JP2005243904A - Illumination optical apparatus, aligner, and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination optical apparatus including an optical element capable of maintaining optical performance even when used in a place where energy density of a beam emitted from a light source is high. <P>SOLUTION: The illumination optical apparatus for illuminating a plane M to be irradiated by a beam from the light source 1 includes a first optical integrator 4a provided in a light path between the light source 1 and the plane M, a second optical integrator 8 provided in a light path between the first integrator 4a and the plane M, and an incident position changing element 87 provided in a light path between the first optical integrator 4a and the second optical integrator 8 for varying the incident position of an incoming beam to the second integrator 8. The element 87 comprises an optical member capable of maintaining the optical performance of the element 87 even if used in a place where energy density of the beam emitted from the light source 1 is high. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an illumination optical apparatus used in an exposure apparatus for manufacturing a microdevice such as a semiconductor element, a liquid crystal display element, and a thin film magnetic head in a lithography process, an exposure apparatus including the illumination optical apparatus, and the illumination optical apparatus. It relates to the exposure method used.

  In a conventional exposure apparatus, a light beam emitted from a light source is incident on a fly-eye lens (or micro fly-eye lens) as an optical integrator, and a secondary light source composed of a number of light sources is formed on the rear focal plane. The light beam from the secondary light source is restricted through an aperture stop disposed in the vicinity of the rear focal plane of the fly-eye lens as necessary, and then enters the condenser lens.

  The light beam condensed by the condenser lens illuminates the mask on which a predetermined pattern is formed in a superimposed manner. The light transmitted through the mask pattern forms an image on the wafer via the projection optical system. Thus, the mask pattern is projected and exposed (transferred) onto the wafer. The pattern formed on the mask is highly integrated. In order to accurately transfer the fine pattern onto the wafer, it is essential to obtain a uniform illuminance distribution on the wafer.

  Further, when the mask pattern becomes fine and exposure is performed near the resolution limit of the exposure apparatus, it is the aperture stop that contributes to the resolution of the light emitted from the aperture stop of the illumination optical apparatus. Only the light emitted from the peripheral portion becomes light, and the light emitted from the central portion of the opening only serves to lower the contrast of the image. Therefore, in recent years, the depth of focus and resolving power of the projection optical system have been improved by performing ring-shaped or multipolar (for example, quadrupolar) modified illumination having a light intensity distribution around the illumination pupil of the illumination optical device. The technique of making it attract attention (for example, refer patent document 1 and patent document 2).

JP-A-61-91662 Japanese Patent Laid-Open No. 4-101148

  By the way, in the illumination optical device described above, many of the optical members constituting the illumination optical device are formed of quartz that can be easily processed as an optical member. However, when an optical member formed of quartz is mounted on an illumination optical device, the light beam of the optical element passes when the optical member is disposed at a position where the light beam emitted from the light source unit has a high energy density. Since the portion is damaged and the internal structure of the optical element is changed, the light transmittance of the optical element is deteriorated. Therefore, an optical element formed of quartz cannot maintain the optical performance of the optical element.

  The subject of this invention was provided with the illumination optical apparatus provided with the optical element which can maintain an optical performance, even when it is used in the place where the energy density of the light beam inject | emitted from a light source part becomes high, and this illumination optical apparatus An exposure apparatus and an exposure method using the illumination optical apparatus are provided.

  The illumination optical device according to claim 1, wherein the illumination optical device illuminates the illuminated surface with a light beam from the light source unit, and a first optical integrator disposed in an optical path between the light source unit and the illuminated surface; A second optical integrator disposed in an optical path between the first optical integrator and the irradiated surface; an optical path disposed between the first optical integrator and the second optical integrator; 2 An incident position changing element that changes the incident position of the incident light beam on the optical integrator, and the incident position changing element is used even when the energy density of the light beam emitted from the light source unit is increased. It is constituted by an optical member that can maintain the optical performance of the incident position changing element.

  According to the illumination optical device according to claim 1, the incident position constituted by the optical member capable of maintaining the optical performance even when used in a place where the energy density of the light beam emitted from the light source unit is high. Since the changing element is provided, it is possible to prevent damage to the internal structure of the incident position changing element arranged where the energy density of the light beam emitted from the light source unit is high, and the light transmittance of the incident position changing element Can be prevented. Accordingly, since the light beam emitted from the light source unit passes through the incident position changing element while maintaining the optical performance of the incident position changing element, it is possible to suppress a decrease in the amount of light of the light beam and to illuminate the irradiated surface satisfactorily. be able to.

  The illumination optical device according to claim 2 is complementary to the first prism in which the incident position changing element has a concave refractive surface with respect to the optical axis direction of the illumination optical device, and the concave refractive surface of the first prism. And at least one of the first prism and the second prism is configured to be movable along the optical axis of the illumination optical device. It is characterized by that.

  According to the illumination optical apparatus of the second aspect, at least one of the first prism and the second prism included in the incident position changing element is configured to be movable along the optical axis of the illumination optical apparatus. By making the concave refracting surface of one prism and the convex refracting surface of the second prism abut, the incident position changing element forms a parallel plane plate. Further, by separating the concave refracting surface of the first prism from the convex refracting surface of the second prism, the incident position changing element forms a so-called beam expander, so that the concave refracting surface of the first prism and the second prism are By adjusting the distance from the convex refracting surface, the incident position (distance from the optical axis) of the incident light beam on the second optical integrator can be freely changed. Therefore, for example, when performing modified illumination or the like (for example, annular illumination or multipolar illumination), the illumination shape corresponding to the region to be illuminated of the illuminated surface can be obtained, and the illuminated surface can be illuminated well. it can.

  The illumination optical device according to claim 3, wherein the incident position changing element has a first prism having a part of a concave refractive surface with respect to the optical axis direction of the illumination optical device, and the optical axis direction of the illumination optical device. And a second prism having a part of a convex refracting surface, and at least one of the first prism and the second prism is configured to be movable along the optical axis direction of the illumination optical device. The first prism has a part of the plurality of concave refracting surfaces, and the second prism has a part of the plurality of convex refracting surfaces.

