lot via the projection optical system (projection optical unit). Transcribed. Thereafter, in step 304, the photoresist on the one lot of wafers is developed, and in step 305, the resist pattern is etched on the one lot of wafers to form a pattern on the mask. Corresponding circuit patterns are formed in each shot area on each wafer. Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput.

  In the exposure apparatus of the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 6, in the pattern formation process 401, a so-called photolithography process is performed in which the mask pattern is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus of the above-described embodiment. . By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step 402.

  Next, in the color filter forming step 402, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter forming step 402, a cell assembly step 403 is executed. In the cell assembly step 403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step 401, the color filter obtained in the color filter formation step 402, and the like.

  In the cell assembly step 403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step 401 and the color filter obtained in the color filter formation step 402, and a liquid crystal panel (liquid crystal cell) is obtained. ). Thereafter, in a module assembling step 404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine circuit pattern can be obtained with high throughput.

  In the above-described embodiment, an ultrahigh pressure mercury lamp is used as the light source, but the present invention is not limited to this, and other appropriate light sources can be used. That is, in the present invention, the exposure wavelength is not particularly limited to g-line, h-line, i-line and the like.

  In the above-described embodiment, the present invention is exemplified by a multi-scanning projection exposure apparatus that performs scanning exposure while moving a mask and a photosensitive substrate with respect to a projection system (projection optical system) constituted by a plurality of projection optical units. Describes the invention. However, the present invention can also be applied to a projection exposure apparatus that performs batch exposure without moving a mask and a photosensitive substrate with respect to a projection system composed of a plurality of projection optical units.

  Furthermore, it comprises a scanning projection exposure apparatus that performs scanning exposure while moving a mask and a photosensitive substrate with respect to a projection system (projection optical system) composed of a single projection optical unit, and a single projection optical unit. The present invention can also be applied to a projection exposure apparatus that performs batch exposure without moving a mask and a photosensitive substrate with respect to the projected system. However, in this case, it is not necessary to consider the influence of the inclination component due to the bending of the mask, and only the influence of the bending component (curving component) needs to be considered.

  In the above embodiments, an example in which a mask having a predetermined light-shielding pattern formed on a transparent substrate is used as a mask. However, the present invention is not limited to this, and a DMD (digital mirror micro device) or a liquid crystal is used. It is also possible to use a pattern display element using an element or the like as a mask. Furthermore, it goes without saying that the present invention can also use a pattern display device other than the DMD or liquid crystal element as a mask.

1 is a perspective view schematically showing an overall configuration of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematically the structure of the projection optical unit concerning this embodiment. It is a figure explaining the influence of a mask bending when a mask with a big size is used in the exposure apparatus of this embodiment. (A) is a figure explaining a bending compensation optical surface, (b) is a figure explaining an inclination compensation optical surface. It is a flowchart of the method at the time of obtaining the semiconductor device as a microdevice by forming a predetermined circuit pattern in the wafer etc. as a photosensitive substrate using the exposure apparatus of this embodiment. It is a flowchart of the method at the time of obtaining the liquid crystal display element as a microdevice by forming a predetermined pattern on a plate using the exposure apparatus of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source 2 Elliptical mirror 3 Reflective mirror 4 Relay lens system 5 Light guide 6 Fly eye integrator 7 Condenser lens system 24 Deflection compensation member 24a Deflection compensation optical surface 25 Inclination compensation optical surface M Mask PL Projection system (projection optical system)
PL1 to PL5 Projection optical unit P Plate FS Field stop S1 First refractive optical system S2 Second refractive optical system M1 First concave reflecting mirror M2 Second concave reflecting mirror K1 First imaging optical system K2 Second imaging optical system

Claims (20)

