JP2005150129A - Transfer apparatus and transfer system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer apparatus which can convey an article to be conveyed efficiently, and which can shorten wasteful waiting time. <P>SOLUTION: The transfer apparatus includes a plurality of storing shelves 3 each for storing a FOUP 30 temporarily, and a grasping mechanism 25 capable of holding the FOUP 30. The transfer apparatus further includes a lifting mechanism 23 and an expanding and contracting mechanism 24 for moving the grasping mechanism 25 to enable it to be positioned at an arbitrary position in the transfer region, corresponding to the storing shelves 3, and a moving mechanism 22 for moving the lifting mechanism 23 and the expanding and contracting mechanism 24 to the plurality of the storing shelves 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a transfer device and a transfer system used in a storage device that temporarily stores an object to be transported conveyed by a transport carriage.

  In production facilities that use semiconductor substrates, etc., as a final product while transporting them between processes and between processes, there is a case where irregular waiting times may occur before processing equipment performs processing. A transfer device, which is a storage means for temporarily storing a semiconductor substrate or the like as an intermediate product, is provided. Such a transfer apparatus is provided with a storage shelf for temporarily storing a semiconductor substrate in the vicinity of the processing apparatus, and the semiconductor substrate is carried into and out of the storage shelf and the processing apparatus by a dedicated transfer machine. In the transfer apparatus of Patent Document 1, a plurality of storage shelves are arranged above a semiconductor processing apparatus, and a semiconductor substrate is attached to and detached from the semiconductor processing apparatus and the storage shelf by a transporter installed on the ceiling.

JP 2003-51527 A (FIG. 2)

  However, the transfer apparatus described in Patent Document 1 is different from the transfer device of the transfer apparatus when the semiconductor substrate processed by the semiconductor processing apparatus is transferred to another semiconductor processing apparatus. Need to be transported by. Therefore, since the semiconductor substrate is transported in two stages, a wasteful waiting time occurs.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer apparatus and a transfer system that can efficiently transfer an object to be transferred and can reduce useless waiting time.

Means and effects for solving the problems

  The transfer device according to the present invention includes a plurality of storage shelf devices that temporarily store the objects to be conveyed and a holding mechanism that can hold the objects to be conveyed, and the transfer mechanism corresponding to the storage shelf device. An intra-shelf moving apparatus that moves the position to an arbitrary position in the loading area; and an inter-shelf moving apparatus that moves the intra-shelf moving apparatus to the plurality of storage shelf apparatuses.

  According to this configuration, since the intra-shelf moving device can move to a plurality of storage shelf devices, it is not necessary to newly provide a transport means for transporting the object to be transported to another storage shelf device. For this reason, in contrast with the conveyance time when the conveyance means is newly provided, the conveyance time can be shortened, and the object to be conveyed can be efficiently conveyed.

  In the present invention, the storage shelf device may include a plurality of storage shelves that are arranged in a matrix in the horizontal direction and the vertical direction and on which the object to be transported is placed.

  According to this, since the storage shelves are arranged in a matrix in the horizontal and vertical directions, the total number of storage shelves can be easily changed, and the storage capacity of the conveyed object can be adjusted.

  In this case, the storage shelf device is arranged in a vertical direction, and includes a plurality of slide shelves on which the transported objects are placed, and a slide mechanism that allows the slide shelves to slide toward the side where the holding mechanism is located. It is preferable to provide.

  According to this, the slide shelf can be protruded from other shelves by sliding the slide shelf on which the necessary object to be conveyed is placed, and the object to be conveyed placed on the slide shelf is accessed. Easy to do.

  Further, in this case, the storage shelf device includes a plurality of rotating shelves arranged in a vertical direction and on which the object to be transported is placed, and the rotating shelf has a size that allows the object to be transported to pass therethrough. It is preferable to include a notch portion and a rotation unit that allows the rotating shelf to be rotated so that the notch portion overlaps at the same position in the vertical direction.

  According to this configuration, since the notch part through which the object to be conveyed can pass is provided on the rotating shelf, the notch part of the rotating shelf above the necessary object to be conveyed is superimposed on the object to be conveyed. Thus, access from above is possible.

  The transfer system according to the present invention includes the transfer device described above and a processing device that is disposed in a transfer region of the transfer device and that processes the object to be transported.

  When the transfer system of the present invention is positioned in the vicinity of the traveling path disposed in the vicinity of the processing device, the traveling mechanism that travels in the traveling path, and the storage shelf device, the transfer device is transferred. You may provide the conveyance trolley which has the attachment or detachment mechanism which attaches or detaches the said to-be-conveyed object with respect to the relay part set in the area | region and the said processing apparatus.

  According to this configuration, since the intra-shelf moving device can move to a plurality of storage shelf devices and processing devices, the object to be conveyed can be transported to the processing device or the storage device without going through the transport carriage. Thereby, it is not necessary to convey a to-be-conveyed object in two steps, and conveyance time can be shortened. Further, since the transport carriage can attach and detach the transported object to and from the relay unit and the processing apparatus, the means for transporting the transported object can be divided according to the situation.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments according to the invention will be described with reference to the drawings.