  According to the illumination optical device of the third aspect, since the first prism included in the incident position changing element has a part of the plurality of concave refracting surfaces, the thickness of the first prism compared to the prism having the concave refracting surfaces. The thickness can be reduced. Similarly, since the second prism included in the incident position changing element has a part of the plurality of convex refracting surfaces, the thickness of the second prism can be reduced compared to the prism having the convex refracting surfaces. it can. Therefore, when the first prism and the second prism are mounted on the illumination optical device, the arrangement space can be reduced.

  In addition, since at least one of the first prism and the second prism is configured to be movable along the optical axis of the illumination optical device, a part of the plurality of concave refractive surfaces of the first prism and the plurality of second prisms are arranged. The incident position changing element constitutes a plane parallel plate by contacting a part of the convex refracting surface. In addition, by separating a part of the plurality of concave refracting surfaces of the first prism from a part of the plurality of convex refracting surfaces of the second prism, the incident position changing element forms a so-called beam expander. By adjusting the distance between the prism and the second prism, the incident position (distance from the optical axis) of the incident light beam to the second optical integrator can be freely changed. Therefore, when performing modified illumination or the like (for example, annular illumination or multipolar illumination), it is possible to obtain an illumination shape corresponding to a region to be irradiated on the irradiated surface, and to illuminate the irradiated surface satisfactorily. .

  The illumination optical device according to claim 4 is characterized in that the optical member has a crystal optical member formed of a crystal material.

  The illumination optical device according to claim 5 is characterized in that the crystal optical member has fluorite or crystal.

  The illumination optical device according to claim 6 is characterized in that the crystal optical member is positioned so that a crystal orientation (111) of the crystal optical member coincides with an optical axis of the illumination optical device.

  According to the illumination optical device according to any one of claims 4 to 6, the optical member has a crystal optical member, and the crystal optical member has a crystal orientation (111) of the crystal optical member and an optical axis of the illumination optical device. Therefore, when a linearly polarized light beam enters the optical member, a change in the vibration direction of the linearly polarized light and a change from the linearly polarized light to the elliptically polarized light or the circularly polarized light can be prevented. . Therefore, illumination can be performed with a light beam in an optimal polarization state corresponding to the characteristics of the irradiated surface.

  The illumination optical device according to claim 7 is characterized in that the incident position changing element is arranged in the pupil of the illumination optical device or in the vicinity of the pupil.

  The illumination optical apparatus according to claim 8 is characterized in that the first optical integrator forms a light intensity distribution of a predetermined shape in the pupil or in the vicinity of the pupil based on a light beam from the light source unit.

  According to the illumination optical apparatus according to claim 7 and claim 8, the incident position changing element is disposed in the pupil of the illumination optical apparatus or in the vicinity of the pupil, and the first optical integrator performs illumination based on the light flux from the light source unit. A light intensity distribution having a predetermined shape is formed in or near the pupil of the optical device. In other words, the incident position changing element is disposed at a place where the energy density of the light beam emitted from the light source unit is high, but the optical performance is also obtained when the incident position changing element is used at a place where the energy density of the light beam is high. Therefore, the internal structure of the incident position changing element can be prevented from being damaged, and the deterioration of the light transmittance of the incident position changing element can be suppressed. Accordingly, since the light beam emitted from the light source unit passes through the incident position changing element while maintaining the optical performance of the incident position changing element, it is possible to suppress a decrease in the amount of light of the light beam and to illuminate the irradiated surface satisfactorily. be able to.

  The exposure apparatus according to claim 9 is an illumination optical apparatus according to any one of claims 1 to 8, which illuminates the mask in an exposure apparatus that transfers a mask pattern onto a photosensitive substrate. An apparatus and a projection optical system for forming an image of the pattern of the mask on the photosensitive substrate are provided.

  According to the exposure apparatus of the ninth aspect, since the illumination optical apparatus according to any one of the first to eighth aspects is provided, a decrease in the amount of illumination light can be suppressed, and Illumination can be performed with illumination light in an optimal polarization state corresponding to the characteristics of the pattern. Therefore, good exposure can be performed.

  An exposure method according to a tenth aspect is the exposure method for transferring a predetermined pattern onto a photosensitive substrate, wherein the predetermined optical pattern is obtained using the illumination optical device according to any one of the first to eighth aspects. An illumination process for illuminating a mask on which a pattern is formed, and a transfer process for transferring the predetermined pattern onto the photosensitive substrate.

  According to the exposure method of the tenth aspect, since the illumination of the mask is performed using the illumination optical apparatus according to any one of the first to eighth aspects, a decrease in the amount of illumination light can be suppressed. It is possible to illuminate with illumination light having an optimum polarization state corresponding to the characteristics of the mask pattern. Therefore, good exposure can be performed.

  According to the illumination optical device of the present invention, the incident position changing element constituted by the optical member capable of maintaining the optical performance even when used in a place where the energy density of the light beam emitted from the light source unit is high. Therefore, it is possible to prevent damage to the internal structure of the incident position changing element arranged where the energy density of the light beam emitted from the light source unit is high, and to reduce the light transmittance of the incident position changing element. Can be suppressed. Accordingly, since the light beam emitted from the light source unit passes through the incident position changing element while maintaining the optical performance of the incident position changing element, it is possible to suppress a decrease in the amount of light of the light beam and to illuminate the irradiated surface satisfactorily. be able to.

  Further, since the optical member has a crystal optical member, and the crystal optical member is positioned so that the crystal orientation (111) of the crystal optical member coincides with the optical axis of the illumination optical device, When the light beam enters the optical member, it is possible to prevent a change in the vibration direction of the linearly polarized light and a change from the linearly polarized light to the elliptically polarized light or the circularly polarized light. Therefore, illumination can be performed with a light beam in an optimal polarization state corresponding to the characteristics of the irradiated surface.

  In addition, according to the exposure apparatus of the present invention, since the illumination optical apparatus of the present invention is provided, a decrease in the amount of illumination light can be suppressed, and illumination light in an optimal polarization state corresponding to the mask pattern characteristics It can be illuminated with. Therefore, good exposure can be performed.

