JP2005149189A - Data carrier and method for producing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small noncontact data carrier that can be manufactured using conventional techniques at low manufacturing cost. <P>SOLUTION: A certain number of first metallic wires 2 are formed in parallel on a flexible, insulating base 1 in such a way as to form a slope with respect to the base 1. An electrical connection between a semiconductor chip 6 and a pad 3 which are placed on the first metallic wires 2 is made by a second metallic wire 5. The base 1 is deformed into a tubular shape so that both end faces thereof are connected together. Both ends of the first metallic wire 2 formed at each end of the base 1 are electrically connected to each other to form a helical antenna coil 11 from the first metallic wires 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a data carrier including a semiconductor device on which a semiconductor chip for recording information is mounted, and an antenna for transmitting and receiving to and from an external device, and a method for manufacturing the data carrier.

  In recent years, development of data carriers capable of communicating a large amount of information just by holding them over a reader / writer has been actively performed, and some of them are used in industry. Among them, in particular, it is used in merchandise distribution from the viewpoint of high-speed communication, and is used for a credit card or ID card from the viewpoint of high security.

  Under such circumstances, development of an extremely thin non-contact type data carrier is rapidly progressing, and the demand for this data carrier is expected to increase in the future.

  The non-contact type data carrier has various forms depending on applications, and not only the thin film type but also the non-contact type data carrier described in Patent Document 1 is no exception.

With reference to FIGS. 10A and 10B, an example of a non-contact type data carrier having a rod shape will be described. 10A is a longitudinal sectional view of the data carrier, FIG. 10B is a transverse sectional view of the antenna, and the data carrier includes the circuit component 20 formed on the epoxy substrate 22 on which the IC chip 21 is mounted. The bobbin 31 composed of the outer thin film magnetic material 42 and the inner elastic resin layer 41 is electrically connected to the bobbin 31 apart from the transmitting / receiving antenna 32 formed by winding the coil 30, and these are placed in the outer case 40. Thereafter, the whole is sealed with a sealing resin 50.
JP 2000-322542 A

  In the configuration of the conventional non-contact type data carrier, a magnetic material and an elastic resin for extending a communication distance in addition to a semiconductor chip, an antenna coil, and a substrate for holding them, which are essential for the non-contact type data carrier. And an outer case and a sealing resin for protecting the data carrier, the number of parts is increased, and the manufacturing cost is increased.

  Further, the use of the outer case and the installation of the semiconductor chip away from the antenna coil increase the size of the completed non-contact type data carrier.

  In order to solve these problems, the material cost to be used must be minimized, and a non-contact type data carrier must be produced with a minimum number of parts.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a non-contact type data carrier that solves the above-described conventional problems and that can be manufactured by the conventional technique and is small in size and low in manufacturing cost.

  In order to achieve the above object, the present invention forms a metal wiring on a flexible insulating substrate in parallel with an arbitrary number so as to form a slope with respect to the substrate, and further overlaps the semiconductor chip with the metal wiring on the substrate. The metal wiring formed on both ends of the substrate is electrically connected to the semiconductor chip by a metal wire or the like, and the metal wiring formed so as to form an inclined surface with respect to the substrate is one spiral. Both ends of the substrate are connected so as to form a coil.

  The data carrier according to the present invention is composed of a flexible insulating substrate, antenna coil, and semiconductor chip, which has a smaller number of parts than conventional products, is a low-cost material, and is manufactured by an easy manufacturing process. Can be a non-contact data carrier. Since the semiconductor chip is directly mounted on the substrate, the entire data carrier can be reduced in size.

(Embodiment 1)
FIG. 1 is a perspective view of a contact-type data carrier for explaining the first embodiment of the present invention, and FIG. 2 is a development view of the data carrier of FIG. 1. A flexible insulating substrate 1 is attached to the substrate 1. A first metal wiring 2 that forms an oblique line with respect to the first metal wiring 2 and a pad 3 for electrically connecting the first metal wiring 2 and the semiconductor chip 6 are formed by plating or printing. The semiconductor chip 6 is mounted on the first metal wiring 2 formed on the outermost side. At the same time, the semiconductor chip 6 and the pad 3 are electrically connected by the second metal wiring 5. A form in which one spiral antenna coil 11 is formed from the metal wiring 2 by being deformed into a cylindrical shape so as to be connected is shown.