(First embodiment)
The transfer apparatus according to the first embodiment is suitably applied to a transport system that uses a transport cart to transport a processing object between processes and between processes as a final product, like a semiconductor product manufacturing facility. Is done. As shown in FIG. 1, a plurality of semiconductor manufacturing apparatuses 5 (5a-1,... 5b-1,... 5n-1), stockers 4, and a plurality of transfer apparatuses 2 having different processing contents are provided. 15a to 15n) (a region surrounded by a dotted line constituting the semiconductor processing step). Each semiconductor manufacturing apparatus 5 and stocker 4 in each bay 15 are connected by an in-process track 12 (12a to 12n). Further, the intra-process track 12 is connected to the inter-process track 10 via the branch track 11 (11a to 11n).

  The inter-process track 10, the branch track 11, and the intra-process track 12 are travel paths on which a plurality of suspended transport carts 16 that transport semiconductors (conveyed materials) can travel. These travel paths (10, 11, 12) are installed above the factory (ceiling side), and are mounted and transported so that the semiconductor is suspended from each transport carriage 16. Here, the semiconductor is, for example, a semiconductor wafer housed in a plurality of cassettes (housing containers) called FOUP 30 (Front Opening Unified Pod) as shown in FIG. The FOUP 30 has a substantially cubic shape, and a flange 31 for gripping and transporting the FOUP 30 is disposed at the center of the upper surface thereof. The semiconductor is transported in units of cassettes and is subjected to predetermined processing in each semiconductor manufacturing apparatus 5. In the following description, a conveyed product conveyed by the conveying cart 16 is referred to as FOUP 30.

  The transport carriage 16 carries the FOUP 30 and transports it to the stocker 4, the semiconductor manufacturing apparatus 5, and the transfer apparatus 2. A plurality of transport carts 16 are provided, and can travel by moving on each travel path (10, 11, 12). The transport carriage 16 travels in each direction (10, 11, 12) in one direction (arrow in the figure) and transports the FOUP 30.

  Here, the conveyance carriage 16 will be described with reference to FIG. As shown in FIG. 2, the transport carriage 16 has an elevator body 161, a belt 162, an elevator body 163, a finger 164, and a traveling machine 165. The traveling machine 165 travels in one direction on the traveling path (10, 11, 12). An elevator body 161 is disposed below the traveling machine 165. A belt 162 is disposed on the elevator body 161. The belt 162 is wound around a reel (not shown) of the elevator body 161. An elevating body 163 is installed at the tip of the belt 162. The elevating body 163 is raised and lowered via the belt 162 by forward and reverse rotation of the reel. The belt 162 has a length that allows the elevating body 163 to be lowered until the FOUP 30 can be attached to and detached from the semiconductor manufacturing apparatus 5 or the like. A finger 164 that grips the flange 31 disposed in the FOUP 30 is provided at the tip of the elevating body 163. The finger 164 has an opening / closing function so that the flange 31 of the FOUP 30 can be clamped. When the elevating body 163 descends to the FOUP 30, the finger 164 is opened and closed to clamp the flange 31.

  Returning to FIG. 1, the stocker 4 is connected to the branch track 11 and the in-process track 12. The stocker 4 is storage means that can store a plurality of FOUPs 30. The FOUP 30 is temporarily stored until a semiconductor manufacturing apparatus 5 to be described later finishes processing and another semiconductor manufacturing apparatus 5 needs it. The stocker 4 has a carry-in port 41a for taking in the FOUP 30 and a carry-out port 41b for carrying out the FOUP 30 to the outside. The stocker 4 is arranged so that the transport carriage 16 can directly attach and detach the FOUP 30, and the carry-in port 41 a and the carry-out port 41 b are located immediately below the in-process track 12. The stocker 4 has a stacker crane (not shown). This stacker crane has the function of taking in the FOUP 30 mounted on the carry-in port 41a by the transport carriage 16 and storing it in each shelf, and the function of carrying out the FOUP 30 stored in each shelf onto the carry-out port 41b. Yes.

  The semiconductor manufacturing apparatus 5 is a processing apparatus that takes in the FOUP 30 and performs processes such as thin film formation, photolithography, and etching on the semiconductor wafer accommodated in the FOUP 30. The semiconductor manufacturing apparatus 5 is provided with a carry-in port 51a for taking in the FOUP 30 and a carry-out port 51b for carrying out the FOUP 30 to the outside. The semiconductor manufacturing apparatus 5 has a transfer mechanism (not shown). The transfer mechanism carries the FOUP 30 attached to the carry-in port 51a into the inside and carries out the FOUP 30 processed inside to the carry-out port 51b. It has a function. The semiconductor manufacturing apparatus 5 is arranged so that the carry-in port 51a and the carry-out port 51b are located immediately below the in-process track 12. Further, the transport carriage 16 can simultaneously access the carry-in port 51a and the carry-out port 51b. That is, the FOUP 30 can be carried in and out at the same time.