  In addition, according to the exposure method of the present invention, since the illumination optical device of the present invention is used to illuminate the mask, a decrease in the amount of illumination light can be suppressed, and the optimum polarization corresponding to the characteristics of the mask pattern It can be illuminated with state illumination light. Therefore, good exposure can be performed.

  An exposure apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to this embodiment. In the following description, the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is set in a direction orthogonal to the wafer W. The illumination optical device according to this embodiment is configured to perform annular illumination.

  As shown in FIG. 1, an exposure apparatus according to this embodiment is an ArF excimer laser that supplies light having a wavelength of about 193 nm, for example, as a laser light source (light source unit) 1 for supplying exposure light (illumination light). A light source or a KrF excimer laser light source that supplies light having a wavelength of about 248 nm is provided. The substantially parallel light beam emitted from the laser light source 1 along the Z direction has a rectangular cross section extending along the X direction, and is incident on the beam expander 2 including a pair of lenses 2a and 2b. Each lens 2a and 2b has a negative refractive power and a positive refractive power in the YZ plane of FIG. Therefore, the light beam incident on the beam expander 2 is enlarged in the YZ plane of FIG. 1 and shaped into a light beam having a predetermined rectangular cross section.

  The parallel light beam that has passed through the beam expander 2 as the shaping optical system is reflected by the bending mirror 3 and deflected in the Y direction, and then the crystal optical axis is rotatable about the optical axis AX and inserted from the optical axis AX. The light enters the quarter-wave plate 11 configured to be removable. Here, when the elliptically polarized light is incident, the quarter wavelength plate 11 sets the crystal optical axis of the quarter wavelength plate 11 according to the characteristics of the incident elliptically polarized light, thereby It has a function of converting incident light into linearly polarized light.

  That is, when a KrF excimer laser light source or an ArF excimer laser light source is used as the laser light source 1, the laser light source 1 emits substantially linearly polarized light. Usually, in the optical path between the laser light source 1 and the quarter-wave plate 11, a plurality of right-angle prisms (not shown) are arranged as back reflectors. In general, when linearly polarized light incident on a right-angle prism as a back surface reflecting mirror does not coincide with P-polarized light or S-polarized light with respect to the incident surface of the right-angle prism, the linearly polarized light becomes elliptical due to total reflection at the right-angle prism. Change to polarized light. Therefore, for example, even when incident light changes from linearly polarized light to elliptically polarized light through a right-angle prism, the crystal optical axis of the quarter wavelength plate 11 depends on the characteristics of the elliptically polarized light incident on the quarter wavelength plate 11. Is set, the incident light can be changed from elliptically polarized light to linearly polarized light.

  The light beam that has passed through the quarter-wave plate 11 passes through the half-wave plate 10 and the depolarizer (non-polarizing element) 20. FIG. 2 is a diagram showing a schematic configuration of the half-wave plate 10 and the depolarizer 20. As shown in FIG. 2, the half-wave plate 10 is configured such that the crystal optical axis is rotatable about the optical axis AX. The depolarizer 20 includes a wedge-shaped quartz prism 20a and a wedge-shaped quartz prism 20b having a shape complementary to the quartz prism 20a. The quartz prism 20a and the quartz prism 20b are configured to be detachable with respect to the illumination optical path as an integral prism assembly.

  When the crystal optical axis of the half-wave plate 10 is set to make an angle of 0 degree or 90 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the linearly polarized light incident on the half-wave plate 10 Passes through without changing the plane of polarization. In addition, when the crystal optical axis of the half-wave plate 10 is set to form an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the linearly polarized light incident on the half-wave plate 10 is It is converted into linearly polarized light whose polarization plane has changed by 90 degrees. Further, when the crystal optical axis of the quartz prism 20a is set to make an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the linearly polarized light incident on the quartz prism 20a is light in an unpolarized state. Converted to non-polarized light.

  In this embodiment, when the depolarizer 20 is positioned in the illumination optical path, the crystal optical axis of the crystal prism 20a is configured to form an angle of 45 degrees with respect to the polarization plane of linearly polarized light that is incident. . Incidentally, when the crystal optical axis of the crystal prism 20a is set to make an angle of 0 degrees or 90 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the plane of polarization of the linearly polarized light incident on the crystal prism 20a has a polarization plane. Pass through without change. Further, when the crystal optical axis of the half-wave plate 10 is set to make an angle of 22.5 degrees with respect to the plane of polarization of the linearly polarized light that is incident, The light is converted into non-polarized light including a linearly polarized light component that passes through without changing its polarization plane and a linearly polarized light component whose polarization plane changes by 90 degrees.

  In this embodiment, as described above, linearly polarized light is incident on the half-wave plate 10. When the depolarizer 20 is positioned in the illumination optical path, if the crystal optical axis of the half-wave plate 10 is set to make an angle of 0 degrees or 90 degrees with respect to the plane of polarization of the linearly polarized light that is incident, 1/2 The linearly polarized light incident on the wave plate 10 passes through the polarization plane without change and enters the quartz prism 20a. Since the crystal optical axis of the crystal prism 20a is set to make an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light that is incident, the linearly polarized light incident on the crystal prism 20a is converted into light that is not polarized. Is done.

  On the other hand, if the crystal optical axis of the half-wave plate 10 is set to make an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the light of the linearly polarized light incident on the half-wave plate 10 is polarized. Becomes linearly polarized light that changes by 90 degrees and enters the crystal prism 20a. Since the crystal optical axis of the quartz prism 20a is set to make an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light that is incident, the linearly polarized light incident on the quartz prism 20a is converted into unpolarized light. Converted. The light depolarized through the quartz prism 20a passes through the quartz prism 20b as a compensator for compensating the traveling direction of the light.

  On the other hand, when the depolarizer 20 is retracted from the illumination optical path, the crystal optical axis of the half-wave plate 10 is set to make an angle of 0 degree or 90 degrees with respect to the polarization plane of the linearly polarized light that is incident. The linearly polarized light incident on the half-wave plate 10 passes through without changing the plane of polarization. On the other hand, if the crystal optical axis of the half-wave plate 10 is set to make an angle of 45 degrees with respect to the plane of polarization of the linearly polarized light incident thereon, the light of the linearly polarized light incident on the half-wave plate 10 is polarized. Becomes linearly polarized light which is changed by 90 degrees.