  3 is a partial cross-sectional view including the first metal wiring and the pad of FIG. 1, and FIG. 4 is a partial cross-sectional view including the first metal wiring immediately before forming FIG.

  The semiconductor chip 6 mounted on the first metal wiring 2 is electrically connected to the second metal wiring 5 through the contact hole 4 of the substrate 1 as shown in FIG. Then, the tip of the first metal wiring 2 that is not electrically connected to the semiconductor chip 6 and the pad 3 is contact hole 7 in the substrate 1 supporting the tip of the first metal wiring 2 as shown in FIG. And bonding is performed by crimping both ends of the first metal wiring 2.

(Embodiment 2)
FIG. 5 is a development view of a contacted data carrier for explaining the second embodiment of the present invention, in which a metal wiring 2 ′ on the front surface and a single pad 3 on the back surface of the flexible insulating substrate 1 are plated. Alternatively, the semiconductor chip 6 that is formed by printing and mounted on the back surface of the substrate 1 is electrically connected to the metal wiring 2 ′ on the surface farthest from the pad on the back surface through a contact hole. In this configuration, the wires 8 are electrically connected.

  The metal wiring 2 ′ on the surface of the substrate 1 and the pad 3 on the back surface of the substrate 1 are electrically connected through a contact hole. Then, by deforming the substrate 1 into a cylindrical shape and connecting both ends so that one spiral antenna coil 11 is formed on the metal wiring 2 ′ formed on the surface of the substrate 1, non-contact type Create a data carrier. At this time, the bridged metal wire 8 is wound inside.

  FIG. 6 is a development view showing a modified example of the contact-type data carrier according to the second embodiment. The semiconductor chip 6 mounted on the back surface of the flexible insulating substrate 1 is directly connected to the metal wiring 2 ′ and the contact hole on the surface. Instead of being electrically connected to each other, two pads 3 electrically connected to the metal wiring 2 'on the front surface via contact holes are formed on the back surface, and the two pads 3 and the back surface of the substrate 1 are mounted. The semiconductor chip 6 thus formed is electrically connected by a metal wire 8.

  In addition to the above-described embodiment, the following three method examples are conceivable as a method for connecting metal wiring.

  (1) FIG. 7 is a front view showing a connecting portion at both ends of a metal wiring on a substrate, and a single helical antenna coil 11 is formed on the flexible insulating substrate 1 having a cylindrical shape as described above. In this case, in order to form the exposed portion 9 by exposing one end portion of the metal wiring 2, the substrate 1 holding the metal wiring 2 in that portion is partially removed. At this time, both end portions of the metal wiring 2 are produced so as to have a concavo-convex shape, and are mechanically engaged and locked so as not to be easily detached, and the metal wirings 2 are physically joined to each other. It is good to do so.

  (2) FIG. 8 is a side view showing a connecting portion at both ends of the metal wiring on the substrate. Similarly to the above, one antenna coil is formed from the metal wiring 2 formed on the flexible insulating substrate 1 having a cylindrical shape. 11 is formed, in order to form the exposed portion 9 at one end of the metal wiring 2, the substrate 1 holding the portion of the metal wiring 2 is partially removed. On the other hand, a conductive or non-conductive adhesive 10 is applied to the other end portion of the metal wiring 2 and both ends of the metal wiring 2 are crimped to make an electrical connection.

  (3) FIG. 9 is a plan view showing a connecting portion at both ends of the metal wiring on the substrate. Similarly to the above, one antenna coil 11 is formed from the metal wiring formed on the cylindrical flexible insulating substrate. When forming, the board | substrate 1 is deform | transformed into a cylinder shape so that the side surface which the metal wiring 2 has exposed becomes inside, and the surfaces of the metal wiring 2 are electrically connected with an adhesive agent.

  As described above, according to this embodiment, since the contactless data carrier is small, lightweight, and inexpensive, it is possible to reduce the area that was impossible with a card-type contactless data carrier. It can be incorporated into the end portion of the antenna of a mobile phone to perform data communication.