  The semiconductor manufacturing apparatus 5 has a different processing time depending on the processing content of each apparatus. In addition, since the stocker 4 that temporarily stores unnecessary FOUPs 30 needs to carry in / out the FOUPs 30 via a stacker crane, it takes time to carry in / out. For this reason, when the FOUP 30 that has been processed in the semiconductor manufacturing apparatus 5 is stored in the stocker 4 and then another semiconductor manufacturing apparatus 5 needs the FOUP 30, it is useless until the FOUP 30 is transported to the semiconductor manufacturing apparatus 5. There is a waiting time. Therefore, in the present embodiment, storage means for temporarily storing the FOUP 30 is provided in the vicinity of the semiconductor manufacturing apparatus 5. Therefore, as shown in FIGS. 1 and 3 to 4, the transfer device 2, the storage shelf 3, and the transfer shelf 7 are disposed across the two semiconductor manufacturing devices 5.

  The transfer device 2 will be described with reference to FIGS. 3 and 4 are enlarged views of the inside of the one-dot chain line depicted in FIG. As shown in FIGS. 3 and 4, the storage shelves 3 (3-1 to 3-8) and the transfer shelves 7 are arranged in a matrix in the vertical direction and the horizontal direction above the semiconductor manufacturing apparatus 5. ing. The storage shelf 3 is disposed so as to overlap with the carry-in / out ports 51 a and 51 b of the semiconductor manufacturing apparatus 5. The transfer shelf 7 is disposed between the semiconductor manufacturing apparatuses 5. A storage shelf 3 may be further arranged below the transfer shelf 7. Further, FIG. 1 does not show the storage shelf 3 and the transfer shelf 7.

  Both the storage shelf 3 and the transfer shelf 7 are shelves for temporarily storing the FOUP 30. Specifically, the storage shelf 3 is storage means for temporarily storing the FOUP 30 until the semiconductor manufacturing apparatus 5 requires it. The transfer shelf 7 is a transfer unit that is temporarily mounted when the FOUP 30 is transferred between the transfer device 2 and the transport carriage 16 described later. That is, the FOUP 30 transported by the transport carriage 16 is placed on the transfer shelf 7, and the transfer device 2 transports the FOUP 30 placed on the transfer shelf 7. The same applies to the reverse case. Note that the FOUP 30 can be attached to and detached from only the transfer shelf 7 in the transport carriage 16 with respect to the apparatus within the one-dot chain line in FIG.

  Inside the loop-shaped in-process track 12a, a rail mechanism 21 is installed above the factory (ceiling side) in the same manner as the other traveling paths (10, 11, 12). The rail mechanism 21 has two rails parallel to the vertical direction. As shown in FIG. 1, the rail mechanism 21 has a length that allows the two semiconductor manufacturing apparatuses 5a-1 and 5a-2 to be accommodated. The transfer mechanism 2 is attached to the rail mechanism 21 so that it can run. The transfer device 2 includes a moving mechanism 22, an elevating mechanism 23, an expansion / contraction mechanism 24, and a gripping mechanism 25.

  The moving mechanism 22 has a roller (not shown), a roller motor 221 shown in FIG. 5, and a moving position detector 222. The rollers are sandwiched between two rail mechanisms 21 arranged in the vertical direction and connected to a roller motor 221. The movement position detector 222 detects a predetermined position of the rail mechanism 21. With the forward / reverse rotation of the roller motor 221, the roller also rotates forward / reversely, and the moving mechanism 22 moves the rail mechanism 21. The roller motor 221 stops when the movement position detector 222 detects a predetermined position. Here, the predetermined position refers to a position on the rail mechanism 21 corresponding to a place where the transfer device 2 attaches / detaches the FOUP 30.

  An elevating mechanism 23 is connected to the lower part of the moving mechanism 22. The elevating mechanism 23 has an upper arm 23a and a lower arm 23b. The upper arm 23a has a larger width than the lower arm 23b, and the lower arm 23b can be accommodated in the vertical direction inside. When the upper arm 23a houses the lower arm 23b, the lower arm 23b can move in the vertical direction, and the elevating mechanism 23 can be raised and lowered. Further, the elevating mechanism 23 is such that the tip of the elevating mechanism 23 (the tip of the lower arm 23b) is within the range from the loading / unloading ports 51a, 51b of the semiconductor manufacturing apparatus 5 to the storage shelf 3 or the transfer shelf 7 positioned at the top. Have a length that is movable. Further, the lifting mechanism 23 includes a lifting motor 231 and a height position detector 232. The lower arm 23b is connected to the lift motor 231, and when the lift motor 231 is operated, the lower arm 23b moves in the vertical direction. The height position detector 232 detects the height position of the gripping mechanism 25 described later. When the gripping mechanism 25 detects a height position suitable for attaching / detaching the FOUP 30 to / from the storage shelf 3 or the like, the elevating motor 231 is stopped.

  A telescopic mechanism 24 is provided at the tip of the lower arm 23 b of the lifting mechanism 23. It has an arm (not shown) that can be expanded and contracted in the horizontal direction by the same configuration as the lifting mechanism 23. The arm can extend to an attachment / detachment position such as the storage shelf 3 to / from which the FOUP 30 is attached / detached. Further, the telescopic mechanism 24 has a horizontal motor 241 and a placement position detector 242. The arm is connected to the horizontal motor 241 and extends and contracts. The placement position detector 242 detects whether or not the gripping mechanism 25 is located at the attachment / detachment position of the FOUP 30. When it is detected that the mounting position detector 242 is positioned on the apparatus, the horizontal motor 241 is stopped.