  As described above, in this embodiment, the depolarizer 20 can be converted into non-polarized light by being inserted and positioned in the illumination optical path. Further, the depolarizer 20 is retracted from the illumination optical path, and the crystal optical axis of the half-wave plate 10 is set so as to form an angle of 0 degree or 90 degrees with respect to the polarization plane of the linearly polarized light. Light travels without changing the linear polarization state. Further, the polarization plane is changed by 90 degrees by retracting the depolarizer 20 from the illumination optical path and setting it to 45 degrees with respect to the polarization plane of the linearly polarized light on which the crystal optical axis of the half-wave plate 10 is incident. Can be converted into light in a linearly polarized state.

  The light beam that has passed through the depolarizer 20 enters the diffractive optical element (first optical integrator) 4a. In general, a diffractive optical element (DOE) is formed by forming a step having a pitch of about the wavelength of exposure light (illumination light) on a glass substrate, and has a function of diffracting an incident beam to a desired angle. Specifically, the diffractive optical element 4a has a function of forming an annular light intensity distribution in the far field (or Fraunhofer diffraction region) when a parallel light beam having a rectangular cross section is incident. Therefore, the light beam that has passed through the diffractive optical element 4a forms an annular light intensity distribution, that is, a light beam having an annular cross section at or near the pupil of an afocal lens 85 (and thus an illumination optical device) described later. . The diffractive optical element 4a is configured to be retractable from the illumination optical path.

  The light beam that has passed through the diffractive optical element 4 a enters an afocal lens (relay optical system) 85. The afocal lens 85 is set so that the front focal position of the afocal lens 85 and the position of the diffractive optical element 4a substantially coincide with each other, and the rear focal position thereof substantially coincides with the position of the predetermined surface 86 indicated by a broken line in the drawing. System (non-focal optical system). Accordingly, the substantially parallel light beam incident on the diffractive optical element 4 a is emitted from the afocal lens 85 as a substantially parallel light beam after forming an annular light intensity distribution on the pupil plane of the afocal lens 85.

  In the optical path between the front lens group 85a and the rear lens group 85b of the afocal lens 85, a conical axicon system 87, a first cylindrical lens pair 88, and a second lens are arranged in order from the light source side at or near the pupil. A cylindrical lens pair 89 is disposed. The light beam that has been converted into linearly polarized light or non-polarized light through the half-wave plate 10 and the depolarizer 20 passes through the front lens group 85a of the afocal lens 85 and enters the conical axicon system (incident incident). It enters the position change element 87.

  FIG. 3 is a diagram showing a schematic configuration of the conical axicon system 87 arranged in the vicinity of the pupil of the illumination optical apparatus or in the vicinity of the pupil. The conical axicon system 87 is arranged in order from the light source side to the first prism 87a having a concave conical refractive surface (concave refractive surface) with respect to the optical axis AX direction and the concave conical refractive surface of the first prism 87a. A second prism 87b having a convex conical refracting surface (convex refracting surface) formed so as to be in contact with each other is provided. The first prism 87a is disposed with the plane facing the light source side and the concave conical refracting surface facing the mask M, and the second prism 87b faces the convex conical refracting surface toward the optical axis and the mask M. It is arranged with a flat side.

  The first prism 87a and the second prism 87b are formed of fluorite as a crystal optical member formed of a crystal material. FIG. 4 is a diagram for explaining the crystal orientation of the conical axicon system 87. As shown in FIG. 4, the conical axicon system 87 is positioned so that the crystal orientation (111) of the fluorite forming the conical axicon system 87 and the optical axis AX coincide with each other, and the crystal orientation (100), crystal The orientation (010) and the crystal orientation (001) are positioned at predetermined positions (indicated by arrows in the figure).

FIG. 5 is a diagram for explaining the crystal orientation of fluorite. As shown in FIG. 5, the crystal orientation of fluorite is defined on the basis of cubic crystal axes a ₁ a ₂ a ₃ (indicated by thin line arrows in the figure). That is, the crystal orientation (100) is defined along the crystal axis + a ₁ , the crystal orientation (010) is defined along the crystal axis + a ₂ , and the crystal orientation (001) is defined along the crystal axis + a ₃ (thick arrows in the figure). ). _Further, a 1 _{a 3} crystal orientation in the plane (100) and crystal orientation ₍₁₀₁₎ in the direction forming an 45 degree crystal orientation _(001), crystal orientation in a 1 _{a 2} a plane (100) and the crystal orientation and (010) The crystal orientation (110) is defined in the direction forming 45 degrees, and the crystal orientation (010) and the crystal orientation (001) are defined in the direction forming 45 degrees in the a ₂ a ₃ plane (broken line in the figure). Indicated by an arrow). Furthermore, the crystal orientation (111) is defined in the + direction of the crystal axes a ₁ a ₂ a _{3 and} the direction that forms the same angle as the crystal orientation (100), the crystal orientation (010), and the crystal orientation (001) ( (Indicated by bold arrows in the figure). The conical axicon system 87 is positioned so that the crystal orientation (111) of the fluorite forming the conical axicon system 87 coincides with the optical axis AX.

  Further, at least one of the first prism 87a and the second prism 87b is configured to be movable along the optical axis AX, and the concave conical refracting surface of the first prism 87a and the convex conical shape of the second prism 87b. The distance from the refracting surface is variable. Here, in a state where the concave conical refracting surface of the first prism 87a and the convex conical refracting surface of the second prism 87b are in contact with each other, the conical axicon system 87 functions as a parallel plate. There is no effect on the secondary light source in the annular zone. However, when the concave conical refracting surface of the first prism 87a and the convex conical refracting surface of the second prism 87b are separated from each other, the conical axicon system 87 functions as a so-called beam expander. Therefore, the incident angle of the incident light beam on the predetermined surface 86 indicated by a broken line in FIG. 1 changes with the change in the interval of the conical axicon system 87.