  Also, when installing on curved surfaces such as bottles or can labels, the conventional flat non-contact data carrier reduces the communication distance because the antenna coil shape is not parallel to the reader / writer, Response sensitivity also becomes dull. However, when the non-contact type data carrier of the present embodiment is used, the antenna coil can be kept parallel to the reader / writer, and therefore, compared to the case of using a planar non-contact type data carrier. Communication distance and response sensitivity performance is maintained.

  INDUSTRIAL APPLICABILITY The present invention is effective for use in a miniaturized non-contact type ID tag and card manufactured by mounting an antenna coil and a semiconductor chip on an insulating thin substrate, and a manufacturing method for manufacturing the ID tag. is there.

The perspective view of the to-be-contacted type data carrier for demonstrating Embodiment 1 of this invention Development view of data carrier of embodiment 1 Partial sectional view including metal wiring and pads in Embodiment 1 Partial sectional view including metal wiring immediately before forming the data carrier of Embodiment 1 Development view of a contacted data carrier for explaining Embodiment 2 of the present invention FIG. 6 is a development view illustrating a modification of the contacted data carrier according to the second embodiment. The front view which shows the connection part of the both ends of the metal wiring in the board | substrate for demonstrating the other example of the connection method of metal wiring The side view which shows the connection part of the both ends of the metal wiring in the board | substrate for demonstrating the other example of the connection method of metal wiring The top view which shows the connection part of the both ends of the metal wiring in the board | substrate for demonstrating the other example of the connection method of metal wiring (A) is a longitudinal sectional view of a data carrier for explaining an example of a conventional non-contact type data carrier having a rod shape, and (b) is a transverse sectional view of an antenna.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible insulating board 2, 2 'Metal wiring 3 Pad 4 Contact hole 5 Metal wiring 6 Semiconductor chip 7 Contact hole 8 Metal wire 9 Tip of metal wiring processed into bowl shape Adhesive 11 Spiral antenna coil

Claims (6)

In a data carrier comprising a semiconductor device on which a semiconductor chip for recording information is mounted and an antenna for transmitting and receiving with an external device,
A data carrier characterized in that an antenna coil is formed outside or inside a cylindrical flexible insulating substrate to constitute the antenna, and the semiconductor chip is mounted on the antenna coil portion.   2. The data carrier according to claim 1, wherein the semiconductor chip is electrically connected by a metal wire, and the metal wire is installed inside the substrate. A manufacturing method for manufacturing a data carrier comprising a semiconductor device on which a semiconductor chip for recording information is mounted and an antenna for transmitting and receiving with an external device,
On one side surface of a substantially rectangular flexible insulating substrate, a plurality of first metal wirings oblique to the insulating substrate, and electrical connection between the semiconductor chip and the first metal wiring are assisted Forming a pad for performing,
Forming a second metal wiring for electrically connecting the pad and the semiconductor chip on the other side surface of the insulating substrate;
A step of simultaneously mounting and electrically connecting a semiconductor chip to the second metal wiring located at an end of the insulating substrate;
The portion of the insulating substrate that holds one end portion of the tip end portion of the first metal wiring is removed to expose one end portion of the first metal wiring, and the other end of the first metal wiring Electrically connecting parts via an adhesive, and forming a helical antenna coil from the first metal wiring formed on the insulating substrate;
A method for manufacturing a data carrier, comprising:   The method for manufacturing a data carrier according to claim 3, wherein, instead of the step of forming a second metal wiring for electrically connecting the pad and the semiconductor chip on the other side surface of the insulating substrate, the pad and the 4. The method of manufacturing a data carrier according to claim 3, further comprising a step of electrically connecting the semiconductor chip to the semiconductor chip with a metal wire.   When removing a portion of the insulating substrate that holds one end portion of the tip end portion of the first metal wiring, the end portion of the metal wiring is formed in a bowl shape, and both end portions of the first metal wiring are formed. The data carrier manufacturing method according to claim 3, wherein the data carrier is locked.   4. The method of manufacturing a data carrier according to claim 3, wherein a portion of the insulating substrate holding one end portion of the tip end portion of the first metal wiring is removed to expose one end portion of the first metal wiring. In place of the step of electrically connecting the other end portion of the first metal wiring via an adhesive, the surface of the one end portion of the first metal wiring and the other of the first metal wiring 4. The method of manufacturing a data carrier according to claim 3, further comprising a step of electrically connecting the surface of the end portion via an adhesive.

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