  A fork-type gripping mechanism 25 that holds the lower surface of the flange 31 of the FOUP 30 is provided at the tip of the telescopic mechanism 24. The gripping mechanism 25 has a placement detection sensor 251. The placement detection sensor 251 detects whether or not the FOUP 30 is mounted when the gripping mechanism 25 attaches / detaches the FOUP 30 to / from the storage shelf 3 or the like. The placement detection sensor 251 transmits a detection signal to the horizontal motor 241 and the lifting motor 231 so that the operating horizontal motor 241 and lifting motor 231 are stopped.

  As shown in FIG. 5, the transfer device 2 configured as described above includes a transfer device controller 210 that controls each mechanism, and a transmission / reception unit 250 connected to the transfer device controller 210. . The transfer device controller 210 stores a calculation program for operating the flowchart of FIG. The transmission / reception unit 250 can transmit / receive a data signal to / from the system controller 8 by wireless communication. When the transfer device 2 receives a command signal from the system controller 8, the signal content included in the command signal is read. Specifically, a designated location such as the storage shelf 3 to / from which the FOUP 30 is attached / detached is recognized based on the command signal, and the operation of the transfer device 2 for attaching / detaching the FOUP 30 is determined after reaching the designated location.

  Next, the operation procedure of the transfer apparatus 2 will be described with reference to the flowchart of FIG. The transfer device 2 determines whether or not a command signal from the system controller 8 has been received (S601). If the command signal is not received (S601, NO), the command signal reception waiting state is maintained by repeatedly executing S601. On the other hand, when the command signal is received (S601, YES), the signal content of the command signal is taken in (S602). Thereafter, it is determined whether the command signal is a carry-in / out signal (S603). Here, the carry-in / out signal refers to a carry-in signal for carrying the FOUP 30 from the transfer shelf 7 to the storage shelf 3 and a carry-out signal for carrying the FOUP 30 from the storage shelf 3 to the transfer shelf 7.

  If the command signal is a carry-in / out signal (S603, YES), it is next determined whether or not it is a carry-in signal (S604). In the case of a carry-in signal (S604, YES), carry-in processing is performed (S606). Specifically, the roller motor 221 operates and the transfer device 2 travels on the rail mechanism 21. When the movement position detector 222 detects a position corresponding to the transfer shelf 7, the roller motor 221 stops. Thereafter, the lifting / lowering motor 231 of the lifting / lowering mechanism 23 is operated, and the telescopic mechanism 24 and the gripping mechanism 25 are lowered. When the height position detector 232 detects a height position that is slightly lower than the lower surface of the flange 31 of the FOUP 30 on which the gripping mechanism 25 is placed on the transfer shelf 7, the elevating motor 231 stops.

  Next, the horizontal motor 241 of the expansion / contraction mechanism 24 operates, and the expansion / contraction mechanism 24 extends in the direction of the transfer shelf 7. When the placement position detector 242 detects the placement position of the transfer shelf 7, the horizontal motor 241 stops. At this time, the gripping mechanism 25 is located below the flange 31. And the raising / lowering motor 231 is operated and the raising / lowering mechanism 23 is raised. As a result, the FOUP 30 is suspended from the gripping mechanism 25. When the placement detection sensor 251 of the gripping mechanism 25 detects that the FOUP 30 is not placed, the lift motor 231 is stopped. Thereafter, the horizontal motor 241 is operated, the telescopic mechanism 24 is contracted, and the gripping mechanism 25 is returned to the original position. With the above operation, the FOUP 30 can be removed from the transfer shelf 7.

  When the FOUP 30 is mounted, it is the same as the above-described removal. The transfer device 2 travels on the rail mechanism 21 while holding the FOUP 30. When the transfer device 2 travels the rail mechanism 21 to a position facing the target storage shelf 3, the lifting mechanism 23 is operated so that the lower surface of the FOUP 30 is slightly higher than the upper surface of the storage shelf 3. After that, the horizontal motor 241 operates, and the telescopic mechanism 24 extends until the FOUP 30 being held is positioned on the storage shelf 3. When the FOUP 30 is positioned on the storage shelf 3, the elevating motor 231 operates and the gripping mechanism 25 is lowered until the placement detection sensor 251 detects that the FOUP 30 is placed on the storage shelf 3. When the FOUP 30 is placed, the expansion / contraction mechanism 24 contracts again, and the gripping mechanism 25 returns to the original position. Thus, the carry-in process is completed. When the processing is completed, a processing completion signal is transmitted to the system controller 8 (S610). Thereafter, the process is re-executed from S601, and shifts to a reception waiting state for the next command signal transmitted from the system controller 8.

  If the command signal from the system controller 8 is not a carry-in signal (S604, NO), a carry-out process is performed (S605). Specifically, the transfer device 2 moves to the position of the FOUP 30 placed on the storage shelf 3 and grips the FOUP 30. The FOUP 30 is moved to the transfer shelf 7 while holding the FOUP 30, and the FOUP 30 is placed on the transfer shelf 7. When the processing is completed, a processing completion signal is transmitted to the system controller 8 (S610).