  FIG. 6 is a diagram for explaining the action of the conical axicon system 87 on the secondary light source formed in the annular illumination. The smallest ring-shaped secondary light source 130a formed in a state where the distance between the conical axicon systems 87 is 0 and the focal length of a zoom lens 90 described later is set to a minimum value (hereinafter referred to as “standard state”) By increasing the interval of the conical axicon system 87 from 0 to a predetermined value, the width (1/2 of the difference between the outer diameter and the inner diameter: indicated by an arrow in the figure) does not change, and the outer diameter and the inner diameter are changed. Are changed to an annular secondary light source 130b. That is, due to the action of the conical axicon system 87, the width of the annular light source does not change, and the annular ratio (inner diameter / outer diameter) and size (outer diameter) both change.

  FIG. 7 is a diagram showing a schematic configuration of the first cylindrical lens pair 88 and the second cylindrical lens pair 89 arranged in the optical path between the front lens group 85a and the rear lens group 85b of the afocal lens 85. . As shown in FIG. 7, the first cylindrical lens pair 88 is, in order from the light source side, for example, the same as YZ in the same manner as the first cylindrical negative lens 88a having negative refractive power in the YZ plane and no refractive power in the XY plane. The first cylindrical positive lens 88b has a positive refractive power in the plane and has no refractive power in the XY plane. On the other hand, the second cylindrical lens pair 89 is, in order from the light source side, for example, a second cylindrical negative lens 89a having negative refractive power in the XY plane and having no refractive power in the YZ plane, and also positively refracting in the XY plane. The second cylindrical positive lens 89b has a power and has no refractive power in the YZ plane.

  The first cylindrical negative lens 88a and the first cylindrical positive lens 88b are configured to rotate integrally around the optical axis AX. Similarly, the second cylindrical negative lens 89a and the second cylindrical positive lens 89b are configured to rotate integrally around the optical axis AX. The first cylindrical lens pair 88 functions as a beam expander having power in the Z direction, and the second cylindrical lens pair 89 functions as a beam expander having power in the X direction. In this embodiment, the powers of the first cylindrical lens pair 88 and the second cylindrical lens pair 89 are set to be the same. Therefore, the light beam that has passed through the first cylindrical lens pair 88 and the second cylindrical lens pair 89 is subjected to an expansion action with the same power in the Z direction and the X direction.

  The light beam that has passed through the afocal lens 85 is incident on the microlens array 8 as the second optical integrator through the zoom lens 90 for varying the σ value. The position of the predetermined surface 86 is disposed at or near the front focal position of the zoom lens 90, and the incident surface of the microlens array 8 is disposed at or near the rear focal plane of the zoom lens 90. That is, in the zoom lens 90, the predetermined surface 86 and the incident surface of the microlens array 8 are arranged in a substantially Fourier relationship, and the pupil surface of the afocal lens 85 and the incident surface of the microlens array 8 are optically arranged. In general, they are arranged in a substantially conjugate manner. Accordingly, on the incident surface of the microlens array 8, for example, a ring-shaped illumination field centered on the optical axis AX is formed in the same manner as the pupil surface of the afocal lens 85. The overall shape of the annular illumination field changes in a similar manner depending on the focal length of the zoom lens 90.

  FIG. 8 is a diagram for explaining the action of the zoom lens 90 on the secondary light source formed in the annular illumination. An annular secondary light source 130a formed in a standard state is an annular secondary light source whose overall shape is enlarged in a similar manner by increasing the focal length of the zoom lens 90 from a minimum value to a predetermined value. It changes to 130c. That is, due to the action of the zoom lens 90, both the width and size (outer diameter) change without changing the annular ratio of the annular secondary light source.

  The light beam that has passed through the zoom lens 90 enters the microlens array 8. Here, since the zoom lens 90 has a function of converting an angle change on the predetermined surface 86 into a position change (distance change from the optical axis) on the incident surface of the microlens array 8, the zoom lens 90 functions as an incident position changing element. As the interval of the conical axicon system 87 changes, the incident position (distance from the optical axis) of the incident light beam on the microlens array 8 changes.

  The microlens array 8 is an optical element made up of a large number of microlenses having positive refracting power that are arranged vertically and horizontally and densely. Each microlens constituting the microlens array 8 has a rectangular cross section similar to the shape of the illumination field to be formed on the mask M (and thus the shape of the exposure region to be formed on the wafer W). The light beam incident on the microlens array 8 is two-dimensionally divided by a large number of microlenses, and is substantially the same as the illumination field formed by the light beam incident on the microlens array 8 on the rear focal plane (and thus the illumination pupil). A secondary light source having a light intensity distribution, that is, a secondary light source composed of a substantial surface light source having an annular shape centering on the optical axis AX is formed. The luminous flux from the annular secondary light source formed on the rear focal plane of the microlens array 8 illuminates the mask blind MB in a superimposed manner via the condenser lens 9a.

  In the mask blind MB as an illumination field stop, a rectangular illumination field corresponding to the shape and focal length of each microlens constituting the microlens array 8 is formed. The light beam that has passed through the rectangular opening (light transmission part) of the mask blind MB is subjected to the light condensing action of the imaging optical system 9b, and is then superimposed on the mask (irradiated surface) M on which a predetermined pattern is formed. Illuminate. That is, the imaging optical system 9b forms an image of the rectangular opening of the mask blind MB on the mask M. The light beam that has passed through the pattern of the mask M forms a pattern image of the mask M on the wafer W, which is a photosensitive substrate, via the projection optical system PL. In this way, the pattern of the mask M is formed in each exposure region of the wafer W by performing batch exposure or scan exposure while two-dimensionally driving and controlling the wafer W in a plane orthogonal to the optical axis AX of the projection optical system PL. Sequential exposure is performed.

  According to the exposure apparatus of the first embodiment, the conical axicon system 87 as the incident position changing element according to this embodiment is used where the energy density of illumination light emitted from the laser light source 1 is high. Since the crystal optical member formed of the crystal material that can maintain the optical performance even in the case of being formed is made of fluorite, the cone axicon system 87 arranged at a place where the energy density of the illumination light becomes high Damage to the internal structure can be prevented, and deterioration of the light transmittance of the conical axicon system 87 can be suppressed. Accordingly, since the illumination light passes through the conical axicon system 87 while maintaining the optical performance of the conical axicon system 87, a decrease in the amount of illumination light can be suppressed, and the mask M can be illuminated well.