Exposure in which the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is projected onto the second substrate via the projection optical system. In the device
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
At least one projection optical unit of the plurality of projection optical units is arranged in the vicinity of the first substrate or the second substrate in order to compensate for the influence of the deflection component of the first substrate corresponding to the projection optical unit. An exposure apparatus comprising: a deflection compensating optical surface disposed in a predetermined curved shape corresponding to the deflection component. The deflection compensating optical surface is obtained by adding a toric surface or a spherical surface curved in a direction opposite to the bending direction of the first substrate to a designed optical surface designed on the assumption that the first substrate is not bent. The exposure apparatus according to claim 1, wherein At least one projection optical unit of the plurality of projection optical units is arranged in the vicinity of the first substrate or the second substrate in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit. The exposure apparatus according to claim 1, further comprising an inclination compensation optical surface that is arranged in a predetermined inclination plane according to the inclination component. The tilt compensation optical surface is obtained by adding a tilt plane inclined in a direction opposite to the tilt direction of the first substrate to a design optical plane designed on the assumption that the first substrate is not bent. The exposure apparatus according to claim 3. 5. The exposure apparatus according to claim 3, wherein the tilt compensation optical surface is formed on an optical member that does not rotate around the optical axis. At least one projection optical unit of the plurality of projection optical units replaces the deflection compensation optical surface with the deflection component for compensating for the influence of the deflection component of the first substrate corresponding to the projection optical unit. Deflection / tilt compensation optics comprising: a required curved surface component corresponding to the projection component; and a required tilt plane component corresponding to the tilt component for compensating for the influence of the tilt component of the first substrate corresponding to the projection optical unit. The exposure apparatus according to claim 1, wherein the exposure apparatus has a surface. Exposure in which the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is projected onto the second substrate via the projection optical system. In the device
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
At least one projection optical unit of the plurality of projection optical units is arranged in the vicinity of the first substrate or the second substrate in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit. And an inclination compensating optical surface formed in a required inclination plane shape corresponding to the inclination component. The tilt compensation optical surface is obtained by adding a tilt plane inclined in a direction opposite to the tilt direction of the first substrate to a design optical plane designed on the assumption that the first substrate is not bent. The exposure apparatus according to claim 7. 9. The exposure apparatus according to claim 7, wherein the tilt compensation optical surface is formed on an optical member that does not rotate around the optical axis. Exposure in which the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is projected onto the second substrate via the projection optical system. In the apparatus adjustment method,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of the pattern of the first substrate on the second substrate,
In at least one projection optical unit of the plurality of projection optical units, in order to compensate for the influence of the deflection component of the first substrate corresponding to the projection optical unit, the vicinity of the first substrate or the second substrate An adjustment method, comprising: a deflection adjustment step of adjusting a predetermined optical surface arranged in a predetermined curved surface according to the deflection component. In the deflection adjusting step, the optical member having the predetermined optical surface is replaced or reworked so that the design optical surface designed on the premise that the first substrate is not bent is opposite to the bending direction of the first substrate. The adjustment method according to claim 10, wherein the adjustment is performed by adding a toric surface or a spherical surface curved in a direction. In at least one projection optical unit of the plurality of projection optical units, in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit, the vicinity of the first substrate or the second substrate The adjustment method according to claim 10, further comprising an inclination adjustment step of adjusting a predetermined optical plane disposed in a predetermined inclination plane according to the inclination component. In the tilt adjustment step, an optical member having the predetermined optical plane is replaced or reworked so that the design optical plane designed on the assumption that the first substrate is not bent is opposite to the tilt direction of the first substrate. The adjustment method according to claim 12, wherein the adjustment is performed by adding an inclined plane inclined in the direction. In the deflection adjustment step, a predetermined optical surface is provided on the projection optical unit with a required curved surface component corresponding to the deflection component for compensating for the influence of the deflection component of the first substrate corresponding to the projection optical unit. 12. The adjustment according to claim 10, wherein the adjustment is performed to an optical surface having a required inclined plane component corresponding to the inclination component for compensating for the influence of the corresponding inclination component of the first substrate. Method. Exposure in which the first substrate and the second substrate are moved relative to the projection optical system in the first direction, and the pattern formed on the first substrate is projected onto the second substrate via the projection optical system. In the apparatus adjustment method,
The projection optical system has a plurality of projection optical units arranged along a predetermined direction crossing the first direction and for forming an image of a pattern of the first substrate on the second substrate,
In at least one projection optical unit of the plurality of projection optical units, in order to compensate for the influence of the tilt component of the first substrate corresponding to the projection optical unit, the vicinity of the first substrate or the second substrate And a tilt adjusting step of adjusting a predetermined optical plane disposed in a predetermined tilt plane according to the tilt component. In the tilt adjustment step, an optical member having the predetermined optical plane is replaced or reworked so that the design optical plane designed on the assumption that the first substrate is not bent is opposite to the tilt direction of the first substrate. The adjustment method according to claim 15, wherein the adjustment is performed by adding an inclined plane inclined in the direction. In an exposure apparatus that projects and exposes a pattern formed on a first substrate onto a second substrate via a projection optical system,
The projection optical system is disposed in the vicinity of the first substrate or the second substrate to compensate for the influence of the deflection component of the first substrate, and is formed in a required curved surface shape corresponding to the deflection component. An exposure apparatus having a deflection compensating optical surface. The deflection compensating optical surface is obtained by adding a toric surface or a spherical surface curved in a direction opposite to the bending direction of the first substrate to a designed optical surface designed on the assumption that the first substrate is not bent. The exposure apparatus according to claim 17, wherein In an exposure apparatus adjustment method for projecting and exposing a pattern formed on a first substrate onto a second substrate via a projection optical system,
In order to compensate the influence of the deflection component of the first substrate in the projection optical system, a predetermined optical surface arranged in the vicinity of the first substrate or the second substrate is formed into a required curved surface shape corresponding to the deflection component. The adjustment method characterized by including the bending adjustment process adjusted to (3). In the deflection adjusting step, the optical member having the predetermined optical surface is replaced or reworked so that the design optical surface designed on the premise that the first substrate is not bent is opposite to the bending direction of the first substrate. 20. The adjustment method according to claim 19, wherein adjustment is performed by adding a toric surface or a spherical surface curved in a direction.

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