  If the command signal is not a carry-in / out signal (S603, NO), it is determined whether it is a mounting signal (S607). In the case of a mounting signal (S607, YES), mounting processing is performed (S608). Specifically, the FOUP 30 is transported to the carry-out port 51a of the semiconductor manufacturing apparatus 5 that requires the FOUP 30 placed on the storage shelf 3. When the processing is completed, a processing completion signal is transmitted to the system controller 8 (S610).

  If the command signal is not a mounting signal (S607, NO), a removal process is performed (S609). Specifically, the FOUP 30 which has been placed on the carry-out port 51 b and has been processed by the semiconductor manufacturing apparatus 5 is transported to the storage shelf 3. When the processing is completed, a processing completion signal is transmitted to the system controller 8 (S610).

  Next, returning to FIG. 4, a work pattern of the transfer apparatus 2 of the present embodiment will be described. In FIG. 4, the case where the FOUP 30 that has been processed by the semiconductor manufacturing apparatus 5 is transferred to the transfer shelf 7 by the transfer carriage 16 will be described. Note that the following explanation examples are merely examples of work patterns, and the present invention is not limited to this example, and various work patterns can be executed.

  When the transport carriage 16 places the FOUP 30 on the transfer shelf 7, the transfer device 2 transports the FOUP 30 placed on the transfer shelf 7 to the storage shelf 3-2 in response to a command signal from the system controller 8. . Thereafter, since the semiconductor manufacturing apparatus 5a-2 needs the FOUP 30 mounted on the storage shelf 3-2, an instruction signal is transmitted to the system controller 8 so as to transport the FOUP 30 to the transfer apparatus 2. The transfer device 2 transports the FOUP 30 of the storage shelf 3-2 to the carry-in port 51a of the semiconductor manufacturing device 5a-2 based on a command signal from the system controller 8. The semiconductor manufacturing apparatus 5a-2 takes the FOUP 30 placed on the carry-in port 51a into the inside and performs a process. After the processing, the FOUP 30 is placed on the carry-out port 51b. At the same time, a signal is sent to the system controller 8 to carry out the FOUP 30 of the carry-out port 51b. The transfer device 2 conveys the FOUP 30 of the carry-out port 51b to the storage shelf 3-6.

  After the FOUP 30 is placed on the storage shelf 3-6, the semiconductor manufacturing apparatus 5a-1 needs the FOUP 30 of the storage shelf 3-6 and outputs a signal to the system controller 8. The transfer device 2 conveys the FOUP 30 of the storage shelf 3-6 to the carry-in port 51a of the semiconductor manufacturing device 5a-2 by a signal from the system controller 8. The semiconductor manufacturing apparatus 5a-1 takes in the FOUP 30 placed on the carry-in port 51a and performs a process for taking it in. After the processing, the FOUP 30 is placed on the carry-out port 51b. At the same time, a signal is sent to the system controller 8 so as to convey the FOUP 30 of the carry-out port 51b. At this time, the processed FOUP 30 is transferred to another semiconductor manufacturing apparatus 5 or the stocker 4 because the processing of all the semiconductor manufacturing apparatuses 5 within the movement range of the transfer apparatus 2 is completed. Therefore, the system controller 8 transmits a signal so that the FOUP 30 is mounted on the transfer shelf 7 to the transfer device 2. On the other hand, the system controller 8 transmits a transport signal of the FOUP 30 placed on the transfer shelf 7 to the transport carriage 16. When the transfer device 2 mounts the FOUP 30 on the transfer shelf 7, the transport carriage 16 grips and transports the FOUP 30 of the transfer shelf 7. At this time, if the transfer shelf 7 is not in a state where it can be placed, that is, if another FOUP 30 is placed, the transfer shelf 7 can be once mounted on the storage shelf 3. You may keep it temporarily until

  As described above, in this embodiment, the storage shelf 3 and the transfer device 2 which are simple storage means are provided in the semiconductor manufacturing apparatus 5 with a short processing time. For this reason, it is not necessary to store all FOUPs 30 for which processing has been completed in the stocker 4. Since the transfer device 2 can move between the plurality of storage shelves 3 and the semiconductor manufacturing device 5, it is not necessary to transport the FOUP 30 in two stages via the transport carriage 16. Thereby, conveyance time can be shortened.

  Further, since the storage shelves 3 are arranged in a matrix in the horizontal and vertical directions, the total number of the storage shelves 3 can be easily changed, and the storage capacity of the FOUP 30 in the transfer device 2 can be adjusted.

  In the present embodiment, the storage shelves 3 are arranged in a matrix in the vertical direction and the horizontal direction above the semiconductor manufacturing apparatus 5, but the present invention is not limited to this. You may make it arrange | position the storage shelf 3 only to one direction. Moreover, if it can be temporarily stored, it will not be restricted to the shelf which mounts. For example, a storage shelf that hooks and hangs the flange 31 of the FOUP 30 may be used.

  Further, the configuration of the transfer device is not limited to the configuration described in the above embodiment. For example, although the transfer device is traveling on a traveling path disposed above (ceiling), the transfer device may travel below (the ground), or the transfer device may be installed on a wall. Further, the structure of the gripping mechanism 25 for gripping the FOUP 30 may be a structure using fingers that open and close to the transport carriage 16 or may be other than that. Of course, it is not limited to the number of semiconductor manufacturing apparatuses 5, stockers 4, and transfer apparatuses 2.