  Further, since the conical axicon system 87 is positioned so that the crystal orientation (111) of the fluorite forming the conical axicon system 87 and the optical axis AX coincide with each other, illumination light in a linearly polarized state enters the conical axicon system 87. When incident, it is possible to prevent a change in the vibration direction of linearly polarized light and a change from linearly polarized light to elliptically polarized light or circularly polarized light. Therefore, illumination can be performed with illumination light having an optimum polarization state corresponding to the characteristics of the pattern image of the mask M.

  Next, a second embodiment of the present invention will be described with reference to the drawings. The configuration of the exposure apparatus according to the second embodiment is such that the conical axicon system 87 of the exposure apparatus according to the first embodiment is changed to the Fresnel axicon system 100 as the incident position changing element shown in FIG. It is. Therefore, in the description of the second embodiment, a detailed description of the same configuration as that of the exposure apparatus according to the first embodiment is omitted, and the same as the exposure apparatus according to the first embodiment. The configuration will be described using the same reference numerals.

  The Fresnel axicon system 100 according to the second embodiment is arranged at or near the pupil of the illumination optical apparatus. FIG. 9 is a cross-sectional view for explaining a schematic configuration of the Fresnel axicon system 100. As shown in FIG. 9, the Fresnel axicon system 100 includes a plurality of (three in this embodiment) concave conical refracting surfaces (concave refracting surfaces) in the optical axis AX direction in order from the light source side. The first prism 100a having a part and a plurality of (three in this embodiment) convexes formed so as to be able to contact each other with a part of the concave conical refracting surface of the first prism 100a. A second prism 100b having a part of a conical refracting surface (convex refracting surface) is provided. The first prism 100a is arranged with the plane facing the light source side and a part of the three concave conical refracting surfaces facing the mask M, and the second prism 100b has three convex conical shapes on the optical axis side. A part of the refracting surface is directed and the flat surface is arranged on the mask M side.

  The first prism 100a has three concave conical refracting surface portions 101a, 101b, and 101c. Part of the concave conical refracting surface 101a, 101b, 101c of the first prism 100a is a concave conical shape of the prism 100'a having the concave conical refracting surface shown in the sectional view of FIG. 10 and the front view of FIG. These refractive surfaces are sectioned and arranged in a plane as shown by broken lines in FIGS. That is, it has the same refracting surface as the regions 101'a, 101'b, 101'c of the refracting surface of the prism 100'a. Therefore, the light beam that enters the first prism 100a and passes through the portions 101a, 101b, and 101c of the concave conical refracting surface of the first prism 100a is incident on the prism 100′a and is an area of the refracting surface of the prism 100′a. The light beam is refracted in the same manner as the light beam passing through 101'a, 101'b, and 101'c. That is, the first prism 100a has the same function as the prism 100′a.

  The second prism 100b has three convex conical refracting surface portions 102a, 102b, and 102c. Part 102a, 102b, 102c of the convex conical refracting surface of the second prism 100b is the convex conical shape of the prism 100'b having the convex conical refracting surface shown in the sectional view of FIG. 12 and the front view of FIG. The refracting surfaces are divided and planarly arranged as shown by broken lines in FIGS. That is, it has the same refracting surface as the regions 102'a, 102'b, 102'c of the refracting surface of the prism 100'b. Accordingly, the light beam that enters the second prism 100b and passes through the portions 102a, 102b, and 102c of the convex conical refracting surface of the second prism 100b is incident on the prism 100′b and the region of the refracting surface of the prism 100′b. The light beam is refracted in the same manner as the light beam passing through 102'a, 102'b, and 102'c. That is, the second prism 100b has the same function as the prism 100′b.

  The first prism 100a and the second prism 100b are formed of fluorite as a crystal optical member formed of a crystal material. Similar to the conical axicon system 87 according to the first embodiment shown in FIG. 4, the Fresnel axicon system 100 matches the crystal orientation (111) of the fluorite forming the Fresnel axicon system 100 with the optical axis AX. The crystal orientation (100), crystal orientation (010), and crystal orientation (001) are positioned at predetermined positions.

  Further, at least one of the first prism 100a and the second prism 100b is configured to be movable along the optical axis AX, and the three concave conical refracting surfaces 101a to 101c of the first prism 100a are provided. The interval between the three convex conical refracting surfaces 102a to 102c of the second prism 100b is variably configured. Here, the three concave conical refracting surface portions 101a to 101c of the first prism 100a and the three convex conical refracting surface portions 102a to 102c of the second prism 100b are in contact with each other. Then, the Fresnel axicon system 100 functions as a plane parallel plate, and has no influence on the annular secondary light source formed.

  However, if the portions 101a to 101c of the three concave conical refracting surfaces of the first prism 100a and the portions 102a to 102c of the three convex conical refracting surfaces of the second prism 100b are separated, the Fresnel axicon The system 100 functions as a so-called beam expander. Accordingly, with the change in the interval of the Fresnel axicon system 100, the incident angle on the predetermined surface 86 indicated by the broken line in FIG. 1 changes, and the zoom lens 90 changes the angle change on the predetermined surface 86 to the incident on the microlens array 8. Since it has a function of converting into a position change on the surface (distance change from the optical axis), the incident position (distance from the optical axis) of the incident light beam to the microlens array 8 as the second optical integrator changes. To do. Therefore, like the operation of the conical axicon system 87 according to the first embodiment shown in FIG. 6, the operation of the Fresnel axicon system 100 does not change the width of the annular secondary light source, Both the ratio (inner diameter / outer diameter) and size (outer diameter) change.

  According to the exposure apparatus according to the second embodiment, the energy density of illumination light emitted from the laser light source 1 by the Fresnel axicon system 100 as the incident position changing element according to this embodiment is increased. Since it is composed of fluorite that can maintain optical performance even when it is used, it prevents damage to the internal structure of the Fresnel axicon system 100 disposed where the energy density of illumination light is high. And deterioration of the light transmittance of the Fresnel axicon system 100 can be suppressed. Accordingly, since the illumination light passes through the Fresnel axicon system 100 while maintaining the optical performance of the Fresnel axicon system 100, a decrease in the amount of illumination light can be suppressed, and the mask M can be illuminated well. .

  Further, since the Fresnel axicon system 100 is positioned so that the crystal orientation (111) of the fluorite forming the Fresnel axicon system 100 and the optical axis AX coincide with each other, the illumination light in the linear polarization state is When entering the system 100, it is possible to prevent a change in the vibration direction of the linearly polarized light and a change from the linearly polarized light to the elliptically polarized light or the circularly polarized light. Therefore, illumination can be performed with illumination light having an optimum polarization state corresponding to the characteristics of the pattern image of the mask M.

  In addition, since the first prism 100a included in the Fresnel axicon system 100 has the three concave conical refracting surface portions 101a to 101c arranged in a plane, the prism 100'a having a concave conical refracting surface. As compared with the first prism 100a, the thickness of the first prism 100a can be reduced. Similarly, since the second prism 100b included in the Fresnel axicon system 100 includes the three convex conical refracting surface portions 102a to 102c arranged in a plane, the prism having the convex conical refracting surface. Compared with 100′b, the thickness of the second prism 100b can be reduced. Therefore, the arrangement space of the Fresnel axicon system 100 including the first prism 100a and the second prism 100b having a small thickness can be reduced.

  The first prism 100a according to the second embodiment has three concave conical refracting surface portions 101a to 101c, and the second prism 100b is part of three convex conical refracting surfaces. 102a to 102c, but the first prism has a part of two or more concave conical refracting surfaces, and the second prism has two, four or more convex conical refractions. You may make it have a part of surface.

  In the first and second embodiments described above, the optical member formed of fluorite is used as the crystal optical member formed of the crystal material as the angle changing element, but is formed of the crystal material. An optical member having fluorite as a crystal optical member, an optical member formed of crystal as a crystal optical member formed of a crystal material, or an optical member having crystal as a crystal optical member formed of a crystal material good.

  In the first and second embodiments described above, the half-wave plate 10 as a phase member for changing the polarization plane of incident linearly polarized light as necessary is disposed on the light source side. A depolarizer 20 for depolarizing incident linearly polarized light as necessary is disposed on the mask side. However, the present invention is not limited to this, and the same optical effect can be obtained even if the depolarizer 20 is arranged on the light source side and the half-wave plate 10 is arranged on the mask side.

  In the first and second embodiments described above, the quartz prism 20b is used as a compensator for compensating the traveling direction of light through the quartz prism 20a. However, the present invention is not limited to this, and a wedge-shaped prism formed of an optical material having high durability against KrF excimer laser light or ArF excimer laser light, such as quartz or fluorite, is used as a compensator. You can also

  In the first and second embodiments described above, a diffractive optical element is used as the first optical integrator, but a fly-eye lens may be used as the first optical integrator. In this case, at the pupil position of the illumination optical device located at or near the position where the conical axicon system or the Fresnel axicon system is arranged, the fly-eye lens has a large number of lens surfaces provided on the incident side of the fly-eye lens. A light intensity distribution having a shape similar to a contour shape (for example, a hexagonal shape or a rectangular shape) is formed.

  In the exposure apparatus according to each of the above-described embodiments, the light shielding member for shielding the 0th-order light from the diffractive optical element (DOE) 4a is used in the vicinity of the pupil position of the illumination optical system, for example, as a second optical integrator. The micro lens array 8 may be disposed on the incident surface side or the exit surface side. Such 0th-order light shielding members are disclosed in, for example, Japanese Patent Laid-Open Nos. 4-225359, 2001-176766, and 2001-284240. At this time, in the 0th-order light shielding member disclosed in Japanese Patent Laid-Open No. 2001-284240, four strings for holding the 0th-order light shielding member are provided so as to be orthogonal to each other, but with respect to the projection optical system PL. When applied to a scanning projection exposure apparatus that performs exposure while relatively moving the mask M and the wafer W, this string may adversely affect illumination unevenness on the irradiated surface. At this time, out of the four strings for holding the 0th-order light shielding member, two strings along the direction corresponding to the scanning direction are removed, and the 0th-order light is emitted only with the strings in the direction corresponding to the non-scanning direction. It is preferable to hold the light shielding member. Alternatively, the strings may be three extending in the direction corresponding to the non-scanning direction (at this time, the angle formed by each string is 120 degrees). Further, for example, as disclosed in Japanese Patent Laid-Open No. 2001-176766, a technique in which a string is not provided by patterning a light shielding member on a light transmissive substrate may be employed.

  In the exposure apparatuses according to the first and second embodiments described above, the mask (reticle) M is illuminated by the illumination optical apparatus (illumination process), and the transfer is formed on the mask M using the projection optical system PL. By transferring the pattern onto the photosensitive substrate (wafer) W (transfer process), a microdevice (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. Hereinafter, an example of a technique for obtaining a semiconductor device as a microdevice by forming a predetermined circuit pattern on a wafer W as a photosensitive substrate using the exposure apparatus according to the first or second embodiment. This will be described with reference to the flowchart of FIG.

  First, in step S301 in FIG. 14, a metal film is deposited on one lot of wafers W. In the next step S302, a photoresist is applied on the metal film on the wafer W of the l lot. Thereafter, in step S303, using the exposure apparatus according to the first or second embodiment, an image of the pattern on the mask M is shot on each wafer W of the lot through the projection optical system PL. The area is sequentially exposed and transferred. After that, in step S304, the photoresist on the one lot of wafers W is developed, and in step S305, etching is performed on the one lot of wafers W using the resist pattern as a mask M. A circuit pattern corresponding to the upper pattern is formed in each shot area on each wafer W.

  Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, since the illumination optical device according to the first or second embodiment is used, a decrease in the amount of illumination light can be suppressed, and the optimum corresponding to the characteristics of the circuit pattern It is possible to illuminate with illumination light (exposure light) in a polarized state. Therefore, a semiconductor device having an extremely fine circuit pattern can be obtained with high accuracy. In steps S301 to S305, a metal is deposited on the wafer W, a resist is applied onto the metal film, and exposure, development, and etching processes are performed. Prior to these processes, the wafer is processed. It goes without saying that after a silicon oxide film is formed on W, a resist is applied onto the silicon oxide film, and each step such as exposure, development, and etching may be performed.