  Further, the transport cart 16 can be attached to and detached from the storage shelves 3-1, 3-2, 3-5, 3-6 located at the uppermost stage shown in FIG. The FOUP 30 may be delivered between the loading device 2 and the transport carriage 16. In this case, the transfer shelf 7 and the storage shelves 3-1, 3-2, 3-5, 3-6 are also used as a transfer unit that delivers the FOUP 30 and a temporary storage unit. Also good.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. This embodiment is different from the first embodiment in that the transfer shelf 7 for transferring the FOUP 30 between the transfer device 2 and the transport carriage 16 is a slide-type transfer shelf. . Hereinafter, the difference will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted.

  The movement transfer shelf 6 of the transfer apparatus 2 according to the present embodiment will be described with reference to FIGS. FIG. 7 is a diagram corresponding to the alternate long and short dash line in FIG. In FIG. 7, the transfer device 2 in FIGS. 3 and 4 is omitted, but the configuration and operation of the transfer device 2 are the same as those in the first embodiment.

  The mobile transfer shelf 6 can directly attach and detach a plurality of FOUPs 30 by the transport carriage 16 and the transfer device 2, and corresponds to the transfer shelf 7 of FIGS. The movable transfer shelf 6 has a shelf unit 6 a and a support column 63. In the shelf unit 6a, the table plate 61 and the slide plate 62 overlap each other. A plurality of shelf units 6 a are arranged on the support 63 in the vertical direction. Further, the interval between the shelf units 6 a positioned above and below is set so that the FOUP 30 can be placed on the slide plate 62 and the shelf unit 6 a positioned immediately above the FOUP 30 does not contact. The slide plate 62 has a linear gear (not shown), and the table plate 61 has a rotary gear (not shown). Furthermore, the moving transfer shelf 6 has a shelf drive motor 66 and a shelf protrusion detector 67 shown in FIG. The rotating gear is directly connected to the shelf drive motor 66 and can rotate freely forward and backward. The two gears mesh with each other and the rotating gear rotates to allow the slide plate 62 to slide on the table plate 61. The movable transfer shelf 6 is arranged between the semiconductor manufacturing apparatuses 5 so that when the slide plate 62 is slid, the front end portion of the slide plate 62 which is the mounting area of the FOUP 30 is located immediately below the in-process track 12. Yes. When the slide plate 62 protrudes, the transport carriage 16 can directly place the FOUP 30 on the slide plate 62. The shelf protrusion detector 67 detects that the slide plate 62 is protruding, and transmits a signal to the system controller 8 or the transport carriage 16. Although not shown in FIG. 7, a storage shelf 3 is provided above the semiconductor manufacturing apparatus 5 as in the first embodiment.

  Each shelf unit 6a is controlled by a transfer shelf controller 65 as shown in FIG. The transfer shelf controller 65 is provided with a calculation program for operating the storage shelf control routine of FIG. The transfer shelf controller 65 is connected to a transmission / reception unit 68 so that a data signal can be transmitted / received to / from the system controller 8 by wireless communication.

  Next, an operation procedure in which the transport cart 16 carries the FOUP 30 in and out of the moving transfer shelf 6 will be described with reference to the flowchart of FIG. In addition, about the operation | movement which the transfer apparatus 2 carries in / out the FOUP30 in the movement transfer shelf 6, it is the same as that of 1st Embodiment, and description is abbreviate | omitted.

  In the mobile transfer shelf 6, it is determined whether or not a shelf command signal from the system controller 8 has been received (S101). If the shelf command signal is not received (S101, NO), the command signal reception waiting state is maintained by repeatedly executing S101. On the other hand, when the shelf command signal is received (S101, YES), the signal content of the shelf command signal is captured. Then, the shelf unit number included in the signal content is acquired (S102). Here, the shelf unit number is the number of the shelf unit 6a that carries the FOUP 30 in and out.

  Next, the shelf slide process is executed based on the shelf unit number (S103). For example, if the shelf unit number is the second from the top, the shelf drive motor 66 of the shelf unit 6a operates and the slide plate 62 slides. When the shelf slide processing is completed, a shelf preparation completion signal is transmitted (S104). Thereafter, it is determined whether or not a carry-in / out process completion signal of the transport carriage 16 has been received (S105). The carry-in / out completion signal is a signal indicating that the transport carriage 16 has placed the FOUP 30 on the slide plate 62 that has been slid (described in detail later). When the carry-in / out process completion signal is received (S105, YES), the protruding slide plate 62 is returned to the original state. When the carry-in / out process completion signal has not been received (S105, NO), the process waits until the carry-in / out process completion signal is received. Thereafter, S101 is re-executed, and the process shifts to a reception waiting state for the next shelf command signal transmitted from the system controller 8.

  On the other hand, the transport carriage 16 determines whether or not a command signal from the system controller 8 has been received (S901). If the command signal is not received (S901, NO), the command signal reception waiting state is maintained by repeatedly executing S901. On the other hand, when the command signal is received (S901, YES), the signal content is taken in and the content of the command signal is read (S902). Thereafter, it is determined whether the read signal is a shelf attachment / detachment command (S903). When it is not a shelf attachment / detachment command (S903, NO), other processing is performed (S908). Other processing refers to processing for attaching / detaching to / from the semiconductor manufacturing apparatus 5, processing for holding and transporting the FOUP 30, and the like.