  In the exposure apparatus according to the first and second embodiments, a liquid crystal display element as a micro device is obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). You can also Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 15, in the pattern formation step S401, the pattern of the mask M is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus according to the first or second embodiment. An optical lithography process is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming process S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembling step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S401 and the color filter obtained in the color filter forming step S402. ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since the illumination optical device according to the first or second embodiment is used, a decrease in the amount of illumination light can be suppressed, and the characteristics of the circuit pattern can be accommodated. The illumination light (exposure light) having the optimum polarization state can be illuminated. Therefore, a semiconductor device having an extremely fine circuit pattern can be obtained with high accuracy.

It is a figure which shows schematic structure of the exposure apparatus concerning 1st Embodiment. It is a figure which shows schematic structure of the 1/2 wavelength plate and depolarizer with which the illumination optical apparatus concerning 1st Embodiment is provided. It is a figure which shows schematic structure of the cone axicon system with which the illumination optical apparatus concerning 1st Embodiment is provided. It is a figure for demonstrating the crystal orientation of the fluorite which forms the cone axicon system concerning 1st Embodiment. It is a figure for demonstrating the crystal orientation of a fluorite. It is a figure for demonstrating the effect | action of the cone axicon system with respect to the secondary light source formed in the annular illumination concerning 1st Embodiment. It is a figure which shows schematic structure of the 1st cylindrical lens pair with which the illumination optical apparatus concerning 1st Embodiment is equipped, and a 2nd cylindrical lens pair. It is a figure for demonstrating the effect | action of the zoom lens with respect to the secondary light source formed in the annular illumination concerning 1st Embodiment. It is sectional drawing of the Fresnel axicon system concerning 2nd Embodiment. It is sectional drawing for demonstrating the structure of the 1st prism with which the Fresnel axicon system concerning 2nd Embodiment is provided. It is a front view for demonstrating the structure of the 1st prism with which the Fresnel axicon system concerning 2nd Embodiment is provided. It is sectional drawing for demonstrating the structure of the 2nd prism with which the Fresnel axicon system concerning 2nd Embodiment is provided. It is a front view for demonstrating the structure of the 2nd prism with which the Fresnel axicon system concerning 2nd Embodiment is provided. It is a flowchart which shows the method of manufacturing the semiconductor device as a microdevice concerning embodiment of this invention. It is a flowchart which shows the method of manufacturing the liquid crystal display element as a microdevice concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Laser light source, 2 ... Beam expander, 3 ... Bending mirror, 4a ... Diffractive optical element, 8 ... Micro lens array, 9a ... Condenser lens, 9b ... Imaging optical system, 10 ... 1/2 wavelength plate, 11 ... 1 / 4 wavelength plate, 20 ... depolarizer, 85 ... afocal lens, 87 ... conical axicon system, 87a ... first prism, 87b ... second prism, 88 ... first cylindrical lens pair, 89 ... second cylindrical lens pair, 90 ... zoom lens, 100 ... Fresnel axicon system, 100a ... first prism, 100b ... second prism, MB ... mask blind, M ... mask, PL ... projection optical system, W ... wafer.

Claims (10)

In the illumination optical device that illuminates the irradiated surface with the light beam from the light source unit,
A first optical integrator disposed in an optical path between the light source unit and the irradiated surface;
A second optical integrator disposed in an optical path between the first optical integrator and the irradiated surface;
An incident position changing element that is arranged in an optical path between the first optical integrator and the second optical integrator and changes an incident position of an incident light beam to the second optical integrator;
With
The incident position changing element is composed of an optical member capable of maintaining the optical performance of the incident position changing element even when used in a place where the energy density of the light beam emitted from the light source unit is high. An illumination optical device. The incident position changing element is
A first prism having a concave refractive surface with respect to the optical axis direction of the illumination optical device;
A second prism having a convex refracting surface formed complementary to the concave refracting surface of the first prism;
With
2. The illumination optical apparatus according to claim 1, wherein at least one of the first prism and the second prism is configured to be movable along an optical axis of the illumination optical apparatus. The incident position changing element is
A first prism having a part of a concave refractive surface with respect to the optical axis direction of the illumination optical device;
A second prism having a part of a convex refractive surface with respect to the optical axis direction of the illumination optical device;
With
At least one of the first prism and the second prism is configured to be movable along the optical axis direction of the illumination optical device,
The first prism has a part of the plurality of concave refractive surfaces,
The illumination optical device according to claim 1, wherein the second prism has a part of the plurality of convex refractive surfaces.   The illumination optical device according to any one of claims 1 to 3, wherein the optical member includes a crystal optical member formed of a crystal material.   The illumination optical apparatus according to claim 4, wherein the crystal optical member includes fluorite or crystal.   6. The illumination optical device according to claim 4, wherein the crystal optical member is positioned so that a crystal orientation (111) of the crystal optical member coincides with an optical axis of the illumination optical device. .   The illumination optical apparatus according to any one of claims 1 to 6, wherein the incident position changing element is arranged in a pupil of the illumination optical apparatus or in the vicinity of the pupil.   The illumination optical apparatus according to claim 7, wherein the first optical integrator forms a light intensity distribution having a predetermined shape in the pupil or in the vicinity of the pupil based on a light beam from the light source unit. In an exposure apparatus that transfers a mask pattern onto a photosensitive substrate,
The illumination optical apparatus according to any one of claims 1 to 8, for illuminating the mask;
A projection optical system for forming an image of the mask pattern on the photosensitive substrate;
An exposure apparatus comprising: In an exposure method for transferring a predetermined pattern onto a photosensitive substrate,
An illumination process for illuminating a mask on which the predetermined pattern is formed using the illumination optical apparatus according to any one of claims 1 to 8.
A transfer step of transferring the predetermined pattern onto the photosensitive substrate;
An exposure method comprising:

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