  If the read command is a shelf attachment / detachment command (S903, YES), the command is moved onto the target moving transfer shelf 6 (S904). At this time, it is determined whether or not the above-described shelf preparation completion signal is received from the moving transfer shelf 6 (S905). If the shelf preparation completion signal is not received (S905, NO), it waits until the shelf preparation completion signal is received. When the shelf preparation completion signal is received (S905, YES), the transport carriage 16 performs the FOUP 30 attachment / detachment process by the operation described in FIG. 2 (S906). For example, when it is desired to place on the second shelf unit 6a from the top of the movable transfer shelf 6 in FIG. 7, the slide plate 62 of the second shelf unit 6a is slid. As a result, the second shelf unit 6a protrudes from the other shelf units 6a and is located directly below the transport carriage 16, so that the transport carriage 16 can be accessed.

  When the attachment / detachment process is completed as described above, an attachment / detachment process completion signal is transmitted (S907). At this time, the signal may be transmitted to the moving transfer shelf 6 via the system controller 8 or directly to the moving transfer shelf 6. Thereafter, the process is re-executed from S901, and shifts to a reception waiting state for the next command signal transmitted from the system controller 8.

  As described above, since each shelf unit 6a of the moving transfer shelf 6 serving as a transfer means is configured to be slidable, it can be accessed by the transport carriage 16. For this reason, it is possible to reduce the waiting time when the transfer shelf 7 in the first embodiment cannot be placed when the FOUP 30 is transferred between the transfer device 2 and the transport carriage 16. In addition, according to the present embodiment, the same effects as those of the first embodiment can be obtained.

  In the present embodiment, the lowermost shelf unit 6a of the moving transfer shelf 6 is configured to slide, but may be configured to be positioned directly below the in-process track 12 in advance. . Moreover, although the three-stage shelf unit 6a is provided in the present embodiment, the number is not limited to this. The slide structure of the shelf unit 6a uses gears, but other structures may be used. Furthermore, the arrangement location of the moving transfer shelf 6 is not limited between the semiconductor manufacturing apparatuses 5.

  Further, in the present embodiment, the moving transfer shelf 6 is used as a transfer means for delivering the FOUP 30 between the transfer device 2 and the transport carriage 16, similarly to the transfer shelf 7. Similarly to the storage shelf 3, the transfer shelf 6 may be used as storage means. In this case, the storage shelf 3 may or may not be disposed above the semiconductor manufacturing apparatus 5.

(Third embodiment)
Next, a third embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that the transfer shelf 7 for transferring the FOUP 30 between the transfer device 2 and the transport carriage 16 is a rotary transfer shelf. . Hereinafter, the difference will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted.

  The rotational transfer shelf 9 of the transfer apparatus 2 according to the present embodiment will be described with reference to FIGS. The rotational transfer shelf 9 includes a plurality of rotating shelves 91 arranged in the vertical direction and a bottom rotating shelf 92 arranged at the lowermost stage. The rotating shelf 91 and the bottom rotating shelf 92 have a disk shape, and the respective rotation center axes are aligned in the vertical direction. Further, the interval between the stages is set so that the FOUP 30 can be placed and the FOUP 30 and each shelf are not in contact with each other. The rotating shelf 91 is provided with a notch 93 having a size through which the FOUP 30 can pass. The notch 93 has a trapezoidal shape. The rotational transfer shelves 9 are arranged between the semiconductor manufacturing apparatuses 5 so that the mounting area of the FOUP 30 is located immediately below the in-process track 12.

  The rotary shelf 91 and the bottom rotary shelf 92 have a rotation gear (not shown), a shelf drive motor 96 shown in FIG. 11, and a rotation angle detector 97, and can rotate around the rotation center axis. . The rotating gear is connected to the shelf driving motor 96, and the rotating shelf 91 and the bottom rotating shelf 92 are rotated by the shelf driving motor 96 rotating the rotating gear. In addition, the rotation angle detector 97 that detects the rotation angle of each shelf detects the rotation angle, and rotates each rotation shelf 91 and the bottom rotation shelf 92 to process any one of the plurality of placement areas. It can be positioned directly below the inner track 12. In addition, the conveyance carriage 16 can be accessed by vertically stacking the notches 93 of the rotation shelf 91 or the rotation shelf 91 located above the bottom rotation shelf 92 to be accessed by the conveyance carriage 16.

  The rotating shelf 91 and the bottom rotating shelf 92 are controlled by a rotating shelf control 95. The rotating shelf control 95 has a calculation program for operating the conveyance carriage control routine of FIG. A transmission / reception unit 98 is connected to the rotating shelf control 95 so that a data signal can be transmitted / received to / from the system controller 8 by wireless communication.

  Next, an operation procedure in which the transport cart 16 carries the FOUP 30 in and out of the rotary transfer shelf 9 will be described with reference to the flowchart of FIG. In addition, about the operation | movement which the transfer apparatus 2 carries in / out the FOUP30 in the rotation transfer shelf 9, it is the same as that of 1st Embodiment, and description is abbreviate | omitted.

  In the rotational transfer shelf 9, it is determined whether or not the shelf command signal from the system controller 8 has been received (S201). If the shelf command signal is not received (S201, NO), the command signal reception waiting state is maintained by repeatedly executing S101. On the other hand, when the shelf command signal is received (S201, YES), the signal content of the shelf command signal is captured. Then, the storage unit number included in the signal content is acquired (S202). Here, the storage unit number is a shelf number of the rotating shelf 91 or the bottom rotating shelf 92 that carries the FOUP 30 in and out, and a position number that represents the position of the placement area of the FOUP 30 on the rotating shelf 91 or the bottom rotating shelf 92. .

  Next, a storage unit setting process is executed based on the storage unit number (S203). For example, if the shelf number is the third shelf from the top, the rotation shelf 91 is rotated so that the placement area corresponding to the position number included in the signal is located directly below the in-process track 12. To. And the rotation shelf 91 above this rotation shelf 91 is rotated, and the notch part 93 is located just above the mounting area | region corresponding to a position number. As a result, the transport carriage 16 can access the third-stage rotating shelf 91. When the storage unit setting process is completed, a shelf preparation completion signal is transmitted (S204). Thereafter, S201 is re-executed, and the process shifts to a reception waiting state for the next shelf command signal transmitted from the system controller 8.

  On the other hand, since the description of the second embodiment can be applied to the transport carriage 16, the description is omitted.

  As described above, in this embodiment, the same effect as that of the second embodiment can be obtained.

  In the present embodiment, the number of stages of the rotating shelf 91 is three in FIG. 10, but is not limited to this. Further, the cutout portion 93 provided in the rotating shelf 91 is not trapped by the shape as long as the FOUP 30 can pass therethrough. Furthermore, although the rotary shelf 91 and the bottom rotary shelf 92 have a disk shape, other shapes may be used. Moreover, although the rotation structure of the rotation shelf 91 and the bottom part rotation shelf 92 uses the rotation gear, it cannot be overemphasized that it is not limited to this.

  In the present embodiment, the rotational transfer shelf 9 is used as a transfer means for delivering the FOUP 30 between the transfer device 2 and the transport carriage 16 in the same manner as the transfer shelf 7. Similarly to the storage shelf 3, the transfer mounting shelf 9 may be used as storage means. In this case, the storage shelf 3 may or may not be disposed above the semiconductor manufacturing apparatus 5.

It is a track | orbit layout figure of the conveyance system provided with the transfer apparatus which concerns on this Embodiment. It is a figure with which a conveyance trolley grasps FOUP. It is a side view of the transfer apparatus enclosed with the dashed-dotted line of FIG. It is a front view of the transfer apparatus enclosed with the dashed-dotted line of FIG. It is a block diagram which shows the structure of a transfer apparatus. It is a flowchart figure showing operation | movement of the transfer apparatus. It is a figure showing the state by which the movement transfer shelf which concerns on the 2nd Embodiment of this invention is arrange | positioned. It is a block diagram which shows the structure of a movement transfer shelf. It is a flowchart showing operation | movement with a conveyance trolley | bogie and a movement transfer shelf. It is the schematic of the rotation transfer shelf based on the 3rd Embodiment of this invention. It is a block diagram which shows the structure of a rotation transfer mounting shelf. It is a flowchart showing operation | movement with a conveyance trolley | bogie and a rotation transfer shelf.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer system 2 Transfer apparatus 3 Storage shelf 5 Semiconductor manufacturing apparatus 7 Transfer shelf 12 In-process track 16 Transfer carriage 21 Transfer apparatus transfer path 22 Moving mechanism 23 Lifting mechanism 24 Grip mechanism 30 FOUP

Claims (6)

A plurality of storage shelf devices for temporarily storing the objects to be conveyed;
A holding mechanism capable of holding the object to be transported, and an in-shelf moving device that moves the holding mechanism so as to be positioned at an arbitrary position in a transfer area corresponding to the storage shelf device;
A transfer device comprising: an inter-shelf moving device for moving the intra-shelf moving device to the plurality of storage shelf devices.   The transfer device according to claim 1, wherein the storage shelf device includes a plurality of storage shelves arranged in a matrix in a horizontal direction and a vertical direction, and on which the object to be transported is placed. The storage shelf device is arranged in a vertical direction, a plurality of slide shelves on which the object to be transported is placed,
The transfer apparatus according to claim 1, further comprising a slide mechanism that allows the slide shelf to slide to a side where the holding mechanism is located. The storage shelf device is arranged in a vertical direction, and includes a plurality of rotating shelves on which the object to be transported is placed,
The rotating shelf is
A notch having a size through which the object can pass;
The transfer device according to claim 1, further comprising: a rotation unit that allows the rotation shelf to rotate so that the cutout portion overlaps the same position in the vertical direction. The transfer device according to any one of claims 1 to 4,
A transfer system, comprising: a processing device disposed in a transfer region of the transfer device and processing the object to be transported. A travel path disposed in the vicinity of the processing device;
When the transport mechanism that travels on the travel path and the storage shelf device are positioned in the vicinity, the object to be transported is connected to the relay unit and the processing device that are set in the transfer area of the transfer device. The transfer system according to claim 5, further comprising a conveyance carriage having an attachment / detachment mechanism for attaching / detaching.

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